CN113904651A - Crystal oscillator and electronic device - Google Patents
Crystal oscillator and electronic device Download PDFInfo
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- CN113904651A CN113904651A CN202111131504.3A CN202111131504A CN113904651A CN 113904651 A CN113904651 A CN 113904651A CN 202111131504 A CN202111131504 A CN 202111131504A CN 113904651 A CN113904651 A CN 113904651A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
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Abstract
The invention provides a crystal oscillator and an electronic device. The flexible vibration damping pad is arranged in the first gap and is connected with the electronic assembly and the outer shell respectively. When the crystal oscillator is delivered to a client, the crystal oscillator has the function of vibration resistance, and the requirement of the client on phase noise when the whole machine vibrates can be met. When the vibration absorber is used, a complex external vibration damping structure is not required to be arranged in the reserved space of the oscillator, and the vibration absorber can be directly used and is convenient to assemble. The crystal oscillator provided by the embodiment of the invention has the advantages of high reliability, small volume, good dynamic phase noise and convenience in production.
Description
Technical Field
The present invention relates to the field of electronic devices, and particularly to a crystal oscillator and an electronic device.
Background
The crystal oscillator is a heart of an electronic system, is widely applied to the fields of navigation, measurement and control, radar and the like, and is used as a system reference frequency source, and phase noise of the crystal oscillator has a large influence on the performance of the system.
With the development of electronic technology, vehicle-mounted, airborne, missile-borne and other electronic devices are subjected to mechanical vibration and impact environments which are worse than before, and at the moment, the phase noise of the crystal oscillator is deteriorated by more than 40dB, so that the normal operation of the electronic devices is affected. For example, due to the influence of random vibration, the phase noise of the crystal oscillator can be greatly reduced, the detection sensitivity of the radar can be reduced, and the error rate of communication equipment can be improved; if the radar is used on an aircraft or missile, catastrophic results can occur. In order to ensure the signal quality of an electronic system in the vibration process and improve the precision and the reliability of the system, vibration isolation measures must be taken on a crystal oscillator, the phase noise deterioration of the crystal oscillator under the vibration condition is reduced, and the capability of the crystal oscillator adapting to various severe environment conditions is improved.
Although some oscillators with damping assemblies are available on the market, these oscillators have the problems of poor damping effect, large occupied space and inconvenient installation.
Disclosure of Invention
The invention provides a crystal oscillator, which is used for solving the problems of poor vibration damping effect, large occupied space and inconvenient installation of the conventional crystal oscillator.
The present invention provides a crystal oscillator, including:
an outer housing having a cavity formed therein;
the electronic assembly is arranged in the cavity, and a first gap is formed between the electronic assembly and the outer shell;
and the flexible vibration damping pad is arranged in the first gap and is respectively connected with the electronic assembly and the outer shell.
According to the crystal oscillator provided by the embodiment of the invention, the crystal oscillator further comprises a lead, the outer shell is provided with a through hole, one end of the lead is electrically connected with the electronic component, and the other end of the lead extends to the outside of the outer shell through the through hole.
According to the crystal oscillator provided by the embodiment of the invention, the inner wall of the through hole is connected with the lead wire through gluing, or a flexible gasket is arranged between the inner wall of the through hole and the lead wire.
According to the crystal oscillator provided by the embodiment of the invention, one end of the lead is connected with the top of the electronic component.
According to an embodiment of the crystal oscillator, the first gap is formed between the electronic component and a sidewall of the outer housing.
According to the crystal oscillator provided by the embodiment of the invention, the flexible vibration damping pad is made of silicon rubber or rubber, the Poisson ratio of the silicon rubber is 0.4-0.5, the thickness of the silicon rubber is 2mm-8mm, and the density of the silicon rubber is 1.1g/cm3-1.3g/cm3。
According to the crystal oscillator provided by the embodiment of the invention, the outer shell comprises a shell body and a cover body, the cavity is formed in the shell body, the top of the shell body is provided with an opening communicated with the cavity, and the cover body covers the opening and is detachably connected with the shell body.
According to the crystal oscillator provided by the embodiment of the invention, a second gap is formed between the bottom of the cover body and the top of the electronic component, the second gap is provided with the flexible vibration reduction pad, and the flexible vibration reduction pad is respectively connected with the cover body and the electronic component.
According to an embodiment of the present invention, there is provided a crystal oscillator, wherein the electronic component includes an inner housing and an electronic component disposed inside the inner housing, and the electronic component is connected to the inner housing.
The invention also provides an electronic device, which comprises a circuit board and the crystal oscillator, wherein the crystal oscillator is arranged on the circuit board.
According to the crystal oscillator provided by the embodiment of the invention, the flexible vibration damping pad is arranged in the gap between the electronic component and the side wall of the outer shell, and the flexible vibration damping pad is used as a vibration damping mechanism of the electronic component, so that the deterioration of phase noise of the crystal oscillator in a vibration state can be effectively reduced, and the capability of an electronic system based on the crystal oscillator to work under various severe environment conditions is improved. When the crystal oscillator is delivered to a client, the crystal oscillator has the function of vibration resistance, and the requirement of the client on phase noise when the whole machine vibrates can be met. When the vibration absorber is used, a complex external vibration damping structure is not required to be arranged in the reserved space of the oscillator, and the vibration absorber can be directly used and is convenient to assemble. The crystal oscillator provided by the embodiment of the invention has the advantages of high reliability, small volume, good dynamic phase noise and convenience in production.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 illustrates a schematic structural diagram of a crystal oscillator provided by an embodiment of the present invention;
FIG. 2 illustrates a schematic diagram of a mechanical analysis model of a passive damping system provided by an embodiment of the invention;
FIG. 3 illustrates a response diagram of a crystal oscillator provided by an embodiment of the present invention in a certain direction;
FIG. 4 illustrates a static phase noise diagram of a crystal oscillator provided by an embodiment of the present invention;
fig. 5 illustrates a dynamic phase noise diagram of a crystal oscillator provided by an embodiment of the invention.
Reference numerals: 1. a housing body; 2. a cover body; 3. a screw; 4. a flexible vibration damping pad; 5. an inner housing; 6. an electronic component; 7. an output pin; 8. a lead wire; 9. insulating glass beads; 10. a fixed point.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The crystal oscillator and the electronic device according to the embodiment of the present invention will be described with reference to fig. 1 to 5.
Fig. 1 illustrates a structural schematic diagram of a crystal oscillator according to an embodiment of the present invention, and as shown in fig. 1, the crystal oscillator includes an outer housing, an electronic component, and a flexible damping pad 4, a cavity is formed inside the outer housing, the electronic component is disposed in the cavity, and a first gap is formed between the electronic component and the outer housing. The flexible vibration damping pad 4 is arranged in the first gap, and the flexible vibration damping pad 4 is connected with the electronic component and the side wall of the outer shell respectively.
According to the crystal oscillator provided by the embodiment of the invention, the flexible vibration damping pad 4 is arranged in the gap between the electronic component and the side wall of the outer shell, and the flexible vibration damping pad 4 is used as a vibration damping mechanism of the electronic component, so that the deterioration of phase noise of the crystal oscillator in a vibration state can be effectively reduced, and the capability of an electronic system based on the crystal oscillator to work under various severe environment conditions is improved. When the crystal oscillator is delivered to a client, the crystal oscillator has the function of vibration resistance, and the requirement of the client on phase noise when the whole machine vibrates can be met. When the vibration absorber is used, a complex external vibration damping structure is not required to be arranged in the reserved space of the oscillator, and the vibration absorber can be directly used and is convenient to assemble. The crystal oscillator provided by the embodiment of the invention has the advantages of high reliability, small volume, good dynamic phase noise and convenience in production.
According to an embodiment of the present invention, as shown in fig. 1, the electronic component includes an inner housing 5 and an electronic component 6 disposed inside the inner housing 5, the outer housing and the inner housing 5 are both rectangular housings, and a first gap between the inner housing 5 and the outer housing is provided with four flexible vibration damping pads 4, wherein two flexible vibration damping pads 4 are respectively located at the left and right sides of the inner housing 5, and the other two flexible vibration damping pads 4 are respectively located at the front and rear sides of the inner housing 5. The electronic component 6 and the inner housing 5 are connected by screws, but the electronic component 6 and the inner housing 5 may be connected by soldering. The top of the electronic component 6 is provided with insulating glass beads 9 and the output pins 7 are also provided on the top of the electronic component 6.
According to an embodiment of the invention, the electronic component 6 comprises a crystal oscillator, which may be a conventional in-line package (including DIP14 package and 25 × 25mm package)2Package) crystal oscillator, and can also be a PCB board provided with a crystal oscillator circuit.
According to an embodiment of the present invention, the crystal oscillator further includes a lead wire 8, and the lead wire 8 is used to electrically connect the electronic component 6 with an external circuit. The outer shell is provided with a through hole, one end of a lead 8 is connected with an output pin 7 of the electronic element 6 in a welding mode, and the other end of the lead 8 extends to the outside of the outer shell through the through hole. The lead 8 comprises a soft lead and a shielding wire, and the soft lead and the shielding wire can be led out through the same through hole or can be led out through two through holes respectively.
According to the embodiment of the invention, the inner wall of the through hole is connected with the lead 8 through gluing, and compared with the prior art that the output pin 7 and an external circuit are connected through a flying wire and the lead 8 is fixed through gluing, the stability of the lead 8 is improved, and the reliability of the crystal oscillator is further improved. Of course, the fixing method of the lead 8 is not limited to this, and a flexible pad may be fitted on the outer peripheral surface of the lead 8 and then fitted into the through hole, and similarly, the lead 8 may be raisedTo a fixed effect. The flexible gasket is made of silicon rubber or rubber, and the outer diameter of the lead 8 is
The inner diameter of the through hole matches the outer diameter of the lead 8.
According to the embodiment of the invention, one end of the lead 8 is connected with the top of the electronic component through gluing to form secondary fixing of the lead 8, and the secondary fixing can further improve the stability of the lead 8. To facilitate the fixation of the lead 8, the top of the electronic component is provided with a fixation point 10, the position of the fixation point 10 corresponding to the fixation position of one end of the lead 8. After one end of the lead 8 is welded to the output pin 7 of the electronic component 6, the other end of the lead 8 is connected to the fixing point 10 by gluing, so that the secondary fixing of the lead 8 can be completed. Of course, the manner of secondarily fixing the lead 8 is not limited to the manner of gluing, and the lead 8 may be secondarily fixed by using a snap or other fixing means.
According to the embodiment of the invention, a first gap is formed between the electronic component and the side wall of the outer shell, the flexible damping pad 4 is arranged in the first gap, and the flexible damping pad 4 is respectively connected with the electronic component and the side wall of the outer shell.
According to the embodiment of the invention, the flexible damping pad 4 is made of silicon rubber or rubber, the Poisson ratio of the silicon rubber is 0.4-0.5, and the density of the silicon rubber is 1.1g/cm3-1.3g/cm3. The thickness of the silicon rubber is 2mm-8mm, and the specific thickness of the silicon rubber is determined according to the size of the first gap. When the inner shell 5 is fixed by using the silicon rubber, a damping structure is formed between the inner shell 5 and the outer shell by solidifying the silicon rubber by means of a glue pouring mold in a mode of die pressing and high-temperature vulcanization at 160 ℃, and the inner shell 5 is fixed in the cavity.
According to the embodiment of the invention, the outer shell comprises an outer shell body 1 and a cover body 2, a cavity is formed inside the outer shell body 1, and an opening communicated with the cavity is formed at the top of the outer shell body 1. The shape of lid 2 and open-ended shape looks adaptation, lid 2 lid fits the opening, and four angles of lid 2 are provided with screw 3 respectively, and lid 2 passes through screw 3 with shell body 1 and is connected. Certainly, the cover body 2 and the housing body 1 can also be connected through a buckle, and the cover body 2 can be mounted and dismounted more conveniently by using the buckle connection.
According to the embodiment of the invention, a second gap is formed between the bottom of the cover body 2 and the top of the electronic assembly, the second gap is provided with a flexible damping pad 4, and the flexible damping pad 4 is respectively connected with the cover body 2 and the top of the electronic assembly.
According to the embodiment of the invention, the crystal oscillator comprises an outer shell, an electronic component, a flexible damping pad 4 and a lead 8, wherein the outer shell comprises a shell body 1 and a cover body 2, a cavity is formed inside the shell body 1, and an opening communicated with the cavity is formed in the top of the shell body 1. The cover body 2 covers the opening, four corners of the cover body 2 are respectively provided with a screw 3, and the cover body 2 is connected with the shell body 1 through the screws 3.
The electronic component is arranged in the cavity, and a first gap is formed between the electronic component and the side wall of the outer shell. Electronic component includes interior casing 5 and sets up in the inside electronic component 6 of interior casing 5, and the shell body is the rectangle casing with interior casing 5, and the first clearance between interior casing 5 and the shell body is provided with four flexible damping pads 4, and wherein, two flexible damping pads 4 are located the left and right sides of interior casing 5 respectively, and two flexible damping pads 4 are located the front and back both sides of interior casing 5 respectively in addition. Flexible damping pads 4 are connected to the side walls of the inner housing 5 and the outer housing, respectively, to secure the electronic assembly within the cavity. The flexible vibration damping pad 4 is made of silicon rubber, the Poisson ratio of the silicon rubber is 0.4-0.5, and the density of the silicon rubber is 1.1g/cm3-1.3g/cm3The thickness of the silicon rubber is 2mm-8 mm.
The outer shell is provided with a through hole, one end of a lead 8 is connected with an output pin 7 of the electronic element 6, and the other end of the lead 8 extends to the outside of the outer shell through the through hole. The lead 8 comprises a soft lead 8 and a shielding wire, and the soft lead and the shielding wire can be led out through the same through hole or can be led out through two through holes respectively. The inner wall of through-hole and lead wire 8 pass through adhesive bonding, compare and adopt flying wire to connect output pin 7 and external circuit among the prior art, fix lead wire 8 through gluing, have improved lead wire 8's stability, have further improved crystal oscillator's reliability. One end of the lead 8 is connected with the top of the electronic component through glue, and the lead 8 can be fixed for the second time, so that the stability of the lead 8 is further improved.
When the crystal oscillator is delivered to a client, the crystal oscillator has the function of vibration resistance, and the requirement of the client on phase noise when the whole machine vibrates can be met. When the vibration absorber is used, a complex external vibration damping structure is not required to be arranged in the reserved space of the oscillator, and the vibration absorber can be directly used and is convenient to assemble. The crystal oscillator provided by the embodiment of the invention has the advantages of high reliability, small volume, good dynamic phase noise and convenience in production.
The crystal oscillator provided by the embodiment of the invention has the advantages of small volume, simplicity in assembly, high consistency, high reliability and convenience in use, and can meet the requirements of customers on phase noise under vibration conditions.
The vibration reduction principle based on the crystal oscillator is as follows:
in the vibration state, when the vibration amplitude of the crystal oscillator is not large, it can be assumed that the small signal is modulated with the crystal oscillator signal, and the calculation method of the phase noise of the crystal oscillator in the vibration state is as follows formula (1):
L＝20×log((Γ·A)f0/(2fv)) (1)
wherein L is the deviation main frequency f of the crystal oscillator in the vibration statevPhase noise of (2);
fvis the frequency offset;
f0the output frequency of the crystal oscillator in a static state is obtained;
gamma is the acceleration sensitivity of the crystal;
a is the vibration amplitude of the vibration table, and both Γ and A are vectors.
In most cases the vibrations to which the crystal oscillator is subjected are random vibrations, in which case the acceleration can be expressed in terms of its power spectral density g (f). Thus, equation (1) can be expressed as:
it can be derived from the above equation (1) that the phase noise of the crystal oscillator when it is subjected to vibration is proportional to the power spectral density of the vibration and the acceleration sensitivity of the crystal resonator. In order to obtain better phase noise, it is necessary to reduce the magnitude of the spectral density of the vibrations transmitted to the crystal oscillator, in addition to reducing the acceleration sensitivity of the crystal.
Fig. 2 illustrates a schematic diagram of a mechanical analysis model of a passive vibration damping system according to an embodiment of the present invention, and as shown in fig. 2, a vibration damping mechanism formed by a flexible vibration damping pad 4 and an electronic component form a passive vibration damping system, which can be analyzed by using the passive vibration damping system, and a transmission rate of a dynamic model of a crystal oscillator system can be represented as:
wherein the resonance frequency omega of the vibration-damping structure2n is k/m, damping ratio D is a/omegan，a＝c/2m，γ＝ω/ωn. Wherein c is the damping coefficient of the vibration damping material, k is the stiffness of the vibration damping material, and m is the mass of the crystal oscillator.
The resonance frequency of the vibration damper is determined so that it is far from the phase noise frequency offset of interest to the customer, based on the mass m of the internal crystal oscillator, the stiffness and damping coefficient of the vibration damping material.
Fig. 3 illustrates a response diagram of the crystal oscillator in a certain direction, and as shown in fig. 3, large amplitude attenuation is obtained at both 1KHz and 10KHz, and the attenuation amplitude reaches more than 90%.
Table 1 illustrates the damping effect of the crystal oscillator of the present invention, and as shown in table 1, table 1 summarizes the structural responses of the crystal oscillator of the present invention in three directions, and it can be seen from data that the damping effect of the crystal oscillator meets the design requirements.
TABLE 1
By detecting the 80MHz crystal oscillator, the static phase noise of the 80MHz crystal oscillator provided by the embodiment of the invention is-141 @1KHz and-155 @10KHz, and the dynamic phase noise is-134 @1KHz and 155@10 KHz.
FIG. 4 is a schematic diagram illustrating static phase noise of a crystal oscillator provided by an embodiment of the present invention, and FIG. 5 is a schematic diagram illustrating dynamic phase noise of a crystal oscillator provided by an embodiment of the present invention, as shown in FIGS. 4 and 5, the dynamic phase noise of an oscillator based on a vibration reduction structure of the present invention deteriorates by only 7dB at 1KHz, which is greatly improved compared with 40dB deterioration of a structure without vibration reduction and vibration reduction; the dynamic phase noise at 10KHz is not deteriorated, and a good vibration reduction effect is obtained. The crystal oscillator can meet the index requirement of the airborne or missile-borne complete machine environment on the dynamic phase noise of the oscillator.
The invention also provides an electronic device, which comprises a circuit board and the crystal oscillator according to any one of the embodiments, wherein the crystal oscillator is arranged on the circuit board.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A crystal oscillator, comprising:
an outer housing having a cavity formed therein;
the electronic assembly is arranged in the cavity, and a first gap is formed between the electronic assembly and the outer shell;
and the flexible vibration damping pad (4) is arranged in the first gap, and the flexible vibration damping pad (4) is respectively connected with the electronic assembly and the outer shell.
2. A crystal oscillator according to claim 1, further comprising a lead wire (8), wherein the outer case is provided with a through hole, one end of the lead wire (8) is electrically connected to the electronic component, and the other end of the lead wire (8) extends to the outside of the outer case through the through hole.
3. A crystal oscillator according to claim 2, characterized in that the inner wall of the through hole is connected to the lead (8) by gluing or a flexible gasket is provided between the inner wall of the through hole and the lead (8).
4. A crystal oscillator according to claim 2 or 3, characterized in that one end of the lead (8) is connected to the top of the electronic component.
5. A crystal oscillator according to any one of claims 1 to 3, wherein the first gap is formed between the electronic component and a side wall of the outer housing.
6. The crystal oscillator according to claim 5, characterized in that the flexible damping pad (4) is made of silicon rubber or rubber, the Poisson's ratio of the silicon rubber is 0.4-0.5, the thickness of the silicon rubber is 2mm-8mm, and the density of the silicon rubber is 1.1g/cm3-1.3g/cm3。
7. A crystal oscillator according to any one of claims 1 to 3, wherein the outer casing comprises a casing body (1) and a cover body (2), the cavity is formed inside the casing body (1), an opening communicated with the cavity is arranged at the top of the casing body (1), and the cover body (2) covers the opening and is detachably connected with the casing body (1).
8. A crystal oscillator according to claim 7, characterized in that a second gap is formed between the bottom of the cover (2) and the top of the electronic component, said second gap being provided with said flexible damping pad (4), said flexible damping pad (4) being connected to the cover (2) and the electronic component, respectively.
9. A crystal oscillator according to any one of claims 1 to 3, characterized in that the electronic assembly comprises an inner housing (5) and an electronic component (6) arranged inside the inner housing (5), the electronic component (6) being connected to the inner housing (5).
10. An electronic device comprising a circuit board, characterized by further comprising the crystal oscillator of any one of claims 1 to 9, the crystal oscillator being provided to the circuit board.
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| CN202111131504.3A CN113904651A (en) | 2021-09-26 | 2021-09-26 | Crystal oscillator and electronic device |
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| CN202111131504.3A CN113904651A (en) | 2021-09-26 | 2021-09-26 | Crystal oscillator and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115459733A (en) * | 2022-11-11 | 2022-12-09 | 成都世源频控技术股份有限公司 | High-stability crystal oscillator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115459733A (en) * | 2022-11-11 | 2022-12-09 | 成都世源频控技术股份有限公司 | High-stability crystal oscillator |
| CN115459733B (en) * | 2022-11-11 | 2023-03-24 | 成都世源频控技术股份有限公司 | High-stability crystal oscillator |
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