CN113857950A - Continuous production process of non-plated diamond wire - Google Patents
Continuous production process of non-plated diamond wire Download PDFInfo
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- CN113857950A CN113857950A CN202111067190.5A CN202111067190A CN113857950A CN 113857950 A CN113857950 A CN 113857950A CN 202111067190 A CN202111067190 A CN 202111067190A CN 113857950 A CN113857950 A CN 113857950A
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- diamond
- steel wire
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- 239000010432 diamond Substances 0.000 title claims abstract description 102
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000008569 process Effects 0.000 title claims abstract description 31
- 238000010924 continuous production Methods 0.000 title claims abstract description 22
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 61
- 239000010959 steel Substances 0.000 claims abstract description 61
- 239000002245 particle Substances 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000012046 mixed solvent Substances 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000001723 curing Methods 0.000 claims description 22
- 238000001035 drying Methods 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 10
- 230000001590 oxidative effect Effects 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 230000004048 modification Effects 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052753 mercury Inorganic materials 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 150000003904 phospholipids Chemical class 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 2
- 238000003848 UV Light-Curing Methods 0.000 claims description 2
- 239000005416 organic matter Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 27
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 description 26
- 238000007596 consolidation process Methods 0.000 description 20
- 239000006061 abrasive grain Substances 0.000 description 16
- 238000001179 sorption measurement Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 239000007767 bonding agent Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000036541 health Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910000677 High-carbon steel Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/38—Single-purpose machines or devices for externally grinding travelling elongated stock, e.g. wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention relates to the technical field of diamond wires and discloses a continuous production process of a non-plated diamond wire, which comprises the following steps: s1, sequentially penetrating the straightened steel wire through the hollow cylinders with the inner side surfaces provided with the polishing abrasive paper; s2, processing the surface of the diamond abrasive particle; s3, mixing and stirring the resin binder and the organic solvent until the resin binder is dissolved to form a mixed solvent; s4, adding the processed diamond abrasive particles and SiC powder with the diameter of 3-4 microns into the mixed solvent, and mixing and stirring the mixture uniformly; s5, the processed steel wire is sequentially passed through the mixture formed in S4, so that the steel wire is uniformly coated with the processed steel wire. The non-coating diamond wire continuous production process has the advantages that the strength of the steel wire is improved, the wire breakage rate of the steel wire is reduced, meanwhile, the diamond abrasive particles which are easier to adsorb with the resin binder are solidified on the surface in a resin binder mode, the cost is reduced, and the solidification effect is improved.
Description
Technical Field
The invention relates to the technical field of diamond wires, in particular to a continuous production process of non-coated diamond wires.
Background
Diamond wire is also called diamond wire, diamond cutting wire or diamond wire, and many hard materials in industry are cut by cutting steel wire or higher quality gold steel wire, such as polycrystalline silicon slices, monocrystalline silicon and crystal bars in the photovoltaic field. The material of the cutting steel wire is very important, and excessive wire breakage, poor product quality and the like are related to the material of the steel wire in the using process. The mainstream silicon slice cutting line used in the photovoltaic field is an ultra-fine cutting steel wire with the diameter of about 120um, the raw material adopts high-carbon steel, and the material quality is different from 80C, 86C and 90C. Diamond cutting lines, as the name implies, are associated with diamonds. In general, diamond cutting wires are made by embedding fine particles of diamond on a cutting steel wire. Diamond is known to be ultra hard and to be used in a wide variety of cutting materials. The diamond wire has the micro saw teeth of the diamond, the cutting capability of the steel wire is improved, and the cutting speed and the cutting capability can be greatly accelerated. The gold steel wire is a revolutionary progress for the solar silicon material cutting industry. Therefore, people generally expect that the application of the method in the future will be very wide and the cost is high.
The steel wire of the existing diamond wire is easy to break in the using process, so that the cutting quality and the cutting effect of the diamond wire are influenced; the existing diamond wire is usually used for consolidating diamond abrasive grains onto a steel wire in an electroplating mode, although the consolidation effect is improved, the electroplating mode is complex in process and high in cost, and the process is harmful to the health of people; in order to meet the requirements of cutting, the consolidation effect is further improved, the consolidation effect is generally improved in a mode of increasing a coating, so that the protruding part of the diamond abrasive particles is shortened, the cutting effect is reduced, heat dissipation is not facilitated, powder is easily gathered among the diamond abrasive particles after cutting, and the cutting efficiency is further reduced; however, the diamond abrasive grains are bonded by using a general resin bond, and the diamond abrasive grains are not easily detached due to the adsorption force.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a continuous production process of a non-plated diamond wire, which has the advantages that the strength of the steel wire is improved by using the processed steel wire, the wire breakage rate of the steel wire is reduced, meanwhile, the diamond abrasive particles which are easier to adsorb with a resin binder are consolidated in a resin binder mode, the cost is reduced, the consolidation effect is improved, the diamond abrasive particles are further improved in consolidation effect by solidifying the diamond abrasive particles, and the like, and the problems that the existing diamond wire is easy to break in the using process, and the cutting quality and the cutting effect of the diamond wire are influenced are solved; the existing diamond wire is usually used for consolidating diamond abrasive grains onto a steel wire in an electroplating mode, although the consolidation effect is improved, the electroplating mode is complex in process and high in cost, and the process is harmful to the health of people; in order to meet the requirements of cutting, the consolidation effect is further improved, the consolidation effect is generally improved in a mode of increasing a coating, so that the protruding part of the diamond abrasive particles is shortened, the cutting effect is reduced, heat dissipation is not facilitated, powder is easily gathered among the diamond abrasive particles after cutting, and the cutting efficiency is further reduced; however, the diamond abrasive grains are bonded by using a general resin bond, and the diamond abrasive grains are not easy to fall off due to insufficient adsorption force.
In order to realize the purposes that the strength of the steel wire is improved and the breakage rate of the steel wire is reduced by using the treated steel wire, meanwhile, the diamond abrasive particles which are easier to be adsorbed with resin binders in surface modification are consolidated in a resin binder mode, the cost is reduced, the consolidation effect is improved, and the consolidation effect is further improved by solidifying the diamond abrasive particles, the invention provides the following technical scheme: a continuous production process of non-plated diamond wires comprises the following steps:
s1, sequentially penetrating the straightened steel wire through the hollow cylinders with the inner side surfaces provided with the polishing abrasive paper;
s2, processing the surface of the diamond abrasive particle;
s3, mixing and stirring the resin binder and the organic solvent until the resin binder is dissolved to form a mixed solvent;
s4, adding the processed diamond abrasive particles and SiC powder with the diameter of 3-4 microns into the mixed solvent, and mixing and stirring the mixture uniformly;
s5, sequentially passing the processed steel wire through the mixture formed in the step S4 to enable the steel wire to be uniformly coated;
s6, curing the coated steel wire for 20-25 minutes under the conditions of 500-900 ℃;
s7, curing the steel wire subjected to primary curing for 2-3 minutes under uv light;
and S8, drying the steel wire after the secondary curing in a drying box at constant temperature.
Preferably, the step of treating the surface of the diamond abrasive grains is: removing the non-diamond carbon layer on the surface of the monocrystalline diamond powder with the grain size of 5-45 microns by using oxidizing acid, and then carrying out surface modification treatment on the monocrystalline diamond powder by using organic matters.
Preferably, the oxidizing acid includes at least one of sulfuric acid, nitric acid, perchloric acid, and permanganic acid.
Preferably, the organic substance includes at least one of carbonic acid, carbonate, cyanide, and phospholipid.
Preferably, the uv light curing is performed by irradiation with an ultraviolet high-pressure mercury lamp.
Preferably, the diameter of the diamond abrasive grains is 0.05 to 0.15 times the diameter of the steel wire.
Preferably, the temperature of the constant-temperature drying box is raised to 200-400 ℃ within 6-36 hours, then the temperature is maintained for 12-24 hours, and finally the temperature is naturally reduced to the room temperature.
Compared with the prior art, the invention provides a continuous production process of non-plated diamond wires, which has the following beneficial effects:
1. the continuous production process of the non-coated diamond wire strengthens the strength of a steel wire through polishing and various curing treatments and reduces the fracture rate of the steel wire.
2. According to the continuous production process of the non-coated diamond wire, the diamond abrasive particles are solidified on the steel wire in a resin bonding agent and high-temperature, uv light and dry solidification mode, a complex and high-cost electroplating mode is not needed, the cost is reduced, and the health of people is guaranteed.
3. According to the non-coating diamond wire continuous production process, the adsorption effect of the diamond abrasive particles and the resin bonding agent is improved by adopting a resin bonding agent mode and using the diamond abrasive particles subjected to surface treatment, and the consolidation effect is improved.
4. According to the continuous production process of the non-coated diamond wire, the diamond abrasive particles with the diameter 0.05-0.15 times that of the steel wire are selected, so that the protruding degree of the diamond abrasive particles is guaranteed, the gaps between the convex parts of the diamond abrasive particles and the steel wire are increased, the heat dissipation is enhanced, the aggregation of cut powder is prevented, and the cutting efficiency is guaranteed.
Drawings
FIG. 1 is a flow chart of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1, a continuous production process of non-plated diamond wires includes the following steps:
s1, sequentially penetrating the straightened steel wire through the hollow cylinders with the inner side surfaces provided with the polishing abrasive paper, and treating the steel wire to facilitate consolidation;
s2, processing the surface of the diamond abrasive grains, wherein the diameter of the diamond abrasive grains is 0.05 times of the diameter of the steel wire, the protruding degree of the diamond abrasive grains is ensured, and the processing of the surface of the diamond abrasive grains comprises the following steps: removing the non-diamond carbon layer on the surface of the single crystal diamond powder with the grain size of 5 microns by using oxidizing acid, and then carrying out surface modification treatment on the single crystal diamond powder by using organic matters so that the surface of the single crystal diamond powder can react and combine with the mixture in S4 to enhance the adsorption force and enhance the consolidation effect, wherein the oxidizing acid comprises sulfuric acid to promote the reaction, and the organic matters comprise carbonic acid to promote the reaction;
s3, mixing and stirring the resin binder and the organic solvent until the resin binder is dissolved to form a mixed solvent, and treating the resin binder to facilitate reaction;
s4, adding the processed diamond abrasive particles and SiC powder with the diameter of 3 microns into the mixed solvent, mixing and stirring the mixture uniformly, and reacting the mixture with the surface of the processed diamond abrasive particles to enhance the adsorption force;
s5, sequentially passing the processed steel wire through the mixture formed in the step S4 to enable the steel wire to be uniformly coated;
s6, curing the coated steel wire for 20 minutes at 500 ℃ for primary curing;
s7, curing the steel wire subjected to primary curing for 2 minutes under uv light, wherein the uv light is irradiated by an ultraviolet high-pressure mercury lamp and used for enhancing the curing effect;
and S8, drying the steel wire subjected to secondary curing in a constant-temperature drying oven to enhance the consolidation effect, wherein the temperature of the constant-temperature drying oven is raised to 200 ℃ within 6 hours, then the temperature is kept for 12 hours, and finally the temperature is naturally reduced to room temperature to ensure the consolidation effect.
Example two:
referring to fig. 1, a continuous production process of non-plated diamond wires includes the following steps:
s1, sequentially penetrating the straightened steel wire through the hollow cylinders with the inner side surfaces provided with the polishing abrasive paper, and treating the steel wire to facilitate consolidation;
s2, processing the surface of the diamond abrasive grains, wherein the diameter of the diamond abrasive grains is 0.15 times of the diameter of the steel wire to ensure the protrusion degree of the diamond abrasive grains, and the processing of the surface of the diamond abrasive grains comprises the following steps: removing the non-diamond carbon layer on the surface of the single crystal diamond powder with the grain size of 45 microns by using oxidizing acid, and then carrying out surface modification treatment on the single crystal diamond powder by using organic matters so that the surface of the single crystal diamond powder can react and combine with the mixture in S4 to enhance the adsorption force and enhance the consolidation effect, wherein the oxidizing acid comprises nitric acid to promote the reaction, and the organic matters comprise phospholipid to promote the reaction;
s3, mixing and stirring the resin binder and the organic solvent until the resin binder is dissolved to form a mixed solvent, and treating the resin binder to facilitate reaction;
s4, adding the processed diamond abrasive particles and SiC powder with the diameter of 4 microns into the mixed solvent, mixing and stirring the mixture uniformly, and reacting the mixture with the surface of the processed diamond abrasive particles to enhance the adsorption force;
s5, sequentially passing the processed steel wire through the mixture formed in the step S4 to enable the steel wire to be uniformly coated;
s6, curing the coated steel wire for 25 minutes at 900 ℃ for primary curing;
s7, curing the steel wire subjected to primary curing for 3 minutes under uv light, wherein the uv light is irradiated by an ultraviolet high-pressure mercury lamp and used for enhancing the curing effect;
and S8, drying the steel wire subjected to secondary curing in a constant-temperature drying oven to enhance the consolidation effect, wherein the temperature of the constant-temperature drying oven is raised to 400 ℃ within 36 hours, then the temperature is kept for 24 hours, and finally the temperature is naturally reduced to room temperature to ensure the consolidation effect.
In conclusion, the continuous production process of the non-plated diamond wire enhances the strength of the steel wire through polishing and various curing treatments, and reduces the fracture rate of the steel wire. The diamond abrasive particles are solidified on the steel wire by adopting a resin bonding agent and a high-temperature, uv light and dry solidification mode, a complex and high-cost electroplating mode is not required to be selected, the cost is reduced, and the health of people is also ensured. The adsorption effect of the diamond abrasive particles and the resin bonding agent is increased by adopting a resin bonding agent mode and using the diamond abrasive particles with the surface treated, and the consolidation effect is improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A continuous production process of non-plated diamond wires is characterized by comprising the following steps: the method comprises the following steps:
s1, sequentially penetrating the straightened steel wire through the hollow cylinders with the inner side surfaces provided with the polishing abrasive paper;
s2, processing the surface of the diamond abrasive particle;
s3, mixing and stirring the resin binder and the organic solvent until the resin binder is dissolved to form a mixed solvent;
s4, adding the processed diamond abrasive particles and SiC powder with the diameter of 3-4 microns into the mixed solvent, and mixing and stirring the mixture uniformly;
s5, sequentially passing the processed steel wire through the mixture formed in the step S4 to enable the steel wire to be uniformly coated;
s6, curing the coated steel wire for 20-25 minutes under the conditions of 500-900 ℃;
s7, curing the steel wire subjected to primary curing for 2-3 minutes under uv light;
and S8, drying the steel wire after the secondary curing in a drying box at constant temperature.
2. The continuous production process of the non-coated diamond wire according to claim 1, which is characterized in that: the step of processing the surface of the diamond abrasive particles comprises the following steps: removing the non-diamond carbon layer on the surface of the monocrystalline diamond powder with the grain size of 5-45 microns by using oxidizing acid, and then carrying out surface modification treatment on the monocrystalline diamond powder by using organic matters.
3. The continuous production process of the non-coated diamond wire according to claim 1, which is characterized in that: the oxidizing acid comprises at least one of sulfuric acid, nitric acid, perchloric acid and permanganic acid.
4. The continuous production process of the non-coated diamond wire according to claim 1, which is characterized in that: the organic matter comprises at least one of carbonic acid, carbonate, cyanide and phospholipid.
5. The continuous production process of the non-coated diamond wire according to claim 1, which is characterized in that: the uv light curing is performed by irradiation of an ultraviolet high-pressure mercury lamp.
6. The continuous production process of the non-coated diamond wire according to claim 1, which is characterized in that: the diameter of the diamond abrasive particles is 0.05-0.15 times of the diameter of the steel wire.
7. The continuous production process of the non-coated diamond wire according to claim 1, which is characterized in that: the temperature of the constant-temperature drying box is raised to 200-400 ℃ within 6-36 hours, then the temperature is preserved for 12-24 hours, and finally the temperature is naturally reduced to the room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111067190.5A CN113857950A (en) | 2021-09-13 | 2021-09-13 | Continuous production process of non-plated diamond wire |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111067190.5A CN113857950A (en) | 2021-09-13 | 2021-09-13 | Continuous production process of non-plated diamond wire |
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-
2021
- 2021-09-13 CN CN202111067190.5A patent/CN113857950A/en active Pending
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|---|---|---|---|---|
| US20140246005A1 (en) * | 2011-04-05 | 2014-09-04 | Ehwa Diamond Industrial Co., Ltd. | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
| GB201209191D0 (en) * | 2011-05-27 | 2012-07-04 | Corp | Cutter constructions and method for making same |
| WO2013166976A1 (en) * | 2012-05-11 | 2013-11-14 | 香港雅诚国际有限公司 | Method for manufacturing resin diamond wire |
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Application publication date: 20211231 |