CN113903686A - Chip, chip production system and method, recycled chip and production method thereof - Google Patents

Chip, chip production system and method, recycled chip and production method thereof Download PDF

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Publication number
CN113903686A
CN113903686A CN202111129005.0A CN202111129005A CN113903686A CN 113903686 A CN113903686 A CN 113903686A CN 202111129005 A CN202111129005 A CN 202111129005A CN 113903686 A CN113903686 A CN 113903686A
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China
Prior art keywords
chip
unit
component
chips
assembly
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CN202111129005.0A
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Chinese (zh)
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不公告发明人
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Hangzhou Chipjet Technology Co Ltd
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Hangzhou Chipjet Technology Co Ltd
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Priority to CN202111129005.0A priority Critical patent/CN113903686A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to the technical field of chip production and processing, and discloses a chip, a chip production system and method, a regenerated chip and a production method thereof. The chip production system includes: the feeding unit can hold the chips and discharge the chips from the outlet end one by one in a preset direction; the first loading unit is detachably connected with a first container, one end of the conveying unit is connected with the outlet end of the feeding unit, and the other end of the conveying unit is in butt joint with the first loading unit, so that chips are orderly loaded into the first container; the feeding unit can store a plurality of first containers and can send the chips in the first containers into the transmission unit one by one, the transmission unit can convey the chips to at least one test unit, and the test unit can test the chips; the second loading unit can load the chip whose operation is completed in the test unit into the second container. The chip production system, the chip production method and the regenerated chip production method have high automation degree and high production efficiency. The chip and the regeneration chip of the invention have high production efficiency and low cost.

Description

Chip, chip production system and method, recycled chip and production method thereof
Technical Field
The invention relates to the technical field of chip production and processing, in particular to a chip, a chip production system and method, a regenerated chip and a production method thereof.
Background
The printing equipment needs to use printing consumables such as ink cartridges or selenium drums in the working process, the printing consumables are provided with chips for recording information of the ink cartridges or the selenium drums, and the chips need to be sent into the test unit in a preset direction in the production process of the chips to perform data writing, verification, performance detection and other operations so as to write, read or rewrite information stored by the chips.
Before sending into the test unit, a large amount of chips are stacked together irregularly, because the chip size is very little, generally need the manual work to put the direction of chip one by one accurate back and send into the test unit again, production efficiency is very low. In order to improve production efficiency, the scheme that usually adopts among the prior art is once only with a plurality of chip orientations pendulum and place in the tray to the tray is whole to be sent into the test unit and carry out information processing as the unit, and this kind of mode can improve production efficiency to a certain extent, but whole production process still relies on the manual work, and degree of automation is low, the promotion of production efficiency has the limitation, still can not effectively reduce chip cost.
Therefore, a chip production system and method, a recycled chip and a production method thereof are needed to solve the above technical problems.
Disclosure of Invention
The first purpose of the invention is to provide a chip production system which has high automation degree and high production efficiency.
The second purpose of the invention is to provide a chip production method, which has high automation degree and high production efficiency by adopting the chip production system.
The third objective of the present invention is to provide a chip manufactured by the above chip manufacturing system, which has high chip manufacturing efficiency and low cost.
The fourth purpose of the invention is to provide a production method of the regenerated chip, which has high automation degree and high production efficiency by adopting the chip production system.
The fifth purpose of the invention is to provide a regenerated chip, which is manufactured by adopting the production method of the regenerated chip, and has high production efficiency and low cost.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip production system, comprising:
the feeding unit can contain chips and discharge the chips from the outlet end one by one in a preset direction;
the conveying unit is detachably connected with a first container, one end of the conveying unit is connected with the outlet end of the feeding unit, and the other end of the conveying unit can be in butt joint with the first charging unit, so that the chips are sequentially loaded into the first container;
the feeding unit can store a plurality of first containers and can feed the chips in the first containers one by one into the conveying unit, the conveying unit can convey the chips to at least one testing unit in sequence, and the testing unit can test the chips;
and a second loading unit capable of loading the chip operated in the test unit into a second container.
Optionally, the chip production system further comprises:
a surface assembly unit for mounting the wafer and/or the component on the PCB and forming a bare chip;
a packaging unit, configured to package the bare chip, so that the wafer and/or the component are electrically connected to the PCB to form the chip;
and the transferring unit is used for conveying the chips into the feeding unit.
Optionally, the chip production system further includes a glue shoveling unit, and the glue shoveling unit is configured to shovel off the glue on the old chip and the wafer in the glue, and convey the remaining PCB to the surface assembly unit.
Optionally, the shovel unit includes feed mechanism, heating mechanism and removes gluey mechanism, wherein:
the feeding mechanism is used for transmitting the chips forwards in the same direction of the colloid on the surfaces of the chips;
the heating mechanism is arranged on a transmission path of the chip and is used for heating the chip;
the glue removing mechanism comprises a scraper knife which can move relative to the chip so as to remove the heated glue on the surface of the chip.
Optionally, the feeding unit comprises:
the vibration mechanism can contain the chip and can generate vibration;
screening mechanism, including being used for supplying the chip is with the transfer orbit of putting the state forward and moving vertically, transfer orbit one end with vibration mechanism's exit end is connected, the other end with the conveying unit is connected, be provided with at least one screening portion on the transfer orbit, screening portion is used for the screening place with preset position on the transfer orbit the chip.
Optionally, the conveying track includes a side plate and a pallet provided at a side of the side plate for supporting the chip moved in a standing state;
along the extending direction of the conveying track, the chip screening device is provided with a first screening part and at least one of a second screening part, a third screening part and a fourth screening part which are arranged behind the first screening part, wherein:
the first screening part is used for screening the rubber-bearing surface orientation of the chip, and the width of the supporting plate at the first screening part is set based on the PCB thickness of the chip, so that the rubber-bearing surface of the chip can be vibrated down when facing the side plate; when the adhesive-carrying surface of the chip is opposite to the side plate, the chip can pass through the first screening part and continuously move forwards;
the second screening part is configured to penetrate through a first hollow window of the side plate, and the first hollow window is set to enable the chip with the height exceeding the upper boundary of the first hollow window along the extension direction of the side plate to pass through;
the third screening part is used for screening the direction of the notch of the chip, a second hollow window penetrating through the side plate is arranged at the third screening part of the side plate, the third screening part comprises a bulge, the bulge protrudes from the upper boundary of the second hollow window to the inside of the second hollow window by referring to the conveying direction of the chip, the bulge is set to enable the notch of the chip to fall through the second hollow window when aligned with the bulge, and the distance between the bulge and the two sides of the second hollow window is not more than the width of the chip;
the fourth screening portion is used for screening the component orientation of chip, the fourth screening portion including connect in conveying orbital vertical plate body, and set up in the plate body of buckling of vertical plate body upper end, buckle the plate body and be in vertical plate body upper end inflection forms the spout of downwardly opening, the spout extends along a straight line direction, be provided with the edge in the spout the sand grip that the spout extending direction extends, works as the upper end of chip gets into during the spout, the component on the chip with the sand grip cooperation makes the chip can be followed the spout slides.
Optionally, the conveying unit comprises a material distributing assembly and a conveying rail, one end of the conveying rail is connected with the outlet end of the feeding unit, the other end of the conveying rail can be butted with the first container on the first charging unit, and the material distributing assembly enables the chips on the conveying rail to be sequentially conveyed into the first container on the first charging unit.
Optionally, the first charging unit is arranged lower than the feeding unit, and the conveying track is arranged obliquely.
Optionally, the material distribution assembly includes a pressing member and a blocking member disposed downstream of the pressing member, the blocking member is configured to block the lowermost chip on the conveying track, and the pressing member is configured to press the chip adjacent to the lowermost chip against the conveying track.
Optionally, a feeding detection part for detecting whether the chip enters the conveying track is arranged at one end of the conveying track connected with the outlet end of the feeding unit;
one end of the conveying track, which is connected with the first loading unit, is provided with a discharge detection piece for detecting whether the chip enters the first loading unit.
Optionally, the chip production system further includes at least one auxiliary material distribution assembly, and the auxiliary material distribution assembly enables the chips on the conveying rail to be smoothly conveyed to the first loading unit.
Optionally, the first loading unit comprises:
a charging plate on which a plurality of said first containers can be mounted in parallel;
a driving assembly, wherein the driving assembly drives the charging plate to move so as to enable different first containers to be respectively butted with the other end of the conveying track.
Optionally, the chip manufacturing system includes a support, the feeding unit, the transferring unit and the testing unit are disposed on the support, the feeding unit includes a storage for storing the first container, a transporter for taking out the first container from the storage and transferring the first container to a feeding position, and a feeder capable of transferring the chip contained in the first container at the feeding position to the transferring unit.
Optionally, the accumulator includes that two locate relatively the first storage frame and the second storage frame of support, first storage frame with the opposite face of second storage frame is equipped with respectively along first direction extension's first hold up and second hold up, first storage frame with the bottom of second storage frame all is equipped with the discharge gate, the both ends of first container are located respectively in first hold up and the second hold up, and can follow the discharge gate is followed the second direction roll-off, the second direction perpendicular to first direction.
Optionally, the transporter includes a moving plate, the moving plate is provided with a first placing part, the moving plate is slidably arranged on the bracket along the second direction, and the moving plate has a material taking position close to the storage and a feeding position close to the feeder; the storage device also comprises a discharging piece, the discharging piece is arranged on the support in a sliding mode along the first direction, and the discharging piece is provided with a jacking position for jacking the first container at the lowest layer to be above the discharge hole and a discharging position for discharging the first container at the lowest layer to be opposite to the discharge hole; when the unloading piece is located at the jacking position, the movable plate can move to the material taking position, and when the unloading piece is located at the material placing position, the first container falls into the first placing part and can be transferred to the feeding position by the movable plate.
Optionally, the feeder comprises:
the feeding frame comprises a supporting plate, is rotatably arranged on the supporting plate and is provided with a material receiving position for receiving the first container and a discharging position for enabling the first container to be obliquely placed, and is provided with a bearing part;
the pressing block is arranged on the feeding frame in a sliding mode and provided with a pressing position close to the bearing part so as to press the first container on the bearing part and a releasing position far away from the bearing part so as to release the first container.
Optionally, the support includes a support plate, the support plate is disposed in an inclined manner, the conveying unit includes a main material channel assembly and a material distribution channel assembly disposed on the support plate, the material distribution channel assembly is located below the main material channel assembly, the chip production system includes a plurality of test units arranged along a second direction, and the plurality of test units are located below the material distribution channel assembly;
the main material channel assembly can receive and simultaneously contain a plurality of chips from the first container, and can release the chips to the material distribution channel assembly one by one;
the material distribution channel assembly can drive the chip to move on the supporting plate along the second direction so as to selectively distribute the chip to any one of the plurality of test units.
Optionally, the test unit includes a writing and reading bearing plate, a writing and reading cover plate, a writing and reading code assembly and a first writing and reading stop member, the support includes a support plate arranged obliquely, the writing and reading bearing plate is arranged on the support plate, the writing and reading cover plate is arranged on the writing and reading bearing plate to form an operation channel, the first writing and reading stop member is used for blocking a chip to be written with data, and the writing and reading code assembly can write, read and verify the data of the chip.
Optionally, the second loading unit comprises a loading assembly and a fixing frame, the loading assembly is arranged on the supporting plate, the fixing frame is arranged below the loading assembly, a plurality of second containers can be arranged on the fixing frame, the loading assembly can receive the chips from the testing unit and can selectively place the chips into any one of the second containers.
Optionally, the test unit includes a code writing and reading component, and the code writing and reading component can write, read, and verify data to the chip; and/or the test unit comprises a performance detection component, and the performance detection component can perform performance detection on the chip entering the test unit; and/or the test unit comprises a marking assembly, and the marking assembly can mark the chip; and/or the test unit comprises a data rewriting component, and the data rewriting component can perform data flash on the chip needing to be upgraded; the second charging unit comprises a charging assembly, the code writing and reading assembly and/or the performance detection assembly and/or the marking assembly and/or the data rewriting assembly are/is respectively in communication connection and/or electrical connection with the charging assembly, and the charging assembly can respectively place the chips into different second containers according to the detection result of the performance detection assembly, and/or the verification result of the code writing and reading assembly, and/or the operation result of the marking assembly, and/or the test result of the data rewriting assembly.
A chip production method, which adopts the chip production system, specifically comprises the following steps:
carrying out surface assembly and packaging on the PCB to form a chip;
sequencing the chips in a preset direction;
sequentially conveying the sequenced chips to the test unit for performance detection and/or data writing and/or data verification and/or marking operation;
and respectively loading the chips into different second containers according to the operation result of the test unit.
Optionally, the test unit includes a code writing and reading component, and the code writing and reading component can write, read, and verify data to the chip; and/or the test unit comprises a performance detection component, and the performance detection component can perform performance detection on the chip entering the test unit; and/or the test unit comprises a marking assembly, and the marking assembly can mark the chip; and/or the test unit comprises a data rewriting component, and the data rewriting component can perform data flash on the chip needing to be upgraded;
the second charging unit comprises a charging assembly, the code writing and reading assembly and/or the performance detection assembly and/or the marking assembly and/or the data rewriting assembly are/is respectively in communication connection and/or electrical connection with the charging assembly, and the charging assembly can respectively place the chips into different second containers according to the detection result of the performance detection assembly, and/or the verification result of the code writing and reading assembly, and/or the operation result of the marking assembly, and/or the test result of the data rewriting assembly.
A production method of a regenerated chip adopts the chip production system, and specifically comprises the following steps:
removing the colloid on the old chip and the wafer in the colloid, and reserving the PCB;
carrying out surface assembly and packaging on the PCB to form a regenerative chip;
sequencing the regenerative chips in a preset direction;
sequentially conveying the sequenced regenerated chips to the test unit for performance detection and/or data writing and/or data verification and/or marking operation;
and respectively loading the regenerated chips into different second containers according to the operation result of the test unit.
Alternatively,
the test unit comprises a code writing and reading component which can write, read and verify data in the regeneration chip; and/or the test unit comprises a performance detection component, and the performance detection component can detect the performance of the regenerative chip entering the test unit; and/or the test unit comprises a marking component, and the marking component can mark the regenerated chip; and/or the test unit comprises a data rewriting component which can carry out data flash on the regeneration chip needing to be upgraded;
the second charging unit comprises a charging assembly, the code writing and reading assembly and/or the performance detection assembly and/or the marking assembly and/or the data rewriting assembly are/is respectively in communication connection and/or electrical connection with the charging assembly, and the charging assembly can respectively place the regeneration chips into different second containers according to the detection result of the performance detection assembly, and/or the verification result of the code writing and reading assembly, and/or the operation result of the marking assembly, and/or the test result of the data rewriting assembly.
A chip is manufactured by the chip production method.
A regenerated chip is prepared by the production method of the regenerated chip.
The invention has the beneficial effects that:
according to the chip production system, the directions of the chips can be automatically screened through the feeding unit, the chips can be continuously discharged one by one and then are loaded into the first container for subsequent use, the chips in the first container can be conveniently and continuously fed into the testing unit one by one to carry out corresponding operation through the matching of the feeding unit and the transmission unit, the chips which are completed with the operation are loaded into the second container through the second loading unit, and therefore the production of the chips is completed, and the subsequent use or the sale of the chips are facilitated. Whole process does not need the manual work to carry out the adjustment of chip position, does not need the manual work to send the chip to the test unit one by one, also does not need the manual work to collect the chip of accomplishing the operation to can improve the production efficiency of chip greatly, reduce the labour, reduction in production cost.
According to the chip production method and the regenerated chip production method, the chip production system is adopted, so that the production efficiency can be greatly improved, the labor force is reduced, and the production cost is reduced.
The chip of the invention is manufactured by adopting the chip production method, so that the chip production efficiency can be improved, and the chip cost can be reduced.
The regenerated chip of the invention is manufactured by adopting the production method of the regenerated chip, so that the production efficiency of the regenerated chip can be improved, and the cost of the regenerated chip can be reduced.
Drawings
Fig. 1 is a schematic perspective view of a feeding unit, a conveying unit and a first loading unit of a chip production system according to an embodiment of the present invention;
fig. 2 is a schematic perspective view illustrating a feeding unit, a transmission unit, a testing unit, and a second loading unit of a chip manufacturing system according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a chip according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a vibrating mechanism and a screening mechanism provided in an embodiment of the present invention;
fig. 5 is a schematic perspective view of a vibrating mechanism and a screening mechanism provided in an embodiment of the present invention from another perspective;
FIG. 6 is a schematic side view of a first screening portion according to an embodiment of the present invention, in which a non-adhesive surface of a chip is attached to a side plate;
FIG. 7 is a schematic side view of a first screening portion according to an embodiment of the present invention, in which a glued surface of a chip is adjacent to a side plate;
FIG. 8 is an enlarged schematic view of the structure at A in FIG. 5;
FIG. 9 is a schematic front view of a second screening portion according to an embodiment of the present invention, in which the upper end of the chip exceeds the upper boundary of the first hollow window;
fig. 10 is a schematic front view of a second screening portion according to an embodiment of the present invention, in which an upper end of a chip is lower than an upper boundary of a first hollow window;
FIG. 11 is an enlarged view of the structure at B in FIG. 5;
fig. 12 is a schematic front view of a third screening portion according to an embodiment of the present invention, in which a chip has an upward notch;
FIG. 13 is a schematic front view of a third screening portion according to an embodiment of the present invention, in which a chip has a notch facing downward;
FIG. 14 is an enlarged view of the structure at C in FIG. 5;
FIG. 15 is a schematic cross-sectional view of a fourth screening portion according to an embodiment of the present invention, in which the components on the chip are disposed downward;
FIG. 16 is a schematic illustration of a decking configuration for a fourth screening portion according to one embodiment of the invention, showing components on the chip facing upward;
fig. 17 is a schematic perspective view of a feeding unit, a conveying unit and a first loading unit of a chip production system according to an embodiment of the present invention;
FIG. 18 is an enlarged view of the structure of FIG. 17 at D;
fig. 19 is a schematic perspective view of a back side of a conveying unit according to an embodiment of the present invention;
FIG. 20 is an enlarged view of the structure of FIG. 19 at E;
FIG. 21 is a schematic perspective view of a feeding unit according to a first embodiment of the present invention;
FIG. 22 is a schematic perspective view of a reservoir according to an embodiment of the present invention;
FIG. 23 is a schematic view of a portion of a feeder according to an embodiment of the present invention;
FIG. 24 is a schematic view of a second partial structure of a feeder according to a first embodiment of the present invention;
FIG. 25 is a schematic view of a partial structure of a transporter according to an embodiment of the present invention;
FIG. 26 is a schematic perspective view of a main material channel assembly according to an embodiment of the present invention;
FIG. 27 is a first schematic view illustrating a first partial structure of a material distributing channel assembly according to a first embodiment of the present invention;
FIG. 28 is a schematic view of a second partial structure of a material distributing channel assembly according to a first embodiment of the present invention;
FIG. 29 is a schematic view of a first angle of a test unit according to an embodiment of the present invention;
FIG. 30 is a partial structural view of a second angle of the test unit according to an embodiment of the present invention;
FIG. 31 is a schematic diagram illustrating a third angle of a test unit according to an embodiment of the present invention;
fig. 32 is a schematic perspective view of a second loading unit according to an embodiment of the present invention;
FIG. 33 is a flow chart illustrating a method for manufacturing a chip according to an embodiment of the present invention;
fig. 34 is a schematic perspective view of a glue shoveling unit according to a second embodiment of the invention;
FIG. 35 is a schematic perspective view of an interior of a glue shoveling unit provided by the second embodiment of the invention at a first viewing angle;
FIG. 36 is a schematic perspective view of an interior of a glue shoveling unit provided in accordance with a second embodiment of the present invention;
fig. 37 is a schematic perspective view of the inner part of the glue shoveling unit provided by the second embodiment of the invention in a third view angle;
FIG. 38 is an enlarged view of the structure at F in FIG. 35;
FIG. 39 is an enlarged view of the structure at G in FIG. 36;
FIG. 40 is an enlarged schematic view of FIG. 37 at H;
fig. 41 is a schematic perspective view of a heating mechanism according to a second embodiment of the present invention;
FIG. 42 is a top view of a heating mechanism provided in accordance with a second embodiment of the present invention;
FIG. 43 is a schematic diagram of an elastic lifting device according to a second embodiment of the present invention;
FIG. 44 is a flow chart illustrating a method for manufacturing a recycled chip according to a second embodiment of the present invention.
In the figure:
100. a chip; 101. a PCB board; 102. a colloid; 103. an element; 104. a notch; 200. a first container; 300. a second container; 400. a support; 401. a support plate; 402. a carrier plate; 500-a display unit;
1. a glue shoveling unit; 11. a feeding mechanism; 111. a transmission assembly; 1111. a transfer track; 1112. a push assembly; 1112a, a drive source; 1112b, a feed brush; 112. a vibrating device; 12. a heating mechanism; 121. a heat conducting stage; 1211. a transfer slot; 1212. a top outlet; 122. a limit baffle; 1221. a chute; 1222. grinding the groove; 13. a glue removing mechanism; 131. a scraper knife; 132. a tool holder assembly; 133. a support assembly; 1331. a guide slide rail; 134. an impact unit; 14. a cleaning mechanism; 15. a polishing mechanism; 151. rolling and brushing; 16. a base; 17. a hood; 171. a touch screen; 172. a function button; 173. a temperature control device; 174. an indicator light; 18. a dust removal mechanism;
2. a feeding unit; 21. a vibration mechanism; 211. an outlet end; 22. a screening mechanism; 221. a transfer rail; 2211. a side plate; 2211a, outer side; 2211b, inner side; 2212. a support plate; 222. a first screening section; 223. a second screening section; 2231. a first hollow window; 224. a third screening section; 2241. a second hollow window; 2242. a protrusion; 225. a fourth screening section; 2251. a longitudinal plate body; 2252. bending the plate body; 2253. a chute; 2254. a convex strip;
3. a conveying unit; 31. a conveying track; 311. a first track; 312. a second track; 32. a material distributing component; 321. a pressing member; 322. a blocking member; 33. a first detecting member; 34. a second detecting member; 35. feeding a material detection piece; 36. a discharge detection member; 37. a glide detection member;
4. a first charging unit; 41. a charging plate; 42. a drive assembly; 421. a lead screw; 422. a nut; 423. a drive motor;
5. an auxiliary material distribution assembly;
6. a feeding unit; 61. a reservoir; 611. a first storage rack; 6111. a first storage tank; 6112. a discharge port; 612. a second storage rack; 6121. a second storage tank; 613. a ballast block; 614. a ballast limit; 615. unloading the material; 62. a transporter; 621. moving the plate; 6211. a first placing section; 6212. a second placing section; 622. a rolling member; 623. a first pushing block; 624. fixing a driving member; 625. pushing the driving member; 626. a second pushing block; 627. an empty container jack; 63. a feeder; 631. a feeding frame; 6311. a bearing part; 632. rotating the driving member; 633. briquetting; 634. pressing down the driving member; 635. pushing the driving member; 636. a pushing member; 64. a collection region;
7. a transmission unit; 71. a main material channel component; 711. a main bearing plate; 712. a main cover plate; 713. a first primary crimp member; 714. a second primary crimping member; 715. a primary stop; 716. a first primary detection member; 717. a second primary detection member; 718. a third primary detection member; 72. a material distributing channel assembly; 721. dividing a bearing plate; 722. dividing a cover plate; 723. a sub-stopper; 724. a material distributing conveying belt; 725. a material distribution transmission driving part; 726. a material distributing driving wheel; 727. a material distributing driven wheel;
8. a test unit; 81. a writing and reading bearing plate; 82. a writing and reading cover plate; 83. a code writing and reading component; 84. a first write-read stop; 85. a second write-read stop; 86. a third write-read stop; 87. a writing and reading pressure connection piece; 88. a first read-write detector; 89. a second write-read detection element;
9. a second charging unit; 91. a charging assembly; 911. a loading plate; 912. a charging cover plate; 913. a charging stop; 92. a fixed mount; 921. a container placement floor; 922. a container placement cover plate; 923. a spring plate; 93. a charging power assembly.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
Example one
The embodiment provides a chip production system, a chip production method and a chip, which can be used for producing the chip 100 in a printing consumable material. The chip production system includes a surface assembly unit for mounting a wafer, a component 103, and the like on the PCB board 101, and a packaging unit. Thereby forming a bare chip 100, and the packaging unit is used for packaging the bare chip 100, so that the wafer and the component 103 are electrically connected to the PCB board 101, respectively, to form the chip 100. The surface mounting unit and the packaging unit can be any one of the prior art without departing from the inventive concept of the present application, and are not described herein again.
Preferably, as shown in fig. 1 and 2, the chip production system further includes a transfer unit, a feeding unit 2, a conveying unit 3, a first loading unit 4, a feeding unit 6, a conveying unit 7, at least one testing unit 8 and a second loading unit 9, the feeding unit 2 can hold the chips 100 and discharge the chips 100 from an outlet end one by one in a preset orientation, the first loading unit 4 is detachably connected with a first container 200, one end of the conveying unit 3 is connected with the outlet end of the feeding unit 2, the other end can be butted with the first loading unit 4 to sequentially load the chips 100 into the first container 200, the feeding unit 6 can store a plurality of first containers 200 and can feed the chips 100 in the first containers 200 into the conveying unit 7 one by one, the conveying unit 7 can sequentially convey the chips 100 to at least one testing unit 8, the testing unit 8 can perform testing operation on the chips 100, the second loading unit 9 can load the chips 100 whose operations are completed in the test unit 8 into the second container 300. It should be noted that the test unit 8 can be used for, but not limited to, code writing and reading operations and/or performance testing and/or marking operations on the chip 100. Specifically, the writing and reading codes perform data writing and data verification on the chip 100. The performance test is generally used to detect whether various performances of the chip 100 meet requirements, such as whether sensor parameters meet requirements, whether the writing speed of data meets requirements, and the like. It is understood that the first container 200 mounted on the first loading unit 4 is removed and placed at the feeding unit 6 to be stored by a robot or a human after being filled with the chips 100.
The chip production system of the embodiment can automatically screen the positions of the chips 100 through the feeding unit 2, and can continuously discharge the chips one by one, and then the chips are loaded into the first container 200 for subsequent use, the feeding unit 6 is matched with the transmission unit 7 to conveniently and continuously feed the chips 100 in the first container 200 into the testing unit 8 one by one for corresponding operation, the second loading unit 9 loads the chips 100 which complete the operation into the second container 300, thereby facilitating the subsequent use or sale of the chips 100, the whole process does not need manual adjustment of the positions of the chips 100, does not need manual feeding of the chips 100 to the testing unit 8 one by one, and does not need manual collection of the chips 100 which complete the operation, thereby greatly improving the production efficiency of the chips 100, reducing labor force and lowering production cost.
In this embodiment, the first container 200 and the second container 300 are both tubes matched in size to the chips 100, that is, only one chip 100 can be accommodated in the width direction of the tube, and a plurality of chips 100 are arranged in sequence in the length direction of the tube.
As shown in fig. 3, in this embodiment, the molded chip 100 includes a PCB 101, a glue 102 and a component 103, where the PCB 101 is rectangular, a notch 104 is disposed on the PCB 101, the PCB 101 includes a glue-carrying surface and a glue-free surface, and the glue 102 and the component 103 are disposed on the glue-carrying surface.
Preferably, as shown in fig. 4 and 5, the feeding unit 2 includes a vibration mechanism 21 and a screening mechanism 22, the vibration mechanism 21 can hold the chips 100 placed in a pile, disorderly, and can generate vibration, the vibration mechanism 21 has an exit end 211 for continuously outputting the chips 100 outward, the screening mechanism 22 includes a conveying rail 221, one end of the conveying rail 221 is connected to the exit end 211 of the vibration mechanism 21, the other end is connected to the conveying unit 3, the conveying rail 221 can allow the chips 100 to move forward in a standing state, and the conveying rail 221 has at least one screening portion for screening the chips 100 placed in a predetermined orientation on the conveying rail 221. In this embodiment, the "standing state" includes a strict vertical placement of the chip 100, and also includes a placement of the chip 100 at a certain inclination angle to the vertical direction.
Specifically, as shown in fig. 4, the conveying rail 221 may include a side plate 2211 and a support plate 2212 disposed at a side portion of the side plate 2211, and the lower end of the PCB board 101 of the chip 100 is supported on the support plate 2212. Since the screening mechanism 22 is used in cooperation with the vibration mechanism 21, in one embodiment, the conveying rail 221 is disposed in an arc shape and surrounds the upper end of the vibration mechanism 21. Thus, the conveying rail 221 substantially surrounds the trough of the vibrating mechanism 21, and when the chip 100 that has failed to pass through the sorting unit falls from the conveying rail 221, the chip can fall back into the trough of the vibrating mechanism 21. The side plate 2211 has an outer side surface 2211a positioned on the outer side of the arc and an inner side surface 2211b opposite to the outer side surface 2211a, and the support plate 2212 is provided on the outer side surface 2211a of the side plate 2211.
In the present embodiment, as shown in fig. 5, the screening portion includes a first screening portion 222, a second screening portion 223, a third screening portion 224, and a fourth screening portion 225, wherein the first screening portion 222 is used for screening the adhesive-coated surface orientation of the chip 100, the second screening portion 223 is used for screening the length and width directions of the rectangular chip 100, the third screening portion 224 is used for screening the orientation of the notch 104 on the chip 100, and the fourth screening portion 225 is used for screening the orientation of the element 103. It is understood that in other embodiments, the specific shape of the chip 100 may be changed to a square shape based on this embodiment, or no notch 104 is provided, or no component 103 is provided, and after the specific structure of the chip 100 is changed, the corresponding screening portion is adaptively selected and provided.
The first screening portion 222 is used to screen the adhesive-coated surface of the chip 100. Specifically, as shown in fig. 4, 6 and 7, the width of the carrier 2212 of the conveying track 221 at the first screening portion 222 is set based on the thickness of the PCB 101 of the chip 100, so that when the adhesive-free surface of the chip 100 is attached to the side plate 2211 and the adhesive-carrying surface is opposite to the side plate 2211 (i.e., the orientation shown in fig. 6), the chip 100 can smoothly pass through the first screening portion 222 and continue to be conveyed forward; when the adhesive side of the chip 100 faces the side plate 2211 (i.e. the orientation shown in fig. 7), the chip 100 is vibrated down because the width d of the supporting plate 2212 is small, the conveying rail 221 itself vibrates along with the vibrating mechanism 21, and the protruding height of the adhesive 102 is generally between 1mm and 1.2 mm. In some embodiments, the width d of the support plate 2212 may be approximately equal to the thickness of the PCB board 101, and the difference between the thickness may not exceed 0.15 mm. In this way, the chips 100 passing through the first screening portion 222 are all transferred forward in a direction in which the adhesive-free surface is attached to the side plate 2211.
Referring to fig. 6 and 7, in some embodiments, to allow the chip 100 in the orientation shown in fig. 6 to pass more stably through the first sifting portion 222, the side plate 2211 is obliquely disposed, and the support plate 2212 and the side plate 2211 are disposed substantially perpendicular to each other, so that the chip 100 abuts against the side plate 2211 under the influence of its own weight. Further, an included angle α is formed between one side face, which can be attached to the non-adhesive face of the PCB 101, of the side plate 2211 and the vertical direction, and α is not less than 20 ° and not more than 40 °.
The second screening portion 223 screens the rectangular chip 100 in the longitudinal and width directions. Referring to fig. 5 and 8, the side plate 2211 is provided with a first hollowed window 2231 penetrating the side plate 2211 at the second screening portion 223. Referring to the orientation shown in fig. 9, the height of the first hollow window 2231 is set to Y, the length of the long side of the PCB 101 of the chip 100 is Y, the length of the short side is x, the length Y of the long side is greater than the height Y of the first hollow window 2231, and the length x of the short side is less than the height Y of the first hollow window 2231. As such, when the chip 100 is transferred to the second screening portion 223 in the orientation shown in fig. 9, the upper edge of the PCB 101 exceeds the upper boundary of the first cutout window 2231, and thus, the chip 100 can pass through smoothly. When the chip 100 is transferred to the second screening portion 223 in the orientation shown in fig. 10, the upper edge of the PCB 101 is lower than the upper boundary of the first hollow window 2231, and therefore, the chip 100 can fall from the first hollow window 2231. In this way, all the chips 100 passing through the second screening portion 223 are oriented as shown in fig. 9.
The third screening portion 224 is used for screening the orientation of the notch 104 of the chip 100. Specifically, referring to fig. 11, the side plate 2211 is provided with a second hollow window 2241 penetrating through the side plate 2211 at the third screening portion 224, and referring to the direction shown in the figure, the third screening portion 224 includes a protrusion 2242, the protrusion 2242 extends from the upper boundary of the second hollow window 2241 to the hollow area of the second hollow window 2241, and the shape and size of the protrusion 2242 are designed based on the notch 104 on the chip 100. The width of the notch 104 is slightly greater than the width Z3 of the protrusion 2242. Distances between the protrusion 2242 and the left and right sides of the second hollow window 2241 are respectively Z1 and Z2, values of Z1 and Z2 do not exceed the width of the chip 100, so that the chip 100 is prevented from falling off on the left or right side of the protrusion 2242, and the height of the chip 100 is smaller than that of the second hollow window 2241. Thus, referring to fig. 12 and 13, in fig. 12, the notch 104 on the chip 100 is disposed upward, so that when the chip 100 is transferred to the notch 104 and aligned with the protrusion 2242, the chip 100 falls through the second hollow window 2241; in fig. 13, the notch 104 faces downward, and the PCB 101 can fit on the protrusion 2242 and then smoothly pass through the second hollow window 2241. As shown in fig. 11, the second hollow window 2241 may have a plurality of protrusions 2242 therein along the transmission direction of the chip 100.
Since the second and third screening portions 224 each screen the chip 100 in the predetermined orientation in the form of a hollow area, in order to facilitate the chip 100 to fall from the first hollow window 2231 or the second hollow window 2241, the side plate 2211 may be disposed along the inclination shown in fig. 6 and 7.
The fourth screening portion 225 is used for screening the orientation of the element 103 on the chip 100. Referring to fig. 14, the fourth screening part 225 includes a longitudinal plate body 2251 connected to the conveying rail 221, and a bending plate body 2252 provided at an upper end of the longitudinal plate body 2251, the bending plate body 2252 being bent back at the upper end of the longitudinal plate body 2251 and forming a slide groove 2253 opened downward, the slide groove 2253 extending in a linear direction, and a protrusion 2254 extending in the same direction as the slide groove 2253 is provided in the slide groove 2253. Referring to the orientation shown in fig. 15, the distance between the left side of the rib 2254 and the right side of the slide groove 2253 is no less than the thickness of the PCB 101. As shown in a comparison of fig. 15 and 16, when the element 103 is moved upward into the slot 2253 (i.e., the orientation shown in fig. 15), the element 103 is supported by the rib 2254 such that the upper end of the chip 100 cannot exit the slot 2253, and the chip 100 can continue to slide along the slot 2253; when the element 103 is moved downward into the slide 2253 (i.e., in the orientation shown in fig. 16), the chip 100 may fall out of the fourth screening portion 225 in the direction of the arrow shown in fig. 15 because the element 103 cannot engage the rib 2254. As described above, the supporting plate 2212 on the conveying rail 221 is used to support the lower end of the chip 100, and in order to prevent the supporting plate 2212 from affecting the chip 100 and falling out of the fourth screening portion 225, the conveying rail 221 may be stopped before the fourth screening portion 225 or may be stopped after extending a section along the sliding groove 2253.
Further, as shown in fig. 1, the fourth screening portion 225 extends to the conveying unit 3, and the chip 100 falls on the conveying unit 3 when moving to the end of the fourth screening portion 225, it is understood that, in order to ensure the direction of the chip 100 after falling on the conveying unit 3 is consistent, a corresponding guiding structure may be provided. The chip 100 is provided with contacts for data writing, and in this embodiment, the contacts are arranged upward after the chip 100 is dropped on the conveying unit 3 by a suitable guide structure.
Preferably, as shown in fig. 1, 17 and 18, the conveying unit 3 includes a distributing assembly 32 and a conveying rail 31, one end of the conveying rail 31 is connected to an outlet end of the feeding unit 2, the feeding unit 2 allows the chips 100 to enter the conveying rail 31, the conveying rail 31 sequentially arranges the chips 100, the other end of the conveying rail 31 is connected to the first loading unit 4, the distributing assembly 32 sequentially conveys the chips 100 on the conveying rail 31 to the first loading unit 4, and the first loading unit 4 is used for sub-packaging the chips 100.
In this embodiment, the chips 100 screened out from the feeding unit 2 are conveyed to the conveying track 31, the conveying track 31 enables the chips 100 to be sequentially arranged in the conveying track 31, the distributing component 32 enables the chips 100 on the conveying track 31 to be sequentially conveyed to the first loading unit 4, and the first loading unit 4 dispenses the chips 100, so that the chips 100 are automatically loaded, the loading of the chips 100 can be sequentially carried out, the production efficiency is improved, and the automatic production of the chips 100 is realized.
In this embodiment, as shown in fig. 1, the first loading unit 4 is disposed lower than the feeding unit 2, and the conveying rail 31 is disposed obliquely, so that the chips 100 entering the conveying rail 31 slide down into the first loading unit 4 by gravity. The structure is simple, and the equipment cost is low. Preferably, the inclination angle of the conveying rail 31 is 45 ° or more and 90 ° or less, and the chip 100 slides down on the conveying rail 31 by its own weight.
In this embodiment, as shown in fig. 1, the conveying track 31 includes a first track 311 and a second track 312, one end of the first track 311 is connected to the outlet end of the feeding unit 2, the other end is connected to one end of the second track 312, and the other end of the second track 312 is connected to the first loading unit 4. The first track 311 may be a pipe matched with the shape of the chip 100, and the chips 100 are arranged in a single row in the first track 311, so that the chips 100 are sequentially transported. The second rail 312 is provided with a sliding groove matching with the shape of the chip 100, and the chips 100 are arranged in the sliding groove in a single row. The dispensing assembly 32 is positioned at the location of the second track 312 to facilitate the orderly movement of the control chip 100.
Alternatively, in this embodiment, as shown in fig. 17 and 18, the separating assembly 32 includes a pressing member 321 and a blocking member 322 disposed downstream of the pressing member 321, the blocking member 322 is used for blocking the lowermost chip 100 on the conveying track 31, and the pressing member 321 is used for pressing the chip 100 adjacent to the lowermost chip 100 on the conveying track 31. The pressing member 321 and the blocking member 322 cooperate with each other to slide the chips 100 to the first loading unit 4 sequentially, and only one chip 100 slides each time. Specifically, in actual production, a plurality of chips 100 are sequentially arranged upstream of the blocking member 322, the pressing member 321 presses the chip 100 adjacent to the lowermost chip 100 to block the chip 100 and the chip 100 upstream from the pressing member from sliding off, at this time, the blocking member 322 is moved away, the chip 100 positioned at the lowermost chip slides off to the first loading unit 4, then the blocking member 322 is reset to continue blocking the chips 100, the pressing member 321 is moved away, all the chips 100 sequentially slide off downwards, the lowermost chip 100 is blocked by the blocking member 322, the pressing member 321 presses the chip 100 adjacent to the lowermost chip 100, and then the blocking member 322 is moved away again, thereby achieving the ordered delivery of the chips 100 to the first loading unit 4.
In order to automatically operate the pressing member 321 and the stopper 322, in the present embodiment, as shown in fig. 18, the first detector 33 for detecting the chip 100 is provided at a position pressed by the pressing member 321, and the second detector 34 for detecting the chip 100 is provided at a position on the conveying rail 31 where the stopper 322 blocks the lowermost chip 100. The blocking member 322 will perform the removing operation when the second detecting member 34 detects the signal of the chip 100. When the first detector 33 detects the signal indicating that the chip 100 is present, the pressing member 321 operates to press the chip 100.
Optionally, the first detecting part 33 and the second detecting part 34 are both correlation sensors, an avoiding hole is formed in the conveying track 31, the transmitting end of each correlation sensor is arranged on one side of the conveying track 31, and the receiving end of each correlation sensor is arranged on the other side of the conveying track 31.
In this embodiment, the pressing element 321 includes a pressing driving element and a pressing contact, the pressing contact is connected to an output end of the pressing driving element, and the pressing driving element drives the pressing contact to press the chip 100 on the conveying track 31. Optionally, in this embodiment, the pressing driving part and the pressing contacts are disposed on the back surface of the second rail 312, a hole is formed in the second rail 312 for the pressing contacts to extend out, the pressing contacts extend out to abut against the chip 100, two sides of the notch of the sliding slot of the second rail 312 are provided with a baffle, and the chip 100 is limited in the sliding slot by the baffle. In other embodiments, the pressing contact and the pressing driving member may also be disposed above the second rail 312 to press the chip 100 against the bottom of the sliding slot of the second rail 312. The pressing contacts and the pressing driving members may also be disposed at the side of the second rail 312 to press the chip 100 against the side wall of the sliding slot of the second rail 312, which is not limited herein. The pressing driving piece can be an air cylinder or an electric push rod.
In order to avoid damaging the chip 100, a rubber sleeve is sleeved on the press contact to protect the chip 100 from being damaged and play a role in buffering.
In this embodiment, the blocking member 322 includes a blocking driving member and a stopping block, and the stopping block is connected to the output end of the blocking driving member and stops the driving block from driving the stopping block to extend and retract. Optionally, in this embodiment, the blocking driving element and the stopper are disposed on the back surface of the second rail 312, and a hole is formed in the second rail 312 for the stopper to extend out, and the stopper extends out to block the chip 100 from sliding down. In other embodiments, the blocking driving member and the blocking stopper may be disposed above the second rail 312 or disposed at a side of the second rail 312, which is not limited herein. The blocking driving part can be an air cylinder or an electric push rod.
In order to improve the operation stability of the conveying unit 3 and timely stop the operation of the conveying unit 3 when the conveying unit 3 fails, in this embodiment, as shown in fig. 18, an end of the conveying track 31 connected to the outlet end of the feeding unit 2 is provided with a feeding detection member 35 for detecting whether the chip 100 enters the conveying track 31, so as to detect whether the chip 100 enters the conveying track 31. One end of the conveying track 31 connected with the first loading unit 4 is provided with a discharging detection part 36 for detecting whether the chip 100 enters the first loading unit 4 or not so as to detect whether the chip 100 enters the first loading unit 4 or not, and the function of counting the number of the chips 100 entering the first loading unit 4 is provided.
In order to further improve the operation stability of the conveying unit 3, a downward sliding detection piece 37 is further arranged between the discharging detection piece 36 and the second detection piece 34, and the downward sliding detection piece 37 is used for detecting whether the chip 100 has slid downward, so that the problem that when the chip 100 is jammed, if the conveying unit 3 continues to operate, the chip 100 is damaged is avoided.
Optionally, the feeding detection piece 35, the discharging detection piece 36 and the sliding detection piece 37 are all correlation sensors, an avoidance hole is formed in the conveying rail 31, the transmitting end of each correlation sensor is arranged on one side of the conveying rail 31, the receiving end of each correlation sensor is arranged on the other side of the conveying rail 31, and the sensors are good in detection stability, high in precision and simple in installation mode. Preferably, the feeding detector 35 and the discharging detector 36 are disposed at both ends of the second rail 312.
In this embodiment, in order to enable the chips 100 to smoothly enter the first loading unit 4 through the conveying track 31 and reduce the failure rate of the operation of the apparatus, the chip production system further includes at least one auxiliary distributing assembly 5, and the auxiliary distributing assembly 5 enables the chips 100 on the conveying track 31 to be smoothly conveyed to the first loading unit 4, so as to avoid the chips 100 from being stuck on the conveying track 31.
Optionally, the auxiliary distributing assembly 5 includes an air nozzle and an air supply part for providing air to the air nozzle, the air nozzle blows air towards the chip 100 in the conveying track 31, the weight of the chip 100 is small, and the position of the chip 100 can be adjusted by the air flow, so that the chip 100 smoothly slides to the first loading unit 4. In other embodiments, the auxiliary material distributing assembly 5 may have other structures, and is not limited in particular.
A plurality of auxiliary distributing assemblies 5 can be arranged along the length direction of the conveying track 31 to improve the production efficiency and reduce the failure rate.
The first loading unit 4 is used for loading the chips 100 to facilitate the turnover and transportation of the chips 100, and in this embodiment, as shown in fig. 1, 19 and 20, the first loading unit 4 includes a loading plate 41 and a driving assembly 42, a plurality of first containers 101 can be mounted on the loading plate 41 in parallel, and the first containers 101 are used for containing the chips 100. Specifically, the loading plate 41 has a plurality of loading tracks, each loading track can be provided with a first container 101, and the chip 100 in the conveying track 31 slides down into the loading track and enters the first container 101, so as to realize the sub-packaging of the chip 100. After one first container 101 is filled, the driving assembly 42 drives the loading plate 41 to move so that the adjacent empty first container 101 is connected to the other end of the conveying rail 31 to contain the chip 100 in the conveying rail 31. The number of the chips 100 contained in each first container 101 is fixed, the discharge detecting member 36 counts, and after the number of the chips 100 introduced into the first container 101 reaches a preset value, the driving assembly 42 drives the loading plate 41 to move so that the adjacent empty first container 101 is butted against the conveying rail 31.
Optionally, as shown in fig. 20, the driving assembly 42 provided by this embodiment includes a lead screw 421, a nut 422 and a driving motor 423, the charging plate 41 is connected to the nut 422, and the driving motor 423 drives the lead screw 421 to rotate so as to drive the nut 422 to move along the lead screw 421, and further drive the charging plate 41 to move. Specifically, the lead screw 421, the nut 422, and the driving motor 423 are provided inside the frame, and the charging plate 41 is provided outside the frame, to improve the overall beauty of the device.
The output of the driving motor 423 may be directly connected to the lead screw 421, or may be connected to the lead screw 421 through a transmission member. The transmission member may be a synchronous pulley structure or a sprocket structure, and is not limited specifically herein.
In other embodiments, the first loading unit 4 may further include at least one guide rail, one end of the guide rail is connected to the conveying track 31, and the other end of the guide rail is connected to other production equipment, so as to realize direct conveying and avoid a transfer process. If a plurality of guide rails are provided, different guide rails can be switched to connect with the conveying rail 31, so that multi-directional conveying of the chip 100 is realized, and the use flexibility is improved.
In other embodiments, the first rail 311 is disposed obliquely to receive the chips 100 conveyed by the feeding unit 2, the second rail 312 is disposed horizontally, the separating assembly 32 pushes the chips 100 in the second rail 312 into the first loading unit 4, and the first loading unit 4 dispenses the chips 100. The construction of the material dispensing assembly 32 is conventional and will not be described in detail herein.
After the first container 200 at the first loading unit 4 is filled with the chips 100, the first container 200 may be transferred to the feeding unit 6 for storage by means of a robot or a manual transfer.
Preferably, as shown in fig. 2 and 21, the chip production system includes a support 400, wherein the support 400 includes a horizontally disposed carrier plate 402 and an obliquely disposed support plate 401. The feeding unit 6 includes a storage 61, a conveyor 62, and a feeder 63; the storage 61 is used for storing the first container 200, the transporter 62 is used for taking out and transferring the first container 200 in the storage 61 to the feeding position, the feeder 63 transfers the chip 100 contained in the first container 200 at the feeding position to the transfer unit 7, the transfer unit 7 transfers the chip 100 to the test unit 8, the test unit 8 performs performance test and/or data writing and/or data verification and/or marking operation on the chip 100, and the second loading unit 9 loads the chip 100 which has completed the operation at the test unit 8 into the second container 300.
In this embodiment, the above-mentioned setting has realized the full automated production of chip 100 to through setting up a plurality of test element 8, can realize that single test element 8 produces or a plurality of test element 8 coproduction, greatly improve production efficiency, satisfy the production demand of chip 100 in the printing consumables. In this embodiment, as shown in fig. 21, the X direction represents a first direction and is a vertical direction, the Y direction represents a second direction, and the Z direction represents a third direction, where the X direction, the Y direction, and the Z direction are perpendicular to each other, that is, the Y direction and the Z direction are both horizontal directions.
Regarding the arrangement of the storage 61, as shown in fig. 21 and 22, the storage 61 includes two first storage racks 611 and two second storage racks 612 oppositely disposed on the bearing plate 402, a first storage slot 6111 and a second storage slot 6121 extending along a first direction are respectively disposed on opposite sides of the first storage racks 611 and the second storage racks 612, bottom ends of the first storage racks 611 and the second storage racks 612 are respectively provided with a discharge port 6112 facing one side of the transport 62, two ends of the first container 200 along a third direction are respectively located in the first storage slot 6111 and the second storage slot 6121, the first container 200 can move along the first direction in the first storage slot 6111 and the second storage slot 6121, and when the first container 200 moves to a lowermost side, the first container 200 can move along the second direction towards one side of the transport 62 to be separated from the storage slots. In this embodiment, the arrangement can realize that a plurality of first containers 200 are stacked and stored in the storage tank, and after the first container 200 at the bottom is taken away, the remaining first containers 200 can sequentially move downwards to one position, and the first containers 200 fall down by gravity without additional arrangement of driving, so that the structure is simple and the cost is low.
Specifically, as shown in fig. 22, each of the first storage rack 611 and the second storage rack 612 includes a vertical storage plate and two enclosing storage plates spaced apart from the vertical storage plate, a first storage slot 6111 is formed between the two enclosing storage plates of the first storage rack 611, and a second storage slot 6121 is formed between the two enclosing storage plates of the second storage rack 612.
Preferably, the reservoir 61 further comprises a ballast block 613; the two ends of the ballast block 613 along the third direction are respectively slidably disposed in the first storage tank 6111 and the second storage tank 6121, and are disposed above the plurality of stacked first containers 200, and the ballast block 613 is configured to assist in driving the first containers 200 to move downward. Preferably, the size of the ballast block 613 in the first direction is greater than that of the discharge port 6112 in the first direction, and thus, when the first container 200 is not present in the storage tank and the ballast block 613 falls on the lowermost end of the uppermost storage tank, it does not escape from the discharge port 6112.
In an alternative embodiment, as shown in fig. 22, the storage 61 further includes a ballast retainer 614, one end of the ballast retainer 614 is connected to the ballast block 613, the other end can abut against the bearing plate 402, and when the ballast retainer 614 abuts against the bearing plate 402, the ballast block 613 is located above the discharge port 6112. At this time, there is only one first container 200 below the ballast block 613, and the first container 200 can slide out of the discharge port 6112. The arrangement is such that when there is no first container 200 below the ballast block 613, the ballast block 613 is located above the discharge port 6112, preventing the ballast block 613 from entering the discharge port 6112 area and being mistakenly taken out as the first container 200.
In another embodiment of this embodiment, a mounting plate is disposed at the bottom of the vertical storage plate, the vertical storage plate is fixedly connected to the bearing plate 402 via the mounting plate, and the other end of the ballast limiting member 614 can abut against the upper surface of the mounting plate. When the ballast stopper 614 abuts against the upper surface of the mounting plate, the ballast block 613 is positioned above the discharge port 6112.
In this embodiment, optionally, as shown in fig. 21, the transporter 62 includes a moving plate 621, the moving plate 621 is provided with a first placing portion 6211, the moving plate 621 is slidably disposed on the bracket 400 along the second direction, and the moving plate 621 has a material taking position close to the storage 61 and a material feeding position close to the feeder 63; the storage device 61 further comprises a discharging member 615, the discharging member 615 is slidably disposed on the bracket 400 along a first direction, that is, the discharging member 615 can perform a lifting motion, the discharging member 615 can at least partially extend into the lower portion of the first container 200 at the lowermost layer, and has a supporting position for supporting all the first containers 200 downward, so that the first container 200 at the lowermost layer is supported above the discharge port 6112, and a discharging position for discharging the first container 200 at the lowermost layer to the position opposite to the discharge port 6112. When the unloading member 615 is located at the jacking position, the moving plate 621 can move to the material taking position, and at this time, the first placing portion 6211 is located below the first container 200 at the lowermost layer; then, the discharging member 615 moves downward and is located at the discharging position, the first container 200 at the lowest layer at least partially falls on the first placing portion 6211, and the moving plate 621 moves in the second direction to take the first container 200 at the lowest layer out of the discharging hole 6112. With the above-described structure, the first container 200 in the storage 61 can be taken out and transferred to the feeding position by the cooperation of the horizontal movement of the moving plate 621 and the upward and downward movement of the discharging member 615.
Specifically, as shown in fig. 21, the first placing portion 6211 includes a first placing groove provided in the moving plate 621. The carrier 62 further includes a carrier driving member disposed on the loading plate 402, the moving plate 621 is connected to an output end of the carrier driving member, and the carrier driving member can drive the moving plate 621 to move relative to the loading plate 402 along the second direction. Optionally, the transporter driving element includes a driving motor, a screw rod and a nut, the motor is disposed on the bearing plate 402, the screw rod is rotatably disposed on the bearing plate 402, the nut is in threaded fit with the screw rod and is connected with the moving plate 621, and the moving plate 621 is slidably disposed on the bearing plate 402 through the sliding rail and slider assembly.
In order to avoid the position deviation of the first container 200 on the moving plate 621 due to vibration during transportation, which may cause the first container 200 not to reach the feeding position accurately, in this embodiment, as shown in fig. 21, the transporter 62 further includes a fixing component for fixing the first container 200 located on the first placing portion 6211 of the moving plate 621. Specifically, the fixing assembly includes a first pushing block 623 and a fixed driving element 624, the fixed driving element 624 is disposed on the moving plate 621, the first pushing block 623 is slidably disposed on the moving plate 621 along the second direction and connected to the output end of the fixed driving element 624, and the first pushing block 623 has a clamping position close to the first placing groove and abutting the first container 200 located in the first placing groove on the side wall of the first placing groove, and a releasing position far away from the first placing groove to release the first container 200 in the first placing groove. In other ways in this embodiment, the first pushing block 623 can be directly mounted at the output end of the fixed driving member 624.
In addition, as shown in fig. 21, the feeding unit 6 further includes collecting areas 64 provided on the carrying plate 402, the collecting areas 64 and the reservoirs 61 being provided at both ends of the moving plate 621 in the second direction, respectively. The moving plate 621 further comprises a second placing portion 6212, the moving plate 621 further has a material discarding position close to the collecting region 64, when the moving plate 621 is located at the material taking position, the first container 200 located at the material feeding position can be placed on the second placing portion 6212, and when the moving plate 621 moves to the material discarding position, the first container 200 can be placed in the collecting region 64.
In this embodiment, in particular, the transporter 62 further comprises a pushing assembly, the output end of which is movable in the second direction with respect to the moving plate 621 for pushing the first container 200 located on the second placing portion 6212 to the collecting region 64. Specifically, the push assembly includes a push driver 625 and a second push block 626; the push driving member 625 is disposed on the moving plate 621, and the second push block 626 is disposed at the output end of the push driving member 625.
The second placing portion 6212 includes a second placing groove penetrating the moving plate 621 along the third direction, the bracket 400 is provided with two empty container lifting members 627, the two empty container lifting members 627 are respectively arranged at the output ends of the two empty pipe lifting driving members, the empty pipe lifting driving members drive the empty container lifting members 627 to lift along the first direction, so as to lift the two ends of the first container 200 positioned in the second placing portion 6212, thereby ejecting the first container 200 from the second placing groove, at this time, the output end of the pushing assembly moves along the second direction, and the first container 200 can be pushed to the collecting region 64. In this embodiment, the cross-sectional shape of the second placement groove may be rectangular. Of course, in other embodiments of this embodiment, the cross-sectional shape of the second placement groove may be formed in an arc shape or a semicircular shape. In this embodiment, the empty container lifting member 627 and the empty pipe lifting driving member may not be provided, and the first container 200 may be pushed out from the second placing groove directly by the pushing assembly and placed in the collecting region 64. In addition, the pushing assembly may be replaced by a blowing member that blows air to the first container 200 so that the first container 200 is transferred from the second placement tank to the collection area 64, or the first container 200 is blown to the collection area 64 after being jacked up by the empty container jacking member 627.
Referring to fig. 23-24, in the present embodiment, optionally, the feeder 63 includes a feeding rack 631 and a pressing block 633, wherein the feeding rack 631 is rotatably disposed on the bracket 400, the feeding rack 631 has a material receiving position for receiving the first container 200 and a material discharging position for inclining the first container 200, and the feeding rack 631 is provided with a bearing part 6311; when the feeding frame 631 is located at the discharging position, the first container 200 can feed the chips 100 to the transfer unit 7. The pressing block 633 is slidably disposed on the feeding rack 631, and the pressing block 633 has a pressing position close to the bearing part 6311 to press the first container 200 against the bearing part 6311 and a releasing position away from the bearing part 6311 to release the first container 200. Specifically, the feeder 63 further includes a rotary driving member 632 and a downward pressing driving member 634, the rotary driving member 632 is disposed on the bracket 400, and the feeding frame 631 is provided with a hinge portion hinged to an output end of the rotary driving member 632; the press-down driving member 634 is disposed on the feeding frame 631, and the pressing block 633 is disposed on the output end of the press-down driving member 634. With the above arrangement, the first container 200 can be rotated from a horizontal position to an inclined position, so that the chip 100 contained in the first container 200 can automatically slide out, thereby saving power transmission of the chip 100 and energy.
As shown in fig. 21, the feeder 63 may further include an urging assembly for urging the first container 200 located at the feeding position so that the first container 200 enters the predetermined position of the supporting portion 6311. This arrangement ensures that the preset position of the carrying part 6311 is accessed when the first container 200 is located at the feeding position. Specifically, the pushing assembly includes a pushing driving member 635 and a pushing member 636, the pushing driving member 635 is disposed on the bracket 400, and the pushing member 636 is disposed at an output end of the pushing driving member 635.
In the embodiment, as shown in fig. 25, further, the fixing assembly further includes a rolling member 622, and a plurality of rolling members 622 are disposed at intervals along the third direction on the first pushing block 623. Specifically, the rolling member 622 includes a deep groove ball bearing, an axis of the deep groove ball bearing is parallel to the first direction, and the first container 200 and the plurality of deep groove ball bearings are tangent when the first pusher 623 is in the clamping position. This arrangement results in rolling friction between the first container 200 moving in the second direction and the rolling member 622, reducing the coefficient of friction.
When the first container 200 is rotated from the horizontal position to the inclined position by the feeder 63, the outlet of the first container 200 is just opposite to the inlet of the transfer unit 7, so that the chip 100 of the first container 200 can automatically fall into the outlet unit by gravity.
Referring to fig. 2 and 26, in the present embodiment, the conveying unit 7 includes a main channel assembly 71 and a branch channel assembly 72 both disposed on a supporting plate 401, the branch channel assembly 72 is located downstream of the main channel assembly 71, a plurality of chips 100 can be simultaneously accommodated in the main channel assembly 71, and the chips 100 can be released to the branch channel assembly 72 one by one; the material channel assembly 72 is used for receiving the chip 100 from the main material channel assembly 71 and selectively placing the chip 100 into any one of the test units 8. With the arrangement of the above structure, one-by-one ordered distribution of the chips 100 can be realized.
In this embodiment, the included angle between the supporting plate 401 and the horizontal plane is a, wherein a is greater than or equal to 45 degrees and less than 90 degrees. This arrangement enables automatic sliding down of the chip 100. Of course, in other embodiments, the supporting plate 401 may be in a horizontal state, and in this embodiment, a pushing power assembly may be disposed at each transmission portion to push the chip 100.
As shown in fig. 26, the main material channel assembly 71 includes a main bearing plate 711, a main cover plate 712, a first main pressing member 713 and a main stop member 715, the main bearing plate 711 is disposed on the supporting plate 401, the main cover plate 712 is disposed on the main bearing plate 711, a main channel is formed between the main bearing plate 711 and the main cover plate 712, a plurality of chips 100 can slide downward in the main channel at the same time, the first main pressing member 713 is used for pressing the chips 100 to prevent the chips 100 from sliding downward, the main stop member 715 can extend into the main channel to prevent the chips 100 from sliding downward, wherein the main stop member 715 is located downstream of the first main pressing member 713 and spaced apart by a distance of one chip 100, that is, the chip 100 of the main stop member 715 is adjacent to the chip 100 pressed by the first main pressing member 713, when the main stop member 715 extends into the main channel, all the chips 100 in the main channel stop sliding downward, when the first main pressing member 713 presses the chips 100 and the main stop member 715 is extracted from the main channel, the most downstream chip 100 slides out of the main channel. With this arrangement, the passage of the chips 100 one by one in the main channel can be realized. Specifically, the main cover plate 712 is provided with a main cover through hole penetrating through the main cover plate 712, and the first main pressing member 713 is disposed on the support plate 401 and can penetrate through the main cover through hole and press the chip 100 to the main carrier plate 711; the main bearing plate 711 is provided with a main bearing hole penetrating through the main bearing plate 711, and the main stopper 715 can pass through the main bearing hole and extend into the main channel. Further, the main material channel assembly 71 further includes a second main crimping member 714, the second main crimping member 714 is located upstream of the first main crimping member 713, and the first main crimping member 713 and the second main crimping member 714 are spaced apart by a plurality of chips 100, and preferably, the first main crimping member 713 and the second main crimping member 714 are spaced apart by three chips 100. Wherein the primary stop 715 may be selected to be a pneumatic floating bead.
The first main crimping part 713 and the second main crimping part 714 have the same structure, the first main crimping part 713 may include a telescopic rod and a crimping driving part, the crimping driving part is disposed on the supporting plate 401, one end of the telescopic rod is disposed at an output end of the crimping driving part, and the other end of the telescopic rod can abut against the chip 100. Further, the abutting end of the telescopic rod and the chip 100 is provided with a buffer member, and the buffer member is preferably a rubber rod.
Alternatively, as shown in fig. 26, the inlet and the outlet of the main channel are respectively provided with at least one auxiliary distributing assembly 5, and the auxiliary distributing assembly 5 is used for assisting the chip 100 to slide down smoothly in the main channel. The inlet and the outlet of the operation channel are respectively provided with at least one auxiliary material distributing assembly 5, and the auxiliary material distributing assembly 5 is used for assisting the chip 100 to slide down smoothly in the operation channel. Specifically, the auxiliary distributing assembly 5 includes an air blowing nozzle, which can blow air to the main channel or the working channel, so that the chip 100 with burrs or the chip 100 blocked by the obstacle can slide down continuously.
Preferably, as shown in fig. 26, the inlet of the main passage is provided with a first main detecting member 716. A second main detecting member 717 is provided between the first main pressing member 713 and the second main pressing member 714, and the second main detecting member 717 is located downstream of the second main pressing member 714 and can be used for detecting that the second main pressing member 714 presses the adjacent chip 100 of the chip 100. Downstream of the primary stop 715 is a third primary detector 718.
Referring to fig. 2, in the present embodiment, a plurality of test units 8 are disposed at intervals along the second direction on the supporting plate 401 and are located below the material distributing channel assembly 72, and the material distributing channel assembly 72 can move along the second direction relative to the supporting plate 401, so that the material distributing channel assembly 72 can selectively place the chip 100 on any one of the test units 8.
Referring to fig. 27 and 28, the material distributing channel assembly 72 includes a material distributing plate 721, a material distributing cover 722 and a material distributing stopper 723, the material distributing plate 721 is slidably disposed on the supporting plate 401 along the second direction, the material distributing cover 722 covers the material distributing plate 721, a material distributing channel is formed between the material distributing plate 721 and the material distributing cover 722, the material distributing channel can accommodate one chip 100, and the material distributing stopper 723 can extend into the material distributing channel to stop the chip 100. Specifically, the sub cover plate 722 is provided with a sub cover through hole penetrating through the sub cover plate 722, and the sub stopper 723 can pass through the sub cover through hole to enter the sub passage.
Optionally, as shown in fig. 28, the material separating channel assembly 72 further includes a material separating power assembly, the material separating power assembly is disposed on the supporting plate 401, and the material separating plate 721 is disposed at the output end of the material separating power assembly. Specifically, the material distributing power assembly comprises a material distributing conveying belt 724, a material distributing driving wheel 726, a material distributing driven wheel 727 and a material distributing conveying driving piece 725, the material distributing conveying driving piece 725 is arranged on the supporting plate 401, the material distributing driving wheel 726 is arranged at the output end of the material distributing conveying driving piece 725, the material distributing driven wheel 727 is rotatably arranged on the supporting plate 401, and the material distributing conveying belt 724 is wound between the material distributing driving wheel 726 and the material distributing driven wheel 727; the dividing plate 721 is fixed to the dividing conveyor 724. The sub-bearing plate 721 is slidably disposed on the supporting plate 401 through a sliding rail assembly.
Preferably, the inlet of the branch channel is provided with a first branch detection member. The outlet of the branch channel is provided with a second branch detection part.
As shown in fig. 29 and 30, the test unit 8 includes a write/read loading plate 81, a write/read cover plate 82, a write/read code assembly 83, and a first write/read stopper 84; the reading/writing plate 81 is disposed on the supporting plate 401, the reading/writing cover plate 82 is disposed on the reading/writing plate 81, a working channel is formed between the reading/writing plate 81 and the reading/writing cover plate 82, and the first reading/writing stop member 84 is used for stopping the chip 100 to be worked, i.e., stopping the chip 100 to be worked at a working position. This arrangement enables the simultaneous working operation of a plurality of chips 100.
Specifically, the first write/read stop 84 and the working channel are similar in positional relationship, and the main stop 715 and the main channel are similar in positional relationship. Specifically, the reading/writing carrier 81 has a reading/writing hole penetrating through the reading/writing carrier 81, and the first reading/writing stopper 84 penetrates through the reading/writing hole and then extends into the working channel to stop the chip 100 to be worked.
After the operation is completed, the chip 100 to be operated needs to be added to the operation position, and the adding time is long due to the long distance of the operation channel.
For this reason, in the present embodiment, as shown in fig. 31, the test unit 8 further includes a second write-read stopper 85, and the second write-read stopper 85 is provided upstream of the first write-read stopper 84, and is used for stopping the chip 100 to be subjected to the operation. Preferably, the second write/read stop 85 and the first write/read stop 84 are separated by one or two chips 100, and this arrangement makes it possible to store one chip 100 in the working channel during the working process, so as to shorten the time for filling the next chip 100 into the working position.
Further, the test unit 8 further includes a writing and reading pressure contact member 87, the writing and reading pressure contact member 87 is located upstream of the second writing and reading stopper 85, and the chip 100 pressed by the writing and reading pressure contact member 87 is adjacent to the chip 100 stopped by the second writing and reading stopper 85. This arrangement enables a plurality of chips 100 to be worked to be stocked in the working channel. Preferably, 5 chips 100 to be processed can be stored in the processing channel. It should be noted that the second write/read stop 85 and the first write/read stop 84 have the same structure, and the write/read pressure contact member 87 and the first main pressure contact member 713 have the same structure, so the structures of the second write/read stop 85 and the write/read pressure contact member 87 are not described in detail here. Wherein, the first write-read stop 84 and the second write-read stop 85 can be both pneumatic floating beads.
Alternatively, as shown in fig. 29, the inlet and outlet of the working channel are provided with a first write read detector 88 and a second write read detector 89, respectively. The first write/read detection element 88 is used to detect whether the chip 100 to be operated in the test unit 8 enters the operation channel, and the second write/read detection element 89 is used to detect whether the chip 100 that has completed the operation is successfully released.
As shown in fig. 32, the charging unit 9 includes a charging assembly 91 and a holder 92 capable of mounting a plurality of second containers 300, the charging assembly 91 and the holder 92 are provided on the support plate 401, the holder 92 is located downstream of the charging assembly 91, and the plurality of second containers 300 are provided in parallel on the holder 92; the loading assembly 91 is used to alternatively load the chips 100 that have completed the work into the second container 300.
The loading assembly 91 includes a loading carrier plate 911, a loading cover plate 912 and a loading stopper 913, the loading carrier plate 911 is movable in the second direction with respect to the support plate 401, the loading cover plate 912 is provided to cover the loading carrier plate 911, a loading passage is formed between the loading carrier plate 911 and the loading cover plate 912, the loading passage can accommodate one chip 100, and the loading stopper 913 can protrude into the loading passage to stop the chip 100. Specifically, the charging cover plate 912 is provided with a charging through-hole penetrating through the charging cover plate 912, and the charging stopper 913 can enter the charging passage through the charging through-hole. Alternatively, the charging stopper 913 and the first primary crimping member 713 are identical in structure, and thus, the detailed structure thereof will not be described herein.
Optionally, the charging unit 9 further comprises a charging power assembly 93, the charging power assembly 93 being provided at the support plate 401, and a charging carrier plate 911 being provided at the output of the charging power assembly 93. Specifically, the charging power assembly 93 and the distributing power assembly are identical in structure, and therefore, the structure of the charging power assembly 93 is not described in detail herein.
In this embodiment, the fixing frame 92 includes a container placing bottom plate 921 and a container placing cover plate 922, the container placing bottom plate 921 is provided with a plurality of container placing grooves that penetrate through the container placing bottom plate 921 at intervals along the second direction, the container placing bottom plate 921 is provided with the supporting plate 401, the container placing cover plate 922 is provided with the container placing bottom plate 921, the container placing cover plate 922 and the container placing bottom plate 921 form a plurality of container placing channels, and the plurality of second containers 300 are respectively arranged in the plurality of container placing channels in a penetrating manner. Further, the tank bottom of the container placing groove is provided with an elastic sheet 923, and the elastic sheet 923 is used for pressing the second container 300 to the container placing cover plate 922. This arrangement improves the stability of the second container 300. Specifically, the shell fragment 923 one end is fixed in the tank bottom of container standing groove, and the other end inclines to the container placing cover plate 922 along the export to the entry direction of container standing groove.
The loading assembly 91 needs to accommodate the chips 100 which complete the operation among the plurality of test units 8, when the number of the test units 8 is large enough, the loading assembly 91 cannot timely accommodate the chips 100 which complete the operation among the plurality of test units 8, and further the second reading and writing stop member 85 cannot be opened after the test units 8 complete the operation of the chips 100, at this time, the reading and writing code assembly 83 needs to stop working, and the working efficiency is affected.
For this reason, in the present embodiment, as shown in fig. 30, the test unit 8 further includes a third write/read stopper 86, and the third write/read stopper 86 is disposed downstream of the first write/read stopper 84 and is used for stopping the chip 100 that has completed the operation. This arrangement allows the chip 100, which has completed the operation in the test unit 8, to be blocked by the third read/write stopper 86, and then to wait for the loading member 91 to receive the chip, without stopping the read/write code member 83, thereby improving the work efficiency of the read/write code member 83.
Preferably, the chip production system further includes a detection unit including various detection members and sensors, a controller, and a display unit 500, the controller controlling the operation of the feeding unit 6, the transferring unit 7, the testing unit 8, the charging unit 9, and the like by controlling the detection unit. The display unit 500 is used for displaying the device state and realizing human-computer interaction operation. Controllers are well known to those skilled in the art and, therefore, the structure and control principle of the controller will not be described again.
Preferably, in this embodiment, the code writing and reading component 83 can write, read and verify data to the chip 100, so as to verify whether the data stored in the chip 100 is qualified. Preferably, the test unit 8 further comprises a performance detection component, which is capable of performing performance detection on the chip 100 entering the test unit 8, and in particular, the performance detection is generally used for detecting whether various performances of the chip 100 meet requirements, such as whether sensor parameters meet requirements, whether a writing speed of data meets requirements, and the like. Further, the test unit 8 further includes a marking assembly capable of performing a marking operation on the chip 100. The test unit also includes a data rewriting component that enables data to be flashed to the chip 100 that needs to be upgraded. The code writing and reading component 83, the performance detecting component, the marking component and the data rewriting component are respectively in communication connection and/or electrical connection with the loading component 91, and the loading component 91 can respectively place the chip 100 into different second containers 300 according to the detection result of the performance detecting component, the verification result of the code writing and reading component 83, the operation result of the marking component and the test result of the data rewriting component. Specifically, the loading assembly 91 sends the product with unqualified performance detection to one second container 300, the chip 100 which is read by the code writing and reading assembly 83 and has unqualified verification data is placed into the other second container 300, and the chip 100 which has qualified performance detection and qualified data verification and completes marking operation is placed into the other second container 300, so that the production quality of the whole chip 100 is monitored.
The implementation also provides a chip production method, which is carried out by adopting the chip production system and specifically comprises the following steps:
step 10, performing surface assembly and packaging on the PCB 101 to form a chip 100;
step 20, sequencing the chips 100 in a preset direction;
step 30, sequentially conveying the sequenced chips 100 to the test unit 8 for performance detection and/or data writing and/or data verification and/or marking operation;
step 40 loads the chips 100 into different second containers 300 according to the operation result of the test unit 8.
According to the chip production method, automatic sequencing of the chips 100 is achieved by adopting the chip production system, the sequenced chips 100 are sequentially conveyed to the test unit 8 for operation, manual adjustment of the positions of the chips 100 is not needed in the whole process, the chips 100 are not needed to be conveyed to the test unit 8 one by one, and manual collection of the chips 100 completing the operation is also not needed, so that the production efficiency of the chips 100 can be greatly improved, the labor force is reduced, and the production cost is reduced.
It should be noted that, in step 10, the surface mounting technology and the packaging technology of the chip 100 are well-established technologies, and are not described herein again.
Preferably, after the chip 100 is packaged, the package result needs to be detected, and the chip 100 with the unqualified package result needs to be taken out and maintained.
Preferably, the process of sorting the chips 100 in the preset orientation in step 20 includes:
step 21, discharging the chips 100 one by one from an outlet end in a preset direction by adopting the feeding unit 2 of the chip production system of the embodiment;
in step 22, the conveying unit 3 and the first loading unit 4 of this embodiment are used to load the chips 100 discharged from the outlet end of the feeding unit 2 into the first container 200.
The chips 100 in the sequence are stored by arranging the first container 200, and then the chips 100 in the first container 200 are directly conveyed to the test unit 8 for operation, so that the influence on the normal operation of the test unit 8 after the feeding unit 2 for sequencing fails can be avoided.
Further, in step 30, the chips 100 contained in the first container 200 are fed one by one to the test unit 8 to be operated by cooperation of the feeding unit 6 and the transferring unit 7 which are sequentially provided in the chip manufacturing system of the present embodiment.
Preferably, the test unit 8 of the present embodiment can perform data writing, reading and verifying, performance testing, and marking operations on the chip 100. Specifically, the detection unit 8 can write, read and verify data in the chip 100 through the code writing and reading component 83, so as to verify whether the data stored in the chip 100 is qualified. The test unit 8 can perform performance detection on the chip 100 entering the test unit 8 through a performance detection component, and in particular, the performance detection is generally used to detect whether various performances of the chip 100 meet requirements, such as whether sensor parameters meet requirements, whether a data writing speed meets requirements, and the like. Further, the test unit 8 can perform a marking operation on the chip 100 by the marking assembly. The test unit can perform data flash on the chip 100 needing to be upgraded through the data rewriting component. The code writing and reading component 83, the performance detecting component, the marking component and the data rewriting component are respectively in communication connection and/or electrical connection with the loading component 91, and the loading component 91 can respectively place the chip 100 into different second containers 300 according to the detection result of the performance detecting component, the verification result of the code writing and reading component 83, the operation result of the marking component and the test result of the data rewriting component. Specifically, the loading assembly 91 can place the chips 100 that fail the performance test in a second container 300, and the second container 300 can be refilled with NG due to the performance failure; the charging assembly 91 can place the chip 100 whose data write failed in another second container 300, and the second container 300 can be remarked about the data write failure NG; the loading assembly 91 can place the chip 100 with the unqualified data verification result into another second container 300, and the second container 300 can be remarked with the unqualified data verification failure NG; the chips 100 (hereinafter referred to as good products) with qualified performance detection, successful data writing, qualified verification and finished marking are placed into the rest of the second containers 300, and then the good products in the second containers 300 are packaged.
In summary, the process flow of the chip production method of the present embodiment is shown in fig. 33, and includes:
surface assembling and packaging the PCB board 101 to form a chip 100;
detecting the packaging result of the chip 100, sending the chip 100 which is detected to be unqualified to maintenance, and carrying out the next step if the chip 100 is qualified;
sending the qualified chips to the feeding unit 2, and discharging the chips 100 one by one in a preset direction by the feeding unit 2;
the chips 100 are sequentially fed into the conveying unit 3 and the first loading unit 4 to load the chips 100 into the first container 200;
the feeding unit 6 and the transferring unit 7 feed the chips 100 in the first container 200 to one or more testing units 8;
the test unit 8 performs performance detection on the chip 100, and unqualified chips are sent to the second container 300A;
the qualified chips are written with data, and the chips are sent into the second container 300B without success;
if the chip is qualified, reading and verifying the data of the chip 100, and if the chip is not qualified, sending the chip into a second container 300C;
if the chip is qualified, marking the chip 100 and sending the chip into a second container 300D;
the chips 100 in the second container 300D are then packaged.
In the following, the chip production method is described by using the chip production system of this embodiment, and the chip production system includes three test units:
the time for the main channel assembly 71 of the conveying unit 7 to distribute 1 chip 100 to the branch channel assembly 72 is 0.2-1 second, the branch channel assembly 72 distributes 5 chips 100 to three test units 8 in one period, and the time for distributing one chip 100 per minute and returning to the main channel assembly 71 is 0.2-0.6 second, preferably, the time for distributing one chip 100 per minute to the test units 8 at two sides and returning to the main channel assembly 71 is 0.4 second; it takes 0.2 seconds for each chip 100 to be dispensed to the intermediate test unit 8.
Alternatively, after the chip 100 enters the test unit 8, first, the first writing and reading stopper 84 is extended, then in a state that the writing and reading pressure contact member 87 is pressed and contacted, the second writing and reading stopper 85 is contracted and moved, one chip 100 is released to the working position and is stopped by the first writing and reading stopper 84, the writing and reading code assembly 83 and the performance detection assembly respectively perform corresponding work, meanwhile, the second writing and reading stopper 85 is extended, the writing and reading pressure contact member 87 is released, the chip 100 is descended to the second writing and reading stopper 85, and then the writing and reading pressure contact member 87 is pressed and contacted and moved; after the code writing and reading component 83 and the performance detection component complete the operation, the third writing and reading stop component 86 extends out, then the first writing and reading stop component 84 contracts, the chip 100 which completes the operation is released, and is stopped by the third writing and reading stop component 86; the next cycle then begins.
Alternatively, in the test unit 8, it takes t1 seconds for the chip 100 stored in the working channel to enter the working position, it takes t2 seconds for the code writing and reading component 83 to write and read the chip 100, and it takes t3 seconds for the chip 100 to slide out of the working position after the working is completed, i.e. it takes t3 seconds for the chip 100 to be vacated. Wherein, when t2 is greater than t1, the production time of each chip 100 is determined by the sum of t2 and t3 or by t 2. When t2 is smaller than t1, the production time of each chip 100 is determined by the sum of t1 and t3 or by t 1.
Alternatively, the chip 100 that has completed the job takes 0.2-1 second to enter the loading passage of the loading assembly 91 after the third write-read stopper 86 is released, and the loading assembly 91 takes 1-2 seconds to place the chip 100 in the second container 300 and wait for another test unit 8 to receive the chip 100 that has completed the job. Specifically, the time of each link may be adjusted according to the actual situation, and is not limited thereto. Illustratively, as the number of test cells 8 increases, the time required to deliver one chip 100 per pass and return to the main channel assembly 71 decreases. Specifically, when the number of the test units 8 is 8, it takes 0.2 seconds per minute to transfer one chip 100 to the test units 8 on both sides and return to the main lane assembly 71. It takes 0.1 second for each chip 100 to be dispensed to the intermediate test unit 8. Specifically, the material distribution process is added with an air blowing device capable of accelerating.
In addition, the number of chips 100 that the material separating channel assembly 72 separates to each test unit 8 in one cycle can be adjusted according to practical situations, and is not limited to this. Illustratively, as the number of test cells 8 increases, the number of chips 100 dispensed by lane assembly 72 per test cell 8 per cycle increases. Specifically, when the number of test units 8 is 8, the number of chips 100 that the feed channel assembly 72 dispenses to each test unit 8 in one cycle may be 10.
The embodiment also provides a chip, and the chip 100 is manufactured by the chip production method provided by the embodiment. It is understood that the chip 100 may be used in printing consumables, and may also be used in other fields, and is not limited herein.
Example two
The embodiment provides a chip production system, a regenerated chip production method and a regenerated chip. The chip production system in this embodiment includes the chip production system in the first embodiment, and in addition, the chip production system in this embodiment further includes a glue shoveling unit 1, the glue shoveling unit 1 shovels away the glue 102 on the side of the PCB 101 of the recovered old chip and the wafer in the glue 102, and the remaining PCB 101 and the components 103 thereon can be subjected to the surface assembly and packaging process again, thereby realizing the regeneration of the old chip.
Preferably, as shown in fig. 34-37, the glue shoveling unit 1 comprises a feeding mechanism 11, a heating mechanism 12 and a glue removing mechanism 13, wherein: the feed mechanism 11 is used to transfer the old chips forward in a preset orientation. In one embodiment, the feeding mechanism 11 includes a conveying assembly 111 and a vibrating device 112. The vibration unit 112 may employ some devices similar to a vibration plate that continuously output the materials by vibration.
The conveying assembly 111 may include a conveying track 1111 and a pushing assembly 1112, the conveying track 1111 is connected to the material output port of the vibration device 112, and the old chips may be output from the vibration device 112 to the conveying track 1111. The pushing assembly 1112 comprises a driving source 1112a and a feeding brush 1112b connected to a motion output end of the driving source 1112a, and the driving source 1112a may be configured as any device capable of outputting a uniform rotation, such as a motor. The feeding brush 1112b is driven by the driving source 1112a to rotate at a constant speed; the feeding brush 1112b is suspended above the conveying track 1111, and the brush hair on the feeding brush 1112b can contact the old chip on the conveying track 1111 and push the old chip forward at a substantially constant speed by the constant speed rotation of the feeding brush 1112b itself. In other embodiments, the conveying assembly 111 may also adopt a structure similar to a conveyor belt, that is, the conveying track 1111 directly realizes the forward conveying of the old chip, and the feeding brush 1112b is eliminated, or adopt other forms as long as the conveying assembly can push and convey the old chip output by the vibration device 112 forward.
The transport track 1111 may be further provided with a vacancy sensor for detecting whether there is a vacancy in the transport track 1111. Thus, when there is no old chip on the transmission track 1111 or the transmission of the old chip is interrupted, the vacancy sensor can send an electrical signal to the central control unit of the glue shoveling unit 1, for example, when there is no old chip in the vibration device 112, there is no old chip on the transmission track 1111, and at this time, the vacancy sensor can detect the material shortage of the vibration device 112 and send a signal to the central control system of the glue shoveling unit 1.
In order to cooperate with the subsequent heating and glue removing link, the old chips need to be arranged according to a certain rule, and the old chips which are arranged according to the rule are conveyed to the conveying track 1111, so that the structure of the specific screening chip can be carried out by adopting the feeding unit 2, and the details are not repeated.
The heating mechanism 12 is disposed on a path along which the old chip is transferred forward to heat the old chip. Referring to fig. 41 and 42, the heating mechanism 12 may include a heat conduction stage 121 and a heating element (not shown) installed in the heat conduction stage 121, the heating element generating heat and raising the temperature of the heat conduction stage 121; the PCB 101 of the old chip receives heat, and the temperature of the PCB 101 gradually increases, so that the contact between the gel 102 and the PCB 101 is first softened. It will be appreciated that the heating temperature does not affect the structure of the PCB 101 itself, since a new wafer is subsequently required to be re-bonded with the PCB 101. Generally, the components 103 of the sensor circuit or the logic circuit on the old chip are connected to the PCB 101 by high temperature solder, which has a melting point of 150 ° or more, so that the original structure of the PCB 101 is not damaged as long as the temperature transmitted to the PCB 101 is lower than the melting point of the solder.
Further, in order to avoid the temperature of the heating component or the heat conducting platform 121 from being too high, a temperature control device 173 for controlling the temperature may be further disposed at the heating mechanism 12 or other positions of the glue shoveling unit 1.
In order to enable the old chips on the transmission track 1111 to receive the heat of the heat conduction station 121, it may be implemented by directly extending the transmission track 1111 through the heat conduction station 121, or as shown in fig. 38, 41 and 42, a transfer slot 1211 for allowing the old chips to be continuously transferred forward may be provided on the heat conduction station 121, so that the old chips may be directly or indirectly transferred heat with the heat conduction station 121 through other means without being transferred heat through the transmission track 1111.
Referring to fig. 38, 40 and 42, the glue removing mechanism 13 includes a blade 131, a guide frame assembly 32 for mounting the blade 131, and a support assembly 133 mounted in a fixed position. The supporting member 133 is installed at a fixed position of the shovel unit 1, and is provided with an impact unit 134 for driving the shovel blade 131 to rapidly extend/retract. In some embodiments, the impact unit 134 may be configured as an air cylinder, a hydraulic cylinder, or the like, and in order to obtain a faster moving speed of the blade 131, the air cylinder, the hydraulic cylinder, or the like as the impact unit 134 may be further connected to a fast-acting control circuit so that it can drive the blade 131 to extend and retract rapidly.
In addition, in order to control the moving track of the blade 131 more precisely, the support assembly 133 is further provided with a guide rail 1331, and the blade carrier assembly 132 is slidably connected to the guide rail 1331. When the striking unit 134 is actuated, the carriage assembly 132 can be driven to move along the guide rail 1331, so that the path along which the blade 131 mounted to the carriage assembly 132 moves is more precise.
In the case of the configuration without limitation to the size, there may be a plurality of blades 131 in the forward direction of the old chip to perform the adhesive removing operation at the same time. The structures of the old chips are different in not only the presence or absence of the component 103, the presence or absence of the notch 104, and the like, but also the thicknesses of the PCB 101 are different in some old chips with approximately the same structure: the height of the upper surface of the conveying track 1111 or the height of the upper surface of the conveying groove 1211 on the heat conduction table 121 is uniform, that is, the thickness of the PCB 101 is different, the level of the glue-carrying surface of the old chip is also different, and the process of the scraper 131 scraping the glue 102 may damage the PCB 101 or may not completely remove the glue 102.
In order to solve this problem, as shown in fig. 41 to 43, the heat conducting table 121 is provided with the limiting baffles 122, in some embodiments, the limiting baffles 122 may be provided in two and respectively disposed at both sides of the forward transfer direction of the used chip, and one side of the pair of limiting baffles 122 adjacent to each other extends to above the transfer groove 1211, so that the upward movement of the used chip transferred to the transfer groove 1211 is limited by the lower surfaces of the limiting baffles 122.
The glue removing mechanism 13 further includes a jacking device (not shown) installed at the heat conducting table 121, as shown in fig. 43, the jacking device can jack up the old chip upwards along the hollow arrow direction shown in the figure, and when the jacking device jacks up the old chip, the lower surface of the limit baffle 122 limits the old chip from further moving upwards, so that the jacking device can make the glue-carrying surface of the old chip abut against the lower surface of the limit baffle 122 (the horizontal straight line shown in fig. 43 represents the lower surface of the limit baffle 122), so that the glue-carrying surfaces of the old chip can be jacked on the same plane, and the force pushing against the old chip can make the old chip relatively fixed at the jacked position. So, make the face of gluing of taking of old chip paste limit baffle 122's lower surface department through jacking system, so, scraper knife 131 can install based on limit baffle 122's lower surface, promptly, makes scraper knife 131's cutting edge parallel and level in limit baffle 122's lower surface, so can guarantee that scraper knife 131's the effect of removing glue does not receive the influence that PCB board 101's thickness is different.
Referring to fig. 42, the heat conducting table 121 may further have an ejection opening 1212, and the ejection opening 1212 may receive the upper end of the lifting device to lift the old chip in the conveying groove 1211. The position of the ejection port 1212 may be set based on the position of the blade 131. In one embodiment, the lifter is disposed in the heat conduction table 121 and can receive heat from the heat conduction table 121, and when the lifter lifts up an old chip, the heat is conducted to the old chip by the lifter, and the glue 102 at the interface between the old chip and the PCB 101 is softened after about 10 seconds, and at this time, the scraper 131 is controlled to operate, so that the glue 102 can be scraped. It will be appreciated that the jacking device is provided to jack the old chip upward at a predetermined position (e.g., where the blade 131 moves to remove the glue) so that the glued surface of the old chip abuts against the lower surface of the limit stop 122. thus, embodiments of the jacking device include, but are not limited to, a hydraulic or pneumatic jacking device, or a resilient jacking device with a resilient member (e.g., a spring) attached thereto. In addition, the jacking device can also enable a certain positive pressure to exist between the rubber surface of the old chip and the lower surface of the limit baffle 122, and the friction force between the rubber surface and the lower surface of the limit baffle 122 caused by the positive pressure can better avoid the influence of the movement of the old chip along with the scraper 131 on the rubber removal effect when the scraper 131 acts.
Referring to fig. 40 to 42, the limiting baffle 122 is further provided with a plurality of knife paths 1221 penetrating through the limiting baffle 122, and the number of the knife paths 1221 corresponds to the number of the cutting blades 131. The scraper 131 can extend into the cutter slot 1221 to a position where the blade edge is flush with the lower surface of the limiting baffle 122, so that when the scraper 131 moves in the cutter slot 1221 along the solid arrow direction in fig. 40 and 41, the blade edge of the scraper 131 can be flush with the lower surface of the limiting baffle 122 to scrape the glue 102 on the old chip from the interface between the glue-carrying surface of the old chip and the glue 102.
Referring to fig. 38, the glue shoveling unit 1 further comprises a cleaning mechanism 14, and the cleaning mechanism 14 is correspondingly arranged at the end of the glue shoveling travel of the shovel blade 131 and can take away the shoveled glue 102. In some embodiments, the cleaning mechanism 14 may be configured as a negative pressure suction device to carry away the scooped gel 102 with negative pressure; alternatively, in another embodiment, the cleaning mechanism 14 may be an air blowing device capable of blowing air outward to blow away the colloid 102 by the blown air, so as to avoid the scraped colloid 102 from affecting the next colloid removing operation of the scraper 131; in addition, other forms of cleaning mechanism structures can be adopted as long as the shoveled colloid 102 can be taken away in time.
In addition, as shown in fig. 39, 41 and 42, the glue shoveling unit 1 further includes a grinding mechanism 15, and the grinding mechanism 15 is disposed behind the glue removing mechanism 13 and is used for grinding the area where the old chip is removed of glue. In one embodiment, the grinding mechanism 15 may include a rotary driving source and a roller brush 151 connected thereto, which can scrape the area of the used chip after removing the glue to remove the remaining small amount of glue 102 and not scratch the surface of the PCB 101. Similar to the slot 1221, the limiting baffle 122 is further provided with a polishing groove 1222 penetrating through the limiting baffle 122 at a position corresponding to the position of the roller brush 151, and the roller brush 151 may partially extend into the polishing groove 1222 to polish the surface of the old chip better. Since the grinding mechanism 15 is disposed adjacent to the glue removing mechanism 13, the cleaning mechanism 14 can suck part of the powder generated during grinding.
In some related prior arts, it is proposed to perform the glue removing process by cutting the glue 102 with laser or melting the glue 102 with laser at high temperature, however, the laser beam has high temperature and is difficult to control, and it is very easy to melt the PCB 101 or to melt the solder in the PCB 101 when melting the glue 102 at high temperature; as described above, the PCB 101 of the old chip has different thickness and the surface is not necessarily completely flat, so that when the colloid 102 is cut by laser, the high-efficiency automatic cutting is difficult to achieve due to the state difference of the PCB 101, and the rejection rate is high. In contrast, in the present invention, the rubber-carrying surface of the old chip is fixed to the uniform plane by the jacking device, and as long as the displacement of the scraper 131 is accurate, the rubber-scraping effect is controllable, even if the PCB 101 has residual rubber 102 due to the warping, unevenness and other factors of the PCB 101, the polishing mechanism 15 can further remove the residual rubber 102 by scraping and polishing.
As shown in fig. 34, the glue shoveling unit 1 further includes a base 16 and a hood 17, the hood 17 is mounted on the upper surface of the base 16, and a certain space is formed on the upper surface of the base 16, and the feeding mechanism 11, the heating mechanism 12, the glue removing mechanism 13, the cleaning mechanism 14, the polishing mechanism 15, and the like may be disposed in the covered space of the hood 17. Further, the hood 17 is provided with a dust removing mechanism 18, and the dust removing mechanism 18 is used for removing dust, foreign substances, and the like in the hood 17.
The hood 17 is further provided with a touch screen 171, function buttons 172, a temperature control device 173, an indicator light 174 and the like, which are electrically connected with corresponding units in the hood 17 to form a complete glue shoveling unit 1.
Therefore, when the glue shoveling unit 1 is powered on to work, the central control unit in the glue shoveling unit 1 can firstly send out a self-checking instruction so as to execute the self-checking program of each unit and feed back self-checking information to the central control unit.
Wherein:
when the vibrating device 112 in the feeding mechanism 11 starts to work, the vacancy sensor can send an electric signal to the central control unit to prompt that no old chip exists in the vibrating device 112 currently;
the heating component in the heating mechanism 12 receives the electrical signal of the central control unit, and starts to heat the heat conducting table 121 according to the temperature parameter set by the program, at this time, the temperature control device 173 in the equipment detects the temperature in the equipment, when the temperature rises to the set temperature, the hollow unit sends a signal to stop heating, and when the temperature is lower than the set temperature value, the heating component continues to heat;
the touch screen 171 embedded on the outer surface of the hood 17 can simultaneously display the status information so that the user can know the operation of each unit in the hood 17 through the displayed status information, and when all the equipment is normal, the indicator light 174 is lighted to prompt the user to add an old chip into the vibration device 112 and start the operation.
The embodiment also provides a method for producing a recycled chip, which includes the method for producing a chip provided by the embodiment, except that the method for producing a recycled chip of the embodiment includes a step of glue shoveling, as shown in fig. 44 specifically:
recovering the old chip, removing the colloid 102 and the wafer of the old chip, and reserving the PCB;
carrying out surface assembly and packaging on the PCB to form a regenerative chip;
detecting the encapsulation result of the regenerated chip, sending the regenerated chip which is detected to be unqualified to maintenance, and carrying out the next step when the regenerated chip is qualified;
sending qualified regenerated chips to the feeding unit 2, and discharging the regenerated chips one by one in a preset direction by the feeding unit 2;
feeding the recycled chips into the conveying unit 3 and the first loading unit in order to load the recycled chips into the first container 200;
the feeding unit 6 and the transferring unit 7 feed the recycled chips in the first container 200 to one or more testing units 8;
the test unit 8 performs performance detection on the regenerated chip, and unqualified chips are sent to the second container 300A;
the qualified regenerated chips are written with data, and the data are sent into the second container 300B without success;
if the regenerated chip is qualified, reading and checking the data of the regenerated chip, and sending the unqualified regenerated chip into a second container 300C;
if the regenerated chip is qualified, marking the regenerated chip and sending the regenerated chip into a second container 300D;
the reconstituted chips in the second container 300D are then packaged.
The embodiment also provides a regeneration chip, and the regeneration chip is manufactured by adopting the regeneration chip production method provided by the embodiment. It is understood that the recycling chip can be used in printing consumables, and can also be used in other fields, and is not limited herein.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the invention and are not to be construed as limitations of the embodiments of the present invention, but may be modified in various embodiments and applications by those skilled in the art according to the spirit of the present invention, and the content of the present description should not be construed as a limitation of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (26)

1. A chip production system, comprising:
the feeding unit (2) can contain chips and discharge the chips from an outlet end one by one in a preset direction;
the chip packaging device comprises a conveying unit (3) and a first loading unit (4), wherein a first container (200) is detachably connected to the first loading unit (4), one end of the conveying unit (3) is connected with the outlet end of the feeding unit (2), and the other end of the conveying unit can be in butt joint with the first loading unit (4) so that the chips can be orderly loaded into the first container (200);
the chip testing device comprises a feeding unit (6), a conveying unit (7) and at least one testing unit (8), wherein the feeding unit (6) can store a plurality of first containers (200) and can feed chips in the first containers (200) into the conveying unit (7) one by one, the conveying unit (7) can convey the chips to the at least one testing unit (8) in sequence, and the testing unit (8) can test the chips;
and a second loading unit (9) capable of loading the chips subjected to the test operation in the test unit (8) into a second container (300).
2. The chip production system according to claim 1, further comprising:
a surface assembly unit for mounting the wafer and/or the component (103) on the PCB board (101) and forming a bare chip;
a packaging unit for packaging the bare chip, so that the wafer and/or the element (103) are electrically connected with the PCB (101) to form the chip;
and the transfer unit is used for conveying the chips into the feeding unit (2).
3. The chip production system according to claim 2, further comprising a glue shoveling unit (1), wherein the glue shoveling unit (1) is used for shoveling away the glue (102) on the old chip and the wafer in the glue (102) and conveying the remaining PCB (101) to the surface assembly unit.
4. The chip production system according to claim 3, wherein the glue shoveling unit (1) comprises a feeding mechanism (11), a heating mechanism (12) and a glue removing mechanism (13), wherein:
the feeding mechanism (11) is used for conveying the colloid (102) on the surface of the chip forwards towards the same direction;
the heating mechanism (12) is arranged on a transmission path of the chip and is used for heating the chip;
the glue removing mechanism (13) comprises a scraper knife (131), and the scraper knife (131) can move relative to the chip to scrape off the heated glue (102) on the surface of the chip.
5. Chip production system according to any one of claims 1 to 4, wherein the feed unit (2) comprises:
a vibration mechanism (21) capable of containing the chip and generating vibration;
screening mechanism (22), including being used for supplying the chip is with the delivery track (221) that the state of putting upright moved forward, delivery track (221) one end with the exit end of vibration mechanism (21) is connected, the other end with conveying unit (3) are connected, be provided with at least one screening portion on delivery track (221), screening portion is used for screening the chip that places in the predetermined position on delivery track (221).
6. The chip production system according to claim 5, wherein the transfer rail (221) comprises a side plate (2211) and a pallet (2212), the pallet (2212) being provided at a side of the side plate (2211) for supporting the chip moving in a standing state;
along the extension direction of the conveying track (221), the chip screening device has a first screening portion (222), and at least one of a second screening portion (223), a third screening portion (224), and a fourth screening portion (225) disposed after the first screening portion (222), wherein:
the first screening part (222) is used for screening the adhesive surface orientation of the chip, and the width of the supporting plate (2212) at the first screening part (222) is set based on the thickness of the PCB (101) of the chip, so that the adhesive surface of the chip can be shaken down when facing the side plate (2211); when the adhesive surface of the chip is opposite to the side plate (2211), the chip can pass through the first screening part (222) and continuously move forwards;
the second screening portion (223) is configured to penetrate through a first hollowed-out window (2231) of the side plate (2211), and the first hollowed-out window (2231) is arranged to enable the chip with the height along the extending direction of the side plate (2211) exceeding the upper boundary of the first hollowed-out window (2231) to pass through;
the third screening portion (224) is used for screening the orientation of the notch (104) of the chip, the side plate (2211) is provided with a second hollow window (2241) penetrating through the side plate (2211) at the third screening portion (224), the third screening portion (224) comprises a protrusion (2242), the protrusion (2242) protrudes from the upper boundary of the second hollow window (2241) towards the inside of the second hollow window (2241) with reference to the conveying direction of the chip, the protrusion (2242) is arranged to make the notch (104) of the chip fall through the second hollow window (2241) when aligned with the protrusion (2242), and the distance between the protrusion (2242) and the two sides of the second hollow window (2241) does not exceed the width of the chip;
the fourth screening portion (225) is used for screening the element orientation of the chip, the fourth screening portion (225) comprises a longitudinal plate body (2251) connected to the conveying track (221), and a bending plate body (2252) arranged at the upper end of the longitudinal plate body (2251), the bending plate body (2252) is bent back at the upper end of the longitudinal plate body (2251) and forms a chute (2253) which is open downwards, the chute (2253) extends along a straight line direction, a protruding strip (2254) extending along the extending direction of the chute (2253) is arranged in the chute (2253), when the upper end of the chip enters the chute (2253), the element on the chip is matched with the protruding strip (2254) to enable the chip to slide along the chute (2253).
7. The chip production system according to any one of claims 1 to 4, wherein the conveying unit (3) comprises a separating assembly (32) and a conveying rail (31), one end of the conveying rail (31) is connected with the outlet end of the feeding unit (2), the other end of the conveying rail can be butted with the first container (200) on the first loading unit (4), and the separating assembly (32) enables the chips on the conveying rail (31) to be conveyed into the first container (200) on the first loading unit (4) in order.
8. The chip production system according to claim 7, wherein the first loading unit (4) is disposed lower than the feeding unit (2), and the conveying rail (31) is disposed obliquely.
9. The chip production system according to claim 8, wherein the separating assembly (32) comprises a pressing member (321) and a blocking member (322) disposed downstream of the pressing member (321), the blocking member (322) being configured to block the lowermost chip on the conveying track (31), and the pressing member (321) being configured to press the chip adjacent to the lowermost chip against the conveying track (31).
10. The chip production system according to claim 7, wherein one end of the conveying track (31) connected to the outlet end of the feeding unit (2) is provided with a feeding detection member (35) for detecting whether the chip enters the conveying track (31);
one end of the conveying track (31) connected with the first loading unit (4) is provided with a discharging detection piece (36) used for detecting whether the chip enters the first loading unit (4).
11. The chip production system according to claim 7, further comprising at least one auxiliary dispensing assembly (5), the auxiliary dispensing assembly (5) smoothly transporting the chips on the transporting track (31) to the first loading unit (4).
12. The chip production system according to claim 7, wherein the first loading unit (4) comprises:
a loading plate (41), wherein a plurality of first containers (200) can be mounted on the loading plate (41) in parallel;
a driving assembly (42), wherein the driving assembly (42) drives the charging plate (41) to move so as to enable different first containers (200) to be respectively butted with the other end of the conveying track (31).
13. The chip production system according to any of claims 1 to 4, comprising a rack (400), wherein the feeding unit (6), the transferring unit (7) and the testing unit (8) are disposed on the rack (400), wherein the feeding unit (6) comprises a storage (61), a transporter (62) and a feeder (63), wherein the storage (61) is used for storing the first container (200), the transporter (62) is used for taking out and transferring the first container (200) in the storage (61) to a feeding position, and the feeder (63) is capable of transferring the chip contained in the first container (200) in the feeding position to the transferring unit (7).
14. The chip production system according to claim 13, wherein the storage (61) comprises a first storage rack (611) and a second storage rack (612) oppositely arranged on the support (400), opposite surfaces of the first storage rack (611) and the second storage rack (612) are respectively provided with a first storage slot (6111) and a second storage slot (6121) extending along a first direction, bottom ends of the first storage rack (611) and the second storage rack (612) are respectively provided with a discharge port (6112), two ends of the first container (200) are respectively located in the first storage slot (6111) and the second storage slot (6121) and can slide out from the discharge port (6112) along a second direction, and the second direction is perpendicular to the first direction.
15. The chip manufacturing system according to claim 14, wherein the transporter (62) comprises a moving plate (621), the moving plate (621) is provided with a first placing portion (6211), the moving plate (621) is slidably provided to the rack (400) along the second direction, the moving plate (621) has a material-taking position near the storage (61) and a feeding position near the feeder (63); the storage (61) further comprises a discharging piece (615), the discharging piece (615) is arranged on the support (400) in a sliding mode along the first direction, the discharging piece (615) is provided with a jacking position for jacking the first container (200) at the lowest layer to the position above the discharging port (6112) and a discharging position for discharging the first container (200) at the lowest layer to the position opposite to the discharging port (6112); when the unloading piece (615) is located at the jacking position, the moving plate (621) can move to the material taking position, and when the unloading piece (615) is located at the material placing position, the first container (200) falls into the first placing part (6211) and can be transferred to the feeding position by the moving plate (621).
16. The chip production system according to claim 13, wherein the feeder (63) comprises:
the feeding rack (631), the support (400) comprises a support plate (401), the feeding rack (631) is rotatably arranged on the support plate (401) and is provided with a material receiving position for receiving the first container (200) and a material discharging position for enabling the first container (200) to be placed in an inclined mode, and a bearing part (6311) is arranged on the feeding rack (631);
and the pressing block (633) is arranged on the feeding frame (631) in a sliding manner, and is provided with a pressing position close to the bearing part (6311) so as to press the first container (200) on the bearing part (6311) and a releasing position far away from the bearing part (6311) so as to release the first container (200).
17. The chip production system according to claim 13, wherein the support (400) comprises a support plate (401), the support plate (401) is disposed obliquely, the transport unit (7) comprises a main material channel assembly (71) and a material channel assembly (72) disposed on the support plate (401), the material channel assembly (72) is located below the main material channel assembly (71), the chip production system comprises a plurality of the test units (8) arranged along a second direction, and a plurality of the test units (8) are located below the material channel assembly (72);
said main lane assembly (71) capable of receiving and simultaneously containing a plurality of said chips from said first container (200) and capable of passing said chips one by one to said lane assembly (72);
the feed channel assembly (72) can drive the chip to move on the support plate (401) along the second direction to selectively dispense the chip to any one of the plurality of test units (8).
18. The chip production system according to claim 13, wherein the test unit (8) comprises a reading and writing carrier plate (81), a reading and writing cover plate (82), a reading and writing code assembly (83) and a first reading and writing stop member (84), the bracket (400) comprises a support plate (401) arranged obliquely, the reading and writing carrier plate (81) is arranged on the support plate (401), the reading and writing cover plate (82) is arranged on the reading and writing carrier plate (81) in a covering manner to form a working channel, the first reading and writing stop member (84) is used for blocking a chip to be written with data, and the reading and writing code assembly (83) can write, read and verify the data on the chip.
19. The chip production system according to claim 18, wherein said second loading unit (9) comprises a loading assembly (91) provided on said support plate (401) and a holder (92), said holder (92) being provided below said loading assembly (91), said holder (92) being capable of mounting a plurality of said second containers (300), said loading assembly (91) being capable of receiving said chips from said test unit (8) and of selectively placing said chips into any one of said second containers (300).
20. The chip production system according to claim 1, wherein the test unit (8) comprises a write-read code component (83), the write-read code component (83) being capable of writing, reading, and verifying data to the chip; and/or the test unit (8) comprises a performance detection component, and the performance detection component can perform performance detection on the chip entering the test unit (8); and/or the test unit (8) comprises a marking component which can mark the chip; and/or the test unit (8) comprises a data rewriting component, and the data rewriting component can perform data flash on a chip needing to be upgraded;
the second loading unit (9) comprises a loading component (91), the code writing and reading component (83) and/or the performance detecting component and/or the marking component and/or the data rewriting component are/is respectively in communication connection and/or electrical connection with the loading component (91), and the loading component (91) can place the chips into different second containers (300) respectively according to the detection result of the performance detecting component, and/or the verification result of the code writing and reading component (83), and/or the operation result of the marking component, and/or the test result of the data rewriting component.
21. A chip production method, characterized in that, the chip production system of any one of claims 1-2 and 5-20 is adopted, and the method specifically comprises the following steps:
carrying out surface assembly and packaging on the PCB to form a chip;
sequencing the chips in a preset direction;
sequentially conveying the sequenced chips to the test unit (8) for performance detection and/or data writing and/or data verification and/or data rewriting and/or marking operation;
the chips are loaded into different second containers (300) according to the operation result of the test unit (8).
22. The chip production method according to claim 21, wherein the test unit (8) comprises a write-read code component (83), the write-read code component (83) being capable of writing, reading, and verifying data to the chip; and/or the test unit (8) comprises a performance detection component, and the performance detection component can perform performance detection on the chip entering the test unit (8); and/or the test unit (8) comprises a marking component which can mark the chip; and/or the test unit (8) comprises a data rewriting component, and the data rewriting component can perform data flash on a chip needing to be upgraded;
the second loading unit (9) comprises a loading component (91), the code writing and reading component (83) and/or the performance detecting component and/or the marking component and/or the data rewriting component are/is respectively in communication connection and/or electrical connection with the loading component (91), and the loading component (91) can place the chips into different second containers (300) respectively according to the detection result of the performance detecting component, and/or the verification result of the code writing and reading component (83), and/or the operation result of the marking component, and/or the test result of the data rewriting component.
23. A method for producing a recycled chip, characterized in that the chip production system according to any one of claims 1 to 20 is used, and comprises the following steps:
removing the colloid (102) on the old chip and the wafer in the colloid (102) and reserving the PCB;
carrying out surface assembly and packaging on the PCB to form a regenerative chip;
sequencing the regenerative chips in a preset direction;
sequentially conveying the sequenced regenerated chips to the test unit (8) for performance detection and/or data writing and/or data verification and/or data rewriting and/or marking operation;
the recycled chips are loaded into different second containers (300) according to the operation result of the test unit (8).
24. The method for producing a recycled chip as claimed in claim 23, wherein the test unit (8) comprises a write-read code component (83), and the write-read code component (83) can write, read and verify data on the recycled chip; and/or the test unit (8) comprises a performance detection component, and the performance detection component can perform performance detection on the regenerated chip entering the test unit (8); and/or the testing unit (8) comprises a marking component which can mark the regeneration chip; and/or the test unit (8) comprises a data rewriting component which can carry out data flash on the regeneration chip needing to be upgraded;
the second loading unit (9) comprises a loading component (91), the code writing and reading component (83) and/or the performance detection component and/or the marking component and/or the data rewriting component are/is respectively in communication connection and/or electrical connection with the loading component (91), and the loading component (91) can place the regeneration chips into different second containers (300) respectively according to the detection result of the performance detection component, and/or the verification result of the code writing and reading component (83), and/or the operation result of the marking component, and/or the test result of the data rewriting component.
25. A chip produced by the chip production method according to claim 21 or 22.
26. A recycled chip produced by the recycled chip production method according to claim 23 or 24.
CN202111129005.0A 2021-09-26 2021-09-26 Chip, chip production system and method, recycled chip and production method thereof Pending CN113903686A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114951018A (en) * 2022-05-13 2022-08-30 深圳市标谱半导体科技有限公司 LED testing arrangement and LED test packaging all-in-one machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114951018A (en) * 2022-05-13 2022-08-30 深圳市标谱半导体科技有限公司 LED testing arrangement and LED test packaging all-in-one machine

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