CN113900457A - Pressure zero setting method and semiconductor process equipment - Google Patents
Pressure zero setting method and semiconductor process equipment Download PDFInfo
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- CN113900457A CN113900457A CN202111153325.XA CN202111153325A CN113900457A CN 113900457 A CN113900457 A CN 113900457A CN 202111153325 A CN202111153325 A CN 202111153325A CN 113900457 A CN113900457 A CN 113900457A
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Abstract
The embodiment of the invention provides a pressure zero setting method and semiconductor process equipment, which are applied to the technical field of semiconductor manufacturing, and the method comprises the following steps: after the process chamber is vacuumized, timing is started, pressure values collected by the pressure gauge are obtained under the condition that the timing time reaches preset time, a plurality of pressure values collected by the pressure gauge are obtained again under the condition that the pressure values are not lower than preset negative float judgment pressure values and not higher than preset positive float upper pressure limits, and pressure zero setting operation is executed when the pressure values meet preset pressure zero setting conditions. In the zeroing process of the pressure gauge, under the condition that the pressure gauge is determined to have no negative float and the positive float error is within an acceptable range, if a plurality of collected pressure values meet the pressure zeroing condition, the pressure zeroing operation is carried out, hardware zeroing of the pressure gauge is avoided being directly and manually carried out, and therefore the problem of difficulty in zeroing operation can be solved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a pressure zero setting method and semiconductor process equipment.
Background
In a semiconductor processing apparatus, a chamber in which a wafer is subjected to a relevant process by physical, chemical, or the like means is referred to as a process chamber. The pressure gauge is installed in the process chamber, and in the wafer processing process, the actual pressure in the process chamber can be detected through the pressure gauge, and the process chamber is controlled to work at the target pressure according to the actual pressure so as to perform process processing on the wafer.
After the pressure gauge is used for a certain time, the zero point of the pressure gauge can drift, so that an error can be generated in the actual pressure collected by the pressure gauge. For example, after a pressure gauge is used for a period of time, the actual pressure in the process chamber is 0 millitorr (mT), but the output of the pressure gauge is 0.5 mtorr, which may result in an error of 0.5 mtorr.
In the prior art, in order to avoid the drift of the zero point of the pressure gauge, a worker regularly performs hardware zero setting on the pressure gauge, and in the hardware zero setting process, the worker needs to manually rotate a zero setting knob on the pressure gauge, and the pressure gauge is usually arranged at a position where the worker is inconvenient to touch, so that the zero setting operation is difficult.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is that the zero setting of a pressure gauge in semiconductor process equipment is difficult.
In order to solve the above problems, an embodiment of the present invention discloses a pressure zeroing method, which is applied to semiconductor processing equipment, where the semiconductor processing equipment includes a process chamber and a pressure gauge, and the pressure gauge is used for acquiring a pressure value in the process chamber; the method comprises the following steps:
after the process chamber is vacuumized, timing is started;
acquiring a pressure value acquired by the pressure gauge under the condition that the timing duration reaches a preset duration;
under the condition that the pressure value is not lower than a preset negative float judgment pressure value and not higher than a preset positive float upper pressure limit, acquiring a plurality of pressure values collected by the pressure gauge again;
and when the pressure values meet a preset pressure zero setting condition, executing pressure zero setting operation.
Optionally, the obtaining again a plurality of pressure values collected by the pressure gauge includes:
acquiring pressure values acquired by the pressure gauge every preset sampling time to obtain a plurality of pressure values;
the pressure zeroing condition comprises:
the difference value between the maximum pressure value and the minimum pressure value in the plurality of pressure values is not higher than a preset pressure difference value.
Optionally, the pressure zeroing condition further comprises: the minimum pressure value is not higher than a preset pressure threshold value.
Optionally, the pressure zeroing operation comprises:
thirdly, acquiring a pressure value acquired by the pressure gauge, and storing the pressure value as a zero pressure adjustment value;
identifying the zero pressure adjustment value as zero.
Optionally, before the identifying the zero-point pressure adjustment value as a zero point, the method further includes:
acquiring the stored zero point pressure adjustment value corresponding to the previous pressure zero setting operation;
and under the condition that the sum of the zero-point pressure adjustment value corresponding to the pressure zero setting operation at the current time and the zero-point pressure adjustment value corresponding to the pressure zero setting operation at the previous time is higher than a preset automatic zero setting pressure upper limit, informing a user of manually setting the pressure gauge.
Optionally, the semiconductor process equipment further comprises a pressure controller, wherein the pressure controller is connected with the pressure gauge and is used for controlling the pressure in the process chamber according to the pressure value acquired by the pressure gauge;
the obtaining of the pressure value collected by the pressure gauge includes: directly acquiring the collected pressure value from the pressure gauge;
the obtaining of the plurality of pressure values collected by the pressure gauge again includes: and acquiring the plurality of pressure values acquired by the pressure gauge through the pressure controller.
Optionally, before the evacuating the process chamber, the method further includes:
and carrying out leakage rate detection on the process chamber, and vacuumizing the process chamber after the leakage rate is qualified.
The embodiment of the invention also discloses conductor process equipment which comprises a process chamber, a vacuumizing device, a controller and a pressure gauge, wherein the controller is connected with the vacuumizing device and the pressure gauge;
the vacuumizing device is used for vacuumizing the process chamber; the pressure gauge is used for collecting a pressure value in the process chamber;
the controller is used for starting timing after controlling the vacuumizing device to vacuumize the process chamber; acquiring a pressure value acquired by the pressure gauge under the condition that the timing duration reaches a preset duration; under the condition that the pressure value is not lower than a preset negative float judgment pressure value and not higher than a preset positive float upper pressure limit, acquiring a plurality of pressure values collected by the pressure gauge again; and when the pressure values meet a preset pressure zero setting condition, executing pressure zero setting operation.
Optionally, the controller includes an analog input board card, the pressure gauge is connected with the controller through the analog input board card, and the controller acquires the pressure value collected by the pressure gauge through the analog input board card when the timing duration reaches the preset duration.
Optionally, the semiconductor processing equipment further comprises a pressure controller, wherein the pressure controller is connected with the controller and the pressure gauge and is used for controlling the pressure in the processing chamber according to the pressure value acquired by the pressure gauge;
the controller comprises a communication board card, the pressure controller is connected with the controller through the communication board card, and the controller acquires the pressure values acquired by the pressure gauge again through the communication board card.
Compared with the background art, the invention has the following advantages: after the process chamber is vacuumized, timing is started, pressure values collected by the pressure gauge are obtained under the condition that the timing time reaches preset time, a plurality of pressure values collected by the pressure gauge are obtained again under the condition that the pressure values are not lower than preset negative float judgment pressure values and not higher than preset positive float upper pressure limits, and pressure zero setting operation is executed when the pressure values meet preset pressure zero setting conditions. In the zeroing process of the pressure gauge, under the condition that the pressure gauge is determined to have no negative float and the positive float error is within an acceptable range, if a plurality of collected pressure values meet the pressure zeroing condition, the pressure zeroing operation is carried out, hardware zeroing of the pressure gauge is avoided being directly and manually carried out, and therefore the problem of difficulty in zeroing operation can be solved.
Drawings
FIG. 1 is a schematic diagram of a semiconductor processing apparatus according to the present invention;
FIG. 2 is a schematic diagram of a process chamber of the present invention;
FIG. 3 is a flow chart illustrating the steps of one embodiment of a pressure zeroing method of the present invention;
FIG. 4 is a schematic system diagram of a semiconductor processing apparatus according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the embodiments of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, there is shown a schematic structural diagram of a semiconductor processing apparatus of the present invention, which includes a process chamber, a vacuum transfer chamber, a transition chamber, and an atmospheric robot. The process chamber may be represented by a symbol PM shown in fig. 1, and the process chamber may perform related process processing on the wafer, for example, the process chamber may be an etching chamber, and the wafer may be plasma etched in the etching chamber. The vacuum transfer chamber may be denoted by the symbol TC shown in fig. 1, the transition chamber may be denoted by the symbol ll (load lock) shown in fig. 1, and the atmospheric robot is disposed in an Equipment Front End Module (EFEM) shown in fig. 1. The process chamber is separated from the vacuum transmission chamber through a valve, and the vacuum transmission chamber is separated from the transition chamber through a valve. The process chamber is required to maintain a vacuum state while performing related process on the wafer, and the vacuum transfer chamber is used to isolate the process chamber from the external environment. Specifically, after the wafer enters the processing procedure, the wafer in the external environment can be firstly sent into the transition chamber through the atmospheric robot, and all valves of the transition chamber are closed. And vacuumizing the transition chamber, opening a valve between the transition chamber and the vacuum transmission chamber, transferring the wafer in the transition chamber through the vacuum transmission chamber by a manipulator in the vacuum transmission chamber, and then sending the wafer into the process chamber to keep the process chamber in a vacuum state.
Referring to fig. 2, a schematic structural diagram of a process chamber according to the present invention is shown, wherein a pressure gauge, an inflation device and a vacuum pumping device are installed on the process chamber, the vacuum pumping device includes a vacuum pump, a pressure controller and a swing valve (not shown in the figure), the pressure controller is connected to the pressure gauge, and a detection end of the pressure gauge is disposed in the process chamber and is capable of collecting pressure in the process chamber and sending the collected pressure value to the pressure controller. The vacuum pump is connected with the process chamber through the swing valve, the pressure controller can control the swing valve to be opened, and the vacuum pump is controlled to be started to vacuumize the process chamber. The pressure controller is electrically connected with the swing valve, the pressure controller can control the opening of the swing valve according to the actual pressure value collected by the pressure gauge, the pressure in the process chamber is maintained at the target pressure, and the vacuum chamber is maintained in a vacuum state. The Gas filling means may be represented by a symbol "Gas In" In fig. 2, and is used to supply a predetermined type of Gas to the process chamber during the process, perform a related process on the wafer, or clean the process chamber. The specific structure of the semiconductor processing equipment can be set according to the requirement, and the embodiment does not limit the structure.
When the wafer is sent into the process chamber to carry out process treatment on the wafer, by-products generated in the treatment process can be attached to the detection end of the pressure gauge, so that the zero point of the pressure gauge is shifted. When the zero point of the pressure gauge drifts, the pressure value acquired by the pressure gauge deviates and does not accord with the actual pressure value in the process chamber. At this time, if the pressure controller controls the opening of the swing valve according to the pressure value acquired by the pressure gauge, the pressure in the process chamber cannot reach the target pressure, and the quality of the chip is affected.
Referring to fig. 3, a flow chart of steps of an embodiment of a pressure zeroing method of the present invention is shown, which may include the steps of:
In this embodiment, the pressure zeroing method may be implemented by a controller in the semiconductor process equipment, where the controller is, for example, a lower computer in the semiconductor process equipment, the lower computer is connected to the pressure gauge, and the pressure value in the process chamber may be obtained by the pressure gauge. As shown in fig. 4, fig. 4 is a schematic diagram of a system structure of a semiconductor process device according to the present invention, the semiconductor process device includes an upper computer and a lower computer, the upper computer and the lower computer may be electronic devices with control capability such as a computer, a touch screen, and a Programmable Logic Controller (PLC), and a user may send a control command to the lower computer through the upper computer to instruct the lower computer to operate. The lower computer is connected with the pressure controller and can send a control instruction to the pressure controller to control the pressure controller to act. The pressure controller may obtain a pressure value in the process chamber from the pressure gauge, and control an opening degree of the swing valve (symbol PV represents the swing valve) according to the obtained pressure value to adjust the pressure in the process chamber. Meanwhile, the lower computer is connected with the pressure gauge, and the pressure value collected by the pressure gauge can be acquired. As shown in fig. 4, an input board card is integrated into the lower computer, and the input board card may be an analog input board card, such as an analog-to-digital converter, which is electrically connected to a pressure gauge installed on the process chamber. The pressure gauge can convert the pressure value in the process chamber into an analog voltage signal of 0-10V, and the input board card can convert the voltage signal into a digital signal, namely a voltage value, and provides the voltage value for a lower computer. The input board card can also be a digital quantity input board card, and the pressure gauge can directly convert the pressure value in the process chamber into a digital signal at the moment, and the digital signal is sent to the lower computer through the input board card. The specific types of the lower computer and the pressure gauge can be set according to requirements, and the embodiment does not limit the specific types.
In one embodiment, step 301 may be implemented as follows: the lower computer can control the vacuumizing device in the semiconductor process equipment to start under the condition of receiving the zeroing instruction sent by the upper computer, vacuumizes the process cavity and acquires the pressure value acquired by the pressure gauge. In order to avoid confusion, the pressure value obtained after the vacuum extractor is started and before the timing is started is defined as the first-stage pressure in this embodiment. For example, when the process chamber is in an idle state, a user can operate the upper computer to send a zero setting instruction to the lower computer, the lower computer starts the execution step 301 after receiving the zero setting instruction sent by the upper computer, sends a control instruction to the pressure controller, controls the pressure controller to send a start instruction to the vacuum pump, controls the evacuation pump to start, and controls the pressure controller to open the swing valve to evacuate the process chamber. Meanwhile, the analog signal acquired by the pressure gauge can be acquired through the input board card, and a digital signal, namely the first-stage pressure acquired by the pressure gauge, is obtained through conversion. In practical application, the upper computer can also automatically send a zero setting instruction to the lower computer when the process chamber is in an idle state, or the lower computer automatically starts and executes the step 301 when the process chamber is in an idle state.
When the pressure in the first stage is less than or equal to the preset zero setting pressure, the pressure in the process chamber can be determined to be close to or reach the limit vacuum during the process treatment, and the zero setting operation can be carried out on the pressure gauge. The ultimate vacuum corresponds to the pressure zero point in the process treatment process, and under the ultimate vacuum condition, if the zero point of the pressure gauge does not drift, the pressure value acquired by the pressure gauge is 0. In this embodiment, when the vacuum-pumping device is controlled to vacuum the pressure in the process chamber to the preset zero-setting pressure, the process chamber is continuously pumped and timing is started,
and 302, acquiring a pressure value acquired by the pressure gauge under the condition that the timing duration reaches a preset duration.
In this embodiment, the pressure value acquired by the pressure gauge can be acquired again when the timing duration reaches the preset duration. The purpose of timing is to wait for the pressure in the process chamber to be stable, so that the pressure in the process chamber completely enters the ultimate vacuum state, and a pressure value is obtained in the stable state. In order to avoid confusion, in this embodiment, the pressure value collected after the timing duration reaches the preset duration and before collecting the plurality of pressures is defined as the pressure in the second stage. For example, the preset zero setting pressure is 0.5 millitorr, the preset time is 30 seconds, the lower computer continuously obtains the pressure value collected by the pressure gauge after controlling the vacuumizing device to start, namely the pressure in the first stage, the timing is started when the pressure in the first stage is less than or equal to 0.5 millitorr, and the pressure value collected by the pressure gauge is obtained again when the timing time reaches 30 seconds, so that the pressure in the second stage is obtained. The specific values of the zeroing pressure and the time duration can be set according to requirements, and the embodiment does not limit the values.
And 303, under the condition that the pressure value is not lower than the preset negative float judgment pressure value and is not higher than the preset positive float upper limit, acquiring a plurality of pressure values collected by the pressure gauge again.
Under the condition of ultimate vacuum, when the pressure value acquired by the pressure gauge is lower than the negative float judgment pressure, the zero point of the pressure gauge can be determined to generate negative float, the pressure value acquired by the pressure gauge is lower than the pressure value in the actual process chamber, and otherwise, the zero point of the pressure gauge can be determined not to generate negative float. Meanwhile, when the pressure value acquired by the pressure gauge is smaller than the upper limit of the positive-floating pressure, the zero point of the pressure gauge is determined not to be positively floated, or the pressure deviation generated by positive floating is within an acceptable range, and manual and mechanical zero setting by a user is not needed.
In this embodiment, the pressure value collected after the second-stage pressure is not lower than the negative drift judgment pressure and not higher than the upper limit of the positive drift pressure is defined as the third-stage pressure. For example, the negative drift determination pressure may be 0.05 mtorr, the upper limit of the positive drift pressure may be 1 mtorr, after the second stage pressure is obtained, if the second stage pressure is greater than or equal to the negative drift determination pressure, it may be determined that negative drift does not occur at the zero point of the pressure gauge, and when the second stage pressure is less than or equal to the upper limit of the positive drift pressure, it may be determined that positive drift does not occur at the zero point of the pressure gauge, or the pressure deviation generated by positive drift is within an acceptable range. At this time, the lower computer may acquire a plurality of pressure values acquired by the pressure gauge again. In this embodiment, the pressure value collected after the pressure value is determined to be not lower than the preset negative float judgment pressure value and not higher than the preset positive float upper pressure limit is defined as the third stage pressure.
Otherwise, when the pressure in the second stage is smaller than the negative drift judgment pressure, the zero point of the pressure gauge is determined to generate negative drift, the lower computer can output first prompt information to prompt the user that the zero point of the pressure gauge generates negative drift, and the user can manually zero the pressure gauge. And when the pressure at the second stage is higher than the upper limit of the positive drift pressure, the lower computer can output second prompt information to prompt a user that the zero point of the pressure gauge is positively floated, so that the user manually adjusts the zero point of the pressure gauge. The specific form of the first prompt message and the second prompt message may be set according to the requirement, which is not limited in this embodiment.
In another embodiment, when it is determined that the second stage pressure is lower than the negative drift judgment pressure or higher than the upper limit of the positive drift pressure, the lower computer may send related information to the upper computer, so that the upper computer outputs the first prompt information or the second prompt information. The specific form of the first prompt message and the second prompt message may be set according to the requirement, which is not limited in this embodiment.
And 304, when the pressure values meet the preset pressure zero setting condition, executing pressure zero setting operation.
Optionally, the pressure zeroing operation may include:
thirdly, acquiring a pressure value acquired by the pressure gauge, and storing the pressure value as a zero pressure adjustment value;
the zero pressure adjustment value is identified as zero.
And the zero point pressure adjusting value is used for controlling the pressure of the process chamber in the pressure control of the process chamber according to the sum of the zero point pressure adjusting value and the actual pressure value acquired by the pressure gauge.
In this embodiment, when the plurality of pressure values satisfy the preset pressure zero setting condition, the pressure values acquired by the pressure gauge may be acquired again, the acquired pressure values are used as zero point pressure adjustment values, that is, the pressure values that are just acquired from the pressure gauge at the current time are used as the zero point pressure adjustment values, and the zero point pressure adjustment values are identified as zero points. Because the pressure gauge is connected with the lower computer, the lower computer continuously obtains the pressure value from the pressure gauge, and when the lower computer determines that the plurality of pressure values meet the preset pressure zero setting condition, the lower computer can obtain the pressure value from the pressure gauge once again (namely, for the third time), and the obtained pressure value is used as the zero point pressure adjustment value.
The lower computer can send the zero pressure adjustment value to the pressure controller after determining the zero pressure adjustment value, so that the pressure controller marks the zero pressure adjustment value as zero in the pressure control process of the process chamber, acquires the acquired pressure value from the pressure gauge, sums the acquired pressure value and the zero pressure adjustment value, uses the summed pressure value as an actual pressure value of the process chamber, and controls the opening of the swing valve through an actual pressure value operation control algorithm to stabilize the pressure in the process chamber at a target pressure. In the pressure control process, after the pressure controller acquires a pressure value from the pressure gauge each time, the pressure controller can sum the pressure value and a zero pressure adjustment value, the pressure value obtained by summation is used as an actual pressure value of the process chamber, the actual pressure value is used as the input of a Proportional Integral Derivative (PID) control algorithm, the PID control algorithm is operated to obtain output pressure, the output pressure is converted into the opening of the swing valve, and the swing valve is controlled to act, so that the pressure of the process chamber is stabilized at a target pressure. Namely, the zero pressure adjustment value is used as a deviation value, and the deviation value is superposed on the pressure value acquired by the pressure gauge in the pressure control process to obtain the actual pressure value in the process chamber.
In another embodiment, the lower computer may store the zero pressure adjustment value after determining the zero pressure adjustment value, and in the wafer processing process, after determining the target pressure of the process chamber, may sum the target pressure and the zero pressure adjustment value, and send the sum result to the pressure controller, so that the pressure controller takes the sum result as the target pressure in the pressure control process, and operates a PID algorithm according to the pressure value acquired by the pressure gauge, so as to control the opening of the swing valve, so that the process chamber reaches the target pressure. Namely, the zero pressure adjustment value is used as a deviation value, in the pressure control process, the deviation value is superposed on the target pressure, the pressure value acquired by the pressure gauge has deviation, and the deviation value acquired by the pressure gauge is offset through the deviation value superposed on the target pressure.
It should be noted that, the pressure value acquired by the acquiring pressure gauge defined in this embodiment refers to the pressure value acquired from the process chamber by the acquiring pressure gauge at the current time.
Optionally, the step of obtaining a plurality of pressure values collected by the pressure gauge again may be implemented as follows:
acquiring pressure values acquired by the pressure gauge every preset sampling time to obtain a plurality of pressure values;
the preset pressure zero setting conditions include: the difference value between the maximum pressure value and the minimum pressure value in the plurality of pressure values is not higher than a preset pressure difference value.
When the difference value between the maximum pressure value and the minimum pressure value in the plurality of pressure values is smaller than or equal to the preset pressure difference value, the pressure in the process chamber can be determined to be relatively stable, and the pressure zeroing operation can be executed.
In an embodiment, in the process of obtaining the third-stage pressure, a plurality of third-stage pressures may be continuously obtained, and whether the pressure in the process chamber at the current moment is stable is further determined through the plurality of third-stage pressures. For example, the preset sampling time may be 10 seconds (S), and after it is determined that the second-stage pressure is greater than the negative drift judgment pressure and lower than the positive drift upper pressure limit, the lower computer may obtain the pressure value collected by the pressure gauge every 10 seconds, and continuously obtain the pressure values for 3 times, so as to obtain 3 third-stage pressures. Then the lower computer can determine the maximum pressure value and the minimum pressure value from the 3 third-stage pressures, and calculate the difference value between the maximum pressure value and the minimum pressure value. When the difference between the maximum pressure value and the minimum pressure value is less than or equal to the preset pressure difference, the pressure in the process chamber is in a stable state, and at this time, the pressure zero setting operation can be executed. Conversely, when the difference between the maximum pressure value and the minimum pressure value is greater than the preset pressure difference value, it may be determined that the current pressure in the process chamber is unstable, and a third prompt message may be output to prompt a user to check the process chamber to determine whether the process chamber leaks. The specific amount of the test pressure can be set according to the requirement, and the embodiment does not limit this.
In the embodiment of the invention, a plurality of pressure values are obtained through a plurality of times of sampling, and when the pressure in the process chamber is judged to be stable through the plurality of pressure values, the pressure zeroing operation is executed. And because the interval time between the leakage rate detection process and the pressure zero setting process of the process chamber is long, the leakage rate detection result performed before the pressure zero setting operation is executed may not be accurate, and whether the process chamber leaks or not can be further determined through a plurality of pressure values, so that the pressure zero setting operation is executed under the condition that the process chamber does not leak, and an accurate zero pressure adjustment value is obtained.
Optionally, the pressure zeroing condition further comprises: the minimum pressure value is not higher than a preset pressure threshold value.
In this embodiment, when the minimum pressure value in the plurality of third-stage pressures is not higher than the preset pressure threshold, it may be determined that the positive drift pressure of the pressure gauge is within the acceptable range. In combination with the above example, the difference between the maximum pressure value and the minimum pressure value is smaller than the preset pressure difference, and when the minimum pressure value is smaller than or equal to the pressure threshold, the pressure in the process chamber is not higher than the sum of the pressure threshold and the pressure difference. Because the pressure in the process chamber is determined to be stable, the pressure zeroing operation is executed under the condition that the pressure in the process chamber is not higher than the sum of the pressure threshold and the pressure difference, so that the zero point pressure adjustment value is not higher than the sum of the pressure threshold and the pressure difference, the range of the zero point pressure adjustment value can be limited, and a large zero point pressure adjustment value is avoided. Conversely, when the minimum pressure value in the plurality of third-stage pressures is higher than the pressure threshold, fourth prompt information may be output to prompt the user that the currently determined zero-point pressure adjustment value is large, and the pressure gauge may be manually zeroed.
In the embodiment of the invention, the pressure zero setting operation is executed when the minimum pressure value in the plurality of pressure values is determined not to be higher than the pressure threshold value, so that the range of the zero point pressure adjustment value can be limited, and the zero point pressure adjustment value is prevented from exceeding the acceptable deviation range due to a larger value.
In summary, in the embodiment of the present invention, after the process chamber is vacuumized, timing is started, the pressure value acquired by the pressure gauge is acquired when the timing duration reaches the preset duration, the plurality of pressure values acquired by the pressure gauge are acquired again when the pressure value is not lower than the preset negative float judgment pressure value and is not higher than the preset positive float upper pressure limit, and the pressure zeroing operation is performed when the plurality of pressure values satisfy the preset pressure zeroing condition. In the zeroing process of the pressure gauge, under the condition that the pressure gauge is determined to have no negative float and the positive float error is within an acceptable range, if a plurality of collected pressure values meet the pressure zeroing condition, the pressure zeroing operation is carried out, hardware zeroing of the pressure gauge is avoided being directly and manually carried out, and therefore the problem of difficulty in zeroing operation can be solved.
Furthermore, because the embodiment of the invention does not need manual hardware zero setting, the lower computer can automatically zero the pressure gauge when the semiconductor process equipment is in an idle state, thereby avoiding user participation and realizing automatic zero setting.
Optionally, after step 305, the method may further include:
acquiring a stored zero point pressure adjustment value corresponding to the previous pressure zero setting operation;
and under the condition that the sum of the zero point pressure adjustment value corresponding to the current pressure zero setting operation and the zero point pressure adjustment value corresponding to the previous pressure zero setting operation is higher than the preset automatic zero setting pressure upper limit, informing a user of manually setting the zero point of the pressure gauge.
In an embodiment, after determining the zero-point pressure adjustment value, the lower computer may obtain a stored zero-point pressure adjustment value when the pressure zeroing operation was performed last time, then sum the zero-point pressure adjustment value of this time and the zero-point pressure adjustment value of the last time, and if the sum result is greater than the upper limit of the auto-zeroing pressure, output a fifth prompt message to notify the user of performing manual zeroing on the pressure gauge. For example, the upper limit of the auto-zero pressure may be 1 mtorr, in the zeroing process, if the zero pressure adjustment value determined when the pressure zeroing operation was performed last time is 0.6 mtorr and the zero pressure adjustment value determined when the pressure zeroing operation was performed this time is 0.5 mtorr, since the zero pressure adjustment value is determined based on the zero pressure adjustment value determined last time, the total error of the zero pressure for two times is 1.1 mtorr, and the deviation between the pressure value acquired by the pressure gauge and the actual pressure value at this time is 1.1 mtorr and is higher than the upper limit of the auto-zero pressure, the lower computer may output a fifth prompt message to prompt the user that the zero point of the pressure gauge is floating, and the bias of the floating pressure is large, so that the user manually zeroes the pressure gauge.
In the embodiment of the invention, the notification information is output when the sum of the zero point pressure adjustment value and the previous zero point pressure adjustment value is determined to be higher than the upper limit of the automatic zero setting, so that the deviation of the pressure gauge exceeds the acceptable range after the zero setting for many times can be avoided.
Optionally, obtaining the pressure value collected by the pressure gauge includes: directly acquiring the collected pressure value from the pressure gauge;
obtaining a plurality of pressure values collected by the pressure gauge again, wherein the pressure values comprise: and acquiring a plurality of pressure values acquired by the pressure gauge through the pressure controller.
As shown in fig. 4, the lower computer and the pressure controller are respectively connected with the pressure gauge, so that the lower computer and the pressure controller can simultaneously obtain a pressure value from the pressure gauge. The lower computer is connected with the pressure controller, so that the lower computer can acquire the pressure value acquired by the pressure controller from the pressure gauge from the pressure controller. In fig. 4, a communication board card is integrated in the lower computer, the communication board card may be a Recommended Standard (RS) 232 interface, and the pressure controller is in communication connection with the lower computer through the RS232 interface. The lower computer can directly acquire the pressure value acquired by the pressure gauge from the pressure gauge in the process of acquiring the pressure in the second stage. In the process of collecting the third-stage pressure, the lower computer can send a collecting instruction to the pressure controller, and the pressure controller can send the pressure value obtained from the pressure gauge to the lower computer after receiving the collecting instruction. Or the pressure controller can continuously acquire the pressure value from the pressure gauge and forward the pressure value to the lower computer.
In practical application, due to different hardware parameters, when the lower computer and the pressure controller acquire pressure values at the same moment from the pressure gauge, the pressure values acquired by the lower computer and the pressure controller may have deviation, and the lower computer acquires the pressure values from the pressure controller, so that the deviation can be avoided, and the pressure matched with the pressure controller can be acquired.
Optionally, before step 301, the method may further include:
and (4) carrying out leakage rate detection on the process chamber, and vacuumizing the process chamber after the leakage rate is qualified.
In one embodiment, the lower computer may initiate performing steps 301 to 304 if the process chamber leak rate is lower than a predetermined leak rate, and it is determined that the process chamber has not leaked. When the leakage rate of the process chamber is larger than or equal to the preset leakage rate, the reaction chamber is determined to be leaked, normal processing on the wafer cannot be carried out, at the moment, alarm information is output, and a user is informed to check the process chamber, so that the leakage problem is solved. Otherwise, when the leakage rate is lower than the preset leakage rate, the reaction chamber is determined not to be leaked, and the wafer can be normally processed.
With reference to the foregoing example, after receiving the zeroing instruction sent by the upper computer, the lower computer may obtain the leakage rate obtained by the previous detection, determine whether the leakage rate is lower than the preset leakage rate, determine that the process chamber has not leaked if the leakage rate is lower than the preset leakage rate, and continue to execute steps 301 to 304 if the leakage rate is qualified in the detection of the leakage rate. Otherwise, when the leakage rate is higher than the preset leakage rate, determining that the leakage rate is unqualified, and outputting alarm information to inform a user that the process chamber is leaked. Or the lower computer can store the detection result of the leakage rate, can acquire the detection result of the previous leakage rate detection after receiving the zeroing instruction, and directly judges whether the process chamber leaks or not according to the detection result.
In another embodiment, after receiving the zero setting instruction, the lower computer can directly perform leak rate detection to obtain the leak rate of the process chamber at the current moment, and when the leak rate obtained by detection is lower than a preset leak rate, it is determined that the process chamber is not leaked, and the leak rate is qualified. In combination with the above example, after receiving the zeroing instruction, the lower computer may control to close all valves on the process chamber, so that the process chamber is in a sealed state. Furthermore, the action of the vacuumizing device can be controlled to vacuumize the process chamber to a preset pressure. After evacuation to the preset pressure, the evacuation device may be stopped, and the pressure in the process chamber may be collected by the pressure gauge, and the collected pressure value may be used as an initial pressure value, which may be represented by symbol P1. The method comprises the steps of starting timing after collecting an initial pressure value P1, collecting pressure values in the preset time length again when the timing time length reaches the preset time length, taking the collected pressure values as end pressure values, wherein the end pressure values can be represented by a symbol P2, the preset time length can be represented by a symbol T, and the leakage rate of the preset time length can be calculated by a formula (P2-P1) ÷ T. The specific values of the preset pressure and the preset time period may be set according to the requirement, and the method for calculating the leakage rate according to the initial pressure value, the ending pressure value and the preset time period may include, but is not limited to, the above examples.
In the embodiment of the invention, before zeroing, the process chamber is determined not to leak, so that the zeroing result error caused by zeroing when the process chamber leaks can be avoided. In practical applications, the leakage rate of the process chamber is generally less than the preset leakage rate, and therefore, before zeroing, it may not be determined whether the process chamber leaks.
The embodiment of the invention also discloses conductor process equipment which comprises a process chamber, a vacuumizing device, a controller and a pressure gauge, wherein the controller is connected with the vacuumizing device and the pressure gauge;
the vacuumizing device is used for vacuumizing the process chamber; the pressure gauge is used for acquiring a pressure value in the process chamber;
the controller is used for starting timing after controlling the vacuumizing device to vacuumize the process chamber; acquiring a pressure value acquired by a pressure gauge under the condition that the timing duration reaches a preset duration; under the condition that the pressure value is not lower than the preset negative float judgment pressure value and is not higher than the preset positive float upper pressure limit, acquiring a plurality of pressure values collected by the pressure gauge again; and when the pressure values meet the preset pressure zero setting condition, executing the pressure zero setting operation.
Optionally, the controller includes an analog input board card, the pressure gauge is connected with the controller through the analog input board card, and the controller obtains the pressure value acquired by the pressure gauge through the analog input board card when the timing duration reaches a preset duration.
Optionally, the semiconductor process equipment further comprises a pressure controller, wherein the pressure controller is connected with the controller and the pressure gauge and is used for controlling the pressure in the process chamber according to the pressure value acquired by the pressure gauge;
the controller includes the communication integrated circuit board, and pressure controller passes through the communication integrated circuit board to be connected with the controller, and the controller passes through the communication integrated circuit board and reachs a plurality of pressure values that the pressure gauge was gathered again.
For understanding of the semiconductor processing equipment, reference may be made to the above examples, which are not described herein in detail.
Embodiments of the present application provide a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the pressure zeroing method described above.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or mobile device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or mobile device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or mobile device that comprises the element.
The pressure zeroing method and the conductor processing equipment provided by the embodiment of the invention are described in detail, and the principle and the implementation mode of the embodiment of the invention are explained by applying specific examples, and the description of the embodiment is only used for helping to understand the method and the core idea of the embodiment of the invention; meanwhile, for a person skilled in the art, according to the idea of the embodiment of the present invention, there may be a change in the specific implementation and application scope, and in summary, the content of the present specification should not be construed as a limitation to the embodiment of the present invention.
Claims (10)
1. The pressure zero setting method is characterized by being applied to semiconductor process equipment, wherein the semiconductor process equipment comprises a process chamber and a pressure gauge, and the pressure gauge is used for collecting the pressure value in the process chamber; the method comprises the following steps:
after the process chamber is vacuumized, timing is started;
acquiring a pressure value acquired by the pressure gauge under the condition that the timing duration reaches a preset duration;
under the condition that the pressure value is not lower than a preset negative float judgment pressure value and not higher than a preset positive float upper pressure limit, acquiring a plurality of pressure values collected by the pressure gauge again;
and when the pressure values meet a preset pressure zero setting condition, executing pressure zero setting operation.
2. The method of claim 1, wherein said re-acquiring the plurality of pressure values collected by the pressure gauge comprises:
acquiring pressure values acquired by the pressure gauge every preset sampling time to obtain a plurality of pressure values;
the pressure zeroing condition comprises:
the difference value between the maximum pressure value and the minimum pressure value in the plurality of pressure values is not higher than a preset pressure difference value.
3. The method of claim 2, wherein the pressure zeroing condition further comprises:
the minimum pressure value is not higher than a preset pressure threshold value.
4. The method of claim 1, wherein the pressure zeroing operation comprises:
thirdly, acquiring a pressure value acquired by the pressure gauge, and storing the pressure value as a zero pressure adjustment value;
identifying the zero pressure adjustment value as zero.
5. The method of claim 4, further comprising, prior to said identifying said zero-point pressure adjustment value as a zero point:
acquiring the stored zero point pressure adjustment value corresponding to the previous pressure zero setting operation;
and under the condition that the sum of the zero-point pressure adjustment value corresponding to the pressure zero setting operation at the current time and the zero-point pressure adjustment value corresponding to the pressure zero setting operation at the previous time is higher than a preset automatic zero setting pressure upper limit, informing a user of manually setting the pressure gauge.
6. The method of claim 1, wherein the semiconductor processing tool further comprises a pressure controller coupled to the pressure gauge for controlling the pressure within the process chamber based on the pressure value collected by the pressure gauge;
the obtaining of the pressure value collected by the pressure gauge includes: directly acquiring the collected pressure value from the pressure gauge;
the obtaining of the plurality of pressure values collected by the pressure gauge again includes: and acquiring the plurality of pressure values acquired by the pressure gauge through the pressure controller.
7. The method of any of claims 1-6, further comprising, prior to evacuating the process chamber:
and carrying out leakage rate detection on the process chamber, and vacuumizing the process chamber after the leakage rate is qualified.
8. The semiconductor process equipment is characterized by comprising a process chamber, a vacuumizing device, a controller and a pressure gauge, wherein the controller is connected with the vacuumizing device and the pressure gauge;
the vacuumizing device is used for vacuumizing the process chamber; the pressure gauge is used for collecting a pressure value in the process chamber;
the controller is used for starting timing after controlling the vacuumizing device to vacuumize the process chamber; acquiring a pressure value acquired by the pressure gauge under the condition that the timing duration reaches a preset duration; under the condition that the pressure value is not lower than a preset negative float judgment pressure value and not higher than a preset positive float upper pressure limit, acquiring a plurality of pressure values collected by the pressure gauge again; and when the pressure values meet a preset pressure zero setting condition, executing pressure zero setting operation.
9. The semiconductor processing equipment according to claim 8, wherein the controller comprises an input board card, the pressure gauge is connected with the controller through the input board card, and the controller obtains the pressure value collected by the pressure gauge through the input board card when the timing duration reaches the preset duration.
10. The semiconductor processing apparatus of claim 8, further comprising a pressure controller coupled to the controller and the pressure gauge for controlling a pressure within the processing chamber based on a pressure value collected by the pressure gauge;
the controller comprises a communication board card, the pressure controller is connected with the controller through the communication board card, and the controller acquires the pressure values acquired by the pressure gauge again through the communication board card.
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