CN113830727A - Micro-nano part transfer method - Google Patents
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- CN113830727A CN113830727A CN202111054781.9A CN202111054781A CN113830727A CN 113830727 A CN113830727 A CN 113830727A CN 202111054781 A CN202111054781 A CN 202111054781A CN 113830727 A CN113830727 A CN 113830727A
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- 238000000034 method Methods 0.000 title claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 87
- 239000002184 metal Substances 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims description 20
- 230000007704 transition Effects 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 239000012454 non-polar solvent Substances 0.000 claims description 3
- 239000002798 polar solvent Substances 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 5
- 238000010023 transfer printing Methods 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000013341 scale-up Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
Abstract
The invention relates to the technical field of microsystem heterogeneous integration, in particular to a micro-nano part transfer method, which comprises two steps of picking up a micro part and placing the micro part, wherein the picking up step of the micro part is to dip an adhesive medium through a metal ball and accurately pick up the micro part from a growth substrate; said micro-part placement step precisely transfers picked micro-parts to target substrate locations containing a tacky surface; the preparation of the metal ball and the picking and placing steps of the miniature part are completed through a standard wire bonding instrument, so that the large-scale efficient transfer of the miniature part is realized, and the defect that the traditional miniature part transfer methods such as transfer printing are difficult to apply in a large scale due to the adoption of non-standardized equipment is effectively overcome.
Description
Technical Field
The invention relates to the technical field of microsystem heterogeneous integration, in particular to a method for transferring a micro-nano part.
Background
The heterogeneous integration technology for transferring the micro-nano-scale material and structure from the growth substrate to the target device substrate is one of key technologies in the field of microsystems, realizes high-density integration of all functional units, and breaks through the limitation that substrates and preparation processes of different micro devices are incompatible with the target device substrate.
In recent years, new ideas and methods are provided for micro-component transfer and integration by using new technologies represented by micro-nano grippers and transfer printing. The micro-nano gripper structure is complex to prepare, the gripper is controlled by a precise instrument to realize the operations of gripping, displacing, placing and the like of the miniature part, the cost is high, and the micro-nano gripper is not suitable for large-scale application. The transfer printing process depends on a seal made of elastic materials, completes the operations of adsorption, displacement, release and the like of the miniature part by controlling the relative size of the interface adsorption force by means of a customized manual or automatic electric device, and has low cost and large-scale application potential. However, since the transfer process relies on non-standardized electromechanical devices, it is limited in its scale-up practical application.
Therefore, the existing micro-piece transferring method is limited in scale use because standardized equipment widely used in the industry is not adopted.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a micro-nano part transfer method, which is used for solving the problem that the micro-nano part is difficult to be applied in a large scale due to the adoption of non-standardized equipment in the prior art.
The invention provides a micro-nano piece transfer method, which comprises the steps of picking up micro pieces and placing the micro pieces, wherein,
the picking up steps of the miniature parts are as follows: the wire bonding instrument is controlled to strike fire to enable the tail end of the metal wire to form a metal ball, the metal ball is controlled to push against the adhesion medium plane, the tail end of the metal ball is enabled to form a pickup plane and to be stained with the adhesion medium, and the pickup plane with the adhesion medium adhered to the metal ball is utilized to stick and pick up the miniature part on the surface of the growth substrate;
the placing steps of the miniature parts are as follows: the adhered micro-pieces are precisely placed on the tacky surface of the target substrate by manipulating the movement of the metal balls by a wire bonding instrument, and then the metal balls are removed to release the micro-pieces from the pick-up plane of the metal balls.
According to the micro-nano piece transfer method, in the micro piece placing step, the electronic ignition current in the wire bonding process is led into the grounding unit in advance, so that the current is prevented from passing through the micro piece.
According to the micro-nano part transfer method, the grounding unit is a grounding metal rod.
According to the micro-nano piece transfer method, in the micro piece placing step, the electronic ignition current is set to be a low current value so as to prevent the current from damaging the micro piece.
The method for transferring the micro-nano part further comprises the following steps of: after the step of placing the micro-components is completed, the used metal balls are placed on the hole structure substrate, the metal balls and the holes on the hole structure substrate are mutually corresponding and are bonded with the metal layer on the surface of the holes, then the metal wires are removed, and the metal balls are separated from the metal wires and are fixed on the hole structure substrate, so that the metal ball waste treatment is completed.
According to the micro-nano part transfer method, the diameter of the metal ball is larger than the diameter of the hole on the hole structure substrate.
According to the micro-nano part transfer method, a micro part is prepared on a growth substrate in advance and is separated on the growth substrate, and is transferred and adsorbed to a target substrate/a transition substrate through metal balls.
According to the micro-nano part transfer method, the micro parts are supported by the micro column or micro beam structure on the growth substrate and are broken under the action of the bonding force in the micro part pickup step, so that the micro parts on the growth substrate are released.
According to the micro-nano part transfer method, in the picking-up step of the micro-parts, the adhesive medium is in a liquid state or a colloid state.
According to the micro-nano part transfer method, after the micro-parts are transferred to the target substrate, residual adhesive media on the surfaces of the micro-parts are cleaned by using polar or semi-polar or non-polar solvents.
The invention provides a micro-nano piece transfer method, which comprises two steps of picking up a micro piece and placing the micro piece, wherein in the picking up step of the micro piece, a metal ball is controlled by a lead bonding instrument to be dipped and adhered with an adhesion medium, and then the micro piece is accurately picked up from a transition substrate or a growth substrate thereof; in the micro-part placing step, a wire bonding instrument is used for controlling the metal ball to move accurately, and the picked micro-parts are accurately transferred to the position of a target substrate with a viscous surface; in the process, the preparation of the metal ball and the picking and placing steps of the micro-piece are completed by adopting a standard wire bonding instrument widely used in the industry, and the picking, displacement and placing steps of transferring the workpiece with the micro-structure from the growth or transition substrate to the target substrate are realized by means of a standard ball bonding-wedge bonding process, so that the large-scale efficient transfer of the micro-piece is realized, the defect that the conventional micro-piece transfer methods such as transfer printing and the like are difficult to apply in a large scale due to adoption of non-standard equipment is effectively overcome, and the method has better large-scale application prospect.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Figure 1 is a schematic process diagram of a micro-part picking step of the present invention;
figure 2 is a schematic process diagram of a micro-member placement step of the present invention;
FIG. 3 is a schematic process diagram of the metal ball discard processing step of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A micro-nano piece transfer method comprises a micro piece picking step and a micro piece placing step.
As shown in fig. 1, a schematic process diagram of a picking step of a micro component is realized by a simulated ball bonding-wedge bonding process of a standard wire bonding instrument, and the process diagram specifically includes:
as shown in fig. 1(a) and 1(b), first, by operating a wire bonder, a metal ball 403 is generated by electrically striking a spark between a striking electrode 50 and a metal wire 401, the metal ball 403 being formed at the bottom end of the metal wire;
then, as shown in fig. 1(c), the metal ball 403 is controlled to move by using a wire bonder, the metal ball 403 is controlled to contact the adhesive medium 102 and the carrier 101 thereof, the bonding force applied by the porcelain nozzle 402 presses the adhesive medium plane of the carrier 101 downwards, and the bottom end of the metal ball 403 is forced to form a pickup plane under the bonding force, as shown in fig. 1(d), when the metal ball 403 rises, the pickup plane surface at the bottom of the metal ball 403 can be dipped into the adhesive medium material 103.
Finally, as shown in fig. 1(e), the metal ball 403 is manipulated by the wire bonding machine to move, and the micro-members 202 on the surface of the growth substrate 201 (or transition substrate) are adhered by the pick-up plane of the adhesive medium material 103 attached to the metal ball 403, as shown in fig. 1(f), and then the micro-members 202 are picked up when lifted upwards and out of contact.
After the above steps are completed, a micro-component placement step is performed, as shown in fig. 2, using a single-step ball bonding process with a wire bonder, comprising:
as shown in fig. 2(a), the adhered micro-members 202 are precisely placed on the adhesive surface 302 of the target substrate 301 by manipulating the metal balls 403 to precisely move by a wire bonding machine, and since the adhesive surface 302 is adhesive, as shown in fig. 2(b), when the metal balls 403 are removed, the micro-members 202 can be released from the pick-up plane at the bottom of the metal balls 403, so that the micro-members 202 can be precisely placed and stay on the adhesive surface 302 of the target substrate 301, and the placement step of the micro-members 202 is completed.
In the micro-member placing step, an electric sparking current of the wire bonding process is introduced into the grounding unit from the sparking electrode 50 in advance to prevent the current from passing through the micro-member and to avoid damage to the micro-member. Specifically, the grounding unit is a grounding metal rod 60, and more specifically, the grounding metal rod 60 may be a tungsten pin or a separate gold wire.
Understandably, the end of the metal ball 403 forms a pick-up plane, so that the metal ball can be matched with the surface of the miniature part more accurately, the miniature part is prevented from being inclined when being picked up, and accurate pick-up and subsequent accurate placement are facilitated.
The method for transferring the miniature part comprises two steps of picking up the miniature part and placing the miniature part, wherein in the picking up step of the miniature part, a metal ball is controlled by using a wire bonding instrument to dip an adhesion medium, and then the miniature part is accurately picked up from a transition substrate or a growth substrate thereof; in the micro-part placing step, a wire bonding instrument is used for controlling the metal ball to move accurately, and the picked micro-parts are accurately transferred to the position of a target substrate with a viscous surface; in the process, the preparation of the metal ball and the picking and placing steps of the micro-piece are completed by adopting a standard wire bonding instrument widely used in the industry, and the picking, displacement and placing steps of transferring the workpiece with the micro-structure from the growth or transition substrate to the target substrate are realized by means of a standard ball bonding-wedge bonding process, so that the large-scale efficient transfer of the micro-piece is realized, the defect that the conventional micro-piece transfer methods such as transfer printing and the like are difficult to apply in a large scale due to adoption of non-standard equipment is effectively overcome, and the method has better large-scale application prospect.
As an alternative specific solution to this embodiment, the metal ball 403 may be formed by electrically striking a metal wire made of metal such as Au, Ag, Al, Cu, or an alloy thereof, specifically, in this embodiment, the material of the metal ball 403 is gold, the diameter is 100 μm, and the diameter of the gold wire used is 25 μm.
As an optional specific solution to this embodiment, the adhesion medium 102 is in a liquid state or a colloidal state, for example, the adhesion medium 102 may be selected as lubricating oil, the carrier 101 is a silicon wafer, and the carrier may be spin-coated on the silicon wafer at a rotation speed of 5000rpm to form an approximately micron thick oil layer; the applied wire bonding force was set at 500mN, the bonding time was 50ms, and no ultrasonic vibration energy was applied.
Understandably, the adhesive medium 102 is in a liquid or gel state, which is easier to be uniformly wetted and less limited in the types of micro-components that can be adhered, compared with a solid adsorption medium, thereby ensuring the reliability and wide adaptability of the micro-component picking process.
As an alternative embodiment to this embodiment, the transition medium 201 provided in this embodiment is a thermal release tape (heat treated), and the micro-members 202 are square silicon micro-members having a side length of about 60 μm; the applied bonding force of the lead is set to be 100mN, the bonding time is 50ms, and no ultrasonic vibration energy is applied;
as an alternative embodiment to this embodiment, the silicon-based micro-devices can also be fabricated directly on the device layer of a silicon-on-insulator (SOI) substrate; firstly, the discrete patterning is completed through a standard photoetching and silicon etching process, then, a silicon dioxide layer at the bottom of a silicon miniature part is etched through hydrofluoric acid until only micro-column supports with the width of about 2-5 mu m are remained, the miniature part is released by forcing the micro-columns to break under the action of bonding force in the picking-up process of the miniature part, the applied bonding force is set to be 200mN, the bonding time is 50ms, and the ultrasonic vibration energy is 30%.
As an alternative specific solution to this embodiment, the target substrate 301 is a glass sheet, the adhesive surface is made of a thermal release adhesive material, the applied bonding force is 100mN, the bonding time is 100ms, and no ultrasonic vibration energy is applied.
As an alternative embodiment of this embodiment, in the step of placing the micro-pieces, the electronic ignition current is set to a low current value, and the electronic ignition current is set to a value close to zero, so as to prevent the current from damaging the micro-pieces, thereby not affecting the integrity and functionality of the transferred micro-pieces, and avoiding the use of a grounding metal rod, and simplifying the flow.
Through the above steps, the metal balls 403 can be recycled.
Further, as shown in fig. 3, the method further includes a step of disposing the metal ball 403: as shown in fig. 3(a) -3 (c), after the step of placing the micro device 202 is completed, a wire bonder is used to place the used metal ball 403 to be discarded on the hole structure substrate 701, so that the metal ball 403 corresponds to the hole 703 on the hole structure substrate 701 and is bonded with the metal layer 702 on the surface of the substrate 701 under the action of a bonding force, and after the metal ball 403 is bonded with the metal layer 702 on the surface of the hole 703 and is partially deformed to wedge into the hole 703, the metal ball 403 can be fixed on the hole structure substrate 701, as shown in fig. 3(d), and finally the metal wire 401 is removed, so that the metal ball 403 is detached from the metal wire and fixed on the hole structure substrate 701, thereby completing the discarding process of the metal ball 403.
Further, a metal layer 702 is pre-deposited on the surface of the pore structure substrate 701 to ensure that reliable bonding with the metal balls 403 can be achieved.
Wherein the broken wire can be used for the creation of new metal balls so that the next micro-part transfer cycle can be performed again.
Specifically, the diameter of metal ball 403 is larger than the diameter of hole 703 on the hole structure substrate.
Optionally, the substrate 701 with a pore structure provided in this embodiment is silicon, the pore 703 is formed by patterning a photoresist and etching silicon, and has a pore depth of 100 μm and a pore diameter of 70 μm; the surface metal coating is composed of TiW with the thickness of 50nm and Au with the thickness of 300nm, and is respectively deposited by electron beam evaporation; the applied bonding force was set at 2000mN, the bonding time was 50ms and the ultrasonic vibration energy was 25%.
As an alternative embodiment to this embodiment, the micro-members 202 are prepared in advance on the growth substrate 201 and are separated on the growth substrate 201, and transferred and adsorbed onto the target substrate 301 or the transition substrate through the metal balls 403.
As an alternative embodiment to this embodiment, the micro-pieces 202 are supported on the growth substrate 201 by micro-pillar or micro-beam structures and are broken by the bonding force during the picking-up step of the micro-pieces to release the micro-pieces on the growth substrate.
As a further alternative to this embodiment, after the micro-members 202 are transferred to the target substrate 301, the residual adhering medium on the micro-members' surface is washed with a polar or semi-polar or non-polar solvent. Specifically, the solvent of the present embodiment may be selected to be isopropyl alcohol.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A micro-nano piece transfer method is characterized by comprising the steps of picking up micro pieces and placing the micro pieces, wherein,
the picking up steps of the miniature parts are as follows: the wire bonding instrument is controlled to strike fire to enable the tail end of the metal wire to form a metal ball, the metal ball is controlled to push against the adhesion medium plane, the tail end of the metal ball is enabled to form a pickup plane and to be stained with the adhesion medium, and the pickup plane with the adhesion medium adhered to the metal ball is utilized to stick and pick up the miniature part on the surface of the growth substrate;
the placing steps of the miniature parts are as follows: the adhered micro-pieces are precisely placed on the tacky surface of the target substrate by manipulating the movement of the metal balls by a wire bonding instrument, and then the metal balls are removed to release the micro-pieces from the pick-up plane of the metal balls.
2. A micro-nano member transfer method according to claim 1, wherein in the micro member placing step, an electric sparking current of a wire bonding process is introduced into the grounding unit in advance to prevent the current from passing through the micro member.
3. A micro-nano part transfer method according to claim 2, wherein the grounding unit is a grounding metal rod.
4. A micro-nano member transfer method according to claim 1, wherein in the micro member placing step, the electron firing current is set to a low current value to prevent the current from damaging the micro member.
5. The method for transferring the micro-nano part according to claim 1, further comprising a step of abandonment treatment of the metal ball: after the step of placing the micro-components is completed, the used metal balls are placed on the hole structure substrate, the metal balls and the holes on the hole structure substrate are mutually corresponding and are bonded with the metal layer on the surface of the holes, then the metal wires are removed, and the metal balls are separated from the metal wires and are fixed on the hole structure substrate, so that the metal ball waste treatment is completed.
6. A micro-nano part transfer method according to claim 5, wherein the diameter of the metal sphere is larger than the diameter of the hole on the pore structure substrate.
7. A method according to claim 1, wherein the micro-members are prepared in advance on the growth substrate and separated on the growth substrate, and transferred and adsorbed to the target substrate/transition substrate through the metal balls.
8. A method according to claim 7, wherein the micro-devices are supported by micro-column or micro-beam structures on the growth substrate and are broken by the bonding force during the micro-device picking step to release the micro-devices on the growth substrate.
9. A micro-nano part transfer method according to claim 1, wherein the adhesive medium is in a liquid or gel state during the micro-part picking-up step.
10. A micro-nano member transfer method according to claim 1, wherein after the micro member is transferred to the target substrate, residual adhesive medium on the surface of the micro member is cleaned by polar or semi-polar or non-polar solvent.
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| CN202111054781.9A CN113830727A (en) | 2021-09-09 | 2021-09-09 | Micro-nano part transfer method |
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