CN113890374A - Self-adaptive adjusting high-performance positive and negative pulse electroplating power supply - Google Patents

Self-adaptive adjusting high-performance positive and negative pulse electroplating power supply Download PDF

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Publication number
CN113890374A
CN113890374A CN202111184270.9A CN202111184270A CN113890374A CN 113890374 A CN113890374 A CN 113890374A CN 202111184270 A CN202111184270 A CN 202111184270A CN 113890374 A CN113890374 A CN 113890374A
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anode
electrically connected
output
unit
power supply
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CN202111184270.9A
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CN113890374B (en
Inventor
胡栋明
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Shenzhen City Jinyuankang Industry Co ltd
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Shenzhen City Jinyuankang Industry Co ltd
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/22Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • H02M3/325Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
    • H02M3/335Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/33569Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/32Means for protecting converters other than automatic disconnection
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/22Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • H02M3/325Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
    • H02M3/335Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/33569Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
    • H02M3/33576Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/02Conversion of ac power input into dc power output without possibility of reversal
    • H02M7/04Conversion of ac power input into dc power output without possibility of reversal by static converters
    • H02M7/12Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/145Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means
    • H02M7/155Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
    • H02M7/162Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only in a bridge configuration
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H02M7/53871Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dc-Dc Converters (AREA)

Abstract

The invention provides a self-adaptive adjustment high-performance positive-negative pulse electroplating power supply, which comprises a plurality of output modules and a power supply input module, wherein the output modules are respectively arranged at different positions of an electroplating bath, each output module comprises an anode output unit and a cathode output unit, the output end of each anode output unit is electrically connected with an anode of a load, a current detection part is arranged between each anode output unit and the anode of the load, and the current detection part detects the change of electroplating current so as to feed back the ion concentration of electroplating solution and send an ion concentration change signal; the output end of the anode output unit is electrically connected with a voltage compensation unit, the output end of the voltage compensation unit is electrically connected with the anode of the load, and the voltage compensation unit responds to the ion concentration change signal and changes the output voltage to adjust the electroplating current of the anode of the load. The invention has the effect of adjusting the current during electroplating according to the concentration of metal ions in the electroplating solution.

Description

Self-adaptive adjusting high-performance positive and negative pulse electroplating power supply
Technical Field
The invention relates to the technical field of electroplating, in particular to a self-adaptive adjusting high-performance positive and negative pulse electroplating power supply.
Background
In general, the electroplating process mainly comprises an electrolytic process, wherein after current is input to an anode and a cathode, the cathode attracts metal ions in an electroplating solution and reductively plates on an object to be plated connected with the cathode, and simultaneously, the metal connected with the anode is oxidized and dissolved to provide more metal ions for the electroplating solution, so that the electroplating process is continuously carried out until enough plating layers are deposited on the object to be plated. By the electroplating function, the corrosion resistance and the abrasion resistance of the electroplated part as well as the conductivity, the smoothness, the heat resistance and the surface beauty can be effectively enhanced.
However, the inventor believes that in the electroplating power supply device in the prior art, metal ions are generated by consuming anode metal during electroplating, and the cathode rapidly absorbs the metal ions in the electroplating solution, so that the metal ions in a local position near the cathode in the electroplating solution are consumed, the conductivity of the electroplating solution in the local position is reduced, and the electroplating layer on the surface of the workpiece to be electroplated is prone to have different thicknesses, thereby affecting the electroplating effect.
Disclosure of Invention
The invention aims to provide a high-performance positive-negative pulse electroplating power supply capable of being adaptively adjusted, which has the characteristic of improving the problem that the electroplating effect is influenced by the reduction of the conductivity of an electroplating solution caused by the reduction of the concentration of metal cations in the electroplating solution.
The above object of the present invention is achieved by the following technical solutions:
a self-adaptive adjustable high-performance positive-negative pulse electroplating power supply comprises a plurality of output modules and a power supply input module for supplying power to the output modules, wherein the output modules are respectively arranged at different positions of an electroplating bath,
the output module comprises an anode output unit and a cathode output unit, the output end of the anode output unit is electrically connected with the anode of a load, a current detection part is arranged between the anode output unit and the anode of the load, and the current detection part is used for detecting the change of electroplating current so as to feed back the ion concentration of electroplating solution and sending an ion concentration change signal; the output end of the anode output unit is electrically connected with a voltage compensation unit used for compensating the output voltage, the output end of the voltage compensation unit is electrically connected with the anode of the load, and the voltage compensation unit responds to the ion concentration change signal and changes the output voltage so as to adjust the electroplating current of the anode of the load.
By adopting the technical scheme, the output modules are placed in the electroplating bath, and the anode output units in the output modules are respectively positioned at different positions of the electroplating bath so as to be responsible for electroplating the electroplated part from different directions. When the plating bath is used for plating, the current detection part detects the plating current during plating, because the conductivity of the plating solution is determined by metal ions in the plating solution, when the metal ion concentration between any one of the anode and the cathode is low, the conductivity of the plating solution decreases, the current discharged from the anode decreases, therefore, the electroplating current under the same voltage level is smaller, the current flowing through the current detection part is reduced, the current detection part sends out an ion concentration change signal, the voltage compensation unit in the same output module responds to the ion concentration change signal sent out by the current detection part to adjust the output voltage of the anode, the current on the anode of the load is increased, the anode electrolysis is accelerated to form metal ions which are supplemented into the electroplating solution, so as to increase the concentration of metal ions in the plating liquid in the vicinity of the anode, thereby increasing the plating current during plating.
Preferably, the current detection unit includes a light emitting bulb D1 and a first voltage dividing resistor R19 electrically connected to the light emitting bulb D1, the light emitting bulb D1 is located between the first voltage dividing resistor R19 and the anode output unit, the light emitting bulb D1 is electrically connected to the output end of the anode output unit, one end of the first voltage dividing resistor R19 far from the light emitting bulb D1 is electrically connected to the anode of the load, and the light emitting bulb D1 feeds back the change of the ion concentration in the plating solution through the luminance of the light emission.
By adopting the technical scheme, when the electroplating bath is used for electroplating, electroplating current flows through the light-emitting bulb D1 to enter the electroplating solution, and when the concentration of metal ions in the electroplating solution is low, the current flowing through the light-emitting bulb D1 is small, and the brightness of the light-emitting bulb D1 is low. When the concentration of the metal ions in the plating liquid is high, the current flowing through the light-emitting bulb D1 is large, and the luminance of the light-emitting bulb D1 is bright.
Preferably, the voltage compensation unit includes an operational amplifier A3 and a switch control unit for controlling on/off of the operational amplifier A3, a unidirectional input terminal of the operational amplifier A3 is electrically connected to the switch control unit, an output terminal of the operational amplifier A3 is electrically connected to an anode of a load, and a feedback amplification resistor set is electrically connected between an inverting input terminal and an output terminal of the operational amplifier A3.
By adopting the technical scheme, the operational amplifier A3 and the feedback amplification resistor group are arranged, when the switch control part is switched on, the voltage of the output end of the anode output unit is amplified by the operational amplifier A3 and the feedback amplification resistor group, so that the voltage on the anode of the load is increased, and the electrolysis of the metal plated on the anode is accelerated.
Preferably, the switch control part includes a photo resistor RL1 matched with the light emitting bulb D1 and a field effect transistor Q1 electrically connected with the photo resistor RL1, the photo resistor RL1 is electrically connected to a base of the field effect transistor Q1, an emitter and a collector of the field effect transistor Q1 are respectively and electrically connected to a same-direction input end of the anode output unit and the operational amplifier A3, an emitter resistor R18 is connected in series between the emitter of the field effect transistor Q1 and the anode output unit, and the photo resistor RL1 is used for sensing the brightness of the light emitting bulb D1 to adjust the base voltage of the field effect transistor Q1 so as to control the on-off of the field effect transistor Q1.
By adopting the technical scheme, the resistance value of the photosensitive resistor RL1 is controlled by the brightness of the light-emitting bulb D1, when the brightness of the light-emitting bulb D1 is brighter, the metal ion concentration in electroplating solution is higher, the resistance value of the photosensitive resistor RL1 is smaller, the field effect transistor Q1 is turned off, the current flowing through the operational amplifier A3 and the feedback amplification resistor group is zero, and the output voltage is not increased. When the light-emitting bulb D1 is dark, the metal ion concentration in the electroplating solution is low, the resistance value of the photosensitive resistor RL1 is large, the field-effect tube Q1 is conducted, and the output voltage is increased through the amplification effect of the operational amplifier A3.
Preferably, the output module further includes a first transformer CT1 electrically connected to the power input module, and two ends of a secondary coil of the first transformer CT1 are electrically connected to the anode output unit and the cathode output unit, respectively.
By adopting the technical scheme, the two ends of the secondary coil of the first transformer CT1 are respectively and electrically connected with the anode output unit and the cathode output unit, the electroplating device is used for electroplating normally, and when a forward current flows, the current flows through the anode output unit, the current detection part and the load to the cathode output unit in sequence. When the current of the negative half cycle flows, the current flows through the cathode output unit, the current detection part and the load to the anode output unit in sequence.
Preferably, the output module further includes a reverse conducting portion for conducting current in a reverse direction, and two ends of the reverse conducting portion are electrically connected to the secondary coil of the first transformer CT1 and the electrode of the load, respectively.
By adopting the above technical scheme, when the first transformer CT1 outputs a forward current, the reverse conducting part electrically connected with the anode output unit does not work, and the reverse conducting part electrically connected with the cathode output unit works and conducts. When the first transformer CT1 outputs a reverse current, the reverse conducting portion electrically connected to the cathode output unit does not work, and the reverse conducting portion electrically connected to the anode output unit works.
Preferably, the power input module includes a rectifying unit electrically connected to an external power source and an inverting unit connected to the rectifying unit, and the inverting unit is electrically connected to the primary coil of the first transformer CT1 and is configured to convert the electric energy from the rectifying unit into an alternating current to provide the alternating current to the first transformer CT 1.
By adopting the technical scheme, the rectifying unit and the inverting unit are respectively used for converting the external alternating current electric energy into alternating current with actually required frequency and peak value and inputting the alternating current into the first transformer CT 1.
Preferably, a filtering unit is arranged between the rectifying unit and the inverting unit.
By adopting the technical scheme, the filtering unit is used for reducing the ripple coefficient of the alternating current output by the rectifying unit, so that the current output by the rectifying unit is smoother.
Preferably, a first inductor L0 is disposed between the inverter unit and the primary winding of the first transformer CT 1.
By adopting the technical scheme, the leakage inductance of the primary coil of the first transformer CT1 is matched with the first inductor L0 to realize zero-voltage zero-current switching on or off.
Preferably, a second inductor L1 is disposed between the output module and the anode of the load.
By adopting the technical scheme, the second inductor L1 and the leakage inductance of the secondary coil of the first transformer CT1 are matched together to absorb the surge, so that the peak is suppressed, and the oscillation is eliminated.
In summary, the present application includes at least one of the following beneficial technical effects:
1. by arranging the current detection part, the switch control part and the operational amplifier A3 at the output end, when the conductive current in the electroplating solution is detected to be small, the operational amplifier A3 amplifies the output voltage to increase the dissolution of the anode metal and improve the metal ions in the solution.
2. When the pulse plating power supply is used, the effect of forming pulse current on the cathode and the anode of a load can be realized only by controlling the on-off of the power switch tube in the inverter unit, and the reliability of the pulse plating power supply is improved.
Drawings
FIG. 1 is a schematic diagram of a pulse power supply circuit in the present embodiment;
FIG. 2 is a schematic circuit diagram of the power input module of the present invention;
fig. 3 is a circuit schematic of the output module of the present invention.
Description of reference numerals: 1. an output module; 11. an anode output unit; 111. a filtering section; 12. a current detection unit; 13. a voltage compensation unit; 14. a switch control unit; 15. a feedback amplifying resistor group; 16. a cathode output unit; 17. a reverse conducting part; 2. a power input module; 21. a rectifying unit; 22. a filtering unit; 23. an inversion unit; 3. and a control module.
Detailed Description
The present invention is described in further detail below with reference to figures 1-3.
A self-adaptive adjusting high-performance positive and negative pulse electroplating power supply refers to fig. 1 and comprises a plurality of output modules 1 and a power supply input module 2 for supplying electric energy to the output modules 1. Wherein, a plurality of output module 1 connects in parallel each other, and a plurality of output module 1 distributes in the different positions in the plating bath for respectively follow different angles and carry out the electroplating to plated item. In this embodiment, there are four output modules 1, the four output modules 1 are respectively located on four sides of the electroplating bath, and the number of the output modules 1 can be increased according to actual needs.
Referring to fig. 2, the rectifying unit 21 is electrically connected to an external ac power source. In this embodiment, the rectifying unit 21 is a three-phase rectifying bridge, and the three-phase rectifying bridge is composed of two groups of thyristors. The first group of thyristors comprises a thyristor VT1, a thyristor VT3 and a thyristor VT5 which are connected in a common cathode mode, the second group of thyristors comprises a thyristor VT2, a thyristor VT4 and a thyristor VT6 which are connected in a common anode mode, the anode of the first group of thyristors and the cathode of the second group of thyristors are electrically connected with the a phase, the b phase and the c phase of an external alternating current power supply, and the output current of the three-phase rectifier bridge is the forward conduction of the thyristor connected with the highest potential phase in the 3 phases of electricity in the external alternating current power supply at any moment to form forward current. The forward current flows to the thyristor connected with the phase with the lowest potential in the 3-phase current after flowing through the load connected with the three-phase rectifier bridge, thereby forming a loop.
Referring to fig. 1, in addition, two sets of thyristors are all electrically connected with a control module 3, and the control module 3 includes an MCU main control chip, in this embodiment, the model of the MCU main control chip is EG8010, the gate poles of the two sets of thyristors are electrically connected with the first control pin of the MCU main control chip, and the MCU main control chip controls the on-off of the two sets of thyristors by controlling the gate pole signals of the thyristors.
Referring to fig. 2, the output end of the three-phase rectifier bridge is electrically connected to a filter unit 22, one end of the filter unit 22 is electrically connected to the cathode of the first group of thyristors, and the other end of the filter unit 22 is electrically connected to the input end of the inverter unit 23. Specifically, the filter unit 22 includes a pi-type LC filter circuit composed of a filter capacitor C1, a filter capacitor C2, and a filter inductor L4, and two ends of the filter inductor L4 are electrically connected to the cathode of the first group of thyristors and the inverter unit 23, respectively. One end of the filter capacitor C1 is grounded, the other end of the filter capacitor C1 is electrically connected between the filter inductor L4 and the inverter unit 23, one end of the filter capacitor C2 is grounded, and the other end of the filter capacitor C2 is electrically connected between the filter inductor L4 and the cathode of the first group of thyristors. The filtering unit 22 is configured to reduce an ac ripple coefficient output by the three-phase rectifier bridge, so that a dc current output by the three-phase rectifier bridge is smoother.
Referring to fig. 2, the inverter unit 23 includes a first switching tube IGBT1, a second switching tube IGBT2, a third switching tube IGBT3, and a fourth switching tube IGBT4 as power switching tubes. Specifically, the second switching tube IGBT2 and the fourth switching tube IGBT4 form a first arm, and the first switching tube IGBT1 and the third switching tube IGBT3 form a second arm; the collectors of the first switching tube IGBT1 and the second switching tube IGBT2 are electrically connected to the positive pole of the three-phase rectifier bridge, and the emitters of the third switching tube IGBT3 and the fourth switching tube IGBT4 are electrically connected to the negative pole of the three-phase rectifier bridge. An emitter of the first switching tube IGBT1 is electrically connected to a collector of the third switching tube IGBT3, and a first output terminal of the inverter unit 23 is disposed between the first switching tube IGBT1 and the third switching tube IGBT 3. An emitter of the second switching tube IGBT2 is electrically connected to a collector of the fourth switching tube IGBT4, and a second output end of the inverter unit 23 is disposed between the second switching tube IGBT2 and the fourth switching tube IGBT 4.
The gates of the first switch tube IGBT1, the second switch tube IGBT2, the third switch tube IGBT3 and the fourth switch tube IGBT4 in the inverter unit 23 are all electrically connected to a second control pin of the MCU main control chip, and the output voltage frequency is adjusted by setting the on-off frequency of the MCU main control chip to control the first switch tube IGBT1, the second switch tube IGBT2, the third switch tube IGBT3 and the fourth switch tube IGBT 4. So that the output voltage frequency of the output module 1 is adjustable.
Referring to fig. 3, the output module 1 includes transformers for transforming, the transformers including a first transformer CT1, a second transformer CT2, a third transformer CT3, and a fourth transformer CT 4. Two ends of the primary coil of the first transformer CT1 are electrically connected to the first output end and the second output end of the inverter unit 23, respectively. Specifically, the first output terminal is electrically connected to one end of the primary winding of the first transformer CT1 after passing through the series capacitor C3, and the capacitor C3 is used for isolating the dc power in the circuit. The second output end is electrically connected with the other end of the primary coil of the first transformer CT1 after being connected in series with the first inductor L1, and zero-voltage and zero-current switching-on or switching-off is realized through the leakage inductance of the first inductor L1 and the primary coil of the first transformer CT 1.
When the first switching tube IGBT1 and the fourth switching tube IGBT4 in the inverter unit 23 are turned on and the second switching tube IGBT2 and the third switching tube IGBT3 are turned off, the direct current flows through the first switching tube IGBT1, the first inductor L1, the primary coil, the capacitor C3, and the fourth switching tube IGBT4 in sequence. When the second switching tube IGBT2 and the third switching tube IGBT3 are turned on and the first switching tube IGBT1 and the fourth switching tube IGBT4 are turned off, the direct current flows through the second switching tube IGBT2, the capacitor C3, the primary coil, the first inductor L1, and the third switching tube IGBT3 in sequence, so that alternating current with a changing current direction is formed.
Referring to fig. 1 and 3, the output module 1 further includes an anode output unit 11 and a cathode output unit 16, and the anode output unit 11 and the cathode output unit 16 are respectively electrically connected to two ends of the secondary coil of the first transformer CT 1. The output end of the anode output unit 11 is electrically connected with the anode of the load, and the output end of the cathode output unit 16 is electrically connected with the cathode of the load. A second inductor L2 is arranged between the output end of the anode output unit 11 and the load anode, and the second inductor L2 is used for absorbing surge, suppressing peak and eliminating oscillation in cooperation with leakage inductance of the secondary coil of the first transformer CT 1.
Specifically, referring to fig. 3, the anode output unit 11 includes a filter unit 111 for filtering an interference signal in the secondary coil, an input end of the filter unit 111 is electrically connected to a diode VD1, and the diode VD1 is used for conducting a forward current. The cathode of the diode VD1 is electrically connected to the filter unit 111, and the anode of the diode VD1 is electrically connected to the secondary coil. The filter unit 111 includes a high-Q band-pass filter composed of two high-input-impedance operational amplifiers a1 and a 2. The output of operational amplifier A1 is connected in series with the inverting input of operational amplifier A2. The output end of the operational amplifier a2 is electrically connected to the resistor R14, the other end of the resistor R14 is electrically connected to the positive input end of the operational amplifier a1, and the resistor R14 is used to improve the quality factor of the filter unit 111 by positive feedback, so that the filter unit 111 has better frequency-selective characteristics. In this embodiment, the operational amplifier is SF 356.
Referring to fig. 3, the output end of the filter portion 111 is electrically connected to a current detection portion 12 for detecting the magnitude of the plating current, the current detection portion 12 includes a light-emitting bulb D1 for displaying the magnitude of the plating current and a first voltage-dividing resistor R19 electrically connected to the light-emitting bulb D1, and one end of the first voltage-dividing resistor R19 away from the light-emitting bulb D1 is electrically connected to the anode of the load. When the electroplating is performed, the forward electroplating current in the anode output unit 11 flows through the diode VD1, the filter part 111, the light-emitting bulb D1 and the first voltage-dividing resistor R19 in sequence, and then flows into the electroplating solution from the anode of the load to electroplate the electroplated part. When the concentration of metal ions in the plating solution between the anode connected to the anode output unit 11 and the cathode of the load is low, the conductivity of the plating solution is made low, so that the current flowing into the light-emitting bulb D1 and the first voltage-dividing resistor R19 is small, and the luminance of light emitted by the light-emitting bulb D1 is low. When the concentration of metal ions in the plating solution between the anode connected to this anode output unit 11 and the cathode of the load is high, the conductivity of the plating solution is high, and the light-emitting bulb D1 emits light with a high luminance.
Referring to fig. 3, a voltage compensation unit 13 is electrically connected to both ends of the current detection unit 12, and the voltage compensation unit 13 includes an operational amplifier A3 and a switch control unit 14 for controlling on/off of the operational amplifier A3. The switch control unit 14 includes a photo resistor RL1 and a field effect transistor Q1 electrically connected to the photo resistor RL1, the photo resistor RL1 is electrically connected to a base of the field effect transistor Q1, an emitter and a collector of the field effect transistor Q1 are respectively electrically connected to the anode output unit 11 and a same-direction input end of the operational amplifier a3, and an emitter resistor R18 is connected in series between the emitter of the field effect transistor Q1 and the anode output unit 11. In this embodiment, the maximum resistance of the photo resistor RL1 is the same as the emitter resistor R18, and the fet Q1 is a PNP fet.
A feedback amplification resistor group 15 is arranged between the output end of the operational amplifier A3 and the equidirectional input end, the feedback amplification resistor group 15 comprises a first amplification resistor R111 and a second amplification resistor R112, one end of the first amplification resistor R111 and one end of the second amplification resistor R112 after being connected in series are electrically connected with the output end of the operational amplifier A3, and one end of the first amplification resistor R111 and one end of the second amplification resistor R112 after being connected in series are grounded. The non-inverting input terminal of the operational amplifier a3 is electrically connected between the first amplifying resistor R111 and the second amplifying resistor R112. The amplification factor of the operational amplifier a3 is (first amplification resistor R111+ second amplification resistor R112)/second amplification resistor R112.
When electroplating discharge is carried out, current flows through the light-emitting bulb D1 and the first voltage dividing resistor R19, the light-emitting bulb D1 is conducted to emit light, when the concentration of metal ions in electroplating solution is higher, the conductivity of the electroplating solution is higher, so that the brightness of the light-emitting bulb D1 is higher, the resistance value of the photoresistor RL1 is the maximum, at the moment, the partial voltage of the photoresistor RL1 and the partial voltage of the emitter resistor R18 are the same, the field effect transistor Q1 is in a cut-off state, and the operational amplifier A3 does not work. When the concentration of metal ions in the electroplating solution is low, the current flowing through the light-emitting bulb D1 is small, the conductivity of the electroplating solution is low, the brightness of the light-emitting bulb D1 is low, the resistance value of the photoresistor RL1 is gradually reduced, the field-effect triode Q1 is in a conducting state, the operational amplifier A3 starts to work, the output voltage of an anode electrically connected with the output end of the operational amplifier A3 is increased, the electroplated metal on the anode is dissolved quickly, the concentration of the metal ions near the anode is increased, the diffusion of the concentration of the metal ions is accelerated, and the concentration of the metal ions between the anode and a cathode of a load is more uniform.
Referring to fig. 3, the output module 1 further comprises a reverse conducting portion 17, the reverse conducting portion 17 being configured to conduct current through the reverse conducting portion 17 when the pulse current is reversed. The reverse conducting parts 17 are two, the two reverse conducting parts 17 are respectively connected between the secondary coil of the first transformer CT1 and the electrode of the load, wherein the reverse conducting part 17 electrically connected with the anode of the load comprises a diode VD2 and a first reverse resistor R113, the diode VD2 is connected in series with the first reverse resistor R113, the cathode of the diode VD2 is electrically connected with the secondary coil, and the anode of the diode VD2 is electrically connected with the anode of the load after being connected in series with the first reverse resistor R113. The reverse conducting part 17 electrically connected to the cathode of the load includes a diode VD4 and a second reverse resistor R213, the cathode of the diode VD4 is electrically connected to the secondary winding of the other end of the first transformer CT1, and the anode of the diode VD4 and the second reverse resistor R213 are electrically connected to the cathode of the load.
The cathode output unit 16 of the output unit is electrically connected to the other end of the secondary coil of the first transformer CT1, and the output end of the cathode output unit 16 is also electrically connected to the current detection unit 12 and the voltage compensation unit, wherein the current detection unit 12 electrically connected to the cathode output unit 16 includes a light emitting bulb D2 and a second voltage dividing resistor R29, the cathode output unit 16 and the anode output unit 11 are identical in composition and connection, and the current detection unit 12 and the voltage compensation unit electrically connected to the cathode output unit 16 are identical in composition and connection with the current detection unit 12 and the voltage compensation unit electrically connected to the anode output.
When the metal ion concentration in the plating liquid is normal and the luminance of the light-emitting bulb L1 is maximum, the voltage compensation portion is not turned on. At this time, when the first transformer CT1 outputs a forward current, the current flows into the plating bath from the anode of the load after passing through the filter part 111, the light-emitting bulb D1, the first voltage-dividing resistor R19 and the second inductor L2 in the anode output unit 11 in sequence, so that the anode metal dissolution-formed metal ions are diffused in the plating solution, and then flows back to the secondary coil from the diode VD4 and the second reverse resistor R213 in the reverse conducting part 17 electrically connected to the cathode of the load.
When the first transformer CT1 outputs a reverse current, the current flows in order from the cathode of the load into the plating bath through the filter part 111, the light-emitting bulb D2 and the second voltage-dividing resistor R29 in the cathode output unit 16, so that the plated metal dissolved in the cathode is diffused in the plating solution, and then flows back to the secondary coil from the diode VD2 and the first reverse resistor R113 in the reverse conducting part 17 electrically connected to the anode of the load.
The implementation principle of the application is as follows: the four output modules 1 are placed in the electroplating bath, and the anode electrical connection ends of the four output modules 1 and the load are respectively positioned on four opposite side surfaces of the electroplating bath so as to be responsible for electroplating the electroplated part from four directions.
When the electroplating bath is used for electroplating, the rectifying unit 21 is connected with an external alternating current power supply, and the MCU main control chip is arranged to control the rectifying unit 21 and the inverter unit 23 to be opened and closed, so that the desired output current frequency is output and output from a secondary coil of the first transformer CT 1.
When the metal ion concentration between the anode of the load and the cathode of the load electrically connected to any one of the four output modules 1 is low, the conductivity of the region near the electrode is reduced.
At this time, when the first transformer CT1 outputs a forward current, the output current of the anode is decreased, the current flowing through the light bulb D1 connected to the anode is decreased, the brightness of the light bulb D1 is decreased, the photo resistor RL1 in the same output module 1 is decreased in resistance value in response to the change in brightness of the light bulb D1, the field effect transistor Q1 is turned on, the output voltage of the anode is increased by the operational amplifier a3, the current on the anode of the load is increased, and the electrode is accelerated to electrolyze to form metal ions to be supplemented to the plating solution, so as to increase the average concentration of the metal ions in the plating solution near the anode and the cathode of the load, and improve the conductivity of the region.
When the first transformer CT1 outputs reverse current, the current of the light bulb D2 is reduced, the brightness of the light bulb D2 is reduced, the resistance value of the photosensitive resistor RL2 in the same output module 1 is reduced in response to the brightness change of the light bulb D2, the field effect transistor Q2 is conducted, the output voltage of the cathode is increased by the operational amplifier A6, the current on the cathode of the load is increased, the electroplated layer on the electroplated part is dissolved, and the conductivity of the electroplated liquid is improved.
The transformer alternately outputs forward and reverse pulse currents to repeatedly electroplate and dissolve the electroplated layer on the electroplated part, so that a more compact, bright and uniform electroplated layer is obtained.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.

Claims (10)

1. A self-adaptive adjustable high-performance positive-negative pulse electroplating power supply is characterized by comprising a plurality of output modules (1) and a power supply input module (2) for supplying electric energy to the output modules (1), wherein the output modules (1) are respectively arranged at different positions of an electroplating bath,
the output module (1) comprises an anode output unit (11) and a cathode output unit (16), the output end of the anode output unit (11) is electrically connected with a load anode, a current detection part (12) is arranged between the anode output unit (11) and the load anode, and the current detection part (12) is used for detecting the change of electroplating current so as to feed back the ion concentration of the electroplating solution and sending an ion concentration change signal; the output end of the anode output unit (11) is electrically connected with a voltage compensation unit (13) used for compensating output voltage, the output end of the voltage compensation unit (13) is electrically connected with the anode of the load, and the voltage compensation unit (13) responds to the ion concentration change signal and changes the output voltage so as to adjust the electroplating current of the anode of the load.
2. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply of claim 1, characterized in that: the current detection part (12) comprises a light-emitting bulb D1 and a first voltage-dividing resistor R19 electrically connected with the light-emitting bulb D1, the light-emitting bulb D1 is positioned between the first voltage-dividing resistor R19 and an anode output unit (11), the light-emitting bulb D1 is electrically connected with the output end of the anode output unit (11), one end of the first voltage-dividing resistor R19, which is far away from the light-emitting bulb D1, is electrically connected with the anode of a load, and the light-emitting bulb D1 feeds back the change of ion concentration in the electroplating solution through the luminous brightness.
3. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply according to claim 2, characterized in that: the voltage compensation unit (13) comprises an operational amplifier A3 and a switch control part (14) for controlling the on-off of the operational amplifier A3, wherein the equidirectional input end of the operational amplifier A3 is electrically connected with the switch control part (14), the output end of the operational amplifier A3 is electrically connected with the anode of a load, and a feedback amplification resistor group (15) is electrically connected between the reverse input end and the output end of the operational amplifier A3.
4. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply according to claim 3, characterized in that: the switch control part (14) comprises a photosensitive resistor RL1 matched with the light-emitting lamp bulb D1 and a field-effect tube Q1 electrically connected with the photosensitive resistor RL1, the photosensitive resistor RL1 is electrically connected with the base of the field-effect tube Q1, the emitter and the collector of the field-effect tube Q1 are respectively and electrically connected with the equidirectional input ends of the anode output unit (11) and the operational amplifier A3, an emitter resistor R18 is connected in series between the emitter of the field-effect tube Q1 and the anode output unit (11), and the photosensitive resistor RL1 is used for sensing the brightness of the light-emitting lamp bulb D1 to adjust the base voltage of the field-effect tube Q1 so as to control the on-off of the field-effect tube Q1.
5. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply of claim 1, characterized in that: the output module (1) further comprises a first transformer CT1 electrically connected to the power input module (2), and two ends of a secondary coil of the first transformer CT1 are electrically connected to the anode output unit (11) and the cathode output unit (16), respectively.
6. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply of claim 1, characterized in that: the output module (1) further comprises a reverse conducting part (17) for conducting current in a reverse direction, and two ends of the reverse conducting part (17) are respectively and electrically connected to the secondary coil of the first transformer CT1 and the electrode of the load.
7. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply of claim 6, characterized in that: the power input module (2) comprises a rectifying unit (21) electrically connected with an external power supply and an inverting unit (23) connected with the rectifying unit (21), wherein the inverting unit (23) is electrically connected with a primary coil of the first transformer CT1 and is used for converting electric energy from the rectifying unit (21) into alternating current so as to provide the alternating current for the first transformer CT 1.
8. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply according to claim 7, characterized in that: and a filtering unit (22) is arranged between the rectifying unit (21) and the inverting unit (23).
9. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply according to claim 7, characterized in that: a first inductor L0 is arranged between the inverter unit (23) and the primary coil of the first transformer CT 1.
10. The self-adaptive adjusting high-performance positive and negative pulse electroplating power supply of claim 1, characterized in that: and a second inductor L1 is arranged between the output module (1) and the anode of the load.
CN202111184270.9A 2021-10-11 2021-10-11 Self-adaptive adjusting high-performance positive and negative pulse electroplating power supply Active CN113890374B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544876A (en) * 1983-12-16 1985-10-01 Solavolt International Voltage regulator
CN1402419A (en) * 2001-08-17 2003-03-12 株式会社三社电机制作所 Electroplating supply unit
US20100164393A1 (en) * 2008-12-31 2010-07-01 Delta Electronics, Inc. Light source driving circuit
CN102223090A (en) * 2011-06-17 2011-10-19 湖南大学 High-power simplified electrolytic and electroplating high-frequency switch power supply and control method thereof
CN106793342A (en) * 2017-02-15 2017-05-31 江南大学 A kind of long-life LED drive power based on ripple compensation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544876A (en) * 1983-12-16 1985-10-01 Solavolt International Voltage regulator
CN1402419A (en) * 2001-08-17 2003-03-12 株式会社三社电机制作所 Electroplating supply unit
US20100164393A1 (en) * 2008-12-31 2010-07-01 Delta Electronics, Inc. Light source driving circuit
CN102223090A (en) * 2011-06-17 2011-10-19 湖南大学 High-power simplified electrolytic and electroplating high-frequency switch power supply and control method thereof
CN106793342A (en) * 2017-02-15 2017-05-31 江南大学 A kind of long-life LED drive power based on ripple compensation

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