CN113873847A - Graphene honeycomb heat dissipation net and processing technology thereof - Google Patents
Graphene honeycomb heat dissipation net and processing technology thereof Download PDFInfo
- Publication number
- CN113873847A CN113873847A CN202111179762.9A CN202111179762A CN113873847A CN 113873847 A CN113873847 A CN 113873847A CN 202111179762 A CN202111179762 A CN 202111179762A CN 113873847 A CN113873847 A CN 113873847A
- Authority
- CN
- China
- Prior art keywords
- graphene
- honeycomb
- net
- heat dissipation
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a graphene honeycomb heat dissipation net and a processing technology thereof. The processing technology of the graphene honeycomb heat dissipation net comprises the following steps: s1: water plating and shaping; s2: thinning and forming; s3: spraying graphene powder; s4: stably drying; s5: hot melt adhesive composites; s6: and (5) cutting and forming. The advantages of the invention and the prior art are: 1. the finished product is ultrathin and can be 0.05 mm; 2. the heat dissipation is fast due to the ultrahigh heat conduction performance, low thermal resistance; 3. mass production can be realized, the productivity is high, and the delivery speed is high; 4. according to different price requirements of customers, various materials can be randomly matched, and the cost is controllable; 5. easy operation, light weight and can be cut into various molding specifications according to the requirements of customers.
Description
Technical Field
The invention relates to a heat dissipation net and a processing technology thereof, in particular to a graphene honeycomb heat dissipation net and a processing technology thereof.
Background
The traditional heat dissipation net has the following defects: 1. the thickness is too thick to be applied to ultra-thin products; 2. the process is complex, the cost is high, the efficiency is low, the shipment period is long, the mass production cannot be realized, and the customization is needed; 3. heat dissipation is slow. Therefore, it is an urgent problem to be solved by those skilled in the art to develop a graphene honeycomb heat dissipation mesh.
Disclosure of Invention
The invention provides a graphene honeycomb heat dissipation net and a processing technology thereof to solve the defects.
The above object of the present invention is achieved by the following technical means: the utility model provides a graphite alkene honeycomb radiator-grid, includes honeycomb network substrate and conducting material layer, honeycomb network substrate surface spraying is equipped with the graphite alkene coating to compound through hot melt adhesive and conducting material layer.
Further, the honeycomb net base material is formed by water plating and pressing polyurethane sponge.
Further, the conductive material layer is graphene copper foil, nickel-plated copper foil, nickel-plated copper foil (resistant to oxidation), aluminum foil, graphene aluminum foil, graphite sheet, or high-temperature insulating film.
The processing technology of the graphene honeycomb heat dissipation net comprises the following steps:
s1: plating plastic by water: soaking polyurethane sponge in the electroplating solution for 2-3 times (water plating), baking in a sealed stove (or oven), burning off the polyurethane sponge, soaking in the electroplating solution for 1 time (water plating), and making into thick honeycomb blank;
s2: thinning and forming: putting the thick honeycomb blank plated by water into a pressing device to be pressed into an extremely thin honeycomb net (the thinnest can be controlled to be 0.05-0.1 mm);
S3: spraying graphene powder: mixing graphene powder with resin, grinding the mixture to be in a glue state through grinding equipment, and spraying the glue graphene powder onto the pressed honeycomb net by using a spray gun;
s4: and (3) stabilizing and drying: in order to enable the graphene powder to be better attached to the honeycomb radiating net, the honeycomb net sprayed with the colloidal graphene powder is placed into a dryer to be dried, and the graphene honeycomb radiating net is obtained;
s5: hot melt adhesive composite: the dried graphene honeycomb radiating net is connected with hot melt adhesive to adhere the conductive material layer;
s6: cutting and forming: according to different product requirements, the cutting and shearing are carried out into different shapes, the cutting and shearing can be carried out at any time, and the operation is simple and convenient.
Further, the conductive material layer is made of a composite type conductive material layer.
Further, the conductive material is graphene copper foil, nickel-plated copper foil, nickel-plated copper foil (resistant to oxidation), aluminum foil, graphene aluminum foil, graphite sheet, or high-temperature insulating film.
The invention takes a graphene honeycomb net as a main substrate structure, any one of graphene copper foil, nickel-plated copper foil, nickel-plated copper foil (capable of resisting oxidation), aluminum foil, graphene aluminum foil, graphite flake or high-temperature insulating film is compounded to form a use raw material, a use structural member finished product is processed and formed by a jig mould device, the problems of heat dissipation, heat conduction and temperature reduction of an electronic original device product are solved, and the thickness of the material product can be made to be 0.05-0.1mm at the thinnest.
The advantages of the invention and the prior art are:
1. the finished product is ultrathin and can be 0.05 mm;
2. the heat dissipation is fast due to the ultrahigh heat conduction performance, low thermal resistance;
3. mass production can be realized, the productivity is high, and the delivery speed is high;
4. according to different price requirements of customers, various materials can be randomly matched, and the cost is controllable;
5. easy operation, light weight and can be cut into various molding specifications according to the requirements of customers.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, the graphene honeycomb heat dissipation mesh comprises a honeycomb substrate 1 and a conductive material layer 2, wherein a graphene coating (not shown) is sprayed on the surface of the honeycomb substrate 1, and is compounded with the conductive material layer 2 through a hot melt adhesive 3.
Further, the honeycomb net substrate 1 is formed by water plating and pressing polyurethane sponge.
Further, the conductive material layer 2 is a graphene copper foil, a nickel-plated copper foil, a nickel-plated copper foil (resistant to oxidation), an aluminum foil, a graphene aluminum foil, a graphite sheet, or a high-temperature insulating film.
The processing technology of the graphene honeycomb heat dissipation net comprises the following steps:
s1: plating plastic by water: soaking polyurethane sponge in the electroplating solution for 2-3 times (water plating), baking in a sealed stove (or oven), burning off the polyurethane sponge, soaking in the electroplating solution for 1 time (water plating), and making into thick honeycomb blank;
S2: thinning and forming: putting the thick honeycomb blank plated by water into a pressing device to be pressed into an extremely thin honeycomb net (the thinnest can be controlled to be 0.05-0.1 mm);
s3: spraying graphene powder: mixing graphene powder with resin, grinding the mixture to be in a glue state through grinding equipment, and spraying the glue graphene powder onto the pressed honeycomb net by using a spray gun;
s4: and (3) stabilizing and drying: in order to enable the graphene powder to be better attached to the honeycomb radiating net, the honeycomb net sprayed with the colloidal graphene powder is placed into a dryer to be dried, and the graphene honeycomb radiating net is obtained;
s5: hot melt adhesive composite: the dried graphene honeycomb radiating net is connected with hot melt adhesive to adhere the conductive material layer;
s6: cutting and forming: according to different product requirements, the cutting and shearing are carried out into different shapes, the cutting and shearing can be carried out at any time, and the operation is simple and convenient.
Further, the conductive material layer is made of a composite type conductive material layer.
Further, the conductive material is graphene copper foil, nickel-plated copper foil, nickel-plated copper foil (resistant to oxidation), aluminum foil, graphene aluminum foil, graphite sheet, or high-temperature insulating film.
The invention takes a graphene honeycomb net as a main substrate structure, any one of graphene copper foil, nickel-plated copper foil, nickel-plated copper foil (capable of resisting oxidation), aluminum foil, graphene aluminum foil, graphite flake or high-temperature insulating film is compounded to form a use raw material, a use structural member finished product is processed and formed by a jig mould device, the problems of heat dissipation, heat conduction and temperature reduction of an electronic original device product are solved, and the thickness of the material product can be made to be 0.05-0.1mm at the thinnest.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The utility model provides a graphite alkene honeycomb radiator mesh which characterized in that: the honeycomb-shaped composite material comprises a honeycomb-shaped substrate and a conductive material layer, wherein a graphene coating is sprayed on the surface of the honeycomb-shaped substrate and is compounded with the conductive material layer through a hot melt adhesive.
2. The graphene honeycomb heat-dissipating mesh according to claim 1, wherein: the honeycomb net base material is formed by water plating and pressing polyurethane sponge.
3. The graphene honeycomb heat-dissipating mesh according to claim 1, wherein: the conductive material layer is graphene copper foil, nickel-plated copper foil, aluminum foil, graphene aluminum foil, graphite sheet or high-temperature insulating film.
4. A processing technology of a graphene honeycomb heat dissipation net is characterized by comprising the following steps: the method comprises the following steps:
s1: plating plastic by water: soaking polyurethane sponge in the electroplating solution for 2-3 times, baking in a sealed stove or oven, removing polyurethane sponge, soaking in the electroplating solution for 1 time again to obtain thick honeycomb blank;
S2: thinning and forming: putting the thick honeycomb blank plated by water into pressing equipment to press a honeycomb net with the thickness of 0.05-0.1 mm;
s3: spraying graphene powder: mixing graphene powder with resin, grinding the mixture to be in a glue state through grinding equipment, and spraying the glue graphene powder onto the pressed honeycomb net by using a spray gun;
s4: and (3) stabilizing and drying: in order to enable the graphene powder to be better attached to the honeycomb radiating net, the honeycomb net sprayed with the colloidal graphene powder is placed into a dryer to be dried, and the graphene honeycomb radiating net is obtained;
s5: hot melt adhesive composite: the dried graphene honeycomb radiating net is connected with hot melt adhesive to adhere the conductive material layer;
s6: and (5) cutting and forming.
5. The processing technology of the graphene honeycomb heat dissipation net according to claim 4, characterized in that: the conductive material layer is composed of a composite conductive material layer.
6. The processing technology of the graphene honeycomb heat dissipation net according to claim 5, characterized in that: the conductive material is graphene copper foil, nickel-plated copper foil, aluminum foil, graphene aluminum foil, graphite sheet or high-temperature insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111179762.9A CN113873847A (en) | 2021-09-30 | 2021-09-30 | Graphene honeycomb heat dissipation net and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111179762.9A CN113873847A (en) | 2021-09-30 | 2021-09-30 | Graphene honeycomb heat dissipation net and processing technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113873847A true CN113873847A (en) | 2021-12-31 |
Family
ID=79002444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111179762.9A Pending CN113873847A (en) | 2021-09-30 | 2021-09-30 | Graphene honeycomb heat dissipation net and processing technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113873847A (en) |
-
2021
- 2021-09-30 CN CN202111179762.9A patent/CN113873847A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107338426B (en) | A method of high-adhesion silver metal pattern is grown on Kapton surface | |
| CN103447646B (en) | The welding method of soft chip circuit plate and metallic matrix is realized without special tooling | |
| CN201128344Y (en) | Intimating metal drawing sticking film | |
| CN216960578U (en) | Graphite alkene honeycomb radiator mesh | |
| CN113873847A (en) | Graphene honeycomb heat dissipation net and processing technology thereof | |
| CN105592578A (en) | Flexible fit-type nanometer electric heating film | |
| TW201500163A (en) | Method for in-mold decoration | |
| CN106313865B (en) | A kind of copper-based composite substrate, copper-clad plate and preparation method thereof | |
| CN111469329A (en) | Preparation method of heating sheet and heating sheet prepared by using preparation method | |
| CN203077767U (en) | Rolling device | |
| CN110602888A (en) | Preparation method of aluminum-lined high-frequency substrate | |
| CN113122189A (en) | Heat-conducting composite material, preparation method and application thereof | |
| CN102259447A (en) | Method for manufacturing abnormal polytetrafluoroethylene copper-clad plate | |
| CN202205477U (en) | Thin PTFE material belt for cables | |
| CN214083260U (en) | PTFE high-frequency high-speed copper-clad plate | |
| TWI727112B (en) | Manufacturing method of insulating aluminum material and insulating aluminum material, insulating aluminum shell and electronic component products | |
| CN104582278B (en) | A kind of circuit board and preparation method thereof | |
| CN105702644A (en) | Aluminium alloy graphite alkene heat radiation product and manufacture method | |
| JP2010076443A (en) | Method for molding of textiles | |
| CN112389044A (en) | PTFE high-frequency high-speed copper-clad plate and preparation method thereof | |
| CN212826922U (en) | Heatable curved dividing wall bonding composite die | |
| CN116042189A (en) | Heat-conducting composite material, preparation method and application thereof | |
| CN210172544U (en) | Silver microchip with high temperature resistance function | |
| CN108172676A (en) | A kind of LED Ceramic Composites package substrate and its production technology | |
| CN101414654B (en) | Technique for preparing high-power LED ceramic heat-dissipating substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |