CN113851394A - Semiconductor wafer drying device - Google Patents

Semiconductor wafer drying device Download PDF

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Publication number
CN113851394A
CN113851394A CN202110939768.5A CN202110939768A CN113851394A CN 113851394 A CN113851394 A CN 113851394A CN 202110939768 A CN202110939768 A CN 202110939768A CN 113851394 A CN113851394 A CN 113851394A
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CN
China
Prior art keywords
dust
drying
semiconductor wafer
round crystal
drying chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110939768.5A
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Chinese (zh)
Inventor
向宇
向国清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhijiang Jicheng Electronics Co ltd
Original Assignee
Zhijiang Jicheng Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhijiang Jicheng Electronics Co ltd filed Critical Zhijiang Jicheng Electronics Co ltd
Priority to CN202110939768.5A priority Critical patent/CN113851394A/en
Publication of CN113851394A publication Critical patent/CN113851394A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a semiconductor wafer drying device which comprises a dust-free drying chamber, wherein a track is arranged in the dust-free drying chamber, a sliding trolley is arranged on the track, a vertical telescopic device is connected to the sliding trolley, a transverse telescopic device is connected to the vertical telescopic device, and a negative pressure suction device is arranged on the transverse telescopic device; the middle part of the dust-free drying chamber is provided with a plurality of drying frames, one end of the dust-free drying chamber is provided with a feeding disc, the other end of the dust-free drying chamber is provided with a discharging disc, and the feeding disc and the discharging disc are both connected with stretching devices; the drying rack comprises a material plate which is arranged from top to bottom, and a plurality of round crystal placing grooves are formed in the material plate. A plurality of air holes are formed at the bottom of the round crystal placing groove. The invention realizes the automatic material taking and drying operation of the round crystal, effectively prevents the risk of easily scratching the round crystal in the transfer process, fully dries the round crystal, has high efficiency and effectively prevents the risk of easily substituting dust to pollute the round crystal when people enter a workshop to influence the drying of the round crystal.

Description

Semiconductor wafer drying device
Technical Field
The invention belongs to the field of semiconductors, and particularly relates to a semiconductor wafer drying device.
Background
Wafer (Wafer) refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, and is called a Wafer because it has a circular shape. Wafers are carriers used in the production of integrated circuits, and in general, wafers are referred to as single crystal silicon wafers. The monocrystalline silicon wafer is drawn and refined by common silica sand, a monocrystalline silicon rod is prepared by a series of measures of dissolution, purification and distillation, and the monocrystalline silicon rod becomes a wafer after being polished and sliced.
A layer of Al of about 2um is adhered on the surface of the wafer2O3And glycerol mixed liquor protection, and chemical etching and surface cleaning are required before use. But present drying device all is that the manual work puts into the stoving incasement with the wafer, then the manual work takes out, leads to drying efficiency lower, and the manual work is put into and the in-process of taking out is easy with the wafer surface fish tail.
Disclosure of Invention
In order to solve the problems, the invention discloses a semiconductor wafer drying device. The invention realizes the automatic material taking and drying operation of the round crystal, effectively prevents the risk of easily scratching the round crystal in the transfer process, fully dries the round crystal, has high efficiency and effectively prevents the risk of easily substituting dust to pollute the round crystal when people enter a workshop to influence the drying of the round crystal.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a semiconductor wafer drying device comprises a dust-free drying chamber, wherein a track is arranged in the dust-free drying chamber, a sliding trolley is arranged on the track, a vertical telescopic device is connected to the sliding trolley, the vertical telescopic device is connected to a transverse telescopic device, and a negative pressure suction device is arranged on the transverse telescopic device; the middle part of the dust-free drying chamber is provided with a plurality of drying frames, one end of the dust-free drying chamber is provided with a feeding disc, the other end of the dust-free drying chamber is provided with a discharging disc, and the feeding disc and the discharging disc are both connected with stretching devices; the drying rack comprises a material plate which is arranged from top to bottom, and a plurality of round crystal placing grooves are formed in the material plate. A plurality of air holes are formed at the bottom of the round crystal placing groove.
In a further improvement, a plurality of bumps are formed at the bottom of the round crystal placing groove in a lifting mode.
In a further refinement, the number of projections is at least three.
In a further improvement, the vertical telescopic device, the transverse telescopic device and the stretching device are all air cylinders or screw rod mechanisms.
In a further improvement, the negative pressure suction device comprises a sucker which is communicated with an air pipe, and the air pipe is communicated with a negative pressure pump.
In a further improvement, an elastic ring is fixed at the edge of the sucker.
In a further improvement, doors are arranged at the feeding disc and the discharging disc.
The invention has the advantages that:
the invention realizes the automatic material taking and drying operation of the round crystal, effectively prevents the risk of easily scratching the round crystal in the transfer process, fully dries the round crystal, has high efficiency and effectively prevents the risk of easily substituting dust to pollute the round crystal when people enter a workshop to influence the drying of the round crystal.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic top view of a cleanroom oven.
Detailed Description
The invention is further explained with reference to the drawings and the embodiments.
Examples
As shown in fig. 1 and 2, the semiconductor wafer drying device includes a dust-free drying chamber 1, a rail 2, a sliding trolley 3, a vertical expansion device 4, a horizontal expansion device 5, a negative pressure suction device 6, a suction cup 61, an air pipe 62, a negative pressure pump 63, an elastic ring 64, a drying rack 7, a feeding disk 8, a discharging disk 9, a stretching device 10, a material plate 11, a wafer placing groove 12, air holes 13, and bumps 14.
The dust-free drying room 1 is internally provided with a track 2, the track 2 is provided with a sliding trolley 3, the sliding trolley 3 is connected with a vertical telescopic device 4, the vertical telescopic device 4 is connected with a transverse telescopic device 5, and the transverse telescopic device 5 is provided with a negative pressure suction device 6; the middle part of the dust-free drying chamber 1 is provided with a plurality of drying frames 7, one end of the dust-free drying chamber 1 is provided with a feeding disc 8, the other end of the dust-free drying chamber is provided with a discharging disc 9, and the feeding disc 8 and the discharging disc 9 are both connected with stretching devices 10; the drying rack 7 comprises a material plate 11 arranged from top to bottom, and a plurality of round crystal placing grooves 12 are formed in the material plate 11. A plurality of air holes 13 are formed at the bottom of the round crystal placing groove 12. The bottom of the round crystal placing groove 12 is formed with more than three lugs 14 which are evenly raised along the circumferential direction. The vertical telescopic device 4, the horizontal telescopic device 5 and the stretching device 10 are all screw rod mechanisms, and can be replaced by air cylinders.
Wherein, the silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent. The polysilicon is melted by the wafer fab, a small silicon crystal seed is doped into the solution, and then it is slowly pulled out to form a cylindrical monocrystalline silicon ingot, which is called "grain growth" because the silicon ingot is gradually grown from a small grain in the molten silicon feedstock. The silicon crystal bar is ground, polished and sliced to obtain a silicon wafer which is a basic raw material of an integrated circuit factory and is a wafer. The wafer is preserved by using Al2O3And coating and protecting with glycerin mixture. After cleaning the wafer with the cleaning solution, the cleaned semiconductor wafer is placed on the feeding tray 8 to be stacked, then the sliding trolley 3 slides to the corresponding position to suck the wafer through the suction cup 61, and the buffering is realized through the elastic ring 64 to prevent the surface of the wafer from being scratched. Then the sliding trolley 3 moves to the corresponding drying rack 7, and the round crystal is placed in the empty round crystal placing groove 12. Because the air holes and the convex blocks of the round crystal placing groove 12, the bottom and the top of the round crystal are fully contacted with hot air, so that the drying effect of the top and the bottom is ensured, and the drying speed of the round crystal is accelerated. The dried round crystal is sucked out by the sucking disc 61 and put into the discharging disc 9, the discharging disc 9 extends out, and the round crystal on the discharging disc is taken away by other manipulators, so that the drying of the round crystal is completed.
The negative pressure suction device 6 comprises a suction cup 61, the suction cup 61 is communicated with an air pipe 62, and the air pipe 62 is communicated with a negative pressure pump 63. An elastic ring 64 is fixed to the edge of the suction cup 61 for buffering. Doors are arranged at the feeding disc 8 and the discharging disc 9.
While embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the specification and the embodiments, which are fully applicable to various fields of endeavor for which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.

Claims (7)

1. A semiconductor wafer drying device is characterized by comprising a dust-free drying chamber (1), wherein a track (2) is installed in the dust-free drying chamber (1), a sliding trolley (3) is installed on the track (2), a vertical telescopic device (4) is connected to the sliding trolley (3), a transverse telescopic device (5) is connected to the vertical telescopic device (4), and a negative pressure suction device (6) is installed on the transverse telescopic device (5); the middle part of the dust-free drying chamber (1) is provided with a plurality of drying frames (7), one end of the dust-free drying chamber (1) is provided with a feeding disc (8), the other end of the dust-free drying chamber is provided with a discharging disc (9), and the feeding disc (8) and the discharging disc (9) are both connected with stretching devices (10); the drying rack (7) comprises a material plate (11) which is arranged from top to bottom, and a plurality of round crystal placing grooves (12) are formed in the material plate (11). A plurality of air holes (13) are formed at the bottom of the round crystal placing groove (12).
2. The semiconductor wafer drying apparatus according to claim 1, wherein a plurality of bumps (14) are formed by lifting the bottom of the wafer placing groove (12).
3. The semiconductor wafer drying apparatus according to claim 2, wherein the number of the bumps (14) is at least three.
4. The semiconductor wafer drying device according to claim 1, wherein the vertical stretching device (4), the horizontal stretching device (5) and the stretching device (10) are all air cylinders or screw rod mechanisms.
5. The semiconductor wafer drying device according to claim 1, wherein the negative pressure suction device (6) comprises a suction cup (61), the suction cup (61) is communicated with a gas pipe (62), and the gas pipe (62) is communicated with a negative pressure pump (63).
6. The semiconductor wafer drying apparatus according to claim 5, wherein an elastic ring (64) is fixed to an edge of the suction cup (61).
7. The semiconductor wafer drying apparatus according to claim 1, wherein doors are installed at the feeding tray (8) and the discharging tray (9).
CN202110939768.5A 2021-08-16 2021-08-16 Semiconductor wafer drying device Pending CN113851394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110939768.5A CN113851394A (en) 2021-08-16 2021-08-16 Semiconductor wafer drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110939768.5A CN113851394A (en) 2021-08-16 2021-08-16 Semiconductor wafer drying device

Publications (1)

Publication Number Publication Date
CN113851394A true CN113851394A (en) 2021-12-28

Family

ID=78975516

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110939768.5A Pending CN113851394A (en) 2021-08-16 2021-08-16 Semiconductor wafer drying device

Country Status (1)

Country Link
CN (1) CN113851394A (en)

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