CN113889750A - Liquid crystal antenna - Google Patents
Liquid crystal antenna Download PDFInfo
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- CN113889750A CN113889750A CN202111152609.7A CN202111152609A CN113889750A CN 113889750 A CN113889750 A CN 113889750A CN 202111152609 A CN202111152609 A CN 202111152609A CN 113889750 A CN113889750 A CN 113889750A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
Abstract
The invention discloses a liquid crystal antenna, which comprises a first substrate, a second substrate, a microstrip line, a grounding metal layer, a liquid crystal layer, a feed network, a radiation electrode and a medium isolation layer, wherein the first substrate and the second substrate are arranged oppositely, and the medium isolation layer is positioned on one side of the microstrip line close to the liquid crystal layer and/or on one side of the grounding metal layer close to the liquid crystal layer. According to the liquid crystal antenna provided by the embodiment of the invention, the dielectric isolation layer is arranged on one side of the microstrip line close to the liquid crystal layer and/or one side of the grounding metal layer close to the liquid crystal layer, so that the microstrip line and/or the grounding metal layer are isolated from the liquid crystal layer, the liquid crystal layer is prevented from being hydrolyzed due to the contact between the microstrip line and/or the grounding metal layer and the liquid crystal layer, the reliability of the liquid crystal antenna is improved, and the use performance is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of communication, in particular to a liquid crystal antenna.
Background
The liquid crystal antenna is a novel reconfigurable antenna system formed by combining a traditional microstrip patch antenna and a liquid crystal material, liquid crystal and the microstrip line are combined, the arrangement of the liquid crystal is adjusted, then the relative dielectric constant of the liquid crystal is adjusted, a liquid crystal phase shifter is formed, and the liquid crystal phase shifter is combined with a patch radiator to form a liquid crystal antenna structure capable of performing electric scanning. The liquid crystal antenna can be widely applied to the fields of low-orbit satellite receiving antennas, vehicle-mounted antennas, base station antennas and the like.
The metal layer in the existing liquid crystal antenna is easy to influence with other environments, and the use performance of the liquid crystal antenna is adversely affected.
Disclosure of Invention
The invention provides a liquid crystal antenna, which is used for improving the performance of the liquid crystal antenna.
The embodiment of the invention provides a liquid crystal antenna, which comprises:
the first substrate and the second substrate are oppositely arranged;
the microstrip line is positioned on one side of the second substrate, which is close to the first substrate;
the grounding metal layer is positioned on one side of the first substrate close to the second substrate;
a liquid crystal layer between the first substrate and the second substrate;
the feed network is positioned on one side of the first substrate, which is far away from the microstrip line; or the feed network and the microstrip line are arranged on the same layer, and the feed network is coupled with the microstrip line;
the radiation electrode is positioned on one side of the first substrate far away from the second substrate, and the vertical projection of the grounding metal layer on the second substrate is at least partially overlapped with the vertical projection of the radiation electrode on the second substrate;
and the dielectric isolation layer is positioned on one side of the microstrip line close to the liquid crystal layer, and/or the dielectric isolation layer is positioned on one side of the grounding metal layer close to the liquid crystal layer.
According to the liquid crystal antenna provided by the embodiment of the invention, the dielectric isolation layer is arranged on one side of the microstrip line close to the liquid crystal layer and/or one side of the grounding metal layer close to the liquid crystal layer, so that the microstrip line and/or the grounding metal layer are isolated from the liquid crystal layer, the liquid crystal layer is prevented from being hydrolyzed due to the contact between the microstrip line and/or the grounding metal layer and the liquid crystal layer, the reliability of the liquid crystal antenna is improved, and the use performance is improved.
Drawings
Fig. 1 is a schematic structural diagram of a liquid crystal antenna according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1;
fig. 3 is a schematic partial cross-sectional structure diagram of a liquid crystal antenna according to an embodiment of the present invention;
fig. 4 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the present invention;
fig. 5 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the invention;
fig. 6 is a schematic partial cross-sectional view illustrating a liquid crystal antenna according to another embodiment of the present invention;
fig. 7 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the invention;
fig. 8 is a schematic partial cross-sectional view illustrating a liquid crystal antenna according to another embodiment of the present invention;
fig. 9 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the invention;
fig. 10 is a schematic partial cross-sectional view illustrating a liquid crystal antenna according to another embodiment of the present invention;
fig. 11 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the invention;
fig. 12 is a schematic partial cross-sectional view illustrating a liquid crystal antenna according to another embodiment of the present invention;
fig. 13 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a liquid crystal antenna according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of a cross section of fig. 1 along a direction a-a', fig. 3 is a schematic structural diagram of a partial cross section of a liquid crystal antenna according to an embodiment of the present invention, and fig. 4 is a schematic structural diagram of a partial cross section of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 1, fig. 2, fig. 3, and fig. 4, the liquid crystal antenna according to an embodiment of the present invention includes a first substrate 10 and a second substrate 11 that are disposed opposite to each other, and further includes a microstrip line 12, a ground metal layer 13, a liquid crystal layer 14, a feed network 15, a radiation electrode 16, and a dielectric isolation layer 17. The microstrip line 12 is located on one side of the second substrate 11 close to the first substrate 10; the grounding metal layer 13 is positioned on one side of the first substrate 10 close to the second substrate 11; the liquid crystal layer 14 is positioned between the first substrate 10 and the second substrate 11; as shown in fig. 2, the feeding network 15 is located on a side of the first substrate 10 away from the microstrip line 12, or, as shown in fig. 3, the feeding network 15 and the microstrip line 12 are disposed on the same layer, and the feeding network 15 is coupled with the microstrip line 12; the radiation electrode 16 is positioned on one side of the first substrate 10 far away from the second substrate 11, and the vertical projection of the grounding metal layer 13 on the second substrate 11 at least partially overlaps with the vertical projection of the radiation electrode 16 on the second substrate 11; as shown in fig. 2 and 3, a dielectric isolation layer 17 is located on the side of microstrip line 12 close to liquid crystal layer 14, and/or, as shown in fig. 4, dielectric isolation layer 17 is located on the side of ground metal layer 13 close to liquid crystal layer 14.
Specifically, as shown in fig. 1 and fig. 2, a liquid crystal layer 14 is disposed between the first substrate 10 and the second substrate 11, a microstrip line 12 is disposed on a side of the liquid crystal layer 14 close to the second substrate 11, and a ground metal layer 13 is disposed on a side of the liquid crystal layer 14 close to the first substrate 10, in this embodiment, by applying voltage signals to the microstrip line 12 and the ground metal layer 13, respectively, an electric field is formed between the microstrip line 12 and the ground metal layer 13, and the electric field can drive liquid crystal molecules 141 in the liquid crystal layer 14 to deflect, so as to change a dielectric constant of the liquid crystal layer 14. The microstrip line 12 is further configured to transmit a radio frequency signal, the radio frequency signal is transmitted in the liquid crystal layer 14 between the microstrip line 12 and the ground metal layer 13, and due to a change in a dielectric constant of the liquid crystal layer 14, the radio frequency signal transmitted on the microstrip line 12 is shifted in phase, so that a phase of the radio frequency signal is changed, and a phase shift function of the radio frequency signal is achieved.
It should be noted that the liquid crystal antenna may include one or more microstrip lines 12, for example, as shown in fig. 1, the liquid crystal antenna includes 4 microstrip lines 12 distributed in an array, and in other embodiments, a person skilled in the art may set the number, the shape, and the layout of the microstrip lines 12 according to actual requirements, which is not limited in the embodiment of the present invention.
With continued reference to fig. 1 and fig. 2, a feeding network 15 is disposed on a side of the first substrate 10 away from the microstrip lines 12, the feeding network 15 is coupled to the microstrip lines 12, and the feeding network 15 is configured to transmit a radio frequency signal to each microstrip line 12, where the feeding network 15 may be distributed in a tree shape and includes a plurality of branches, and one branch provides a radio frequency signal for one microstrip line 12. The ground metal layer 13 includes a first hollow portion 131, a vertical projection of the feed network 15 on the first substrate 10 covers a vertical projection of the first hollow portion 131 on the first substrate 10, a radio frequency signal transmitted by the feed network 15 is coupled to the microstrip line 12 at the first hollow portion 131 of the ground metal layer 13, and a deflection of a liquid crystal molecule 141 in the liquid crystal layer 14 is controlled to change a dielectric constant of the liquid crystal layer 14, so that a phase shift of the radio frequency signal on the microstrip line 12 is realized.
As shown in fig. 3, optionally, the feeding network 15 may also be disposed on the same layer as the microstrip line 12, and the feeding network 15 is coupled to the microstrip line 12, which may be set by a person skilled in the art according to actual requirements, and the present invention is not limited to this.
With continuing reference to fig. 2 and fig. 3, optionally, the liquid crystal antenna according to the embodiment of the present invention further includes a radio frequency signal interface 18 and a pad 19, where one end of the radio frequency signal interface 18 is connected to the feeding network 15 and fixed by the pad 19, and the other end of the radio frequency signal interface 18 is used to connect external circuits such as a coaxial cable connector, so as to implement feeding of a radio frequency signal.
With continued reference to fig. 1-3, a side of the first substrate 10 facing away from the second substrate 11 is provided with a radiation electrode 16, and a perpendicular projection of the ground metal layer 13 on the second substrate 11 at least partially overlaps a perpendicular projection of the radiation electrode 16 on the second substrate 11. The ground metal layer 13 is provided with a second hollow-out portion 132, the vertical projection of the radiation electrode 16 on the plane where the ground metal layer 13 is located covers the second hollow-out portion 132, the vertical projection of the microstrip line 12 on the plane where the ground metal layer 13 is located covers the second hollow-out portion 132, the radio-frequency signal is transmitted between the microstrip line 12 and the ground metal layer 13, the liquid crystal layer 14 between the microstrip line 12 and the ground metal layer 13 shifts the phase of the radio-frequency signal to change the phase of the radio-frequency signal, and the radio-frequency signal after the phase shift is coupled to the radiation electrode 16 at the second hollow-out portion 132 of the ground metal layer 13, so that the radiation electrode 16 radiates the signal outwards.
It should be noted that the radiation electrode 16 is disposed corresponding to the microstrip line 12, for example, the radiation electrode 16 is disposed corresponding to the microstrip line 12 one by one, and the radiation electrodes 16 corresponding to different microstrip lines 12 are disposed in an insulating manner; optionally, different voltage signals are applied to different microstrip lines 12, liquid crystal molecules at corresponding positions of different microstrip lines 12 deflect differently, dielectric constants of the liquid crystal layer 14 at each position are different, phases of radio-frequency signals at positions of different microstrip lines 12 are adjusted, and finally different beam directions of the radio-frequency signals are realized.
With reference to fig. 1 to 3, a dielectric isolation layer 17 is disposed on a side of the microstrip line 12 close to the liquid crystal layer 14, and the dielectric isolation layer 17 is used to isolate the microstrip line 12 from the liquid crystal layer 14, so as to prevent the liquid crystal layer 14 from being hydrolyzed due to the contact between the microstrip line 12 and the liquid crystal layer 14, thereby improving the reliability of the liquid crystal antenna and improving the usability.
As shown in fig. 4, optionally, a dielectric isolation layer 17 is disposed on a side of the ground metal layer 13 close to the liquid crystal layer 14, and the dielectric isolation layer 17 is used to isolate the ground metal layer 13 from the liquid crystal layer 14, so as to prevent the liquid crystal layer 14 from being hydrolyzed due to contact between the ground metal layer 13 and the liquid crystal layer 14, thereby improving reliability of the liquid crystal antenna and improving usability.
Fig. 5 is a schematic partial cross-sectional structure view of another liquid crystal antenna according to an embodiment of the present invention, and as shown in fig. 5, optionally, a dielectric isolation layer 17 may be disposed on both a side of the microstrip line 12 close to the liquid crystal layer 14 and a side of the ground metal layer 13 close to the liquid crystal layer 14, so as to isolate the microstrip line 12 and the ground metal layer 13 from the liquid crystal layer 14, so as to prevent the liquid crystal layer 14 from being hydrolyzed due to contact between the microstrip line 12 and the ground metal layer 13 and the liquid crystal layer 14, thereby further improving reliability of the liquid crystal antenna and improving usability of the liquid crystal antenna.
It should be noted that the cross-sectional schematic diagrams provided in the present application only schematically show the film layer structures of the film layers in the liquid crystal antenna, and do not represent actual dimensions.
According to the liquid crystal antenna provided by the embodiment of the invention, the dielectric isolation layer 17 is arranged on one side of the microstrip line 12 close to the liquid crystal layer 14 and/or one side of the grounding metal layer 13 close to the liquid crystal layer 14, so that the microstrip line 12 and/or the grounding metal layer 13 is isolated from the liquid crystal layer 14, and the liquid crystal layer 14 is prevented from being hydrolyzed due to the contact between the microstrip line 12 and/or the grounding metal layer 13 and the liquid crystal layer 14, therefore, the reliability of the liquid crystal antenna is improved, and the use performance is improved.
Fig. 6 is a schematic partial cross-sectional structure diagram of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 6, optionally, the feeding network 15 is located on a side of the first substrate 10 away from the microstrip line 12, the dielectric isolation layer 17 includes a first dielectric isolation layer 20, and the first dielectric isolation layer 20 is located on a side of the feeding network 15 away from the second substrate 11.
For example, as shown in fig. 6, taking the feed network 15 located on the side of the first substrate 10 away from the microstrip line 12 as an example, the first dielectric isolation layer 20 is disposed on the side of the feed network 15 away from the second substrate 11, so that the first dielectric isolation layer 20 isolates the feed network 15 from the external environment, thereby preventing the feed network 15 from surface oxidation under the influence of external air, which is beneficial to improving the electrical conductivity of the surface of the feed network 15, reducing the loss of radio frequency signals on the feed network 15, and thus improving the reliability of the liquid crystal antenna and improving the use performance.
With continued reference to fig. 6, optionally, the dielectric isolation layer 17 includes a first dielectric isolation layer 20, the first dielectric isolation layer 20 being located on a side of the radiation electrode 16 remote from the first substrate 10.
As shown in fig. 6, the first dielectric isolation layer 20 is disposed on the side of the radiation electrode 16 away from the first substrate 10, so that the first dielectric isolation layer 20 isolates the radiation electrode 16 from the external environment, thereby preventing the radiation electrode 16 from surface oxidation under the influence of the external air, improving the conductivity of the surface of the radiation electrode 16, reducing the loss of the radio frequency signal on the radiation electrode 16, and improving the reliability and usability of the liquid crystal antenna.
Optionally, the first dielectric isolation layer 20 for isolating the radiation electrode 16 from the external environment and the first dielectric isolation layer 20 for isolating the feed network 15 from the external environment may be simultaneously manufactured, thereby effectively improving the efficiency of the manufacturing process. A gap may be formed between the two first dielectric isolation layers 20, and the two first dielectric isolation layers 20 respectively cover the radiation electrode 16 and the feed network 15, so that the radiation electrode 16 and the feed network 15 are isolated from the external environment; the first dielectric spacer layer 20 may be continuously disposed throughout the layer, i.e., without a gap between the two first dielectric spacer layers 20.
With continued reference to fig. 2-6, optionally, the dielectric isolation layer 17 comprises at least one insulating layer 21, the insulating layer 21 comprising any one or more of a silicon nitride layer, a silicon oxide layer, a polytetrafluoroethylene layer, a hafnium nitride layer, a hafnium oxide layer, a hafnium oxynitride layer.
Illustratively, as shown in fig. 2-6, the dielectric isolation layer 17 may include only one insulating layer 21, and the insulating layer 21 may be a silicon nitride layer (SiN)x) Silicon oxide layer (SiO)2) Polytetrafluoroethylene layer (PTFE), hafnium nitride layer (HfN), hafnium oxide layer (HfO)2) Or hafnium oxynitride layer (HfN)xOy) The material has high density, ensures low cost and realizes the obstruction of the liquid crystal antennaThe metal layers such as the microstrip line 12, the feed network 15 and the radiation electrode 16 are in contact with the external environment, so that the risk of hydrolysis of the liquid crystal layer 14 caused by oxidation of the metal layers and contact of the metal layers and the liquid crystal layer 14 is reduced, and the reliability of the liquid crystal antenna is improved.
It should be noted that the insulating layer 21 is not limited to the above-mentioned materials, in other embodiments, a person skilled in the art may set the insulating layer 21 as other organic or inorganic films according to actual needs, and the embodiments of the present invention do not limit this.
In other embodiments, the dielectric isolation layer 17 may also include multiple stacked insulating layers 21, and a person skilled in the art may set the number and thickness of the insulating layers 21 according to actual requirements, which is not limited in the embodiments of the present invention.
Fig. 7 is a schematic partial cross-sectional structure view of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 7, optionally, the dielectric isolation layer 17 includes at least one first insulating layer 211, the at least one first insulating layer 211 includes a first sub-insulating layer 2111 and a second sub-insulating layer 2112, the second sub-insulating layer 2112 is located on a side of the first sub-insulating layer 2111 close to the liquid crystal layer 14, and a density of the first sub-insulating layer 2111 is greater than a density of the second sub-insulating layer 2112.
It should be noted that the compactness in the present invention refers to the average value of the sizes of the gaps between atoms or molecules of the material, and if the average gap is smaller, the porosity thereof is smaller, the compactness thereof is higher, and if the average gap is larger, the porosity thereof is larger, the compactness thereof is lower.
As shown in fig. 7, in this embodiment, the density of the first sub-insulating layer 2111 contacting the microstrip line 12 or the ground metal layer 13 is set to be greater than the density of the second sub-insulating layer 2112 close to the liquid crystal layer 14, so as to effectively block metal diffusion and permeation of the microstrip line 12 or the ground metal layer 13 to the dielectric isolation layer 17, thereby playing a better role in isolation and reducing the influence of the microstrip line 12 and the ground metal layer 13 on the liquid crystal layer 14.
For example, the first sub-insulating layer 2111 may include, but is not limited to, silicon nitride, and the compactness of the silicon nitride is relatively large, so that a relatively small gap is formed between the nitrogen element and the silicon element in the first sub-insulating layer 2111, and the arrangement of the elements in the first sub-insulating layer 2111 is relatively tight, so as to effectively block metal diffusion and infiltration of the microstrip line 12 or the ground metal layer 13 to the dielectric isolation layer 17. The second sub-insulating layer 2112 may include, but is not limited to, silicon oxide, which has a smaller dielectric constant of a film layer and a smaller influence on a radio frequency signal than silicon nitride, and also has better mechanical properties and contact performance.
In this embodiment, by providing that the dielectric isolation layer 17 at least includes a first sub-insulation layer 2111 and a second sub-insulation layer 2112 which are stacked, the second sub-insulation layer 2112 is located on one side of the first sub-insulation layer 2111 close to the liquid crystal layer 14, and the density of the first sub-insulation layer 2111 is greater than that of the second sub-insulation layer 2112, on one hand, metal diffusion and infiltration of the microstrip line 12 or the ground metal layer 13 to the dielectric isolation layer 17 are effectively blocked, and at the same time, the mechanical performance and the contact performance of the dielectric isolation layer 17 are improved; on the other hand, the second sub-insulating layer 2112 with a smaller dielectric constant and the first sub-insulating layer 2111 with a larger dielectric constant are stacked, so that the loss of the dielectric isolation layer 17 to radio frequency signals is reduced, further, more first insulating layers 211 can be arranged between the first sub-insulating layer 2111 and the second sub-insulating layer 2112, the dielectric constants of different first insulating layers 211 are gradually transited from the first sub-insulating layer 2111 to the second sub-insulating layer 2112, abrupt change of the dielectric constants is avoided, the loss of the radio frequency signals is further reduced, and the improvement of the use performance of the liquid crystal antenna is facilitated.
Fig. 8 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 8, optionally, the first dielectric isolation layer 20 includes at least one second insulation layer 201, the at least one second insulation layer 201 includes a third sub-insulation layer 2011 and a fourth sub-insulation layer 2012, the third sub-insulation layer 2011 is located on a side of the fourth sub-insulation layer 2012, which is far away from the second substrate 11, and a density of the fourth sub-insulation layer 2012 is greater than a density of the third sub-insulation layer 2011.
As shown in fig. 8, in this embodiment, the density of the fourth sub-insulating layer 2012 in contact with the feed network 15 and the radiation electrode 16 is greater than the density of the third sub-insulating layer 2011 away from the feed network 15 and the radiation electrode 16, so as to effectively prevent the feed network 15 and the radiation electrode 16 from diffusing and penetrating the metal of the dielectric isolation layer 17, thereby playing a better isolation role.
For example, the fourth sub-insulating layer 2012 can include, but is not limited to, silicon nitride, and the compactness of the silicon nitride is relatively large, so that a relatively small gap is formed between the nitrogen element and the silicon element in the fourth sub-insulating layer 2012, and the arrangement of the elements in the fourth sub-insulating layer 2012 is relatively close, so as to effectively block metal diffusion and infiltration of the feeding network 15 and the radiation electrode 16 to the first dielectric isolation layer 20. The third sub-insulating layer 2011 may include, but is not limited to, silicon oxide, which has a smaller dielectric constant of a film layer and a smaller influence on the rf signal than silicon nitride, and also has better mechanical properties and contact performance.
In this embodiment, by providing that the first dielectric isolation layer 20 at least includes a third sub-insulation layer 2011 and a fourth sub-insulation layer 2012 which are stacked, the third sub-insulation layer 2011 is located on a side of the fourth sub-insulation layer 2012, which is away from the second substrate 11, and the density of the fourth sub-insulation layer 2012 is greater than the density of the third sub-insulation layer 2011, on one hand, metal diffusion and infiltration of the feed network 15 and the radiation electrode 16 to the first dielectric isolation layer 20 are effectively blocked, and at the same time, the mechanical performance and the contact performance of the first dielectric isolation layer 20 are improved; on the other hand, the third sub-insulating layer 2011 with a smaller dielectric constant and the fourth sub-insulating layer 2012 with a larger dielectric constant are stacked, so that the loss of the first dielectric isolation layer 20 to the radio frequency signal is reduced, further, more second insulating layers 201 can be further arranged between the third sub-insulating layer 2011 and the fourth sub-insulating layer 2012, and the dielectric constants of different second insulating layers 201 are gradually transited from the fourth sub-insulating layer 2012 to the third sub-insulating layer 2011, so that the abrupt change of the dielectric constants is avoided, the loss of the radio frequency signal is further reduced, and the use performance of the liquid crystal antenna is improved.
With continued reference to FIGS. 2-8, the dielectric isolation layer 17 may optionally have a thickness D1, where 10nm D1 nm 1000 nm.
The thickness D1 of the medium isolation layer 17 is set to satisfy that D1 is not less than 10nm and not more than 1000nm, so that the medium isolation layer 17 is not too thick while the isolation effect is ensured, and the miniaturization application of the liquid crystal antenna is facilitated.
With continued reference to fig. 2-8, optionally, the liquid crystal antenna provided by the embodiment of the invention further includes an alignment layer 22, where the alignment layer 22 is located on a side of the dielectric isolation layer 17 close to the liquid crystal layer 14.
As shown in fig. 2 to 8, the alignment layer 22 is disposed on one side of the dielectric isolation layer 17 close to the liquid crystal layer 14, so that the alignment layer 22 provides a pretilt angle to each liquid crystal molecule 141 in the liquid crystal layer 14, and aligns the liquid crystal layer 14, so that the liquid crystal molecules 141 can rapidly deflect in response to an applied electric field, thereby increasing the response speed of the liquid crystal antenna.
It should be noted that, in general, the surface of the alignment layer 22 needs to be processed by Rubbing, even if the roller attached with the Rubbing cloth rotates at a high speed, the fluff on the Rubbing cloth completes the Rubbing action on the alignment layer 22 to generate a structure with alignment to the liquid crystal on the alignment layer 22, therefore, if only the alignment layer 22 is disposed between the microstrip line 12 or the grounding metal layer 13 and the liquid crystal layer 14, there is a problem that a trace amount of metal is exposed, which causes the microstrip line 12 or the grounding metal layer 13 to contact with the liquid crystal layer 14, and further acts as a hydrolysis action to the liquid crystal, thereby reducing the reliability of the antenna.
In this embodiment, the dielectric isolation layer 17 is disposed on a side of the alignment layer 22 away from the liquid crystal layer 14, so as to completely isolate the microstrip line 12 and/or the ground metal layer 13 from the liquid crystal layer 14, thereby preventing the microstrip line 12 and/or the ground metal layer 13 from contacting the liquid crystal layer 14 to cause hydrolysis of the liquid crystal layer 14, and thus improving reliability of the liquid crystal antenna and improving usability.
Fig. 9 is a schematic partial cross-sectional structure view of another liquid crystal antenna according to an embodiment of the present invention, and as shown in fig. 9, optionally, the liquid crystal antenna according to an embodiment of the present invention further includes a support 23, where the support 23 is located between the first substrate 10 and the second substrate 11, the dielectric isolation layer 17 is located on a side of the microstrip line 12 close to the liquid crystal layer 14, and a gap exists between a vertical projection of the dielectric isolation layer 17 on the second substrate 11 on a side of the microstrip line 12 close to the liquid crystal layer 14 and a vertical projection of the support 23 on the second substrate 11.
Specifically, as shown in fig. 9, a support 23 is disposed between the first substrate 10 and the second substrate 11 to support the first substrate 10 and the second substrate 11, so that the uniformity of the thickness of the cell is maintained by using the uniformity of the size of the support 23 during the cell process.
With continued reference to fig. 9, in the present embodiment, a gap exists between a vertical projection of the dielectric isolation layer 17 on the side of the microstrip line 12 close to the liquid crystal layer 14 on the second substrate 11 and a vertical projection of the support 23 on the second substrate 11, that is, in the thickness direction of the second substrate 11, the dielectric isolation layer 17 on the side of the microstrip line 12 close to the liquid crystal layer 14 does not overlap with the support 23, so as to reduce the influence of the thickness of the dielectric isolation layer 17 on the control of the liquid crystal cell thickness by the support 23.
The dielectric isolation layer 17 can be patterned to cover only the microstrip line 12, or cover the microstrip line 12 and be located only near the microstrip line 12, so that the vertical projection of the dielectric isolation layer 17 on the side of the microstrip line 12 close to the liquid crystal layer 14 on the second substrate 11 does not overlap with the vertical projection of the support 23 on the second substrate 11, and the influence of the thickness of the dielectric isolation layer 17 on the control of the thickness of the liquid crystal cell by the support 23 is reduced.
With continued reference to fig. 9, the supports 23 may optionally comprise Ball Space (BS) that may be dispersed on the second substrate 11 by spraying. In other embodiments, the support 23 may further include a Photo Spacer (PS), and a person skilled in the art may set the shape, number, position, and preparation process of the support 23 according to actual requirements, which is not limited by the embodiment of the invention.
With continued reference to fig. 2-9, optionally, at least one of microstrip line 12, ground metal layer 13, radiation electrode 16, and feed network 15 includes at least one metal layer 24, the metal layer 24 including one or more of a copper layer, an aluminum layer, a titanium layer, and a molybdenum layer.
For example, as shown in fig. 2 to 9, one or more of the microstrip line 12, the ground metal layer 13, the radiation electrode 16 and the feeding network 15 may include only one metal layer 24, and the metal layer 24 may be a copper layer (Cu), an aluminum layer (Al), a titanium layer (Ti) or a molybdenum layer (Mo), for example, the copper layer (Cu) may be used as the metal layer 24, Cu is a metal material most commonly used in the antenna field, and has excellent conductivity and low cost, and the copper layer used as the metal layer 24 may effectively reduce energy loss caused by too high resistance, thereby improving the performance of the antenna.
It should be noted that the metal layer 24 is not limited to the above-mentioned materials, and in other embodiments, a person skilled in the art may set the material of the metal layer 24 according to actual needs, which is not limited in the embodiments of the present invention.
In other embodiments, one or more of the microstrip line 12, the ground metal layer 13, the radiation electrode 16, and the feeding network 15 may also include multiple metal layers 24 stacked in layers, and a person skilled in the art may set the number and thickness of the metal layers 24 according to actual requirements, which is not limited in the embodiment of the present invention.
Fig. 10 is a schematic partial cross-sectional structure diagram of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 10, optionally, the feeding network 15 is disposed on the same layer as the microstrip line 12, and the feeding network 15 is coupled to the microstrip line 12, and/or the ground metal layer 13, and/or the feeding network 15 includes at least one first metal layer 241, at least one first metal layer 241 includes a first sub-metal layer 2411 and a second sub-metal layer 2412, the second sub-metal layer 2412 is located on a side of the first sub-metal layer 2411 close to the liquid crystal layer 14, and a resistance of the second sub-metal layer 2412 is smaller than a resistance of the first sub-metal layer 2411.
As shown in fig. 10, in this embodiment, one or more of the microstrip line 12, the ground metal layer 13 and the feeding network 15 includes a first sub-metal layer 2411 and a second sub-metal layer 2412 which are stacked, the second sub-metal layer 2412 is located on one side of the first sub-metal layer 2411 close to the liquid crystal layer 14, and the resistance of the second sub-metal layer 2412 is smaller than that of the first sub-metal layer 2411, so that the resistance of the second sub-metal layer 2412 close to the liquid crystal layer 14 is smaller, the conductivity is better, the energy loss caused by the excessively high resistance can be effectively reduced, and the performance of the antenna can be improved; meanwhile, the resistance of the first sub-metal layer 2411 near the substrate side is relatively high, and since the resistance is generally proportional to the adhesion, the adhesion of the first sub-metal layer 2411 near the substrate side is relatively good, the adhesion performance of the first metal layer 241 is improved, and the problem of serious peeling does not occur.
Here, the adhesion refers to an adhesive ability between the metal layer and the substrate.
Illustratively, the second sub-metal layer 2412 may include, but is not limited to, a copper layer (Cu), which has excellent conductivity and may effectively reduce energy loss due to too high resistance, thereby improving the performance of the antenna. The first sub-metal layer 2411 may include, but is not limited to, an aluminum layer (Al), a titanium layer (Ti), or a molybdenum layer (Mo) to have a superior adhesion property.
In other embodiments, a person skilled in the art may set the materials of the first sub-metal layer 2411 and the second sub-metal layer 2412 according to actual requirements, for example, the electrical conductivity of the material of the second sub-metal layer 2412 is set to be greater than that of titanium, so as to ensure that the loss of the radio frequency signal is low, and thus the performance of the antenna is ensured, which is not limited in the embodiments of the present invention.
Fig. 11 is a schematic partial cross-sectional structure diagram of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 11, optionally, the feeding network 15 is located on a side of the first substrate 10 away from the microstrip line 12, and the radiation electrode 16, and/or the feeding network 15 includes at least one second metal layer 242, where the at least one second metal layer 242 includes a third sub-metal layer 2421 and a fourth sub-metal layer 2422, the fourth sub-metal layer 2422 is located on a side of the third sub-metal layer 2421 away from the second substrate 11, and a resistance of the fourth sub-metal layer 2422 is smaller than a resistance of the third sub-metal layer 2421.
As shown in fig. 11, in the present embodiment, by providing the radiation electrode 16, and/or by providing the feeding network 15 including the third sub-metal layer 2421 and the fourth sub-metal layer 2422 which are stacked, the fourth sub-metal layer 2422 is located on a side of the third sub-metal layer 2421 away from the first substrate 10, and the resistance of the fourth sub-metal layer 2422 is smaller than that of the third sub-metal layer 2421, so that the fourth sub-metal layer 2422 away from the first substrate 10 has smaller resistance and better conductivity, which can effectively reduce energy loss caused by too high resistance, thereby improving the performance of the antenna; meanwhile, the third sub-metal layer 2421 closer to the first substrate 10 has a larger resistance, and since the resistance is generally proportional to the adhesiveness, the adhesiveness between the third sub-metal layer 2421 closer to the first substrate 10 and the first substrate 10 is better, reducing the possibility of the occurrence of the peeling problem.
Illustratively, the fourth sub-metal layer 2422 may include, but is not limited to, a copper layer (Cu), which has excellent conductivity and may effectively reduce energy loss caused by too high resistance, thereby improving the performance of the antenna. The third sub-metal layer 2421 may include, but is not limited to, an aluminum layer (Al), a titanium layer (Ti), or a molybdenum layer (Mo) to have better adhesion properties.
In other embodiments, a person skilled in the art may set the materials of the third sub-metal layer 2421 and the fourth sub-metal layer 2422 according to practical requirements, for example, the conductivity of the material of the fourth sub-metal layer 2422 is set to be greater than that of titanium, so as to ensure that the loss of the rf signal is low, and thus the performance of the antenna is ensured, which is not limited in the embodiments of the present invention.
Fig. 12 is a partial cross-sectional structural schematic diagram of another liquid crystal antenna according to an embodiment of the present invention, as shown in fig. 12, optionally, the at least one metal layer 24 includes a fifth sub-metal layer 2401, a sixth sub-metal layer 2402, and a seventh sub-metal layer 2403, which are stacked, the sixth sub-metal layer 2402 is located between the fifth sub-metal layer 2401 and the seventh sub-metal layer 2403, the resistance of the sixth sub-metal layer 2402 is smaller than the resistance of the fifth sub-metal layer 2401, and the resistance of the sixth sub-metal layer 2402 is smaller than the resistance of the seventh sub-metal layer 2403.
As shown in fig. 12, in this embodiment, by providing one or more of the microstrip line 12, the ground metal layer 13, the feed network 15, and the radiation electrode 16 including a fifth sub-metal layer 2401, a sixth sub-metal layer 2402, and a seventh sub-metal layer 2403 which are stacked, the sixth sub-metal layer 2402 is located between the fifth sub-metal layer 2401 and the seventh sub-metal layer 2403, and the resistance of the sixth sub-metal layer 2402 is smaller than that of the fifth sub-metal layer 2401, and the resistance of the sixth sub-metal layer 2402 is smaller than that of the seventh sub-metal layer 2403, the resistance of the sixth sub-metal layer 2402 located in the middle is smaller, the conductivity is better, and the energy loss caused by the excessively high resistance can be effectively reduced, thereby improving the performance of the antenna; the resistance of the fifth sub-metal layer 2401 and the seventh sub-metal layer 2403 located outside is large, and since the resistance is generally proportional to the adhesiveness, the adhesiveness of the fifth sub-metal layer 2401 located closer to the substrate is good, and the possibility of occurrence of the peeling problem is reduced.
Illustratively, the sixth sub-metal layer 2402 may include, but is not limited to, a copper layer (Cu), which has excellent conductivity and may effectively reduce energy loss caused by too high resistance, thereby improving the performance of the antenna. The fifth and seventh sub-metal layers 2401 and 2403 may include, but are not limited to, an aluminum layer (Al), a titanium layer (Ti), or a molybdenum layer (Mo) to have a good adhesion property; meanwhile, due to the fact that the oxidation resistance of the copper layer is poor, the copper layer can be protected by arranging the other metal layers on the two sides of the copper layer, and the copper layer is prevented from being oxidized, so that loss of radio frequency signals is reduced, and the use performance of the liquid crystal antenna is improved.
Fig. 13 is a schematic partial cross-sectional view of another liquid crystal antenna according to an embodiment of the invention, as shown in fig. 13, optionally, the first substrate 10 includes a first sub-substrate 101 and a second sub-substrate 102, and the first sub-substrate 101 is located on a side of the second sub-substrate 102 away from the liquid crystal layer 14.
Specifically, as shown in fig. 13, the first substrate 10 includes a first sub-substrate 101 and a second sub-substrate 102, and the first sub-substrate 101 is located on a side of the second sub-substrate 102 away from the liquid crystal layer 14, so that the first sub-substrate 101 is used for carrying the radiation electrode 16, and the second sub-substrate 102 is used for carrying the ground metal layer 13. In the process of manufacturing the liquid crystal antenna, the radiation electrode 16 can be formed on the first sub-substrate 101, the grounding metal layer 13 is formed on the second sub-substrate 102, and then the first sub-substrate 101 and the second sub-substrate 102 are attached to form the first substrate 10.
Optionally, the first sub-substrate 101 includes a high-frequency substrate, the high-frequency substrate is a special circuit board with a higher electromagnetic frequency, the frequency is above 1GHz, and by using the low-loss high-frequency substrate, the loss of the first substrate 10 to the radio frequency signal can be effectively reduced, so as to improve the use performance of the antenna.
For example, the first sub-substrate 101 may be a high frequency substrate such as an FR-4 epoxy glass cloth laminated board, a teflon board, a hot pressed ceramic board, etc., and those skilled in the art can set the substrate according to actual needs, which is not limited by the embodiment of the present invention.
Alternatively, the second sub-substrate 102 and the second substrate 11 may be glass substrates, and a liquid crystal cell may be formed by using the glass substrates, so that high manufacturing accuracy may be achieved.
In other embodiments, a person skilled in the art may set the material of the second sub-substrate 102 and the second substrate 11 according to actual requirements, which is not limited by the embodiments of the present invention.
With continued reference to fig. 2 to 13, optionally, the liquid crystal antenna provided in the embodiment of the present invention further includes a supporting structure 25, where the supporting structure 25 is configured to support the first substrate 10 and the second substrate 11 to provide a containing space for the liquid crystal layer 14.
Those skilled in the art can also set other structures of the liquid crystal antenna according to actual requirements, for example, those skilled in the art can set the shape of the microstrip line 12 at will according to actual requirements, and the shape of the microstrip line 12 may be serpentine, W-shaped, U-shaped, spiral, comb-shaped, zigzag, and the like, which is not limited in the embodiment of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (14)
1. A liquid crystal antenna, comprising:
the first substrate and the second substrate are oppositely arranged;
the microstrip line is positioned on one side of the second substrate close to the first substrate;
the grounding metal layer is positioned on one side of the first substrate close to the second substrate;
a liquid crystal layer between the first substrate and the second substrate;
the feed network is positioned on one side of the first substrate, which is far away from the microstrip line; or the feed network and the microstrip line are arranged on the same layer, and the feed network is coupled with the microstrip line;
the radiation electrode is positioned on one side of the first substrate far away from the second substrate, and the vertical projection of the grounding metal layer on the second substrate at least partially overlaps with the vertical projection of the radiation electrode on the second substrate;
and the dielectric isolation layer is positioned on one side of the microstrip line close to the liquid crystal layer, and/or the dielectric isolation layer is positioned on one side of the grounding metal layer close to the liquid crystal layer.
2. The liquid crystal antenna of claim 1,
the feed network is positioned on one side of the first substrate far away from the microstrip line;
the dielectric isolation layer comprises a first dielectric isolation layer, and the first dielectric isolation layer is located on one side, far away from the second substrate, of the feed network.
3. The liquid crystal antenna of claim 1,
the dielectric isolation layer comprises a first dielectric isolation layer, and the first dielectric isolation layer is positioned on one side of the radiation electrode, which is far away from the first substrate.
4. The liquid crystal antenna according to any one of claims 1 to 3,
the dielectric isolation layer comprises at least one insulating layer;
the insulating layer includes any one or more of a silicon nitride layer, a silicon oxide layer, a polytetrafluoroethylene layer, a hafnium nitride layer, a hafnium oxide layer, and a hafnium oxynitride layer.
5. The liquid crystal antenna of claim 1,
the medium isolation layer comprises at least one first insulation layer;
at least one layer of the first insulating layer comprises a first sub insulating layer and a second sub insulating layer, and the second sub insulating layer is positioned on one side, close to the liquid crystal layer, of the first sub insulating layer;
the density of the first sub-insulating layer is greater than that of the second sub-insulating layer.
6. The liquid crystal antenna according to claim 2 or 3,
the first dielectric isolation layer comprises at least one second insulating layer;
the at least one second insulating layer comprises a third sub insulating layer and a fourth sub insulating layer, and the third sub insulating layer is positioned on one side, far away from the second substrate, of the fourth sub insulating layer;
the density of the fourth sub-insulating layer is greater than that of the third sub-insulating layer.
7. The liquid crystal antenna according to any one of claims 1 to 3,
the thickness of the medium isolating layer is D1, wherein D1 is more than or equal to 10nm and less than or equal to 1000 nm.
8. The liquid crystal antenna of claim 1,
the liquid crystal antenna further comprises an alignment layer, and the alignment layer is located on one side, close to the liquid crystal layer, of the medium isolation layer.
9. The liquid crystal antenna of claim 1,
the liquid crystal antenna further comprises a support, wherein the support is positioned between the first substrate and the second substrate;
the dielectric isolation layer is positioned on one side of the microstrip line close to the liquid crystal layer, and a gap exists between the vertical projection of the dielectric isolation layer on the second substrate and the vertical projection of the support on the second substrate.
10. The liquid crystal antenna of claim 1,
at least one of the microstrip line, the ground metal layer, the radiation electrode and the feed network comprises at least one metal layer;
the metal layer includes one or more of a copper layer, an aluminum layer, a titanium layer, and a molybdenum layer.
11. The liquid crystal antenna of claim 10,
the feed network and the microstrip line are arranged on the same layer, and the feed network is coupled with the microstrip line;
the microstrip line, and/or the ground metal layer, and/or the feed network comprises at least one first metal layer;
at least one first metal layer comprises a first sub-metal layer and a second sub-metal layer, and the second sub-metal layer is positioned on one side, close to the liquid crystal layer, of the first sub-metal layer;
the resistance of the second sub-metal layer is smaller than the resistance of the first sub-metal layer.
12. The liquid crystal antenna of claim 10,
the feed network is positioned on one side of the first substrate far away from the microstrip line;
the radiation electrode and/or the feed network comprises at least one second metal layer;
at least one second metal layer comprises a third sub-metal layer and a fourth sub-metal layer, and the fourth sub-metal layer is positioned on one side, far away from the second substrate, of the third sub-metal layer;
the resistance of the fourth sub-metal layer is smaller than the resistance of the third sub-metal layer.
13. The liquid crystal antenna of claim 10,
the at least one metal layer comprises a fifth sub-metal layer, a sixth sub-metal layer and a seventh sub-metal layer which are arranged in a stacked mode, and the sixth sub-metal layer is located between the fifth sub-metal layer and the seventh sub-metal layer;
the resistance of the sixth sub-metal layer is smaller than the resistance of the fifth sub-metal layer, and the resistance of the sixth sub-metal layer is smaller than the resistance of the seventh sub-metal layer.
14. The liquid crystal antenna of claim 1,
the first substrate comprises a first sub-substrate and a second sub-substrate, and the first sub-substrate is positioned on one side of the second sub-substrate, which is far away from the liquid crystal layer.
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