CN113871321A

CN113871321A - Substrate processing method and substrate processing apparatus

Info

Publication number: CN113871321A
Application number: CN202110725317.1A
Authority: CN
Inventors: 镰田雅之; 山中智史; 酒井康将; 今城周也; 平藤裕司
Original assignee: Screen Holdings Co Ltd
Current assignee: Screen Holdings Co Ltd
Priority date: 2020-06-30
Filing date: 2021-06-29
Publication date: 2021-12-31
Also published as: KR20220002126A; TW202205416A; JP2022011452A; TWI823102B; KR102571029B1; JP7487024B2

Abstract

The invention provides a substrate processing method, which provides a technology capable of inhibiting the pollution of a processing unit from spreading. The substrate processing method includes: a setting step (S1) for setting, for each of a plurality of processing units provided in a substrate processing apparatus, a usable dummy substrate among a plurality of dummy substrates stored in a storage device based on an input from a user, and generating setting information indicating the usable dummy substrate for each of the plurality of processing units; a dummy substrate specifying step (S3) for specifying a first dummy substrate usable in a first processing unit of the plurality of processing units from among the plurality of dummy substrates based on the setting information; and a simulation processing step (S4) in which a transfer unit provided in the substrate processing apparatus transfers the first dummy substrate from the container to the first processing unit, and the first processing unit performs simulation processing on the first dummy substrate.

Description

Substrate processing method and substrate processing apparatus

Technical Field

The present application relates to a substrate processing method and a substrate processing apparatus.

Background

In a manufacturing process of products such as semiconductor devices and liquid crystal display devices, a substrate processing apparatus is used which performs various processes on a substrate. The substrate processing apparatus includes a plurality of processing units for supplying a processing liquid to a substrate, a transfer unit for transferring the substrate, and a control unit for controlling the processing units. The processing unit supplies the processing liquid to the substrates carried in one by one from the carrying unit, and processes the substrates one by one. When the processing unit processes a plurality of substrates, contamination (particles and the like) gradually accumulates inside the processing unit. Therefore, in the substrate processing apparatus, unit cleaning for cleaning the inside of the processing unit is performed as necessary (for example, patent document 1).

In order to perform the cell cleaning, a dummy substrate may be used. The dummy substrate is a substrate (product substrate) that is not processed for producing a product but has the same outer shape as the product substrate. The unit cleaning process is performed in a state where the dummy substrate is held by the substrate holder in the processing unit, so that various kinds of unit cleaning can be performed as compared with a state where any substrate is not held by the substrate holder. For example, in order to allow the cleaning liquid to reach a specific position in the processing unit, the dummy substrate may be held by the substrate holder and the cleaning liquid may be supplied to the dummy substrate. That is, since there is a place in the process unit where cleaning by unit cleaning is impossible without using the dummy substrate, it is effective to clean the inside of the process unit using the dummy substrate.

Patent document 1: japanese patent laid-open publication No. 2017-41506

The plurality of processing units of the substrate processing apparatus may include processing units used in different stages of a manufacturing process. For example, the processing unit includes a processing unit used in an initial step (so-called Front End Of Line (FEOL)) in the manufacturing process and a processing unit used in a Middle step (so-called Middle End Of Line (MEOL)).

The film structure of the substrate carried in the FEOL processing unit is different from that of the substrate carried in the MEOL processing unit, and the kind of the processing liquid supplied to the substrate in the FEOL processing unit may be different from that in the MEOL processing unit. Thus, the kind of contamination of particles or the like generated in the processing unit for FEOL may be different from the kind of contamination generated in the processing unit for MEOL.

If the same dummy substrate is used for the processing units for different applications, there is a problem that contamination of the processing unit for one application is diffused into the processing unit for another application via the dummy substrate.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of suppressing the spread of contamination in a process unit.

A first aspect of the substrate processing method is a substrate processing method including: a setting step of setting, for each of a plurality of processing units provided in a substrate processing apparatus, a usable dummy substrate among a plurality of dummy substrates accommodated in a container based on an input from a user, and generating setting information indicating the usable dummy substrate for each of the plurality of processing units; a dummy substrate specifying step of specifying a first dummy substrate usable in a first processing unit of the plurality of processing units from among the plurality of dummy substrates based on the setting information; and a simulation processing step of transferring the first dummy substrate from the container to the first processing unit by a transfer unit provided in the substrate processing apparatus, and performing simulation processing on the first dummy substrate by the first processing unit.

A second aspect of the substrate processing method is the substrate processing method according to the first aspect, wherein the setting step includes: setting a process of a processing type for each of the plurality of processing units based on an input by a user; and a step of setting a process type for each of the plurality of dummy substrates based on an input from a user, wherein in the dummy substrate specifying step, a dummy substrate belonging to a process type identical to that of the first process unit is specified as the first dummy substrate.

A third aspect of the substrate processing method is the substrate processing method according to the second aspect, wherein the processing type includes a type indicating any one of a plurality of processing stages in which the manufacturing process of the semiconductor device is divided.

A fourth aspect of the substrate processing method is the substrate processing method according to the second or third aspect, wherein the processing types for the plurality of dummy substrates include a type indicating that the dummy substrate can be used in any one of the plurality of processing units.

A fifth aspect of the substrate processing method is the substrate processing method according to any one of the second to fourth aspects, wherein the setting step further includes: and setting, based on an input from a user, a hand to be used for the transfer of the first dummy substrate among the plurality of hands included in the transfer unit, for each process type.

A sixth aspect of the substrate processing method is the substrate processing method according to any one of the first to fifth aspects, wherein in the setting step, 2 or more dummy substrates among the plurality of dummy substrates are set to be usable in the first processing unit, and in the dummy substrate specifying step, a dummy substrate that is used the fewest number of times among the 2 or more dummy substrates is specified as the first dummy substrate.

A seventh aspect of the substrate processing method is the substrate processing method according to any one of the first to sixth aspects, wherein the setting step further includes: the plurality of dummy substrates stored in the first storage container and the second storage container are set based on the input of the user.

An eighth aspect of the substrate processing method is the substrate processing method according to any one of the first to seventh aspects, wherein the setting step further includes: the method further includes setting at least one of a first start condition and a second start condition as the start condition for each of the plurality of processing units, the first start condition being a lifetime for which each of the plurality of processing units does not continue processing a substrate being equal to or longer than a lifetime set time, and the second start condition being a lifetime for which the number of processed substrates in each of the plurality of processing units is equal to or longer than a lifetime set number.

A ninth aspect of the substrate processing method is the substrate processing method according to the eighth aspect, wherein the setting step further includes: and setting at least one of the lifetime setting time and the lifetime setting number based on an input by a user.

A tenth aspect of the substrate processing method is the substrate processing method according to any one of the first to ninth aspects, wherein the setting step further includes: and a step of setting the number of processed sheets of the dummy substrate used in the dummy processing step for each of the plurality of processing units based on an input from a user, wherein the first dummy substrate of the set number of processed sheets is sequentially carried into the first processing unit in the dummy processing step, and the first processing unit performs the dummy processing on the sequentially carried first dummy substrates.

An eleventh aspect of the substrate processing method is the substrate processing method according to any one of the first to tenth aspects, further comprising a processing step in which the plurality of processing units sequentially execute processing on the substrate for each processing task in which a plurality of predetermined substrates are set as one unit, the setting step further comprising: and setting, based on an input from a user, whether to perform the simulation process between an execution period of a process on the process task and an execution period of a process on a next process task, or to perform the simulation process during the execution period of the process task.

A twelfth aspect of the substrate processing method is the substrate processing method according to any one of the first to eleventh aspects, further comprising an inspection step of inspecting whether or not the setting in the setting step is appropriate.

A thirteenth aspect of the substrate processing method is the substrate processing method according to any one of the second to fourth aspects, further comprising an inspection step of inspecting whether or not all types of processing categories set in the plurality of processing units are set for the plurality of dummy substrates.

A fourteenth aspect of the substrate processing method is the substrate processing method according to any one of the first to thirteenth aspects, wherein in the dummy processing step, the first processing unit supplies a cleaning liquid to the first dummy substrate.

A fifteenth aspect of the substrate processing method is the substrate processing method according to any one of the first to fourteenth aspects, wherein in the dummy processing step, the first processing unit supplies the same processing liquid as the processing liquid supplied to the substrate by the first processing unit to the first dummy substrate.

A sixteenth aspect of the substrate processing method is the substrate processing method according to any one of the first to fifteenth aspects, further comprising an initialization step of initializing the setting information when the plurality of dummy substrates are carried out to the outside of the substrate processing apparatus.

The first mode of the substrate processing apparatus is a substrate processing apparatus, an input device; a plurality of processing units; a transfer unit that transfers the dummy substrate between a container that contains a plurality of dummy substrates and each of the plurality of processing units; and a control unit configured to create setting information indicating a usable dummy substrate among the plurality of dummy substrates for each of the plurality of processing units based on an input to an input device, specify a first dummy substrate usable in a first processing unit among the plurality of processing units based on the setting information, cause the transfer unit to transfer the first dummy substrate from the container to the first processing unit, and cause the first processing unit to perform a dummy process on the first dummy substrate.

The dummy substrate usable in the processing unit is set according to the first and third aspects of the substrate processing method and the aspect of the substrate processing apparatus. Thus, by setting different dummy substrates in the process units in which different types of contamination occur, it is possible to suppress the contamination occurring in one process unit from spreading to another process unit.

According to the second aspect of the substrate processing method, different dummy substrates are used in the processing units having different processing types, and diffusion of different contaminants can be suppressed. In addition, one process type may be set for each process unit, and one process type may be set for each dummy substrate, and thus, the setting can be easily performed.

According to the fourth aspect of the substrate processing method, usability can be improved.

According to the fifth aspect of the substrate processing method, the hand is set according to the process type, and the spread of contamination via the hand can be suppressed.

According to the sixth aspect of the substrate processing method, the number of times a specific dummy substrate is used can be significantly reduced as compared with other dummy substrates.

According to the seventh aspect of the substrate processing method, usability can be improved.

According to the eighth aspect of the substrate processing method, usability can be improved.

According to the ninth aspect of the substrate processing method, usability can be improved.

According to the tenth aspect of the substrate processing method, the simulation process can be continuously performed 1 or more times in the simulation process step. The number of consecutive times of the simulation process (the number of processes) is set for each processing unit, and the simulation process can be performed a number of times suitable for the processing unit.

According to the eleventh aspect of the substrate processing method, usability can be improved.

According to the twelfth and thirteenth aspects of the substrate processing method, erroneous setting can be suppressed.

According to the fourteenth aspect of the substrate processing method, the processing unit can be cleaned.

According to the fifteenth aspect of the substrate processing method, the processing environment of the processing unit can be adjusted.

According to the sixteenth aspect of the substrate processing method, when a plurality of new dummy substrates are loaded into the substrate processing apparatus, it is possible to avoid loading the dummy substrates into the processing unit using the previous setting information.

Drawings

Fig. 1 is a diagram schematically showing an example of the overall configuration of a substrate processing apparatus.

Fig. 2 is a side view schematically showing an example of the configuration of the substrate processing apparatus.

Fig. 3 is a block diagram schematically showing an example of an electrical configuration of the substrate processing apparatus.

Fig. 4 is a flowchart showing an example of the operation of the substrate processing apparatus.

Fig. 5 is a flowchart showing an example of the setting step.

Fig. 6 is a diagram schematically showing an example of the first setting image.

Fig. 7 is a diagram schematically showing an example of the second setting image.

FIG. 8 is a flowchart showing an example of a dummy substrate specifying step.

Fig. 9 is a diagram showing an example of the relationship between the hand and the process type.

Fig. 10 is a timing chart showing an example of the simulation process.

Fig. 11 is a timing chart showing an example of substrate processing.

Fig. 12 is a timing chart showing an example of substrate processing.

Fig. 13 is a flowchart showing an example of the inspection process.

Fig. 14 is a diagram schematically showing another example of the second setting image.

Fig. 15 is a flowchart schematically showing an example of the initialization process.

Wherein the reference numerals are as follows:

10: processing unit

90: control unit

100: substrate processing apparatus

BF: container (simulation substrate container)

C: container (containing rack)

DW: simulation substrate

CR: transporting part (Central manipulator)

H: hand part

IR: transporting part (indexer mechanical arm)

W: substrate

Detailed Description

Hereinafter, embodiments will be described with reference to the drawings. The drawings are schematically illustrated, and the configuration is omitted and simplified as appropriate for convenience of explanation. The relationship between the size and the position of the structures shown in the drawings is not necessarily described precisely, and may be changed as appropriate.

In the following description, the same components are denoted by the same reference numerals and have the same names and functions. Therefore, detailed description thereof may be omitted to avoid redundancy.

In the following description, even when ordinal numbers such as "first" and "second" are used, these terms are used to facilitate understanding of the contents of the embodiments, and are not limited to the order in which the ordinal numbers are used.

Unless otherwise specified, expressions indicating relative or absolute positional relationships (for example, "in one direction", "along one direction", "parallel", "orthogonal", "central", "concentric", "coaxial", and the like) indicate not only the positional relationships in a strict sense but also a state in which angles or distances are relatively displaced within a range in which tolerances or functions of the same degree can be obtained. Unless otherwise specified, expressions indicating the same state (for example, "same", "equal", "homogeneous", etc.) mean not only the state of being quantitatively and strictly equal but also the state of being subject to tolerance or obtaining the same degree of functional difference. Unless otherwise specified, the expression indicating the shape (for example, "quadrangular shape" or "cylindrical shape") indicates not only the shape which is geometrically strict but also a shape having, for example, irregularities or chamfered corners within a range in which the same degree of effect can be obtained. The expression that one constituent element is expressed as being "provided with", "having", "including" or "having" is not an exclusive expression that excludes the presence of other constituent elements. The expression "A, B and at least one of C" includes the case of all of a alone, B alone, C alone, any two of A, B and C, and A, B and C.

< schematic Structure of substrate processing apparatus >

Fig. 1 is a plan view schematically showing an example of the structure of a substrate processing apparatus 100. Fig. 2 is a side view schematically showing an example of the structure of the substrate processing apparatus 100.

As shown in fig. 1, the substrate processing apparatus 100 is, for example, a sheet-fed apparatus that can be used for processing to remove organic residues adhering to the surface of a semiconductor substrate (wafer) W, which is an example of a substrate. Examples of the organic residue include unnecessary resist remaining on the surface of the substrate W after ion implantation treatment for implanting impurities into the surface of the substrate W, and organic debris derived from the resist adhering to the vicinity of the outer periphery of the surface of the substrate W. The substrate processing apparatus 100 can also be used for removing inorganic residues and etching the substrate W.

The substrate processing apparatus 100 includes: a load port LP as a container holding mechanism for holding a plurality of container racks C as containers; and a plurality of processing units 10 (12 stages in the present embodiment) for processing the substrate W.

In the load port LP, a plurality of receiving racks C for receiving a plurality of substrates W are arranged along a horizontal arrangement direction D in a plan view. Since the receiving rack C is loaded into the load port LP from the outside of the substrate processing apparatus 100, the load port LP functions as a loading unit for loading the substrate W.

In the example of fig. 1, 4 processing units 10 are arranged in a plan view. In the substrate processing apparatus 100, a plurality of (for example, 3) processing units 10 respectively configured from the 4 processing units 10 are arranged to be stacked in the vertical direction.

The substrate processing apparatus 100 further includes, for example, an indexer robot IR, a center robot CR, and a controller 90. The indexer robot IR transfers the substrate W between the load port LP and the central robot CR. The center robot CR transports the substrate W between the indexer robot IR and each processing unit 10.

The indexer robot IR is disposed adjacent to the load port LP in a direction orthogonal to the arrangement direction D. The indexer robot IR is provided movably in the arrangement direction D and is movable to a position facing each of the storage shelves C. The indexer robot IR can carry out the substrates W one by one from each of the storage shelves C and convey the substrates W to the substrate mount 110. The substrate mounting unit 110 is provided on a stage on which the substrate W is mounted, the stage being located on the opposite side of the indexer robot IR from the load port LP in plan view. The indexer robot IR can transfer the substrates W from the substrate mount 110 to the respective storage shelves C one by one.

The center robot CR is disposed on the opposite side of the indexer robot IR with respect to the substrate mounting unit 110 in a plan view, and can carry out the substrate W from the substrate mounting unit 110. In the example of fig. 1, four towers TW are arranged to surround the center robot CR in a plan view. Each column TW is formed of a plurality of (for example, three) process units 10 stacked in the vertical direction. The substrate mounting portion 110 is located between two of the four towers TW located on the indexer robot IR side. In the example of fig. 2, only one tower TW is shown.

The central robot CR can transport the substrates W from the substrate placement unit 110 to the processing units 10 one by one, and can transport the substrates W from the processing units 10 to the substrate placement unit 110 one by one, for example. Further, for example, the center robot CR can transport the substrates W one by one between the plurality of processing units 10 as necessary. The indexer robot IR and the center robot CR are transfer units (transfer robots) that transfer the substrates W between the respective storage shelves C and the processing units 10.

In the example of fig. 1, the indexer robot IR has a hand H in a U shape in plan view. Here, the indexer robot IR has two hands H. The two hands H are disposed at different heights from each other. Each hand H can support the substrate W in a horizontal posture. The indexer robot IR can move the hand H in the horizontal direction and the vertical direction. As a moving mechanism for moving the indexer robot IR, for example, a ball screw mechanism can be used.

The indexer robot IR can change the orientation of the hand H by rotating (self-rotating) about an axis along the vertical direction. As the rotation mechanism for rotating the indexer robot IR, for example, a motor can be used.

The indexer robot IR moves along the alignment direction D on a path passing through the delivery position (the position where the indexer robot IR is drawn in fig. 1). The delivery position is a position at which the index robot IR and the substrate mounting unit 110 face each other in a direction orthogonal to the arrangement direction D in a plan view. The indexer robot IR can make the hand H face any of the storage racks C and the substrate mounting portion 110. Here, for example, the indexer robot IR can perform a loading operation for loading the substrate W into the storage rack C and a unloading operation for unloading the substrate W from the storage rack C by moving the hand H. For example, the indexer robot IR can perform a loading operation of loading the substrate W onto the substrate mount 110 and a loading operation of unloading the substrate W from the substrate mount 110 by moving the hand H at the delivery position.

In the example of fig. 1, the center robot CR has a hand H having a U-shape in plan view, as in the indexer robot IR. Here, the center robot CR has two hands H. The two hands H are arranged at mutually different heights. Each hand H can support the substrate W in a horizontal posture. The center robot CR can move each hand H in the horizontal direction and the vertical direction.

The center robot CR is rotatable (self-rotated) about an axis along the vertical direction, thereby being able to change the orientation of the hand H. As the rotation mechanism for rotating the center robot CR, for example, a motor may be used. The center robot CR is surrounded by the plurality of processing units 10 in a plan view. The central robot C R can make the hand H face any one of the processing unit 10 and the substrate mounting unit 110.

Here, for example, the center robot CR can perform a carry-in operation of carrying the substrate W into each processing unit 10 and a carry-out operation of carrying the substrate W out of each processing unit 10 by moving the hand H. For example, the center robot CR can perform a loading operation for loading the substrate W into the substrate mounting unit 110 and a unloading operation for unloading the substrate W from the substrate mounting unit 110 by moving the hand H.

The unprocessed substrate W is taken out of the storage rack C by the indexer robot IR and is transferred to the center robot CR via the substrate placement unit 110. The central robot CR carries the unprocessed substrate W into the processing unit 10. The processing unit 10 processes the substrate W. The processed substrate W is taken out from the processing unit 10 by the central robot CR, passes through another processing unit 10 as necessary, and is then transferred to the indexer robot IR via the substrate mount 110. The indexer robot IR carries the processed substrate W into the storage rack C. Thereby, the substrate W is processed.

As shown in fig. 2, each processing unit 10 includes, for example, a processing chamber 11, a substrate holding portion 12, a nozzle 13, and a cup 14. The processing chamber 11 is formed with a processing chamber, and houses the substrate holding portion 12, the nozzle 13, and the cup 14.

The substrate holding portion 12 holds the substrate W in a horizontal posture. Here, the horizontal posture is a posture in which the normal line of the substrate W is along the vertical direction. The substrate holding portion 12 rotates the substrate W about a rotation axis passing through a center portion of the substrate W and extending in the vertical direction. The substrate holding portion 12 is also referred to as a spin chuck. The substrate holding portion 12 may hold the end portion of the substrate W by a plurality of pins, or may hold the back surface of the substrate W by vacuum suction.

The nozzle 13 discharges the processing liquid toward the main surface of the substrate W held by the substrate holding portion 12. When the processing liquid lands on the main surface of the rotating substrate W, the processing liquid flows outward on the main surface of the substrate W by centrifugal force, and scatters outward from the peripheral edge of the substrate W. Thereby, the substrate W is processed. In addition, the nozzle 13 may discharge a plurality of kinds of treatment liquids. For example, the nozzle 13 is connected to a plurality of processing liquid supply sources via a plurality of pipes. Further, each pipe is provided with a valve. By controlling the opening and closing of the valves, a plurality of treatment liquids can be discharged from the nozzle 13. In addition, the processing unit 10 may be provided with a plurality of nozzles 13.

The cup 14 has a cylindrical shape surrounding the substrate holding portion 12, and receives the processing liquid scattered from the peripheral edge of the substrate W.

Here, each of the plurality of processing units 10 belonging to the substrate processing apparatus 100 is classified into one of a plurality of applications. As a specific example, each processing unit 10 is classified into one of the processing unit 10 for an initial step and the processing unit 10 for a middle step in a manufacturing process of a product such as a semiconductor device. The initial process is called a Front End Of Line (FEOL), and the Middle process is called a Middle Of Line (MEOL).

The processing unit 10 for FEOL and the processing unit 10 for MEOL are common in including the processing chamber 11, the substrate holding portion 12, the nozzle 13, and the cup 14, but more detailed structures may be different from each other. For example, the structure of the substrate holding portion 12 in the processing unit 10 for FEOL may be different from the structure of the substrate holding portion 12 in the processing unit 10 for M EOL. The FEOL processing unit 10 and the MEOL processing unit 10 may differ in the number and shape of the nozzles 13 and the type of the processing liquid that can be supplied to the substrate W.

The substrate W is carried into the FEOL processing unit 10, and the processing unit 10 performs the process for the FEOL on the substrate W. The treatment for FEOL includes standard cleaning treatment using a treatment liquid such as hydrofluoric acid (HF), ammonia hydrogen peroxide mixed liquid (SC-1), hydrogen peroxide hydrochloride mixed liquid (SC-2), and the like. The substrate W is carried into the MEOL processing unit 10, and the processing unit 10 performs the ME OL processing on the substrate W. The MEOL treatment includes a metal-containing substrate cleaning treatment using a treatment liquid such as dilute hydrofluoric acid (dHF) or SC-2, a polymer removal treatment, and the like.

As shown in fig. 1, the substrate processing apparatus 100 is provided with a user interface 94. The user interface 94 includes a display 95 and an input device 96. The display 95 is a display such as a liquid crystal display. The display 95 is controlled by the control unit 90 to display various information. The input device 96 is an input device such as a keyboard and a mouse. The input device 96 outputs information input by the user to the control section 90. The user can input various information to the substrate processing apparatus 100 using the input device 96. For example, the user can instruct the substrate processing apparatus 100 to start an operation using the input device 96.

The control unit 90 can control the operations of the respective units included in the substrate processing apparatus 100, for example. Fig. 3 is a block diagram schematically showing an example of the electrical configuration of the substrate processing apparatus 100. The controller 90 is electrically connected to the indexer robot IR, the center robot CR, and the plurality of processing units 10, and controls the operations thereof. The control unit 90 is also electrically connected to the user interface 94, and notifies the user of various information using the user interface 94 (specifically, the display 95), or receives various information input to the user interface 94 (specifically, the input device 96).

The hardware configuration of the control unit 90 is the same as that of a general computer. That is, the control unit 90 includes: a data processing unit 91 such as a CPU for performing various arithmetic processes; a Read Only Memory (ROM), which is a dedicated Memory for reading, and stores a basic program; a non-temporary storage medium 92 such as a magnetic disk, for storing control software, data, and the like; and a temporary storage medium 93 such as a Random Access Memory (RAM) which is a free-read/write Memory, and stores various information. The data processing unit 91 of the control unit 90 processes a predetermined processing program, and the control unit 90 controls the operation mechanisms of the substrate processing apparatus 100 to perform processing in the substrate processing apparatus 100. The control unit 90 may be realized by a dedicated hardware circuit that does not require software to realize the functions.

< simulation processing >

Each processing unit 10 may perform a simulation process in addition to the above-described process on the substrate W. The dummy process is a process using a dummy substrate DW different from the substrate W. The dummy substrate DW has the same shape (for example, a disk shape) as the substrate W, and has, for example, almost the same diameter as the substrate W. However, unlike the substrate W, the dummy substrate DW is not a substrate for manufacturing which is actually used to manufacture a product.

When the simulation process is performed, the simulation substrate DW is carried into the processing unit 10. Then, the processing unit 10 ejects a processing liquid (e.g., a cleaning liquid such as pure water) from the nozzle 13 to the main surface of the dummy substrate DW while rotating the dummy substrate DW by the substrate holding part 12 (dummy processing). Thereby, for example, the processing unit 10 is cleaned. By performing the dummy process while the dummy substrate DW is held by the substrate holding portion 12 in the processing unit 10, the inside of the processing unit 10 can be cleaned more than in a state where no substrate is held by the substrate holding portion 12. For example, in order to allow the cleaning liquid to reach a specific position in the processing unit 10, the dummy substrate DW can be held by the substrate holding portion 12 and the cleaning liquid can be supplied to the dummy substrate DW.

< Emulation substrate accommodator >

The dummy substrate DW may be accommodated in a portable accommodating rack C (see also fig. 1) held by the load port LP. In the example of fig. 1, since four load ports LP are provided, four receiving shelves C are held. A plurality of dummy substrates D W may be accommodated in one of the four accommodating shelves C. In this case, the indexer robot IR and the center robot CR transport the dummy substrates DW between the storage rack C and the processing units 10.

However, in this case, one load port LP is occupied by the dummy substrate DW. Thereby, the throughput of processing the substrate W may be reduced.

Therefore, in the example of fig. 2, the substrate processing apparatus 100 may be provided with a dummy substrate container BF for accommodating the dummy substrate DW, which is different from the load port LP. The dummy substrate holder BF is a fixed type holder, and is disposed in a space above the substrate mounting portion 110, for example. As a specific example, the dummy substrate container BF is provided at a position opposing the substrate mounting portion 110 in the vertical direction.

For example, the dummy substrate stocker BF stores a plurality of dummy substrates DW in a state of being arranged in a horizontal posture and in a vertical direction, similarly to the storage rack C. The dummy substrate holder BF has a box shape that opens on the center robot CR side in a plan view.

The central robot CR can lift the hand H and move the hand H to a height position horizontally opposed to the dummy substrate holder BF. The center robot CR can perform the loading operation of loading the substrate W into the dummy substrate container BF and the unloading operation of unloading the substrate W from the dummy substrate container BF by moving the hand H.

The central robot CR transports the dummy substrate DW between the dummy substrate stocker BF and each processing unit 10. Specifically, the central robot CR moves the hand H to a height position opposite to the dummy substrate holder BF. Then, the central robot CR moves the hand H, carries out the dummy substrate DW from the dummy substrate stocker BF, and carries the dummy substrate DW into the processing unit 10. The processing unit 10 performs a simulation process on the simulation substrate DW. When the simulation process is completed, the center robot CR carries out the simulation substrate DW from the processing unit 10. The central robot CR moves the hand H on which the dummy substrate DW is placed to a height position facing the dummy substrate container BF, and moves the hand H to the dummy substrate container BF to carry the dummy substrate DW in.

In this way, when the dummy substrate DW accommodated in the dummy substrate accommodator BF is used, the accommodating shelf C accommodating only the product substrate W can be placed on the load port LP. This can avoid a decrease in processing capacity of the process.

< kind of processing Unit >

As described above, the plurality of process units 10 belonging to the substrate processing apparatus 100 are classified into one of the process unit 10 for the F EOL and the process unit 10 for the MEOL, respectively. In a manufacturing process of a product such as a semiconductor device, since various thin films are sequentially formed on the main surface of the substrate W, the film structure of the main surface of the substrate W in FE OL and the film structure of the main surface of the substrate W in MEOL are different from each other. Therefore, the film structures of the main surfaces of the substrates W carried into the FEOL processing unit 10 and the MEOL processing unit 10 are different from each other.

Further, the kind of the processing liquid supplied to the substrate W by the FEOL processing unit 10 and the kind of the processing liquid supplied to the substrate W by the M EOL processing unit 10 may be different from each other.

As described above, the film structures of the main surfaces of the substrates W carried into the processing units 10 for different purposes are different from each other, and the types of the processing liquids supplied to the substrates W by the processing units 10 for different purposes are also different from each other, so that the types of contaminants (e.g., particles) generated in the processing units 10 for different purposes are also different from each other.

Here, a case where one dummy substrate DW is commonly used for the processing units 10 for different purposes is considered. When the dummy substrate DW is carried into the processing unit 10 for one purpose and the dummy process is performed, the dummy substrate DW is slightly contaminated by the dummy process. The contaminated dummy substrate DW is carried into the processing unit 10 for another use to perform a dummy process, and the contamination of the dummy substrate DW may be diffused into the processing unit 10 for another use. That is, contamination in the process unit 10 of one use may be diffused to the process unit 10 of another use via the dummy substrate DW. Sometimes contamination that occurs under different applications is difficult to remove by simulation processes and the diffusion of such contamination is not ideal.

Therefore, in the present embodiment, as described below, the dummy substrates DW that can be used for the respective process units 10 can be individually set.

In addition, the input device 96 may receive input for various settings related to the simulation process. For example, the input device 96 may receive an input for setting the dummy substrate DW that can be used for each processing unit 10. An example of the operation of the substrate processing apparatus 100 will be described below.

< action >

Fig. 4 is a flowchart showing an example of the operation of the substrate processing apparatus 100. First, the control unit 90 performs various settings related to the simulation process based on the user input (step S1: setting process). Fig. 5 is a flowchart showing a specific example of the setting step. First, the control unit 90 displays a first setting screen for setting on the display 95 (step S11). Fig. 6 is a diagram schematically showing an example of the first setting image. Information on various settings of the simulation process can be input to the input device 96 according to the display of the first setting image.

< correspondence information >

First, a method of providing a usable dummy substrate DW among a plurality of dummy substrates DW accommodated in a container (accommodating rack C or dummy substrate accommodator BF) for each of the process units 10 is described. As described in detail below, the user inputs information of the dummy substrate DW that can be used by each processing unit 10 using the input device 96. The input device 96 outputs input information to the control section 90. Based on the information from the input device 96, the control section 90 creates correspondence information indicating the + dummy substrate DW that can be used for each processing unit 10 as one of the setting information (step S12).

In the present embodiment, a description will be given of a process type as an example of a method for setting the dummy substrate DW that can be used. The processing category is a category for distinguishing the processing unit 10, and includes two categories of "FEOL" and "MEOL" as specific examples. In the present embodiment, as described below, the process type is set for each processing unit 10, and the process type is set for each dummy substrate DW. The processing unit 10 can use a dummy substrate DW belonging to the same processing type as the processing unit 10.

In the first setting image illustrated in fig. 6, a table is displayed, and "processing unit" and "processing type" are displayed as its items. In the item of "processing unit",

processing units

10A, 10B, ·, 10H are displayed in a vertical arrangement as all processing units 10 belonging to the substrate processing apparatus 100. In the item of "processing category", processing categories (here, "FEOL" or "MEOL") are displayed in a vertical array in one-to-one correspondence with the respective processing units 10.

In the first setting image illustrated in fig. 6, an input element M11 for inputting the processing type of each processing unit 10 is displayed. In the example of fig. 6, a plurality of input elements M11 are provided in one-to-one correspondence with the processing units 10A to 10H, and are, for example, combo boxes. When the user operates (for example, clicks) the input element M11 corresponding to each processing unit 10 using the input device 96, a list of selectable processing types (not shown) is displayed on the display 95. Here, "FEOL" and "MEOL" are displayed in the display 95. When the user selects one of the lists using the input device 96, the information is output from the input device 96 to the control section 90. Based on this information, the control unit 90 sets the processing type of the corresponding processing unit 10 as the selected processing type.

The user performs the above-described operation on all the processing units 10, and the control section 90 can set the processing type for all the processing units 10. Specifically, the control unit 90 generates unit setting information associating the processing unit 10 and the processing type.

In the example of fig. 6, "F EOL" is set in the processing type from the processing unit 10A to the processing unit 10F, and "MEOL" is set in the processing type from the processing unit 10G to the processing unit 10H.

An input element M12 is also displayed in the first setting image illustrated in fig. 6. The input element M12 is an input element for displaying a second setting image described later. The input element M12 is, for example, a key (also referred to as a soft key. When the user operates (e.g., clicks) the input element M12 of the first setting image using the input device 96, the control section 90 displays the first setting image and the second setting image on the display 95 in response to the end of the operation.

The second setting image is a screen for setting the process type of each dummy substrate DW. Fig. 7 is a diagram schematically showing an example of the configuration of the second setting image. A table is also displayed in the second setting image, and a "slot (slot)" and a "processing type" are displayed as items thereof. The "slot" indicates a space for accommodating each dummy substrate DW in each of the accommodating shelf C and the dummy substrate accommodator BF. Here, as an example, the accommodating shelf C and the dummy substrate accommodating unit BF can accommodate 25 dummy substrates DW. In the example of fig. 7, items in "slot" are displayed with "1" to "25" as numerals for identifying the slot. Since each dummy substrate DW is accommodated in each slot, the number for identifying the slot also serves as a number for identifying the dummy substrate DW.

In the item of the "processing type", corresponding to each slot, "FEO L" and "MEOL" are displayed in a horizontal arrangement. The set one of "FEOL" and "MEOL" is hatched with diagonal lines in the background. In the example of fig. 7, "MEOL" is set as the process type on the dummy substrate DW accommodated in the slot of "1" because "MEOL" is shaded in the process type corresponding to the slot indicated by "1".

In the item of the "process type", each region in which "MEOL" is displayed functions as an input element M13 for inputting "ME OL" as a process type of the corresponding dummy substrate DW, and each region in which "FEOL" is displayed functions as an input element M14 for inputting "FEOL" as a process type of the corresponding dummy substrate DW. The input elements M13 and M14 are, for example, buttons.

When the user operates (for example, clicks) one of the input elements M13 using the input device 96, the control unit 90 sets the process type of the dummy substrate DW corresponding to the one input element M13 to "MEOL" in response to the operation. When the user operates (for example, clicks) one of the input elements M14 using the input device 96, the control unit 90 sets the process type of the dummy substrate DW corresponding to the one input element M14 to "FEOL" in response to the operation.

In the example of fig. 7, "presence or absence" is displayed as an item in the table of the second setting image. The item "presence/absence" indicates whether or not the information of the dummy substrate DW is present in each slot. In the example of fig. 7, the presence of the dummy substrate DW is indicated by a black circle, and the absence of the dummy substrate D W is indicated by a blank column. In the example of fig. 7, the dummy substrate DW is not present in the slot "21", and the dummy substrate DWs are present in the other slots.

The information indicating the presence or absence of the dummy substrate DW in each slot may be input by a customer using the input device 96, or a mapping sensor for detecting the presence or absence of the dummy substrate DW in the housing rack C and a mapping sensor for detecting the presence or absence of the dummy substrate DW in the dummy substrate housing BF may be provided in the substrate processing apparatus 100, for example.

The user operates the input element M13 or the input element M14 on all slots in which the dummy substrate DW exists, and the control unit 90 can set the process type for all dummy substrates DW. Specifically, the control unit 90 generates dummy substrate setting information for associating the dummy substrate DW with the process type.

In the example of fig. 7, "MEOL" is set for the dummy substrates DW accommodated in the slots "1" to "13", and "FEOL" is set for the dummy substrates DW accommodated in the slots "14" to "20" and "22" to "25".

An input element M91 is also displayed in the second setting image. The input element M91 is an input element for returning to the first setting image, for example, a key. When the user operates (for example, clicks) the input element M91 using the input device 96, the control section 90 ends the display of the second setting image on the display 95 and redisplays the first setting image in response to the operation.

Referring to fig. 6, an input element M92 is also displayed in the first setting image. The input element M92 is an input element for specifying setting information, and is, for example, a key. When the user operates (e.g., clicks) the input element M92 using the input device 96, the control section 90 causes setting information (e.g., correspondence information) to be stored in the storage medium 92 in response to the operation. More specifically, the control unit 90 stores, in the storage medium 92, unit setting information indicating the correspondence between the process units 10 and the process types, and dummy substrate setting information indicating the correspondence between the slots and the process types (i.e., the correspondence between the dummy substrate DW and the process types). Thereby, correspondence information (cell setting information and dummy substrate setting information) is specified.

In the correspondence information, the dummy substrate DW used in the processing unit 10 can be set via the process type. More specifically, the dummy substrate DW belonging to the same process type as that of the processing unit 10 can be used in the processing unit 10. In the example of fig. 6, the processing category of the processing unit 10A is "FEOL". In the example of fig. 7, the process type of "FEOL" is set for the dummy substrates DW accommodated in the slots "14" to "20" and "22" to "25". Therefore, in the simulation process of the process unit 10A, the simulation substrate DW accommodated in the slots of "14" to "20" and "22" to "25" may be used. In this example, a plurality of dummy substrates DW are set as the dummy substrates DW that can be used in the processing unit 10A.

Referring to fig. 5, in the setting step, steps S13 to S16 for generating setting information different from the correspondence information may be performed, and details thereof will be described later.

Referring to fig. 4, after the setting step (step S1), control unit 90 determines whether or not the start condition of the simulation process is satisfied for each processing cell 10 (step S2). In the following, an example of the starting condition of the dummy process will be described, which is a lifetime (life) for which the introduction processing unit 10 can process the substrate W without performing the dummy process. When the life of each processing unit 10 is exhausted, the control unit 90 determines that the simulation processing needs to be performed on the processing unit 10. That is, the life-time-out start condition is determined to be satisfied.

As a specific index indicating the lifetime, for example, the number of lifetimes described below can be used. The number of lifetime wafers is the number of wafers W processed by the processing unit 10 after the previous simulation process. The lifetime decreases as the number of lifetime sheets increases. For example, the control unit 90 determines that the lifetime is exhausted when the number of lifetime sheets is equal to or greater than a predetermined number of lifetime set sheets.

As a specific example of the operation, the controller 90 counts the number of lifetime sheets of the processing unit 10 every time the central robot CR carries a substrate W into the processing unit 10. This enables the number of lifetime sheets to be measured for each processing unit 10. Then, the control unit 90 determines whether or not the number of processed substrates W, i.e., the number of lifetime wafers W after the last simulation process, is equal to or greater than a predetermined number of lifetime setting wafers for each processing unit 10. The control unit 90 determines that the start condition of the processing unit 10 is satisfied when the number of lifetime sheets is equal to or greater than the set number of lifetime sheets.

Alternatively, as an index indicating the lifetime, the lifetime described below may be used. The lifetime is a time during which the processing unit 10 does not continue processing the substrate W. That is, the lifetime is a time during which the processing unit 10 continues waiting without performing the processing of the substrate W. For example, the control unit 90 may determine that the lifetime is exhausted when the lifetime becomes equal to or longer than a predetermined lifetime setting time.

As a specific example of the operation, the control unit 90 measures, for each processing unit 10, the elapsed time from the start of the processing of the last substrate W as the lifetime. The measurement of the lifetime is performed by, for example, a timer circuit, and the timer circuit is initialized when the substrate W is loaded into the processing unit 10. The control unit 90 determines whether or not the lifetime time is equal to or longer than a predetermined lifetime setting time for each processing unit 10. When the lifetime time is equal to or longer than the lifetime setting time, it is determined that the start condition of the processing unit 10 is established.

When all the processing units 10 determine that the above start condition is not satisfied, the control unit 90 re-executes step S2.

When it is determined that the start condition is satisfied for a certain processing unit 10, the control section 90 specifies the dummy substrate DW usable for the processing unit 10 whose start condition is satisfied, based on the setting information (i.e., the correspondence information) stored in the storage medium 92 (step S3: dummy substrate specifying step).

FIG. 8 is a flowchart showing a specific example of the dummy substrate specifying step. The control unit 90 specifies the dummy substrate DW belonging to the same process type as the process cell 10 in which the start condition is satisfied, based on the correspondence information (step S31). For example, when the start condition of the processing unit 10A is satisfied, the control unit 90 specifies one of the dummy substrates DW belonging to the same processing category as the processing category of the processing unit 10A (the "FEOL" in fig. 6) as the dummy substrate D W usable in the processing unit 10A. In the example of fig. 7, the processing categories of the slots "14" to "20" and "22" to "25" are set to "FEOL" which is the same as the processing category of the processing unit 10A. That is, the dummy substrates DW accommodated in the slots of "14" to "20" and "22" to "25" can be used.

Therefore, the control section 90 can specify the dummy substrate DW accommodated in any one of the slots "14" to "20" and "22" to "25" as the dummy substrate DW used for the simulation process of the process unit 10A. For example, the control unit 90 specifies the dummy substrate DW that is used the least number of times among the dummy substrates DW (step S32). For example, each time the dummy substrate DW is carried into the processing unit 10, the number of times of use corresponding to the dummy substrate DW is counted to measure the number of times of use of the dummy substrate DW. The dummy substrate DW with the smallest number of uses is specified, and variations in the number of uses of each dummy substrate DW can be suppressed. That is, the plurality of dummy substrates DW can be more uniformly used. Thus, the replacement timing of each dummy substrate DW can be aligned.

Referring back to fig. 4, the substrate processing apparatus 100 performs the simulation process in the processing cell 10 in which the start condition is satisfied (step S4: simulation process step). Here, as an example, the dummy substrate DW accommodated in the dummy substrate accommodation BF is used. The central robot CR carries out a specific dummy substrate DW from the dummy substrate stocker BF in the dummy substrate specifying step, and carries the dummy substrate DW into the processing unit 10 in which the start condition is satisfied. The substrate holding unit 12 of the processing unit 10 holds the dummy substrate DW and rotates the dummy substrate DW. Then, the processing unit 10 discharges the processing liquid from the nozzle 13 toward the dummy substrate DW. Thereby, the simulation process is performed. By the simulation process, for example, the inside of the process unit 10 can be cleaned.

As described above, in the present embodiment, the dummy substrate DW usable by the processing unit 10 is carried in, and the processing unit 10 performs the dummy process using the dummy substrate DW usable by the processing unit 10. As a more specific example, the dummy substrate DW belonging to the same process type as that of the process unit 10 is carried into the process unit 10 as the usable dummy substrate DW. In other words, the same dummy substrate DW is not carried in to the processing units 10 belonging to different processing types. Therefore, the spread of contamination via the dummy substrate DW between the process units 10 belonging to different process categories can be avoided.

In the above example, the correspondence relationship between the processing unit 10 and the simulation board DW is indirectly set using the processing type. This makes it easy to set the correlation between the processing unit 10 and the dummy substrate DW.

For comparison, a case where a plurality of dummy substrates D W that can be used are directly set for each processing unit 10 is considered. In this case, in the above example, the user sequentially inputs slots "14" to "20" and "21" to "25" (11 slots) to the processing unit 10A, and thus 11 inputs are required to the processing unit 10A. The user sequentially inputs the same slot for each of the processing units 10B to 10F. Therefore, 66 (6 × 11) inputs are required in total for the processing units 10A to 10F. Further, the user sequentially inputs slots "1" to "13" (13 slots) for each of the processing units 10G to 10H. Thus, 78 (6 × 13) inputs are required in total for the processing units 10G to 10H.

In contrast, if the correspondence relationship between the process units 10 and the dummy substrate DW is indirectly set using the process types, only one process type may be set for each of the process units 10 and the dummy substrate DW. Accordingly, the number of inputs of the sum (for example, 36) of the number (for example, 12) of the processing units 10 and the number (for example, 24) of the dummy substrates DW existing in the stocker may be input. Therefore, the input operation can be simplified. This can reduce work errors. In addition, since the correspondence relationship is easily understood, it is also easy to input and check.

< other setting information >

Other setting information related to the simulation process will be described below.

< accommodator setting of simulation substrate >

In the example of fig. 2, the dummy substrate holder BF is provided in the substrate processing apparatus 100. Thus, the dummy substrate DW in the dummy substrate holder BF can be used for the dummy process. On the other hand, when the receiving rack C receiving the dummy substrate DW is carried into the load port LP, the dummy substrate DW in the receiving rack C may be used for the dummy process.

Therefore, the control unit 90 may set a container for accommodating the dummy substrate DW used in the dummy processing based on the input of the user (step S13: FIG. 5). In other words, the input device 96 may also receive input specifying a receptacle used in the simulation process. More specifically, the input device 96 may receive an input specifying whether to use the plurality of dummy substrates DW accommodated in any one of the movable type accommodating rack C and the fixed type dummy substrate accommodator BF placed on the load port LP.

In the example of fig. 6, the input element M2 is displayed in the first setting image. The input element M2 is an input element for inputting a container for simulation processing. In the example of fig. 6, the input elements M2 include input elements M21 through M25. The input elements M21 to M24 respectively display "LP 1", "LP 2", "LP 3", and "LP 4", which respectively represent the load ports LP. The input element M25 shows "BF", indicating the dummy substrate holder BF.

When the user operates (for example, clicks) any one of the input elements M21 through M25 using the input device 96, the control unit 90 sets the container used in the simulation process as one input element of the operation in response to the operation. Specifically, the control unit 90 generates container information indicating a container used in the simulation process.

In the example of fig. 6, the input element M25 is shaded. This means that the dummy substrate container B F is set as a container used for the simulation process.

In determining the setting of the accommodator, the user uses the input device 96, for example, to operate the input element M92. In response to the operation of the input element M92, the control unit 90 stores container information indicating a container used in the simulation process in the storage medium 92 as one of the setting information.

As described above, the user can input the accommodator used in the simulation process.

The controller 90 controls the indexer robot IR and the center robot CR based on the container information stored in the storage medium 92 when performing the simulation processing. When the pod indicated by the pod information is the load port LP, the controller 90 causes the indexer robot IR to carry the dummy substrate DW out of the pod rack C held in the load port LP indicated by the pod information and to carry the dummy substrate DW into the processing unit 10 via the center robot CR. When the simulation process is completed in the processing unit 10, the center robot CR and the indexer robot IR cooperate to return the simulated substrate DW to the original position in the original storage rack C.

When the pod indicated by the pod information is the dummy substrate pod BF, the control section 90 causes the central robot CR to carry out the dummy substrate DW from the dummy substrate pod BF and carry the dummy substrate DW into the processing unit 10. When the simulation process is completed in the processing unit 10, the center robot CR returns the simulation substrate DW to the original position in the simulation substrate stocker BF.

As described above, the housing of the dummy substrate DW used in the dummy process can be set. This can improve the usability of the substrate processing apparatus 100.

< starting Condition of simulation processing >

In the above example, the control unit 90 determines whether or not the life time is equal to or longer than the life setting time for each processing unit 10, and determines that the start condition of the simulation process of the processing unit 10 is satisfied when the life time is equal to or longer than the life setting time. Hereinafter, this start condition is referred to as a first start condition.

In the above example, the control unit 90 determines whether or not the number of lifetime sheets is equal to or greater than the number of lifetime-set sheets for each processing unit 10, and determines that the start condition of the simulation process of the processing unit 10 is satisfied when the number of lifetime sheets is equal to or greater than the number of lifetime-set sheets. Hereinafter, this start condition is referred to as a second start condition.

The control unit 90 may set the starting conditions of the simulation process based on the user input (step S14: fig. 5). In other words, the input device 96 may also receive an input for specifying a start condition of the simulation process. More specifically, the input device 96 may receive an input for designating at least one of the first start condition and the second start condition as a start condition.

When the user inputs at least one of the first start condition and the second start condition using the input device 96, the control unit 90 sets the input start condition as the start condition of the simulation process in each processing unit 10.

Here, as an example, the first start condition is set by setting the lifetime setting time used in the first start condition to a value greater than 0, and the second start condition is set by setting the lifetime setting number used in the second start condition to a value greater than 0. A specific example will be described below.

In the example of fig. 6, "life setting time" and "number of life setting sheets" are displayed as items in the table of the first setting image. In the example of fig. 6, in the item of "lifetime setting time", the lifetime setting time TA to the lifetime setting time TH are displayed in a vertical array in one-to-one correspondence with the processing units 10A to 10H. In the example of fig. 6, in the item of "number of lifetime set sheets", the number of lifetime set sheets NA to the number of lifetime set sheets NH are displayed in a vertical array in one-to-one correspondence with the processing units 10A to 10H.

The lifetime setting time being greater than 0 means that the first start condition is adopted as the start condition of the processing unit 10. That is, the user can set the first start condition for the corresponding processing unit 10 by setting the lifetime setting time to a value greater than 0 using the input device 96.

Similarly, the number of lifetime setting sheets being greater than 0 means that the second start condition is adopted as the start condition of the processing unit 10. That is, the user can set the second start condition for the corresponding processing unit 10 by setting the number of lifetime setting sheets to a value greater than 0 using the input device 96.

In fig. 6, a region from each of the lifetime setting time TA to the lifetime setting time TH is displayed, and functions as an input element M31 for inputting the lifetime setting time. When the user operates (for example, clicks on) one input element M31 using the input device 96, the lifetime setting time corresponding to the one input element M31 can be input. When the user inputs the life setting time using the input device 96 in this state, the control unit 90 sets the input time to the life setting time of the processing unit 10 corresponding to the one input element M31.

When the user inputs the lifetime setting time to all the processing units 10, the control unit 90 can set the lifetime setting time for all the processing units 10.

Further, a region from each of the lifetime set number NA to the lifetime set number NH is displayed, and functions as an input element M32 for inputting the lifetime set number. When the user operates (for example, clicks on) one input element M32 using the input device 96, the lifetime setting time corresponding to the one input element M32 can be input. When the user inputs the lifetime-set number of sheets using the input device 96 in this state, the control unit 90 sets the input number of sheets as the lifetime-set number of sheets of the processing unit 10 corresponding to the one input element M32.

When the user inputs the number of lifetime setting sheets to all the processing units 10, the control unit 90 can set the number of lifetime setting sheets for all the processing units 10.

When the setting of the lifetime setting time and the number of lifetime setting sheets is determined, the user operates, for example, the input element M92 using the input device 96. In response to the operation of the input element M92, the control unit 90 stores life information indicating the set life time and the set number of lives corresponding to the processing unit 10 in the storage medium 92 as one of the setting information.

As described above, the lifetime setting time and the number of lifetime-set sheets can be set for each processing unit 10.

When determining whether or not the simulation start condition is satisfied (step S2: fig. 4), the control unit 90 first reads the lifetime information from the storage medium 92. Based on the life information, the control unit 90 determines whether or not the start condition of the simulation process is satisfied for each processing unit 10. For example, when life setting time TA of processing unit 10A is greater than 0, control unit 90 measures life time TA of processing unit 10A and determines whether or not life time TA is equal to or greater than life setting time TA of processing unit 10A. Then, when the lifetime time tA is equal to or longer than the lifetime setting time tA, the control unit 90 determines that the condition for starting the emulation processing by the processing unit 10A is satisfied. The same determination is made for the processing unit 10B to the processing unit 10H.

When the number of lifetime setting sheets NA of the processing unit 10A is greater than 0, the control unit 90 measures the number of lifetime sheets NA of the processing unit 10A and determines whether or not the number of lifetime sheets NA is equal to or greater than the number of lifetime setting sheets NA of the processing unit 10A. Then, the control unit 90 determines that the condition for starting the simulation process in the processing unit 10A is satisfied even when the number of lifetime NAs is equal to or greater than the number of lifetime setting NAs. The same determination is made for the processing unit 10B to the processing unit 10H.

As described above, since the first start condition and the second start condition can be set as the start conditions, the usability of the substrate processing apparatus 100 can be improved. In the above example, since the lifetime setting time and the number of lifetime-set sheets can be set for each processing unit 10, the lifetime setting time and the number of lifetime-set sheets can be set appropriately for the processing unit 10.

In the above example, the first start condition is set by setting the lifetime setting time to a value greater than 0, and the second start condition is set by setting the number of lifetime setting sheets to a value greater than 0, but a dedicated input element for setting the start condition may be displayed in the first setting image. For example, an input element for inputting the first start condition and an input element for inputting the second start condition may be displayed as the start conditions in the first setting image.

< display of Life time and Life number of sheets >

In the example of fig. 6, "life time" and "number of life sheets" are displayed as items in the table of the first setting image. In the "lifetime" item, the lifetime at the current time and the lifetime setting time are displayed for each processing unit 10. For example, the lifetime time tA and the lifetime setting time tA are displayed side by "/" corresponding to the processing unit 10A. The same applies to the processing unit 10B to the processing unit 10H.

In the display 95, the life time and the life setting time at the current time are displayed for each processing unit 10, so that the user can predict the time at which the simulation process is executed for each processing unit 10.

In the item of "number of life spans", the number of life spans and the number of life spans to be set at the current time are displayed for each processing unit 10. For example, the number of lifetime NAs and the number of lifetime setting NAs are displayed side by "/" corresponding to the processing unit 10A. The same applies to the processing unit 10B to the processing unit 10H.

Since the number of lifetime setting sheets and the number of lifetime sheets at the current time are displayed on the display 95, the user can predict the time at which the simulation process is executed for each processing unit 10.

< simulation flow procedure >

The contents of the simulation process (hereinafter, referred to as a simulation process procedure) may be different for each processing unit 10. For example, the simulation processing procedure of the processing unit 10 for FEOL may be different from the simulation processing procedure of the processing unit 10 for MEOL. The simulation processing procedure is information for specifying a procedure in the simulation processing, and includes information for specifying various conditions of the simulation processing such as the type of the processing liquid discharged from the nozzle 13, the discharge time of the processing liquid, and the rotation speed of the substrate W.

If the simulation procedure is set for each processing unit 10, an appropriate simulation procedure can be set for each processing unit.

In the above example, the indexer robot IR includes a plurality of (e.g., two) hands H, and the center robot CR also includes a plurality of (e.g., two) hands H. Any hand H may be used for transporting the dummy substrate DW, but the hand H used for transporting the dummy substrate DW may be different depending on the type of process.

Specifically, when the center robot CR uses one hand H for transporting the dummy substrate DW for FEOL, the other hand H may be used for transporting the dummy substrate DW for MEOL. Fig. 9 is a diagram showing an example of the correspondence relationship between the hand H and the process type. In the example of fig. 9, the upper hand H1 (see fig. 2) is used as one hand H for transporting the dummy substrate DW for FEOL, and the lower hand H2 (see fig. 2) is used as the other hand H for transporting the dummy substrate DW for MEOL.

Accordingly, even if the contamination generated in the dummy substrate DW spreads to the hand H due to the contact with the dummy substrate DW, the contamination of the hand H does not spread to the dummy substrates DW of different processing types. This is because the hand H is not used for transporting the dummy substrates DW of different processing types. In other words, the spread of contamination via the hand H between the process units 10 of different process types can be avoided.

When the dummy substrate DW in the storage rack C is used, the indexer robot IR may use different hands H for transporting the dummy substrate DW according to the process type (see also fig. 9).

Hereinafter, the simulation flow protocol is introduced as a protocol including a simulation processing protocol and a substrate transfer condition. The substrate transfer conditions include information on which hand H is used for transferring the dummy substrate DW.

The control unit 90 may set a simulation flow procedure based on the user input (step S15: fig. 5). That is, the input device 96 may receive input of simulation flow specifications (simulation process specifications and substrate transfer conditions).

In the example of fig. 6, the table of the first setting image shows "simulation flow procedures" as its items. The simulation flow protocol is a protocol for specifying a series of operation steps in the substrate processing apparatus 100 when performing the simulation process, and includes a simulation process protocol and substrate transfer conditions. In the example of fig. 6, in the item of "simulation flow procedure", the simulation flow procedures FRA to FRH are displayed in a vertical arrangement in one-to-one correspondence with the processing units 10A to 10H.

The region displaying the respective simulation flow procedures FRA to FRH functions as an input element M4 for inputting the simulation flow procedures. If the user operates (e.g., clicks on) one of the input elements M4 using the input device 96, the simulation flow protocol corresponding to the one input element M4 can be input. When the user inputs the simulation flow procedure using the input device 96 in this state, the control unit 90 sets the input simulation flow procedure as the simulation flow procedure of the processing unit 10 corresponding to the one input element M4.

The simulation process recipe included in the simulation flow recipe may be a process recipe for specifying a process procedure for the substrate W, or may be a process recipe dedicated to the simulation process.

The user inputs a simulation flow specification for each processing unit 10 using the input device 96, and sets a hand H used for transporting the simulation substrate DW according to the process type. In other words, the user inputs the simulation flow specification for each processing unit 10 so that the hand H used for the transfer of the simulation substrate DW to the processing unit 10 for FEOL and the hand H used for the transfer of the simulation substrate DW to the processing unit 10 for MEOL are different from each other.

In determining the settings of the simulation flow protocol, the user operates the input elements M92, for example, using the input device 96. In response to the operation of the input element M92, the control unit 90 stores flow procedure information indicating a simulation flow procedure corresponding to the processing unit 10 in the storage medium 92 as one of the setting information.

As described above, the simulation flow procedure can be set for each processing unit 10.

When the start condition of the simulation process is satisfied, the control unit 90 reads the flow specification information from the storage medium 92, and controls the substrate processing apparatus 100 based on the simulation flow specification of the processing unit 10 in which the start condition of the simulation process is satisfied. In this way, the dummy substrate DW is transported by the hand H defined in the substrate transport condition, and the process unit 10 performs the dummy process defined in the dummy process recipe. For example, when the start condition of the processing unit 10A is satisfied, the dummy substrate DW for the FEOL is carried out of the housing by the hand H for the FEOL, and the dummy substrate DW is carried into the processing unit 10A, and the processing unit 10A performs the dummy processing in accordance with the dummy processing procedure for the FE OL. When the simulation process is completed, the simulated substrate DW is returned to the original position of the original pod by the hand H for FEOL.

This makes it possible to perform a simulation process suitable for the processing unit 10A for FEOL. Further, since the dummy substrate DW for FEOL is carried by the hand H for F EOL, it is possible to avoid the spread of contamination via the hand H between the process units 10 belonging to different process types.

< number of simulation processed pieces >

The maximum value of the number of processing contents (steps) that can be specified in the simulation flow protocol may be determined in advance. In this case, the number of steps exceeding the maximum value cannot be specified in the simulation flow protocol. Here, in order to perform the simulation process with the number of steps exceeding the maximum value, the substrate processing apparatus 100 may continuously execute a series of operations according to the simulation flow protocol a plurality of times.

Fig. 10 is a timing chart showing an example of the simulation process. In the example of fig. 10, a timing chart of a simulation process in the processing unit 10A is shown. The block indicated by "→ 10A" indicates a period during which the dummy substrate DW is conveyed from the container to the processing unit 10A, "DP" indicates a period during which the dummy process is performed in the processing unit 10A, and "10A →" indicates a period during which the dummy substrate DW is conveyed from the processing unit 10A to the container. The three consecutive periods represent periods during which the operation OP is performed according to the simulation flow procedure of the processing unit 10A. In the example of fig. 10, the operation OP is performed 2 times in succession in the simulation process of the processing unit 10A. That is, the simulation process using 2 simulation substrates DW is continuously performed.

In this way, by performing the simulation process a plurality of times in succession, the simulation process can be performed with the number of steps totaling more than the maximum value. For example, when 200 steps are defined in the simulation flow procedure, 600 steps can be executed by executing the simulation flow procedure 3 times. This enables the necessary emulation processing to be performed. More specifically, for example, the total discharge time for discharging the processing liquid can be extended, and the cleaning process in the processing unit 10A can be appropriately completed.

As described above, the substrate processing apparatus 100 can perform a series of operations OP including the transfer of the dummy substrate DW to the process unit 10, the dummy process in the process unit 10, and the transfer of the dummy substrate DW to the stocker a plurality of times.

Therefore, the control unit 90 can set the number of consecutive times of the operation OP (i.e., the number of processed pseudo substrates DW used in the emulation processing) based on the user' S input (step S16: FIG. 5). That is, the input device 96 may receive an input of the processed number of the dummy substrates DW used in the dummy processing (hereinafter referred to as the processed number set value).

In the example of fig. 6, "processing sheet number setting value" is displayed as an item in the table of the first setting image. In the example of fig. 6, in the item of the "processed number of sheets setting value", the processed number of sheets setting value MA to the processed number of sheets setting value MH are displayed in a vertical array in one-to-one correspondence with the processing unit 10A to the processing unit 10H.

Each processed sheet number setting value MA functions as an input element M5 for setting a processed sheet number setting value in an area indicated by the processed sheet number setting value MH. When the user operates (for example, clicks on) one input element M5 using the input device 96, the set value of the number of processed sheets corresponding to the one input element M5 can be input. When the user inputs the processed number-of-sheets setting value using the input device 96 in this state, the control portion 90 sets the input number of sheets to the processed number-of-sheets setting value of the processing unit 10 corresponding to the one input element M5.

When determining the setting of the processed sheet number setting value, the user operates the input element M92 using the input device 96, for example. In response to the operation of the input element M92, the control unit 90 stores the simulated processed sheet count information indicating the set value of the processed sheet count corresponding to the processing unit 10 in the storage medium 92 as one of the setting information.

As described above, the processed sheet number setting value can be set for each processing unit 10.

When the conditions for starting the simulation process are satisfied, the control unit 90 reads the flow specification information and the simulation process sheet count information from the storage medium 92. Then, the control unit 90 repeats the operation OP of executing the set number of times of processing in the substrate processing apparatus 100 based on the simulation flow protocol of the processing unit 10 in which the start condition of the simulation processing is satisfied. For example, when the start condition of the processing unit 10A is satisfied, the substrate processing apparatus 100 repeats the simulation flow routine corresponding to the processing unit 10A only by executing the set value MA for the number of processed sheets corresponding to the processing unit 10A the number of times.

The substrate processing apparatus 100 may repeatedly use the same dummy substrate DW only the set number of processed sheets in the dummy processing step, or may use different dummy substrates DW in the dummy processing step. For example, a case where the set value MA of the number of processed sheets corresponding to the processing unit 10A is 3 sheets will be described. In the simulation process, one simulation substrate DW for FEOL may be repeatedly used to perform the simulation process 3 times. Alternatively, for example, the simulation process may be continuously performed by sequentially using three different simulation substrates DW, which are used a small number of times. In the case of using different dummy substrates DW, a plurality of dummy substrates DW can be more uniformly used.

As described above, the number of consecutive times of the operation OP (the number of processed dummy substrates DW) is set for each processing unit 10, and therefore, the dummy processing can be performed with the number of steps suitable for the processing unit 10.

< display of number of simulation processed sheets >

In the example of fig. 6, "the number of processed simulation sheets" is displayed as an item in the table of the first setting image. The number of dummy processes indicates the number of times the dummy process is completed (i.e., the number of dummy substrates DW processed in the dummy process) during the execution of the dummy process. In the "number of processed sheets simulation" item, the number of processed sheets simulation at the present time and the set value of the number of processed sheets are displayed for each processing unit 10. For example, the simulation processed number mA and the processed number setting value mA are displayed side by "/" corresponding to the processing unit 10A. The processing unit 10B to the processing unit 10H are also the same.

Since the number of processed sheets and the set value of the number of processed sheets at the current time are displayed on the display 95, the user can predict the time at which the processing unit 10 completes the simulation processing process.

< execution time of simulation Process >

The substrate processing apparatus 100 may continuously perform substrate processing on a plurality of substrates W in a processing task, with the plurality of substrates W being set to 1 unit (hereinafter, referred to as a processing task). The number of substrates W in the processing task is, for example, equal to or less than the number of substrates that can be accommodated in the accommodating rack C, and is determined in advance. Here, the number of substrates W in the processing job is 25, for example.

When a substrate processing of a processing task is performed by the substrate processing apparatus 100, first, the control unit 90 performs scheduling described below. That is, the control unit 90 performs scheduling for determining at what timing each component in the substrate processing apparatus 100 is to be operated in order to sequentially process a plurality of substrates W in a processing task. The control unit 90 controls the substrate processing apparatus 100 based on the result of the scheduling, and the substrate processing apparatus 100 sequentially processes the plurality of substrates W in the processing task.

In this way, when the starting condition of the dummy process is satisfied while the substrate processing apparatus 100 sequentially processes the substrates W in the processing tasks, the substrate processing apparatus 100 may not execute the dummy process until the process of the processing task is completed. That is, the substrate processing apparatus 100 may execute the simulation process during a period between the process execution period of the process task and the process execution period of the next process task. When the simulation process is completed, the substrate processing apparatus 100 processes the substrate W of the next process task.

Fig. 11 is a timing chart showing an example of substrate processing. In the example of fig. 11, for the sake of simplicity, processing units 10A to 10E are shown. The processing units 10A to 10E can process the 1 processing task PJ by sequentially processing 5 substrates W. In the example of fig. 11, a block denoted by "W" schematically represents the processing task PJ while the processing units 10A to 10E sequentially perform substrate processing. In the example of fig. 11, for the sake of simplicity, only the timing chart in the case where the start condition of the simulation process DP in the processing unit 10A is satisfied is shown.

In the example of fig. 11, the start condition of the simulation process DP of the processing unit 10A is satisfied in the execution of the process to the process task PJ 1. However, in the example of fig. 11, the simulation process DP is not performed quickly in response to the establishment of the start condition. As shown in fig. 11, the simulation process D P is not executed until the processing for the processing task PJ1 in the processing unit 10A ends. The simulation process DP is executed between the end time of the process performed by the process unit 10A on the last substrate W in the process job PJ1 and the start time of the process performed by the process unit 10A on the first substrate W in the next process job PJ 2.

Accordingly, it is not necessary to change the procedure of the substrate processing performed on the substrate W in the processing task PJ1, and therefore, it is not necessary to perform scheduling again, and the processing load of the control unit 90 can be reduced.

On the other hand, the substrate processing apparatus 100 may execute the simulation process during execution of the process to the process task PJ. Fig. 12 is a timing chart showing an example of substrate processing. In the example of fig. 12, the start condition of the simulation process DP of the processing unit 10A is satisfied during the execution period of the process to the processing task PJ.

In response to the establishment of the start condition, the control unit 90 reschedules the remaining substrates W of the processing job PJ as objects. That is, the control unit 90 performs scheduling again to perform the simulation process in the processing unit 10A. The control unit 90 operates the substrate processing apparatus 100 based on the result of rescheduling, so that the processing unit 10A performs the simulation process DP during the operation of processing the processing task PJ, and after the simulation process DP is completed, the substrates W are carried into the processing unit 10A again in sequence, and the substrates W are processed again

Accordingly, the simulation process D P can be performed more quickly in response to the establishment of the start condition of the simulation process, without waiting for the completion of the process for the process task PJ.

Therefore, the control unit 90 can set, based on the user input, whether to execute the emulation processing between the processing tasks PJ (fig. 11) or to execute the emulation processing between the substrates W in the processing tasks PJ (fig. 12) (step S17: see fig. 5). In other words, the input device 96 is capable of receiving an input of the execution time (timing) of the simulation process.

In the example of fig. 6, an input element M6 for instructing the execution time of the simulation process is displayed in the first setting image. In the example of fig. 6, the input elements M6 include an input element M61 for inputting between the process tasks P J and an input element M62 for inputting between the substrates W within the process task PJ as the execution time of the simulation process.

When the user operates (e.g., clicks) an input element using the input device 96, the control unit 90 sets the execution time of the simulation process between the processing tasks PJ in response to the operation. When the user operates (e.g., clicks) the input element M62 using the input device 96, the control unit 90 sets the time between the substrates W to be the execution time of the simulation process in response to the operation.

When determining the setting of the execution timing of the simulation process, the user operates the input element M92, for example, using the input device 96. In response to the operation of the input element M92, the control unit 90 stores, as one of the setting information, execution time information indicating the execution time of the simulation process in the storage medium 92.

As described above, the execution time of the simulation process can be set.

When the conditions for starting the simulation process are satisfied, the control unit 90 reads the execution time information from the storage medium 92, and causes the corresponding processing unit 10 to perform the simulation process at the execution time based on the execution time information.

This can improve the usability of the substrate processing apparatus 100.

< start and end of automatic simulation processing >

In the above example, the control unit 90 determines whether or not the start condition of the simulation process is satisfied, and automatically performs the simulation process based on the determination result. This operation is hereinafter referred to as an automatic simulation process.

Input device 96 may receive input for the start and end of the automated simulation process. In the example of fig. 6, an input element M71 and an input element M72 are displayed in the first setting image. The input element M71 is an input element for instructing the start of the automatic simulation process, and is, for example, a button. The input element M72 is an input element for instructing the end of the automatic simulation process, and is, for example, a button.

When the user operates (e.g., clicks) the input element M71 using the input device 96, the control section 90 starts the automatic simulation process in response to the operation. In this way, the simulation process is automatically performed in the processing unit 10 in which the start condition of the simulation process is satisfied.

When the user operates (e.g., clicks) the input element M72 using the input device 96, the control section 90 ends the automatic simulation process in response to the operation.

< inspection processing >

The control unit 90 may perform an inspection process for determining whether or not the various setting information generated in the setting step (step S1) is appropriate. For example, the control unit 90 performs the inspection process in response to the operation of the input element M92 by the user. Alternatively, the control unit 90 may perform the checking process in response to the operation of the input element M71 by the user.

Fig. 13 is a flowchart showing an example of the inspection process. First, the control section 90 determines whether the input element M92 or the input element M71 is operated (step S51). When it is determined that the input element M92 and the input element M71 are not operated, the control section 90 re-executes step S51.

When the input element M92 or the input element M71 is operated, the control unit 90 performs a check judgment to check whether the setting information is appropriate (step S52), and determines whether the check result is appropriate (step S53).

< correspondence information >

For example, the control unit 90 checks whether or not correspondence information indicating the correspondence between the processing unit 10 and the dummy substrate DW is appropriate as setting information. More specifically, the control unit 90 determines whether or not all types of processing types (here, "FEOL" and "MEO L" 2 types) set for the plurality of processing units 10 are set for the plurality of dummy substrates DW. The control unit 90 determines that the correspondence information is appropriate when all types of processing types are set in the plurality of dummy substrates DW.

On the other hand, when at least one process type is not provided on any of the plurality of dummy substrates D W, the control unit 90 determines that the correspondence information is not appropriate. For example, when only one of "FEOL" and "MEOL" is set for all the dummy substrates DW, the control section 90 determines that the correspondence information is not appropriate.

< simulation flow procedure >

The control unit 90 may check whether or not flow procedure information indicating a simulation flow procedure is appropriate as setting information, for example. For example, in the substrate transfer conditions in the simulation flow specification indicated by the flow specification information, it is specified that information of a certain hand H is used for transferring the simulation substrate DW. The control unit 90 determines whether or not the hand H used for transporting the dummy substrate DW is classified by the process type. That is, it is determined whether or not one hand H is set for the FEOL processing unit 10 and the other hand H is set for the MEOL processing unit 10.

When a hand H of a processing type different from the processing type of the processing unit 10 is specified in the flow protocol of the processing type, the control unit 90 determines that the flow protocol information is not appropriate. Specifically, when the other hand H for MEOL is specified in any flow protocol information of the processing unit 10 for F EOL, the control section 90 determines that the flow protocol information is not appropriate.

< Others >

The control unit 90 may determine whether or not other setting information is appropriate. For example, when setting information for each setting information is not input, it may be determined that the setting information is not appropriate.

< examination result >

When the above-described inspection result is appropriate, the control unit 90 stores the setting information in the storage medium 92 (step S54). Thereby, the setting information is determined.

On the other hand, when the inspection result is not appropriate, the control unit 90 displays the inspection result on the display 95 of the user interface 94 (step S55). That is, when the inspection result is inappropriate, the setting information is not determined, and the user interface 94 notifies the user of the inspection result and prompts for re-input. If the user recognizes the check result, input for resetting the setting information is performed using the input device 96.

This enables appropriate setting information to be stored in the storage medium 92. In other words, erroneous setting can be suppressed.

< class of processing >

In the above example, "FEOL" and "MEOL" are adopted as the processing categories of the simulation substrate DW. Here, further, "FREE" is also adopted as a processing category of the simulation substrate DW. "FREE" is a type indicating that the dummy substrate DW can be used in any of the processing units 10. That is, "F REE" indicates a type of the dummy substrate DW that can be used for both the processing unit 10 for FEOL and the processing unit 10 for MEOL.

Fig. 14 is a diagram showing an example of a second setting image for setting the process type of the dummy substrate DW. In the example of fig. 14, "FEOL", "MEOL", and "FREE" are displayed in the item of "processing type" so as to be aligned horizontally corresponding to each slot. Each region in which "FREE" is displayed functions as an input element M15 for setting "FREE" as an input processing type. The input element M15 is, for example, a key. When the user operates (for example, clicks) one of the input elements M15 using the input device 96, the control unit 90 sets the process type of the dummy substrate DW corresponding to the one input element M15 to "FREE" in response to the operation.

This can improve the usability of the substrate processing apparatus 100.

< initialization of correspondence information >

When the dummy substrate DW is repeatedly used, contaminants gradually accumulate on the dummy substrate DW, and thus the dummy substrate DW may be replaced.

Here, as an example, a case where the simulation process is performed using the simulation substrate DW in the housing rack C held in the load port LP will be described. For example, when the dummy substrate stocker BF is not provided in the substrate processing apparatus 100, or when the load port LP is set as a stocker used for the dummy process, the dummy process is performed using the dummy substrate DW in the stocker C.

The storage rack C in which the dummy substrate DW is stored is carried into the load port LP by an external transfer device (not shown) of the substrate processing apparatus 100, and is carried out to the outside of the substrate processing apparatus 100 from the load port LP. For example, when the dummy substrate DW is replaced, the external transfer device carries out the storage rack C containing the used dummy substrate DW from the load port LP and carries other storage racks C containing the dummy substrates DW into the load port LP.

The dummy substrates DW in the other storage racks C are different from the dummy substrates DW in the original storage racks C, and therefore, the previous setting of the process type is not necessarily directly applicable.

Therefore, the control section 90 can initialize the correspondence information when the dummy substrate DW is carried out from the substrate processing apparatus 100 to the outside, and as a more specific example, when the housing rack C housing the dummy substrate DW is carried out from the load port LP.

Fig. 15 is a flowchart showing the initialization processing of the correspondence information. The control section 90 determines whether or not the dummy substrate DW is carried out from the substrate processing apparatus 100, specifically, whether or not the accommodating shelf C accommodating the dummy substrate DW is carried out from the load port LP (step S61). For example, the control unit 90 may perform the determination based on information from a control device that controls the external conveyance device.

When the rack C is not carried out from the load port LP, the controller 90 re-executes step S61.

When the storage rack C is carried out from the load port LP, the control unit 90 initializes the correspondence information (step S62). For example, the control unit 90 initializes the dummy substrate setting information indicating the correspondence relationship between the dummy substrate DW and the process type. As a more specific example, the control section 90 deletes the dummy substrate setting information stored in the storage medium 92.

When the receiving rack C receiving a new dummy substrate DW is loaded into the load port LP, the user inputs the processing type of the dummy substrate DW in the receiving rack C through the input device 96. The control unit 90 sets the process type of the dummy substrate DW based on the input. In this way, the user can appropriately reset the dummy substrate DW in accordance with the new dummy substrate DW.

As described above, since the correspondence information is initialized in response to the transfer to the outside of the dummy substrate DW, it is possible to avoid performing the dummy process using the correspondence information before.

< simulation processing >

In the above example, the cleaning process in the processing unit 10 is adopted as the simulation process, but is not necessarily limited thereto. In short, any process of discharging the processing liquid from the nozzle 13 to the dummy substrate DW can be adopted as the dummy process.

For example, the simulation process may be performed to adjust the processing environment of the processing unit 10. Specifically, the processing unit 10 may supply a high-temperature processing liquid to the substrate W. When the temperature of the processing liquid is lower than the predetermined temperature, the processing of the substrate W is insufficient, and therefore, temperature control of the processing liquid is important. If the life time of the processing unit 10 during which the substrate W is not processed after the processing of the substrate W is completed becomes longer, the temperature in the processing unit 10 decreases. In this state, when the processing unit 10 supplies the high-temperature processing liquid to the substrate W, the heat of the processing liquid is lost to the surroundings, and the low-temperature processing liquid may be supplied to the substrate W.

Therefore, when the lifetime is equal to or longer than the lifetime setting time, the high-temperature processing liquid may be ejected from the nozzle 13 toward the dummy substrate DW as the dummy processing in the processing unit 10. That is, the processing unit 10 supplies the same processing liquid as the processing liquid supplied to the substrate W to the dummy substrate DW. This can raise the temperature in the processing unit 10 to a predetermined temperature, thereby adjusting the processing environment.

Further, if the lifetime becomes longer, the treatment liquid attached to the inner peripheral surface of the cup 14 flows downward or evaporates, and the inner peripheral surface of the cup 14 is in a dry state. When the processing liquid scattered from the substrate W collides with the inner peripheral surface of the cup 14 in a state where the processing liquid is not adhered to the inner peripheral surface, the processing liquid is largely splashed back. This may cause particles to adhere to the substrate W. Therefore, when the lifetime is equal to or longer than the lifetime setting time, the process liquid is supplied to the dummy substrate DW as the dummy process in the process unit 10. The processing liquid may be the same processing liquid as the processing liquid supplied to the substrate W, and may be, for example, a cleaning liquid. In this simulation process, the inner peripheral surface of the cup 14 receives the processing liquid, and the inner peripheral surface of the cup 14 is wetted. Thereby, the processing environment can be adjusted. Therefore, during the subsequent processing of the substrate W, the processing liquid can be prevented from being splashed back from the cup 14. This can suppress the adhesion of particles to the substrate W.

As described above, the substrate processing method and the substrate processing apparatus 100 have been described in detail, but the above description is illustrative in all aspects, and the substrate processing apparatus 100 is not limited thereto. It is to be understood that numerous variations not illustrated can be devised without departing from the scope of the disclosure. The respective configurations described in the above embodiments and modifications can be appropriately combined or omitted unless contradictory to each other.

For example, "FEOL" and "MEOL" are adopted as the processing category. However, in the case where the processing unit 10 for a later process (so-called Back End Of Line (BEOL)) Of the manufacturing process is provided, "BEOL" may be adopted as the processing type.

In addition, as the process type, it is not always necessary to adopt a type indicating a process stage for dividing a manufacturing process of a semiconductor device. In short, when different contamination occurs in different processing units 10, the process type may be a type for distinguishing the processing unit 10. As a specific example, since different contamination may occur in the processing unit 10 that supplies different types of processing liquids, a type that distinguishes the types of processing liquids that can be supplied may be adopted as the processing type. Alternatively, in the case where substrates having different types of film structures are carried into the processing unit 10, since different contamination may occur, a type that distinguishes the type of film structure of the carried-in substrate may be adopted as the processing type.

Claims

1. A substrate processing method includes:

a setting step of setting, for each of a plurality of processing units provided in a substrate processing apparatus, a usable dummy substrate among a plurality of dummy substrates stored in a storage device based on an input from a user, and generating setting information indicating the usable dummy substrate among the plurality of processing units;

a dummy substrate specifying step of specifying a first dummy substrate usable in a first processing unit of the plurality of processing units from among the plurality of dummy substrates based on the setting information; and

and a simulation processing step of transferring the first dummy substrate from the container to the first processing unit by a transfer unit provided in the substrate processing apparatus, and performing simulation processing on the first dummy substrate by the first processing unit.

2. The substrate processing method according to claim 1,

the setting step includes:

a step of setting a process type for each of the plurality of process units based on an input from a user; and

a step of setting a process type for each of the plurality of dummy substrates based on an input from a user,

in the dummy substrate specifying step, a dummy substrate belonging to a process type identical to that of the first process unit is specified as the first dummy substrate.

3. The substrate processing method according to claim 2, wherein,

the process type includes a type indicating one of a plurality of process stages in a manufacturing process of the semiconductor device.

4. The substrate processing method according to claim 2 or 3,

the process types for the plurality of dummy substrates include a type indicating that the dummy substrate can be used in any one of the plurality of process units.

5. The substrate processing method according to claim 2 or 3,

the setting step further includes:

and setting, based on an input from a user, a hand used for the conveyance of the first dummy substrate among the plurality of hands included in the conveyance unit, in accordance with a process type.

6. The substrate processing method according to any one of claims 1 to 3,

in the setting step, 2 or more dummy substrates among the plurality of dummy substrates are set to be usable in the first processing unit,

in the dummy substrate specifying step, a dummy substrate that is used the least number of times among the 2 or more dummy substrates is specified as the first dummy substrate.

7. The substrate processing method according to any one of claims 1 to 3,

the setting step further includes:

the plurality of dummy substrates stored in the first storage container and the second storage container are set based on user input.

8. The substrate processing method according to any one of claims 1 to 3,

the setting step further includes:

setting a starting condition of the simulation process based on an input of a user,

the step further includes setting at least one of a first start condition that a lifetime during which the plurality of processing units do not continue processing the substrate is equal to or longer than a lifetime setting time and a second start condition that the number of processed substrates in the plurality of processing units is equal to or longer than the lifetime setting number as the start condition of each of the plurality of processing units.

9. The substrate processing method according to claim 8, wherein,

the setting step further includes:

and setting at least one of the lifetime setting time and the number of lifetime setting sheets based on an input from a user.

10. The substrate processing method according to any one of claims 1 to 3,

the setting step further includes:

a step of setting the number of processed dummy substrates to be used in the dummy processing step for each of the plurality of processing units based on an input from a user,

in the simulation processing step, the first simulation substrates of the set number of processed sheets are sequentially carried into the first processing unit, and the first processing unit performs the simulation processing on the sequentially carried first simulation substrates, respectively.

11. The substrate processing method according to any one of claims 1 to 3,

further comprises a treatment process for the above-mentioned materials,

in the processing step, the plurality of processing units sequentially perform processing on the substrate for each processing task in which a plurality of predetermined substrates are set as one unit,

the setting step further includes:

and setting, based on an input from a user, whether to perform the simulation process between an execution period of a process on the process task and an execution period of a process on a next process task, or to perform the simulation process during the execution period of the process task.

12. The substrate processing method according to any one of claims 1 to 3,

further comprises an inspection step of inspecting the surface of the substrate,

in the checking step, whether or not the setting in the setting step is appropriate is checked.

13. The substrate processing method according to claim 2 or 3,

in the inspection step, it is inspected whether or not all types of processing types set in the plurality of processing units are set for the plurality of dummy substrates.

14. The substrate processing method according to any one of claims 1 to 3,

in the dummy processing step, the first processing unit supplies a cleaning liquid to the first dummy substrate.

15. The substrate processing method according to any one of claims 1 to 3,

in the dummy processing step, the first processing unit supplies the same processing liquid as the processing liquid supplied to the substrate by the first processing unit to the first dummy substrate.

16. The substrate processing method according to any one of claims 1 to 3,

further comprises an initialization process for the first time,

in the initialization step, the setting information is initialized when the plurality of dummy substrates are carried out to the outside of the substrate processing apparatus.

17. A substrate processing apparatus includes:

an input device;

a plurality of processing units;

a transfer unit that transfers a dummy substrate between a container that contains a plurality of dummy substrates and each of the plurality of processing units; and

and a control unit configured to create setting information indicating a usable dummy substrate among the plurality of dummy substrates for each of the plurality of processing units based on an input to an input device, specify a first dummy substrate usable for a first processing unit among the plurality of processing units based on the setting information, cause the transfer unit to transfer the first dummy substrate from the container to the first processing unit, and cause the first processing unit to perform a dummy process on the first dummy substrate.