CN113871684A - Method for manufacturing battery - Google Patents

Method for manufacturing battery Download PDF

Info

Publication number
CN113871684A
CN113871684A CN202111123764.6A CN202111123764A CN113871684A CN 113871684 A CN113871684 A CN 113871684A CN 202111123764 A CN202111123764 A CN 202111123764A CN 113871684 A CN113871684 A CN 113871684A
Authority
CN
China
Prior art keywords
circuit board
adhesive layer
solvent
channel
reinforcing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111123764.6A
Other languages
Chinese (zh)
Inventor
张静
蔡家榕
文艺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Nvt Technology Co Ltd
Original Assignee
Dongguan Nvt Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Nvt Technology Co Ltd filed Critical Dongguan Nvt Technology Co Ltd
Priority to CN202111123764.6A priority Critical patent/CN113871684A/en
Publication of CN113871684A publication Critical patent/CN113871684A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/60—Arrangements or processes for filling or topping-up with liquids; Arrangements or processes for draining liquids from casings
    • H01M50/609—Arrangements or processes for filling with liquid, e.g. electrolytes
    • H01M50/627—Filling ports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

The application discloses a method for manufacturing a battery, comprising the following steps: arranging an adhesive layer and a reinforcing plate on the first surface of the circuit board, wherein the adhesive layer fixes the reinforcing plate on the first surface of the circuit board, and one side, facing the circuit board, of the reinforcing plate is provided with a channel allowing a solvent to flow, and the channel is connected with the adhesive layer; attaching the electronic component to the circuit board; and injecting a solvent into the channel, wherein the solvent dissolves the adhesive layer or reduces the adhesive force of the adhesive layer, and the reinforcing plate and at least part of the adhesive layer are separated from the circuit board. The reinforcing plate is used for reinforcing the circuit board, so that the shape of the circuit board is fixed, the risks of falling of electronic components, cracking of the circuit board and the like are reduced, and the yield of products is improved.

Description

Method for manufacturing battery
Technical Field
The application relates to the field of batteries, in particular to a manufacturing method of a battery.
Background
In order to meet the trend of light and thin for various electric devices, controlling the battery volume has become a mainstream in the industry. In order to reduce the size of the battery as much as possible, manufacturers generally aim to make the most use of the head space of the battery, and one of the technical means adopted is to thin the circuit board. However, if the thickness of the circuit board is reduced, the structural strength is reduced, and the circuit board is easily deformed, so that the risk of falling off of the electronic component, cracking of the circuit board and the like is high, and the product yield is low.
Disclosure of Invention
The embodiment of the application provides a manufacturing method of a battery, which is used for solving the problems that electronic components fall off, circuit boards crack and the like affect the yield of products due to the fact that the thickness of the head of the battery is reduced.
In a first aspect, an embodiment of the present application provides a method for manufacturing a battery, including steps S1 to S3. S1, arranging an adhesive layer and a reinforcing plate on the first surface of the circuit board, wherein the reinforcing plate is fixed on the first surface of the circuit board by the adhesive layer, and a channel allowing a solvent to flow is arranged on one side, facing the circuit board, of the reinforcing plate and is connected with the adhesive layer; s2, attaching the electronic component to the circuit board; and S3, injecting a solvent into the channel, wherein the solvent dissolves the adhesive layer or reduces the adhesive force of the adhesive layer, and the reinforcing plate and at least part of the adhesive layer are separated from the circuit board. The reinforcing plate is used for reinforcing the circuit board, so that the shape of the circuit board is favorably fixed, the circuit board is not easy to deform in the processes of attaching electronic components and the like, the risks of falling of the electronic components, cracking of the circuit board and the like are reduced, and the yield of products is improved; the bonding force of the bonding layer is dissolved or reduced through the solvent, the reinforcing plate is separated from the circuit board, the thickness of the circuit board is unchanged, and the requirement for thinning the head of the battery is met.
In some embodiments, the channel further includes an injection port and an exhaust port, and the solvent injected from the injection port flows towards the exhaust port, which can facilitate the flow of the solvent in the channel, so that the solvent is fully contacted with the adhesive layer, and the adhesive layer is dissolved or the adhesive force of the adhesive layer is reduced in time, thereby facilitating the separation of the reinforcing plate from the circuit board.
In some embodiments, the channel extends along the length direction of the circuit board, and the injection port and the discharge port of the channel are respectively arranged at two opposite ends of the circuit board along the length direction, or are arranged at the same end of the circuit board, so that the length of the channel can be increased, the flowing time of the solvent in the channel is prolonged, the solvent is fully contacted with the bonding layer, and the separation of the reinforcing plate and the circuit board is facilitated.
In some embodiments, the reinforcing plate is provided with at least two channels, and the at least two channels are communicated with each other, so that the total length of the channels can be increased, the flowing time of the solvent in the channels is prolonged, the solvent is fully contacted with the bonding layer, and the separation of the reinforcing plate and the circuit board is facilitated.
In some embodiments, the channel extends in at least one of a straight line, a curved line, and a broken line. The linear channel is favorable for the flow of the solvent in the channel, takes away the dissolved adhesive layer in time and improves the concentration of the solvent. The length of the channel can be increased by the channel with the curve line or the broken line, and the flowing time of the solvent in the channel is prolonged, so that the solvent is fully contacted with the bonding layer, and the separation of the reinforcing plate and the circuit board is facilitated.
In some embodiments, the channel includes a first portion and a second portion, and the second portion is connected to at least one side of the first portion, so that the length of the channel can be increased, and the flowing time of the solvent in the channel can be prolonged, so that the solvent is fully contacted with the adhesive layer, and the separation of the reinforcing plate and the circuit board is facilitated.
In some embodiments, one end of the second portion communicates with the first portion, and the other end of the second portion is disposed opposite to the edge of the reinforcing plate or exposed at the edge of the reinforcing plate and serves as a discharge port of the passage.
In some embodiments, the included angle between the extending directions of the first part and the second part is alpha, and alpha is more than 0 and less than or equal to 160 degrees, so that the impact force of the solvent entering the second part from the first part can be increased, and the impact force of the solvent on the adhesive layer in contact with the second part is large, thereby being beneficial to dissolving the adhesive layer.
In some embodiments, the adhesion force of the adhesive layer is greater than or equal to 1600gf/in before injecting the solvent2After contact with a solvent, the adhesive force of the adhesive layer is less than or equal to 100gf/in2。
In some embodiments, the channel is provided with an opening connected with the bonding layer, and the width of the opening is smaller than or equal to the maximum width of the channel along the width direction of the circuit board, so that the impact force of the solvent on the bonding layer can be increased, the contact between the bonding layer and the bonding layer is improved, and the separation of the reinforcing plate and the circuit board is facilitated.
In some embodiments, the solvent comprises: at least one of ethanol, isopropanol, diethyl ether, toluene, xylene, pentane, hexane, and octane.
In some embodiments, the material of the bonding layer comprises at least one of carboxymethyl cellulose, styrene butadiene rubber, polyvinylidene fluoride, polytetrafluoroethylene, fluorinated rubber, polyurethane, polyvinyl alcohol, sodium polyacrylate, polyether amide, or acrylate. The bonding layer prepared from the materials has higher structural strength after being cured, is not easy to deform, and can be matched with a reinforcing plate to fix the form of the circuit board.
In some embodiments, the thickness of the adhesive layer is D, and D is greater than 0mm and less than or equal to 10mm, so that the adhesive layer has certain deformation resistance and can be matched with a reinforcing plate to fix the form of the circuit board.
In some embodiments, after the step of S2 and before the step of S3, the method of manufacturing the battery includes the step of S21. And S21, electrically connecting the circuit board to the battery cell.
In some embodiments, after the step of S3, the method of manufacturing the battery includes a step S4. S4, forming an injection molding body at the end part of the battery cell, where the circuit board is arranged, wherein one end of the circuit board is arranged in the injection molding body, and the other end of the circuit board extends out of the injection molding body. The injection molding body coats the circuit board and the electronic components on the circuit board, so that the circuit board can be fixed and is not easy to deform, and the circuit board and the electronic components in the injection molding body can be protected, so that the product yield is further improved.
Drawings
Fig. 1 is a schematic flow chart of a method of manufacturing a battery according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram illustrating the application of bonding a stiffener to a first surface of a circuit board;
FIG. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a first reinforcing plate according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of a second stiffening plate according to an embodiment of the present disclosure;
FIG. 6 is a top view of a third stiffener according to an embodiment of the present disclosure;
FIG. 7 is a top view of a fourth stiffener according to an embodiment of the present disclosure;
FIG. 8 is a top view of a fifth reinforcement panel according to an embodiment of the present disclosure;
FIG. 9 is a top view of a sixth reinforcing plate according to an embodiment of the present disclosure;
FIG. 10 is a schematic cross-sectional view of the stiffener shown in FIG. 6 taken along the direction A-A;
FIGS. 11 and 12 are schematic views of partial structures of a battery according to an embodiment of the present application;
fig. 13 is a schematic structural view of a battery according to another embodiment of the present application;
fig. 14 is a schematic flow chart of a method of manufacturing a battery according to another embodiment of the present application.
Detailed Description
In the embodiment of the application, the reinforcing plate is fixed on the circuit board by the adhesive layer, the circuit board is reinforced by the reinforcing plate, the shape of the circuit board is favorably fixed, and the circuit board is not easy to deform in the processes of attaching electronic components and the like, so that the risks of falling off of the electronic components, cracking of the circuit board and the like are reduced, and the yield of products is improved; the bonding force of the bonding layer is dissolved or reduced through the solvent, the reinforcing plate is separated from the circuit board, and the requirement for thinning the thickness of the head of the battery can be met on the premise of not changing the thickness of the circuit board.
The function of the circuit board should be set according to the actual required adaptability. For example, the circuit board may be used to implement overcurrent protection, overvoltage protection, charge protection, power detection, output short-circuit protection, temperature detection, and the like of the battery. The Circuit Board may be embodied in the form of a Printed Circuit Board (PCB) or a Flexible Printed Circuit Board (FPC).
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described below in detail with reference to specific embodiments and accompanying drawings. It should be apparent that the embodiments described below are only some embodiments of the present application, and not all embodiments. In the following embodiments and technical features thereof, all of which are described below may be combined with each other without conflict, and also belong to the technical solutions of the present application.
It should be understood that in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing technical solutions and simplifying the description of the respective embodiments of the present application, and do not indicate or imply that a device or an element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a battery according to an embodiment of the present disclosure. Referring to fig. 1, the method for manufacturing the battery may include the following steps S1 to S3.
And S1, arranging an adhesive layer and a reinforcing plate on the first surface of the circuit board, wherein the reinforcing plate is fixed on the first surface of the circuit board by the adhesive layer, one side of the reinforcing plate facing the circuit board is provided with a channel allowing the solvent to flow, and the channel is connected with the adhesive layer.
Referring to fig. 2 and 3, the structural strength of the stiffener 21 is greater than that of the circuit board 10, including but not limited to FR4 stiffener, plastic board, metal board, etc. The circuit board 10 is reinforced by the reinforcing plate 21, the shape of the circuit board 10 is fixed, and the circuit board 10 is not easily deformed in the subsequent processes (for example, the electronic component 11 is disposed in step S2, or the circuit board 10 is electrically connected to the battery cell 30).
The curvature of the surface of the reinforcing plate 21 to which the circuit board 10 is bonded may be the same, for example, the surface to which both are bonded is a flat surface. The circuit board 10 may be an elongated circuit board, and the stiffener 21 is suitably an elongated stiffener. Along the second direction y, the circuit board 10 includes a first surface 101 and a second surface 102 disposed oppositely, the second surface 102 is used for disposing the electronic component 11, and the reinforcing plate 21 is adhered to the first surface 101. The second direction y is a thickness direction of the circuit board 10, and optionally, a length direction of the circuit board 10 is the first direction x, and a width direction of the circuit board 10 is the third direction z. It should be understood that in other embodiments, the first surface 101 of the circuit board 10 may also be provided with the electronic component 11.
The curvature of the surface where the reinforcing plate 21 is bonded to the circuit board 10 may also be different, the bonding layer 22 bonds the reinforcing plate 21 to the circuit board 10, and the bonding layer 22 fills the overlapping area between the reinforcing plate 21 and the circuit board 10, for example, as shown in fig. 2, the bonding layer 22 may fill the area between the reinforcing plate 21 and the first surface 101 of the circuit board 10, so as to achieve stable bonding between the reinforcing plate 21 and the circuit board 10.
Referring to fig. 4 to 10, a channel 211 is disposed on a side of the stiffener 21 facing the circuit board 10, the channel 211 allows fluid to flow through, and an opening 211a is disposed on a side of the stiffener 21 facing the circuit board 10, in other words, the channel 211 can be regarded as a groove opened by the stiffener 21. In a state where the reinforcing plate 21 is bonded to the circuit board 10, the via 211 is connected to the adhesive layer 22.
In some embodiments, as shown in fig. 10, the width W of the opening 211a is along the width direction (i.e., the third direction z) of the circuit board 101Less than or equal to the maximum width W of the channel 2110When the solvent is injected into the channel 211, the solvent is pressed by the side wall of the channel 211, so that the impact force of the solvent on the adhesive layer 22 can be increased, the contact between the solvent and the adhesive layer 22 is improved, and the separation of the reinforcing plate 21 and the circuit board 10 is facilitated. The cross-sectional shape of the channel 211 is not limited in the embodiments of the present application, and may be, for example, a trapezoid as shown in fig. 10, or a polygon such as a circle or a rectangle that meets the actual requirement.
As shown in fig. 4 to 9, the passage 211 is provided with an injection port 2111 and a discharge port 2112.
And S2, attaching the electronic component to the circuit board.
The circuit board 10 is provided with traces, and the electronic component 11 is disposed on the circuit board 10 and connected to the traces to implement corresponding functions. In practical application scenarios, the electronic components 11 include, but are not limited to: resistors, capacitors, temperature sensors, ICs, etc. In some embodiments, the electronic component 11 may be disposed on the circuit board 10 by Surface Mount Technology (SMT).
Viewed from the perspective along the second direction y, the orthographic projection of the electronic component 11 may be located in the orthographic projection of the reinforcing plate 21, that is, the electronic component 11 is located in the region of the circuit board 10 reinforced by the reinforcing plate 21, which is beneficial to reducing the risk that the electronic component 11 falls off from the circuit board 10.
After the step of S2, as shown in fig. 14, the method of manufacturing a battery may further include a step of S20.
And S20, forming a packaging part on the surface of the electronic component.
With reference to fig. 2 and fig. 3, the sealing portion 12 and the circuit board 10 form a sealed space 121, the electronic component 11 is accommodated in the sealed space 121, the electronic component 11 is isolated from the outside, and during the process of separating the reinforcing plate 21 from the circuit board 10 and using the battery 1 (for example, during charging and discharging), the risk of dropping the electronic component 11 is reduced, and the electronic component 11 is protected from corrosion and insulation.
The sealing portion 12 may be made of a material having insulating, corrosion-resistant, waterproof, and other properties, and the material of the sealing portion 12 includes but is not limited to: ABS (acrylonitrile-butadiene-styrene), PP (high polymer polypropylene), PVC (polyvinyl chloride), PC (polycarbonate), and the like. Depending on the material of the encapsulation 12, in some scenarios, the encapsulation 12 may be formed in one shot by a low pressure injection molding process.
After the step of S2 or the step of S20, as shown in fig. 14, a step of S21 may be further included.
And S21, electrically connecting the circuit board to the battery cell.
As shown in fig. 11 to 13, the battery cell 30 may include a casing 31, an electrode assembly (not shown), and tabs 32. In a scenario where the battery cell 30 includes positive and negative polarities, the electrode assembly includes a positive electrode plate, a negative electrode plate, and a separator disposed between the positive electrode plate and the negative electrode plate. The electrode assembly may be formed by winding or stacking several pole pieces, one end of the tab 32 is protruded into the case 31 and electrically connected to the pole piece of the corresponding polarity, and the other end of the tab 32 is protruded from one side of the case 31.
The tabs 32 include a first tab 32a and a second tab 32b, the first tab 32a may be a negative tab and the second tab 32b a positive tab. The first tab 32a is electrically connected to the negative electrode tab and extends from the inside of the case 31 to the outside of the case 31, and the second tab 32b is electrically connected to the positive electrode tab and extends from the inside of the case 31 to the outside of the case 31. It should be understood that in other embodiments, the first tab 32a may also be a positive tab, and correspondingly, the second tab 32b may be a negative tab. The structure of the tab 32 and its connection to other elements of the present application embodiment will be described herein, in some instances with respect to one of the elements.
The circuit board 10 and the tab 32 may be electrically connected by, for example, welding. For example, the second surface 102 of the circuit board 10 is reserved with a welding area, and the tab 32 is welded with the welding area. For another example, the second surface 102 of the circuit board 10 may be provided with a conductive tab connector, which is a plate structure with a small thickness, and the tab connector is welded to the tab 32 for electrical connection.
In the scenarios shown in fig. 11 to 13, the width direction of the circuit board 10 is the same as the length direction of the battery cell 30, and both directions are the third direction z. In other scenarios, the width direction of the circuit board 10 may be the same as the thickness direction of the battery cell 30, that is, the circuit board 10 is flatly placed on the top wall 33 of the battery cell 30, and the circuit board 10 and the top wall 33 may be parallel or have an included angle smaller than 90 °, which is not limited in the embodiment of the present application.
And S3, injecting a solvent into the channel through the injection port, wherein the solvent dissolves the adhesive layer or reduces the adhesive force of the adhesive layer, and the reinforcing plate and at least part of the adhesive layer are separated from the circuit board.
Step S3 includes at least two cases: firstly, dissolving the adhesive layer 22 by a solvent to separate the reinforcing plate 21 from the circuit board 10; alternatively, the adhesive layer 22 may be dissolved and mixed in the solvent, and discharged out of the channel 211 along the flowing direction of the solvent; secondly, after the solvent is contacted with the adhesive layer 22, the adhesive force of the adhesive layer 22 is reduced, so that the reinforcing plate 21 is separated from the circuit board 10; for example, in some scenarios, the adhesion force of the bonding layer 22 is greater than or equal to 1600gf/in prior to injecting the solvent2The adhesion stability of the reinforcing plate 21 and the circuit board 10 before treatment is favorably satisfied; in situ pouringAfter the solvent is added, the adhesive force of the adhesive layer 22 is less than or equal to 100gf/in2It is advantageous to separate the reinforcing plate 21 from the circuit board 10.
Before separation, the reinforcing plate 21 is used for reinforcing the circuit board 10, which is beneficial to fixing the shape of the circuit board 10, so that the circuit board 10 is not easy to deform in each process of the battery, such as the processes of steps S2, S20 and S21, risks such as falling off of the electronic component 11 and cracking of the circuit board 10 are reduced, and the product yield is improved; after the reinforcing plate 21 is separated from the circuit board 10, the thickness of the circuit board 10 is unchanged, and the requirement of reducing the thickness of the head part of the battery can be met. In addition, in the process of dissolving the adhesive layer 22 by the solvent or reducing the adhesive force of the adhesive layer 22, the circuit board 10 is not subjected to a large force, the acting force on the circuit board 10 when the solvent is injected into the channel is extremely small, and the risk of deformation of the circuit board 10 can also be reduced.
The material of the solvent may be determined according to the material adaptability of the adhesive layer 22, and the embodiment of the present application is not limited. For example, the materials of the adhesive layer 22 include, but are not limited to: at least one of carboxymethyl cellulose, styrene-butadiene rubber, polyvinylidene fluoride, polytetrafluoroethylene, fluorinated rubber, polyurethane, polyvinyl alcohol, sodium polyacrylate, polyether amide imide or acrylate; materials for the solvent include, but are not limited to: at least one of ethanol, isopropanol, diethyl ether, toluene, xylene, pentane, hexane, and octane.
In some embodiments, the adhesive layer 22 may also assist in reinforcing the circuit board 10 with its own structural strength. For example, the adhesive layer 22 made of the above materials has high structural strength and is not easy to deform; for example, the thickness of the adhesive layer 22 is D, and D is greater than 0mm and less than or equal to 10mm, and the thickness of the adhesive layer 22 is within the threshold range, so that not only can the reinforcing plate 21 be stably adhered to the circuit board 10, but also the adhesive layer 22 itself has a certain deformation resistance, and can be matched with the reinforcing plate 21 to fix the form of the circuit board 10, so that the circuit board 10 with a smaller thickness is not easily deformed.
After step S3, the adhesive layer 22 may partially remain on the circuit board 10, and thus a portion of the adhesive layer 22 may remain on the finally manufactured circuit board 10. Here, the remaining adhesive layer 22 may help to reinforce the circuit board 10 by its own structural strength, so that it is not easily deformed.
In the scenarios shown in fig. 4 to 9, the solvent injected from the injection port 2111 flows toward the discharge port 2112, which may facilitate the flow of the solvent in the channel 211, so that the solvent is sufficiently contacted with the adhesive layer 22, and the adhesive layer 22 is dissolved or the adhesive force of the adhesive layer 22 is reduced in time, thereby facilitating the separation of the reinforcing plate 21 from the circuit board 10. It should be understood that in other scenarios, the channel 211 may not be provided with the discharge port 2112, but only with the injection port 2111, and the air in the channel 211 is continuously discharged along with the injection of the solvent, so as to facilitate the solvent to flow to various parts of the channel 211 in time, and improve the contact of the solvent with the adhesive layer 22. The present application will be described below with an example in which the passage 211 includes an injection port 2111 and a discharge port 2112.
In the embodiment shown in fig. 4, 6 to 9, the channel 211 extends along the length direction x of the circuit board 10, the injection port 2111 and the discharge port 2112 of the channel 211 are respectively disposed at two opposite ends of the circuit board 10 along the length direction x, and the channel 211 can penetrate through the length of the circuit board 10, so that the length of the channel 211 is larger, the flowing time of the solvent in the channel 211 is prolonged, the solvent is in sufficient contact with the adhesive layer 22, and the separation of the reinforcing plate 21 and the circuit board 10 is facilitated.
In the embodiment shown in fig. 5, the inlet 2111 and the outlet 2112 of the channel 211 are both disposed at the same end of the circuit board 10, and at least two paths allowing the solvent to flow are included in the length direction of the circuit board 10, the flow path of the solvent is longer, the contact area between the adhesive layer 22 and the solvent is larger, the contact is sufficient, and the separation of the reinforcing plate 21 and the circuit board 10 is further facilitated.
In the embodiment shown in fig. 4 to 7, the reinforcing plate 21 is provided with one passage 211. In the embodiment shown in fig. 8, the reinforcing plate 21 is provided with two channels 211, and the two channels 211 are communicated with each other, so that the total length of the channels 211 can be increased, the flowing time of the solvent in the channels 211 can be prolonged, the solvent is fully contacted with the adhesive layer 22, and the separation of the reinforcing plate 21 and the circuit board 10 is further facilitated. It should be understood that the reinforcing plate 21 may be provided with other number of channels 211, at least two of the channels 211 are communicated, and the flowing time of the solvent in the channels 211 may be prolonged.
In some embodiments, the extending direction of each channel 211 is at least one of a straight line, a curved line and a broken line, but is not limited thereto. The linear channel 211 is beneficial to the flow of the solvent in the channel 211, and the dissolved adhesive layer 22 is taken away in time, so that the concentration of the solvent is improved. The curved or broken channel 211 can increase the length of the channel 211 and prolong the flowing time of the solvent in the channel 211, so that the solvent is fully contacted with the adhesive layer 22, and the separation of the reinforcing plate 21 and the circuit board 10 is facilitated.
In the embodiment shown in FIG. 9, the channel 211 includes a first portion 2115 and a second portion 2116, the second portion 2116 communicating with both sides of the first portion 2115, and other embodiments may provide for the second portion 2116 communicating with one side of the first portion. The first portion 2115 may be considered a trunk of the channel 211, and the second portion 2116 may be considered a branch of the first portion 2115, with the channel 211 being arranged in a crotch. The length of the channel 211 can be increased, and the flowing time of the solvent in the channel 211 is prolonged, so that the solvent is fully contacted with the adhesive layer 22, and the separation of the reinforcing plate 21 and the circuit board 10 is more facilitated.
One end of the second portion 2116 communicates with the first portion 2115, and the other end of the second portion 2116 may be disposed opposite the edge of the reinforcing plate 21 (as shown in fig. 9). Alternatively, the other end of the second portion 2116 is exposed at the edge of the reinforcing plate 21 and serves as a discharge port for the channel, facilitating the flow of solvent to various regions of the channel in time, such that the solvent is in sufficient contact with the adhesive layer 22.
The included angle between the extending directions of the first portion 2115 and the second portion 2116 is alpha, in some embodiments, 0 is greater than alpha and less than or equal to 160 degrees, so that the impact force of the solvent entering the second portion 2116 from the first portion 2115 can be increased, the impact force of the solvent on the adhesive layer 22 in contact with the second portion 2116 is large, and timely and sufficient dissolution of the adhesive layer 22 or reduction of the adhesive force of the adhesive layer 22 is facilitated.
Referring to fig. 14, in some embodiments, after the step of S3, the method for manufacturing the battery includes a step of S4. S4, forming an injection molding body at the end part of the battery cell, where the circuit board is arranged, wherein one end of the circuit board is arranged in the injection molding body, and the other end of the circuit board extends out of the injection molding body.
In an embodiment, for example, referring to fig. 11 to 13, one end (e.g., a main portion) of the circuit board 10 is disposed in the injection molded body 40, and the other end 211 of the circuit board 10 is disposed with the external terminal 212, and the other end 211 extends out of the injection molded body 40, so that the external terminal 212 of the circuit board 10 is disposed outside the injection molded body 40, allowing the external terminal 212 to be connected to an external device, which includes but is not limited to a load. The injection molded body 40 can protect the tab 32, the circuit board 10 and the electronic component 11 thereon.
The injection molding body 40 coats the circuit board 10 and the electronic components 11 on the circuit board, so that the form of the circuit board 10 can be fixed, the circuit board is not easy to deform, and the risks of falling off of the electronic components 11, cracking of the circuit board 10 and the like are reduced. In addition, the injection molded body 40 and the battery cell 30 form a closed accommodating space, so that the circuit board 10, the electronic component 11 and the tab 32 in the accommodating space are protected, and the product yield can be improved.
The injection molded body 40 may be made of a material having insulating, corrosion-resistant, waterproof, and other properties, including but not limited to: ABS, PP, PVC, PC, etc. Depending on the material of the injection molded body 40, in some embodiments, the injection molded body 40 may be formed in one piece by a low pressure injection molding or potting process.
The injection molded body 40 can reduce corrosion of components located inside the injection molded body 40, and improve corrosion resistance of the battery 1. For example, taking the injection molded body 40 made of PP as an example, in a scene of testing the corrosion resistance of the injection molded body 40 through salt spray, the battery 1 is placed in a salt spray test box, a salt spray environment is generated in a volume space of the salt spray test box to test the salt spray corrosion resistance of the product, and after a predetermined time (for example, 1 hour) is passed under a high temperature condition, the ratio of the corrosion area of the injection molded body 40 to the total area is almost zero, so that the components in the injection molded body 40 can be well prevented from being corroded by the outside.
In a specific scenario, the battery 1 manufactured by the method of the foregoing embodiments includes, but is not limited to, all kinds of primary batteries, fuel cells, solar cells, and capacitor (e.g., supercapacitor) batteries, and may be a pouch battery. The battery 1 may preferably be a lithium battery. In addition, the battery 1 may be in the form of a single battery, a battery cell, or a battery module.
The embodiment of the application also provides an electronic device, which comprises a load and the battery 1 prepared by the method of any one of the embodiments, wherein the battery 1 is used for supplying power to the load.
Electronic devices can be implemented in various specific forms, for example, electronic products such as unmanned aerial vehicles, electric cleaning tools, energy storage products, electric vehicles, electric bicycles, electric navigation tools, and the like. In a practical scenario, the electronic device specifically includes but is not limited to: the power supply comprises a standby power supply, a motor, an automobile, a motorcycle, a power-assisted bicycle, a bicycle electric tool, a household large-scale storage battery, a lithium ion capacitor and the like.
It will be appreciated by those skilled in the art that the configuration according to the embodiments of the present application can be applied to a fixed type of electronic device in addition to elements particularly used for moving purposes.
Since the electronic device has the battery 1 manufactured by the method of any one of the foregoing embodiments, the electronic device can produce the advantageous effects of the battery 1 according to the corresponding embodiment.
Although the terms "first, second, etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
Although step numbers such as S1 and S2 are used herein, the purpose is to briefly describe the corresponding content more clearly, and not to constitute a substantial limitation on the sequence, and in the specific implementation, S2 may be performed first, and then S1 may be performed, which are all within the protection scope of the present application.
It should be understood that the above-mentioned embodiments are only some examples of the present application, and not intended to limit the scope of the present application, and all structural equivalents made by those skilled in the art using the contents of the present specification and the accompanying drawings are also included in the scope of the present application.

Claims (14)

1. A method of manufacturing a battery, comprising:
s1, arranging an adhesive layer and a reinforcing plate on the first surface of the circuit board, wherein the adhesive layer fixes the reinforcing plate on the first surface of the circuit board, and one side of the reinforcing plate facing the circuit board is provided with a channel allowing a solvent to flow, and the channel is connected with the adhesive layer;
s2, attaching the electronic component to the circuit board;
and S3, injecting the solvent into the channel, wherein the solvent dissolves the adhesive layer or reduces the adhesive force of the adhesive layer, and the reinforcing plate and at least part of the adhesive layer are separated from the circuit board.
2. The method of claim 1, wherein the channel further comprises an injection port and a discharge port, the solvent injected by the injection port flowing toward the discharge port.
3. The method of claim 2, wherein the channel extends along a length direction of the circuit board, and the inlet and the outlet of the channel are respectively disposed at two opposite ends of the circuit board along the length direction, or are disposed at the same end of the circuit board.
4. The method of claim 1, wherein the stiffener is provided with at least two of the channels, and wherein at least two of the channels are in communication therewith.
5. The method of any one of claims 1 to 4, wherein the channel extends in at least one of a straight line, a curved line and a broken line.
6. The method of any one of claims 1 to 4, wherein the channel comprises a first portion and a second portion, the second portion communicating with at least one side of the first portion.
7. The method of claim 6, wherein one end of the second portion communicates with the first portion and the other end of the second portion is disposed opposite to the edge of the stiffener or is exposed at the edge of the stiffener and serves as a discharge port for the channel.
8. A method according to claim 6, characterised in that the angle between the direction of extension of the first part and the direction of extension of the second part is α, and 0 < α ≦ 160 °.
9. The method of claim 1, wherein the adhesion force of the adhesive layer is greater than or equal to 1600gf/in before the solvent is injected2After contact with the solvent, the adhesive force of the adhesive layer is less than or equal to 100gf/in2。
10. The method of claim 1, wherein the via is provided with an opening connected to the adhesive layer, and a width of the opening is less than or equal to a maximum width of the via in a width direction of the circuit board.
11. The method of claim 1,
the solvent comprises: at least one of ethanol, isopropanol, diethyl ether, toluene, xylene, pentane, hexane, octane;
the material of the bonding layer comprises at least one of carboxymethyl cellulose, styrene-butadiene rubber, polyvinylidene fluoride, polytetrafluoroethylene, fluorinated rubber, polyurethane, polyvinyl alcohol, sodium polyacrylate, polyether amide imide or acrylate.
12. The method of claim 1, wherein the adhesive layer has a thickness D, and 0mm < D ≦ 10 mm.
13. The method of claim 1, wherein after the step of S2 and before the step of S3, the method comprises: and S21, electrically connecting the circuit board to the battery cell.
14. The method according to claim 1, wherein after the step of S3, the method comprises: s4, forming an injection molding body at the end part of the battery cell, where the circuit board is arranged, wherein one end of the circuit board is arranged in the injection molding body, and the other end of the circuit board extends out of the injection molding body.
CN202111123764.6A 2021-09-24 2021-09-24 Method for manufacturing battery Pending CN113871684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111123764.6A CN113871684A (en) 2021-09-24 2021-09-24 Method for manufacturing battery

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111123764.6A CN113871684A (en) 2021-09-24 2021-09-24 Method for manufacturing battery

Publications (1)

Publication Number Publication Date
CN113871684A true CN113871684A (en) 2021-12-31

Family

ID=78994018

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111123764.6A Pending CN113871684A (en) 2021-09-24 2021-09-24 Method for manufacturing battery

Country Status (1)

Country Link
CN (1) CN113871684A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095538A (en) * 2003-07-31 2004-03-25 Toshiba Corp Nonaqueous electrolyte secondary battery
CN109786658A (en) * 2017-11-10 2019-05-21 宁德时代新能源科技股份有限公司 Electrode pole piece, electrode pole piece preparation method and lithium ion battery
CN113036204A (en) * 2019-12-09 2021-06-25 北京小米移动软件有限公司 Battery pack and electronic device
CN113422151A (en) * 2021-06-09 2021-09-21 东莞新能德科技有限公司 Method for manufacturing battery, battery and electric equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095538A (en) * 2003-07-31 2004-03-25 Toshiba Corp Nonaqueous electrolyte secondary battery
CN109786658A (en) * 2017-11-10 2019-05-21 宁德时代新能源科技股份有限公司 Electrode pole piece, electrode pole piece preparation method and lithium ion battery
CN113036204A (en) * 2019-12-09 2021-06-25 北京小米移动软件有限公司 Battery pack and electronic device
CN113422151A (en) * 2021-06-09 2021-09-21 东莞新能德科技有限公司 Method for manufacturing battery, battery and electric equipment

Similar Documents

Publication Publication Date Title
EP3671903B1 (en) Battery module having bus bar assembly
US20200144580A1 (en) Battery module comprising bus bar assembly
CN102683734B (en) Secondary cell and secondary cell bag
CN101542772B (en) Electric storage device
CN113422151B (en) Method for manufacturing battery, battery and electric equipment
US8623532B2 (en) Rechargeable battery
CN113394493A (en) Lithium ion battery and electric vehicle with same
EP1487031A2 (en) Film covered battery and stacked battery assembly
WO2017161835A1 (en) Battery module
EP3522252A1 (en) Assembled battery
CN103066339B (en) Integrated units voltage sensing circuit device for fusing
US20120009443A1 (en) Battery Pack for a Lithium Polymer Battery
US7733055B2 (en) Battery pack and method of manufacturing the same
US20160276647A1 (en) Battery pack
CN112701428A (en) End cover assembly, battery monomer, battery and consumer
CN107615514B (en) Battery module and battery pack including the same
US11901589B2 (en) Cylindrical secondary battery module
KR20140072689A (en) Battery Module Assembly
US8273476B2 (en) Secondary battery with protection circuit module
CN108023042A (en) Battery frame for reception bag packed battery
EP2905821B1 (en) Rechargeable battery pack
KR101145735B1 (en) Battery Pack Not Having Pack Case
CN113871684A (en) Method for manufacturing battery
EP2790245B1 (en) Rechargeable battery
CN113745630B (en) Electrochemical device, method for manufacturing electrochemical device, and electronic device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20211231