CN113835155B - Free space light and photon chip grating coupling method - Google Patents
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- 238000010168 coupling process Methods 0.000 title claims abstract description 97
- 230000008878 coupling Effects 0.000 claims abstract description 82
- 238000005859 coupling reaction Methods 0.000 claims abstract description 82
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000010287 polarization Effects 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000010894 electron beam technology Methods 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 4
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 4
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 4
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 20
- 238000004806 packaging method and process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 230000010354 integration Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29304—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
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Abstract
The disclosure provides a free space light and photonic chip grating coupling method, comprising: setting at least one grating coupler at the focal length of the superlens; the free space light is converged to a light receiving port of the grating coupler through the superlens; and coupling light matching its acceptance angle, direction and polarization into the waveguide through the grating coupler. The method can effectively solve the technical problems that in the prior art, the coupling of free space light and a waveguide is affected by energy dispersion, angle mismatch, mode field mismatch, small size of a grating coupler mode spot and the like, and the free space light power collected by a coupling device of a chip is very low.
Description
Technical Field
The disclosure relates to the technical field of micro-nano optics, in particular to a free space light and photon chip grating coupling method.
Background
Information technology in the latter molar age has become a focus of international social interest. Silicon photonics chip technology, which combines the advantages of ultra-large scale and ultra-high precision fabrication of microelectronics technology and ultra-high speed and ultra-low power consumption of photonics technology, is considered to be the most potential high-efficiency and low-cost on-chip solution. Optical coupling is a key core technology of a photon chip, and the problems of low coupling efficiency and difficult integration are faced at present. This is mainly due to the small waveguide size and the fact that there is a problem of mode matching with the fiber or free space light, resulting in very large coupling losses. Therefore, development of optical coupling techniques is needed to achieve lossless coupling, ensuring efficient coupling between optical emission, transmission and detection.
There are two main ways of coupling incident light to a photonic chip. One is fiber-waveguide coupling and the other is free space optical-waveguide coupling. Both of which aim to couple as much light as possible into the optical waveguide. The former is mainly used for receiving and transmitting signals in the data communication and processing process; the latter is used for object light imaging, astronomical observation, laser radar detection, etc. by receiving free space light.
There are two most widely used ways of coupling optical fibers to waveguides: the end-face coupling is coupled to the grating (vertically). The end surface coupling expands the mode field of the single-mode waveguide at the waveguide end through the mode spot converter, and the single-mode fiber is pulled and tapered to form the tapered lens fiber at the fiber end, so that the mode field of the fiber is reduced, and the efficient coupling of the waveguide and the fiber is realized. This coupling generally provides higher coupling efficiency, greater coupling bandwidth, and lower polarization sensitivity. The best design reported at present can realize that the highest efficiency of two polarization states is higher than-0.25 dB (94.41% @1550 nm) in experiment, and the 1dB bandwidth is about 100nm, but the best design requires a relatively complex manufacturing process, the spot-size converter often requires an exposure process below hundred nanometers, and the accuracy requirement on a photo/electron beam exposure machine is high. The assembly process is complex, a specialized V-groove is required to be designed to fix the optical fiber, and one end of the device is required to be at the end face, so that a plurality of technical difficulties are faced in the aspects of wafer level packaging and testing. The grating coupling is that the vertical incident light is coupled into the optical waveguide in the horizontal direction or the light in the waveguide is output into the optical fiber by the diffraction action of the grating and the 90 degrees turn of the grating coupler. This coupling mode is less efficient, has a relatively narrow bandwidth, and is generally polarization sensitive compared to end-face coupling. After means such as optimizing the grating structure, adding a covering layer or a reflecting layer, the coupling efficiency can be theoretically improved to-0.36 dB (92.04% @1550 nm). In contrast, the grating coupler is more compatible with high volume manufacturing and packaging processes, and can perform wafer level testing and analysis on any part of the silicon-based chip.
However, the coupling between free space light and the waveguide, whether it is end-face coupling or grating (vertical) coupling, is affected by the problem of mode field mismatch, so that development of new coupling techniques is needed to improve the coupling efficiency and promote development of photonic chips and application systems.
Disclosure of Invention
First, the technical problem to be solved
Based on the above problems, the disclosure provides a method for coupling free space light with a photonic chip grating, so as to alleviate the technical problems in the prior art that the coupling of the free space light with a waveguide is affected by energy dispersion, angle mismatch, mode field mismatch, small size of a grating coupler mode spot, and the like, and the free space light power collected by a coupling device of the chip is very low.
(II) technical scheme
The disclosure provides a free space light and photonic chip grating coupling method, comprising: setting at least one grating coupler at the focal length of the superlens; the free space light is converged to a light receiving port of the grating coupler through the superlens; and coupling light matching its acceptance angle, direction and polarization into the waveguide through the grating coupler.
According to the embodiment of the disclosure, a dielectric layer is arranged between the photonic chip and the superlens to provide support for the superlens.
According to the embodiment of the disclosure, the material of the dielectric layer is selected from silicon dioxide or magnesium fluoride, calcium fluoride, HSQ/FOX16 resistors, photoresist and organic resin.
According to the embodiment of the disclosure, the thickness of the dielectric layer is d, d=f/n, where f is the focal length of the superlens, and n is the refractive index of the dielectric layer material.
According to the embodiment of the disclosure, at least one grating coupler is arranged at the focal length of the superlens, and the light receiving ports of the at least one grating coupler are shared.
According to the embodiment of the disclosure, two grating couplers are arranged at the focal length of the superlens, and the two grating couplers are arranged at the relative positions of the plane where the light receiving port is located.
According to the embodiment of the disclosure, four grating couplers are arranged at the focal length of the superlens, and the four grating couplers are arranged in a plane where the light receiving port is located in a pair-by-pair manner.
According to the embodiment of the disclosure, the diameter of the light transmission hole of the superlens is larger than the diameter of the light receiving opening, and the diameter of the light receiving opening is larger than the diameter of the light spot of the space free light converged by the superlens.
According to embodiments of the present disclosure, the superlens is fabricated directly on the dielectric layer using an electron beam, photolithographic exposure, or nanoimprint method.
According to the embodiment of the disclosure, a plurality of superlenses are arranged, and the plurality of superlenses are distributed in an array corresponding to free space light.
(III) beneficial effects
The above technical solution can show that the free space light and photonic chip grating coupling method of the present disclosure has at least one or a part of the following advantages:
(1) The high-efficiency coupling of the free space light and the photonic chip is realized, the caliber of a light receiving port of the photonic chip can be increased from 10 micrometers to hundreds of micrometers of a conventional coupling device, the acquisition capacity of the photonic chip for the free space light is improved by hundreds of times, and the signal to noise ratio of the photonic chip is greatly improved;
(2) The difficulty of integrated packaging of the superlens and the photonic chip is solved, so that various photonic chips with different types can be applied to photoelectric systems, and the application process of small-sized, high-speed and low-energy photonic systems (imaging detection systems, phased array laser radar systems, space communication systems and the like) is promoted.
Drawings
Fig. 1 is a schematic diagram of a free space light and photonic chip grating coupling method according to an embodiment of the present disclosure.
Fig. 2a is a schematic diagram of a free-space light and photonic chip grating coupling method according to an embodiment of the present disclosure when a grating coupler is used.
Fig. 2b is a schematic diagram of a free-space light and photonic chip grating coupling method according to an embodiment of the present disclosure when two grating couplers are used.
Fig. 2c is a schematic diagram of a free-space light and photonic chip grating coupling method according to an embodiment of the present disclosure when four grating couplers are used.
Fig. 3 is a schematic diagram of a super lens and photonic chip integrated package scheme using a grating coupler in a free space light and photonic chip grating coupling method according to an embodiment of the present disclosure.
Fig. 4 is a schematic diagram of a super lens array and a photonic chip integrated package scheme using a grating coupler array in a free space light and photonic chip grating coupling method according to an embodiment of the present disclosure.
Fig. 5 is a flow chart of a free space light and photonic chip grating coupling method according to an embodiment of the present disclosure.
Detailed Description
The present disclosure provides a method for coupling free space light with a photonic chip grating, which utilizes a super surface film micro lens (super lens) to improve the coupling efficiency of the free space light and the photonic chip, and greatly improves the light receiving capability of the photonic chip by the aperture matching of the super lens and a light receiving port of a grating coupler.
The inventor finds that the superlens is used as an artificial nano structure, and can modulate the intensity and the phase of a space light field through the design of a unit structure and arrangement, thereby realizing the light converging function. The device is mainly characterized by being ultrathin, designable, controllable and matched with the size and the mode field of an on-chip photon device (waveguide, coupler and the like). And the CMOS technology is compatible by adopting standard photoetching, electron beam exposure and etching methods for processing. The F number of the superlens (f=f/D, D is the diameter and F is the focal length) is the main parameter that determines the coupling efficiency of the lens, the diameter D determines the magnification, and the focal length F determines the size of the converging spot. The superlens and the chip set provide a new solution for efficiently receiving free space light, and promote the application process of various photonic chips such as imaging chips, phased array laser radar chips, neural network chips and quantum chips.
Since the free-space optical power collected by the coupling device of the photonic chip is very low (determined by the energy distribution of the optical field across the chip and the coupling area of the device). Thus the present disclosureThe technical scheme is that from the angle of increasing the coupling area, the manually designed super-surface lens is adopted to collect free space light onto the photon chip, and the free space light enters the optical waveguide through the grating coupler. Greatly improving light receiving capability of photonic chip by large caliber super surface lens (light receiving capability=super lens area S) 2 Light receiving area S of coupler 1 ) And the adoption of the refractive index matching optical material for carrying out integrated packaging on the superlens and the photon chip is a main problem to be solved by the present disclosure.
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
In an embodiment of the present disclosure, a method for coupling free space light with a photonic chip grating is provided, and in combination with fig. 1 to 5, the method for coupling free space light with a photonic chip grating includes:
operation S1: setting at least one grating coupler at the focal length of the superlens;
operation S2: the free space light is converged to a light receiving port of the grating coupler through the superlens:
operation S3: coupling light matched with the light receiving angle, direction and polarization of the light into the waveguide through the grating coupler;
in the embodiment of the disclosure, the coupling efficiency of free space light and a photonic chip is improved by utilizing the ultra-surface film micro lens (super lens), and the light receiving capacity of the photonic chip is greatly improved by matching the caliber of the super lens and the light receiving port of the grating coupler.
In the embodiment of the disclosure, when the superlens is coupled with the grating coupler, the superlens is placed above the grating coupler at a position with a distance of a focal length f. The incident free space light is converged to the light receiving port of the grating coupler through the superlens, and after reaching the grating coupler, the light matched with the light receiving angle and direction is coupled into the waveguide through the diffraction effect of the grating. Light-transmitting port area S using superlens 2 Area S of light receiving port of grating coupler 1 The ratio between the two can estimate the light receiving capacity (compared with the coupling on the optical chip only, the super lens is usedThe maximum improvement in post-light coupling intensity). The light collected by the superlens is axially symmetric, but limited by the principle of diffraction, the light receiving direction of the grating coupler is directional. Thus, the optical coupling efficiency (defined as the proportion of incident light entering the waveguide in the area of the light receiving port of the coupler) can be improved by arranging grating couplers with different propagation directions. The present disclosure proposes integrating a superlens with a grating coupler that transmits in four directions, front, back, left, and right, thereby further improving coupling efficiency and achieving more efficient utilization of incident light.
When the superlens and the grating coupler are integrated and packaged, the fixation and packaging of the relative positions of the superlens and the grating coupler are the precondition for realizing practical application of the photonic chip. The present disclosure proposes a method of adding a dielectric layer between a photonic chip and a superlens to provide support for the superlens. The superlens may be fabricated directly on the dielectric layer using electron beam or photolithographic exposure. Alignment marks are used in the exposure process to realize alignment of the positions of the superlens and the grating coupler. The material of the dielectric layer can be silicon dioxide or a material which is in dielectric matching with the silicon dioxide, such as inorganic materials like magnesium fluoride and calcium fluoride, or organic materials like HSQ (hydrogen silsesquioxane)/FOX 16 resistors, photoresist and organic resin. The thickness d is determined by the focal length f and the refractive index n of the material: d=f/n.
The integration and packaging of the superlens array and the grating coupler array may be performed in a similar manner. As shown in fig. 4, a plurality of thin film superlenses are manufactured on the surface of the dielectric layer, at least one grating coupler is arranged at the focal length of each thin film superlens to form grating coupling units, the plurality of thin film superlenses are arranged in an array, and the plane where the grating coupling units are positioned is parallel to the plane where the superlenses are positioned; the grating coupling units are staggered, so that more grating coupling units can be arranged in the dielectric layer in unit area, the arrangement of the film superlenses is more compact, and the coupling capacity and the coupling efficiency of the photon chip are further improved. Positional alignment between the superlens and the grating coupler may be achieved using alignment marks during lithography or electron beam exposure.
At the bookIn the disclosed embodiments, the efficiency of light entering the waveguide directly is very low, almost zero, because of the small size of the waveguide, which is difficult to mode match with free space light. The light receiving port of the waveguide is usually connected to a coupler, such as a grating coupler shown in fig. 1, and the incident light is guided into the optical waveguide in the horizontal direction through a nearly 90-degree turn by the diffraction action of the grating. Simulation results show that a conventional grating coupler (the area of a light receiving port of a grating is S 1 ) The optical coupling efficiency can be improved to about 47% (referring to at S) 1 47% of the light in the area range can be collected).
In the disclosed embodiment, as shown in fig. 2 a-2 c, free space light passes through a superlens and a one, two, four grating coupler coupling scheme. The superlens converges large-area light to a focus, and improves the optical power density of unit area, so that the coupling light intensity can be greatly improved. As shown in fig. 2a, superlens area S 2 Area S of light receiving port of coupler 1 The ratio determines the ideal improvement of the optical coupling intensity after the superlens is used (the area of the focal point after the superlens is converged is S 1 ' generally S 1 ’＜S 1 ，S 1 ' and S 1 The light receiving efficiency is highest when the areas are equivalent). The light collected by the superlens is axially symmetric, but the light receiving direction of the grating coupler is directional. Therefore, the optical coupling efficiency can be greatly improved by designing grating couplers with different coupling directions. As shown in fig. 2b, when the grating coupler is increased to two, the coupling efficiency can be theoretically increased by two times. As shown in fig. 2c, when the number of grating couplers is increased to four, a closed space is formed at the periphery of the light receiving port, and the coupling efficiency can reach 100% theoretically. The number of the grating couplers can be three, the three grating couplers are uniformly distributed in the plane where the light receiving port is located to form an equilateral triangle closed space, and the coupling efficiency can reach 100% theoretically.
In the embodiment of the present disclosure, as shown in fig. 3, the integration and packaging of the superlens and the photonic chip are required for practical application. The present disclosure proposes a method of adding a dielectric layer between a photonic chip and a superlens to provide support for the superlens. The material of the dielectric layer can be silicon dioxide or a material which is in dielectric matching with the silicon dioxide, such as inorganic materials like magnesium fluoride and calcium fluoride, or organic materials like HSQ (hydrogen silsesquioxane)/FOX 16 resistors, photoresist and organic resin. The inorganic and organic materials can be formed on the chip by plating (sputtering, physical deposition) or spin coating, respectively. Thereafter, a superlens is fabricated on the dielectric layer using electron beam or photolithographic exposure. And (3) aligning the positions of the superlens and the grating coupler by using the alignment mark in the exposure process. The thickness d of the dielectric layer is determined by the focal length f and the refractive index n of the material: d=f/n.
We have performed experimental tests on the superlens and single vertical coupler coupling scheme shown in fig. 2a, with the coupling efficiency test results shown in table 1 below.
TABLE 1 coupling efficiency test results table for film superlens and imaging chip
For a grating coupler with a 10-micrometer mode field, coupling tests are carried out by using superlenses with different parameters, wherein the magnification of the light receiving area is the ratio of the area of the superlens to the area of a light receiving opening of the grating coupler, and the larger the light receiving area of the superlens is, the larger the F (F/D) number is, and the stronger the light receiving capacity (coupling power) is. When the diameter of the superlens is 150 micrometers and the focal length is 300 micrometers, the actually measured light receiving capacity is improved by 168 times and is close to 225 times of the magnification of the light receiving area after the superlens is placed.
Thus, embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the elements and methods are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
From the above description, one skilled in the art should clearly recognize the method of free-space light and photonic chip grating coupling of the present disclosure.
In summary, the present disclosure provides a method for coupling free-space light with a photonic chip grating, which solves the technical problems associated with optical coupling in photonic chip system applications. For applications of silicon optical modules, there are some technical solutions for optical fiber and waveguide coupling, but free space light and photonic chip coupling still faces technical challenges. The superlens and photonic chip coupling scheme proposed by the present disclosure provides a solution to this challenge. The superlens has the advantages of ultra-thin, micro, easy array processing and integration, and the like, and is an excellent optical device capable of being matched with a photon chip. Integration of the superlens can increase the optical coupling intensity (photon chip light receiving capability) by S compared to the case of not using the superlens 2 /S 1 Multiple times. Aiming at the grating coupling mode, the invention provides a corresponding super-lens fixing and packaging scheme, solves the difficult problem of high coupling efficiency photonic chip integration application, and provides technical guarantee for research and development and commercialization of a novel photonic integrated application system.
It should be further noted that, the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings, and are not intended to limit the scope of the present disclosure. Like elements are denoted by like or similar reference numerals throughout the drawings. Conventional structures or constructions will be omitted when they may cause confusion in understanding the present disclosure. And the shapes and dimensions of the various elements in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of the embodiments of the present disclosure.
The use of ordinal numbers such as "first," "second," "third," etc., in the description and the claims to modify a corresponding element does not by itself connote any ordinal number of elements or the order of manufacturing or use of the ordinal numbers in a particular claim, merely for enabling an element having a particular name to be clearly distinguished from another element having the same name.
Furthermore, unless specifically described or steps must occur in sequence, the order of the above steps is not limited to the list above and may be changed or rearranged according to the desired design. In addition, the above embodiments may be mixed with each other or other embodiments based on design and reliability, i.e. the technical features of the different embodiments may be freely combined to form more embodiments.
While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (6)
1. A method of free space light and photonic chip grating coupling comprising:
arranging a plurality of grating couplers at the focal length of the superlens;
the free space light is converged to a light receiving port of the grating coupler through the superlens; and
coupling light matched with the light receiving angle, direction and polarization of the light into the waveguide through the grating coupler;
a dielectric layer is arranged between the photon chip and the superlens to provide support for the superlens, the thickness of the dielectric layer is d, d=f/n, f is the focal length of the superlens, and n is the refractive index of the dielectric layer material;
the diameter of the light-passing hole of the super lens is larger than that of the light-receiving opening, and the diameter of the light-receiving opening is larger than that of the light spot of the space free light converged by the super lens.
2. The method for coupling free-space light and photonic chip grating according to claim 1, wherein the material of the dielectric layer is selected from silicon dioxide or magnesium fluoride, calcium fluoride, HSQ/FOX16 resistors, photoresist and organic resin.
3. The method for coupling free-space light and photonic chip grating according to claim 1, wherein two grating couplers are arranged at the focal length of the superlens, and the two grating couplers are arranged at the relative positions of the plane where the light receiving port is located.
4. The method for coupling free space light and photonic chip grating according to claim 1, wherein four grating couplers are arranged at the focal length of the superlens, and the four grating couplers are arranged in a plane where the light receiving port is located in a pair-by-pair manner.
5. The method for coupling free-space light and photonic chip grating according to claim 1, wherein the superlens is directly manufactured on the dielectric layer by adopting an electron beam, photoetching exposure or nano-imprinting method.
6. The method for coupling free-space light to a photonic chip grating according to any one of claims 1 to 5, wherein a plurality of superlenses are arranged such that the plurality of superlenses are distributed in an array corresponding to the free-space light.
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| CN116413856B (en) * | 2023-06-12 | 2024-01-09 | 之江实验室 | End face coupler and preparation method thereof |
| CN116449490B (en) * | 2023-06-19 | 2023-09-05 | 南昌大学 | Preparation method of three-dimensional light quantum chip module and three-dimensional light quantum chip module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050007989A (en) * | 2003-07-12 | 2005-01-21 | 한국전자통신연구원 | Focusing waveguide grating coupler and optical pickup head using the same |
| CN210119596U (en) * | 2019-04-29 | 2020-02-28 | 浙江大学 | Silicon-based artificial microstructure super-surface waveguide coupler |
| CN111045219A (en) * | 2019-12-28 | 2020-04-21 | 中国科学院长春光学精密机械与物理研究所 | Planar photoelectric detection system based on color separation focusing diffraction optical element |
| CN111817134A (en) * | 2020-09-03 | 2020-10-23 | 武汉云岭光电有限公司 | Vertical cavity surface emitting laser and manufacturing method thereof, coupling device and manufacturing method thereof |
| CN112946789A (en) * | 2021-01-29 | 2021-06-11 | 中国科学院长春光学精密机械与物理研究所 | Interference flat-plate imaging system based on super lens array and photonic integrated chip |
-
2021
- 2021-09-16 CN CN202111090253.9A patent/CN113835155B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050007989A (en) * | 2003-07-12 | 2005-01-21 | 한국전자통신연구원 | Focusing waveguide grating coupler and optical pickup head using the same |
| CN210119596U (en) * | 2019-04-29 | 2020-02-28 | 浙江大学 | Silicon-based artificial microstructure super-surface waveguide coupler |
| CN111045219A (en) * | 2019-12-28 | 2020-04-21 | 中国科学院长春光学精密机械与物理研究所 | Planar photoelectric detection system based on color separation focusing diffraction optical element |
| CN111817134A (en) * | 2020-09-03 | 2020-10-23 | 武汉云岭光电有限公司 | Vertical cavity surface emitting laser and manufacturing method thereof, coupling device and manufacturing method thereof |
| CN112946789A (en) * | 2021-01-29 | 2021-06-11 | 中国科学院长春光学精密机械与物理研究所 | Interference flat-plate imaging system based on super lens array and photonic integrated chip |
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