CN113845859A - MiniLED organosilicon grid exhaust adhesive tape and preparation method thereof - Google Patents
MiniLED organosilicon grid exhaust adhesive tape and preparation method thereof Download PDFInfo
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- CN113845859A CN113845859A CN202110956158.6A CN202110956158A CN113845859A CN 113845859 A CN113845859 A CN 113845859A CN 202110956158 A CN202110956158 A CN 202110956158A CN 113845859 A CN113845859 A CN 113845859A
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims description 15
- 239000012790 adhesive layer Substances 0.000 claims abstract description 66
- 239000000853 adhesive Substances 0.000 claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 claims abstract description 61
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 59
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 59
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 46
- 239000010703 silicon Substances 0.000 claims abstract description 46
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 34
- 239000011737 fluorine Substances 0.000 claims abstract description 34
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000003999 initiator Substances 0.000 claims abstract description 16
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 10
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 claims abstract description 10
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 10
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 10
- KILOQDFVZVULLJ-UHFFFAOYSA-L [Pt](Cl)Cl.C(C)P(CC)CC Chemical compound [Pt](Cl)Cl.C(C)P(CC)CC KILOQDFVZVULLJ-UHFFFAOYSA-L 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 26
- 238000003756 stirring Methods 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 238000005303 weighing Methods 0.000 claims description 7
- NTNLSICUQDSUMN-UHFFFAOYSA-N 2-(2-benzoylphenoxy)acetic acid Chemical compound OC(=O)COC1=CC=CC=C1C(=O)C1=CC=CC=C1 NTNLSICUQDSUMN-UHFFFAOYSA-N 0.000 claims description 4
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 claims description 2
- 239000002699 waste material Substances 0.000 abstract description 3
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 5
- 230000032683 aging Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a MiniLED organosilicon grid exhaust adhesive tape, which comprises a PET (polyethylene terephthalate) base material, a first adhesive layer, a second adhesive layer, a fluorine release film and a grid fluorine release film, wherein the first adhesive layer and the second adhesive layer are respectively attached to two sides of the PET base material; the first adhesive layer and the second adhesive layer are both obtained by coating organic silicon adhesive on a PET (polyethylene terephthalate) base material, and the organic silicon adhesive comprises the following components in parts by weight: vinyl-terminated dimethylpolysiloxane, vinyl resin, acrylic acid, dimethylaniline, hydroxyl-terminated polybutadiene, p-hydroxybenzene sulfonic acid, n-butyl isooctyl phthalate, cis-bis (triethylphosphorus) platinum dichloride, an initiator, a silane coupling agent and a filler. The invention improves the air exhaust property of the adhesive, and can be reworked due to moderate adhesive force, thereby reducing the material waste and loss.
Description
Technical Field
The invention belongs to the technical field of adhesive tape preparation, and particularly relates to a MiniLED organosilicon grid exhaust adhesive tape and a preparation method thereof.
Background
The MiniLED or the MicroLED is a display technology which adopts the traditional LED structure to be thinned, miniaturized and matrixed, and adopts the PCB, the flexible PCB, the CMOS/TFT integrated circuit process and the like to manufacture a driving circuit so as to realize the addressing control and the independent driving of each pixel point in the LED backlight source. Because various indexes such as brightness, contrast, reaction time, visual angle, resolution ratio and the like of the Mini LED technology are stronger than those of an LCD, and the Mini LED technology has attracted extensive attention in addition to the advantages of self-luminescence, simple structure, small volume and energy conservation.
After the Mini LED lamp panel is manufactured, the Mini LED lamp panel and the supporting aluminum plate are bonded and attached through double-sided adhesive tapes, the Mini LED lamp panel is very weak and cannot be attached in a high-pressure mode, and bubbles are easily generated in a low-pressure attaching mode, so that the problem of bubbles after attachment can be solved through the low-pressure attaching mode and through the air discharging performance of self organic silicon and grids after attachment. And because the adhesive force is moderate, the product can be repaired, and the aging performance of the organic silicon is good, so that the reliability of the product can be further improved.
Disclosure of Invention
The invention aims to provide a Mini LED organosilicon grid exhaust adhesive tape and a preparation method thereof, when a Mini LED lamp panel is attached to a supporting aluminum plate, the grid exhaust effect is better by virtue of excellent exhaust property of organosilicon, and no bubbles are generated after the Mini LED lamp panel is attached in a low-pressure attaching mode; and because its adhesive force is moderate, when the reason causes the laminating badly because of the process counterpoint, etc. in the course of laminating, can reprocess. And by virtue of excellent aging performance of the organic silicon, the reliability of the product can be ensured.
In order to achieve the purpose, the invention adopts the technical scheme that: a MiniLED organosilicon grid exhaust adhesive tape comprises a PET substrate, a first adhesive layer, a second adhesive layer, a fluorine release film and a grid fluorine release film, wherein the first adhesive layer and the second adhesive layer are respectively attached to two sides of the PET substrate;
the first adhesive layer and the second adhesive layer are both obtained by coating organic silicon adhesive on a PET (polyethylene terephthalate) base material, and the organic silicon adhesive comprises the following components in parts by weight:
the technical scheme of further improvement in the technical scheme is as follows:
1. in the above scheme, the initiator is one selected from polytetramethylene glycol 250 bis- (2-carboxymethoxybenzophenone) ester, 4-benzoyl-4' -methyl-diphenyl sulfide, and bis (4- (diphenylsulfonium) phenyl) sulfide-bis hexafluorophosphate.
2. In the scheme, the silane coupling agent is selected from one of silane coupling agents CG501, KBM-602 and KH-630.
3. In the scheme, the thicknesses of the first adhesive layer and the second adhesive layer are both 20-25 mu m, and the adhesive force is both 300-500 g.
4. In the scheme, the thickness of the PET base material is 12-50 μm.
5. In the scheme, the grid shape of the grid fluorine release film is square or rhombic, and the length and the width of the grid are both 0.5 mm-2 mm.
The invention adopts another technical scheme that: a preparation method of a MiniLED silicone grid exhaust adhesive tape comprises the following steps:
s1, preparing an organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) substrate, baking the organic silicon layer adhesive in an oven to obtain a first adhesive layer, and attaching a fluorine release film;
and S3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate in the S2, baking the organic silicon layer adhesive in an oven to prepare a second adhesive layer, and attaching a grid fluorine release film to obtain a finished product of the multilayer structure adhesive tape.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the above scheme, the preparation method of the silicone adhesive in step S1 includes the following steps:
s01, weighing the components in parts by weight, sequentially adding 100 parts of vinyl-terminated dimethyl polysiloxane, 30-50 parts of vinyl resin, 25-50 parts of acrylic acid and 12-20 parts of dimethylaniline into a mixing kettle, stirring, adding 0.01-0.05 part of cis-bis (triethylphosphine) dichloride platinum, heating to 40-60 ℃, and continuing stirring for 30 min;
s02, cooling the mixed material obtained in the step S1 to 30-35 ℃, sequentially adding 5-8 parts of hydroxyl polybutadiene, 1-3 parts of p-hydroxyphenylsulfonic acid, 1-5 parts of n-butyl isooctyl phthalate, 1-5 parts of an initiator, 0.5-5 parts of a silane coupling agent and 2-8 parts of a filler, uniformly stirring, and reacting at 50-80 ℃ for 20-30 min to obtain the organic silicon adhesive.
2. In the scheme, the rotating speed of the stirring kettle in the step S01 is 600-800 RPM.
3. In the scheme, the baking oven temperature in the steps S2 and S3 is 120-160 ℃, and the baking time is 1-4 min.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the MiniLED organosilicon grid exhaust adhesive tape and the preparation method thereof, due to the fact that dimethyl aniline, p-hydroxybenzene sulfonic acid and n-butyl isooctyl phthalate are added into vinyl-terminated dimethyl polysiloxane, vinyl resin and acrylic acid, the exhaust performance of the adhesive is improved, and when poor adhesion dislocation, wrinkle, concave-convex effect and the like are caused by factors such as process alignment, operation abnormity and the like in the adhesion process, due to the fact that the adhesive force is moderate, rework can be conducted to reduce material waste and loss, meanwhile, the adhesive has excellent aging performance, and the reliability of a product in the use process can be guaranteed.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
The figures are labeled as follows:
1. a PET substrate; 2. a first glue layer; 3. a second adhesive layer; 4. a fluorine release film; 5 grid fluorine release film.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
The invention is further described below with reference to the following examples:
examples 1 to 4: a MiniLED organosilicon grid exhaust adhesive tape comprises a PET substrate 1, a first adhesive layer 2, a second adhesive layer 3, a fluorine release film 4 and a grid fluorine release film 5, wherein the first adhesive layer 2 and the second adhesive layer 3 are respectively attached to two sides of the PET substrate 1, the fluorine release film 4 is attached to one side of the first adhesive layer 2, which is far away from the PET substrate 1, and the grid fluorine release film 5 is attached to one side of the second adhesive layer 3, which is far away from the PET substrate 1;
the first adhesive layer 2 and the second adhesive layer 3 are both obtained by coating an organic silicon adhesive on a PET (polyethylene terephthalate) substrate 1, wherein the organic silicon adhesive comprises the following components in parts by weight, as shown in Table 1:
TABLE 1
In the embodiment 1, the initiator is selected from polytetramethylene glycol 250 bis- (2-carboxymethoxybenzophenone) ester, and the silane coupling agent is a silane coupling agent CG 501; the thickness of the PET base material is 12 micrometers, the thickness of the first adhesive layer and the thickness of the second adhesive layer are both 20 micrometers, and the adhesive force is 300 g.
The preparation method of the MiniLED organosilicon grid exhaust adhesive tape comprises the following steps:
s1, preparing an organic silicon adhesive;
s01, weighing the components in parts by weight, sequentially adding vinyl-terminated dimethyl polysiloxane, vinyl resin, acrylic acid and dimethylaniline into a mixing kettle, stirring at the rotating speed of 600RPM, adding cis-bis (triethylphosphine) platinum dichloride, heating to 60 ℃, and continuing to stir for 30 min;
s02, cooling the mixed material obtained in the step S1 to a preset temperature, sequentially adding hydroxyl polybutadiene, p-hydroxybenzene sulfonic acid, n-butyl isooctyl phthalate, an initiator, a silane coupling agent and a filler, uniformly stirring, and reacting at 60 ℃ for 20min to obtain the organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) substrate 1, baking in an oven at the temperature of 120 ℃ for 2min to obtain a first adhesive layer 2, and attaching a fluorine release film 4;
and S3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate 1 in the S2, baking in an oven at the temperature of 130 ℃ for 2min to prepare a second adhesive layer 3, and attaching a grid fluorine release film 5 to obtain a finished product of the multilayer adhesive tape.
In the embodiment 2, the initiator is selected from 4-benzoyl-4' -methyl-diphenyl sulfide, and the silane coupling agent is a silane coupling agent KH-630; the thickness of the PET base material is 25 micrometers, the thickness of the first adhesive layer and the thickness of the second adhesive layer are both 25 micrometers, and the adhesive force is both 500 g.
The preparation method of the MiniLED organosilicon grid exhaust adhesive tape comprises the following steps:
s1, preparing an organic silicon adhesive;
s01, weighing the components in parts by weight, sequentially adding vinyl-terminated dimethyl polysiloxane, vinyl resin, acrylic acid and dimethylaniline into a mixing kettle, stirring at the rotating speed of 650RPM, adding cis-bis (triethylphosphine) platinum dichloride, heating to 45 ℃, and continuing to stir for 30 min;
s02, cooling the mixed material obtained in the step S1 to a preset temperature, sequentially adding hydroxyl polybutadiene, p-hydroxybenzene sulfonic acid, n-butyl isooctyl phthalate, an initiator, a silane coupling agent and a filler, uniformly stirring, and reacting at 80 ℃ for 20min to obtain the organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) substrate 1, baking in an oven at the temperature of 120 ℃ for 1min to obtain a first adhesive layer 2, and attaching a fluorine release film 4;
and S3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate 1 in the S2, baking in an oven at the temperature of 120 ℃ for 1min to prepare a second adhesive layer 3, and attaching a grid fluorine release film 5 to obtain a finished product of the multilayer adhesive tape.
In the embodiment 3, the initiator is selected from bis (4- (diphenyl sulfonium) phenyl) sulfide-bis hexafluorophosphate, and the silane coupling agent is a silane coupling agent CG 501; the thickness of the PET base material is 12-50 mu m, the thickness of the first adhesive layer and the thickness of the second adhesive layer are 22 mu m, and the adhesive force is 350 g.
The preparation method of the MiniLED organosilicon grid exhaust adhesive tape comprises the following steps:
s1, preparing an organic silicon adhesive;
s01, weighing the components in parts by weight, sequentially adding vinyl-terminated dimethyl polysiloxane, vinyl resin, acrylic acid and dimethylaniline into a mixing kettle, stirring at the rotating speed of 800RPM, adding cis-bis (triethylphosphine) dichloride platinum, heating to 60 ℃, and continuing to stir for 30 min;
s02, cooling the mixed material obtained in the step S1 to a preset temperature, sequentially adding hydroxyl polybutadiene, p-hydroxybenzene sulfonic acid, n-butyl isooctyl phthalate, an initiator, a silane coupling agent and a filler, uniformly stirring, and reacting at 50 ℃ for 25min to obtain the organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) substrate 1, baking in an oven at the temperature of 150 ℃ for 4min to obtain a first adhesive layer 2, and attaching a fluorine release film 4;
s3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate 1 in the S2, baking in an oven at the temperature of 120 ℃ for 4min to obtain a second adhesive layer 3, and attaching a grid fluorine release film 5 to obtain a multilayer adhesive tape finished product
In example 4, the initiator is selected from polytetramethylene glycol 250 bis- (2-carboxymethoxybenzophenone) ester, and the silane coupling agent is KBM-602 silane coupling agent; the thickness of the PET base material is 50 micrometers, the thickness of the first adhesive layer and the thickness of the second adhesive layer are both 25 micrometers, and the adhesive force is both 500 g.
The preparation method of the MiniLED organosilicon grid exhaust adhesive tape comprises the following steps:
s1, preparing an organic silicon adhesive;
s01, weighing the components in parts by weight, sequentially adding vinyl-terminated dimethyl polysiloxane, vinyl resin, acrylic acid and dimethylaniline into a mixing kettle, stirring at the rotating speed of 600RPM, adding cis-bis (triethylphosphine) platinum dichloride, heating to 40 ℃, and continuing to stir for 30 min;
s02, cooling the mixed material obtained in the step S1 to a preset temperature, sequentially adding hydroxyl polybutadiene, p-hydroxybenzene sulfonic acid, n-butyl isooctyl phthalate, an initiator, a silane coupling agent and a filler, uniformly stirring, and reacting at 55 ℃ for 25min to obtain the organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) substrate 1, baking in an oven at the temperature of 120 ℃ for 1min to obtain a first adhesive layer 2, and attaching a fluorine release film 4;
s3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate 1 in the S2, baking in an oven at the temperature of 160 ℃ for 1min to obtain a second adhesive layer 3, and attaching a grid fluorine release film 5 to obtain a multilayer adhesive tape finished product
In the embodiment 5, the initiator is selected from 4-benzoyl-4' -methyl-diphenyl sulfide, and the silane coupling agent is a silane coupling agent KH-630; the thickness of the PET base material is 50 μm, the thickness of the first adhesive layer and the thickness of the second adhesive layer are both 20 μm, and the adhesive force is 400 g.
The preparation method of the MiniLED organosilicon grid exhaust adhesive tape comprises the following steps:
s1, preparing an organic silicon adhesive;
s01, weighing the components in parts by weight, sequentially adding vinyl-terminated dimethyl polysiloxane, vinyl resin, acrylic acid and dimethylaniline into a mixing kettle, stirring at the rotating speed of 700RPM, adding cis-bis (triethylphosphine) dichloride platinum, heating to 50 ℃, and continuing to stir for 30 min;
s02, cooling the mixed material obtained in the step S1, sequentially adding hydroxyl polybutadiene, p-hydroxybenzene sulfonic acid, n-butyl isooctyl phthalate, an initiator, a silane coupling agent and a filler, uniformly stirring, and reacting at 60 ℃ for 20-30 min to obtain the organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) substrate 1, baking in an oven at the temperature of 130 ℃ for 3min to obtain a first adhesive layer 2, and attaching a fluorine release film 4;
and S3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate 1 in the S2, baking in an oven at the temperature of 150 ℃ for 2min to prepare a second adhesive layer 3, and attaching a grid fluorine release film 5 to obtain a finished product of the multilayer adhesive tape.
Comparative examples 1 to 2: an organic silicon adhesive tape comprises a PET (polyethylene terephthalate) substrate 1, a first adhesive layer 2, a second adhesive layer 3, a fluorine release film 4 and a grid fluorine release film 5, wherein the first adhesive layer 2 and the second adhesive layer 3 are respectively attached to two sides of the PET substrate 1, the fluorine release film 4 is attached to one side, away from the PET substrate 1, of the first adhesive layer 2, and the grid fluorine release film 5 is attached to one side, away from the PET substrate 1, of the second adhesive layer 3;
the first adhesive layer 2 and the second adhesive layer 3 are both obtained by coating an organic silicon adhesive on a PET (polyethylene terephthalate) substrate 1, wherein the organic silicon adhesive comprises the following components in parts by weight, as shown in Table 2:
TABLE 2
| Components | Example 1 | Example 2 |
| Vinyl terminated dimethylpolysiloxane | 100 portions of | 100 portions of |
| Vinyl resin | 45 portions of | 40 portions of |
| Acrylic acid | 23 portions of | 25 portions of |
| Dimethylaniline | - | 18 portions of |
| Hydroxyl-terminated |
5 portions of | 6 portions of |
| P-hydroxybenzene sulfonic acid | 2.5 parts of | - |
| N- |
5 portions of | - |
| Cis-bis (triethylphosphine) platinum dichloride | 0.02 portion | 0.05 |
| Initiator | ||
| 3 portions of | 2.5 parts of | |
| |
4 portions of | 0.5 |
| Filler material | ||
| 2 portions of | 6 portions of |
Comparative example the procedure was as in example.
The properties of the organic silica gel tape prepared in examples 1 to 5 and comparative examples 1 to 2 are shown in table 3:
TABLE 3
The detection method comprises the following steps:
1) and (3) testing adhesive force: cutting the sample into a width of 25mm and a length of 300 mm; the sheet was bonded to glass/PET/sus, and the end was clamped to a tensile jig of a tensile machine (Aiander tensile machine), peeled at a speed of 300mm/min, and 5 sets of data were measured to determine the average value.
2) And (3) testing the air exhaust property: cutting the sample into 150mm by 150 mm; attaching to glass, standing for 20min, and observing whether bubbles exist.
As shown in the evaluation results of Table 3, the silicone tapes of the examples have moderate adhesive force, are not easy to fall off in the attaching process, are easy to peel off in the repairing process, and can be reworked to reduce the waste loss of materials, while the comparative example 1 has too low adhesive force, is easy to fall off in the practical process to influence the service performance, and the comparative example 2 has adhesive force Thailand and cannot be reworked; meanwhile, the organic silica gel tape prepared by the embodiment does not generate bubbles in the attaching process, has excellent air exhaust performance, reduces defective products caused by the bubbles in the using process, and improves the yield of products; therefore, the invention not only adjusts the adhesive force of the adhesive layer, but also improves the air discharge property and improves the yield and the performance of the product.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. A MiniLED organosilicon net exhaust sticky tape which characterized in that: the adhesive tape comprises a PET (polyethylene terephthalate) base material (1), a first adhesive layer (2), a second adhesive layer (3), a fluorine release film (4) and a grid fluorine release film (5), wherein the first adhesive layer (2) and the second adhesive layer (3) are respectively attached to two sides of the PET base material (1), the fluorine release film (4) is attached to one side, deviating from the PET base material (1), of the first adhesive layer (2), and the grid fluorine release film (5) is attached to one side, deviating from the PET base material (1), of the second adhesive layer (3);
the first adhesive layer (2) and the second adhesive layer (3) are both obtained by coating an organic silicon adhesive on a PET (polyethylene terephthalate) base material (1), and the organic silicon adhesive comprises the following components in parts by weight:
2. the MiniLED silicone grid vent tape of claim 1, wherein: the initiator is selected from one of polytetramethylene glycol 250 bis- (2-carboxymethoxybenzophenone) ester, 4-benzoyl-4' -methyl-diphenyl sulfide and bis (4- (diphenyl sulfonium) phenyl) sulfide-bis hexafluorophosphate.
3. The MiniLED silicone grid vent tape of claim 1, wherein: the silane coupling agent is selected from one of silane coupling agents CG501, KBM-602 and KH-630.
4. The MiniLED silicone grid vent tape of claim 1, wherein: the thickness of the first adhesive layer (2) and the thickness of the second adhesive layer (3) are both 20-25 micrometers, and the adhesive force is 300-500 g.
5. The MiniLED silicone grid vent tape of claim 1, wherein: the thickness of the PET base material (1) is 12-50 mu m.
6. The MiniLED silicone grid vent tape of claim 1, wherein: the grid shape of the grid fluorine release film (5) is square or rhombic, and the length and the width of the grid are both 0.5 mm-2 mm.
7. The preparation method of the MiniLED silicone grid exhaust adhesive tape as claimed in any one of claims 1 to 6, which is characterized in that: the method comprises the following steps:
s1, preparing an organic silicon adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a PET (polyethylene terephthalate) base material (1), baking the organic silicon layer adhesive in an oven to obtain a first adhesive layer (2), and attaching a fluorine release film (4);
and S3, coating the prepared organic silicon layer adhesive on the other side of the PET substrate (1) in the S2, baking in an oven to prepare a second adhesive layer (3), and attaching a grid fluorine release film (5) to obtain a finished product of the multilayer structure adhesive tape.
8. The MiniLED silicone grid vent tape of claim 7, wherein: the preparation method of the organic silicon adhesive in the step S1 comprises the following steps:
s01, weighing the components in parts by weight, sequentially adding 100 parts of vinyl-terminated dimethyl polysiloxane, 30-50 parts of vinyl resin, 25-50 parts of acrylic acid and 12-20 parts of dimethylaniline into a mixing kettle, stirring, adding 0.01-0.05 part of cis-bis (triethylphosphine) dichloride platinum, heating to 40-60 ℃, and continuing stirring for 30 min;
s02, cooling the mixed material obtained in the step S1 to 30-35 ℃, sequentially adding 5-8 parts of hydroxyl polybutadiene, 1-3 parts of p-hydroxyphenylsulfonic acid, 1-5 parts of n-butyl isooctyl phthalate, 1-5 parts of an initiator, 0.5-5 parts of a silane coupling agent and 2-8 parts of a filler, uniformly stirring, and reacting at 50-80 ℃ for 20-30 min to obtain the organic silicon adhesive.
9. The method of claim 8, wherein the adhesive tape comprises the following components: and in the step S01, the rotating speed of the stirring kettle is 600-800 RPM.
10. The method of claim 7 for making a MiniLED silicone mesh vent tape, wherein: the temperature of the baking oven in the steps S2 and S3 is 120-160 ℃, and the baking time is 1-4 min.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024191582A1 (en) * | 2023-03-15 | 2024-09-19 | Applied Materials, Inc. | Method of laminating an interposer for die transfer substrates |
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| CN105860924A (en) * | 2016-05-08 | 2016-08-17 | 王义金 | Communication optical cable joint box sealant |
| CN107286899A (en) * | 2017-05-19 | 2017-10-24 | 合肥市惠科精密模具有限公司 | A kind of Micro LED screens are encapsulated with high-strength anti-aging silica gel |
| CN108239489A (en) * | 2018-02-01 | 2018-07-03 | 昆山汉品电子有限公司 | The manufacturing method of PET exhaust glued membranes and PET exhaust glued membranes |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860924A (en) * | 2016-05-08 | 2016-08-17 | 王义金 | Communication optical cable joint box sealant |
| CN107286899A (en) * | 2017-05-19 | 2017-10-24 | 合肥市惠科精密模具有限公司 | A kind of Micro LED screens are encapsulated with high-strength anti-aging silica gel |
| CN108239489A (en) * | 2018-02-01 | 2018-07-03 | 昆山汉品电子有限公司 | The manufacturing method of PET exhaust glued membranes and PET exhaust glued membranes |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024191582A1 (en) * | 2023-03-15 | 2024-09-19 | Applied Materials, Inc. | Method of laminating an interposer for die transfer substrates |
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Application publication date: 20211228 |