CN113905531B - Method for manufacturing printed circuit board circuit - Google Patents
Method for manufacturing printed circuit board circuit Download PDFInfo
- Publication number
- CN113905531B CN113905531B CN202111504410.6A CN202111504410A CN113905531B CN 113905531 B CN113905531 B CN 113905531B CN 202111504410 A CN202111504410 A CN 202111504410A CN 113905531 B CN113905531 B CN 113905531B
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- Prior art keywords
- copper
- circuit
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- tin
- tin layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
A method for manufacturing a printed circuit board circuit comprises the following steps: sequentially carrying out processes of cutting, drilling, copper deposition and whole-plate electroplating to form copper plating layers on two surfaces of the plate body and the wall of the via hole; electroplating thickened hole copper and surface copper, and plating the copper to the required thickness to form a thickened copper layer; plating a tin layer on the whole surface of the thickened copper layer in an electroplating or chemical plating mode; removing the tin layer in the area without the circuit by means of laser ablation carving and numerical control cutter depth control gong, removing the tin layer in the area without the circuit with the circuit clearance smaller than the preset distance by means of laser ablation carving, and removing the tin layer in the area without the circuit clearance larger than or equal to the preset distance by means of numerical control cutter depth control gong; and etching the thickened copper layer and the copper-plated layer area without the circuit to obtain the required circuit. The dry film is not used, the problem that the generated organic waste is difficult to treat is avoided, the process is simplified, and the production efficiency is increased.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a printed circuit board circuit without using a dry film.
Background
In the process of manufacturing printed circuit boards, the manufacture of circuits is a very core process. The current line processing technology mainly comprises a positive film and a negative film, wherein the processing process of the positive film flow comprises the following steps: normal flow → drilling → copper deposition/board electric → outer layer circuit (dry film pasting, exposure, development) → pattern electroplating (copper plating and tin plating) → film removal → etching → tin removal → post process. The negative film flow comprises the following processing processes: normal flow → drilling → copper deposition/board electric → whole board electroplating thickening → outer layer circuit (dry film pasting, exposure, developing) → etching → film removal → post process. The dry film pasted in the positive film process is used as a plating resistant layer for pattern electroplating, the tin layer for pattern electroplating is used as an etching resistant layer, and the dry film in the negative film process is directly used as the etching resistant layer in the etching process. The dry film is used in the two processing processes, the dry film is an organic polymer film and is widely applied to the manufacturing industry of the printed circuit board, and then after the dry film is used and removed, the obtained dry film waste is difficult to treat.
Disclosure of Invention
Aiming at the defects of the prior art, the method for manufacturing the printed circuit board circuit does not use a dry film, avoids the problem that the generated organic waste is difficult to treat, simplifies the process and increases the production efficiency.
In order to achieve the above object, the present invention employs the following techniques:
a method for manufacturing a printed circuit board circuit comprises the following steps:
s1, pre-processing: sequentially carrying out cutting, drilling, copper deposition and whole-plate electroplating processes to form copper plating layers on two sides of the plate body medium and the wall of the via hole;
s2, thickening copper on the whole plate: electroplating thickened hole copper and surface copper, and plating the copper to the required thickness to form a thickened copper layer;
s3, tinning: plating a tin layer on the whole surface of the thickened copper layer in an electroplating or chemical plating mode;
s4, engraving the tin layer: removing the tin layer of the area without the circuit by means of laser ablation carving and numerical control cutter depth control gong, wherein for the area without the circuit with the circuit clearance smaller than the preset distance, the tin layer is removed by means of laser ablation carving, and for the area without the circuit clearance larger than or equal to the preset distance, the tin layer is removed by means of numerical control cutter depth control gong;
s5, etching: and etching the thickened copper layer and the copper-plated layer area without the circuit to obtain the required circuit.
Further, in step S4, when the tin layer is removed by the laser ablation engraving means, the ablated tin layer area is pushed along the routing direction along with the routing engraved by the laser ablation, and the liquid tin formed by ablating the tin layer is discharged to both sides, so as to expose the thickened copper layer below the routing; the discharged liquid tin is temporarily stopped at the two sides of the exposed area, and then the discharged liquid tin is blown in the reverse wiring direction, so that the liquid tin enters the scraper plate moving along the wiring direction to be stored.
Further, in step S4, when the tin layer is removed by the depth-controlled routing means of the numerical control tool, the tin body routed during the routing process is received by the receiving frame moving with the tool, so that the tin body entering the receiving frame through the routing hole at the bottom of the receiving frame splashes and adheres to the adhesive plates on the side walls and the bottom surface of the receiving frame.
The invention has the beneficial effects that:
1. a dry film is not used, so that the problem that the generated organic waste is difficult to treat is avoided, the process is simplified, and the production efficiency is increased;
2. in the engraving process, a mode of combining laser and mechanical means is adopted, the line gap with small gap is engraved by using the precision of the laser, the area with larger line gap is engraved by using the low-cost and low-energy-consumption performance of the mechanical means, the equipment cost for implementing the process is controlled, and the engraving quality is also ensured;
3. through the structural design of a scraper plate, a push rod, an air injection pipe and the like which move along with a laser, in the laser ablation, the molten liquid tin can be quickly and effectively pushed/driven, so that the region of a tin layer is not exposed, and the liquid tin temporarily piled on two sides after being pushed can be quickly stored, thereby avoiding influencing other non-engraved regions;
4. through the frame isotructure design that removes along with the numerical control cutter for in the dark gong of accuse, can effectively accomodate the tin layer sweeps that the gong milled out, avoid it to influence other non-fall trans-regional and operational environment, and carry out the adhesion to the sweeps in the income frame, avoid the secondary to splash to the dark gong quality of gong sword hole influence accuse.
Drawings
Fig. 1 is a schematic view of a plate body obtained in a preceding processing step in an embodiment of the present application.
Fig. 2 is a schematic diagram of a plate body obtained in the step of thickening copper on the whole plate according to the embodiment of the present application.
Fig. 3 is a schematic view of a plate body obtained in the tin plating step of the embodiment of the present application.
Fig. 4 is a schematic diagram of a plate body obtained in the step of engraving the tin layer according to the embodiment of the present application.
Fig. 5 is a schematic diagram of a plate obtained by the etching step according to the embodiment of the present application.
Fig. 6 is a perspective view of a receiving assembly in a laser ablation engraving apparatus according to an embodiment of the present application.
Fig. 7 is a side view of a receiver assembly in a laser ablation engraving means of an embodiment of the present application.
Fig. 8 is a top view of a receiver assembly in a laser ablation engraving means of an embodiment of the present application.
Fig. 9 is a schematic top view of the pushing during the ablation of the tin layer according to the example of the present application.
Fig. 10 is a schematic cross-sectional view of the pushing during the ablation of the tin layer according to the example of the present application.
Fig. 11 is a perspective view of a housing frame in the numerical control tool depth control gong device according to the embodiment of the present application.
Fig. 12 is a top view of a housing frame in the numerical control tool depth control gong device according to the embodiment of the present application.
Fig. 13 is a view a-a in fig. 12.
Reference numerals: 1 a-plate medium, 1 b-copper plating layer, 1 c-via hole, 1 d-thickened copper layer, 1 e-tin layer, 1 f-tin layer removing area, 1 h-copper layer removing area, 1 i-liquid tin, 21-laser, 22-scraper, 23-gas ejector tube, 24-first stroke frame, 220-push rod, 221-bottom convex part, 222-triangular concave groove, 223-side plate, 224-inclined collecting surface, 225-separation plate, 31-numerical control cutter, 32-frame body, 33-routing hole, 34-inclined transition surface, 35-bonding plate, 36-second stroke frame and 37-lifting cylinder.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
The embodiment provides a method for manufacturing a printed circuit board circuit, which comprises the following steps:
s1, pre-processing: the processes of cutting, drilling, copper deposition and whole-board electroplating are sequentially carried out, so that copper plating layers 1b are formed on both surfaces of the board medium 1a and the wall of the through hole 1c, as shown in fig. 1.
S2, thickening copper on the whole plate: on the basis of the copper plating layer 1b, thickened hole copper and surface copper are electroplated, and the copper thickness of the wall of the via hole 1c and the copper thickness of the two surfaces of the plate body medium 1a are plated to a required thickness to form a thickened copper layer 1d, as shown in fig. 2.
S3, tinning: the surface of the thickened copper layer 1d is plated with tin in a whole plate by using an electroplating or chemical plating mode to form a tin layer 1e, and the tin layer 1e covers the wall of the via hole 1c and the thickened copper layer 1d on the two sides of the plate body medium 1a, as shown in fig. 3. Specifically, the thickness of the formed tin layer is 1-3 μm.
S4, engraving the tin layer: and (3) removing the tin layer in the area where the circuit is not needed by means of laser ablation carving and depth control gong of a numerical control cutter in a matching mode, as shown in figure 4.
Wherein, S41, laser ablation carving: and removing the tin layer by adopting a laser ablation carving method for the area of the unnecessary circuit, the circuit gap of which is smaller than the preset distance. Specifically, a laser is used for carrying out routing ablation according to a circuit to be ablated, and the laser is used for emitting a pulse laser beam. With the routing of laser ablation carving, pushing the ablated tin layer area along the routing direction is needed, and liquid tin formed by melting the ablated tin layer is discharged to two sides so as to expose the thickened copper layer below the routing; the discharged liquid tin is temporarily stopped at the two sides of the exposed area, and then the discharged liquid tin is blown in the reverse wiring direction, so that the liquid tin enters the scraper plate moving along the wiring direction to be stored.
Specifically, in the laser ablation engraving means, a storage assembly as shown in fig. 6 to 8 is adopted, and the storage assembly is connected with the laser 21 through a first stroke frame 24 so as to move along with the routing of the laser 21. Specifically, push rods 220 are disposed at predetermined intervals on one side of the laser 21, the push rods 220 are connected to the middle position of the end of a scraper 22, and the bottom of the push rods 220 has bottom protrusions 221 for fitting into the tin layer removing region 1f, as shown in fig. 9 to 10. The push rod 220 is extended rearward to form a separation plate 225. Side plates 223 are provided on both sides of the squeegee 22. The areas of the scrapers 22 on both sides of the push rod 220 are both recessed inwards to form a hollowed triangular recessed groove 222, and the front end wall of the triangular recessed groove 222 is inclined to form an inclined collecting surface 224. A plurality of air nozzles 23 are arranged at the front end of the triangular concave groove 222 on each side at a preset distance, and air nozzles of the air nozzles 23 face the inclined collecting surface 224 and are used for blowing the liquid tin 1i pushed to the two sides. Specifically, the gas ejected from the gas ejecting pipe 23 is hot gas having a certain temperature. The gas injection pipe 23, the laser 21 and the scraper 22 are all connected to the same first stroke frame 24, so that synchronous movement is facilitated. As shown in fig. 9, when the laser 21 travels along the trace line to be laser-engraved, the tin layer in the ablated tin layer removal region 1f is melted into liquid tin 1i, and at the same time, the liquid tin 1i is pushed from the tin layer removal region 1f to both sides by the pushing 220 and the bottom projection 221 which are wired together, and as shown in fig. 10, a certain temporary pile formed on both sides of the tin layer removal region 1f is blown by hot air blown from the air nozzle of the air nozzle 23, flows toward the inclined collection surface 224 of the squeegee 22 which is moved forward, and flows into the squeegee 22. Due to the triangular concave groove 222, the liquid tin 1i can naturally push and move towards the area of the triangular concave groove 222 under the pushing action, and then is limited by the triangle of the triangular concave groove 222, at this time, part of the liquid tin 1i can be positioned on the inclined collecting surface 224 of the triangular concave groove 222 close to the push rod 220, part of the liquid tin is positioned in the triangular concave groove 222 but does not reach the scraper 22, part of the liquid tin flows outwards and is limited by the inclined collecting surface 224 of the triangular concave groove 222 far away from the push rod 220, and the liquid tin is blown by hot air, passes through the inclined collecting surface 224 to conveniently reach the plate surface of the scraper 22 and is limited between the partition plate 225 and the side plate 223, and the storage is completed. For the area needing to be removed by laser ablation and carving, the routing can be carried out for a plurality of times according to the width or span of the area, namely the size of the gap between the lines needing to be reserved on the two sides, so as to complete the carving and removing.
Wherein, S42, numerical control cutter accuse gong deeply: and removing the tin layer in the region where the line clearance is larger than or equal to the preset distance and where the line does not need to be arranged by adopting a numerical control cutter depth control gong method. The tin bodies which are routed in the routing and milling process are stored by using the storage frame body which moves together with the cutter in a routing way, so that the tin bodies entering the storage frame body through the routing and milling holes at the bottom of the storage frame body splash and adhere to the adhesive plates on the side walls and the bottom surface of the storage frame body.
Specifically, if the depth control gong is removed by a mechanical numerical control means, splashed scraps are generated, and in order to solve this problem, a storage frame as shown in fig. 10 to 13 may be used, and the depth control gong may be completed together with a numerical control tool. This kind accomodates the framework including the framework 32 that has bottom plate and all curb plates, the gong sword hole 33 that link up is seted up at the bottom plate middle part, and the tool bit that is used for supplying numerical control cutter 31 on the one hand stretches into gong sword hole 33 in order to be acted on the tin layer, and on the other hand conveniently passes through the sweeps tin that the gong milled the process and produced. A circle of annular inclined transition surface 34 is arranged on the periphery of the milling cutter hole 33 and extends from the bottom surface of the bottom plate to the bottom of the milling cutter hole 33 in an inclined and downward manner so as to provide a better entering space for containing the scrap tin; simultaneously in order to facilitate carrying out the better accomodating of effect with the sweeps tin that gets into framework 32, it has one deck bonding board 35 to paste to cover on bottom plate and all curb plates, and bonding board 35 is removable, and bonding board 35 provides viscidity, can bond the sweeps that gets into framework 32, avoids it to splash once more, or splashes to gong sword hole 33 department once more to influence the deep gong of accuse. In practical applications, the numerical control tool 31 is disposed at a lifting end of a lifting cylinder 37, and the lifting cylinder 37 and the frame 32 are connected to the same second stroke frame 36, so that the frame 32 can be moved together to gong and store at any time when the numerical control tool 31 is routing. Specifically, according to the size of the tin layer region to be removed as required, or the actual gap of the region, that is, the size of the span gap between the lines to be retained with both sides, the numerical control tool 31 and the frame plate 32 are replaced by corresponding sizes, or the same numerical control tool 31 and the same frame plate 32 may be used to perform multiple routing back and forth to complete the removal of one region.
S5, etching: the regions of the thickened copper layer and the copper plated layer where no wiring is required are etched away as shown in fig. 5, resulting in the desired wiring. Specifically, the etching may use an alkaline etching solution, and the alkaline etching solution may use a type having a composition including ammonium chloride, copper chloride, and ammonia water.
Claims (5)
1. A method for manufacturing a printed circuit board circuit is characterized by comprising the following steps:
s1, pre-processing: sequentially carrying out cutting, drilling, copper deposition and whole-plate electroplating processes to form copper plating layers on two sides of the plate body medium and the wall of the via hole;
s2, thickening copper on the whole plate: electroplating thickened hole copper and surface copper, and plating the copper to the required thickness to form a thickened copper layer;
s3, tinning: plating a tin layer on the whole surface of the thickened copper layer in an electroplating or chemical plating mode;
s4, engraving the tin layer: removing the tin layer of the area without the circuit by means of laser ablation carving and numerical control cutter depth control gong, wherein for the area without the circuit with the circuit clearance smaller than the preset distance, the tin layer is removed by means of laser ablation carving, and for the area without the circuit clearance larger than or equal to the preset distance, the tin layer is removed by means of numerical control cutter depth control gong; when the tin layer is removed by adopting a laser ablation carving means, along with the routing ablated by laser ablation, pushing the ablated tin layer area along the routing direction, and discharging liquid tin formed by ablating the tin layer to two sides so as to expose the thickened copper layer below the routing; the discharged liquid tin stays at two sides of the exposed area for a short time, and then the discharged liquid tin is blown in the reverse wiring direction, so that the liquid tin enters a scraper plate moving along the wiring direction to be stored;
s5, etching: and etching the thickened copper layer and the copper-plated layer area without the circuit to obtain the required circuit.
2. The method for manufacturing the circuit of the printed circuit board according to claim 1, wherein the thickness of the tin layer is 1 μm to 3 μm.
3. The method for manufacturing the circuit of the printed circuit board according to claim 1, wherein the laser beam in the laser ablation engraving means is a pulse laser beam.
4. The method for manufacturing the printed circuit board according to claim 1, wherein the etching in step S5 is performed by using an alkaline etching solution, and the alkaline etching solution comprises ammonium chloride, copper chloride and ammonia water.
5. The method for manufacturing the circuit of the printed circuit board according to claim 1, wherein in step S4, when the tin layer is removed by the depth-controlled routing means of the numerical control tool, the tin body routed during the routing process is received by the receiving frame moving together with the tool, so that the tin body entering the receiving frame through the routing hole at the bottom of the receiving frame is splashed and attached to the adhesive plates on the side walls and the bottom surface of the receiving frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111504410.6A CN113905531B (en) | 2021-12-10 | 2021-12-10 | Method for manufacturing printed circuit board circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111504410.6A CN113905531B (en) | 2021-12-10 | 2021-12-10 | Method for manufacturing printed circuit board circuit |
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| Publication Number | Publication Date |
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| CN113905531A CN113905531A (en) | 2022-01-07 |
| CN113905531B true CN113905531B (en) | 2022-03-01 |
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| CN202111504410.6A Active CN113905531B (en) | 2021-12-10 | 2021-12-10 | Method for manufacturing printed circuit board circuit |
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| CN108990297A (en) * | 2018-08-23 | 2018-12-11 | 鹤山市中富兴业电路有限公司 | It is a kind of thickness copper base on formed route technique |
| CN208556372U (en) * | 2018-04-09 | 2019-03-01 | 惠州市宝惠电子科技有限公司 | A kind of laser protector peeled convenient for scolding tin with route |
| CN110611994A (en) * | 2018-06-14 | 2019-12-24 | 深圳市众阳电路科技有限公司 | Method for manufacturing PCB circuit pattern |
| CN110636707A (en) * | 2019-09-25 | 2019-12-31 | 萍乡市丰达兴线路板制造有限公司 | Method for improving residual copper in half-hole plate of PCB (printed circuit board) |
| CN213244537U (en) * | 2020-09-21 | 2021-05-18 | 建业科技电子（惠州）有限公司 | Tin spraying device is used in circuit board production |
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2021
- 2021-12-10 CN CN202111504410.6A patent/CN113905531B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004037866A (en) * | 2002-07-03 | 2004-02-05 | Asahi Kasei Corp | Method for making printing plate |
| WO2006082770A1 (en) * | 2005-02-07 | 2006-08-10 | Kabushiki Kaisha Toshiba | Ceramic wiring board and process for producing the same, and semiconductor device using the same |
| CN104427773A (en) * | 2013-09-11 | 2015-03-18 | 珠海方正科技多层电路板有限公司 | Manufacturing method of printed circuit board and corresponding printed circuit board |
| CN105208777A (en) * | 2015-09-10 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board with metallization back drilled hole |
| CN208556372U (en) * | 2018-04-09 | 2019-03-01 | 惠州市宝惠电子科技有限公司 | A kind of laser protector peeled convenient for scolding tin with route |
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| CN110636707A (en) * | 2019-09-25 | 2019-12-31 | 萍乡市丰达兴线路板制造有限公司 | Method for improving residual copper in half-hole plate of PCB (printed circuit board) |
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| CN113905531A (en) | 2022-01-07 |
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