CN113833634A

CN113833634A - Electromagnetic drive type MEMS micropump and integrated processing technology thereof

Info

Publication number: CN113833634A
Application number: CN202111022701.1A
Authority: CN
Inventors: 徐天彤; 李海旺; 王文斌; 陶智; 朱凯云; 吴瀚枭
Original assignee: Beihang University
Current assignee: Beihang University
Priority date: 2021-09-01
Filing date: 2021-09-01
Publication date: 2021-12-24
Anticipated expiration: 2041-09-01
Also published as: CN113833634B

Abstract

The invention discloses an electromagnetic drive type MEMS micropump and an integrated processing technology, comprising a micropump body and a fluid channel, wherein a permanent magnet, an MEMS coil and a soft magnetic iron core are arranged in the fluid channel, and the soft magnetic iron core and the permanent magnet form a double annular magnetic circuit; the fluid channel is communicated with an inlet and an outlet; the inlet has an inlet sub-channel in communication with the fluid channel and the outlet has an outlet sub-channel in communication with the fluid channel; the joint of the inlet auxiliary channel and the fluid channel is provided with an inlet check valve, and the joint of the outlet auxiliary channel and the fluid channel is provided with an outlet check valve; the micro pump realizes the unidirectional flow of liquid through the inlet check valve and the outlet check valve. The MEMS micropump solves the problem of liquid return of a valveless micropump, the introduction of the check valve can effectively increase the continuity of the flow of pump liquid, and the micropump has stronger performance in a scene needing accurate liquid control, and is easier to integrate with a microfluidic technology and has more purposes due to the introduction of planarization design and MEMS integrated processing.

Description

Electromagnetic drive type MEMS micropump and integrated processing technology thereof

Technical Field

The invention relates to the technical field of micropumps, in particular to an electromagnetic drive type MEMS micropump and an integrated processing technology of the micropump.

Background

Micropumps are important components of the development of micro-fluidic and Lab-on-a-chip technologies, such as modern drug precision delivery systems, micropower systems, microelectronic system cooling systems, and the like. Driving methods are mainly classified into piezoelectric, electrostatic, thermo-pneumatic (thermal-pneumatic) and electromagnetic, and electromagnetic is widely studied in research and industry due to its characteristics such as precise flow control and ultra-low power consumption.

The existing electromagnetic micropump usually consists of a planar coil or a wound coil, a PDMS film, a permanent magnet adhered to the PDMS film, a channel and a substrate. The permanent magnet is attracted or repelled by energizing the coil and the restoring force is provided by the PDMS membrane.

An electromagnetic micropump (from Gidde, Pawar, change, dhakaye, design and electromagnetic action based on differential application. microsystem Technologies 2019,25(Issue): 509-.

In addition, in the prior art, chinese patent application with publication number CN107975463A also proposes a plunger type electromagnetic micropump with a permanent magnet one-way valve, which is shown in fig. 2, and utilizes electromagnetic force generated by energizing the wound electromagnetic coils 1 and 2 to drive the permanent magnet column 3 to reciprocate to drive fluid in the circular tube flow channel 4 to move, and uses a machined spherical one-way valve to realize one-way rectification, thereby ensuring the one-way property of the pump.

Through careful analysis of two electromagnetic micropump structures disclosed in the prior art, it is easy to find that the electromagnetic micropump in the prior art still has the following defects:

1. the winding coil is large in size, large in manual winding error, incapable of accurately controlling inductance and not beneficial to batch production;

2. the integration level of the pump and the micro-channel is poor, and the driving coil of the micro-pump in the form of PDMS membrane in FIG. 1 or the driving coil of the piston type micro-pump in FIG. 2 is outside the channel, so that the characteristic of the pump can be changed due to the assembly error;

3. most of valve designs of the existing plane micropumps are valve-free designs, the micropumps with the valve-free designs are low in efficiency and have backflow, so that liquid after the pumps and liquid before the pumps can be mixed, and the micropumps are not suitable for supplying liquid in chemical, biological and medical experiments. The micro-pump structure disclosed in fig. 2 is mainly based on a typical check valve, and has no restoring force, poor feeding performance under low-frequency driving, and low efficiency.

Therefore, in view of the above-mentioned drawbacks of the prior art, there is a need for a new electromagnetic MEMS micropump and an integrated process for fabricating the same.

Disclosure of Invention

The invention aims to provide an electromagnetic drive type micropump with high integration level and high performance based on an MEMS (micro-electromechanical system) process and a check valve, so as to overcome the defects of poor integration level, large volume and poor valve performance of the micropump in the prior art.

In order to achieve the above purpose, the invention provides the following technical scheme:

the invention provides an electromagnetic drive type MEMS micropump, comprising:

a micro pump body;

the fluid channel is formed in the middle of the micro pump body, and a permanent magnet is arranged in the fluid channel;

MEMS coils formed on both sides of the fluid channel; and

the soft magnetic iron core and the permanent magnet form a double-annular magnetic circuit;

an inlet and an outlet are communicated with the fluid channel;

the inlet having an inlet sub-channel in communication with the fluid channel, the outlet having an outlet sub-channel in communication with the fluid channel;

the junction of the inlet attachment channel and the fluid channel is provided with an inlet check valve, and the junction of the outlet attachment channel and the fluid channel is provided with an outlet check valve;

the micro pump realizes the unidirectional flow of liquid through the inlet check valve and the outlet check valve.

Furthermore, the inlet check valve and the outlet check valve are connected with the bent and extended base material spring and are connected with the base plate of the micro pump body through end lugs.

The invention discloses an integrated processing technology of an electromagnetic drive type MEMS micropump, wherein the micropump is processed by using three wafers, namely a first wafer, a second wafer and a third wafer, and the integrated processing technology mainly comprises the following steps:

s1, manufacturing a micro-pump substrate, wherein the manufacturing of the micro-pump substrate comprises manufacturing of a micro-pump upper substrate and manufacturing of a micro-pump lower substrate, a first wafer is processed to form the micro-pump upper substrate, and a third wafer is processed to form the micro-pump lower substrate;

s2, manufacturing a micro-pump fluid channel, a soft magnetic iron core and a check valve, processing a second wafer and bonding the second wafer and the first wafer into a first whole at a low temperature;

s3, electroplating the soft magnetic iron core;

s4, manufacturing a permanent magnet base material;

s5, bonding a third wafer, and bonding the third wafer and the first whole into a whole at low temperature;

s6, manufacturing the MEMS coil by electroplating;

s7, magnetizing the permanent magnet;

and S8, cutting to obtain individual micropumps.

Further, the specific steps of manufacturing the micropump substrate in the step S1 are as follows:

s101, cleaning the first wafer and the third wafer by using a Prianha solution;

s102, carrying out thermal oxidation treatment on the first wafer, respectively etching a plurality of parallel coil grooves and vertical through holes according to the positions and the shapes of the coil grooves on the bottom surfaces of the MEMS coils on the two sides and the positions and the shapes of the vertical holes, and cleaning by using a Prianha solution to obtain a lower substrate;

s103, carrying out thermal oxidation treatment on the third wafer, respectively etching a plurality of parallel coil grooves, vertical through holes, four lead wire pad grooves and check valve expansion flow channel grooves according to the position and the shape of the coil grooves on the top surface of the MEMS coil on the two sides, the position and the shape of leads of the MEMS coil, the position and the shape of a flow channel on one side of the check valve close to the permanent magnet and the position and the shape of a vertical hole of the MEMS coil, and cleaning by using a Prianha solution to obtain the upper substrate.

Further, the specific step of step S2 is:

s201, cleaning a second wafer by using a Prianha solution;

s202, carrying out thermal oxidation treatment on the second wafer, and etching boss-shaped bonding points and vertical hole grooves according to the positions and the shapes of connection bosses of the inlet and outlet check valves and the substrate, the shapes of fluid channels and the positions and the shapes of vertical holes of the MEMS coil;

s203, cleaning the first wafer and the second wafer by using a Prianha solution, and cleaning the first wafer and the second wafer by using an RCA method;

s204, placing one surface of the first wafer, which is not provided with the coil groove, opposite to the etched surface of the second wafer, aligning the etched surfaces through the alignment mark, and bonding the first wafer and the second wafer at a low temperature to obtain a first whole;

s205, respectively etching an auxiliary channel, an inlet check valve, an outlet check valve, a soft magnetic core groove and an MEMS coil vertical hole on one surface of the first integral non-coil groove according to the position and the shape of a fluid channel, the position and the shape of the inlet and outlet check valve, the position and the shape of the MEMS coil vertical hole and the position and the shape of the soft magnetic core, and releasing the inlet and outlet check valve spring at the moment.

Further, the specific step of step S3 is:

s301, cleaning the first whole body by using a Prianha solution;

s302, performing thermal oxidation treatment on the first whole body to form an oxide layer;

s303, sputtering a titanium metal layer on one surface of the cleaned soft magnetic core groove of the first whole according to the position and the shape of the soft magnetic core groove;

s304, sputtering or chemically plating the soft magnetic iron core groove sputtered in the step S303 to obtain an iron or nickel metal layer on the titanium metal layer;

s305, protecting the position of the first integral soft magnetic iron core groove and forming a protective layer;

s306, electroplating iron-nickel alloy or iron-cobalt alloy at the soft magnetic iron core slot, wherein the electroplating height is up to the etching depth;

and S307, removing the protective layer.

Further, the specific step of step S4 is:

s401, protecting the soft magnetic iron core and forming a protective layer;

s402, etching the shape of the permanent magnet on the first whole electroplated with the iron-cobalt alloy or the iron-nickel alloy in the S306 at the position of the fluid channel according to the position and the shape of the permanent magnet, wherein beams exist on the periphery and are connected with surrounding matrixes to prepare for subsequent release;

s403, washing the first whole obtained in the step S402 by using a Prianha solution;

s404, sputtering a titanium metal layer on one surface of the first whole body in the shape of the permanent magnet cleaned in the step S403 according to the position and the shape of the permanent magnet matrix;

s405, sputtering an iron-nickel metal layer on one surface of the first integral permanent magnet sputtered in the step S404 according to the position and the shape of the permanent magnet matrix;

s406, protecting the first whole in the step S405 except the other positions of the permanent magnet slot to obtain a protective layer;

s407, injecting Ru FeB to a preset height in the soft magnetic core slot position and the permanent magnet shape;

s408, performing rust prevention on the Ru iron boron permanent magnet sputtering chromium metal layer obtained in the step S407;

and S409, releasing the permanent magnet according to the position and the shape of the joint of the permanent magnet and the matrix.

Further, the specific step of step S5 is:

s501, performing thermal oxidation on the third wafer to form an oxide layer;

s502, cleaning the first whole by using a Prianha solution and an RCA method in sequence;

s503, according to the pre-etched alignment mark, one surface of the third wafer non-MEMS coil slot and one surface of the first integral non-MEMS coil slot are oppositely placed, and after the third wafer and the first integral are aligned through the alignment mark, the third wafer and the first integral are bonded at low temperature, and the integral wafer is obtained.

Further, the specific step of step S6 is:

s601, cleaning the whole wafer obtained in the step S5 by using a Prianha solution, and sputtering a titanium metal layer on the surface of the coil-free pad;

s602, sputtering or chemically plating a copper metal layer on the coil-free pad surface of the whole wafer obtained in the step S601;

s603, electroplating copper until the coil groove and the vertical through hole are covered completely;

s604, sputtering a titanium metal layer on the pad surface of the coil;

s605, sputtering or chemically plating a copper metal layer on the coil pad surface of the whole wafer obtained in the step S604;

s606, electroplating copper until the coil pad upper coil groove is fully covered;

s607, reducing the copper to the thickness of the base layer by using a CMP method, and releasing the coil.

Further, the specific step of step S7 is:

s701, performing breakage-proof protection on the whole wafer obtained in the step S6;

s702, placing the integral wafer of the micropump in magnetizing equipment, and magnetizing the permanent magnet according to the designed magnetizing direction and magnetizing strength of the permanent magnet;

the specific steps of step S8 are: and cutting the magnetized integral wafer of the micro pump obtained in the step S7 into individual micro pumps according to the cutting marks.

In the technical scheme, the electromagnetic drive type MEMS micropump and the integrated processing technology of the micropump have the following beneficial effects:

the MEMS micropump solves the problem of liquid return of a valveless micropump, the introduction of the check valve can effectively increase the continuity of the flow of pump liquid, and the micropump has stronger performance in a scene needing accurate liquid control, and is easier to integrate with a microfluidic technology and has more purposes due to the introduction of planarization design and MEMS integrated processing.

The MEMS micropump has the advantages that the MEMS three-dimensional coil with integrated manufacturing potential and beam magnetic capacity is introduced into the micropump design, and the electromagnetic driving type has remarkable effects on accurate flow control and power consumption reduction. The integrated design makes the mass production and variable control easier.

The electromagnetic drive formed by the double MEMS coils and the permanent magnet is finely designed on the closed magnetic circuit, so that the electromagnetic drive has higher electromagnetic efficiency.

The micro pump with the planar design can be easily combined with other micro-fluidic and microelectronic cooling systems and other wafers, the integration difficulty is lower, redundant connection between the driver and the actuator is reduced, and the reliability and the integration level of the whole system are improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.

FIG. 1 is a schematic diagram of a first prior art micro-pump;

FIG. 2 is a schematic diagram of a second prior art micro-pump;

FIG. 3 is a schematic structural diagram of an electromagnetic drive type MEMS micro-pump provided in an embodiment of the present invention;

FIG. 4 is an enlarged view of a portion of an inlet check valve of an electromagnetically driven MEMS micropump provided in accordance with an embodiment of the present invention;

FIG. 5 is an enlarged view of a portion of an outlet check valve of an electromagnetically driven MEMS micropump provided in accordance with an embodiment of the present invention;

FIG. 6 is a schematic processing diagram of step 102 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 7 is a schematic processing diagram of step 103 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 8 is a schematic processing diagram of step 202 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 9 is a schematic processing diagram of step 204 of an integrated processing process for an electromagnetic driven MEMS micropump provided by an embodiment of the present invention;

FIG. 10 is a schematic processing diagram of step 205 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 11 is a schematic processing diagram illustrating a step 302 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 12 is a schematic processing diagram of step 303 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 13 is a schematic processing diagram illustrating step 304 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 14 is a schematic processing diagram of step 305 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 15 is a schematic processing diagram illustrating step 306 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 16 is a schematic processing diagram of step 307 of the integrated processing process of the electromagnetic driven MEMS micropump provided by the embodiment of the present invention;

FIG. 17 is a schematic processing diagram illustrating a step 401 of an integrated processing technique for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 18 is a schematic processing diagram illustrating a step 402 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 19 is a schematic processing diagram illustrating a step 404 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 20 is a schematic processing diagram illustrating a step 405 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 21 is a schematic processing diagram illustrating a step 406 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 22 is a schematic processing diagram illustrating step 407 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 23 is a schematic processing diagram illustrating step 408 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 24 is a schematic processing diagram of step 409 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 25 is a schematic processing diagram of step 501 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 26 is a schematic processing diagram illustrating a step 503 of an integrated processing technique for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 27 is a schematic processing diagram illustrating a step 601 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 28 is a schematic processing diagram illustrating a step 602 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

fig. 29 is a schematic processing diagram of step 603 of an integrated processing process of an electromagnetic driven MEMS micropump provided by an embodiment of the present invention;

FIG. 30 is a schematic processing diagram illustrating a step 604 in the integrated processing of an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 31 is a schematic processing diagram illustrating a step 605 of an integrated processing process for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

FIG. 32 is a schematic processing diagram illustrating a step 606 of an integrated processing technique for an electromagnetically driven MEMS micropump provided by an embodiment of the present invention;

fig. 33 is a process diagram of step 607 of the integrated process of the electromagnetic driven MEMS micropump according to the embodiment of the present invention.

Description of reference numerals:

101. an inlet; 102. an inlet check valve; 103. an inlet auxiliary channel;

201. an outlet; 202. an outlet check valve; 203. an outlet auxiliary channel;

3. a soft magnetic core;

4. a fluid channel;

5. a permanent magnet;

6. a MEMS coil.

Detailed Description

In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.

In the first embodiment, the first embodiment specifically discloses a micro-pump structure based on a MEMS three-dimensional coil, which is shown in fig. 3 to 5;

the electromagnetic drive type MEMS micropump of the first embodiment includes:

a micro pump body;

the fluid channel 4 is formed in the middle of the micro pump body, and the permanent magnet 5 is arranged in the fluid channel 4;

MEMS coils 6 formed on both sides of the fluid channel 4; and

the soft magnetic iron core 3, the soft magnetic iron core 3 and the permanent magnet 5 form a double-annular magnetic circuit;

an inlet 101 and an outlet 201 are communicated with the fluid channel 4;

the inlet 101 has an inlet sub-channel 103 communicating with the fluid channel 4, and the outlet 201 has an outlet sub-channel 203 communicating with the fluid channel 4;

the inlet port attachment 103 has an inlet check valve 102 at its junction with the fluid passage 4, and the outlet port attachment 103 has an outlet check valve 202 at its junction with the fluid passage 4;

the micro-pump achieves one-way flow of liquid through inlet check valve 102 and outlet check valve 202.

Preferably, the inlet check valve 102 and the outlet check valve 202 of the present embodiment are each connected to a spring of a bent and extended base material and are connected to the base plate of the micro pump body through a terminal bump.

In the micropump of the first embodiment, the check valve is designed at the auxiliary channel of the inlet and the outlet, the MEMS coil 6, the soft magnetic core 3, the permanent magnet 5 and the corresponding fluid channel 4 are integrated at two sides of the micropump, wherein the inlet and the outlet are communicated with the fluid channel 4 through the check valve, and the unidirectional flow of the liquid can be realized through the inlet check valve and the outlet check valve.

Referring to fig. 6 to 33, in a second embodiment, the second embodiment is an integrated processing process of the MEMS micropump disclosed in the first embodiment, and specifically includes:

s3, electroplating the soft magnetic iron core;

s4, manufacturing a permanent magnet base material;

s6, manufacturing the MEMS coil by electroplating;

s7, magnetizing the permanent magnet;

and S8, cutting to obtain individual micropumps.

Referring to fig. 6 to 7, the specific steps of manufacturing the micropump substrate in step S1 are as follows:

s101, cleaning the first wafer and the third wafer by using a Prianha solution;

Referring to fig. 8 to 10, further, the specific steps of step S2 are:

s201, cleaning a second wafer by using a Prianha solution;

Referring to fig. 11 to 16, further, the specific steps of step S3 are:

s301, cleaning the first whole body by using a Prianha solution;

and S307, removing the protective layer.

Referring to fig. 17 to 24, further, the specific steps of step S4 are:

s401, protecting the soft magnetic iron core and forming a protective layer;

Referring to fig. 25 to 26, further, the specific steps of step S5 are:

s501, performing thermal oxidation on the third wafer to form an oxide layer;

Referring to fig. 27 to 33, further, the specific steps of step S6 are:

s604, sputtering a titanium metal layer on the pad surface of the coil;

Further, the specific step of step S7 is:

The micro pump with the planar design is easier to design in a wafer combination mode of other micro-fluidic and microelectronic cooling systems, has lower integration difficulty, reduces redundant connection between a driver and an actuator, and improves the reliability and the integration level of the whole system.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

Claims

1. An electromagnetically driven MEMS micropump, characterized in that the micropump comprises:

a micro pump body;

the fluid channel (4) is formed in the middle of the micro pump body, and a permanent magnet (5) is arranged in the fluid channel (4);

a MEMS coil (6) formed on both sides of the fluid channel (4); and

the soft magnetic core (3), the soft magnetic core (3) and the permanent magnet (5) form a double-ring magnetic circuit;

an inlet (101) and an outlet (201) are communicated with the fluid channel (4);

the inlet (101) having an inlet satellite channel (103) communicating with the fluid channel (4), the outlet (201) having an outlet satellite channel (203) communicating with the fluid channel (4);

the junction of the inlet auxiliary channel (103) and the fluid channel (4) is provided with an inlet check valve (102), and the junction of the outlet auxiliary channel (203) and the fluid channel (4) is provided with an outlet check valve (202);

the micro pump achieves one-way flow of liquid through the inlet check valve (102) and the outlet check valve (202).

2. An electromagnetic driven MEMS micropump according to claim 1, characterized in that the inlet check valve (102) and the outlet check valve (202) are each spring-connected with a matrix material extending in bends and connected with a substrate of the micropump body by means of a terminal bump.

3. The integrated processing technology of the electromagnetic drive type MEMS micropump is characterized in that the micropump is processed by using three wafers, namely a first wafer, a second wafer and a third wafer, and the integrated processing technology mainly comprises the following steps:

s2, manufacturing a micro-pump fluid channel (4), a soft magnetic core (3) and a check valve, processing a second wafer and bonding the second wafer and the first wafer into a first whole at a low temperature;

s3, electroplating the soft magnetic iron core (3);

s4, manufacturing a permanent magnet (5) base material;

s6, manufacturing the MEMS coil (6) by electroplating;

s7, magnetizing the permanent magnet (5);

and S8, cutting to obtain individual micropumps.

4. The integrated processing process of an electromagnetic driven MEMS micropump of claim 3, wherein the specific steps of the fabrication of the micropump substrate in the step S1 are as follows:

s101, cleaning the first wafer and the third wafer by using a Prianha solution;

s102, carrying out thermal oxidation treatment on the first wafer, respectively etching a plurality of parallel coil grooves and vertical through holes according to the positions and the shapes of the coil grooves on the bottom surfaces of the MEMS coils (6) on the two sides and the positions and the shapes of the vertical holes, and cleaning by using a Prianha solution to obtain a lower substrate;

s103, carrying out thermal oxidation treatment on the third wafer, respectively etching a plurality of parallel coil grooves, vertical through holes, four lead wire pad grooves and check valve expansion flow channel grooves according to the position and the shape of the coil grooves on the top surface of the MEMS coil (6) on two sides, the position and the shape of lead wires of the MEMS coil, the position and the shape of a flow channel on one side of the check valve close to the permanent magnet (5) and the position and the shape of a vertical hole of the MEMS coil, and cleaning by using a Prianha solution to obtain the upper substrate.

5. The integrated processing process of the electromagnetic driven MEMS micropump of claim 4, wherein the specific steps of the step S2 are as follows:

s201, cleaning a second wafer by using a Prianha solution;

s202, carrying out thermal oxidation treatment on the second wafer, and etching boss-shaped bonding points and vertical hole grooves according to the positions and the shapes of connection bosses of the inlet and outlet check valves and the substrate, the shapes of the fluid channels (4) and the positions and the shapes of vertical holes of the MEMS coil;

s205, respectively etching an auxiliary channel, an inlet check valve (102), an outlet check valve (202), a soft magnetic core groove and an MEMS coil vertical hole on one surface of the first integral non-coil groove according to the position and the shape of the fluid channel (4), the position and the shape of an inlet and outlet check valve, the position and the shape of an MEMS coil vertical hole and the position and the shape of the soft magnetic core (3), and releasing an inlet and outlet check valve spring at the moment.

6. The integrated processing process of the electromagnetic driven MEMS micropump of claim 5, wherein the specific steps of the step S3 are as follows:

s301, cleaning the first whole body by using a Prianha solution;

and S307, removing the protective layer.

7. The integrated processing process of the electromagnetic driven MEMS micropump of claim 6, wherein the specific steps of the step S4 are as follows:

s401, protecting the soft magnetic iron core and forming a protective layer;

s402, etching the first whole body electroplated with the iron-cobalt alloy or the iron-nickel alloy in the S306 into the shape of the permanent magnet (5) at the position of the fluid channel according to the position and the shape of the permanent magnet (5), wherein beams exist on the periphery and are connected with surrounding matrixes to prepare for subsequent release;

s405, sputtering an iron-nickel metal layer on one surface of the first overall permanent magnet (5) sputtered in the step S404 according to the position and the shape of the permanent magnet matrix;

s407, injecting Ru FeB to a preset height in the soft magnetic core slot position and the shape of the permanent magnet (5);

and S409, releasing the permanent magnet (5) according to the position and shape of the joint of the permanent magnet (5) and the base body.

8. The integrated processing process of the electromagnetic driven MEMS micropump of claim 7, wherein the specific steps of the step S5 are as follows:

s501, performing thermal oxidation on the third wafer to form an oxide layer;

9. The integrated processing process of the electromagnetic driven MEMS micropump of claim 8, wherein the specific steps of the step S6 are as follows:

s604, sputtering a titanium metal layer on the pad surface of the coil;

10. The integrated processing process of the electromagnetic driven MEMS micropump of claim 9, wherein the specific steps of the step S7 are as follows:

s702, placing the integral wafer of the micropump in magnetizing equipment, and magnetizing the permanent magnet (5) according to the designed magnetizing direction and magnetizing strength of the permanent magnet (5);