CN113862630A - Preparation method of narrow-band filter and film coating machine - Google Patents
Preparation method of narrow-band filter and film coating machine Download PDFInfo
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- CN113862630A CN113862630A CN202111297074.2A CN202111297074A CN113862630A CN 113862630 A CN113862630 A CN 113862630A CN 202111297074 A CN202111297074 A CN 202111297074A CN 113862630 A CN113862630 A CN 113862630A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
Abstract
The disclosure provides a preparation method of a narrow-band filter and a film coating machine. The preparation method of the narrow-band filter comprises the following steps: the method comprises the following steps: simulating a first optical curve of the narrow-band filter; after the narrow-band filter is plated, detecting a second optical curve of the narrow-band filter; detecting whether the first optical curve and the second optical curve are consistent, if not, adjusting the first optical curve until the characteristic point of the first optical curve is consistent with the second optical curve, and determining a process influence factor; and adjusting the plating parameters according to the process influence factor to re-plate the narrow-band filter. The preparation method of the narrow-band filter and the film coating machine adjust the first optical curve until the first optical curve is consistent with the second optical curve to determine the process influence factor of the film coating machine, so that the effect of correcting the coating parameters of the narrow-band filter can be achieved according to the process influence factor.
Description
Technical Field
The disclosure belongs to the field of coating, and particularly relates to a preparation method of a narrow-band filter and a coating machine.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
The narrow-band filter can allow optical signals to pass in a specific waveband, but the optical signals on two sides deviating from the specific waveband are prevented, the passband of the narrow-band filter is relatively narrow and is generally less than 5% of the central wavelength value, and the narrow-band filter is widely applied to the fields of fluorescence analyzers, enzyme scanners, cable television upgrading equipment, wireless transmission equipment, mobile phone bar code scanning, infrared electronic whiteboards, infrared cameras and the like.
The narrow-band filter needs to be plated with a plurality of film layers in the preparation process. In the coating process, a quartz crystal oscillator film thickness monitoring method is needed to monitor the thickness of each film layer of the narrow-band filter, and due to the limitation of the monitoring method, the monitoring of the thickness of the film layer is inaccurate, so that the film thickness of the multilayer film in the deposition process is inaccurate, and the optical index of the narrow-band filter is difficult to meet the requirement.
Disclosure of Invention
In view of the above, there is a need for a method for manufacturing a narrowband filter and a film coater for correcting the coating parameters of the narrowband filter.
The application firstly provides a preparation method of a narrow-band filter, which comprises the following steps:
a step of acquiring a first optical curve: configuring optical parameters of a narrow-band filter, and simulating a first optical curve of the narrow-band filter according to the optical parameters;
a step of acquiring a second optical curve: configuring plating parameters of the narrow-band filter, plating the narrow-band filter, and detecting a second optical curve of the plated narrow-band filter;
determining a process influence factor: detecting whether the first optical curve and the second optical curve are consistent, if not, adjusting the first optical curve until the characteristic point of the first optical curve is consistent with the second optical curve, and determining a process influence factor;
parameter adjustment: and adjusting the plating parameters according to the process influence factor to re-plate the narrow-band filter.
Preferably, before the step of determining the process influence factor, the method further comprises detecting a characteristic point of the first optical curve;
the step of obtaining a second optical curve further comprises marking characteristic points of the second optical curve;
the step of determining the process impact factor further comprises: the first optical curve being coincident with the second optical curve includes a characteristic point of the first optical curve being coincident with a characteristic point of the second optical curve.
Preferably, the characteristic point includes one or more of a pass rate, a cut-off wavelength, and a cut-off rate of the filter.
Preferably, before the parameter adjusting step, the method further comprises:
inputting the designed thickness in a coating machine, coating a film layer by using the coating machine and measuring the actual thickness of the film layer;
calculating a tool influence factor corresponding to the film coating machine according to the actual thickness and the design thickness;
re-plating the narrow-band filter after adjusting the plating parameters according to the process influencing factors comprises:
and re-plating the narrow-band optical filter after adjusting the plating parameters according to the process influence factor and the tool influence factor.
Preferably, calculating the tool impact factor corresponding to the coating machine according to the actual coating thickness and the design thickness comprises:
the tool impact factor TF1 is calculated according to the following formula:
TF1=Ha1/Hd;
where Ha1 is the actual plating thickness of the film and Hd is the design thickness of the film.
Preferably, after the parameter adjusting step, the method further comprises: and repeating the steps of obtaining a second optical curve, determining a process influence factor and adjusting parameters until the characteristic points of the second optical curve of the narrow-band optical filter detected in the step of determining the process influence factor are consistent with the characteristic points of the first optical curve.
Preferably, the parameter adjusting step includes:
the plating parameters include an input thickness of the film layer, the input thickness Hi is determined according to the following formula:
Hi=Ha2/(TF1*TF2);
wherein Ha2 is the film thickness of the actually plated narrow-band filter at the last time, and TF2 is a process influence factor;
and inputting the input thickness Hi into a film coating machine, and re-coating the narrow-band filter.
Preferably, the determining a process impact factor step comprises:
dividing the film layer of the narrow-band filter into one or more film stacks, wherein each film stack comprises one or more film layers plated with materials;
and acquiring process influence factors corresponding to the film stack from film layer design software of the film coating machine according to the change of the optical parameters of the first optical curve before and after adjustment.
Preferably, the film stack comprises a film layer plated by at least one of silicon dioxide and titanium oxide materials.
In addition, the application also provides a film coating machine, and the narrow-band filter is coated by adopting the preparation method.
Compared with the prior art, the preparation method of the narrow-band filter and the film coating machine determine the process influence factor of the film coating machine by simulating the first optical curve of the narrow-band filter, detecting the second optical curve of the actually coated narrow-band filter and then adjusting the first optical curve until the first optical curve is consistent with the second optical curve, so that the effect of the coating parameters of the narrow-band filter can be corrected according to the process influence factor, the quality of the coated film layer is improved, and the optical performance of the narrow-band filter is improved.
Drawings
In order to illustrate the embodiments more clearly, the drawings that will be needed in the description of the embodiments will be briefly described below, it being apparent that the drawings in the following description are some examples of the disclosure, and that other drawings may be derived from those drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic structural diagram of a narrowband filter.
Fig. 2 is a flowchart of a method of manufacturing a narrowband filter.
The following detailed description will further illustrate the disclosure in conjunction with the above-described figures.
Detailed Description
In order that the above objects, features and advantages of the present disclosure can be more clearly understood, a detailed description of the present disclosure will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present disclosure, and the described embodiments are merely a subset of the embodiments of the present disclosure, rather than a complete embodiment. All other embodiments, which can be derived by one of ordinary skill in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.
In various embodiments, for convenience in description and not limitation of the disclosure, the term "coupled" as used in the specification and claims of the present disclosure is not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
The embodiment firstly provides a film coating machine which can be used for preparing a narrow-band optical filter. The coater may attach molecules and atoms of the film material to the substrate 10 by means of plasma discharge, arc discharge, or resistance evaporation, etc., to form a plated film layer.
Fig. 1 is a schematic structural diagram of a narrowband filter. As shown in FIG. 1, for example, a 980nm narrowband filter is designed to have 82 layers of film layers, and the material of the film layers is titanium oxide (Ti)3O5) And silicon dioxide (SiO)2). In the preparation process, the 82 film layers are coated on the substrate 10 by the coating machine. Therefore, before plating, plating parameters need to be set in film layer design software of a film plating machine, and 82 layers of films to be plated comprise four film stacks 20, functionally comprise 3 short-wave-pass film stacks 20 with different wavelengths, and 1 long-wave-pass film stack 20. The plating parameters for the four film stacks 20 are: 0.56(0.5HL0.5H) ^ 10; 0.64(0.5HL0.5H) ^ 10; 0.73(0.5HL0.5H) ^ 10; 1.27(0.5 LH0.5L). sub.10, as shown in Table 1.
H | L | |
Material | Ti3O5 | SiO2 |
Film thickness | 1.000qw | 1.000qw |
Whether to optimize | Yes | Yes |
All groups of | 1 | 2 |
TABLE 1
Those skilled in the art will appreciate that the four stacks 20 function as 3 short wavelength passes and 1 long wavelength pass, and that the short wavelength passes and the long wavelength passes can be achieved, and that the coating is not necessarily deposited by the process in the order of the stacks 20, and each stack 20 does not correspond to a long wavelength pass or a short wavelength pass.
Fig. 2 is a flowchart of a method of manufacturing a narrowband filter. As shown in FIG. 2, the preparation method of the narrow-band filter comprises steps S201 to 205.
Step S201: the plating parameters of the coater are set based on the characteristics of the material of the stack 20 and the process experience. As an example, may be according to Ti3O5And SiO2To set the plating parameters as in table 2.
TABLE 2
Where angstroms is the length unit: 0.1 nm, i.e. minus 10 cubic meters of 10.
Then, the above-mentioned plating parameters are set in the design software of the coater, and the plating parameter configuration of the coater is completed as shown in table 2.
Step S202 (first optical curve acquisition step): optimizing the film layer through design software of a film coating machine, configuring optical parameters of the narrow-band filter, and simulating a first optical curve of the narrow-band filter according to the optical parameters. Therefore, the first optical curve is an ideal optical curve of the film layer meeting the design requirements, and the optical index of the film layer meets the design requirements. In this step, after the first optical curve is simulated, feature points of the first optical curve may also be detected, where the feature points include one or more of a pass rate, a cut-off wavelength, and a cut-off rate of the narrowband filter.
Step S203: and calculating the tool influence factor of the film coating machine. Using the above-mentioned plating parameters as initial parameters, on the basis of which, after the design thickness Hd is input in the coater, a film layer (i.e., a single-layer film layer) is plated using the coater and the actual thickness Ha1 of the film layer is measured. And then, calculating a tool influence factor corresponding to the film coating machine according to the actual thickness and the design thickness. For convenience of description, the tool impact factor of the coater is denoted as TF1, and this factor is used to characterize the error of the film thickness gauge. Because of the single layer plating, the influence of the process can be not considered. As an example, calculating the corresponding tool impact factor TF1 of the coater according to the actual thickness Ha1 and the design thickness Hd includes:
the tool impact factor TF1 is calculated according to the following formula:
TF1=Ha1/Hd;
where Ha is the actual thickness of the film and Hd1 is the design thickness of the film.
For example, a layer of Ti3O5 or a layer of SiO2 may be coated by a coater, and the actual thickness of the single-layer film (the actual thickness without considering the process influence) may be fitted after measuring the spectrum by a spectrophotometer, and the actual thickness of the single-layer film of Ti3O5 or the actual thickness of the single-layer film of SiO2 may be recorded as Ha 1. The thickness (i.e., the design thickness) of the single layer of Ti3O5 or SiO2 as measured by a film thickness meter in a post-coating coater was designated as Hd. Then, the coefficient of the high refractive index group (single layer Ti3O5 or single layer SiO2), i.e., the tool influence factor (TF1), is calculated as TF1 ═ Ha1/Hd, e.g., 1.06.
Step S204 (second optical curve acquisition step): setting an initial input thickness Ha2 according to the design parameters of the narrow-band filter, trial-manufacturing the narrow-band filter by using a film plating machine, detecting a second optical curve of the narrow-band filter, and marking the characteristic points of the second optical curve.
Due to the defect of monitoring problems of a film plating machine, a certain deviation exists between the process and the ideal design, so that the problems of passing rate, cut-off wavelength, cut-off rate and the like of a plated film layer possibly exist. Therefore, in this step, a second optical curve of the film layer of the actually plated narrowband filter may be detected by a spectrophotometer, the second optical curve is analyzed, and characteristic points of optical indexes of the film layer reflected by the second optical curve, such as transmittance or cutoff wavelength, are marked, for example: the cutoff ratio was 70%, the cutoff wavelength was 960nm instead of the target wavelength of 980nm, and 20nm was required. Or, the passing rate of a certain long wave should be more than 95%, actually only reaches 70%, and the like, and the specific parameters at the position where the curve is marked do not meet the requirement are marked, namely the characteristic point is marked.
Step S205 (process-influencing factor determining step): and detecting whether the first optical curve is consistent with the second optical curve or not, if not, adjusting the first optical curve until the characteristic point of the simulated first optical curve is consistent with the characteristic point of the second optical curve of the actual plating film layer, and determining a process influence factor TF 2. Specifically, the film layers of the narrow band pass filter are divided into one or more film stacks 20, wherein each film stack 20 includes one or more plated film layers, as shown in table 3.
TABLE 3
And when the characteristic points of the first optical curve and the second optical curve are consistent, the process influence factor can be obtained from film layer design software of the film plating machine. For example, in the above example, the above 4 film stacks 20 are grouped, and are divided into 8 groups according to the material type (2 materials), the film stacks 20 and the group number are adjusted by the interactive analysis function in the film layer design software, the change of the simulated first optical curve is checked through the change of the process influence factor until the simulated first optical curve is consistent with the second optical curve of the actual plating film layer (the curve structure is consistent, the key point parameter is consistent), and the process influence factor of each group is obtained through the interactive analysis function.
Step S206 (parameter adjustment step): and re-plating the narrow-band optical filter after adjusting the plating parameters according to the process influence factor and the tool influence factor. Specifically, the thickness of the film layers included in each film stack 20 is adjusted according to the tool impact factor and the process impact factor corresponding to each film stack 20, and the film plating machine is reused to plate the narrowband filter according to the adjusted thickness of each film stack 20.
In this step, adjusting the plating parameters according to the process influencing factor and the tool influencing factor comprises:
the plating parameters include an input thickness Hi of the film layer, which is determined according to the following formula:
Hi=Ha2/(TF1*TF2);
wherein Ha2 is the film thickness of the last actually plated narrow-band filter, and TF2 is the process influence factor.
The derivation of the above input thickness calculation formula is described in detail below:
first, the tool impact factor TF1 ═ Ha1/Hd, so there is:
Ha1=Hd*TF1;
and the process influence factor TF2 ═ Ha2/Ha1, and therefore TF2 ═ Ha2/(Hd ═ TF1), and therefore:
Ha2=Hd*TF1*TF2
for example, the process influence factor of TI3O5 in the first group is TF2, the actual film thickness actually plated at the previous time after considering the process influence is Ha2, and the designed input thickness is Hi, and then the input thickness Hi required to be input to the coater for the next actual plating is determined according to the following formula:
Hi=Ha2/(TF1*TF2)。
and after the input thickness Hi is input into the film coating machine, the narrow-band filter is coated again.
Step S207: repeating the steps S204 and S206 until the first optical curve and the second optical curve of the newly-plated narrowband filter are consistent, and at this time, it can be confirmed that the film layer of the narrowband filter meets the design requirement. Those skilled in the art understand that in this step, the first optical curve is consistent with the second optical curve, and the first optical curve used in the design requirement is determined as the first optical curve initially simulated, rather than the first optical curve adjusted for obtaining the process influence factor each time.
In the above example, the plating results after multiple adjustments are as follows:
index requirement | Actual test results |
980±2nm@T>85% | 980±2nm@T≥93% |
Half bandwidth of 40-50nm | Half band width of 44nm |
400-940nm@T<1% | 400-940nm@T<0.04% |
1020-1100nm@T<1% | 1020-1100nm@T<0.08% |
According to the preparation method of the narrow-band filter and the film coating machine, the first optical curve of the narrow-band filter is simulated, the second optical curve of the actually coated narrow-band filter is detected, and then the first optical curve is adjusted until the first optical curve is consistent with the second optical curve to determine the process influence factor of the film coating machine, so that the effect of correcting the coating parameters of the narrow-band filter according to the process influence factor is achieved, the quality of a coated film layer is improved, and the optical performance of the narrow-band filter is improved.
Moreover, in the process of correcting the adjustment parameters of the film coating machine, the film layer design is carried out through the film separating stack 20, and in the process of adjusting the process, the analysis and adjustment are more targeted when the problems of the coated film layer are analyzed and adjusted. Moreover, the membrane layer design is carried out through the membrane separation stack 20, the simplified analysis process is only needed to be analyzed and adjusted according to the membrane stack 20 according to specific problems, the time is saved, and the preparation efficiency of the narrow-band filter is improved.
In several embodiments provided in the present disclosure, it will be apparent to those skilled in the art that the present disclosure is not limited to the details of the above-described exemplary embodiments, and can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the disclosure being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. The terms first, second, etc. are used to denote names, but not any particular order.
Although the present disclosure has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present disclosure.
Claims (10)
1. A method for manufacturing a narrow-band filter is characterized by comprising the following steps:
a step of acquiring a first optical curve: configuring optical parameters of a narrow-band filter, and simulating a first optical curve of the narrow-band filter according to the optical parameters;
a step of acquiring a second optical curve: configuring plating parameters of the narrow-band filter, plating the narrow-band filter, and detecting a second optical curve of the plated narrow-band filter;
determining a process influence factor: detecting whether the first optical curve and the second optical curve are consistent, if not, adjusting the first optical curve until the characteristic point of the first optical curve is consistent with the second optical curve, and determining a process influence factor;
parameter adjustment: and adjusting the plating parameters according to the process influence factor to re-plate the narrow-band filter.
2. The method of manufacturing a narrowband filter according to claim 1, further comprising, before the step of determining a process-affecting factor, detecting a characteristic point of the first optical curve;
the step of obtaining a second optical curve further comprises marking characteristic points of the second optical curve;
the step of determining the process impact factor further comprises: the first optical curve being coincident with the second optical curve includes a characteristic point of the first optical curve being coincident with a characteristic point of the second optical curve.
3. The method of claim 2, wherein the feature points comprise one or more of a pass rate, a cut-off wavelength, and a cut-off rate of the filter.
4. The method for manufacturing a narrowband filter according to claim 2, further comprising, before the parameter adjusting step:
inputting the designed thickness in a coating machine, coating a film layer by using the coating machine and measuring the actual thickness of the film layer;
calculating a tool influence factor corresponding to the film coating machine according to the actual thickness and the design thickness;
re-plating the narrow-band filter after adjusting the plating parameters according to the process influencing factors comprises:
and re-plating the narrow-band optical filter after adjusting the plating parameters according to the process influence factor and the tool influence factor.
5. The method of claim 4, wherein calculating the tool impact factor for the coater based on the actual coating thickness and the design thickness comprises:
the tool impact factor TF1 is calculated according to the following formula:
TF1=Ha1/Hd;
where Ha1 is the actual plating thickness of the film and Hd is the design thickness of the film.
6. The method for manufacturing a narrowband filter according to claim 5, further comprising, after the parameter adjusting step: and repeating the steps of obtaining a second optical curve, determining a process influence factor and adjusting parameters until the characteristic points of the second optical curve of the narrow-band optical filter detected in the step of determining the process influence factor are consistent with the characteristic points of the first optical curve.
7. The method of manufacturing a narrowband filter according to claim 6, wherein the parameter adjusting step comprises:
the plating parameters include an input thickness of the film layer, the input thickness Hi is determined according to the following formula:
Hi=Ha2/(TF1*TF2);
wherein Ha2 is the film thickness of the actually plated narrow-band filter at the last time, and TF2 is a process influence factor;
and inputting the input thickness Hi into a film coating machine, and re-coating the narrow-band filter.
8. The method of claim 7, wherein the determining a process impact factor comprises:
dividing the film layer of the narrow-band filter into one or more film stacks, wherein each film stack comprises one or more film layers plated with materials;
and acquiring process influence factors corresponding to the film stack from film layer design software of the film coating machine according to the change of the optical parameters of the first optical curve before and after adjustment.
9. The method of claim 8, wherein the stack comprises a film layer coated with at least one of silicon dioxide and titanium oxide.
10. A coater for coating a narrowband optical filter by the production method according to any one of claims 1 to 9.
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JP2009031235A (en) * | 2007-07-27 | 2009-02-12 | National Central Univ | Precision optical coating monitoring method having correction effect on refractive index and thickness |
CN101555102A (en) * | 2009-05-06 | 2009-10-14 | 上海兆九光电技术有限公司 | Process for plating narrow-band interference filter |
CN103673905A (en) * | 2013-12-31 | 2014-03-26 | 合波光电通信科技有限公司 | Method for monitoring thickness of magnetron-sputtering-coating optical film |
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JP2009031235A (en) * | 2007-07-27 | 2009-02-12 | National Central Univ | Precision optical coating monitoring method having correction effect on refractive index and thickness |
CN101555102A (en) * | 2009-05-06 | 2009-10-14 | 上海兆九光电技术有限公司 | Process for plating narrow-band interference filter |
CN103673905A (en) * | 2013-12-31 | 2014-03-26 | 合波光电通信科技有限公司 | Method for monitoring thickness of magnetron-sputtering-coating optical film |
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