CN113830397A

CN113830397A - Bearing plate and bearing plate stack structure

Info

Publication number: CN113830397A
Application number: CN202111116160.9A
Authority: CN
Inventors: 陈铿合; 黄国峰
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2021-12-24

Abstract

The application relates to the technical field of electronic article tools, and the embodiment of the application provides a bearing plate and a bearing plate stack structure with the bearing plate, wherein the bearing plate at least comprises at least one bearing unit, the bearing unit comprises a bearing body and a plurality of grooves, the bearing body comprises a bearing area and a stacking area surrounding the bearing area, side walls are arranged in the stacking area along a first direction and a second direction, the first direction is vertical to the second direction, the grooves are positioned in the bearing area, the grooves extend along a third direction and are arranged at intervals along a fourth direction, the third direction is vertical to the fourth direction, and an included angle is formed between the first direction and the third direction; the continuous area in the bearing area is reduced by adding the groove structure, the risk of thermal deformation is reduced, and meanwhile, the rigidity of the bearing disc can be improved by the grooves extending in the same direction.

Description

Bearing plate and bearing plate stack structure

Technical Field

The application relates to the technical field of electronic article tools, in particular to a bearing plate and a bearing plate stack structure with the bearing plate.

Background

In the related art, finished products or semi-finished products of electronic articles (such as backlight modules and display panel lamps) are placed in a tray for performing various processes of a manufacturing process. The bearing plates can be stacked mutually, so that the space can be saved, and the carrying is convenient. However, when the tray is transported in a high temperature environment in summer, the tray is easily thermally deformed, which may result in damage to the articles and difficulty in taking out the articles.

Disclosure of Invention

Therefore, it is necessary to provide a carrier tray and a stack structure of carrier trays having the same to reduce the risk of deformation of the carrier tray during transportation in high temperature environment in summer.

According to a first aspect of the present application, an embodiment of the present application provides a carrier tray for carrying at least one electronic article, where the carrier tray includes at least one carrying unit; the bearing unit includes:

the bearing body comprises a bearing area and a stacking area surrounding the bearing area, wherein side walls are arranged in the stacking area along a first direction and a second direction, and the first direction is vertical to the second direction; and

the grooves extend along a third direction and are arranged at intervals along a fourth direction, and the third direction is vertical to the fourth direction;

wherein the first direction and the third direction have an included angle.

In one embodiment, the included angle is 40 to 50 degrees.

In one embodiment, the included angle is 45 degrees.

In one embodiment, the plurality of grooves are arranged at equal intervals along the fourth direction.

In one embodiment, the width of the groove along the fourth direction is equal to the interval between adjacent grooves along the fourth direction.

In one embodiment, the carrying area has a first virtual boundary line, and a second virtual boundary line is arranged between the plurality of grooves and the carrying area;

the first virtual boundary line is arranged around the second virtual boundary line, and a gap is formed between the first virtual boundary line and the second virtual boundary line.

In one embodiment, the distance between the first virtual borderline and the second virtual borderline is equal to the width of the groove in the fourth direction.

In one embodiment, the first virtual borderline and the second virtual borderline are at least one of rectangular, circular and elliptical.

In one embodiment, the groove has two opposite ends along the fourth direction;

and arc transition sections are arranged at two ends of the groove.

According to a second aspect of the present application, an embodiment of the present application provides a stack structure of carrier trays, including a plurality of carrier trays as described above, where the plurality of carrier trays are stacked on each other.

In the above-mentioned bearing plate and bearing plate stack structure with the bearing plate, the bearing plate includes at least one bearing unit, the bearing unit includes a bearing body and a plurality of grooves, the bearing body includes a bearing area and a stack area surrounding the bearing area, side walls are arranged in the stack area along a first direction and a second direction, the first direction is perpendicular to the second direction, the plurality of grooves are located in the bearing area, the plurality of grooves extend along a third direction and are arranged at intervals along a fourth direction, the third direction is perpendicular to the fourth direction, and the first direction and the third direction have an included angle; the continuous area in the bearing area is reduced by adding the groove structure, the risk of thermal deformation is reduced, and meanwhile, the rigidity of the bearing disc can be improved by the grooves extending in the same direction.

Drawings

FIG. 1 is a schematic structural diagram of a carrier tray according to an embodiment of the related art;

FIG. 2 is a schematic structural diagram of a carrier tray deformed according to an embodiment of the related art;

FIG. 3 is a schematic structural diagram of a carrier tray according to an embodiment of the present disclosure;

FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3 of the present application;

FIG. 5 is a schematic structural diagram of a carrier tray according to another embodiment of the present application;

FIG. 6 is a schematic structural diagram of a carrier tray according to another embodiment of the present application;

FIG. 7 is a schematic diagram of a groove structure according to an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a groove in another embodiment of the present application;

FIG. 9 is a schematic view of a groove structure according to another embodiment of the present application;

FIG. 10 is a schematic view of a carrier tray according to a first comparative example of the present application;

FIG. 11 is a schematic structural view of a carrier tray according to a second comparative example of the present application;

FIG. 12 is a schematic view showing a structure of a carrier tray according to a third comparative example of the present application;

FIG. 13 is a schematic view of a carrier tray according to a fourth comparative example of the present application;

FIG. 14 is a schematic view of a carrier tray according to a fifth comparative example of the present application;

FIG. 15 is a schematic view showing a structure of a carrier tray according to a sixth comparative example of the present application;

FIG. 16 is a schematic view showing a structure of a carrier tray according to a seventh comparative example of the present application;

fig. 17 is a schematic rigid deformation diagram illustrating a rigid deformation simulation of a carrier tray according to an embodiment of the present application;

FIG. 18 is a schematic rigid deformation diagram of a carrier platter of the first comparative example of the present application;

FIG. 19 is a schematic illustration of rigid deformation simulating rigid deformation of a carrier platter according to a second comparative example of the present application;

fig. 20 is a schematic view of rigid deformation simulation of a carrier tray in a third comparative example of the present application;

FIG. 21 is a schematic view showing rigid deformation in a rigid deformation simulation of a carrier tray according to a fourth comparative example of the present application;

FIG. 22 is a schematic view showing rigid deformation of a carrier tray according to a fifth comparative example of the present application;

fig. 23 is a schematic view showing rigid deformation in a rigid deformation simulation of a carrier tray according to a sixth comparative example of the present application;

FIG. 24 is a schematic view showing rigid deformation in a rigid deformation simulation of a carrier tray according to a seventh comparative example of the present application;

FIG. 25 is a schematic thermal deformation diagram illustrating a thermal deformation simulation of a carrier tray according to an embodiment of the present disclosure;

FIG. 26 is a schematic thermal deformation diagram illustrating a thermal deformation simulation of a carrier tray according to a first comparative example of the present application;

FIG. 27 is a schematic thermal deformation diagram of a thermal deformation simulation of a carrier tray according to a second comparative example of the present application;

FIG. 28 is a schematic view showing thermal deformation of a carrier tray according to a third comparative example of the present application;

FIG. 29 is a schematic view showing thermal deformation of a carrier tray according to a fourth comparative example of the present application;

FIG. 30 is a schematic view showing thermal deformation of a carrier tray according to a fifth comparative example of the present application;

FIG. 31 is a schematic view showing thermal deformation of a carrier tray according to a sixth comparative example of the present application;

FIG. 32 is a schematic view showing thermal deformation of a carrier tray according to a seventh comparative example of the present application;

fig. 33 is a comparison between the performance of the carrier tray shown in fig. 3 provided in the examples of the present application and the performance of the carrier trays provided in the first comparative example to the seventh comparative example.

Notation of elements for simplicity:

10: the carrier plate 11: concave block

100: the bearing unit 110: bearing body

111: the carrier region 112: stacking zone

120: side wall 130: groove

131: arc transition section

S1: first virtual boundary line S2: second virtual boundary line

a: first direction b: second direction

c: third direction d: fourth direction

α: included angle

d 1: width d 2: first interval

d 3: second interval

1. 2, 3, 4, 5, 6, 7, 8, 9: region(s)

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. The embodiments of this application can be implemented in many different ways than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the invention and therefore the embodiments of this application are not limited to the specific embodiments disclosed below.

It is to be understood that the terms "first," "second," "third," "fourth," and the like as used herein may be used herein to describe various terms of art, and are not to be construed as indicating or implying relative importance or implicit to a number of technical features indicated. However, these terms are not intended to be limiting unless specifically stated. These terms are only used to distinguish one term from another. For example, the first direction, the second direction, the third direction and the fourth direction are different directions, and the first virtual boundary line and the second virtual boundary line are different virtual boundary lines, without departing from the scope of the present application. In the description of the embodiments of the present application, "a plurality" or "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments of the present application, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely below the second feature, or may simply mean that the first feature is at a lesser level than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

As background art shows, the carrier trays are mainly used for carrying electronic articles such as backlight modules or screens, and the carrier trays can be stacked on top of each other to achieve the purpose of saving space and facilitating transportation. When the carrying tray is transported in a high-temperature environment in summer, the carrying tray is easy to generate thermal deformation, and then articles are damaged and are not easy to take out. Generally, the carrier tray is mostly manufactured by hot press molding a plastic sheet, and the temperature range of the hot press molding is between 60 ℃ and 80 ℃. Therefore, a carrier tray for electronic goods shipment needs to satisfy impact and heat resistance 65 degree celsius environmental tests.

Fig. 1 is a schematic structural diagram of a carrier tray 10 in an embodiment of the related art; fig. 2 is a schematic structural diagram illustrating a deformed carrier tray 10 according to an embodiment of the related art; for convenience of explanation, only a portion related to an embodiment of the related art is shown.

Referring to fig. 1, an embodiment of the related art provides a carrier tray 10, the carrier tray 10 is divided into a stacking area 112 and a carrying area 111, the stacking area 112 generally uses a reinforcing rib to enhance the structural strength, and the carrying area 111 mostly uses a recessed block 11 to enhance the structural strength, so as to solve the problem that the carrier tray 10 is jammed due to poor rigidity when the carrier tray 10 is stacked for use, and further prevent the electronic article from shaking and being damaged when the electronic article is taken. In an environmental test of resisting 65 degrees celsius, as shown in fig. 2, deformation may occur near the G of the recessed block 11 of the carrying region 111, and thus the fixing function of the electronic article may be lost, and the electronic article may be damaged by the extrusion.

Based on this, it is desirable to provide a carrier tray 10 to reduce the risk of deformation of the carrier tray 10 during transportation of the carrier tray 10 in a hot summer environment.

Fig. 3 is a schematic structural diagram of the carrier tray 10 according to an embodiment of the present application; FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3 of the present application; for convenience of explanation, only a portion related to an embodiment of the related art is shown.

For ease of understanding, as shown in FIG. 3, the upper side of the drawing sheet is defined as the upper side, the lower side of the drawing sheet is defined as the lower side, the left direction of the drawing sheet is defined as the left side inward, the right direction of the drawing sheet is defined as the right side outward, and the subsequent drawings are based on the direction defined in FIG. 3. It is to be understood that the above definitions are for illustration purposes only and are not to be construed as limitations of the present application. It is to be understood that the above definitions are for illustration purposes only and are not to be construed as limitations of the present application.

Referring to fig. 3 to 4, an embodiment of the present application provides a carrier tray 10 for carrying at least one electronic article, where the carrier tray 10 includes at least one carrying unit 100. The carrier unit 100 includes a carrier body 110 and a plurality of grooves 130, wherein the carrier body 110 includes a carrier region 111 and a stacking region 112 surrounding the carrier region 111. The carrier region 111 is used for placing electronic articles. The side walls 120 are disposed in the stacking area 112 along a first direction a and a second direction b, the first direction a is perpendicular to the second direction b, that is, the outer sides of the side walls 120 disposed in the stacking area 112 form a shape similar to a rectangle, so as to facilitate stacking and carrying, and the inner sides of the side walls 120 enclose the carrying area 111. It should be noted that the outside of the sidewall 120 refers to a side of the sidewall 120 away from the carrier region 111, and the inside of the sidewall 120 refers to a side of the sidewall 120 facing the carrier region 111. For example, referring to fig. 3 in combination with fig. 4, in one load-bearing unit 100, the sidewall 120 has a symmetrical structure along a first direction a (i.e., a left-right direction) and a symmetrical structure along a second direction b (i.e., a top-bottom direction). The plurality of grooves 130 are located in the carrying region 111, the plurality of grooves 130 extend along a third direction c and are arranged at intervals along a fourth direction d, the third direction c is perpendicular to the fourth direction d, and an included angle α is formed between the first direction a and the third direction c. That is, the plurality of grooves 130 extend in the same direction (i.e., the third direction c), the plurality of grooves 130 are directional, and the strength of the grooves 130 extending in the same direction is continuous, so that stress concentration can be prevented, and the rigidity of the carrier tray 10 can be improved. And because the continuous area in the bearing area 111 is reduced, the contact area between the electronic article and the bearing area 111 is reduced, the risk of extrusion when the material expands due to heating due to overlarge contact area can be prevented, and the risk of thermal deformation is reduced.

Fig. 5 shows a schematic structural view of a carrier tray 10 according to another embodiment of the present application; fig. 6 shows a schematic structural view of a carrier tray 10 according to a further embodiment of the present application; for convenience of explanation, only a portion related to an embodiment of the related art is shown.

It should be understood that the carrier tray 10 includes at least one carrier unit 100, which means that the carrier tray 10 may be composed of one carrier unit 100, two carrier units 100, or some other number of carrier units 100, and when a plurality of carrier units 100 are provided in the carrier tray 10, the extending directions of the grooves 130 in different carrier areas 111 may be the same or different, as long as the extending directions of the grooves 130 in one carrier area 111 are consistent. For example, fig. 3 shows a case where two bearing units 100 are provided and the extending directions of the grooves 130 in the two bearing areas 111 are the same, fig. 5 shows a case where two bearing units 100 are provided and the extending directions of the grooves 130 in the two bearing areas 111 are different, the grooves 130 in the left bearing area 111 extend along the fourth direction d and are arranged at intervals along the third direction c, the grooves 130 in the right bearing area 111 extend along the third direction c and are arranged at intervals along the fourth direction d, and fig. 6 shows a case where four bearing units 100 are provided and the extending directions of the grooves 130 in the four bearing areas 111 are the same. The number, the connection form, and the extending direction in the groove 130 of the bearing units 100 may be selected and arranged according to actual requirements, which is not specifically limited in the embodiment of the present application.

In order to further reduce the thermal deformation, the angle α between the first direction a and the third direction c may be set to 40 degrees to 50 degrees as further studied by the inventors of the present application. As an embodiment, with continued reference to fig. 3, the angle α between the first direction a and the third direction c may be set to 45 degrees. In other embodiments, the plurality of grooves 130 are arranged at equal intervals along the fourth direction d, that is, the plurality of grooves 130 are arranged at equal intervals, so that the structural strength of the grooves 130 is improved, and the thermal deformation is reduced. More specifically, the adjacent grooves 130 are spaced apart by a first spacing d2 along the fourth direction d, and the first spacing d2 is equal to the width d1 of the groove 130 along the fourth direction d.

FIG. 7 is a schematic diagram of the structure of the groove 130 in one embodiment of the present application; FIG. 8 shows a schematic view of the structure of the groove 130 in another embodiment of the present application; FIG. 9 shows a schematic view of the structure of a groove 130 in a further embodiment of the present application; for convenience of explanation, only a portion related to an embodiment of the related art is shown.

In other embodiments, with reference to fig. 3, the carrier region 111 has a first virtual boundary line S1, and a second virtual boundary line S2 is formed between the plurality of grooves 130 and the carrier region 111. The first virtual boundary line S1 is arranged to surround the second virtual boundary line S2, and the first virtual boundary line S1 is spaced apart from the second virtual boundary line S2. It should be noted that the first virtual boundary line S1 refers to a region enclosed by the inner side of the sidewall 120 where the electronic article can be placed, and for facilitating taking, placing and fixing the electronic article, the inner side of the sidewall 120 is disposed along the outer edge of the electronic article, that is, the first virtual boundary line S1 is defined by the shape of the outer edge of the placed electronic article, and the second virtual boundary line S2 is similar to the first virtual boundary line S1. In particular, in some embodiments, the first virtual boundary line S1 and the second virtual boundary line S2 are at least one of rectangular, circular, and elliptical. For example, as shown in fig. 3, when the electronic article has a rectangular shape, the first virtual boundary line S1 and the second virtual boundary line S2 have a rectangular shape. For example, as shown in fig. 7, when the electronic article has a circular shape, the first virtual boundary line S1 and the second virtual boundary line S2 have circular shapes. For another example, as shown in fig. 8, when the electronic article has a hexagonal shape, the first virtual boundary line S1 and the second virtual boundary line S2 are circular. For example, as shown in fig. 9, when the electronic article has an elliptical shape, the first virtual boundary line S1 and the second virtual boundary line S2 have elliptical shapes. That is, the shapes of the first virtual boundary line S1 and the second virtual boundary line S2 are matched with the external shape of the electronic article, and may be set according to the actual situation, which is not specifically limited in the embodiment of the present application. In particular, in some embodiments, the distance between the first virtual boundary line S1 and the second virtual boundary line S2 is a second distance d3, and the second distance d3 is equal to the width d1 of the groove 130 along the fourth direction d, so that the mechanical performance of the carrier tray 10 is further optimized by a specific distance ratio, and the risk of thermal deformation is reduced while the rigidity is improved.

In some embodiments, with continued reference to fig. 3, to prevent stress concentration, the groove 130 has two opposite ends along the fourth direction d, and the two ends of the groove 130 have arc transition sections 131.

Based on the same inventive concept, the embodiment of the present application further provides a stack structure of the carrier tray 10, including a plurality of carrier trays 10 in any of the above embodiments, and the plurality of carrier trays 10 are stacked one on another.

Fig. 10 shows a schematic view of a carrier tray 10 according to a first comparative example of the present application; fig. 11 shows a schematic view of a carrier tray 10 according to a second comparative example of the present application; FIG. 12 is a schematic view showing the structure of a carrier tray 10 according to a third comparative example of the present application; FIG. 13 is a schematic view showing the structure of a carrier tray 10 according to a fourth comparative example of the present application; FIG. 14 shows a schematic view of a structure of a carrier tray 10 according to a fifth comparative example of the present application; fig. 15 is a schematic view showing a structure of a carrier tray 10 according to a sixth comparative example of the present application; FIG. 16 is a schematic view showing the structure of a carrier tray 10 according to a seventh comparative example of the present application; for convenience of explanation, only a portion related to an embodiment of the related art is shown.

Next, a rigidity simulation is performed on the structure of the carrier tray 10 shown in fig. 3 provided in the embodiment of the present application and each carrier tray 10 shown in fig. 10 to 16, and the conditions of the rigidity simulation are set to five times the weight of the carrier tray 10, so as to obtain the schematic rigid deformation diagrams shown in fig. 17 to 24. It should be noted that U represents a color corresponding to the simulated deformation amount in the different regions, and U2 represents a specific simulated deformation amount, and the unit is millimeter. Different analog deformation amounts have different colors, and the colors can change along with the change of the analog deformation amounts. The color change means that the color gradually changes from cold tone to warm tone along with the larger and larger analog deformation. As shown in fig. 17 to 24, the change in color appears as a gradual transition from the cool tone to the warm tone from the center to the outside. Illustratively, as shown in fig. 17, the regions from the center to the outside are region 1, region 2, region 3, and region 4, the color of region 1 is yellow, the corresponding analog deformation amount U2 ranges from-1.59 mm to-1.05 mm, the color of region 2 is orange, the corresponding analog deformation amount U2 ranges from-1.05 mm to-0.50 mm, the color of region 3 is orange, the corresponding analog deformation amount U2 ranges from-0.50 mm to 0.04 mm, the color of region 4 is red, and the corresponding analog deformation amount U2 ranges from 0.04 mm to 0.58 mm, and it can be seen that the rigid deformation amount in the load-bearing region is small in the structure provided in fig. 17 from the center to the outside.

The thermal deformation simulation is performed on the structure of the carrier tray 10 shown in fig. 3 provided in the embodiment of the present application and the carrier trays 10 shown in fig. 10 to 16, and the experimental temperature of the thermal deformation simulation is set to 65 degrees celsius, so as to obtain the thermal deformation schematic diagrams shown in fig. 25 to 32. For the definition of the analog deformation amount and the color, reference is made to the above description, which is not repeated herein. Similarly, as shown in fig. 25 to 32, the change in color appears as a gradual transition from the cool tone to the warm tone from the center to the outside. Schematically, as shown in fig. 25, the regions from the center to the outside are region 5, region 6, region 7, region 8, region 9 in this order, the color of region 5 is dark green, the corresponding simulated deflection U2 ranged from-2.67 mm to-2.13 mm, the color of region 6 was pale green, the corresponding simulated deflection U2 ranged from-2.13 mm to-1.59 mm, the color of zone 7 was yellow, the corresponding simulated deflection U2 ranged from-1.59 mm to-1.05 mm, the color of zone 8 was a blend of orange and red-orange, the corresponding simulated deflection U2 ranges from-1.05 mm to 0.04 mm, the color of zone 9 is red, the corresponding simulated deflection U2 ranges from 0.04 mm to 0.58 mm, and it can be seen that from the center outward, the amount of thermal deflection in the load bearing zone in the structure provided in figure 25 is small.

From the above diagrams, the amounts of rigid deformation and thermal deformation corresponding to the present application and the remaining comparative examples were calculated based on the amounts of rigid deformation and thermal deformation of the first comparative example, and the deformation results shown in table 1 were obtained. The percentage of the product contact area is the contact area between the electronic article and the carrying region 111 compared with the area of the upper carrying region 111, and since the carrying region 111 is matched with the electronic article, that is, the area of the carrying region 111 is the area of the surface of the side of the electronic article facing the carrying region. It can be understood that the contact area of the electronic article with the carrier region 111 is the area of the carrier region 111 minus the area of the plurality of grooves 130.

TABLE 1

As can be seen from table 1, with the structure provided in the embodiment of the present application, in the structure provided in the present application, the contact area between the electronic article and the carrying region 111 occupies 64% of the area of the electronic article, and compared with the structure provided in the first comparative example, the rigid deformation amount of the structure provided in the present application is reduced by 43%, and the thermal deformation amount is reduced by 40%, which can be analogized compared with the rest of comparative examples, and thus, details are not repeated. According to table 1, a bar graph as shown in fig. 33 was prepared, each column was obtained by sequentially superimposing the percentage of the contact area of the product, the amount of rigid deformation, and the amount of thermal deformation in the order of percentage, and from left to right, each column corresponded to the present application, the first comparative example, the second comparative example, the third comparative example, the fourth comparative example, the fifth comparative example, the sixth comparative example, and the seventh comparative example, respectively. As can be seen from fig. 33, the lower the percentage of the stacking in the pillar is, the better the corresponding performance is, and the height of the pillar corresponding to the structure provided by the present application is the lowest, so that the structure provided by the present application can obtain smaller rigid deformation and thermal deformation, and has excellent mechanical structure characteristics.

To sum up, the groove 130 structure having proportionality and directionality is provided in the carrier tray 10 provided in the embodiment of the present application, and through the structural form and the arrangement position of the groove 130, the continuous area in the carrier region 111 can be reduced, the risk of thermal deformation is reduced, and meanwhile, the grooves 130 extending in the same direction can improve the rigidity of the carrier tray 10. The carrier tray 10 can be manufactured by, for example, hot press molding, and is made of the same material as the carrier tray as a whole, so that the process is simple and the manufacturing is convenient.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A bearing tray is used for bearing at least one electronic article and is characterized by comprising at least one bearing unit; the bearing unit includes:

wherein the first direction and the third direction have an included angle.

2. The carrier tray of claim 1 wherein the included angle is 40 to 50 degrees.

3. The carrier tray of claim 2 wherein the included angle is 45 degrees.

4. The carrier tray of claim 1, wherein the plurality of grooves are equally spaced along the fourth direction.

5. The carrier platter of claim 4, wherein the width of said grooves along said fourth direction is equal to the spacing of adjacent said grooves along said fourth direction.

6. The carrier tray of claim 1, wherein the carrier region has a first virtual boundary line, and a second virtual boundary line is formed between the plurality of grooves and the carrier region;

7. The carrier tray of claim 6, wherein the first virtual borderline and the second virtual borderline are spaced apart by a distance equal to the width of the groove in the fourth direction.

8. The carrier tray of claim 6, wherein the first virtual boundary line and the second virtual boundary line are at least one of rectangular, circular, and elliptical.

9. The carrier platter of any one of claims 1 to 8, wherein said recess has opposite ends along said fourth direction;

and arc transition sections are arranged at two ends of the groove.

10. A carrier tray stack structure comprising a plurality of carrier trays according to any of claims 1 to 9 stacked on top of each other.