CN113871432A - Display panel - Google Patents
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- CN113871432A CN113871432A CN202111092570.4A CN202111092570A CN113871432A CN 113871432 A CN113871432 A CN 113871432A CN 202111092570 A CN202111092570 A CN 202111092570A CN 113871432 A CN113871432 A CN 113871432A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
The invention provides a display panel, which comprises a substrate, and an auxiliary layer, a driving circuit layer and a light-emitting functional layer which are sequentially stacked on the substrate, wherein the light-emitting functional layer comprises a plurality of light-emitting units; the driving circuit layer below each light-emitting unit is provided with at least one thickness section difference area, and the difference value of the maximum thicknesses of the driving circuit layers at different positions in the thickness section difference area is larger than or equal to a preset threshold value; the substrate is provided with the auxiliary layer in at least a partial region corresponding to the thickness step region, so that the height difference of any two positions of the driving circuit layer in the thickness step region is smaller than the preset threshold value. The display panel is provided with the auxiliary layer in at least partial area corresponding to the thickness section difference area through the substrate, so that the problem of planarization of the light-emitting unit is effectively solved, and the display effect of the display panel is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel.
Background
Organic Light Emitting Diode (OLED) display devices have become the most potential display devices in recent years due to their advantages of self-luminescence, all solid-state property, and high contrast. The OLED display device has many advantages, such as low driving voltage, high light emitting efficiency, short response time, high definition and contrast, a viewing angle of approximately 180 °, a wide temperature range, and capability of realizing flexible display and large-area full-color display, and is considered to be the display device with the most potential development in the industry.
Since the OLED display device has display characteristics and quality superior to those of the LCD display, it has attracted much attention, and its development is more and more advanced in recent years, and not only curved display can be made, but also large size is gradually developed. In the manufacturing process of the OLED display device, an inkjet printing (IJP) process is usually adopted to manufacture an Electroluminescent (EL) layer, the IJP process has a high requirement on the flatness of a backplane, and a driving circuit layer corresponding to the EL layer often has a large thickness step difference region, so that even if a planarization layer is subsequently arranged on the driving circuit layer, the problem of uneven terrain of the driving circuit layer cannot be completely solved, and further, the problem of uneven terrain of each light emitting unit in the EL layer manufactured by the IJP process is caused, so that the OLED display device has non-uniform light emission and poor display effect.
Disclosure of Invention
The invention provides a display panel, which can solve the problem of uneven terrain of a light-emitting unit of the display panel.
The invention provides a display panel, which comprises a substrate, and an auxiliary layer, a driving circuit layer and a light-emitting functional layer which are sequentially stacked on the substrate, wherein the light-emitting functional layer comprises a plurality of light-emitting units;
the driving circuit layer below each light-emitting unit comprises at least one thickness section difference region, and the maximum thickness difference value of the driving circuit layer in the thickness section difference region is greater than or equal to a preset threshold value;
the substrate is provided with the auxiliary layer in at least a partial region corresponding to the thickness step region, so that the height difference of any two positions of the driving circuit layer in the thickness step region is smaller than the preset threshold value.
Optionally, the preset threshold is 50 nm.
Optionally, each light emitting unit includes a first region and a second region, a boundary region between the first region and the second region corresponds to the thickness step region, the auxiliary layer is disposed on the substrate corresponding to the first region, and the thickness of the auxiliary layer disposed on the substrate corresponding to the second region is smaller than the thickness of the auxiliary layer disposed on the substrate corresponding to the first region, where the auxiliary layer is not disposed on the substrate corresponding to the second region.
Optionally, the driving circuit layer corresponding to the second region has multiple thicknesses, and a difference between any two thicknesses of the multiple thicknesses is smaller than the preset threshold.
Optionally, the driving circuit layer of the first region includes a buffer layer, an interlayer dielectric layer, and a passivation layer, which are sequentially stacked; the drive circuit layer that the second region corresponds includes the light shield layer, buffer layer, metal oxide layer, interlaminar dielectric layer, second metal layer and the passivation layer that stack gradually and set up, the second region corresponds metal oxide layer includes first portion and the second portion that mutual interval set up.
Optionally, each light emitting unit further includes a third area, a boundary area between the third area and the second area corresponds to the thickness step difference area, the driving circuit layer corresponding to the third area includes a light shielding layer, a buffer layer, a metal oxide layer, an interlayer dielectric layer, a second metal layer, and a passivation layer, which are sequentially stacked, wherein a thickness of the auxiliary layer disposed on the substrate corresponding to the third area is smaller than a thickness of the auxiliary layer disposed on the substrate corresponding to the second area.
Optionally, a distance extending from an end of the third region far away from the second region to the second region is less than or equal to 2 micrometers.
Optionally, the first metal layer includes a gate, an orthographic projection of the gate on the substrate is not coincident with an orthographic projection of the light-emitting unit on the substrate, and the gate is located on a side of the third region away from the second region.
Optionally, the auxiliary layer corresponding to the first region, the second region and the third region is formed by a photo-masking process.
Optionally, the orthographic projection of the light-emitting unit on the substrate is in a strip shape.
The invention provides a display panel, which comprises a substrate, and an auxiliary layer, a driving circuit layer and a light-emitting functional layer which are sequentially stacked on the substrate, wherein the light-emitting functional layer comprises a plurality of light-emitting units; the driving circuit layer below each light-emitting unit is provided with at least one thickness section difference area, and the difference value of the maximum thicknesses of the driving circuit layers at different positions in the thickness section difference area is larger than or equal to a preset threshold value; the substrate is provided with the auxiliary layer in at least a partial region corresponding to the thickness step region, so that the height difference of any two positions of the driving circuit layer in the thickness step region is smaller than the preset threshold value. The display panel is provided with the auxiliary layer in at least partial area corresponding to the thickness section difference area through the substrate, so that the problem of planarization of the light-emitting unit is effectively solved, and the display effect of the display panel is improved. . The display panel is provided with the auxiliary layer in at least partial area corresponding to the thickness section difference area through the substrate, so that the problem of planarization of the light-emitting unit is effectively solved, and the display effect of the display panel is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel provided in an embodiment of the present invention;
fig. 2(a) -2 (c) are schematic structural diagrams illustrating various manufacturing processes of a display panel according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials. The following are detailed below, and it should be noted that the order of description of the following examples is not intended to limit the preferred order of the examples.
The invention provides a display panel, the display panel includes the base plate 10 and laminates the auxiliary layer 20, drive circuit layer 30 and luminescent functional layer 40 that set up on the said base plate sequentially, the said luminescent functional layer 40 includes a plurality of luminescent units 41; the driving circuit layer 30 below each light-emitting unit 41 comprises at least one thickness step region, and the difference of the maximum thicknesses of the driving circuit layers 30 at different positions in the thickness step region is greater than or equal to a preset threshold value; the auxiliary layer 20 is disposed on at least a partial region of the substrate 10 corresponding to the thickness step region, so that a height difference between any two positions of the driving circuit layer 30 in the thickness step region is smaller than the preset threshold.
In this embodiment, the display panel is, for example, an OLED display panel, and may specifically be a White Organic Light Emitting Diode (WOLED) display panel in which the Light Emitting functional layer 40 is formed by an inkjet printing process, and the WOLED display panel further includes a Color Filter (CF) layer (not shown in the figure) disposed on a Light Emitting side thereof, so as to implement Color display of the OLED display panel. The present invention does not limit the type of the OLED display panel, but may be other types of OLED display panels formed by an inkjet printing process. The display panel may be a flexible display panel or a rigid display panel.
In this embodiment, the substrate 10 may be a flexible substrate or a rigid substrate, and the material of the substrate may be glass, plastic, polyimide, or the like.
In this embodiment, the auxiliary layer 20 may be an organic film layer or a non-metal film layer, the auxiliary layer 20 may have a plurality of different thicknesses, for example, the auxiliary layer 20 with different thicknesses may be manufactured and formed at one time by using a Half-Tone mask (Half-Tone) process, and the thickness of the auxiliary layer 20 formed on the substrate 10 is controlled by controlling the transmittance of a mask, where the transmittance of the mask includes at least two. Specifically, the halftone mask process uses, for example, a positive photoresist, wherein the thicker the auxiliary layer 20 is formed, the lower the light transmittance of the photomask mask in the halftone mask process is. Of course, in other embodiments of the present invention, the halftone mask process may also use a negative photoresist.
In this embodiment, the driving circuit layer 30 is formed with a Thin Film Transistor (TFT), which may be a Low Temperature Polysilicon (LTPS) TFT, an Oxide semiconductor (Oxide) TFT, a Solid Phase Crystallization (SPC) TFT, and other TFTs commonly used in the display field, but not limited thereto. Taking the thin film transistor as an example of an indium gallium zinc oxide thin film transistor (IGZO TFT), the light emitting functional layer 40 includes a light shielding layer 310, a buffer layer 320, a metal oxide layer 330, a gate insulating layer 340, a first metal layer 350, an interlayer dielectric layer 360, a second metal layer 370, and a passivation layer 380, which are sequentially stacked, wherein the metal oxide layer 330 includes a metal oxide semiconductor portion and a metal oxide conductor portion, the metal oxide semiconductor portion forms a channel 331 of the thin film transistor, a projection of the channel 331 on the substrate 10 overlaps a projection of the light shielding layer 310 on the substrate 10, the metal oxide conductor portion is formed by the metal oxide layer 330 being made into a conductor, and includes a first contact portion 332 and a second contact portion 333 in contact with the channel 331 and a spacer portion 334 spaced from the first contact portion 332 and the second contact portion, the spacer 334 serves as one capacitance electrode of the storage capacitor; the first metal layer 350 includes a gate electrode 351 of the thin film transistor, and the gate electrode 351 is disposed corresponding to the channel 331; a first via hole 361 and a second via hole 362 are formed on the interlayer dielectric layer 360; the second metal layer 370 includes a source 371 and a drain 372 of the tft, the source 371 is electrically connected to the first contact 332 through the first via 361, and the drain 372 is electrically connected to the second contact 333 through the second via 362. In other embodiments of the present invention, the positions of the source 371 and the drain 372 may be interchanged, that is, the drain 372 is electrically connected to the first contact 332 through the first via 361, and the source 371 is electrically connected to the second contact 333 through the second via 362.
In this embodiment, the driving circuit layer 30 is further provided with, for example, a planarization layer 50, an anode layer 60, and a pixel defining layer 70. The planarization layer 50 is used for further planarizing the driving circuit layer 30, and a third via hole is formed in the planarization layer 50; the anode layer 60 includes a plurality of anodes, the plurality of anodes and the plurality of light emitting units 41 are disposed in a one-to-one correspondence, and the anodes are electrically connected to the source 371 through the third via holes; the pixel defining layer 70 is formed with a plurality of pixel openings, the shape of the pixel openings is, for example, a strip shape, the pixel defining layer 70 can be formed by a Line Bank printing technology, and the Line Bank printing technology is to connect a column of pixels with the same color together through a strip mask for uniform printing, so that the requirement of inkjet printing on precision can be reduced, and the process difficulty is reduced.
In this embodiment, the light-emitting functional layer 40 is disposed on the pixel defining layer 70, the light-emitting functional layer 40 includes a plurality of light-emitting units 41, the light-emitting units 41 are disposed in the pixel openings, the light-emitting functional layer 40 may be formed by an inkjet printing process, and an orthographic projection of the light-emitting units 41 on the substrate 10 is in a bar shape.
In this embodiment, for example, a cathode layer, a packaging layer and a cover plate are further disposed on the light emitting functional layer 40.
Fig. 2(a), 2(b) and 2(c) are schematic structural diagrams showing respective manufacturing flows of the display panel. As shown in fig. 2(a), 2(b) and 2(c), first, auxiliary layers 20 having different thicknesses are formed on a plurality of regions of the substrate 10 using reticles 100 having different transmittances, so that the auxiliary layers 20 form a stepped structure; then, the driving circuit layer 30, the planarization layer 50, the anode layer 60 and the pixel defining layer 70 are sequentially formed on the auxiliary layer 20; then, a light emitting function layer 40 and a cathode layer 80 are formed on the pixel defining layer 70. After the cathode layer 80 is formed, for example, the encapsulating layer and the cover plate are sequentially formed on the cathode layer 80.
With continued reference to fig. 1, in this embodiment, the driving circuit layer 30 under each of the light emitting units 41 includes at least one thickness step region, and a difference between maximum thicknesses of the driving circuit layer 30 at different positions in the thickness step region is greater than or equal to a preset threshold. In order to avoid the problems that the thickness step zone of the driving circuit layer 30 corresponding to the light emitting unit 41 is too large, the flat layer 50 cannot be flattened and the light emitting unit 41 emits light unevenly, the substrate 10 is provided with the auxiliary layer 20 in at least a partial region corresponding to the thickness step zone, so that the height difference of any two positions of the driving circuit layer 30 in the thickness step zone is smaller than the preset threshold value, the problem that the light emitting unit 41 emits light unevenly in the prior art is solved, and the display effect of the display panel is effectively improved.
In this embodiment, the preset threshold is, for example, 50 nm, and when the height difference between any two positions of the driving circuit layer 30 in the thickness step region corresponding to each light emitting unit 41 is greater than or equal to 50 nm, even if the flat layer 50 is disposed on the driving circuit layer 30, the surface of the light emitting unit 41 contacting the anode may not be effectively flattened; when the height difference between any two positions of the driving circuit layer 30 in the thickness step difference region corresponding to each light emitting unit 41 is smaller than 50 nm, the height difference can be effectively eliminated by stacking the planarization layer 50 and other organic/inorganic film layers on the driving circuit layer 30. Therefore, in the present embodiment, the auxiliary layer 20 is disposed on at least a partial region of the substrate 10 corresponding to the thickness step region, so that the height difference between any two positions of the driving circuit layer 30 in the thickness step region is smaller than 50 nm.
In this embodiment, each of the light emitting units 41 includes a first region a and a second region b, the first region a and the second region b are disposed adjacent to each other, a boundary region between the first region a and the second region b corresponds to the thickness step region, the auxiliary layer 20 is disposed on the substrate 10 corresponding to the first region a, and the auxiliary layer 20 is not disposed on the substrate 10 corresponding to the second region b or the auxiliary layer 20 disposed on the substrate 10 corresponding to the second region b has a thickness smaller than that of the auxiliary layer 20 disposed on the substrate 10 corresponding to the first region a. For example, the auxiliary layer 20 corresponding to the first region a has a first thickness, and the auxiliary layer 20 corresponding to the second region b has a second thickness, where the first thickness is greater than the second thickness, and the second thickness is greater than or equal to 0. That is, when the difference in thickness at the adjacent position between the driving circuit layer 30 corresponding to a certain region of the light emitting unit 41 and the driving circuit layer 30 corresponding to another region adjacent to the certain region exceeds the preset threshold, the difference in thickness at the adjacent position between the driving circuit layer 30 corresponding to the certain region and the driving circuit layer 30 corresponding to the another region may be eliminated or reduced by disposing the auxiliary layer 20 having a larger thickness below the driving circuit layer 30 having a thinner thickness, and disposing the auxiliary layer 20 having a smaller thickness below the driving circuit layer 30 having a larger thickness or not disposing the auxiliary layer 20. Preferably, the auxiliary layer 20 having the first thickness and the second thickness is provided below the first region a and the second region b, respectively, so that a height difference between the driving circuit layer 30 corresponding to the first region a and the second region b at a position adjacent to the first region a and the second region b is 0. As shown in fig. 1, in the present embodiment, both the first thickness and the second thickness are greater than 0.
In this embodiment, the driving circuit layer 30 corresponding to the second area b has a plurality of thicknesses, and a difference between any two thicknesses of the plurality of thicknesses is smaller than the preset threshold, and the driving circuit layer 30 corresponding to the first area a has one thickness.
The reason why the driving circuit layer 30 corresponding to the second region b has various thicknesses and the driving circuit layer 30 corresponding to the first region a has one thickness will be described below by describing the film layer structures of the first region a and the second region b.
In this embodiment, the driving circuit layer 30 in the first area a includes a buffer layer 320, an interlayer dielectric layer 360, and a passivation layer 380, which are sequentially stacked, and orthographic projections of the buffer layer 320, the interlayer dielectric layer 360, and the passivation layer 380 in the first area a all cover the first area a, so that the driving circuit layer 30 corresponding to the first area a has a thickness; the driving circuit layer 30 of the second region b includes a light shielding layer 310, a buffer layer 320, a metal oxide layer 330, an interlayer dielectric layer 360, a second metal layer 370 and a passivation layer 380, which are sequentially stacked, the metal oxide layer 330 corresponding to the second region b includes a first portion and a second portion, which are spaced from each other, and the driving circuit layer 30 corresponding to the second region b has a plurality of thicknesses due to the partial absence of the metal oxide layer 330 corresponding to the second region b. Further, the thickness of the metal oxide layer 330 is smaller than the predetermined threshold. That is, the first portion is a part of the second contact portion 333, and the second portion is the spacer portion 334.
In this embodiment, each of the light emitting units 41 further includes a third area c, a boundary area between the third area c and the second area b also corresponds to the thickness step difference area, and the third area c includes a light shielding layer 310, a buffer layer 320, a metal oxide layer 330, an interlayer dielectric layer 360, a second metal layer 370, and a passivation layer 380 that are sequentially stacked, that is, a film structure included in the driving circuit layer 30 corresponding to the third area c is the same as a film structure included in the driving circuit layer 30 corresponding to the second area b, where a thickness of the auxiliary layer 20 disposed on the substrate 10 corresponding to the third area c is smaller than a thickness of the auxiliary layer 20 disposed on the substrate 10 corresponding to the second area b. For example, the thickness of the auxiliary layer 20 corresponding to the third region c is a third thickness, and the third thickness is smaller than the second thickness. Preferably, the third thickness is 0, that is, the auxiliary layer 20 is not disposed on the third region c.
In this embodiment, the third region c is disposed adjacent to the second region b, is located on a side of the second region b away from the first region a, and has a distance less than or equal to 2 micrometers from one end of the third region c away from the second region b to the second region b. When the topographic extension distance of the thickness difference of the driving circuit layer 30 is less than or equal to 2 microns, even if the height difference exists in the subsequent region of the driving circuit layer 30 due to the possible offset in the subsequent film layer manufacturing process, the planarization effect can be achieved after the planarization layer 50 on the driving circuit layer 30 and other organic/inorganic film layers are stacked.
In this embodiment, the first metal layer 350 includes a gate electrode 351, an orthogonal projection of the gate electrode 351 on the substrate 10 is not overlapped with an orthogonal projection of the light emitting unit 41 on the substrate 10, and the gate electrode 351 is located on a side of the third region c away from the second region b.
The auxiliary layer 20 corresponding to the first region a, the second region b and the third region c is formed by a photo-masking process.
Of course, the invention is not limited to the kind of the thickness of the auxiliary layer 20 corresponding to the light emitting unit 41, and in other embodiments of the invention, the auxiliary layer 20 corresponding to the light emitting unit 41 may also have four or more thicknesses, and may be specifically and adaptively configured based on the inventive concept of the invention and the actual film structure of the driving circuit layer 30.
In summary, the present invention provides a display panel, which includes a substrate, and an auxiliary layer, a driving circuit layer, and a light-emitting functional layer sequentially stacked on the substrate, wherein the light-emitting functional layer includes a plurality of light-emitting units; the driving circuit layer below each light-emitting unit is provided with at least one thickness section difference area, and the difference value of the maximum thicknesses of the driving circuit layers at different positions in the thickness section difference area is larger than or equal to a preset threshold value; the substrate is provided with the auxiliary layer in at least a partial region corresponding to the thickness step region, so that the height difference of any two positions of the driving circuit layer in the thickness step region is smaller than the preset threshold value. The display panel is provided with the auxiliary layer in at least partial area corresponding to the thickness section difference area through the substrate, so that the problem of planarization of the light-emitting unit is effectively solved, and the display effect of the display panel is improved.
The foregoing detailed description is directed to a display panel provided by an embodiment of the present invention, and the principles and embodiments of the present invention are described herein by using specific examples, which are merely used to help understand the method and the core concept of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. The display panel is characterized by comprising a substrate, and an auxiliary layer, a driving circuit layer and a light-emitting functional layer which are sequentially stacked on the substrate, wherein the light-emitting functional layer comprises a plurality of light-emitting units;
the driving circuit layer below each light-emitting unit is provided with at least one thickness section difference area, and the difference value of the maximum thicknesses of the driving circuit layers at different positions in the thickness section difference area is larger than or equal to a preset threshold value;
the substrate is provided with the auxiliary layer in at least a partial region corresponding to the thickness step region, so that the height difference of any two positions of the driving circuit layer in the thickness step region is smaller than the preset threshold value.
2. The display panel of claim 1, wherein the predetermined threshold is 50 nm.
3. The display panel according to claim 1, wherein each of the light emitting units includes a first region and a second region, a boundary region between the first region and the second region corresponds to the thickness step region, the auxiliary layer is disposed on the substrate corresponding to the first region, and the auxiliary layer is not disposed on the substrate corresponding to the second region or the auxiliary layer disposed on the substrate corresponding to the second region has a thickness smaller than that of the auxiliary layer disposed on the substrate corresponding to the first region.
4. The display panel according to claim 3, wherein the driving circuit layer corresponding to the second region has a plurality of thicknesses, and a difference between any two thicknesses of the plurality of thicknesses is smaller than the preset threshold.
5. The display panel according to claim 4, wherein the driving circuit layer of the first region includes a buffer layer, an interlayer dielectric layer, and a passivation layer sequentially stacked; the drive circuit layer that the second region corresponds includes the light shield layer, buffer layer, metal oxide layer, interlaminar dielectric layer, second metal layer and the passivation layer that stack gradually and set up, the second region corresponds metal oxide layer includes first portion and the second portion that mutual interval set up.
6. The display panel according to claim 5, wherein each of the light emitting units further includes a third region, a boundary region between the third region and the second region corresponds to the thickness step difference region, and the driving circuit layer corresponding to the third region includes a light shielding layer, a buffer layer, a metal oxide layer, an interlayer dielectric layer, a second metal layer, and a passivation layer, which are sequentially stacked, wherein a thickness of the auxiliary layer disposed on the substrate corresponding to the third region is smaller than a thickness of the auxiliary layer disposed on the substrate corresponding to the second region.
7. The display panel according to claim 6, wherein a distance extending from an end of the third region away from the second region to the second region is less than or equal to 2 μm.
8. The display panel according to claim 6, wherein the first metal layer comprises a gate electrode, an orthographic projection of the gate electrode on the substrate is not coincident with an orthographic projection of the light-emitting unit on the substrate, and the gate electrode is located on a side of the third region away from the second region.
9. The display panel according to claim 6, wherein the auxiliary layer corresponding to the first region, the second region and the third region is formed by a photo-masking process.
10. The display panel according to claim 1, wherein an orthogonal projection shape of the light emitting unit on the substrate is a stripe shape.
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