CN113866211A - Heat conductivity testing device of heat conducting pad with adjustable compression rate - Google Patents
Heat conductivity testing device of heat conducting pad with adjustable compression rate Download PDFInfo
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- CN113866211A CN113866211A CN202111052011.0A CN202111052011A CN113866211A CN 113866211 A CN113866211 A CN 113866211A CN 202111052011 A CN202111052011 A CN 202111052011A CN 113866211 A CN113866211 A CN 113866211A
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- heat
- pad
- heat conducting
- conducting pad
- plate
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- 230000006835 compression Effects 0.000 title claims abstract description 31
- 238000007906 compression Methods 0.000 title claims abstract description 31
- 238000012360 testing method Methods 0.000 title claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims description 22
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920005372 Plexiglas® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
Abstract
The invention belongs to the technical field of heat conducting pad performance testing, and particularly relates to a heat conducting capacity testing device of a heat conducting pad with adjustable compression rate. The compression ratio of the heat conducting pad is controlled by adjusting the height of the pad column, so that the heat conducting capacity of the heat conducting pad under different compression ratios is tested, the purpose of meeting the test requirement of the heat conducting capacity of the heat conducting pad and avoiding structural redundancy is achieved, human errors are reduced, and the test accuracy is improved.
Description
Technical Field
The invention belongs to the technical field of heat conducting pad performance testing, and particularly relates to a heat conducting capability testing device of a heat conducting pad with adjustable compression rate.
Background
As electronic equipment becomes more complex, the heat conduction path generally becomes longer, and heat conduction from the heat generating device to the heat sink inevitably passes through various interfaces, and generates contact resistance at the interfaces. Higher contact resistance also leads to increased temperature of the electronic device, which affects its lifetime and reliability. Thus, the performance of the thermal pad at different compression ratios is extremely important for heat dissipation of electronic devices.
At present, the heat conductivity of the heat conduction pad is mostly tested by a heat flow method, but the method cannot test the heat conductivity of the heat conduction pad under different compression rates. Therefore, how to provide a testing device capable of adjusting the compression rate to conduct the heat conduction capability of the heat conduction pad becomes a problem which needs to be solved urgently in the field of the performance test of the current heat conduction pad.
Disclosure of Invention
In view of the above, the present invention provides a device for testing heat conductivity of a thermal pad with adjustable compression ratio, wherein heat generated by a heating plate is transferred to a heat dissipation plate through the thermal pad, and the heat conductivity of the thermal pad is measured by testing the temperature of several selected points. The compression ratio of the heat conducting pad is controlled by adjusting the height of the pad column, so that the heat conducting capacity of the heat conducting pad under different compression ratios is tested, the purpose of meeting the test requirement of the heat conducting capacity of the heat conducting pad and avoiding structural redundancy is achieved, human errors are reduced, and the test accuracy is improved.
In order to achieve the technical purpose, the invention adopts the following specific technical scheme:
a thermal conductivity testing device for a thermal pad with adjustable compression rate comprises:
a heat dissipation plate;
the boss is in thermal conduction with the heat dissipation plate and is provided with a heat conduction pad placing table;
the compression device is provided with a pressing plate and is used for controllably compressing the heat-conducting pad on the placing table;
the heating sheet is attached and arranged between the pressing plate and the heat conducting pad;
the temperature measuring device is used for measuring the thermal conductivity of the heat conducting pad;
wherein: the heat conducting pad is arranged between the placing table and the heating sheet; and the placing table and the heating sheet are attached to each other.
Further, the compressing device includes: the device comprises a pressing plate, a distance-adjusting pad column and a screw; the distance-adjusting cushion columns are in multiple groups;
the pressing plate is mounted on the heat dissipation plate through the screws;
the cushion column is attached to and arranged between the pressing plate and the heat dissipation plate, and the compression device is used for adjusting the relative distance between the pressing plate and the placing table by replacing the distance adjusting cushion columns with different heights.
Furthermore, a through hole is formed in the pad column, and the screw penetrates through the through hole to be in threaded connection with the heat dissipation plate.
Furthermore, the temperature measuring device is a thermocouple.
Further, the thermocouple is a K-type thermocouple.
Furthermore, the heat dissipation plate and the boss are made of aluminum alloy materials.
Further, the heating plate is a ceramic heating plate.
Further, the positional relationship of the heating plate, the heat conducting pad and the boss is used for simulating the positional relationship of the chip, the heat conducting pad and the heat conducting pad cover plate.
By adopting the technical scheme, the invention can also bring the following beneficial effects:
1. the invention can realize the heat conduction capability test of the heat conduction pad under different power consumptions;
2. different compression ratios of the heat-conducting pad are realized through the pad columns with known heights, so that the precision of controlling the compression ratio of the heat-conducting pad is improved;
3. according to the invention, accurate tests under different power consumptions can be realized by adjusting the voltage of the heating sheet;
4. the invention is suitable for testing the heat conducting capability of various heat conducting pads.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a device for testing heat conductivity of a thermal pad 2 with adjustable compression ratio according to an embodiment of the present invention;
wherein: 1. a heat dissipation plate; 2. a thermally conductive pad; 3. a boss; 4. a temperature measuring device; 5. pressing a plate; 6. a heating plate; 7. and (7) a cushion column.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in practical implementation, and the type, quantity and proportion of the components in practical implementation can be changed freely, and the layout of the components can be more complicated.
In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
An embodiment of the present invention provides a device for testing a thermal conductivity of a thermal pad 2 with adjustable compression ratio, as shown in fig. 1, including:
a heat dissipation plate 1;
the boss 3 is arranged in heat conduction with the heat dissipation plate 1 and is provided with a heat conduction pad 2 placing table;
the compression device is provided with a pressure plate 5 and is used for controllably compressing the heat-conducting pad 2 on the placing table;
the heating plate 6 is attached and arranged between the pressing plate 5 and the heat conducting pad 2;
the temperature measuring device 4 is used for measuring the heat conductivity of the heat conducting pad 2;
wherein: the heat conducting pad 2 is arranged between the placing table and the heating plate 6; and the placing table and the heating plate 6 are attached.
In this embodiment, the compression device includes: the pressing plate 5, the distance adjusting padding column 7 and the screw; the distance-adjusting cushion columns 7 are in multiple groups;
the pressing plate 5 is arranged on the heat dissipation plate 1 through screws;
the pad column 7 is attached between the pressing plate 5 and the heat dissipation plate 1, and the compression device is used for adjusting the relative distance between the pressing plate 5 and the placing table by replacing the distance-adjusting pad columns 7 with different heights. In this embodiment, four sets of the same-sized distance-adjusting pad posts 7 are required to be disposed for each compression, so as to ensure the stability of the heat-conducting pad 2.
In this embodiment, the stud 7 is provided with a through hole, and a screw is threaded through the through hole to connect with the heat sink 1.
In this embodiment, the temperature measuring device 4 is the temperature measuring device 4, and the measuring end is attached to the heat dissipating plate 1.
In this embodiment, the temperature measuring device 4 is a K-type temperature measuring device 4.
In this embodiment, the heat sink 1 and the boss 3 are made of aluminum alloy.
In the present embodiment, the heater chip 6 is a ceramic heater chip 6.
In the present embodiment, the pressing plate 5 is plexiglass.
In the present embodiment, the positional relationship of the heating plate 6, the thermal pad 2, and the boss 3 is used to simulate the positional relationship of the chip, the thermal pad 2, and the thermal pad cover.
The heat conduction pad 2 to be tested is placed on the boss 3 of the heat dissipation plate 1, and the heat conduction pad 2 to be tested and the heating plate 6 are pressed by using the pressing plate 5. The heating sheet 6 is heated by electrifying, and the temperature of different positions is measured by the temperature measuring device 4 on the heat radiation plate 1. The pad columns 7 with different heights are selected to adjust the compression ratio of the heat conducting pad 2, and then the test of the heat conducting capacity of the heat conducting pad 2 under different compression ratios is determined.
The specific implementation is as follows: the heat generation power consumption was 12W, four kinds of the heat conductive pads 2 of Gap Pad 3000S30, CHLT, S50, and S80 were respectively tested at a thickness of 2mm, the compression ratios were 10%, 20%, and 30%, and specific experimental data are recorded in table 1.
TABLE 1 comparison table of heat conductivity at different compression ratios
Table 1 is a table comparing the thermal conductivity of Gap Pad 3000S30, S50, CHLT, S80 tested at 2mm thickness at different compressibility. The delta T1 represents the relative temperature of the center between the heating plate and the heat conducting pad, and the lower the temperature is, the stronger the heat conducting capability of the heat conducting pad is, so that the temperature of the chip can be effectively reduced; Δ T2 represents the relative temperature at the center of the back surface of the heat sink, and a higher temperature means a higher thermal conductivity of the thermal pad, which effectively transfers heat to the heat sink. As can be seen from the table, the thermal conductivity of S50 and S80 is significantly better than that of GP3000S30 and CHLT, respectively.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. A thermal conductivity testing device of a thermal pad with adjustable compression rate is characterized by comprising:
a heat dissipation plate;
the boss is in thermal conduction with the heat dissipation plate and is provided with a heat conduction pad placing table;
the compression device is provided with a pressing plate and is used for controllably compressing the heat-conducting pad on the placing table;
the heating sheet is attached and arranged between the pressing plate and the heat conducting pad;
the temperature measuring device is used for measuring the thermal conductivity of the heat conducting pad;
wherein: the heat conducting pad is arranged between the placing table and the heating sheet; and the placing table and the heating sheet are attached to each other.
2. The test device of claim 1, wherein: the compression device includes: the device comprises a pressing plate, a distance-adjusting pad column and a screw; the distance-adjusting cushion columns are in multiple groups;
the pressing plate is mounted on the heat dissipation plate through the screws;
the cushion column is attached to and arranged between the pressing plate and the heat dissipation plate, and the compression device is used for adjusting the relative distance between the pressing plate and the placing table by replacing the distance adjusting cushion columns with different heights.
3. The test device of claim 2, wherein: the cushion column is provided with a through hole, and the screw penetrates through the through hole to be in threaded connection with the heat dissipation plate.
4. The test device of claim 1, wherein: the temperature measuring device is a thermocouple.
5. The test device of claim 4, wherein: the thermocouple is a K-type thermocouple.
6. The test device of claim 1, wherein: the heat dissipation plate and the boss are made of aluminum alloy materials.
7. The test device of claim 1, wherein: the heating plate is a ceramic heating plate.
8. The test device of claim 1, wherein: the position relationship of the heating plate, the heat conducting pad and the lug boss is used for simulating the position relationship of the chip, the heat conducting pad and the heat conducting pad cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111052011.0A CN113866211A (en) | 2021-09-08 | 2021-09-08 | Heat conductivity testing device of heat conducting pad with adjustable compression rate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111052011.0A CN113866211A (en) | 2021-09-08 | 2021-09-08 | Heat conductivity testing device of heat conducting pad with adjustable compression rate |
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| Publication Number | Publication Date |
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| CN113866211A true CN113866211A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111052011.0A Pending CN113866211A (en) | 2021-09-08 | 2021-09-08 | Heat conductivity testing device of heat conducting pad with adjustable compression rate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116776478A (en) * | 2023-08-23 | 2023-09-19 | 武汉嘉晨电子技术有限公司 | Compression rate matching method for BDU buffer cushion and heat conducting pad of automobile |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201016946Y (en) * | 2007-03-07 | 2008-02-06 | 华为技术有限公司 | Heat conductive material parameter testing device |
| CN102980910A (en) * | 2012-11-30 | 2013-03-20 | 深圳市博恩实业有限公司 | Heat conduction material property testing equipment |
| CN113033141A (en) * | 2021-02-26 | 2021-06-25 | 中国电子科技集团公司第五十四研究所 | Design and assembly method of heat conducting structure of digital board card |
-
2021
- 2021-09-08 CN CN202111052011.0A patent/CN113866211A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201016946Y (en) * | 2007-03-07 | 2008-02-06 | 华为技术有限公司 | Heat conductive material parameter testing device |
| CN102980910A (en) * | 2012-11-30 | 2013-03-20 | 深圳市博恩实业有限公司 | Heat conduction material property testing equipment |
| CN113033141A (en) * | 2021-02-26 | 2021-06-25 | 中国电子科技集团公司第五十四研究所 | Design and assembly method of heat conducting structure of digital board card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116776478A (en) * | 2023-08-23 | 2023-09-19 | 武汉嘉晨电子技术有限公司 | Compression rate matching method for BDU buffer cushion and heat conducting pad of automobile |
| CN116776478B (en) * | 2023-08-23 | 2023-11-28 | 武汉嘉晨电子技术有限公司 | Compression rate matching method for BDU buffer cushion and heat conducting pad of automobile |
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