CN113881250A - Heat-conducting filler and surface treatment method thereof - Google Patents

Heat-conducting filler and surface treatment method thereof Download PDF

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CN113881250A
CN113881250A CN202111223798.2A CN202111223798A CN113881250A CN 113881250 A CN113881250 A CN 113881250A CN 202111223798 A CN202111223798 A CN 202111223798A CN 113881250 A CN113881250 A CN 113881250A
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surface treatment
heat
treatment agent
conducting filler
conductive filler
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余良兵
刘金明
翁祝强
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Guangzhou Jointas Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/40—Compounds of aluminium
    • C09C1/407—Aluminium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12—Treatment with organosilicon compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/19—Oil-absorption capacity, e.g. DBP values
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/21—Attrition-index or crushing strength of granulates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Abstract

The invention relates to a heat-conducting filler and a surface treatment method thereof, wherein the surface treatment method of the heat-conducting filler comprises the following steps: (1) adding a first surface treatment agent to treat the heat-conducting filler, wherein the boiling point of the first surface treatment agent is lower than 160 ℃; (2) then adding a second surface treatment agent, wherein the boiling point of the second surface treatment agent is higher than 210 ℃. The surface treatment method of the heat-conducting filler can reduce volatilization of the surface treatment agent with low boiling point, thereby reducing the risk of generating gaps in the polymer thermal interface material, avoiding the oxidation of heat-conducting filler particles, reducing the viscosity and the storage modulus of a system, and improving the wettability between the polymer thermal interface material and a base material, thereby reducing the interface thermal resistance, and further better exerting the effect of the polymer thermal interface material.

Description

Heat-conducting filler and surface treatment method thereof
Technical Field
The invention belongs to the field of heat conduction materials, and particularly relates to a heat conduction filler and a surface treatment method thereof.
Background
The polymer thermal interface material is formed by filling heat-conducting powder in a polymer, so that the heat-conducting powder can play a role in heat conduction in the polymer, and the heat-conducting property of the polymer thermal interface material can be improved. Generally, the higher the content of the thermal conductive powder filled in the polymer, the higher the thermal conductivity of the polymer. In order to increase the filling amount of the heat-conducting powder, the heat-conducting powder needs to be subjected to surface treatment, so that the compatibility of the heat-conducting powder and a polymer is increased, and the interface thermal resistance of a system can be reduced.
At present, there are many methods for surface treatment of heat-conducting powder, but there still exist some problems: incomplete surface treatment, unstable treatment process, and excessive surface treatment agent cause evaporation during curing to cause voids in the polymer thermal interface material, and the like. These problems make it difficult to meet the practical requirements for the properties of polymeric thermal interface materials. When the surface treatment agent with a low boiling point is used for surface treatment of the heat conductive filler, the unreacted surface treatment agent is difficult to remove and is free in the system. Which volatilize easily during curing or use, risking the formation of voids in the polymeric thermal interface material, and thus affecting the thermal conductivity and other properties of the polymeric interface material. Although the high-boiling surface treating agent is difficult to volatilize, the high-boiling surface treating agent is adopted to completely replace the low-boiling surface treating agent, so that the risk of generating voids in the polymer thermal interface material can be reduced. However, the higher molecular weight of the high boiling point surface treatment agent increases the viscosity and storage modulus of the system and affects the properties of the material and the Bond Line Thickness (BLT). Secondly, most of the surface treatment agents adopted in the market at present are single surface treatment agents, and the heat-conducting filler is difficult to be completely coated. In addition, although a plurality of surface treatment agents are partially used, there are cases where the treatment process is unstable, the treatment effect is not satisfactory, or the above-mentioned problems occur; when the traditional heat conducting filler is subjected to surface treatment, if the traditional heat conducting filler is required to be treated thoroughly, a complex treatment process and a large amount of energy consumption are required, so that the cost is high.
Disclosure of Invention
Aiming at the problems of unstable treatment process or unsatisfactory treatment effect in the prior art, the surface treatment method of the heat-conducting filler can use a simple process, and has the advantages of easy obtainment of surface treatment agent, lower production cost, good treatment effect and stable operation process.
The present invention provides, in one aspect, a surface treatment method of a heat conductive filler, the surface treatment method including the steps of: (1) adding a first surface treatment agent to treat the heat-conducting filler, wherein the boiling point of the first surface treatment agent is lower than 160 ℃; (2) then adding a second surface treatment agent, wherein the boiling point of the second surface treatment agent is higher than 210 ℃. The surface treatment method of the heat-conducting filler can reduce volatilization of the surface treatment agent with low boiling point, thereby reducing the risk of generating gaps in the polymer thermal interface material, avoiding the oxidation of heat-conducting filler particles, reducing the viscosity and the storage modulus of a system, and improving the wettability between the polymer thermal interface material and a base material, thereby reducing the interface thermal resistance, and further better exerting the effect of the polymer thermal interface material.
In some embodiments, the first thermally conductive filler is selected from at least one of aluminum, silver, copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, aluminum nitride, carbon fiber.
In some embodiments, the thermally conductive filler has a maximum particle size of 80 μm; the average particle size of the heat-conducting filler is 5-20 microns, and preferably 8-15 microns; in some embodiments, the thermally conductive filler is preferably alumina. In some embodiments, the alumina is spherical alumina. In some embodiments, the spherical alumina comprises spherical alumina having a median particle size of 20 μm and spherical alumina having a median particle size of 2 μm, wherein the mass ratio of the spherical alumina having a median particle size of 20 μm to the spherical alumina having a median particle size of 2 μm is 3: 2. In some embodiments, the spherical alumina comprises spherical alumina having a median particle size of 20 μm and spherical alumina having a median particle size of 5 μm; wherein the mass ratio of the spherical alumina with the median particle size of 20 mu m to the spherical alumina with the median particle size of 5 mu m is 1: 1. In some embodiments, the spherical alumina comprises spherical alumina having a median particle size of 20 μm and spherical alumina having a median particle size of 2 μm, wherein the mass ratio of the spherical alumina having a median particle size of 20 μm to the spherical alumina having a median particle size of 2 μm is 3: 2. The surface treatment method of the heat-conducting filler can reduce volatilization of the surface treatment agent with low boiling point, thereby reducing the risk of generating gaps in the polymer thermal interface material, avoiding the oxidation of heat-conducting filler particles, reducing the viscosity and the storage modulus of a system, and improving the wettability between the polymer thermal interface material and a base material, thereby reducing the interface thermal resistance, and further better exerting the effect of the polymer thermal interface material.
In some embodiments, the first surface treatment agent is selected from at least one of gamma-glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, methyltrimethoxysilane, and ethyltrimethoxysilane.
In some embodiments, the second surface treatment agent is selected from:
Figure BDA0003311859060000031
wherein the content of the first and second substances,
r is an alkyl group of 6 carbons or more, X, Y, Z is independently a hydrolyzable group. In some embodiments, the alkyl group is hexyl, phenyl, or dodecyl. In some embodiments, the hydrolyzable group is an alkoxy group or a chloro group.
In some embodiments, the surface treatment method is a wet method or a dry method.
In some embodiments, the surface treatment method is a wet method, and the volume ratio of the solvent to the heat conductive filler added in the wet method is 10: 1-2: 1. In some embodiments, the solvent is an organic solvent selected from the group consisting of methanol, ethanol, isopropanol, toluene, xylene, acetone.
In some embodiments, the first surface treatment agent is used in an amount of 1% to 0.01% by weight of the thermally conductive filler. In some embodiments, the first surface treatment agent is preferably used in an amount of 0.6 to 0.1% by weight of the thermally conductive filler.
In some embodiments, the second surface treatment agent is used in an amount of 1% to 0.01% by weight of the thermally conductive filler. In some embodiments, the first surface treatment agent is preferably used in an amount of 0.6 to 0.1% by weight of the thermally conductive filler.
In still another aspect, the present invention provides a thermally conductive filler prepared by any one of the surface treatment methods described above. In some embodiments, the thermally conductive filler has an oil absorption value <10.5g/100 g. In some embodiments, 8g/100g < oil absorption of the thermally conductive filler <9.5g/100 g. In some embodiments, the thermally conductive filler has a viscosity of <25000 mPa-s. In some embodiments, the thermally conductive filler has a viscosity of <20000 mPa-s. The heat-conducting filler reduces the risk of generating gaps in the polymer thermal interface material, avoids the oxidation of heat-conducting filler particles, reduces the viscosity and the storage modulus of a system, and can also improve the wettability between the polymer thermal interface material and a base material, thereby reducing the interface thermal resistance, better exerting the effect of the polymer thermal interface material, and having relatively simple treatment process, easily obtained surface treatment agent, lower production cost, good treatment effect and stable operation process.
In still another aspect, the present invention provides a thermally conductive filler composition comprising: a thermally conductive filler; the first surface treatment agent is used for treating the heat-conducting filler, wherein the boiling point of the first surface treatment agent is lower than 160 ℃, and the dosage of the first surface treatment agent is 1-0.01% of the weight of the heat-conducting filler; the boiling point of the second surface treating agent is higher than 210 ℃, and the using amount of the second surface treating agent is 1-0.01% of the weight of the heat-conducting filler. In some embodiments, the thermally conductive filler is spherical alumina. In some embodiments, the first surface treatment agent is preferably used in an amount of 0.6 to 0.1% by weight of the thermally conductive filler. In some embodiments, the first surface treatment agent is preferably used in an amount of 0.6 to 0.1% by weight of the thermally conductive filler.
The surface treatment method of the heat conductive filler and the heat conductive filler of the present invention can provide at least one of the following advantages:
(1) by controlling the amount of the low-boiling surface treatment agent (which can be calculated by empirical formula), most or even all of the low-boiling surface treatment agent can be used to coat the thermally conductive filler particles, thereby reducing volatilization of the low-boiling surface treatment agent and reducing the risk of voids in the polymeric thermal interface material.
(2) The heat-conducting filler is coated by the multi-component surface treatment system, so that heat-conducting filler particles can be better dispersed in a polymer matrix, and the heat-conducting filler particles can be prevented from being oxidized.
(3) Less low-boiling point surface treating agent or excessive high-boiling point surface treating agent is dissociated in the system, so that the viscosity and the storage modulus of the system can be reduced, the wettability between the polymer thermal interface material and the base material can be improved, the interface thermal resistance is reduced, and the effect of the polymer thermal interface material is better exerted.
(4) Compared with the traditional treatment method, the treatment method of the heat-conducting filler adopted by the invention has the advantages of relatively simple treatment process, easily obtained surface treatment agent, lower production cost, good treatment effect, stable operation process and the like.
Detailed Description
Example 1
Putting the weighed heat-conducting filler (60 parts of spherical alumina with the median particle size of 20 mu m and 40 parts of spherical alumina with the median particle size of 2 mu m) into modified dispersion equipment, adding isopropanol (the volume ratio of the solvent to the heat-conducting filler is 3:1), stirring and dispersing (the rotating speed is 500rpm and the time is 5min), dropwise adding gamma-glycidyl ether oxypropyltrimethoxysilane (the adding time is 0.2 part based on 100 parts of the heat-conducting filler after 2 min), increasing the rotating speed to 1000rpm and stirring for 10 min; reducing the stirring speed to 500rpm, then dropwise adding dodecyl trimethoxy silane (the addition amount is 0.6 part based on 100 parts of heat-conducting filler after 2 min), increasing the rotation speed to 1000rpm after dropwise adding, stirring for 10min, and drying at 120 ℃ after discharging.
Example 2
Putting the weighed heat-conducting filler (50 parts of spherical alumina with the median particle size of 20 mu m and 50 parts of spherical alumina with the median particle size of 5 mu m) into a modification device, adding isopropanol (the volume ratio of the solvent to the heat-conducting filler is 3:1), stirring and dispersing (the rotating speed is 500rpm and the time is 5min), dropwise adding vinyl trimethoxy silane (the adding time is 0.3 part based on 100 parts of the heat-conducting filler after 2 min), increasing the rotating speed to 1000rpm and stirring for 10 min; reducing the stirring speed to 600rpm, then dropwise adding decaalkyltrimethoxysilane (the addition amount is 0.5 part based on 100 parts of heat-conducting filler after 3 min), increasing the speed to 1200rpm after dropwise adding, stirring for 10min, and drying at 120 ℃ after discharging.
Example 3
Putting the weighed heat-conducting filler (60 parts of spherical alumina with the median particle size of 20 mu m and 40 parts of spherical alumina with the median particle size of 2 mu m) into modified dispersion equipment, adding isopropanol (the volume ratio of the solvent to the heat-conducting filler is 3:1), stirring and dispersing (the rotating speed is 600rpm and the time is 6min), dropwise adding ethyltrimethoxysilane (the adding is finished for 2min and the adding amount is 0.3 part based on 100 parts of the heat-conducting filler), increasing the rotating speed to 1200rpm after the dropwise adding is finished, and stirring for 12 min; reducing the stirring speed to 600rpm, then dropwise adding octyl trimethoxy silane (the addition amount is 0.5 part based on 100 parts of heat-conducting filler after 2 min), increasing the speed to 1200rpm after dropwise adding, stirring for 12min, and drying at 120 ℃ after discharging.
Example 4
Placing the weighed heat-conducting filler (50 parts of spherical alumina with the median particle size of 20 microns and 50 parts of spherical alumina with the median particle size of 5 microns) into a modification device, stirring and dispersing (the rotating speed is 800rpm and the time is 8min), dropwise adding methyltrimethoxysilane (the addition is 0.2 part after 2min of addition based on 100 parts of the heat-conducting filler), increasing the rotating speed to 1500rpm after the dropwise addition, and stirring for 20 min; reducing the stirring speed to 800rpm, then dropwise adding hexadecyl trimethoxy silane (the addition amount is 0.2 part based on 100 parts of heat-conducting filler after 2 min), increasing the speed to 1200rpm after the dropwise adding is finished, and stirring for 12min to finish the modification treatment process of the heat-conducting filler.
Comparative example 1
Putting weighed heat-conducting fillers (60 parts of spherical alumina with the median particle size of 20 mu m and 40 parts of spherical alumina with the median particle size of 2 mu m) into a modified dispersing device, adding isopropanol (the volume ratio of a solvent to the heat-conducting fillers is 3:1), stirring and dispersing (the rotating speed is 500rpm and the time is 5min), dropwise adding gamma-glycidyl ether oxypropyltrimethoxysilane (the adding time is 0.8 part based on 100 parts of the heat-conducting fillers after 4 min), increasing the rotating speed to 1000rpm, stirring for 20min, discharging and drying at 120 ℃.
Comparative example 2
Putting weighed heat-conducting fillers (60 parts of spherical alumina with the median particle size of 20 mu m and 40 parts of spherical alumina with the median particle size of 2 mu m) into a modified dispersing device, adding isopropanol (the volume ratio of a solvent to the heat-conducting fillers is 3:1), stirring and dispersing (the rotating speed is 500rpm and the time is 5min), dropwise adding dodecyl trimethoxy silane (the adding time is 0.8 part based on 100 parts of the heat-conducting fillers after 4 min), increasing the rotating speed to 1000rpm, stirring for 20min, discharging and drying at 120 ℃.
Performance testing
Adding 100 parts of vinyl silicone oil with the viscosity of 500 mPa.S into 700 parts of the heat-conducting filler treated by the following components in parts by mass, and uniformly stirring and mixing the mixture for testing the viscosity; then 0.06 part of 50% 3-methyl-2-butynol, 0.7 part of 0.1% hydrogen-containing silicone oil and 0.6 part of 0.3% hydrogen-containing silicone oil are added, finally 0.3 part of 5000ppm platinum catalyst is added, the mixture is stirred uniformly and defoamed, and then the mixture is placed in a mould and vulcanized and molded at 150 ℃ to prepare the heat-conducting silica gel sheet which is used for testing the heat conductivity coefficient and the hardness and observing holes on the section.
And (3) testing performance parameters:
(1) coefficient of thermal conductivity: the samples were tested for thermal conductivity according to ASTM-D5470.
(2) Hardness: the hardness of the samples was tested according to GB/T531.1-2008.
(3) Oil absorption value: taking a 5g heat-conducting filler sample, placing the sample in a porcelain plate, then dropwise adding dioctyl phthalate (DOP) by using a micro burette, continuously turning and grinding by using a scraper, starting to be in a dispersion state, then gradually wetting by the DOP, and determining the dosage of the DOP. Calculated according to the following formula:
oil absorption value (m1/m) x 100
Wherein m1 is the mass of DOP consumed, g
m is the mass of alumina, g
(4) Viscosity: the samples were tested for viscosity according to GB/T2794-2013.
(5) Section holes: and (3) brittle-breaking the solidified sample wafer in liquid nitrogen, and observing whether holes exist under a microscope.
And (3) testing results:
Figure BDA0003311859060000061
as can be seen from comparison of comparative examples 1, 2 and example 1, the surface treatment of the heat conductive filler by a single high-low boiling point surface treatment agent has a high oil absorption value and viscosity, and a low thermal conductivity. In comparative example 1, the treatment of the heat conductive filler by a single low boiling point surface treatment agent resulted in generation of cross-sectional holes; in comparative example 2, the treatment of the heat conductive filler by a single high boiling point surface treatment agent had a high hardness and a high modulus of the sample, which affected the Bond Line Thickness (BLT) during use. In contrast, the heat-conducting filler prepared by the method has significantly lower system viscosity and better material performance.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (10)

1. A surface treatment method of a heat conductive filler, characterized by comprising the steps of:
(1) adding a first surface treatment agent to treat the heat-conducting filler, wherein the boiling point of the first surface treatment agent is lower than 160 ℃;
(2) then adding a second surface treatment agent, wherein the boiling point of the second surface treatment agent is higher than 210 ℃.
2. The surface treatment method according to claim 1, wherein the first thermally conductive filler is at least one selected from the group consisting of aluminum, silver, copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, aluminum nitride, and carbon fiber.
3. The surface treatment method according to claim 1, wherein the maximum particle diameter of the heat conductive filler is 80 μm, and the average particle diameter of the heat conductive filler is 5 to 20 μm.
4. The surface treatment method according to claim 1, wherein the first surface treatment agent is at least one selected from the group consisting of γ -glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, methyltrimethoxysilane and ethyltrimethoxysilane.
5. A surface treatment method according to claim 1, characterized in that the second surface treatment agent is selected from:
Figure FDA0003311859050000011
wherein R is an alkyl group of 6 carbons or more, X, Y, Z each independently being a hydrolyzable group.
6. The surface treatment method according to claim 1, wherein the surface treatment method is a wet method or a dry method.
7. The surface treatment method according to claim 1, wherein the first surface treatment agent is used in an amount of 1 to 0.01% by weight of the thermally conductive filler.
8. The surface treatment method according to claim 1, wherein the second surface treatment agent is used in an amount of 1 to 0.01% by weight of the thermally conductive filler.
9. A thermally conductive filler, characterized in that it is produced by the surface treatment method according to claims 1 to 9.
10. A thermally conductive filler composition, comprising: a thermally conductive filler; the first surface treatment agent is used for treating the heat-conducting filler, wherein the boiling point of the first surface treatment agent is lower than 160 ℃, and the dosage of the first surface treatment agent is 1-0.01% of the weight of the heat-conducting filler; and the boiling point of the second surface treatment agent is higher than 210 ℃, and the dosage of the second surface treatment agent is 1-0.01% of the weight of the heat-conducting filler.
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CN114507506A (en) * 2022-02-22 2022-05-17 广州集泰化工股份有限公司 Single-component addition type heat-conducting adhesive and preparation method and application thereof

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Application publication date: 20220104