CN113842490A

CN113842490A - Micro active fog ion generating chip

Info

Publication number: CN113842490A
Application number: CN202111410783.7A
Authority: CN
Inventors: 肖志国
Original assignee: Beijing Fu Yun Cloud Data Technology Co ltd
Current assignee: Beijing Fuleyun Technology Co ltd
Priority date: 2021-11-25
Filing date: 2021-11-25
Publication date: 2021-12-28

Abstract

The invention discloses a micro active fog ion generating chip, relating to the technical field of air disinfection, wherein a device body comprises a circuit board, a refrigerating piece, a lower electrode plate and an upper electrode plate; refrigeration piece is located circuit board upper portion central point and puts the department, refrigeration piece lower surface and circuit board upper surface welded, and the positive negative pole of refrigeration piece and the electroplating through-hole interconnect on the circuit board, lower electrode piece lower surface and refrigeration piece upper surface welded, the mounting groove has been seted up on circuit board upper portion, fixed mounting has the voltage subassembly in the mounting groove, circuit board apex angle position department has seted up the wiring hole, every wiring hole fixedly connected with support column, every support column upper end all with last electrode piece lower surface welded, and go up the electrode piece and be located under the electrode piece directly over, and have the clearance down between the electrode piece, the mutual adaptation of structure of electrode piece and last electrode piece down, the support column mainly plays the effect of supporting last electrode piece. The invention is a micro active fog ion generating chip, which has small volume, simple structure and good use effect.

Description

Micro active fog ion generating chip

Technical Field

The invention relates to the technical field of air disinfection, in particular to a micro active mist ion generation chip.

Background

Along with the development of society, liquid atomization technology is more and more emphasized, the effect of the liquid atomization technology on the aspects of saving raw materials, improving the utilization efficiency of liquid, reducing pollution and the like is more and more prominent, the liquid atomization technology is widely used in the fields of industry, agriculture, aerospace and the like, atomization refers to the operation of dispersing liquid into tiny liquid drops through a nozzle or high-speed airflow, a plurality of atomized dispersed liquid drops can capture particulate matters in gas, the liquid atomization methods include pressure atomization, rotary disc atomization, gas atomization, sound wave atomization and the like, the liquid is converted into small liquid drops through a special device and is sprayed out in a foggy mode, and a liquid atomization device is needed for liquid atomization.

The integrated electrolytic atomization module and atomization device disclosed in patent No. CN111825170A comprises an electrolytic component and an atomization component, wherein the atomization component comprises a mounting seat and a flat plate atomization sheet mounted on the mounting seat, and the flat plate atomization sheet is used for atomizing liquid above the flat plate atomization sheet and spraying the liquid upwards; the electrolytic component is characterized by comprising at least one electrolytic electrode pair, namely a first electrolytic electrode and a second electrolytic electrode, wherein an electric isolation distance is arranged between the first electrolytic electrode and the second electrolytic electrode, the first electrolytic electrode and the second electrolytic electrode are connected to the mounting seat, and the projection of the electrolytic component is seen from top to bottom to avoid opening the flat atomization sheet.

The existing electrostatic atomization device has the defects of complex structure, large volume and incapability of being flexibly applied to various occasions, and therefore a micro active mist ion generation chip is provided.

Disclosure of Invention

The invention mainly aims to provide a micro active fog ion generation chip which can effectively solve the problems in the background technology.

In order to achieve the purpose, the invention adopts the technical scheme that: the micro active fog ion generating chip comprises a device body and a control system for controlling the device body, wherein the device body comprises a circuit board and a refrigerating piece; the refrigeration piece is positioned at the center of the upper part of the circuit board, the lower surface of the refrigeration piece is welded with the upper surface of the circuit board, the positive and negative electrodes of the refrigeration piece are mutually connected with the electroplating through hole on the circuit board, the lower electrode plate is positioned at the center of the upper part of the refrigeration piece, and the lower surface of the lower electrode plate is welded with the upper surface of the refrigeration piece;

the upper part of the circuit board is provided with a mounting groove, a voltage assembly is fixedly mounted in the mounting groove, wiring holes are formed in the vertex angle position of the circuit board, each wiring hole is fixedly connected with a supporting column, each supporting column is hollow, the upper end of each supporting column is welded with the lower surface of the upper electrode plate, the upper electrode plate is positioned right above the lower electrode plate, a gap is formed between the upper electrode plate and the lower electrode plate, and the structures of the lower electrode plate and the upper electrode plate are matched with each other;

the control system comprises a circuit module, a refrigeration module and an electric shock module, wherein the circuit board in the circuit module generates high voltage through a voltage assembly, transmits an electric signal to the lower electrode plate through the circuit board, transmits the electric signal to the upper electrode plate through a lead, so that a load high-voltage electric field is formed between the upper electrode plate and the lower electrode plate, the refrigeration element in the refrigeration module is an electronic element using the Peltier effect, firstly receives a current signal generated by the circuit board, generates the Peltier effect by combining a semiconductor of the refrigeration module to realize heat absorption, further realizes refrigeration, reduces the temperature of the lower electrode plate, condenses air on the upper surface of the lower electrode plate to generate condensed water, the electric shock module forms the high-voltage electric field between the lower electrode plate and the upper electrode plate, the upper surface of the lower electrode plate is provided with a conductive needle, and the load high-voltage breaks down the surface condensed water through the conductive needle to generate charged fog ions, compared with the coulomb force generated by an electric field between the upper electrode plate and the lower electrode plate, the coulomb force moves to the upper electrode plate under the action of coulomb force and is sprayed out from the fog outlet through hole of the upper electrode plate, and the support column mainly plays a role in supporting the upper electrode plate.

Preferably, the circuit board is an integrated circuit board, and the circuit board is mainly used for providing a communication circuit for the upper electrode plate, the lower electrode plate and the refrigerating element.

Preferably, the lower electrode plate is made of low-resistance and high-heat-conduction materials, the upper electrode plate is made of low-resistance materials, high voltage is loaded on the upper electrode plate and the lower electrode plate, the voltage strength is enough to break down air between the upper electrode plate and the lower electrode plate, and the lower electrode plate is high in heat conductivity, so that heat absorption of the refrigerating element is facilitated, and heat conduction is facilitated.

Preferably, wiring hole one end is passed the mounting groove, the wiring hole other end with the support column link up each other, voltage component's wire passes in proper order wiring hole and the support column, and above-mentioned wire upper end with go up electrode sheet electric connection, realize go up electrode sheet and circuit board and voltage component electric connection.

Preferably, the refrigerating element is a group of P/N type semiconductors or an electronic component consisting of a plurality of P/N type semiconductors, the refrigerating principle of the electronic component with the Peltier effect consisting of the P/N type semiconductors is that direct current is applied to the P/N type semiconductors, a heat absorption or heat release phenomenon is generated at a joint, the heat is Peltier heat, the size is in direct proportion to current, the effect is reversible, and the refrigerating purpose is achieved through the heat absorption function.

Preferably, the lower electrode plate is made of silver or copper alloy, so that the lower electrode plate has the advantages of low resistivity, good conductivity and no arcing, and has the advantages of high temperature resistance, no abrasion and oxidation resistance of the alloy.

Preferably, the voltage component is made of piezoelectric ceramics, and by using the piezoelectric ceramic element, the voltage component has the advantages of high sensitivity, no magnetic field spreading and overflowing, no use of copper wires and magnets, low cost, low power consumption, convenient repair and convenient mass production.

Preferably, the length and width of the lower electrode plate are the same as those of the refrigerating piece, the length and width of the refrigerating piece are smaller than those of the circuit board, and the length and width of the upper electrode plate are the same as those of the circuit board

Compared with the prior art, the invention has the following beneficial effects:

1. in the invention, an upper electrode plate made of stainless steel and a lower electrode plate made of silver-nickel alloy are arranged, six types of upper electrode plates are provided, five types of lower electrode plates are provided, the upper electrode plates and the lower electrode plates can be matched at random by self, and a complete micro active fog ion generating chip is formed by combining a support column, a refrigerating piece and an integrated circuit board.

2. In the invention, high voltage is loaded on the upper electrode plate and the lower electrode plate, the voltage strength is enough to puncture air between the two electrode plates, the refrigerating element cools the lower electrode plate to condense condensed water in the air on the lower electrode plate, the condensed water on the lower electrode plate can be simultaneously punctured when the upper electrode plate and the lower electrode plate are punctured by the high voltage to generate active fog particle particles, and the generated active fog ions move along the lower electrode plate to the upper electrode plate and are dissipated out through holes on the upper electrode plate, so that the invention has better use effect on atomizing water vapor into fog ions.

3. The device has the advantages of small volume and simple structure, and can be assembled together according to actual needs, so that the device has wider application range, and only a single fault device needs to be replaced during disassembly and maintenance, thereby reducing the cost for production and maintenance of the device.

Drawings

FIG. 1 is a schematic view of the overall structure of a micro active mist ion generating chip according to a first embodiment of the present invention;

FIG. 2 is a schematic view of the overall structure of a first upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 3 is a schematic top view of a first upper electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 4 is a schematic diagram of a front cross-sectional structure of a first upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 5 is a schematic view of the overall structure of a first lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 6 is a schematic top view of a first lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 7 is a schematic front view of a first lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 8 is a schematic view of the overall structure of a support pillar in the micro active mist ion generating chip according to the present invention;

FIG. 9 is a schematic view of the overall structure of the circuit board in the micro active mist ion generating chip according to the present invention;

FIG. 10 is a schematic view of the overall structure of a micro active mist ion generating chip according to a second embodiment of the present invention;

FIG. 11 is a schematic view of the overall structure of a second upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 12 is a schematic top view of a second upper electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 13 is a schematic diagram of a front cross-sectional view of a second upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 14 is a schematic view of the overall structure of a micro active mist ion generating chip according to a third embodiment of the present invention;

FIG. 15 is a schematic view of the overall structure of a third upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 16 is a schematic top view of a third top electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 17 is a schematic diagram of a front cross-sectional structure of a third upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 18 is a schematic view of the overall structure of a micro active mist ion generating chip according to a fourth embodiment of the present invention;

FIG. 19 is a schematic diagram of the overall structure of a fourth upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 20 is a schematic top view of a fourth upper electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 21 is a schematic front sectional view of a fourth upper electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 22 is a schematic view of the overall structure of a micro active mist ion generating chip according to a fifth embodiment of the present invention;

FIG. 23 is a schematic view of the overall structure of a fifth upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 24 is a schematic top view of a fifth upper electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 25 is a schematic diagram of a front cross-sectional view of a fifth upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 26 is a schematic view of the overall structure of a micro active mist ion generating chip according to a sixth embodiment of the present invention;

FIG. 27 is a schematic view of the overall structure of a sixth upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 28 is a schematic top view of a sixth upper electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 29 is a schematic front sectional view of a sixth upper electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 30 is a schematic view of the overall structure of a second lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 31 is a schematic top view of a second lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 32 is a schematic front view of a second lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 33 is a schematic view of the overall structure of a third lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 34 is a schematic top view of a third lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 35 is a schematic front view of a third lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 36 is a schematic view of the overall structure of the fourth lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 37 is a schematic top view of a fourth lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 38 is a schematic front view of a fourth lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 39 is a schematic view of the entire structure of a fifth lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 40 is a schematic top view of a fifth lower electrode plate of the micro active mist ion generating chip according to the present invention;

FIG. 41 is a schematic front view of a fifth lower electrode plate in the micro active mist ion generating chip according to the present invention;

FIG. 42 is a system diagram of a control system in the micro active mist ion generating chip according to the present invention.

In the figure: 1. an electrode plate is arranged; 2. a support pillar; 3. a lower electrode plate; 4. a refrigeration member; 5. a circuit board; 111. a first upper electrode plate; 112. a first circular through hole; 121. a second upper electrode plate; 122. a second circular through hole; 123. a V-shaped groove; 131. a third upper electrode plate; 132. a longitudinal strip-shaped through hole; 141. a fourth upper electrode plate; 142. a curved line; 151. a fifth upper electrode plate; 152. a horizontal bar-shaped through hole; 161. a sixth upper electrode plate; 162. a metal mesh; 163. air holes are formed; 311. a first conductive pin; 312. a first conductive plate; 321. a second conductive pin; 322. a second conductive plate; 331. a third conductive tip; 332. a third conductive plate; 333. a third groove; 341. a fourth conductive tip; 342. a fourth conductive plate; 343. a fourth groove; 351. a fifth conductive tip; 352. a fifth conductive plate; 353. a fifth groove; 511. a wiring hole; 512. a voltage component.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

fig. 1 illustrates a first embodiment of a micro active mist ion generating chip of the present invention, please refer to fig. 2, fig. 3, fig. 4, fig. 8 and fig. 9, the micro active mist ion generating chip of the present embodiment includes a device body and a control system for controlling the device body, the device body includes a circuit board 5 and a cooling element 4; the refrigerating part 4 is positioned at the center of the upper part of the circuit board 5, the lower surface of the refrigerating part 4 is welded with the upper surface of the circuit board 5, the positive and negative poles of the refrigerating part 4 are connected with the electroplating through hole on the circuit board 5, the lower surface of the lower electrode plate 3 is positioned at the center of the upper part of the refrigerating part 4, and the lower surface of the lower electrode plate 3 is welded with the upper surface of the refrigerating part 4.

As shown in fig. 9, an installation groove is formed in the upper portion of the circuit board 5, a voltage component 512 is fixedly installed in the installation groove, a wiring hole 511 is formed at a vertex angle position of the circuit board 5, each wiring hole 511 is fixedly connected with a support column 2, as shown in fig. 8, each support column 2 is hollow, the upper end of each support column 2 is welded to the lower surface of the first upper electrode plate 1, the first upper electrode plate 1 is located right above the lower electrode plate 3, and a gap is formed between the first upper electrode plate 1 and the lower electrode plate 3; the voltage component 512 is preferably a high voltage component.

As shown in fig. 42, the control system includes a circuit module, a refrigeration module and an electric shock module, wherein a circuit board 5 in the circuit module generates a high voltage through a voltage component 512, and transmits an electric signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electric signal to a first upper electrode plate 1 through a wire, so that a load high voltage electric field is formed between the first upper electrode plate 1 and the lower electrode plate 3, a refrigeration element 4 in the refrigeration module is an electronic element using peltier effect, firstly receives a current signal generated by the circuit board 5, generates peltier effect by combining with a semiconductor of the refrigeration element to realize heat absorption, further realizes refrigeration, reduces the temperature of the lower electrode plate 3, condenses air on the upper surface of the lower electrode plate 3 to generate condensed water, the electric shock module, the high voltage electric field formed between the lower electrode plate 3 and the first upper electrode plate 1, and the upper surface of the lower electrode plate 3 is provided with a conductive needle, the loaded high-voltage electricity breaks down surface condensate water through the conductive pins to generate charged fog ions, coulomb force is generated between the first upper electrode plate 1 and the lower electrode plate 3, the charged fog ions move to the first upper electrode plate 1 under the action of coulomb force, and the charged fog ions are sprayed out of the first circular through hole 112 of the first upper electrode plate 1.

The circuit board 5 is an integrated circuit board, the circuit board 5 is mainly used for providing a communication circuit for a first upper electrode plate 1, a lower electrode plate 3 and a refrigerating element 4, the first upper electrode plate 1 is made of a low-resistance material, one end of a wiring hole 511 penetrates through the installation groove, the other end of the wiring hole 511 is communicated with a supporting column 2, a metal wire of a voltage component 512 sequentially penetrates through the wiring hole 511 and the supporting column 2, one end of the metal wire is electrically connected with the first upper electrode plate 1, the refrigerating element 4 is a group of P/N type semiconductors or an electronic component consisting of a plurality of P/N type semiconductors, the lower electrode plate 3 is made of silver or copper alloy, the silver alloy is silver nickel alloy, and the copper alloy is brass or cupronickel; the voltage component 512 is made of piezoelectric ceramics.

As shown in fig. 5, 6 and 7, a first lower electrode plate 3 is shown, the lower electrode plate 3 is composed of a first conductive plate 312 and first conductive pins 311, the first conductive pins 311 are located on the first conductive plate 312, are distributed in an array, and are divided into ten rows and ten columns, the first conductive plate 312 and the first conductive pins 311 are made of silver-nickel alloy, the size of the first conductive pins 311 is phi 0.8mm × 4mm, and the height of the base is phi 3mm × 0.5 mm.

As shown in fig. 30, 31 and 32, a second lower electrode plate 3 is shown, the lower electrode plate 3 is composed of a second conductive plate 322 and second conductive pins 321, the second conductive pins 321 are located on the upper portion of the second conductive plate 322, the second conductive pins 321 are ten rows and are distributed in a staggered manner, the second conductive plate 322 and the second conductive pins 321 are made of silver-nickel alloy, the size of the second conductive pins 321 is phi 0.8mm × 4mm, and the height of the base is phi 3mm × 0.5 mm.

As shown in fig. 33, 34 and 35, a third lower electrode sheet 3 is provided, the lower electrode sheet 3 is composed of a third conductive plate 332 and third conductive tips 331, the third conductive tips 331 are distributed in an array, the tops of the third conductive tips 331 are in a tip shape, third grooves 333 are formed between the third conductive tips 331, the third grooves 333 are used for storing condensed water, and the minimum size of the third conductive tips 331 is 10 μm × 10 μm, and the typical size is 100 μm × 100 μm.

As shown in fig. 36, 37 and 38, a fourth lower electrode sheet 3 is shown, the lower electrode sheet 3 is composed of a fourth conductive plate 342 and fourth conductive tips 341, the fourth conductive tips 341 are distributed in an array, the tops of the fourth conductive tips 341 are in a platform shape, fourth grooves 343 are formed between the fourth conductive tips 341, the fourth grooves 343 can be used for storing condensed water, and the minimum size of the fourth conductive tips 341 is 300 μm × 300 μm.

As shown in fig. 39, 40, and 41, a fifth lower electrode plate 3 is shown, the lower electrode plate 3 is composed of fifth conductive plates 352 and fifth conductive tips 351, the fifth conductive tips 351 are distributed in an array, the fifth conductive tips 351 are cylindrical, fifth grooves 353 are formed between the fifth conductive tips 351, the fifth grooves 353 are used for storing condensed water, the fifth grooves 353 are manufactured by photolithography, the thickness of the fifth conductive tips 351 is 50nm-1000nm, and the width of the fifth grooves 353 is 200 nm-2000 nm.

Referring to fig. 1, in the working principle of this embodiment, a circuit board 5 generates a high voltage through a voltage component 512, and transmits an electrical signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electrical signal to a first upper electrode plate 1 through a wire, so that a load high-voltage electric field is formed between the first upper electrode plate 1 and the lower electrode plate 3, a cooling member 4 receives a current signal generated by the circuit board 5 to absorb heat, so as to achieve cooling, reduce the temperature of the lower electrode plate 3, condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the high-voltage electric field formed between the lower electrode plate 3 and the first upper electrode plate 1, the lower electrode plate 3 is a negative level, the first upper electrode plate 1 is a positive level, the upper surface of the lower electrode plate 3 is provided with a conductive pin or a conductive tip, a conductive groove stores a certain amount of condensed water, the load high-voltage electric field breaks through the surface condensed water through the conductive pin or the conductive tip to generate charged fog ions, the charged fog ions carry negative charges, generate coulomb force between the first upper electrode plate 1 and the lower electrode plate 3, move to the first upper electrode plate 1 under the action of coulomb force, and are sprayed out from a first circular through hole 112 formed in the middle of the first upper electrode plate 111.

Example two:

fig. 10 illustrates a second embodiment of the micro active mist ion generating chip of the present invention, please refer to fig. 11, fig. 12, fig. 13, fig. 8 and fig. 9, the micro active mist ion generating chip of the present embodiment includes a device body and a control system for controlling the device body, the device body includes a circuit board 5 and a cooling member 4; the refrigerating part 4 is positioned at the central position of the upper part of the circuit board 5, the lower surface of the refrigerating part 4 is welded with the upper surface of the circuit board 5, the positive and negative electrodes of the refrigerating part 4 are connected with the electroplating through holes on the circuit board 5, the lower surface of the lower electrode plate 3 is positioned at the central position of the upper part of the refrigerating part 4, and the lower surface of the lower electrode plate 3 is welded with the upper surface of the refrigerating part 4;

as shown in fig. 9, an installation groove is formed in the upper portion of the circuit board 5, a voltage component 512 is fixedly installed in the installation groove, a wiring hole 511 is formed at a vertex angle position of the circuit board 5, each wiring hole 511 is fixedly connected with a support column 2, as shown in fig. 8, each support column 2 is hollow, the upper end of each support column 2 is welded to the lower surface of the second upper electrode plate 1, the second upper electrode plate 1 is located right above the lower electrode plate 3, and a gap is formed between the second upper electrode plate 1 and the lower electrode plate 3;

as shown in fig. 42, the control system includes a circuit module, a refrigeration module and an electric shock module, wherein a circuit board 5 in the circuit module generates a high voltage through a voltage component 512, and transmits an electric signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electric signal to a second upper electrode plate 1 through a wire, so that a load high voltage electric field is formed between the second upper electrode plate 1 and the lower electrode plate 3, a refrigeration element 4 in the refrigeration module is an electronic element using peltier effect, firstly receives a current signal generated by the circuit board 5, generates peltier effect by combining with a semiconductor of the refrigeration element to realize heat absorption, further realizes refrigeration, reduces the temperature of the lower electrode plate 3, condenses air on the upper surface of the lower electrode plate 3 to generate condensed water, the electric shock module, the high voltage electric field formed between the lower electrode plate 3 and the second upper electrode plate 1, and the upper surface of the lower electrode plate 3 is provided with a conductive needle, the loaded high-voltage electricity breaks down surface condensate water through the conductive pins to generate charged fog ions, coulomb force is generated between the second type upper electrode plate 1 and the lower electrode plate 3 through an electric field, the charged fog ions move to the second type upper electrode plate 1 under the action of coulomb force, and the charged fog ions are sprayed out of the fog outlet through hole of the second type upper electrode plate 1.

The circuit board 5 is an integrated circuit board, the circuit board 5 is mainly used for providing a communication circuit for the second upper electrode plate 1, the lower electrode plate 3 and the refrigerating element 4, the second upper electrode plate 1 is made of a low-resistance material, one end of the wiring hole 511 penetrates through the mounting groove, the other end of the wiring hole 511 is communicated with the supporting column 2, a metal wire of the voltage component 512 sequentially penetrates through the wiring hole 511 and the supporting column 2, one end of the metal wire is electrically connected with the second upper electrode plate 1, the refrigerating element 4 is a group of P/N type semiconductors or an electronic component composed of a plurality of P/N type semiconductors, the lower electrode plate 3 is made of silver or copper alloy, and the voltage component 512 is made of piezoelectric ceramics.

Referring to fig. 10, in the working principle of this embodiment, a circuit board 5 generates a high voltage through a voltage component 512, and transmits an electrical signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electrical signal to a second upper electrode plate 1 through a wire, so that a load high-voltage electric field is formed between the second upper electrode plate 1 and the lower electrode plate 3, a cooling member 4 receives a current signal generated by the circuit board 5 to absorb heat, so as to achieve cooling, reduce the temperature of the lower electrode plate 3, condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the high-voltage electric field formed between the lower electrode plate 3 and the second upper electrode plate 1, the lower electrode plate 3 is a negative electrode, the second upper electrode plate 1 is a positive electrode, the upper surface of the lower electrode plate 3 is provided with a conductive pin or a conductive tip, a conductive groove stores a certain amount of condensed water, and the load high-voltage electric field breaks down the surface condensed water through the conductive pin or conductive tip to generate charged fog ions, the charged fog ions carry negative charges, generate coulomb force in an electric field between the second upper electrode plate 1 and the lower electrode plate 3, move towards the second upper electrode plate 1 under the action of coulomb force, and are ejected through a second circular through hole 122 formed in the middle of the second upper electrode plate 121.

Example three:

fig. 14 illustrates a third embodiment of the micro active mist ion generating chip of the present invention, please refer to fig. 15, fig. 16, fig. 17, fig. 8 and fig. 9, the micro active mist ion generating chip of the present embodiment includes a device body and a control system for controlling the device body, the device body includes a circuit board 5 and a cooling member 4; the refrigerator comprises a lower electrode plate 3 and an upper electrode plate 1, wherein the upper electrode plate 1 adopts a third upper electrode plate 1 shown in figures 15, 16 and 17, the upper electrode plate 1 consists of a third upper electrode plate 131 and a longitudinal strip-shaped through hole 132 formed in the middle of the third upper electrode plate 131, the section of the third upper electrode plate 131 is inverted trapezoid, the third upper electrode plate 131 is made of stainless steel, the lower electrode plate 3 can adopt any one of five lower electrode plates 3 shown in figures 5, 30, 33, 36 and 39, the refrigerator 4 is positioned at the center of the upper part of the circuit board 5, the lower surface of the refrigerator 4 is welded with the upper surface of the circuit board 5, the positive and negative electrodes of the refrigerator 4 are connected with the electroplating through hole on the circuit board 5, the lower electrode plate 3 is positioned at the center of the upper part of the refrigerator 4, and the lower surface of the lower electrode plate 3 is welded with the upper surface of the refrigerator 4;

as shown in fig. 9, an installation groove is formed in the upper portion of the circuit board 5, a voltage component 512 is fixedly installed in the installation groove, a wiring hole 511 is formed in a vertex angle position of the circuit board 5, each wiring hole 511 is fixedly connected with a support column 2, as shown in fig. 8, each support column 2 is hollow, the upper end of each support column 2 is welded to the lower surface of a third upper electrode plate 1, the third upper electrode plate 1 is located right above a lower electrode plate 3, and a gap exists between the third upper electrode plate 1 and the lower electrode plate 3;

as shown in fig. 42, the control system includes a circuit module, a refrigeration module and an electric shock module, wherein a circuit board 5 in the circuit module generates a high voltage through a voltage component 512, and transmits an electric signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electric signal to a third upper electrode plate 1 through a wire, so that a load high voltage electric field is formed between the third upper electrode plate 1 and the lower electrode plate 3, a refrigeration element 4 in the refrigeration module is an electronic component using the peltier effect, firstly receives a current signal generated by the circuit board 5, and generates the peltier effect by combining with a semiconductor of the refrigeration element to realize heat absorption, so as to realize refrigeration, reduce the temperature of the lower electrode plate 3, condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the electric shock module, the high voltage electric field formed between the lower electrode plate 3 and the third upper electrode plate 1, and the upper surface of the lower electrode plate 3 is provided with a conductive needle, the high-voltage load electricity breaks down surface condensate water through the conductive needle to generate charged fog ions, coulomb force is generated between the third upper electrode plate 1 and the lower electrode plate 3 through an electric field, the coulomb force moves to the third upper electrode plate 1 under the action of coulomb force, and the charged fog ions are sprayed out of the fog outlet through hole of the third upper electrode plate 1.

Referring to fig. 14, according to the working principle of this embodiment, a circuit board 5 generates a high voltage through a voltage component 512, and transmits an electrical signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electrical signal to a third upper electrode plate 1 through a wire, so that a load high-voltage electric field is formed between the third upper electrode plate 1 and the lower electrode plate 3, a cooling member 4 receives a current signal generated by the circuit board 5 to absorb heat, so as to achieve cooling, and reduce the temperature of the lower electrode plate 3, and condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the high-voltage electric field formed between the lower electrode plate 3 and the third upper electrode plate 1, the lower electrode plate 3 is a negative electrode, the third upper electrode plate 1 is a positive electrode, a conductive pin or a conductive tip is disposed on the upper surface of the lower electrode plate 3, a conductive groove stores a certain amount of condensed water, and the load high-voltage electric penetrates the surface condensed water through the conductive pin or the conductive tip to generate charged fog ions, the charged mist ions carry negative charges, generate coulomb force in the electric field between the third upper electrode plate 1 and the lower electrode plate 3, move toward the third upper electrode plate 1 under the coulomb force, and are ejected through a longitudinal strip-shaped through hole 132 formed in the middle of the third upper electrode plate 131.

Example four:

fig. 18 illustrates a third embodiment of the micro active mist ion generating chip of the present invention, please refer to fig. 19, fig. 20, fig. 21, fig. 8 and fig. 9, the micro active mist ion generating chip of the present embodiment includes a device body and a control system for controlling the device body, the device body includes a circuit board 5 and a cooling member 4; the refrigerator comprises a lower electrode plate 3 and an upper electrode plate 1, wherein the upper electrode plate 1 adopts a fourth upper electrode plate 1 shown in figures 19, 20 and 21, the upper electrode plate 1 consists of a fourth upper electrode plate 141 and a curve strip 142 arranged in the middle of the fourth upper electrode plate 141, the cross section of the fourth upper electrode plate 141 is inverted trapezoid, the fourth upper electrode plate 141 is made of stainless steel, the lower electrode plate 3 can adopt any one of five lower electrode plates 3 shown in figures 5, 30, 33, 36 and 39, the refrigerator 4 is positioned at the center of the upper part of the circuit board 5, the lower surface of the refrigerator 4 is welded with the upper surface of the circuit board 5, the positive and negative electrodes of the refrigerator 4 are connected with electroplating through holes in the circuit board 5, the lower electrode plate 3 is positioned at the center of the upper part of the refrigerator 4, and the lower surface of the lower electrode plate 3 is welded with the upper surface of the refrigerator 4;

as shown in fig. 9, an installation groove is formed in the upper portion of the circuit board 5, a voltage component 512 is fixedly installed in the installation groove, a wiring hole 511 is formed in a vertex angle position of the circuit board 5, each wiring hole 511 is fixedly connected with a support column 2, as shown in fig. 8, each support column 2 is hollow, the upper end of each support column 2 is welded to the lower surface of the fourth upper electrode plate 1, the fourth upper electrode plate 1 is located right above the lower electrode plate 3, and a gap exists between the fourth upper electrode plate 1 and the lower electrode plate 3;

as shown in fig. 42, the control system includes a circuit module, a refrigeration module and an electric shock module, wherein a circuit board 5 in the circuit module generates a high voltage through a voltage component 512, and transmits an electric signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electric signal to a fourth upper electrode plate 1 through a wire, so that a load high voltage electric field is formed between the fourth upper electrode plate 1 and the lower electrode plate 3, a refrigeration element 4 in the refrigeration module is an electronic component using the peltier effect, firstly receives a current signal generated by the circuit board 5, and generates the peltier effect by combining with a semiconductor of the refrigeration element to realize heat absorption, so as to realize refrigeration, reduce the temperature of the lower electrode plate 3, condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the electric shock module, the high voltage electric field formed between the lower electrode plate 3 and the fourth upper electrode plate 1, and the upper surface of the lower electrode plate 3 is provided with a conductive needle, the high-voltage load electricity breaks down surface condensate water through the conductive needle to generate charged fog ions, coulomb force is generated between the fourth upper electrode plate 1 and the lower electrode plate 3 through an electric field, the coulomb force moves to the fourth upper electrode plate 1 under the action of coulomb force, and the charged fog ions are sprayed out of the fog outlet through hole of the fourth upper electrode plate 1.

Referring to fig. 18, according to the working principle of this embodiment, a circuit board 5 generates a high voltage through a voltage component 512, and transmits an electrical signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electrical signal to a fourth upper electrode plate 1 through a wire, so that a load high-voltage electric field is formed between the fourth upper electrode plate 1 and the lower electrode plate 3, a cooling member 4 receives a current signal generated by the circuit board 5 to absorb heat, so as to achieve cooling, and reduce the temperature of the lower electrode plate 3, and condense air on the upper surface of the lower electrode plate 3 to generate condensed water, a high-voltage electric field is formed between the lower electrode plate 3 and the fourth upper electrode plate 1, the lower electrode plate 3 is a negative electrode, the fourth upper electrode plate 1 is a positive electrode, a conductive pin or a conductive tip is disposed on the upper surface of the lower electrode plate 3, a conductive groove stores a certain amount of condensed water, and the load high-voltage electric penetrates the surface condensed water through the conductive pin or the conductive tip to generate charged fog ions, the charged mist ions carry negative charges, generate coulomb force in the electric field between the fourth upper electrode plate 1 and the lower electrode plate 3, move toward the fourth upper electrode plate 1 under the coulomb force, and are ejected through the gap of the curved strip 142 arranged in the middle of the fourth upper electrode plate 141.

Example five:

fig. 22 illustrates a third embodiment of the micro active mist ion generating chip of the present invention, please refer to fig. 23, fig. 24, fig. 25, fig. 8 and fig. 9, the micro active mist ion generating chip of the present embodiment includes a device body and a control system for controlling the device body, the device body includes a circuit board 5 and a cooling member 4; the refrigerator comprises a lower electrode plate 3 and an upper electrode plate 1, wherein the upper electrode plate 1 adopts a fifth upper electrode plate 1 shown in figures 23, 24 and 25, the upper electrode plate 1 consists of a fifth upper electrode plate 151 and a transverse strip-shaped through hole 152 formed in the middle of the fifth upper electrode plate 151, the section of the fifth upper electrode plate 151 is inverted trapezoid, the fifth upper electrode plate 151 is made of stainless steel, the lower electrode plate 3 can adopt any one of five lower electrode plates 3 shown in figures 5, 30, 33, 36 and 39, a refrigerator 4 is positioned at the center of the upper part of a circuit board 5, the lower surface of the refrigerator 4 is welded with the upper surface of the circuit board 5, the positive and negative electrodes of the refrigerator 4 are connected with electroplating through holes in the circuit board 5, the lower electrode plate 3 is positioned at the center of the upper part of the refrigerator 4, and the lower surface of the lower electrode plate 3 is welded with the upper surface of the refrigerator 4;

as shown in fig. 9, an installation groove is formed in the upper portion of the circuit board 5, a voltage component 512 is fixedly installed in the installation groove, a wiring hole 511 is formed at a vertex angle position of the circuit board 5, each wiring hole 511 is fixedly connected with a support column 2, as shown in fig. 8, each support column 2 is hollow, the upper end of each support column 2 is welded to the lower surface of the fifth upper electrode plate 1, the fifth upper electrode plate 1 is located right above the lower electrode plate 3, and a gap exists between the fifth upper electrode plate 1 and the lower electrode plate 3;

as shown in fig. 42, the control system includes a circuit module, a refrigeration module and an electric shock module, wherein a circuit board 5 in the circuit module generates a high voltage through a voltage component 512, and transmits an electric signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electric signal to a fifth upper electrode plate 1 through a wire, so that a load high voltage electric field is formed between the fifth upper electrode plate 1 and the lower electrode plate 3, a refrigeration element 4 in the refrigeration module is an electronic element using peltier effect, firstly receives a current signal generated by the circuit board 5, generates peltier effect by combining with a semiconductor of the refrigeration element to realize heat absorption, further realizes refrigeration, reduces the temperature of the lower electrode plate 3, condenses air on the upper surface of the lower electrode plate 3 to generate condensed water, the electric shock module, the high voltage electric field formed between the lower electrode plate 3 and the fifth upper electrode plate 1, and the upper surface of the lower electrode plate 3 is provided with a conductive needle, the loaded high-voltage electricity breaks down surface condensate water through the conductive pins to generate charged fog ions, coulomb force is generated between the fifth upper electrode plate 1 and the lower electrode plate 3 through an electric field, the charged fog ions move to the fifth upper electrode plate 1 under the action of coulomb force, and the charged fog ions are sprayed out of the fog outlet through holes of the fifth upper electrode plate 1.

Referring to fig. 22, according to the working principle of this embodiment, a circuit board 5 generates a high voltage through a voltage component 512, and transmits an electrical signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electrical signal to a fifth upper electrode plate 1 through a wire, so that a high-voltage load electric field is formed between the fifth upper electrode plate 1 and the lower electrode plate 3, a cooling element 4 receives a current signal generated by the circuit board 5 to absorb heat, so as to achieve cooling, reduce the temperature of the lower electrode plate 3, condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the high-voltage load electric field formed between the lower electrode plate 3 and the fifth upper electrode plate 1, the lower electrode plate 3 is a negative electrode, the fifth upper electrode plate 1 is a positive electrode, the upper surface of the lower electrode plate 3 is provided with a conductive pin or a conductive tip, a conductive groove stores a certain amount of condensed water, and the high-voltage load electric field breaks through the surface condensed water through the conductive pin or conductive tip to generate charged fog ions, the charged mist ions carry negative charges, generate coulomb force in an electric field between the fifth upper electrode plate 1 and the lower electrode plate 3, move toward the fifth upper electrode plate 1 under the coulomb force, and are emitted through the horizontal through holes 152 formed in the fifth upper electrode plate 151.

Example six:

fig. 26 illustrates a third embodiment of the micro active mist ion generating chip of the invention, please refer to fig. 27, fig. 28, fig. 29, fig. 8 and fig. 9, the micro active mist ion generating chip of the embodiment includes a device body and a control system for controlling the device body, the device body includes a circuit board 5 and a cooling member 4; the upper electrode plate 1 is the sixth upper electrode plate 1 shown in fig. 27, 28 and 29, the upper electrode plate 1 is composed of a sixth upper electrode plate 161 and a metal mesh 162 arranged in the middle, an air hole 163 is arranged on the metal mesh 162, the section of the sixth upper electrode plate 161 is inverted trapezoid, the sixth upper electrode plate 161 is made of stainless steel, the lower electrode plate 3 can be any one of the five lower electrode plates 3 shown in fig. 5, 30, 33, 36 and 39, the refrigerating element 4 is positioned at the upper center position of the circuit board 5, the lower surface of the refrigerating element 4 is welded with the upper surface of the circuit board 5, the positive and negative poles of the refrigerating element 4 are connected with the electroplating through holes in the circuit board 5, the lower electrode plate 3 is positioned at the upper center position of the refrigerating element 4, and the lower surface of the lower electrode plate 3 is welded with the upper surface of the refrigerating element 4;

as shown in fig. 9, an installation groove is formed in the upper portion of the circuit board 5, a voltage component 512 is fixedly installed in the installation groove, a wiring hole 511 is formed at a vertex angle position of the circuit board 5, each wiring hole 511 is fixedly connected with a support column 2, as shown in fig. 8, each support column 2 is hollow, the upper end of each support column 2 is welded to the lower surface of the sixth upper electrode plate 1, the sixth upper electrode plate 1 is located right above the lower electrode plate 3, and a gap exists between the sixth upper electrode plate 1 and the lower electrode plate 3;

as shown in fig. 42, the control system includes a circuit module, a refrigeration module and an electric shock module, wherein a circuit board 5 in the circuit module generates a high voltage through a voltage component 512, and transmits an electric signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electric signal to a sixth upper electrode plate 1 through a wire, so that a load high voltage electric field is formed between the sixth upper electrode plate 1 and the lower electrode plate 3, a refrigeration element 4 in the refrigeration module is an electronic element using peltier effect, firstly receives a current signal generated by the circuit board 5, generates peltier effect by combining with a semiconductor of the refrigeration element to realize heat absorption, further realizes refrigeration, reduces the temperature of the lower electrode plate 3, condenses air on the upper surface of the lower electrode plate 3 to generate condensed water, the electric shock module, the high voltage electric field formed between the lower electrode plate 3 and the sixth upper electrode plate 1, and the upper surface of the lower electrode plate 3 is provided with a conductive needle, the loaded high-voltage electricity breaks down surface condensate water through the conductive pins to generate charged fog ions, coulomb force is generated between the sixth upper electrode plate 1 and the lower electrode plate 3 through an electric field, the charged fog ions move to the sixth upper electrode plate 1 under the action of coulomb force, and the charged fog ions are sprayed out of the fog outlet through holes of the sixth upper electrode plate 1.

Referring to fig. 26, according to the working principle of this embodiment, a circuit board 5 generates a high voltage through a voltage component 512, and transmits an electrical signal to a lower electrode plate 3 through the circuit board 5, and then transmits the electrical signal to a sixth upper electrode plate 1 through a wire, so that a high-voltage load electric field is formed between the sixth upper electrode plate 1 and the lower electrode plate 3, a cooling member 4 receives a current signal generated by the circuit board 5 to absorb heat, so as to achieve cooling, reduce the temperature of the lower electrode plate 3, condense air on the upper surface of the lower electrode plate 3 to generate condensed water, the high-voltage load electric field formed between the lower electrode plate 3 and the sixth upper electrode plate 1, the lower electrode plate 3 is a negative electrode, the sixth upper electrode plate 1 is a positive electrode, the upper surface of the lower electrode plate 3 is provided with a conductive pin or a conductive tip, a conductive groove stores a certain amount of condensed water, and the high-voltage load electric field breaks down the surface condensed water through the conductive pin or conductive tip to generate charged fog ions, the charged mist ions carry negative charges, generate coulomb force in an electric field between the sixth upper electrode plate 1 and the lower electrode plate 3, move toward the sixth upper electrode plate 1 under the coulomb force, and are ejected through the air holes 163 on the metal mesh 162 arranged in the middle of the sixth upper electrode plate 161.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A micro active fog ion generation chip is characterized in that: the control system comprises a device body and a control system for controlling the device body, wherein the device body comprises a circuit board (5) and a refrigerating piece (4); the refrigerator comprises a lower electrode plate (3) and an upper electrode plate (1), wherein the refrigerating piece (4) is located at the central position of the upper part of the circuit board (5), the lower surface of the refrigerating piece (4) is welded with the upper surface of the circuit board (5), the anode and the cathode of the refrigerating piece (4) are connected with an electroplating through hole in the circuit board (5), the lower electrode plate (3) is located at the central position of the upper part of the refrigerating piece (4), and the lower surface of the lower electrode plate (3) is welded with the upper surface of the refrigerating piece (4);

the upper portion of the circuit board (5) is provided with a mounting groove, a voltage assembly (512) is fixedly mounted in the mounting groove, wiring holes (511) are formed in vertex angles of the circuit board (5), each wiring hole (511) is fixedly connected with a support column (2), each support column (2) is hollow, the upper end of each support column (2) is welded with the lower surface of the upper electrode plate (1), the upper electrode plate (1) is located right above the lower electrode plate (3), a gap is formed between the upper electrode plate and the lower electrode plate (3), and the structures of the lower electrode plate (3) and the upper electrode plate (1) are matched with each other;

the control system comprises a circuit module, a refrigeration module and an electric shock module, wherein the circuit board (5) in the circuit module generates high voltage through a voltage component (512), transmits an electric signal to the lower electrode plate (3) through the circuit board (5), and transmits the electric signal to the upper electrode plate (1) through a lead so that a load high-voltage electric field is formed between the upper electrode plate (1) and the lower electrode plate (3), the refrigeration part (4) in the refrigeration module is an electronic component using the Peltier effect, firstly receives a current signal generated by the circuit board (5), combines the Peltier effect generated by a semiconductor to realize heat absorption, further realizes refrigeration, reduces the temperature of the lower electrode plate (3), condenses air on the upper surface of the lower electrode plate (3) to generate condensed water, and the electric shock module, the high-voltage electric field formed between the lower electrode plate (3) and the upper electrode plate (1), the upper surface of the lower electrode plate (3) is provided with a conductive needle, the loaded high-voltage electricity breaks through surface condensate water through the conductive needle to generate charged fog ions, coulomb force is generated by an electric field between the upper electrode plate (1) and the lower electrode plate (3), the charged fog ions move towards the upper electrode plate (1) under the coulomb force effect, and the charged fog ions are sprayed out of the fog outlet through hole of the upper electrode plate (1).

2. The miniature active mist ion generating chip of claim 1, wherein: the circuit board (5) is an integrated circuit board, and the circuit board (5) is mainly used for providing a communication circuit for the upper electrode plate (1), the lower electrode plate (3) and the refrigerating piece (4).

3. The miniature active mist ion generating chip of claim 2, wherein: the lower electrode plate (3) is made of low-resistance and high-heat-conduction material, and the upper electrode plate (1) is made of low-resistance material.

4. The miniature active mist ion generating chip of claim 1, wherein: wiring hole (511) one end passes the mounting groove, wiring hole (511) the other end with support column (2) link up each other, the metal wire of voltage component (512) passes in proper order wiring hole (511) and support column (2), and above-mentioned metal wire one end with go up electrode sheet (1) electric connection.

5. The miniature active mist ion generating chip of claim 2, wherein: the refrigerating element (4) is a group of P/N type semiconductors or an electronic component consisting of a plurality of P/N type semiconductors.

6. The miniature active mist ion generating chip of claim 2, wherein: the lower electrode plate (3) is made of silver or copper alloy.

7. The miniature active mist ion generating chip of claim 6, wherein: the voltage component (512) is made of piezoelectric ceramics.

8. The miniature active mist ion generating chip of claim 6, wherein: the length and width of the lower electrode plate (3) are the same as those of the refrigerating piece (4), the length and width of the refrigerating piece (4) are smaller than those of the circuit board (5), and the length and width of the upper electrode plate (1) are the same as those of the circuit board (5).