CN113871407A - LED display and processing method thereof - Google Patents
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- CN113871407A CN113871407A CN202111117209.2A CN202111117209A CN113871407A CN 113871407 A CN113871407 A CN 113871407A CN 202111117209 A CN202111117209 A CN 202111117209A CN 113871407 A CN113871407 A CN 113871407A
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- 238000003672 processing method Methods 0.000 title claims abstract description 25
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- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 238000005187 foaming Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 239000002096 quantum dot Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 230000005284 excitation Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
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- 238000009792 diffusion process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
The application provides an LED display and a processing method thereof, wherein the processing method comprises the following steps: providing a substrate, wherein the substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals; light emitting chips are attached to the first primary color area, the second primary color area and the third primary color area, and the light emitting chips emit first primary color light; the light emitting chip in the first primary color region is provided with a first primary color film, the light emitting chip in the second primary color region is provided with a second primary color film, the first primary color film can emit second primary color light after being excited by the light emitting chip, and the second primary color film can emit third primary color light after being excited by the light emitting chip. According to the embodiment of the application, the processing process flow is simplified, the LED display can be rapidly manufactured, the efficiency of processing the LED display is improved, and the problem of low efficiency in the processing process of the LED display is solved.
Description
Technical Field
The application relates to the technical field of display devices, in particular to an LED display and a processing method thereof.
Background
With the development of LED technology, the application proportion of LEDs in the display field is continuously increasing, and the application scenarios are continuously increasing. The LED has the advantages of small volume, long service life, good reliability and the like, and has good performance in the field of large-screen display.
Currently, cob (chip on board) technology is commonly used in the manufacturing process of LED displays, i.e. semiconductor packaging technology in which a chip is adhered to an interconnection substrate by conductive or non-conductive glue and then wire-bonded to achieve electrical connection. However, in the manufacturing process of the LED display, one pixel needs to respectively apply the COB technology to attach the R/G/B three-primary-color LED lamp to the substrate, and the COB process technology has very strict requirements on the production technology, so that the problem of low efficiency is caused by using the COB technology for many times in the processing process of the LED display.
Disclosure of Invention
The embodiment of the application provides an LED display and a processing method thereof, and solves the problem of low efficiency in the processing process of the LED display.
The embodiment of the application provides a processing method of an LED display, which comprises the following steps:
providing a substrate, wherein the substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals;
light emitting chips are attached to the first primary color area, the second primary color area and the third primary color area, and the light emitting chips emit first primary color light;
the light emitting chip in the first primary color region is provided with a first primary color film, the light emitting chip in the second primary color region is provided with a second primary color film, the first primary color film can emit second primary color light after being excited by the light emitting chip, and the second primary color film can emit third primary color light after being excited by the light emitting chip.
Optionally, the disposing a first primary color film on the light emitting chip located in the first primary color region, and disposing a second primary color film on the light emitting chip located in the second primary color region includes:
plating a first primary color conversion material on the light-emitting chip positioned in the first primary color area to obtain a first primary color film;
and plating a second primary color conversion material on the light-emitting chip positioned in the second primary color area to obtain a second primary color film.
Optionally, the plating a first primary color conversion material on the light emitting chip located in the first primary color region to obtain a first primary color film includes:
printing, printing or spraying the first primary color conversion material on the light emitting chip located in the first primary color region so that the first primary color film is formed in the first primary color region; and/or
The plating of a second primary color conversion material on the light emitting chip located in the second primary color region to obtain a second primary color film comprises:
and printing, printing or spraying the second primary color conversion material on the light emitting chip positioned in the second primary color area so as to form the second primary color film in the second primary color area.
Optionally, the disposing a first primary color film on the light emitting chip located in the first primary color region, and disposing a second primary color film on the light emitting chip located in the second primary color region includes:
plating a first primary color conversion material on the light emitting chip;
etching the first primary color conversion material in the second primary color area and the third primary color area so as to form the first primary color film on the light-emitting chip positioned in the first primary color area;
plating a second primary color conversion material on the light-emitting chip;
and etching the second primary color conversion material in the first primary color area and the third primary color area so as to form the second primary color film on the light-emitting chip positioned in the second primary color area.
The embodiment of the application further provides a processing method of the LED display, and the processing method comprises the following steps:
providing a first substrate;
attaching a plurality of light emitting chips to the first substrate, wherein the light emitting chips emit first primary color light;
providing a second substrate, wherein the second substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals;
a first primary color film is arranged in the first primary color area, a second primary color film is arranged in the second primary color area, the first primary color film can emit second primary color light after being excited by the light emitting chip, and the second primary color film can emit third primary color light after being excited by the light emitting chip;
and attaching the first substrate and the second substrate, wherein the orthographic projection of the first primary color film on the first substrate is at least partially overlapped with one light-emitting chip, and the orthographic projection of the second primary color film on the first substrate is at least partially overlapped with one light-emitting chip.
An embodiment of the present application further provides an LED display, the display includes:
the substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals;
the light-emitting chip is arranged in the first primary color area, the second primary color area and the third primary color area, and can emit first primary color light;
the first primary color film is arranged on a light emitting area of the light emitting chip in the first primary color area, and can emit second primary color light after being excited by the light emitting chip;
the second primary color film is arranged on a light emitting area of the light emitting chip in the second primary color area, and the first primary color film can emit third primary color light after being excited by the light emitting chip.
Optionally, the first primary color film is a colloidal medium coating, the second primary color film is a colloidal medium coating, and the first primary color film and the second primary color film are made of one or a combination of fluorescent powder and quantum dots.
Optionally, the first and second primary color films each include a plurality of diffusing particles and/or a plurality of foaming particles.
Optionally, the color segment wavelength of the second primary color light and the color segment wavelength of the third primary color light are both greater than the color segment wavelength of the first primary color light.
An embodiment of the present application further provides an LED display, the display includes:
the display panel comprises a first substrate and a second substrate which are arranged in a stacked mode, wherein the second substrate comprises a first primary color area, a second primary color area and a third primary color area;
the light-emitting chip is arranged on the first substrate and can emit first primary color light;
the first primary color film is positioned in the first primary color area, and can emit second primary color light after being excited by the light-emitting chip;
the second primary color film is positioned in the second primary color area, and can emit third primary color light after being excited by the light-emitting chip;
the orthographic projection of the first primary color film on the first substrate is at least partially overlapped with one light-emitting chip, and the orthographic projection of the second primary color film on the first substrate is at least partially overlapped with one light-emitting chip.
The beneficial effect of this application lies in: the embodiment of the application provides a processing method of an LED display, a plurality of same light-emitting chips are attached to a substrate, a first primary color film is arranged on the light-emitting chips positioned in a first primary color area, a second primary color film is arranged on the light-emitting chips positioned in a second primary color area, the light-emitting chips can emit first primary color light, the first primary color film can emit second primary color light after being excited by the light-emitting chips, the second primary color film can emit third primary color light after being excited by the light-emitting chips, and further the manufacturing of three-color light is realized, compared with the prior art that R/G/B three-primary color LED lamps are respectively attached to the substrate, the embodiment of the application only needs to attach the light-emitting chips of one primary color, and then the first primary color film and the second primary color film are formed on the light-emitting chips by film plating, the manufacturing of the three primary colors is realized, the processing process flow is simplified, and the film plating can realize the rapid batch manufacturing of the LED displays, and then the efficiency of processing the LED display is improved, and the problem of low efficiency in the processing process of the LED display is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic flow chart of a first processing method of an LED display provided in this embodiment;
FIG. 2 is a schematic view of a first viewing angle corresponding to each step in the processing method shown in FIG. 1;
FIG. 3 is a schematic diagram of a second viewing angle corresponding to each step in the processing method shown in FIG. 1;
fig. 4 is a schematic flow chart of a second method for processing an LED display according to this embodiment;
FIG. 5 is a schematic diagram of the processing method shown in FIG. 4 corresponding to various steps;
fig. 6 is a schematic view of a first structure of the LED display provided in this embodiment;
FIG. 7 is a top view of the LED display shown in FIG. 6;
fig. 8 is a schematic diagram of a second structure of the LED display provided in this embodiment.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
At present, a COB (chip on board) technology is used in the manufacturing process of an LED display, but one pixel needs to be respectively attached to an R/G/B three-primary-color LED lamp on a substrate, and for a large-size and high-density display, the method for assembling the LED display has low efficiency, so that the rapid processing of the display is difficult to achieve rapidly.
Therefore, in order to solve the above problems, the present application proposes an LED display and a method for manufacturing the same. The present application will be further described with reference to the accompanying drawings and embodiments.
Referring to fig. 1 to fig. 3, fig. 1 is a schematic flow chart illustrating a first processing method of an LED display according to the present embodiment, fig. 2 is a schematic view illustrating steps of the processing method shown in fig. 1, and fig. 3 is a schematic view illustrating a second viewing angle corresponding to the steps of the processing method shown in fig. 1. The embodiment of the application provides a processing method of an LED display, a light-emitting chip is attached to a substrate, a first primary color film is arranged on the light-emitting chip positioned in a first primary color area, a second primary color film is arranged on the light-emitting chip positioned in a second primary color area, the light-emitting chip can emit first primary color light, the first primary color film can emit second primary color light after being excited by the light-emitting chip, the second primary color film can emit third primary color light after being excited by the light-emitting chip, and further three-color light is realized, compared with the prior art that R/G/B three-primary color LED lamps are respectively attached to the substrate, the embodiment of the application only needs to attach the light-emitting chip of one primary color, and the first primary color film and the second primary color film are formed on the light-emitting chip by film plating, the emission of three primary colors is realized, compared with a COB process technology, the film plating is applied, the processing process flow is simplified, the LED display can be manufactured quickly, the efficiency of processing the LED display is improved, and the problem of low efficiency in the processing process of the LED display is solved. And the light emitting chip excites different primary color films to generate different primary color light, so that the output light is more uniform. For specific details, see below.
101. A substrate is provided and comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals.
A substrate 10 is provided, and the substrate 10 includes a first primary color region 110, a second primary color region 120 and a third primary color region 130 which are arranged at intervals.
It is understood that the substrate 10 may be a transparent substrate 10, and the substrate 10 may also be an opaque substrate 10. Illustratively, the substrate 10 may be a PCB substrate 10 or a glass substrate 10, or the like.
102. The light emitting chip is attached to the first primary color area, the second primary color area and the third primary color area.
The light emitting chip 20 is attached to the first, second, and third primary color regions 110, 120, and 130.
It is understood that the light emitting chip 20 may emit the first primary color light.
The first primary color light emitted by the light emitting chip 20 may be one of blue, red, or green, or the first primary color light emitted by the light emitting chip 20 may be one of violet, yellow, or cyan instead of one of blue, red, and green.
The embodiment of the present application is described by taking an example that the third primary color light emitted by the light emitting chip 20 may be one of blue, red or green, and should not be construed as a limitation to the light emitting chip 20.
103. The light emitting chip in the first primary color region is provided with a first primary color film, the light emitting chip in the second primary color region is provided with a second primary color film, the first primary color film can emit second primary color light after being excited by the light emitting chip, the second primary color film can emit third primary color light after being excited by the light emitting chip, and the light emitting chip emits third primary color light.
The first primary color film 30 is disposed on the light emitting chip 20 located in the first primary color region 110, and the second primary color film 40 is disposed on the light emitting chip 20 located in the second primary color region 120. The first primary color film 30 can emit a second primary color light after being excited by the light emitting chip 20, the second primary color film 40 can emit a third primary color light after being excited by the light emitting chip 20, and the light emitting chip 20 can emit the third primary color light. It is understood that the color segment wavelength of the second primary color light and the color segment wavelength of the third primary color light are both greater than the color segment wavelength of the first primary color light. Since the shorter the wavelength of the light, the more energy, the light of the first primary color with the large energy can excite the first primary color film 30 and the second primary color film 40 to emit the light of the second primary color and the light of the third primary color.
It can be understood that the first primary color film and the second primary color film are arranged on the same substrate instead of being arranged in an overlapping manner, so that the arrangement of the first primary color film on the light emitting chip in the first primary color region and the arrangement of the second primary color film on the light emitting chip in the second primary color region can be performed simultaneously, which can increase the efficiency of producing the LED display, and further enable the LED display to be produced in batches. And the first primary color film and the second primary color film are respectively positioned on the corresponding light-emitting chips, so that the contact areas of the light-emitting chips and the first primary color film and the second primary color film are larger, and the light-emitting chips can excite the first primary color film and the second primary color film to have better effect.
It should be noted that the first primary color film is disposed on the light emitting chip located in the first primary color region, and the second primary color film is disposed on the light emitting chip located in the second primary color region simultaneously. The first primary color film is arranged on the light emitting chip positioned in the first primary color area, and the second primary color film is arranged on the light emitting chip positioned in the second primary color area.
It is understood that the first primary color film 30 may be formed on the light emitting chip 20 located in the first primary color region 110 by means of partial filming, and the second primary color film 40 may be formed on the light emitting chip 20 located in the second primary color region 120 by means of partial filming. The first primary color film 30 may also be formed on the light emitting chip 20 located in the first primary color region 110 by global filming, and the second primary color film 40 may also be formed on the light emitting chip 20 located in the second primary color region 120 by global filming. The first primary color film 30 may also be formed on the light emitting chip 20 located in the first primary color region 110 by global film plating, and the second primary color film 40 may also be formed on the light emitting chip 20 located in the second primary color region 120 by local film plating. The first primary color film 30 may also be formed on the light emitting chip 20 located in the first primary color region 110 by using a local plating method, and the second primary color film 40 may also be formed on the light emitting chip 20 located in the second primary color region 120 by using a global plating method. The specific coating method is designed according to actual needs, and is not specifically limited herein.
For example, referring to fig. 2, in some embodiments, the LED display is manufactured by using a local plating method. Namely, the first primary color conversion material is plated on the light emitting chip 20 located in the first primary color region 110 to obtain the first primary color film 30, and the second primary color conversion material is plated on the light emitting chip 20 located in the second primary color region 120 to obtain the second primary color film 40, so as to obtain the first primary color film 30 capable of emitting the second primary color light after being excited by the light emitting chip 20 and the second primary color film 40 capable of emitting the third primary color light after being excited by the light emitting chip 20. The light emitting chip 20 of the lighting substrate 10 can display RGB primary color light, thereby realizing the fabrication of the LED display.
For example, the substrate 10 is taken as a PCB substrate 10, and a blue chip is attached to the first primary color region 110, the second primary color region 120, and the third primary color region 130 of the PCB substrate 10. After the blue LED chip is lit, the PCB substrate 10 displays blue light. Next, a red excitation film is plated on the blue LED chip located in the second primary color region 120, and the blue light excites the red excitation film to generate red light, thereby obtaining a red display region in the second primary color region 120. And thirdly, a green excitation film is plated on the blue LED chip located in the third primary color region 130, and green light is generated after the blue light excites the green excitation film. And finally, the LED lamp of the substrate 10 is lightened to display R/G/B three-color primary color light, so that the LED display is manufactured.
Note that the first primary color conversion material is printed, or sprayed on the light emitting chip 20 located in the first primary color region 110 so that the first primary color film 30 is formed in the first primary color region 110.
The second primary color conversion material is printed, or sprayed on the light emitting chip 20 located in the second primary color region 120 such that the second primary color film 40 is formed in the second primary color region 120.
Illustratively, in some embodiments, the LED display is manufactured by adopting a global coating film mode. For example, a first primary color conversion material is plated on the light emitting chip 20; the first primary color conversion material is etched in the second and third primary color regions 120 and 130 so that the first primary color film 30 is formed on the light emitting chip 20 positioned in the first primary color region 110. A second primary color conversion material is plated on the light emitting chip 20, and the second primary color conversion material is etched in the first primary color region 110 and the third primary color region 130, so that a second primary color film 40 is formed on the light emitting chip 20 located in the second primary color region 120.
For example, a PCB is taken as the substrate 10, and a blue light chip is attached to the first primary color region 110, the second primary color region 120, and the third primary color region 130 of the PCB substrate 10. After the blue LED chip is turned on, the substrate 10 displays blue light. Next, a red excitation film is plated on the light emitting chip 20 on the whole substrate 10, and the red excitation films of the second primary color region 120 and the third primary color region 130 are removed by etching, so that the first primary color film 30 is formed on the light emitting chip 20 located in the first primary color region 110. The blue light excites the red excitation film to generate red light, thereby forming a red display region in the first primary color region 110. Thirdly, a green excitation film is plated on the light emitting chip 20 of the entire substrate 10, and the red excitation films of the second primary color region 120 and the third primary color region 130 are removed by etching, so that the first primary color film 30 is formed on the light emitting chip 20 located in the first primary color region 110, only the green excitation film of the second primary color region 120 remains, and the blue light excites the green excitation film of the second primary color region 120 to generate green light, so as to form a green display region in the second primary color region 120. And finally, the LED lamp of the substrate 10 is lightened to display R/G/B three-color primary color light, so that the LED display is manufactured. The processing process flow is simplified, the LED display can be rapidly manufactured, the efficiency of processing the LED display is improved, and the problem of low efficiency in the processing process of the LED display is solved.
It should be noted that, in some embodiments, the substrate 10 is a transparent substrate 10, and the light emitting chip 20 may be disposed on one side of the substrate 10, and the first primary color film 30 and the second primary color film 40 may be disposed on the other side of the light emitting chip 20. Because the substrate 10 is more flat, the first primary color film 30 and the second primary color film 40 can be better plated on the substrate 10.
With reference to fig. 4 to fig. 5, fig. 4 is a schematic flow chart illustrating a second processing method of the LED display according to the present embodiment; fig. 5 is a schematic diagram corresponding to each step in the processing method shown in fig. 4. The embodiment of the application further provides a processing method of the LED display, and the processing method specifically comprises the following steps:
201. a first substrate is provided.
The first substrate 11 is provided, it being understood that the first substrate 11 may be a transparent substrate, and the first substrate 11 may also be an opaque substrate. Illustratively, the first substrate 11 may be a PCB substrate or a glass substrate, or the like.
202. A plurality of light emitting chips are attached to the first substrate and emit first primary color light.
See step 102 for details, which are not described herein.
203. And providing a second substrate, wherein the second substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals.
A second substrate 12 is provided, the second substrate 12 including spaced apart first, second and third primary color regions 110, 120, 130. It is understood that the second substrate 12 may be a transparent substrate 10 and the second substrate 12 may also be an opaque substrate 10. Illustratively, the second substrate 12 may be a PCB substrate 10 or a glass substrate 10, or the like.
204. The first primary color area is provided with a first primary color film, the second primary color area is provided with a second primary color film, the first primary color film can emit second primary color light after being excited by the light emitting chip, and the second primary color film can emit third primary color light after being excited by the light emitting chip.
See step 103 for details, which are not described herein.
205. And attaching the first substrate and the second substrate, wherein the orthographic projection of the first primary color film on the first substrate is at least partially overlapped with one light-emitting chip, and the orthographic projection of the second primary color film on the first substrate is at least partially overlapped with one light-emitting chip.
The first substrate 11 and the second substrate 12 are bonded, and it is understood that the orthographic projection of the first primary color film 30 on the first substrate 11 at least partially overlaps with one light emitting chip 20, and the orthographic projection of the second primary color film 40 on the first substrate 11 at least partially overlaps with one light emitting chip 20. That is, the orthographic projection of the light emitting chip 20 on the first primary color region 110 is at least partially overlapped with the first primary color film 30, and the orthographic projection of the light emitting chip 20 on the second primary color region 120 is at least partially overlapped with the second primary color film 40. So that the first primary color film 30 can emit the second primary color light after being excited by the light emitting chip 20, and the second primary color film 40 can emit the third primary color light after being excited by the light emitting chip 20.
It is understood that in some embodiments, the orthographic projection of the light emitting chip 20 on the first primary color region 110 overlaps the first primary color film 30, and the orthographic projection of the light emitting chip 20 on the second primary color region 120 overlaps the second primary color film 40. The overlapping arrangement may enable the light emitting chip 20 to better excite the first primary color film 30 and the second primary color film 40, so that the emitted light of the second primary color and the emitted light of the third primary color are more uniform.
Referring to fig. 6 and fig. 7, fig. 6 is a schematic view illustrating a first structure of the LED display according to the present embodiment, and fig. 7 is a top view of the LED display shown in fig. 6. The embodiment of the application provides an LED display 100, and the display 100 includes a substrate 10, a light emitting chip 20, a first primary color film 30, and a second primary color film 40, where the substrate 10 includes a first primary color region 110, a second primary color region 120, and a third primary color region 130 that are disposed at intervals. The light emitting chip 20 is disposed in the first primary color region 110, the second primary color region 120, and the third primary color region 130, and the light emitting chip 20 can emit the first primary color light. The first primary color film 30 is disposed on the light emitting region of the light emitting chip 20 in the first primary color region 110, and the first primary color film 30 can emit the second primary color light after being excited by the light emitting chip 20. The second primary color film 40 is disposed on the light emitting region of the light emitting chip 20 in the second primary color region 120, and the first primary color film 30 can emit the third primary color light after being excited by the light emitting chip 20.
In some embodiments, the first color base film 30 is a colloidal medium coating, the second color base film 40 is a colloidal medium coating, and the material of the first color base film 30 and the second color base film 40 is one of phosphor, quantum dot or a combination thereof.
In some embodiments, the first and second basecoat films 30, 40 include a plurality of diffusing particles and/or a plurality of foaming particles. The diffusion particles and the foaming particles are nano/micron particles, so that the light scattering effect is good, the scattering and scattering of incident light sources at various angles can be effectively carried out, and the light is uniformly distributed.
The color segment wavelength of the second primary color light and the color segment wavelength of the third primary color light are both greater than the color segment wavelength of the first primary color light.
Referring to fig. 8, fig. 8 is a schematic view of a second structure of the LED display 100 according to the present embodiment. The embodiment of the present application provides an LED display 100, the display 100 includes a first substrate 11 and a second substrate 12, a light emitting chip 20, a first primary color film 30 and a second primary color film 40, which are stacked, wherein the second substrate 12 includes a first primary color region 110, a second primary color region 120 and a third primary color region 130;
the light emitting chip 20 is disposed on the first substrate 11, and the light emitting chip 20 can emit a first primary color light.
The first primary color film 30 is located in the first primary color region 110, and the first primary color film 30 can emit the second primary color light after being excited by the light emitting chip 20.
And the second primary color film 40, wherein the second primary color film 40 is located in the second primary color region 120, and the second primary color film 40 can emit third primary color light after being excited by the light emitting chip 20.
Wherein, the orthographic projection of the light emitting chip 20 on the first primary color region 110 is at least partially overlapped with the first primary color film 30, and the orthographic projection of the light emitting chip 20 on the second primary color region 120 is at least partially overlapped with the second primary color film 40.
The LED display and the processing method thereof provided by the embodiments of the present application are described in detail above. The principles and embodiments of the present application have been described herein using specific guidelines, the above examples being provided only to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A processing method of an LED display is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals;
light emitting chips are attached to the first primary color area, the second primary color area and the third primary color area, and the light emitting chips emit first primary color light;
the light emitting chip in the first primary color region is provided with a first primary color film, the light emitting chip in the second primary color region is provided with a second primary color film, the first primary color film can emit second primary color light after being excited by the light emitting chip, and the second primary color film can emit third primary color light after being excited by the light emitting chip.
2. The process of claim 1, wherein disposing a first primary color film on the light emitting chip in the first primary color region and disposing a second primary color film on the light emitting chip in the second primary color region comprises:
plating a first primary color conversion material on the light-emitting chip positioned in the first primary color area to obtain a first primary color film;
and plating a second primary color conversion material on the light-emitting chip positioned in the second primary color area to obtain a second primary color film.
3. The process of claim 2, wherein said plating a first primary color conversion material on the light emitting chip in the first primary color region to obtain a first primary color film comprises:
printing, printing or spraying the first primary color conversion material on the light emitting chip located in the first primary color region so that the first primary color film is formed in the first primary color region; and/or
The plating of a second primary color conversion material on the light emitting chip located in the second primary color region to obtain a second primary color film comprises:
and printing, printing or spraying the second primary color conversion material on the light emitting chip positioned in the second primary color area so as to form the second primary color film in the second primary color area.
4. The process of claim 1, wherein disposing a first primary color film on the light emitting chip in the first primary color region and disposing a second primary color film on the light emitting chip in the second primary color region comprises:
plating a first primary color conversion material on the light emitting chip;
etching the first primary color conversion material in the second primary color area and the third primary color area so as to form the first primary color film on the light-emitting chip positioned in the first primary color area;
plating a second primary color conversion material on the light-emitting chip;
and etching the second primary color conversion material in the first primary color area and the third primary color area so as to form the second primary color film on the light-emitting chip positioned in the second primary color area.
5. A processing method of an LED display is characterized by comprising the following steps:
providing a first substrate;
attaching a plurality of light emitting chips to the first substrate, wherein the light emitting chips emit first primary color light;
providing a second substrate, wherein the second substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals;
a first primary color film is arranged in the first primary color area, a second primary color film is arranged in the second primary color area, the first primary color film can emit second primary color light after being excited by the light emitting chip, and the second primary color film can emit third primary color light after being excited by the light emitting chip;
and attaching the first substrate and the second substrate, wherein the orthographic projection of the first primary color film on the first substrate is at least partially overlapped with one light-emitting chip, and the orthographic projection of the second primary color film on the first substrate is at least partially overlapped with one light-emitting chip.
6. An LED display, characterized in that the display comprises:
the substrate comprises a first primary color area, a second primary color area and a third primary color area which are arranged at intervals;
the light-emitting chip is arranged in the first primary color area, the second primary color area and the third primary color area, and can emit first primary color light;
the first primary color film is arranged on a light emitting area of the light emitting chip in the first primary color area, and can emit second primary color light after being excited by the light emitting chip;
the second primary color film is arranged on a light emitting area of the light emitting chip in the second primary color area, and the first primary color film can emit third primary color light after being excited by the light emitting chip.
7. The display according to claim 6, wherein the first color base film is a colloidal dielectric coating, the second color base film is a colloidal dielectric coating, and the materials of the first color base film and the second color base film are one of phosphor, quantum dots, or a combination thereof.
8. The display of claim 6, wherein the first and second primary color films each comprise a plurality of diffusing particles and/or a plurality of foaming particles.
9. The display of claim 6, wherein the color segment wavelength of the second primary light and the color segment wavelength of the third primary light are both greater than the color segment wavelength of the first primary light.
10. An LED display, characterized in that the display comprises:
the display panel comprises a first substrate and a second substrate which are arranged in a stacked mode, wherein the second substrate comprises a first primary color area, a second primary color area and a third primary color area;
the light-emitting chip is arranged on the first substrate and can emit first primary color light;
the first primary color film is positioned in the first primary color area, and can emit second primary color light after being excited by the light-emitting chip;
the second primary color film is positioned in the second primary color area, and can emit third primary color light after being excited by the light-emitting chip;
the orthographic projection of the first primary color film on the first substrate is at least partially overlapped with one light-emitting chip, and the orthographic projection of the second primary color film on the first substrate is at least partially overlapped with one light-emitting chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111117209.2A CN113871407A (en) | 2021-09-23 | 2021-09-23 | LED display and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111117209.2A CN113871407A (en) | 2021-09-23 | 2021-09-23 | LED display and processing method thereof |
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| CN113871407A true CN113871407A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111117209.2A Pending CN113871407A (en) | 2021-09-23 | 2021-09-23 | LED display and processing method thereof |
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| CN (1) | CN113871407A (en) |
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2021
- 2021-09-23 CN CN202111117209.2A patent/CN113871407A/en active Pending
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