CN113878919A - Mould pressing forming device for nano heat insulation material - Google Patents
Mould pressing forming device for nano heat insulation material Download PDFInfo
- Publication number
- CN113878919A CN113878919A CN202110978720.5A CN202110978720A CN113878919A CN 113878919 A CN113878919 A CN 113878919A CN 202110978720 A CN202110978720 A CN 202110978720A CN 113878919 A CN113878919 A CN 113878919A
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- CN
- China
- Prior art keywords
- layer
- frame
- die
- rigid layer
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000012774 insulation material Substances 0.000 title claims abstract description 11
- 238000003825 pressing Methods 0.000 title claims description 15
- 238000004080 punching Methods 0.000 claims abstract description 28
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 239000004744 fabric Substances 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000011121 hardwood Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920005594 polymer fiber Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000032798 delamination Effects 0.000 abstract 1
- 238000007723 die pressing method Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
Abstract
The invention discloses a die-pressing forming device for a nanometer heat-insulating material, which relates to the technical field of equipment manufacturing and comprises an upper die punching structure, a lower die punching structure and a die frame, wherein the upper die punching structure and the lower die punching structure are combined die punching and are formed by connecting a preset layer and a die punching part, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the die punching; the mould frame is of a closed type frame structure, and the peripheral outline of the rigid layer is consistent with and adjacent to the outline of the inner frame of the mould frame in shape; the buffer layer is positioned on the inner side surface of the rigid layer, and the buffer layer and the die frame jointly enclose a die cavity. The device can solve the problems of easy bulging, easy delamination and easy cracking in the process of preparing the nano heat insulation material, can be quickly and completely formed, and improves the die forming efficiency and the product percent of pass of the nano heat insulation material.
Description
Technical Field
The invention relates to the technical field of equipment manufacturing, in particular to a mould pressing forming device for a nanometer heat insulating material.
Background
The nanometer heat insulating material is prepared with nanometer gas phase silica, inorganic fiber and functional assistant as main material and through mixing and molding. Because the grain diameter of the gas phase nano silicon dioxide is extremely small, the loose packing density is extremely low, the bonding strength between powder bodies is low during mould pressing, when the traditional mould pressing forming device is adopted for preparation, long-time pressure maintaining is needed, the defects of bulging, layering, cracking and the like of products are easy to occur, and the qualification rate and the preparation efficiency of the products are greatly reduced. In order to solve the problems of the conventional mold pressing device for preparing the nano heat-insulating material, the invention of the mold pressing forming device for the nano heat-insulating material is urgently needed to improve the mold pressing forming efficiency and the product yield of the nano heat-insulating material.
Disclosure of Invention
In order to solve the problems that a product prepared by adopting a traditional mould pressing device for a nanometer heat-insulating material is easy to bulge, delaminate and crack, the invention provides the mould pressing forming device for the nanometer heat-insulating material, so that the nanometer heat-insulating material can be quickly and completely formed, and the mould pressing forming efficiency and the product percent of pass of the nanometer heat-insulating material are improved.
The technical scheme adopted by the invention is as follows:
a nanometer thermal insulation material mould pressing forming device comprises an upper mould punching structure, a lower mould punching structure and a mould frame, wherein the upper mould punching structure and the lower mould punching structure are combined mould punching and are formed by connecting a preset layer and a mould punching part, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the mould punching part; the mould frame is of a closed type frame structure, and the peripheral outline of the rigid layer is consistent with and adjacent to the outline of the inner frame of the mould frame in shape; the buffer layer is positioned on the inner side surface of the rigid layer, and the buffer layer and the die frame jointly enclose a die cavity.
Preferably, the mold frame is monolithic or split.
Preferably, the buffer layer is a fabric layer, and the thickness of the fabric layer is not less than 1 mm; the density of warp and weft threads of the fabric is not more than 50 threads/cm; the fabric fiber selected by the buffer layer is ceramic fiber or polymer fiber.
Preferably, a gap of 0.5-1mm is reserved between the buffer layer and the die frame for air leakage and die clamping placement.
Preferably, there is a gap of not less than 1.5mm between the peripheral outline of the rigid layer and the inner frame outline of the mold frame.
Preferably, the material selected for the rigid layer comprises one of a metal material, a polymer material, a ceramic material and hard wood.
Preferably, the closest distance of the punch from the die frame is not less than 10 mm.
Preferably, the buffer layer is bonded with the rigid layer through silicon rubber.
Preferably, a controlled connection mode or a contact-only non-connection mode is adopted between the rigid layer and the stamping die, wherein the controlled connection mode comprises a magnetic connection mode and a mechanical claw connection mode, and further automation design is facilitated.
Preferably, the outer surface of the punch is provided with a connecting hole for mechanical connection with a press.
Preferably, the two surfaces of the rigid layer and the punch, which are close to each other, are respectively and uniformly distributed with grooves, the directions of the grooves on the two surfaces are not mirror-symmetrical, the width and the depth of each groove are not less than 2mm, and the density of the grooves is 10-200m/m2。
The invention has the following beneficial effects:
1) the device can be used in the density range of 0.2-1.0g/cm3The buffer layer has compressibility and is in soft contact with the nano heat-insulating material, so that the stress can be slowly unloaded during demolding, and the bulge phenomenon after demolding on the surface of the nano heat-insulating material is avoided;
2) the die of the device is connected with the preset layer in a controllable mode, the die leaves firstly during demolding, and the preset layer is removed after pressure is unloaded, so that the phenomenon that the product is layered and cracked due to negative pressure on the surface of the product caused by the evacuation of the die during demolding is avoided.
3) The device has simple structure and convenient preparation, can realize high-quality and rapid preparation of the nanometer heat-insulating material, and has the product percent of pass of more than 95 percent; after the stamping die is connected with the automatic pressing machine, automatic production can be realized.
Drawings
FIG. 1 is a schematic view of the structure of a nano-insulation material molding apparatus according to the present invention.
Detailed Description
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
The mold pressing forming device for the nanometer heat insulation material disclosed by the embodiment comprises an upper mold punching structure, a lower mold punching structure and a mold frame, wherein the upper mold punching structure and the lower mold punching structure are combined mold punching and are formed by connecting a preset layer and a mold punching, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the mold punching. The mold frame is a closed frame structure, can be in any shape, such as square (or called square), round (or called circular) and the like, and is in an integral type or a splicing type. The periphery outline of the rigid layer is consistent with the outline of the inner frame of the die frame in shape, the rigid layer and the inner frame are close to each other, and a gap not smaller than 1.5mm is reserved. The buffer layer is positioned on the inner side surface of the rigid layer and forms a die cavity together with the die frame. The buffer layer is a fabric layer, and the thickness of the fabric layer is not less than 1 mm; the density of warp and weft threads of the fabric is not more than 50 threads/cm; the fabric fiber selected by the buffer layer is ceramic fiber or polymer fiber. A gap of 0.5-1mm is reserved between the buffer layer and the die frame, so that air leakage is facilitated and die clamping is prevented. The rigid layer is made of one of metal material, high polymer material, ceramic material and hard wood. The minimum distance between the punch and the die frame is not less than 10 mm. One side of the buffer layer is contacted with the nano heat insulation material powder. The buffer layer is bonded with the rigid layer through silicon rubber. The rigid layer and the stamping die are connected in a controlled connection mode or in a contact-only non-connection mode, the controlled connection mode comprises a magnetic connection mode and a mechanical claw connection mode, and therefore further automatic design is facilitated. The outer surface of the punch is provided with a connecting hole which is mechanically connected with the press. The two surfaces of the rigid layer and the punch close to each other are respectively and uniformly distributed with grooves, and the grooves on the two surfacesThe trend is not mirror symmetry, the width and depth of the groove are not less than 2mm, and the density of the groove is 10-200m/m2。
In this embodiment, the thermal insulating nanomaterial is molded by the above apparatus, and the operation steps are as follows:
the method comprises the following steps: by moving out one of the upper and lower stamping structures, adding the nano heat-insulating material to be pressed into a die cavity surrounded by the die frame and the stamping structure which is not moved out;
step two: and resetting the moved stamping structure, and pressurizing the stamping according to the set pressure to press. And after the pressure maintaining is finished according to the specified time, moving out one or all of the upper and lower punch structures, and taking out the formed nano heat insulation material block to obtain the nano heat insulation material pressed component.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A nanometer thermal insulation material mould pressing forming device is characterized by comprising an upper mould punching structure, a lower mould punching structure and a mould frame, wherein the upper mould punching structure and the lower mould punching structure are combined type mould punching and are formed by connecting a preset layer and a mould punching, the preset layer comprises a buffer layer and a rigid layer, and the rigid layer is connected with the mould punching; the mould frame is of a closed type frame structure, and the peripheral outline of the rigid layer is consistent with and adjacent to the outline of the inner frame of the mould frame in shape; the buffer layer is positioned on the inner side surface of the rigid layer, and the buffer layer and the die frame jointly enclose a die cavity.
2. The apparatus of claim 1, wherein the mold frame is one-piece or a split-type.
3. The device of claim 1, wherein the rigid layer is connected to the plunger in a controlled manner, including a magnetic connection or a mechanical jaw connection, or in a contact-only unconnected manner.
4. The apparatus of claim 1, wherein the rigid layer is formed from a material selected from the group consisting of a metal material, a polymer material, a ceramic material, and a hard wood material.
5. The apparatus of claim 1, wherein a gap of not less than 1.5mm exists between the peripheral profile of the rigid layer and the inner frame profile of the mold frame, and a gap of 0.5-1mm remains between the cushioning layer and the mold frame.
6. The device of claim 1, wherein the cushioning layer is bonded to the rigid layer by silicone rubber.
7. The apparatus of claim 1, wherein the cushioning layer is a fabric layer having a thickness of not less than 1 mm; the density of warp and weft threads of the fabric is not more than 50 threads/cm; the fabric fiber selected by the buffer layer is ceramic fiber or polymer fiber.
8. The apparatus of claim 1, wherein the closest distance of the punch to the die frame is no less than 10 mm.
9. The apparatus of claim 1, wherein the outer surface of the die has attachment holes for mechanical attachment to a press.
10. The device of claim 1, wherein the rigid layer and the plunger have grooves uniformly distributed on their surfaces, the grooves on the surfaces have a non-mirror symmetry, the grooves have a width and depth of no less than 2mm, and the grooves have a density of 10-200m/m2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110978720.5A CN113878919B (en) | 2021-08-25 | 2021-08-25 | Mould pressing forming device for nanometer heat insulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110978720.5A CN113878919B (en) | 2021-08-25 | 2021-08-25 | Mould pressing forming device for nanometer heat insulation material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113878919A true CN113878919A (en) | 2022-01-04 |
| CN113878919B CN113878919B (en) | 2023-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110978720.5A Active CN113878919B (en) | 2021-08-25 | 2021-08-25 | Mould pressing forming device for nanometer heat insulation material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113878919B (en) |
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| CN110899693A (en) * | 2019-12-09 | 2020-03-24 | 株洲钻石切削刀具股份有限公司 | Forming method and forming device for powder metallurgy part |
| CN210908102U (en) * | 2019-09-29 | 2020-07-03 | 合肥波林新材料股份有限公司 | Pressing die for powder material |
| CN211000694U (en) * | 2019-07-16 | 2020-07-14 | 李英 | Compression molding equipment for wooden furniture |
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2021
- 2021-08-25 CN CN202110978720.5A patent/CN113878919B/en active Active
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| TW200505607A (en) * | 2003-08-15 | 2005-02-16 | Kinesis Industry Co Ltd | Method for forming a bicycle metal working component and device for same |
| CN2933844Y (en) * | 2006-07-20 | 2007-08-15 | 重庆长安汽车股份有限公司 | Stamping die for thin type material processing |
| CN101722608A (en) * | 2007-04-09 | 2010-06-09 | 杭州兴源过滤科技股份有限公司 | Die-pressing membrane filter plate and molding method thereof |
| JP2009000741A (en) * | 2007-05-23 | 2009-01-08 | Mitsuboshi Belting Ltd | Cushion material for hot pressing |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113878919B (en) | 2023-11-21 |
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