CN113422151B - Method for manufacturing battery, battery and electric equipment - Google Patents

Method for manufacturing battery, battery and electric equipment Download PDF

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Publication number
CN113422151B
CN113422151B CN202110646192.3A CN202110646192A CN113422151B CN 113422151 B CN113422151 B CN 113422151B CN 202110646192 A CN202110646192 A CN 202110646192A CN 113422151 B CN113422151 B CN 113422151B
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China
Prior art keywords
circuit board
flexible circuit
glue
battery
reinforcing plate
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CN202110646192.3A
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CN113422151A (en
Inventor
涂丹凤
陈远胜
胡昱
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Dongguan Nvt Technology Co Ltd
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Dongguan Nvt Technology Co Ltd
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Priority to CN202110646192.3A priority Critical patent/CN113422151B/en
Publication of CN113422151A publication Critical patent/CN113422151A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

The application discloses a manufacturing method of a battery, the battery and electric equipment. The method comprises the following steps: arranging a reinforcing plate on one side of the flexible circuit board through the anti-adhesive glue; electrically connecting the flexible circuit board to the battery cell; reducing the bonding force of the adhesive reducing agent, and separating the reinforcing plate and at least part of the adhesive reducing agent from the flexible circuit board; and forming an injection molding body at the end part of the battery cell, which is provided with the flexible circuit board. The application can meet the thinning requirement of the battery protection plate, can reduce the risks of falling of electronic components, cracking of the battery protection plate and the like, and improves the yield of products.

Description

Method for manufacturing battery, battery and electric equipment
Technical Field
The application relates to the technical field of batteries, in particular to a battery manufacturing method, a battery and electric equipment.
Background
In order to meet the trend of light and thin electrical devices, the control of battery volume has become a mainstream in the industry. In order to reduce the thickness of the battery as much as possible, manufacturers generally strive to make the most use of the head space of the battery, and one of the technical measures adopted is to thin the battery protection plate. However, the thickness of the battery protection plate is reduced, the structural strength is reduced, deformation is easy to occur, the risk that electronic components fall off, the battery protection plate cracks is high, and the product yield is low.
Disclosure of Invention
In view of this, the present disclosure provides a method for manufacturing a battery, a battery and an electric device, which can solve the problem that the product yield is reduced due to the thinning of a battery protection board.
In a first aspect, the present application provides a method of manufacturing a battery, comprising steps S1 to S5.
S1, arranging a first glue and a first reinforcing plate on one side of the flexible circuit board, wherein the first glue is used for fixing the first reinforcing plate on one side of the flexible circuit board.
S2, electrically connecting the flexible circuit board to the battery cell.
S3, the first glue is processed to reduce the bonding force of the first glue, and the first reinforcing plate and at least part of the first glue are separated from the flexible circuit board.
And S4, forming an injection molding body at the end part of the battery cell, which is provided with the flexible circuit board.
Optionally, after step S1, the method may include: and S21, arranging an electronic component on the flexible circuit board.
The flexible circuit board is reinforced by the reinforcing plate (the first reinforcing plate), so that the form of the flexible circuit board is favorably fixed, and the flexible circuit board is not easy to deform in the processes of arranging electronic components and the like; the reinforcing plate is separated from the flexible circuit board by reducing the bonding force of the glue, so that the thickness of the flexible circuit board is unchanged, and the requirement for thinning the flexible circuit board can be met; through the electronic components on the injection molding body cladding flexible circuit board and, not only can fix the form of flexible circuit board, be difficult for taking place deformation, reduce for example risk such as electronic components drops, battery protection shield fracture, can protect flexible circuit board and electronic components that are located the injection molding body in addition, improve the product yield.
Optionally, the first glue comprises a UV-subtractive glue and the treatment comprises UV-light irradiation. In the process of processing the adhesive force of the first adhesive, the influence of UV light on the flexible circuit board and electronic components on the flexible circuit board is extremely small, the safety is high, and the operation is simple.
Optionally, the first glue has an adhesion force of greater than or equal to 1600gf/in before treatment 2 After treatment, the first glue has an adhesion of less than or equal to 100gf/in 2 。
Optionally, the injection molded body is formed by low pressure injection molding or potting.
Optionally, before the step S1, the method includes: s11, arranging a second glue and a second reinforcing plate on one side of the flexible circuit board, and bonding the second reinforcing plate on one side of the flexible circuit board through the second glue. In the step S1, a first glue and a first reinforcing plate are disposed on a first side surface of the second reinforcing plate, where the first side surface is a surface of the second reinforcing plate facing away from the second glue.
The flexible circuit board is further reinforced through the second stiffening plate, and the risk of deformation further reduces, is favorable to improving the product yield more. And the flexible circuit board and the second reinforcing plate are arranged in the injection molding body, so that the thickness of the finally manufactured injection molding body is unchanged by reducing the amount of the blank of the injection molding body, and the occupied head space of the battery is not increased.
Optionally, after the step S21, the method further includes: s22, forming a sealing portion on the surface of the electronic component, for example, the sealing portion may be formed by a low pressure injection molding process. When separating first stiffening plate and flexible circuit board and battery charge-discharge, the risk that electronic components drops can be reduced to the encapsulation portion to carry out insulation protection to electronic components.
In a second aspect, the present application provides a battery, including electric core and the battery protection shield of being connected with electric core electricity, the battery protection shield includes flexible circuit board and electronic components. Electronic components sets up on flexible circuit board, and flexible circuit board thickness is D, and is more than or equal to 0.1mm D and is less than or equal to 0.3mm, and the battery protection shield still includes the injection molding body, and in the injection molding body was located to flexible circuit board's one end, flexible circuit board's the other end extended the injection molding body.
Optionally, the battery protection board further includes a second adhesive and a second reinforcing plate, and the second adhesive is disposed between the flexible circuit board and the second reinforcing plate.
Optionally, along a thickness direction of the flexible circuit board, an orthographic projection of the electronic component is located in an orthographic projection of the second reinforcing plate. And the electronic component is positioned in the reinforcing area of the second reinforcing plate, so that the falling risk is reduced.
In a third aspect, the present application provides a powered device comprising any of the above batteries.
According to the manufacturing method of the battery, the battery and the electric equipment, the injection molding body wraps the flexible circuit board and the electronic components on the flexible circuit board, the form of the flexible circuit board can be fixed, the thinned flexible circuit board is not prone to deformation, risks such as falling of the electronic components and cracking of a battery protection plate are reduced, the flexible circuit board and the electronic components which are located in the injection molding body can be protected, and the product yield is improved.
Drawings
Fig. 1 is a manufacturing method of a battery according to a first embodiment of the present application;
fig. 2 is a schematic structural view of a battery protection plate according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a first reinforcing plate bonded to one side of a flexible protective plate;
fig. 4 and 5 are partial structural schematic views of a battery according to an embodiment of the present application;
fig. 6 is a method of manufacturing a battery according to a second embodiment of the present application;
fig. 7 is a schematic structural view of a battery according to another embodiment of the present application;
fig. 8 is a method of manufacturing a battery according to a third embodiment of the present application;
fig. 9 is a partial schematic view of a battery protection sheet prepared based on the method shown in fig. 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be described below with reference to specific embodiments and accompanying drawings. It is to be understood that the embodiments described are only a few examples of the present application and are not intended to be exhaustive or exhaustive. Based on the embodiments in the present application, the following respective embodiments and technical features thereof may be combined with each other without conflict.
It should be understood that in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing technical solutions and simplifying the description of the respective embodiments of the present application, and do not indicate or imply that a device or an element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
First embodiment
Fig. 1 is a method of manufacturing a battery according to an embodiment of the present application. As shown in fig. 1, the method of manufacturing the battery may include the following steps S1 to S4.
S1, arranging a first glue and a first reinforcing plate on one side of the flexible circuit board, and fixing the first reinforcing plate on one side of the flexible circuit board through the first glue.
Referring to fig. 2 and fig. 3, the flexible circuit board 10 may be an elongated circuit board, and along the second direction y, the flexible circuit board 10 includes a first surface 101 and a second surface 102 that are disposed opposite to each other, where the first surface 101 is used for disposing the electronic component 11. The second direction y is a thickness direction of the flexible circuit board 10, the length direction of the flexible circuit board 10 is the first direction x, and the width direction of the flexible circuit board 10 is the third direction z. It should be understood that the second surface 102 may also be provided with electronic components 11. Suitably, the first stiffening plate 21 is elongate.
The first stiffener 21 has a structural strength greater than that of the flexible circuit board 10, including but not limited to an FR4 stiffener. The flexible circuit board 10 is reinforced by the first reinforcing plate 21, the shape of the flexible circuit board 10 is fixed, and the flexible circuit board 10 is not easily deformed in the subsequent process (for example, the electronic component 11 is arranged in step S21).
The first glue 22 not only bonds the first reinforcing plate 21 and the flexible circuit board 10, but also can assist in reinforcing the flexible circuit board 10 by using the structural strength of the first glue. For example, the first glue 22 has a stable shape and a strong structural strength in a cured state, so that the flexible circuit board 10 is not easily deformed.
The function of the flexible circuit board 10 can be determined according to actual needs. For example, the flexible circuit board 10 may enable protection of the battery 10 from over-discharge, from over-charge, from under-current, from output short-circuit protection, and the like.
In some embodiments, the flexible circuit board 10 is already provided with the electronic components 11 before step S1. In other embodiments, the electronic component 11 may be disposed after step S1, that is, the battery manufacturing method of the present application may further include step S21.
And S21, arranging electronic components on the flexible circuit board.
The flexible circuit board 10 is provided with traces, and the electronic component 11 is disposed on the flexible circuit board 10 and connected with the traces to implement corresponding functions. In practical application scenarios, the electronic component 11 includes, but is not limited to: resistors, capacitors, temperature sensors, ICs, etc.
In some embodiments, the electronic component 11 may be disposed on the flexible circuit board 10 by Surface Mount Technology (SMT).
Along the second direction y, the orthographic projection of the electronic component 11 can be located in the orthographic projection of the first reinforcing plate 21, that is, the electronic component 11 is located in the reinforcing area of the first reinforcing plate 21, so that the risk of falling off of the electronic component 11 can be reduced.
Optionally, as shown in fig. 5, after the step S21, a step S22 is further included.
And S22, forming a packaging part on the surface of the electronic component.
Referring to fig. 2, the sealing portion 12 and the flexible circuit board 10 form a sealed space 121, and the electronic component 11 is accommodated in the sealed space 121, so that the electronic component 11 is isolated from the outside, when the first reinforcing plate 21 is separated from the flexible circuit board 10 and the battery 1 is used (for example, during charging and discharging), the risk of dropping the electronic component 11 can be reduced, and the electronic component 11 can be protected from insulation and corrosion.
The enclosure 12 may be made of a material having insulating, corrosion-resistant, waterproof, and other properties, including but not limited to: ABS (acrylonitrile-butadiene-styrene), PP (high polymer polypropylene), PVC (polyvinyl chloride), PC (polycarbonate), and the like. Depending on the material of the enclosure 12, in some embodiments, the enclosure 12 may be formed in one shot by a low pressure injection molding process.
S2, electrically connecting the flexible circuit board to the battery cell.
As shown in fig. 2, 3, 4 and 5, the battery cell 30 may include a casing 31, an electrode assembly (not shown), and tabs 32.
In a scenario where the battery cell 30 includes positive and negative polarities, the electrode assembly includes a positive electrode plate, a negative electrode plate, and an isolation film disposed between the positive electrode plate and the negative electrode plate. The electrode assembly is formed by winding or stacking a plurality of pole pieces, one end of a tab 32 is inserted into the case 31 and electrically connected to the pole piece of the corresponding polarity, and the other end of the tab 32 is inserted from one side of the case 31.
The tabs 32 include a first tab 32a and a second tab 32b, the first tab 32a may be a negative tab and the second tab 32b a positive tab. The first tab 32a is electrically connected to the negative electrode tab and extends from the inside of the case 31 to the outside of the case 31, and the second tab 32b is electrically connected to the positive electrode tab and extends from the inside of the case 31 to the outside of the case 31. In other embodiments, the first tab 32a may be a positive tab and the second tab 32b a negative tab. The structure of the tab 32 of the embodiment of the present application will be described herein, taking one of them as an example.
The flexible circuit board 10 and the tab 32 may be electrically connected by, for example, welding. For example, a welding area may be reserved on the second surface 102 of the flexible circuit board 10, and the tab 32 is welded to the welding area, so that the flexible circuit board 10 can be electrically connected to the battery cell 30. For another example, the second surface 102 of the flexible circuit board 10 may be provided with a conductive tab connector, which is a plate structure with a small thickness, and the tab connector is welded to the tab 32 for electrical connection.
S3, the first glue is processed to reduce the bonding force of the first glue, and the first reinforcing plate and at least part of the first glue are separated from the flexible circuit board.
The treatment of the first glue 22 may be adapted according to the properties of the first glue 22 itself. In some embodiments, the first glue 22 may be a UV-subtractive glue, the treatment comprising UV light (ultraviolet light) irradiation. In the process of irradiating the first glue 22, the influence of the UV light on the flexible circuit board 10 and the electronic components 11 thereon is extremely small, the safety is high, and the operation is simple.
In other embodiments, the first glue 22 may be a hot melt reduced glue, and the process includes heating the first glue 22. For example, the first adhesive 22 is heated by laser irradiation, so that irradiation of the flexible circuit board 10 and the electronic component 11 thereon is minimized.
Optionally, the adhesion of the first glue 22 is greater than or equal to 1600gf/in before the treatment 2 The bonding stability between the first reinforcing plate 21 and the flexible circuit board 10 before processing is favorably satisfied; after the treatment, the adhesion of the first glue 22 is less than or equal to 100gf/in 2 The separation of the first reinforcing plate 21 from the flexible circuit board 10 after the processing is facilitated.
It should be understood that after step S3, the first glue 22 may partially remain on the flexible circuit board 10, and thus a portion of the first glue 22 may remain on the flexible circuit board 10 finally manufactured. The remaining first glue 22 can help reinforce the flexible circuit board 10 by using its own structural strength, so that it is not easily deformed.
And S4, forming an injection molding body at the end part of the battery cell, which is provided with the flexible circuit board.
In an embodiment, for example, referring to fig. 4, fig. 5 and fig. 7, one end (e.g., a main body portion) of the flexible circuit board 10 is disposed in the injection molding body 40, and the other end 211 of the flexible circuit board 10 is provided with an external terminal 212, and the other end 211 extends out of the injection molding body 40, so that the external terminal 212 of the flexible circuit board 10 is disposed outside the injection molding body 40, allowing the external terminal 212 to be connected with an external device, which includes but is not limited to a load, and the like. The injection molded body 40 can protect the tab 32, the flexible circuit board 10 and the electronic component 11 thereon.
The injection molding body 40 coats the flexible circuit board 10 and the electronic components 11 on the flexible circuit board, so that the flexible circuit board 10 can be fixed in shape and is not easy to deform, and risks of falling off of the electronic components 11, cracking of the flexible circuit board 10 and the like are reduced. In addition, the injection molded body 40 and the battery cell 30 form a closed accommodating space, so that the flexible circuit board 10, the electronic component 11 and the tab 32 located in the accommodating space can be protected, and the product yield can be improved.
The injection molded body 40 may be made of a material having insulating, corrosion-resistant, waterproof, and other properties, including but not limited to: ABS, PP, PVC, PC, etc. Depending on the material of the injection molded body 40, in some embodiments, the injection molded body 40 may be formed in one piece by a low pressure injection molding or potting process.
Injection molded body 40 may have components inside that reduce corrosion. For example, taking an injection molded body 40 made of PP as an example, in a scene of testing the corrosion resistance of the injection molded body 40 through salt spray, the battery 1 is placed in a salt spray test box, a salt spray environment is generated in a volume space of the salt spray test box to test the salt spray corrosion resistance of a product, and after a predetermined time (for example, 1 hour) is passed under a high temperature condition, the ratio of the corrosion area of the injection molded body 40 to the total area is almost zero, so that elements in the injection molded body 40 can be well prevented from being corroded by the outside.
Second embodiment
On the basis of the foregoing first embodiment, but unlike it, as shown in fig. 8 and 9 in conjunction therewith, the manufacturing method of the present embodiment includes step S11 before step S1. For ease of description, like-named structural elements are referred to herein with like reference numerals.
S11, arranging a second glue 24 and a second reinforcing plate 23 on one side of the flexible circuit board 10, and adhering the second reinforcing plate 23 to one side of the flexible circuit board 10 through the second glue 24.
In step S1, the first glue 22 and the first reinforcing plate 21 are disposed on a first side surface of the second reinforcing plate 23, the first side surface is a surface of the second reinforcing plate 23 facing away from the second glue 24, and the first glue 22 bonds the first reinforcing plate 21 to the first side surface of the second reinforcing plate 23.
After the step S3, the flexible circuit board 10 is further reinforced by the second reinforcing plate 23, so that the risk of deformation is further reduced, which is more beneficial to improving the yield of the product.
And, flexible circuit board 10 and second stiffening plate 23 set up in injection molding 40, through reducing the volume of injection molding 40 stock, can make the thickness of the injection molding 40 that makes finally unchangeable, then can not increase shared battery 1 headroom.
In some embodiments, the second glue 24 may be a UV-vis glue, or a non-UV-vis glue. Taking the second glue 24 as a non-UV subtractive adhesive as an example, the first reinforcing plate 21 can be separated from the flexible circuit board 10 in the process of irradiating the first glue 22 with UV light, but the adhesion of the second glue 24 is not affected by the irradiation of the UV light, so that the reinforcing effect of the second reinforcing plate 23 is not affected.
An embodiment of the present application further provides a battery, as shown in fig. 4 and fig. 6, the battery 1 includes a battery core and a battery protection plate 2, and the battery protection plate 2 is electrically connected to the battery core 30. The battery protection board 2 includes a flexible circuit board 10 and an electronic component 11. The electronic component 11 is arranged on the flexible circuit board 10, and the battery 1 can be manufactured by adopting the method of the embodiment, so that the thickness D of the flexible circuit board 10 can be thinner, and D is more than or equal to 0.1mm and less than or equal to 0.3mm, and the thickness of the battery protection board 2 is thinner. It should be understood that the thickness of the flexible circuit board 10 is the thickness of the board body, excluding the thickness of the electronic component 11.
As shown in fig. 6, the battery 1 further includes an injection molded body 40, one end of the flexible circuit board 10 is disposed in the injection molded body 40, and the other end of the flexible circuit board 10 extends out of the injection molded body 40.
The battery 1 can be manufactured by the method of the foregoing embodiment, and thus has the same advantages as the foregoing manufacturing method, which is not described herein again.
In a particular scenario, the battery 1 includes, but is not limited to, all kinds of primary batteries, secondary batteries, fuel cells, solar cells, and capacitor (e.g., supercapacitor) batteries. The battery pack may preferably be a lithium secondary battery. The battery 1 of the embodiment of the present application may be in the form of a battery cell, a battery unit, or a battery module.
The embodiment of the present application further provides a battery protection plate, as shown in fig. 2, 4 and 6, the battery protection plate 2 includes not only the flexible circuit board 10 and the electronic component 11, but also the injection molded body 40. The battery protection plate 2 provided with the injection molded body 40 may be manufactured or sold as a separate component, and a part of the conductive elements (e.g., the aforementioned tab connectors) of the flexible circuit board 10 may extend out of the injection molded body 40 so as to be electrically connected with other devices (e.g., the battery cell 30).
An embodiment of the present application provides an electric device, which includes a load and the battery protection board 2 of any one of the above embodiments or the above battery 1, wherein the battery 1 supplies power to the load.
The electric device may be implemented in various specific forms, for example, an electronic product such as an unmanned aerial vehicle, an electric cleaning tool, an energy storage product, an electric vehicle, an electric bicycle, an electric navigation tool, and the like. In a practical scenario, the electric device specifically includes but is not limited to: standby power supply, motor, automobile, motorcycle, moped, bicycle electric tool, household large-scale storage battery, lithium ion capacitor and the like.
Since the battery 1 and the electric device have the battery protection plate 2 of any one of the foregoing embodiments, advantageous effects that the battery protection plate 2 of the corresponding embodiment has can be produced.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent structural changes made by using the contents of the specification and the drawings are included in the scope of the present application.
Without further limitation, the recitation of a claim "comprising one of 8230, does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises such elements, and the recitation of like elements, features, or elements in different embodiments may have like or different meanings, and the specific meaning will be determined by its interpretation in such embodiment or by its context in further detail in such embodiment.
In addition, although the terms "first, second, third, etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

Claims (6)

1. A method of manufacturing a battery, comprising:
s11, arranging a second glue and a second reinforcing plate on one side of the flexible circuit board, wherein the second glue is used for bonding the second reinforcing plate to one side of the flexible circuit board and is a non-UV (ultraviolet) subtractive glue;
s1, arranging a first glue and a first reinforcing plate on one side of the flexible circuit board and on a first side face of the second reinforcing plate, wherein the first glue comprises a UV (ultraviolet) adhesive reducing layer, and the first reinforcing plate is fixed on one side of the flexible circuit board by the first glue; the first side surface is a surface of the second reinforcing plate, which is opposite to the second glue, and the flexible circuit board comprises a first surface and a second surface which are opposite to each other;
s21, arranging an electronic component on the first surface of the flexible circuit board;
s22, forming a packaging part on the surface of the electronic component through low-pressure injection molding;
s2, electrically connecting the second surface of the flexible circuit board to the battery cell;
s3, carrying out UV light irradiation treatment on the first glue to reduce the bonding force of the first glue, separating at least part of the first glue from the flexible circuit board, leaving a part of the first glue on the flexible circuit board, and reinforcing the flexible circuit board in a curing state by using the self structural strength of the first glue;
and S4, forming an injection molding body at the end part of the battery cell, which is provided with the flexible circuit board.
2. The method according to claim 1, characterized in that, before said treatment, the adhesion of said first glue is greater than or equal to 1600gf/in 2 After said treatment, the first glue has an adhesion of less than or equal to 100gf/in 2 。
3. The method of claim 1, wherein the injection molded body is formed by a low pressure injection molding or potting process.
4. A battery comprises a battery cell and a battery protection board electrically connected with the battery cell, wherein the battery protection board comprises a flexible circuit board and an electronic component, the electronic component is arranged on a first surface of the flexible circuit board, and the battery is prepared by the method of any one of claims 1 to 3, the thickness of the flexible circuit board is D, D is more than or equal to 0.1mm and less than or equal to 0.3mm, the first glue is remained on the flexible circuit board, the remained first glue is in a curing state and assists in reinforcing the flexible circuit board by using the structural strength of the first glue, a second surface of the flexible circuit board is electrically connected with the battery cell, the battery protection board further comprises an injection molding body, a second glue and a second reinforcing board, one end of the flexible circuit board is arranged in the injection molding body, and the other end of the flexible circuit board extends out of the injection molding body; the second glue set up in flexible circuit board with between the second stiffening plate, first glue set up in the first side of second stiffening plate, first side does the second stiffening plate dorsad the gluey surface of second, the second is glued and is subtracted the viscose for non-UV.
5. The battery according to claim 4, wherein an orthogonal projection of the electronic component is located within an orthogonal projection of the second reinforcing plate in a thickness direction of the flexible circuit board.
6. An electric device comprising the battery according to claim 4 or 5.
CN202110646192.3A 2021-06-09 2021-06-09 Method for manufacturing battery, battery and electric equipment Active CN113422151B (en)

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CN113871684A (en) * 2021-09-24 2021-12-31 东莞新能德科技有限公司 Method for manufacturing battery
CN113960857B (en) * 2021-10-29 2023-05-12 歌尔光学科技有限公司 DMD circuit board and DLP light machine module
CN114497917A (en) * 2021-12-22 2022-05-13 珠海市古鑫电子科技有限公司 Optimized structure of FPC in low-temperature injection molding of polymer battery cell
CN114284605A (en) * 2021-12-24 2022-04-05 东莞新能德科技有限公司 Battery and electronic equipment

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