CN113903672A - Preparation method of burr-shaped cutting rib of metal lead frame - Google Patents
Preparation method of burr-shaped cutting rib of metal lead frame Download PDFInfo
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- CN113903672A CN113903672A CN202111351020.XA CN202111351020A CN113903672A CN 113903672 A CN113903672 A CN 113903672A CN 202111351020 A CN202111351020 A CN 202111351020A CN 113903672 A CN113903672 A CN 113903672A
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- 239000002184 metal Substances 0.000 title claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 65
- 238000005520 cutting process Methods 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 70
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- GOECOOJIPSGIIV-UHFFFAOYSA-N copper iron nickel Chemical compound [Fe].[Ni].[Cu] GOECOOJIPSGIIV-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to the technical field of structural design of lead frames, in particular to a preparation method of a burr-shaped cutting rib of a metal lead frame. In the preparation method of the metal lead frame, the semi-etching cutting rib adopts a mode that a cross-shaped entity is connected with a semi-etching reinforcing rib column, and the height of the semi-etching reinforcing rib is lower than the surface of the metal layer and higher than a semi-etching plane; the preparation method of the burr-shaped reinforcing ribs of the metal lead frame comprises the following steps: film pressing and exposure: exposing the dry film on the surface of the cut rib through a working die, and reserving a polymerized dry film in a laser direct writing mode; developing and etching: and etching the half-etched region of the metal layer, and performing side etching by using an etching solution to retain the burr-shaped metal layer structure. The invention provides a preparation method of a burr-shaped cutting rib of a metal lead frame, which improves the strength of a fixed column, improves the manufacturing yield of the lead frame and reduces the manufacturing cost of the lead frame.
Description
Technical Field
The invention relates to the technical field of structural design of lead frames, in particular to a preparation method of a burr-shaped cutting rib of a metal lead frame.
Background
DFN/QFN is a recent electronic packaging technology, and a leadless quad flat package (QFN) is a lead-free package with peripheral terminal pads and a chip pad for mechanical and thermal integrity exposure, which may be square or rectangular, and is mainly characterized by: the assembly is very thin <1mm, and can meet the application with strict requirements on space; the surface mount package leadless pad design occupies a smaller PCB area.
The structure design of a lead frame used by DFN/QFN packaging is required to be made into half etching which is half of the thickness of material required to be made at partial positions, and the thickness of the lead frame cannot be too thick, the conventional QFN lead frame is 0.152mm and 0.203mm at present, cutting ribs are all half etching, the lead frame is easy to deform in the process of producing the lead frame, the manufacturing yield is low, and the slightly deformed lead frame has the phenomena of glue overflow and the like in the packaging process; the cutting ribs are all half the thickness of the metal layer of the lead frame, the frame deformation caused by weak strength after the cutting ribs of the lead frame are half-etched is caused, the warping of the whole product after plastic package curing is serious, and the problem of influencing cutting is serious. The design of the cutting ribs seriously influences the development of lead frame production and semiconductor packaging industries.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a preparation method of a burr-shaped cutting rib of a metal lead frame, which can improve the strength of a fixed column, improve the manufacturing yield of the lead frame and reduce the manufacturing cost of the lead frame.
The invention relates to a preparation method of a burr-shaped cutting rib of a metal lead frame, wherein in the preparation of the lead frame, a semi-etching cutting rib adopts a mode that a cross-shaped entity is connected with a burr-shaped reinforcing rib column, and the height of the burr-shaped reinforcing rib is lower than the surface of a metal layer and higher than a semi-etching plane;
the preparation method of the burr-shaped reinforcing ribs of the metal lead frame comprises the following steps:
(1) film pressing: sticking a dry film on the surface of the metal layer in a hot pressing mode;
(2) exposure: exposing the dry film on the surface of the cutting rib through a working die, adopting a laser direct writing mode, reserving a polymerized dry film by adopting exposure energy of 55-70mJ, and designing the width of an exposure die at 100 plus 130 mu m;
(3) and (3) developing: developing and washing off the unexposed dry film, and exposing the exposed and polymerized corrosion-resistant dry film on the metal surface;
(4) etching: etching off the half-etched area of the metal layer, and reserving a flash-shaped metal layer structure through side etching of etching liquid, wherein the specific weight of the etching liquid is 1.32-1.35; the etching speed is 2-4 m/min, and the spraying pressure is 20-40 psi.
Preferably, the film pressing temperature is 105-115 ℃, the film pressing speed is 2-3 m/min, and the pressure is 0.5-0.6kg/cm2。
Preferably, the development utilizes a sodium carbonate solution to develop the unexposed dry film, and the exposed dry film is retained, wherein the concentration of the developing solution is 5-20g/L, the developing temperature is 20-30 ℃, and the developing speed is 3-5 m/min.
Preferably, the etching solution is acidic copper chloride etching solution, the concentration of copper ions is 150-170mol/L, and the concentration of hydrochloric acid is 1.3-1.5 mol/L.
Preferably, the metal layer is a copper-iron-nickel alloy or an iron-nickel alloy.
In the preparation of the lead frame, the semi-etching cutting ribs adopt a mode that a cross-shaped entity is connected with a flash-shaped reinforcing rib column, and the height of the flash-shaped reinforcing ribs is lower than the surface of the metal layer and higher than a semi-etching plane; in the preparation method of the burr-shaped cutting rib of the metal lead frame, after etching and in an exposure process, the area size, the concentration of an etching solution and the pressure cause difficulty on the burr display effect, the too high burr height can be caused by too large exposure area or too low concentration of the etching solution to expose a metal layer during plastic package, and the too low burr height or no burr generation can be caused by too small exposure area or too high concentration of the etching solution to lose the supporting effect.
Specifically, in the preparation of the lead frame, the semi-etched cutting ribs are connected with the flash-shaped reinforcing rib columns by adopting a cross-shaped entity, and the flash-shaped reinforcing ribs are lower than the surface of the metal layer and higher than a semi-etched plane; the preparation method of the burr-shaped cutting rib of the metal lead frame comprises the following steps:
(1) film pressing: by means of hot pressingPasting a layer of dry film on the surface of the metal layer; the film pressing temperature is 105-115 ℃, the film pressing speed is 2-3 m/min, and the pressure is 0.5-0.6kg/cm2；
(2) Exposure: exposing the dry film on the surface of the cutting rib through a working die, adopting a laser direct writing mode, reserving a polymerized dry film by adopting exposure energy of 55-70mJ, and designing the width of an exposure die at 100 plus 130 mu m;
(3) and (3) developing: developing and washing off the unexposed dry film, and exposing the exposed and polymerized corrosion-resistant dry film on the metal surface; developing the unexposed dry film by using a sodium carbonate solution, and keeping the exposed dry film, wherein the concentration of a developing solution is 5-20g/L, the developing temperature is 20-30 ℃, and the developing speed is 3-5 m/min;
(4) etching: etching off the half-etched area of the metal layer, and reserving a flash-shaped metal layer structure through side etching of etching liquid, wherein the specific weight of the etching liquid is 1.32-1.35; the etching speed is 2-4 m/min, and the spraying pressure is 20-40 psi; the etching solution adopts acidic copper chloride etching solution, the concentration of copper ions is 150-170mol/L, and the concentration of hydrochloric acid is 1.3-1.5 mol/L.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the preparation method of the burr-shaped cutting rib of the metal lead frame, the side etching is adopted during etching, so that the appearance and the cutting problem of a product cannot be influenced;
(2) the preparation method of the burr-shaped cutting rib of the metal lead frame solves the problem of deformation of the lead frame in the manufacturing process, improves the manufacturing yield of the lead frame and reduces the manufacturing cost of the lead frame;
(3) the preparation method of the burr-shaped cutting rib of the metal lead frame solves the problems that the welding wire is poor due to the fact that the strength of the frame is weak and the pins shake in the welding wire operation process, and the whole product is seriously warped after plastic package solidification to affect cutting;
(4) the invention relates to a preparation method of a burr-shaped cutting rib of a metal lead frame, which solves the problem of package flash caused by frame deformation in the operation process of a package client.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a burr-shaped cutting rib of a metal lead frame according to the present invention;
FIG. 2 is a schematic diagram of copper exposure caused by excessive exposure area or excessive flash height due to too low concentration of etching solution during the preparation of cutting ribs of a lead frame;
FIG. 3 is a schematic diagram of a pattern of a lead frame with too small exposure area or too high etchant concentration during the preparation of a cut rib, which results in too low burr height or no burr, and thus loss of support;
fig. 4 a is a schematic structural diagram of a cutting rib in the prior art; b is a structural schematic diagram of a cutting rib of the lead frame in the embodiment of the invention;
fig. 5a is a schematic structural view of a cross-sectional view of a cutting rib in the prior art; b is a structural schematic diagram of a cross-sectional view of a cutting rib of the lead frame in the embodiment of the invention;
fig. 6 is a schematic cross-sectional view of three shapes of cutting ribs of a lead frame according to an embodiment of the present invention.
Detailed Description
The invention provides a preparation method of a burr-shaped cutting rib of a metal lead frame, and a person skilled in the art can appropriately improve process parameters by referring to the content of the cutting rib. It is expressly intended that all such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the scope of the invention. While the process of the present invention has been described in terms of preferred embodiments, it will be apparent to those skilled in the art that variations and appropriate modifications and combinations of the process of the present invention may be made to implement and use the techniques of the present invention without departing from the spirit and scope of the invention.
In the preparation method of the metal lead frame, the semi-etching cutting rib adopts a mode that a cross-shaped entity is connected with a semi-etching reinforcing rib column, and the height of the semi-etching reinforcing rib is lower than the surface of the metal layer and higher than a semi-etching plane;
the preparation method of the burr-shaped reinforcing ribs of the metal lead frame comprises the following steps:
(1) film pressing: sticking a dry film on the surface of the metal layer in a hot pressing mode;
(2) exposure: exposing the dry film on the surface of the cutting rib through a working die, adopting a laser direct writing mode, reserving a polymerized dry film by adopting exposure energy of 55-70mJ, and designing the width of an exposure die at 100 plus 130 mu m;
(3) and (3) developing: developing and washing off the unexposed dry film, and exposing the exposed and polymerized corrosion-resistant dry film on the metal surface;
(4) etching: etching off the half-etched area of the metal layer, and reserving a flash-shaped metal layer structure through side etching of etching liquid, wherein the specific weight of the etching liquid is 1.32-1.35; the etching speed is 2-4 m/min, and the spraying pressure is 20-40 psi.
The film pressing temperature is 105-115 ℃, the film pressing speed is 2-3 m/min, and the pressure is 0.5-0.6kg/cm2。
Developing the unexposed dry film by using a sodium carbonate solution, and keeping the exposed dry film, wherein the concentration of a developing solution is 5-20g/L, the developing temperature is 20-30 ℃, and the developing speed is 3-5 m/min.
The etching solution adopts acidic copper chloride etching solution, the concentration of copper ions is 150-170mol/L, and the concentration of hydrochloric acid is 1.3-1.5 mol/L.
The metal layer is made of copper-iron-nickel alloy or iron-nickel alloy.
In the preparation of the lead frame, the semi-etched cutting rib adopts a mode that a cross-shaped entity is connected with a flash-shaped reinforcing rib column, and the height of the flash-shaped reinforcing rib is lower than the surface of the metal layer and higher than a semi-etched plane; in the preparation method of the burr-shaped cutting rib of the metal lead frame, after etching and in an exposure process, the area size, the concentration of an etching solution and the pressure cause difficulty on the burr display effect, the too high burr height can be caused by too large exposure area or too low concentration of the etching solution to expose a metal layer during plastic package, and the too low burr height or no burr generation can be caused by too small exposure area or too high concentration of the etching solution to lose the supporting effect.
In order to further explain the present invention, the following describes in detail the method for manufacturing the burr-shaped cutting rib of the metal lead frame according to the present invention with reference to the following embodiments.
Examples
In the embodiment, the semi-etched cutting ribs are connected with the flash-shaped reinforcing rib columns by adopting a cross-shaped entity in the preparation of the lead frame, and the flash-shaped reinforcing ribs are lower than the surface of the metal layer and higher than the semi-etched plane; the preparation method of the burr-shaped cutting rib of the metal lead frame comprises the following steps:
(1) film pressing: sticking a dry film on the surface of the metal layer in a hot pressing mode; the film pressing temperature is 105-115 ℃, the film pressing speed is 2-3 m/min, and the pressure is 0.5-0.6kg/cm2；
(2) Exposure: exposing the dry film on the surface of the cutting rib through a working die, adopting a laser direct writing mode, reserving a polymerized dry film by adopting exposure energy of 55-70mJ, and designing the width of an exposure die at 100 plus 130 mu m;
(3) and (3) developing: developing and washing off the unexposed dry film, and exposing the exposed and polymerized corrosion-resistant dry film on the metal surface; developing the unexposed dry film by using a sodium carbonate solution, and keeping the exposed dry film, wherein the concentration of a developing solution is 5-20g/L, the developing temperature is 20-30 ℃, and the developing speed is 3-5 m/min;
(4) etching: etching off the half-etched area of the metal layer, and reserving a flash-shaped metal layer structure through side etching of etching liquid, wherein the specific weight of the etching liquid is 1.32-1.35; the etching speed is 2-4 m/min, and the spraying pressure is 20-40 psi; the etching solution adopts acidic copper chloride etching solution, the concentration of copper ions is 150-170mol/L, and the concentration of hydrochloric acid is 1.3-1.5 mol/L.
The shape of the flash-shaped reinforcing rib prepared in the embodiment is the shape shown in fig. 6, and the cross-sectional view of the flash is a sharp shape, an arc shape, and a parallel peak shape. And customers order 100 lead frames with the models of DFN0506-8L-0.203T, the yield detection is carried out according to the enterprise standard LFZC-CX24-05A2 metallic lead frame inspection standard specification, the product yield of the lead frame adopting the semi-etching process in the prior art is 80 percent, the yield of the prepared lead frame is increased to 85 percent by adopting the preparation method of the burr-shaped cutting rib of the metallic lead frame,
of course, the foregoing is only a preferred embodiment of the invention and should not be taken as limiting the scope of the embodiments of the invention. The present invention is not limited to the above examples, and equivalent changes and modifications made by those skilled in the art within the spirit and scope of the present invention should be construed as being included in the scope of the present invention.
Claims (5)
1. A preparation method of a burr-shaped cutting rib of a metal lead frame is characterized by comprising the following steps: in the preparation of the lead frame, the semi-etched cutting rib adopts a mode that a cross-shaped entity is connected with a flash-shaped reinforcing rib column, and the height of the flash-shaped reinforcing rib is lower than the surface of the metal layer and higher than a semi-etched plane;
the preparation method of the burr-shaped reinforcing ribs of the metal lead frame comprises the following steps:
(1) film pressing: sticking a dry film on the surface of the metal layer in a hot pressing mode;
(2) exposure: exposing the dry film on the surface of the cutting rib through a working die, adopting a laser direct writing mode, reserving a polymerized dry film by adopting exposure energy of 55-70mJ, and designing the width of an exposure die at 100 plus 130 mu m;
(3) and (3) developing: developing and washing off the unexposed dry film, and exposing the exposed and polymerized corrosion-resistant dry film on the metal surface;
(4) etching: etching off the half-etched area of the metal layer, and reserving a flash-shaped metal layer structure through side etching of etching liquid, wherein the specific weight of the etching liquid is 1.32-1.35; the etching speed is 2-4 m/min, and the spraying pressure is 20-40 psi.
2. The method for manufacturing the burried cutting rib of the metal lead frame according to claim 1, wherein: the film pressing temperature is 105-115 ℃, the film pressing speed is 2-3 m/min, and the pressure is 0.5-0.6kg/cm2。
3. The method for manufacturing the burried cutting rib of the metal lead frame according to claim 1, wherein: developing the unexposed dry film by using a sodium carbonate solution, and keeping the exposed dry film, wherein the concentration of a developing solution is 5-20g/L, the developing temperature is 20-30 ℃, and the developing speed is 3-5 m/min.
4. The method for manufacturing the burried cutting rib of the metal lead frame according to claim 1, wherein: the etching solution adopts acidic copper chloride etching solution, the concentration of copper ions is 150-170mol/L, and the concentration of hydrochloric acid is 1.3-1.5 mol/L.
5. The method for manufacturing the burried cutting rib of the metal lead frame according to claim 1, wherein: the metal layer is made of copper-iron-nickel alloy or iron-nickel alloy.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118607459A (en) * | 2024-08-07 | 2024-09-06 | 新恒汇电子股份有限公司 | Design method for manufacturing drawing of lead frame |
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| JP2004023007A (en) * | 2002-06-20 | 2004-01-22 | Sony Corp | Semiconductor package, lead frame of semiconductor package, manufacturing method of semiconductor package |
| JP2012114354A (en) * | 2010-11-26 | 2012-06-14 | Dainippon Printing Co Ltd | Lead frame and method of manufacturing the same |
| JP2014036129A (en) * | 2012-08-09 | 2014-02-24 | Mitsui High Tec Inc | Lead frame |
| JP2016082222A (en) * | 2014-10-09 | 2016-05-16 | 大日本印刷株式会社 | Lead frame and method of manufacturing the same |
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2021
- 2021-11-16 CN CN202111351020.XA patent/CN113903672A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004023007A (en) * | 2002-06-20 | 2004-01-22 | Sony Corp | Semiconductor package, lead frame of semiconductor package, manufacturing method of semiconductor package |
| JP2012114354A (en) * | 2010-11-26 | 2012-06-14 | Dainippon Printing Co Ltd | Lead frame and method of manufacturing the same |
| JP2014036129A (en) * | 2012-08-09 | 2014-02-24 | Mitsui High Tec Inc | Lead frame |
| JP2016082222A (en) * | 2014-10-09 | 2016-05-16 | 大日本印刷株式会社 | Lead frame and method of manufacturing the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118607459A (en) * | 2024-08-07 | 2024-09-06 | 新恒汇电子股份有限公司 | Design method for manufacturing drawing of lead frame |
| CN118607459B (en) * | 2024-08-07 | 2024-10-15 | 新恒汇电子股份有限公司 | Design method for manufacturing drawing of lead frame |
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Application publication date: 20220107 |