CN113835295A - Micro-nano characteristic imprinting method - Google Patents
Micro-nano characteristic imprinting method Download PDFInfo
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- CN113835295A CN113835295A CN202111054765.XA CN202111054765A CN113835295A CN 113835295 A CN113835295 A CN 113835295A CN 202111054765 A CN202111054765 A CN 202111054765A CN 113835295 A CN113835295 A CN 113835295A
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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Abstract
The invention relates to the technical field of micromachining, in particular to a method for imprinting micro-nano features, which comprises a mold preparation step and an imprinting and demolding step, wherein the tail end of a metal wire is promoted to form a metal ball by controlling electronic ignition of a lead bonding instrument, the micro-nano features on the surface of an original mold are promoted to be imprinted on an imprinting plane of the metal ball by utilizing bonding force and bonding temperature so as to form a metal ball mold, and finally the micro-nano features are imprinted to a mask layer on the surface of a target substrate by the metal ball mold; compared with the existing methods such as photoetching, nano-imprinting and the like, the method provided by the invention has the advantages of small number of required original molds and capability of flexibly selecting and combining different micro-nano scale characteristics.
Description
Technical Field
The invention relates to the technical field of micromachining, in particular to a method for imprinting micro-nano features.
Background
The micro-nano scale features (patterns) are transferred from the template to the surfaces of different substrates, which is a key and initial step of a micro-processing process flow in the fields of microelectronics and micro-electro-mechanical technology and is also a basis for preparing various microstructures by deposition, etching and other processes.
The traditional photoetching process uses a photoresist and a mask plate to complete the transfer of micron-scale features, is applied on a large scale, and the resolution ratio of the traditional photoetching process is difficult to reach the nanometer scale. In recent years, the nano-imprinting technology overcomes the defect of insufficient resolution of the photoetching process, and the mold prepared by electron beam etching is used for realizing the large-scale transfer of nano-scale features. However, the method realizes the synchronous transfer of the micro-nano scale features on all the molds, and if different micro-nano scale features need to be combined, if the relative positions are changed, a plurality of molds need to be prepared, so that the technological process is complex, and the cost is increased.
It can be seen that the existing micro-nano scale feature transfer method lacks flexibility, a plurality of dies need to be manufactured when flexible combination of various micro-nano scale features is realized, the process is complicated, and the method is low in efficiency in application occasions such as process principle verification.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a micro-nano feature imprinting method, which is beneficial to solving the problem of low efficiency caused by the need of preparing a plurality of dies when various micro-nano features are flexibly selected and combined in application occasions such as prototype verification and the like in the prior art.
The invention provides an imprinting method of micro-nano characteristics, which comprises a mould preparation step and an imprinting and demoulding step, wherein,
the preparation steps of the mould are as follows: the method comprises the steps of enabling the tail end of a metal wire to form a metal ball by controlling electronic ignition of a lead bonding instrument, controlling the metal ball to contact a plane substrate and apply bonding force to enable the tail end of the metal ball to form an imprinting plane, enabling the imprinting plane of the metal ball to be in mutual extrusion contact with a pre-prepared original mold by utilizing the bonding force and the bonding temperature applied by the lead bonding instrument, and enabling micro-nano characteristics on the surface of the original mold to be imprinted to the imprinting plane of the metal ball to form a metal ball mold;
the stamping and demolding steps are as follows: and pressing and contacting the metal ball mold and the mask layer on the surface of the target substrate by utilizing the bonding force or the bonding force and the bonding temperature applied by the lead bonding instrument, so as to promote the micro-nano characteristics of the imprinting plane on the metal ball mold to be imprinted to the mask layer on the surface of the target substrate, and separating the metal ball mold from the mask layer after the mask layer is solidified.
According to the imprinting method of the micro-nano features, in the imprinting and demolding steps, electronic ignition current is led into the grounding unit in advance, and the current is prevented from passing through the metal ball mold.
According to the imprinting method of the micro-nano features, in the imprinting and demolding steps, the grounding unit is a grounding metal rod.
According to the imprinting method of the micro-nano features, in the imprinting and demolding steps, the electronic ignition current is set to be a low current value so as to prevent the micro-nano features on the metal ball mold from being damaged by the current.
According to the imprinting method of the micro-nano characteristic, in the imprinting and demolding steps, the mask layer on the target substrate is subjected to heat treatment to realize curing treatment of the mask layer.
According to the imprinting method of the micro-nano features, in the imprinting and demolding steps, ultraviolet rays penetrate through the target substrate and the mask layer is cured.
According to the method for imprinting the micro-nano features, the micro-nano features on the surface of the original mold are prepared through the processes of photoetching, electron beam etching and reactive ion etching.
According to the imprinting method of the micro-nano features, the mask layer is made of thermoplastic polymer materials or photo-polymerization polymer materials, the mask layer is deposited on the target substrate in a spin coating or spraying mode, and the thickness of the mask layer is larger than the depth of the micro-nano features on the surface of the metal ball mold.
The imprinting method of the micro-nano features further comprises the following post-processing steps: and removing the residual mask layer material covering the surface of the target substrate at the bottom of the micro-nano feature so as to expose the target substrate.
According to the imprinting method of the micro-nano features, when the metal ball mold needs to be prepared again to imprint new micro-nano features, the used metal ball mold is bonded with the recovery substrate with the metal coating on the surface by operating the lead bonding instrument, so that the metal ball mold is separated from the metal wire and fixed on the recovery substrate to finish the waste treatment of the metal ball mold; the fractured metal wire is used for preparing a new metal ball so as to be used for imprinting new micro-nano characteristics.
According to the imprinting method of the micro-nano features, after one-time imprinting of the micro-nano features is completed and the surface of the target substrate is etched, the target substrate printed with the micro-nano features is coated with the mask layer again, and the mask layer is imprinted with the micro-nano features of different shapes at the positions corresponding to the positions printed with the micro-nano features, so that the multiple micro-nano features are stacked and combined to be imprinted on the same target substrate.
The invention provides a method for imprinting micro-nano features, which is characterized in that the tail end of a metal wire is promoted to form a metal ball by controlling the electronic ignition of a lead bonding instrument, the micro-nano features on the surface of an original mold are promoted to be imprinted on an imprinting plane of the metal ball by utilizing the bonding force and the bonding temperature applied by the lead bonding instrument to form a metal ball mold, and finally the micro-nano features are imprinted to a mask layer on the surface of a target substrate by controlling the metal ball mold by utilizing the lead bonding instrument under the action of the bonding force or the bonding force and the bonding temperature, and the mold preparation step and the imprinting and demolding step are finished by adopting a standard lead bonding instrument widely used in the industry and by virtue of the standard ball bonding and wedge bonding wire bonding process, so that the flexible and efficient transfer of the features with different micro-nano dimensions from the original mold to the target substrate can be conveniently realized, and different micro-nano dimension features can be flexibly selected and combined, the precision is high; compared with the existing methods such as photoetching, nano-imprinting and the like, the method provided by the invention has the advantages of small number of required original molds and capability of flexibly selecting and combining different micro-nano scale characteristics.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic process diagram illustrating the steps of preparing a mold according to one embodiment of the present invention;
FIG. 2 is a schematic process diagram of the imprinting and demolding step according to one embodiment of the present invention;
FIG. 3 is a schematic process diagram of the imprinting and demolding step according to the second embodiment of the present invention;
FIG. 4 is a schematic diagram of the process of the invention for the discarding step of the metal ball mold;
FIG. 5 is a schematic diagram of a process of stacking, imprinting and re-engraving different micro-nano scale features in the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
An imprinting method of micro-nano characteristics comprises a mold preparation step and an imprinting and demolding step, wherein,
as shown in fig. 1, a schematic process diagram of the mold preparation steps is realized by a simulated ball bonding-wedge bonding process of a standard wire bonder, which specifically includes:
as shown in fig. 1(a) and 1(b), first, by operating a wire bonder, a metal ball 103 is generated by electrically striking a fire between a striking electrode 20 and a wire 101, the metal ball 103 being formed at a bottom end of the wire 101;
then, as shown in fig. 1(c), the metal ball 103 is controlled to move by using a wire bonder and is controlled to contact the flat substrate 301 with a smooth surface downwards, a bonding force is applied downwards by using the wire bonder through the porcelain nozzle 102, the end of the metal ball 103 is pressed downwards to the flat substrate 301, so that the bottom end of the metal ball forms an imprinting plane, as shown in fig. 1(d), and then the metal ball is separated from the contact flat substrate 301;
in the above step, the smooth-surfaced planar substrate 301 is made of silicon (surface polishing treatment), the applied wire bonding force is set to be 1500mN, the bonding time is 50ms, no ultrasonic vibration energy is applied, and the planar diameter of the top end of the formed metal ball 103 is about 80 μm;
finally, as shown in fig. 1(e) and fig. 1(f), the imprint plane at the bottom end of the metal ball 103 is contacted with the micro-nano scale feature structure 402 on the surface of the original mold 401 prepared in advance by using the control of the wire bonding instrument, and under the action of the bonding force and the bonding temperature (the bonding force and the bonding temperature are generated by using the wire bonding instrument), the imprint plane material at the bottom of the metal ball 103 can extrude and fill the micro-nano scale feature structure 402 (i.e. the micro-nano feature) on the surface of the original mold 401, so that the micro-nano scale feature structure 402 on the surface of the original mold 401 can be imprinted on the imprint plane at the bottom of the metal ball 103, and the metal ball 103 forms the metal ball mold 105.
After the above steps are completed, the imprinting and demolding steps are performed, the process is as shown in fig. 2, and the process is realized by using a simulated single-step ball bonding process of a wire bonding instrument, and the imprinting and demolding steps comprise:
as shown in fig. 2(a), a wire bonding instrument is used to control the metal ball mold 105 to move and contact the mask layer 602 on the surface of the target substrate 601, and the mask layer 602 is caused to press and fill the micro-nano feature 104 of the imprinting plane at the bottom of the metal ball mold 105 under the action of the bonding force and the bonding temperature applied by the wire bonding instrument, so that the micro-nano feature 104 can be imprinted on the mask layer 602.
As shown in fig. 2(b), after the mask layer 602 is cured, the metal ball mold 105 is separated from the mask layer 602 on the surface of the target substrate 601, so that a micro-nano structure 603 with the size characteristic of the re-engraved micro-nano feature structure 104 is formed on the surface of the mask layer 602, and the imprinting transfer of the micro-nano feature from the original mold 401 to the target substrate 601 is accurately realized.
In the steps of imprinting and demolding, an electronic sparking current in the process of wire bonding is led into a grounding unit from the sparking electrode 20 in advance, so that the current is prevented from passing through the metal ball mold 105, and deformation and damage of the micro-nano feature structure 104 on the bottom surface of the metal ball mold 105 are avoided.
Specifically, the grounding unit is a grounding metal rod 50, and more specifically, the grounding metal rod 50 may be a tungsten needle or an independent gold wire;
understandably, since the bottom end of the metal ball 103 forms an imprinting plane, the micro-nano scale feature structure 402 on the surface of the original mold 401 can be ensured to be completely imprinted at the bottom of the metal ball 103, and the incompleteness of the micro-features in the imprinting and re-engraving process is avoided.
The method for imprinting the micro-nano features comprises the steps of triggering electronic ignition by controlling a lead bonding instrument to enable the tail end of a metal wire to form a metal ball, utilizing bonding force and bonding temperature applied by the lead bonding instrument to enable the micro-nano features on the surface of an original mold to be imprinted on an imprinting plane of the metal ball to form a metal ball mold, and finally utilizing the lead bonding instrument to control the metal ball mold to imprint the micro-nano features on a mask layer on the surface of a target substrate under the action of the bonding force or the bonding force and the bonding temperature, wherein the mold preparation step and the imprinting and demolding step are completed by adopting a standard lead bonding instrument widely used in the industry and by means of standard ball bonding and wedge bonding process procedures, so that flexible and efficient transfer of the features with different micro-nano dimensions from the original mold to the target substrate can be conveniently realized, and different micro-nano dimension features can be flexibly selected and combined, the precision is high; compared with the existing methods such as photoetching, nano-imprinting and the like, the method provided by the invention has the advantages of small number of required original molds and capability of flexibly selecting and combining different micro-nano scale characteristics.
Optionally, in the steps of imprinting and demolding, the electronic ignition current can also be set to be a low current value and set to be close to a zero value, so that the current can be prevented from influencing the surface microstructure characteristic morphology of the metal ball mold, deformation and damage can be prevented, a grounded metal rod is avoided, and the process is simplified.
Alternatively, the metal ball 103 may be formed by electrically striking a metal wire made of Au, Ag, Al, Cu, or the like, or an alloy thereof, and specifically, the metal ball material provided in this embodiment example is gold having a diameter of 125 μm, and a gold wire having a diameter of 25 μm is used.
Optionally, the original mold 401 provided in this embodiment is a silicon wafer, the micro-nano scale feature structure on the surface of the original mold is a circular micro-pit with a diameter of 10 μm and a depth of 2 μm, and patterning is achieved by photolithography and reactive ion etching; the applied wire bonding force was set to 2500mN, the bonding time was 100ms, the bonding temperature was 200 ℃, and no ultrasonic vibration energy was applied.
Optionally, the micro-nano features on the surface of the original mold 401 are prepared by a process of photolithography, electron beam etching, and reactive ion etching.
Optionally, in this embodiment, the mask layer 602 is a thermoplastic polymer material, the mask layer is deposited on the target substrate by spin coating or spray coating, and the thickness of the mask layer is greater than the depth of the micro-nano features on the surface of the metal ball mold.
Alternatively, in this embodiment, a thermoplastic polymer material is used for the mask layer 602, so in this embodiment, the mask layer 602 on the target substrate 601 is cured by a heat treatment.
After the stamping and demolding steps are finished, the present embodiment further includes a post-processing step, including:
with reference to fig. 2(b) and 2(c), the mask layer 602 on the surface of the target substrate 601 is processed by using a process such as oxygen plasma etching, the remaining mask layer material at the bottom of the micro-nano structure 603 and covering the surface of the target substrate 601 is removed, and the target substrate material is exposed (as shown in fig. 2 (c)), so that the target substrate can be processed by a process such as reactive ion etching.
Alternatively, the target substrate 601 may be selected from wafer-like standard size substrates, small die substrates, and other sizes of flexible or non-flexible substrates.
The metal ball mold 105 may be recycled.
Through the steps, complete imprinting transfer of the micro-nano scale features is completed once.
Example two
The embodiment is similar to the embodiment, and is different in that, as shown in fig. 3(a), after the mask layer 702 presses and fills the micro-nano feature structure 104 of the imprinting plane at the bottom of the metal ball mold 105 so that the micro-nano feature structure 104 is imprinted on the mask layer 702, ultraviolet light is utilized to upwardly penetrate through the target substrate 701 and the mask layer 702 is cured;
in order to enable ultraviolet light required for curing the mask layer 702 to penetrate through the target substrate 701, the target substrate 701 provided by this embodiment is a glass sheet for facilitating light penetration, the mask layer 702 is made of a photopolymerizable polymer material for facilitating curing of the mask layer 702 by light, and specifically, the mask layer 702 of this embodiment is made of a photoresist and has a thickness of about 3 μm; the applied bonding force is 200mN, the bonding time is 10s, the bonding temperature is room temperature, and no ultrasonic vibration energy is applied;
as shown in fig. 3(b), after the mask layer 702 is cured, the metal ball mold 105 is separated from the surface of the target substrate 701, so that a micro-nano structure 703 with the size characteristics of the micro-nano structure 104 is formed on the surface of the mask layer 702.
The parts not mentioned in this embodiment are the same as those in the first embodiment, and are not described again here.
Based on the first embodiment and the second embodiment, the method further includes a step of discarding the metal ball mold 105, as shown in fig. 4, the process is as follows:
as shown in fig. 4(a), when the metal ball mold needs to be prepared again to imprint and re-engrave new micro-nano features, the used metal ball mold 105 is bonded to the recovered substrate 801 with the metal plating layer 802 on the surface by operating the wire bonding apparatus under the action of the bonding pressure and the bonding temperature applied by the wire bonding apparatus, so that the metal ball mold 105 is detached from the metal wire 101 and fixed on the recovered substrate 801, thereby completing the disposal of the metal ball mold 105.
The recovery substrate 801 provided by the embodiment is a silicon bare chip, and the surface metal plating layer 802 is composed of TiW with a thickness of 50nm and Au with a thickness of 300nm, and is deposited by electron beam evaporation; the applied bonding force is 1000mN, the bonding temperature is 150 ℃, and the ultrasonic vibration energy is 30%;
as shown in fig. 4(b), then the ceramic nozzle 102 is lifted, the metal wire 101 is broken, and the metal ball mold 105 becomes a waste metal ball mold 106 attached to the recovery substrate 801;
the broken metal wire 101 can be used for preparing a new metal ball mold so as to imprint and re-etch new micro-nano features.
Based on the first embodiment and the second embodiment, further, as shown in fig. 5, the method further includes a process schematic process of transferring and stacking different micro-nano scale features on the target substrate, namely, after completing the imprinting of the micro-nano features once and etching the surface of the target substrate, recoating the mask layer on the target substrate printed with the micro-nano features, and imprinting the mask layer with different shapes of the micro-nano features at the positions corresponding to the positions printed with the micro-nano features, so as to realize the stacking combination imprinting of multiple different micro-nano features, wherein the process schematic process includes the steps of:
firstly, the transfer method of the first embodiment is utilized to complete the imprinting transfer of the first micro-nano scale structural feature 604 on the target substrate 601, as shown in fig. 5(a), and the specific process is not repeated;
next, the target substrate 601 is subjected to deep reactive ion etching to form a micro-nano scale structure 605, as shown in fig. 5 (b);
removing the mask layer on the surface of the target substrate 601 by using a solvent such as acetone, as shown in fig. 5 (c);
coating a new mask layer 606 on the surface of the target substrate 601 again, wherein the mask layer material is still thermoplastic plastics, as shown in FIG. 5 (d);
then, as shown in fig. 5(e) to 5(f), by using the optical alignment function of the wire bonding instrument, by the same method as the first embodiment, the imprint transfer of the second micro-nano-scale feature 109 is performed on the target substrate 601 at a position above the first micro-nano-scale structure 605, so that the second micro-nano-scale structure 607 stacked with the first micro-nano-scale structure 605 is formed on the new mask layer 606, which is equivalent to imprinting the micro-nano features of different shapes again on the mask layer at the position corresponding to the micro-nano features already imprinted; the materials and process parameters adopted in the embodiment are the same as those in the first embodiment, and thus the description is omitted;
finally, as shown in fig. 5(g) to 5(h), the target substrate 601 is further subjected to an implementation method as shown in fig. 5(a) to 5(c), two different micro-nano- scale structures 605 and 608 are formed and etched on the target substrate 601, as shown in fig. 5(h), finally, the stacked combination imprinting of multiple different micro-nano features on the same target substrate is realized, wherein the micro-nano-scale features stacked with each other are generally centrosymmetric patterns, and thus the requirement on rotational positioning precision during alignment is low.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for imprinting micro-nano features is characterized by comprising a mold preparation step and an imprinting and demolding step, wherein,
the preparation steps of the mould are as follows: the method comprises the steps of enabling the tail end of a metal wire to form a metal ball by controlling electronic ignition of a lead bonding instrument, controlling the metal ball to contact a plane substrate and apply bonding force to enable the tail end of the metal ball to form an imprinting plane, enabling the imprinting plane of the metal ball to be in mutual extrusion contact with a pre-prepared original mold by utilizing the bonding force and the bonding temperature applied by the lead bonding instrument, and enabling micro-nano characteristics on the surface of the original mold to be imprinted to the imprinting plane of the metal ball to form a metal ball mold;
the stamping and demolding steps are as follows: and pressing and contacting the metal ball mold and the mask layer on the surface of the target substrate by utilizing the bonding force or the bonding force and the bonding temperature applied by the lead bonding instrument, so as to promote the micro-nano characteristics of the imprinting plane on the metal ball mold to be imprinted to the mask layer on the surface of the target substrate, and separating the metal ball mold from the mask layer after the mask layer is solidified.
2. A method for imprinting micro-nano features according to claim 1, wherein in the imprinting and demolding step, an electronic sparking current is introduced into a grounding unit in advance to prevent the current from passing through the metal ball mold, and the grounding unit is a grounding metal rod.
3. A method for imprinting micro-nano features according to claim 1, wherein in the imprinting and demolding steps, the electronic ignition current is set to be a low current value so as to prevent the micro-nano features on the metal ball mold from being damaged by the current.
4. A method for imprinting micro-nano features according to claim 1, wherein in the imprinting and demolding step, the mask layer on the target substrate is subjected to heat treatment to achieve curing of the mask layer.
5. A method for imprinting micro-nano features according to claim 1, wherein in the imprinting and demolding step, ultraviolet light is used to penetrate the target substrate and to cure the mask layer.
6. The method for imprinting micro-nano features according to claim 1, wherein the micro-nano features on the surface of the original mold are prepared by a process of photolithography, electron beam etching, and reactive ion etching.
7. A method for imprinting micro-nano features according to claim 1, wherein the mask layer is a thermoplastic polymer material or a photopolymerizable polymer material, the mask layer is deposited on the target substrate by spin coating or spray coating, and the thickness of the mask layer is greater than the depth of the micro-nano features on the surface of the metal sphere mold.
8. A method for imprinting micro-nano features according to any one of claims 1 to 7, further comprising a post-processing step: and removing the residual mask layer material covering the surface of the target substrate at the bottom of the micro-nano feature so as to expose the target substrate.
9. The method for imprinting micro-nano features according to claim 1, wherein when a metal ball mold needs to be prepared again to imprint new micro-nano features, the used metal ball mold is bonded with a recovery substrate with a metal coating layer on the surface by operating a wire bonding instrument, so that the metal ball mold is separated from a metal wire and fixed on the recovery substrate to complete the waste treatment of the metal ball mold; the fractured metal wire is used for preparing a new metal ball so as to be used for imprinting new micro-nano characteristics.
10. The method for imprinting micro-nano features according to claim 1, wherein after one-time micro-nano feature imprinting is completed and the surface of the target substrate is etched, the target substrate imprinted with the micro-nano features is recoated with a mask layer, and the mask layer is imprinted with micro-nano features of different shapes at positions corresponding to the positions imprinted with the micro-nano features, so that the stacked combination imprinting of multiple different micro-nano features on the same target substrate is realized.
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