CN113809270A - Display panel and preparation method thereof - Google Patents

Abstract

The embodiment of the application provides a display panel and a preparation method thereof, wherein the display panel comprises: a substrate; the conducting layer sets up in one side of base plate, and the conducting layer includes signal line and metal protection portion, and the signal line has the top surface that deviates from the base plate, the bottom surface towards the base plate and connects the side of top surface and bottom surface, and the side includes two first sides that set up relatively on the signal line width direction, and metal protection portion covers at least partial first side. The application can improve the yield of the display panel.

Description

Display panel and preparation method thereof

Technical Field

The application relates to the technical field of display equipment, in particular to a display panel and a preparation method thereof.

Background

Flat Display panels, such as Liquid Crystal Display (LCD) panels, Organic Light Emitting Diode (OLED) panels, and Display panels using Light Emitting Diode (LED) devices, have advantages of high image quality, power saving, thin body, and wide application range, and are widely used in various consumer electronics products, such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, and become the mainstream of Display devices.

The display panel comprises a plurality of layer structures, and in the preparation process of the display panel, after the signal lines are prepared, other film layers are prepared continuously, so that etching traces can be left on the signal lines in the process of preparing the other film layers, the stability of the signal lines is further influenced, and the yield of the display panel is influenced.

Disclosure of Invention

The embodiment of the application provides a display panel and a preparation method thereof, aiming at improving the yield of the display panel.

An embodiment of a first aspect of the present application provides a display panel, including: a substrate; the conducting layer sets up in one side of base plate, and the conducting layer is including being located the signal line and the metal protection portion of encapsulation region, and the signal line has the top surface that deviates from the base plate, the side of connecting top surface and bottom surface towards the bottom surface of base plate, and the side includes two first sides that set up relatively on its width direction, and metal protection portion covers at least part first side.

According to an embodiment of the first aspect of the present application, a display panel has a display area and a sealing area disposed on a peripheral side of the display area, the display panel further includes; the packaging layer is arranged on one side, away from the substrate, of the conducting layer and comprises frame sealing glue located in the packaging area, and the orthographic projection of at least part of the signal lines on the substrate is located, on the substrate, in the orthographic projection of the frame sealing glue, and at least part of the orthographic projection is overlapped.

According to any one of the preceding embodiments of the first aspect of the present application, the signal line includes a first sub-layer and a second sub-layer located on a side of the first sub-layer facing away from the substrate, the first side surface includes a first sub-surface located on the first sub-layer and a second sub-surface located on the second sub-layer, and the metal protection portion covers the second sub-surface.

According to any one of the preceding embodiments of the first aspect of the present application, the material of the second sub-layer comprises aluminium.

According to any one of the preceding embodiments of the first aspect of the present application, the material of the first sub-layer comprises titanium.

According to any one of the preceding embodiments of the first aspect of the application, the metal protection covers at least part of the top surface and the second sub-surface.

According to any one of the preceding embodiments of the first aspect of the present application, the metal protection covers the second sub-face and at least part of the first sub-face.

According to any of the preceding embodiments of the first aspect of the present application, the metal protection part covers the second sub-surface, the first sub-surface and a part of the substrate surface.

According to any of the preceding embodiments of the first aspect of the present application, the display panel further comprises:

the insulating layer is arranged on one side, away from the substrate, of the conducting layer, and is provided with a first opening so that the signal line and the metal protection part are exposed out of the first opening;

the first electrode layer is positioned on one side, away from the signal line, of the insulating layer, and the metal protection part and the first electrode layer are arranged on the same layer and made of the same material.

According to any of the embodiments of the first aspect of the present application, the first electrode layer includes a plurality of first electrodes distributed in an array, and the first electrodes are used for driving the display panel to emit light.

According to any one of the foregoing embodiments of the first aspect of the present application, the signal line includes a third sub-layer located on a side of the second sub-layer away from the first sub-layer, the first sub-layer and the third sub-layer are both metal titanium layers, the first side surface further includes a third sub-surface located on the third sub-layer, and the metal protection portion covers the third sub-surface.

According to any of the preceding embodiments of the first aspect of the present application, the material of the metal protection part and the material of the first sub-layer are the same.

According to any one of the preceding embodiments of the first aspect of the present application, the material of the first sub-layer and the metal protection comprises titanium, and the material of the second sub-layer comprises aluminum.

According to any of the preceding embodiments of the first aspect of the present application, the metal guard extends from one of the side surfaces to the other side surface and covers the top surface.

According to any of the preceding embodiments of the first aspect of the present application, the metal protection covers at least part of the substrate surface.

According to any one of the preceding embodiments of the first aspect of the present application, the metal protection portion includes a bonding section, the bonding section is attached to the substrate, and an extension of the bonding section in a width direction is 0.2 μm to 0.4 μm.

According to any one of the preceding embodiments of the first aspect of the present application, the signal line is correspondingly provided with two metal protecting parts, and each metal protecting part is used for covering at least part of each side surface.

According to any one of the foregoing embodiments of the first aspect of the present application, the metal guard has an extension in the width direction of 6 μm to 8 μm.

According to any one of the foregoing embodiments of the first aspect of the present application, an extension of the signal line in the width direction is 200 μm to 300 μm.

According to any one of the embodiments of the first aspect of the present application, the pitch of the two metal guard portions corresponding to the same signal line in the width direction is 195 μm to 295 μm.

Embodiments of the second aspect of the present application provide a method for manufacturing a display panel, where the method for manufacturing a display panel includes:

preparing a substrate;

preparing a metal material layer on one side of a substrate, carrying out patterning treatment on the metal material layer to form a conductive layer, wherein the conductive layer comprises a signal line and a metal protection part, the signal line is provided with a top surface deviating from the substrate, a bottom surface facing the substrate and side surfaces connecting the top surface and the bottom surface, the side surfaces comprise two first side surfaces which are oppositely arranged in the width direction of the side surfaces, and the metal protection part covers at least part of the first side surfaces.

According to the embodiment of the second aspect of the present application, in the step of preparing the metal material layer on the substrate, and patterning the metal material layer to form the conductive layer:

preparing a first metal material layer on a substrate, and patterning the first metal material layer to form a signal line;

preparing an insulating material layer on one side of the signal line, which is far away from the substrate, and patterning the insulating material layer to form an insulating layer, wherein the insulating layer comprises a first opening, and the signal line is exposed from the first opening;

and preparing a second metal material layer on one side of the insulating layer, which is far away from the signal line, and patterning the second metal material layer to form a metal protection part and first electrodes distributed in an array.

According to any one of the foregoing embodiments of the second aspect of the present application, the signal line includes a first sub-layer and a second sub-layer, the metal material layer is prepared on one side of the substrate, and the patterning process is performed on the metal material layer to form the conductive layer, in the step:

coating a first sub-material layer and a second sub-material layer on one side of a substrate in sequence;

patterning the first sub-material layer and the second sub-material layer to form a first sub-layer and a second sub-layer;

coating a third material layer on the side of the second sub-layer facing away from the substrate;

and patterning the third material layer to form the metal protection part, wherein the material of the third material layer is the same as that of the first sub material layer.

According to any one of the embodiments of the second aspect of the present application, in the step of patterning the first sub-material layer and the second sub-material layer to form the first sub-layer and the second sub-layer: coating a first photoresist layer on one side of the first sub-material layer and the second sub-material layer, which is far away from the substrate, and exposing, developing and etching to form a first sub-layer and a second sub-layer;

in the step of patterning the third material layer to form the metal protection part: coating a second photoresist layer on one side of the third material layer, which is far away from the substrate, and exposing, developing and etching to form a metal protection part;

and exposing the first photoresist layer and the second photoresist layer by using the same mask plate, wherein the light energy for exposing the first photoresist layer is greater than the light energy for exposing the second photoresist layer.

In the display panel provided by the embodiment of the application, the display panel comprises a substrate and a conductive layer arranged on the substrate. The embodiment of the application further provides the metal protection part on the conductive layer, and the metal protection part can provide protection for at least part of the first side surface of the signal wire, so that the first side surface of the signal wire is not easy to be etched by a subsequent etching process to cause other impurities to be laterally remained, the yield of the signal wire is further improved, and the yield of the display panel is further improved.

Drawings

Other features, objects, and advantages of the present application will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like or similar reference characters identify the same or similar features.

Fig. 1 is a top view of a display panel provided in an embodiment of a first aspect of the present application;

FIG. 2 is an enlarged partial schematic view taken at A-A in FIG. 1;

FIG. 3 is a schematic view of a portion A-A of FIG. 1 in an enlarged scale in accordance with another embodiment;

FIG. 4 is a schematic view of a portion A-A of FIG. 1 in an enlarged scale in accordance with still another embodiment;

FIG. 5 is a cross-sectional view taken at A-A of FIG. 1 in a further embodiment;

FIG. 6 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the second aspect of the present application;

FIG. 7 is a schematic flowchart illustrating a detailed process of a step in a method for manufacturing a display panel according to an embodiment of the second aspect of the present application;

FIG. 8 is a schematic flow chart illustrating a step in a method for manufacturing a display panel according to another embodiment of the second aspect of the present application;

fig. 9 to 17 are schematic process diagrams of a method for manufacturing a display panel according to an embodiment of the second aspect of the present application;

fig. 18 to fig. 26 are schematic process diagrams of a method for manufacturing a display panel according to another embodiment of the second aspect of the present application.

Description of reference numerals:

100. a substrate;

200. a conductive layer; 210. a signal line; 210a, a first sublayer; 210b, a second sublayer; 210c, a third sub-surface; 220. a metal protection part; 230. a conductive wire; 240. connecting a lead;

300. an insulating layer; 310. a first opening;

400. a first electrode layer; 410. a first electrode;

500. a pixel defining layer; 510. a pixel defining section; 520. a pixel opening;

600. a support pillar;

700. a packaging layer; 710. sealing the frame glue; 720. a cover plate;

AA. A display area; KA; an opening area; NA, non-display area; FA. And (7) packaging the area.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the description of the present application, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like, indicate an orientation or positional relationship that is merely for convenience in describing the application and to simplify the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The directional terms appearing in the following description are directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.

The OLED display panel comprises an array substrate and a light emitting structure layer arranged on the array substrate, wherein the array substrate comprises a plurality of metal layers and an insulating layer located between every two adjacent metal layers, and the light emitting structure layer comprises an electrode layer, a pixel definition layer, a supporting column and other organic film layers. In the preparation process of the display panel, the inventor finds that after the metal layer is prepared, when the electrode layer is prepared, wet etching is needed for preparing the electrode layer, and the wet etching can cause some wires in the unprotected metal layer to be etched again, so that grooves appear on the side surfaces of the wires. When the pixel definition layer or the supporting pillar is prepared subsequently, some organic materials used for preparing the pixel definition layer or the supporting pillar may remain in the groove on the side surface of the conducting wire, which causes short circuit of the conducting wire in the subsequent process and affects the performance of the display panel.

Moreover, the normal operation of the light emitting structure layer is easily affected by the invasion of water and oxygen during the preparation process of the display panel, so that the OLED display panel needs to be packaged by using a packaging layer. The packaging method is various, and the glass powder packaging becomes the mainstream display technology of the hard-screen OLED display panel at present by virtue of the advantages of mature technology, good packaging effect and the like. The glass frit package generally includes a frame sealing adhesive and a glass cover plate, wherein the frame sealing adhesive includes glass frit, a filler (e.g., ceramic powder, refractory oxide, etc.), and an adhesive. The glass powder packaging process needs to sinter the frame sealing glue, which results in that the frame sealing glue needs to be in a high-temperature environment. When the frame sealing glue is processed by using a high-temperature process, the organic material can cause bubbles to appear at the groove part under a high-temperature environment, and further poor packaging is caused.

The present application is made to alleviate or solve the above technical problems, at least to some extent. For better understanding of the present application, the display panel, the method for manufacturing the display panel, and the display device according to the embodiments of the present application are described in detail below with reference to fig. 1 to 26.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the first aspect of the present application. Fig. 2 is a partial cross-sectional view taken at a-a in fig. 1.

As shown in fig. 1 and 2, the display panel includes: a substrate 100; the conductive layer 200 is disposed on the substrate 100, the conductive layer 200 includes a signal line 210 and a metal protection portion 220, the signal line 210 has a top surface facing away from the substrate 100, a bottom surface facing the substrate 100, and side surfaces connecting the top surface and the bottom surface, the side surfaces include two first side surfaces disposed oppositely in a width direction of the signal line 210, and the metal protection portion 220 covers at least a portion of the first side surfaces.

The width direction may be the X direction or the Y direction in fig. 1. When the signal line 210 extends in the X direction in fig. 1, the width direction is the Y direction in fig. 1. In contrast, when the signal line 210 extends in the Y direction in fig. 1, the width direction is the X direction in fig. 1.

In the display panel provided in the embodiment of the present application, the display panel includes a substrate 100 and a conductive layer 200 disposed on the substrate 100. The embodiment of the application further provides the metal protection part 220 on the conductive layer 200, and the metal protection part 220 can provide protection for at least part of the first side surface of the signal line 210, so that the first side surface of the signal line 210 is not easily etched by a subsequent etching process to cause other impurities to remain on the side, the yield of the signal line 210 can be improved, and the yield of the display panel is further improved.

As shown in fig. 1, the display surface provided by the embodiment of the present application includes a display area AA and a package area FA disposed around the display area AA. The positions of the encapsulation areas FA are illustrated in fig. 1 by hatching, which does not form a limitation on the structure of the display panel according to the embodiment of the present application.

Optionally, the display panel may further have a non-display area NA, and the encapsulation area FA is located in the non-display area NA. In some optional embodiments, in order to facilitate the under-screen integration of the photosensitive component, the display panel further has an opening area KA, and a through hole may be formed in the opening area KA, so that the photosensitive component obtains the optical information through the through hole. Optionally, the edge of the opening area KA is also provided with a packaging area FA.

Referring to fig. 2, the display panel further includes a packaging layer 700 disposed on a side of the conductive layer 200 away from the substrate 100, the packaging layer 700 includes a sealant 710 located in a packaging region FA, and an orthogonal projection of the signal line 210 on the substrate 100 is at least partially overlapped with an orthogonal projection of the sealant 710 on the substrate 100.

In the embodiment of the present invention, the orthographic projection of the signal line 210 of the conductive layer 200 in the encapsulation area FA on the substrate 100 is at least partially overlapped with the orthographic projection of the frame sealing adhesive 710 of the encapsulation layer 700 on the substrate 100, that is, at least a portion of the frame sealing adhesive 710 is located above the signal line 210, so that the signal line 210 is easily affected when the frame sealing adhesive 710 is operated by a high temperature process such as sintering. The conductive layer 200 is provided with a metal protection portion 220, and the metal protection portion 220 can provide protection for at least a part of the first side surface of the signal line 210, so that the first side surface of the signal line 210 is not easily etched by a subsequent etching process to cause other impurity side residues. When the high-temperature process is used for operating the frame sealing adhesive 710, the impurities are not easily gasified or deformed to generate bubbles, and the sealing performance of the packaging layer 700 can be improved.

The signal lines 210 may be disposed in various ways, and the signal lines 210 may be, for example, power lines, voltage reference lines, data signal lines 210, scanning signal lines 210, detection lines, and the like.

Optionally, the conductive layer 200 may further include a conductive line 230, and the conductive line 230 and the signal line 210 are used to transmit different signals.

Optionally, the encapsulation layer 700 further includes a cover plate 720 located on a side of the conductive layer 200 away from the substrate 100, and the encapsulation layer 700 and the sealant 710 are connected to each other to seal the display panel. Optionally, the frame sealing adhesive 710 is ring-shaped and disposed around the display area AA to achieve full sealing of the peripheral side of the display area AA.

Optionally, referring to fig. 3, the signal line 210 includes a first sub-layer 210a and a second sub-layer 210b made of different materials, the second sub-layer 210b is located on a side of the first sub-layer 210a away from the substrate 100, the first side surface includes a first sub-surface located on the first sub-layer 210a and a second sub-surface located on the second sub-layer 210b, and the metal protection portion 220 covers the second sub-surface. Usually, the second sub-layer 210b is very easily etched by the subsequent etching process to cause other impurity side residue, and the metal protection portion 220 covers the side surface of the second sub-layer 210b to prevent the second sub-layer 210b from being etched by the subsequent etching process to cause other impurity side residue.

The material of the second sub-layer 210b is selected from various materials, and the material of the second sub-layer 210b optionally includes aluminum, so that the second sub-layer 210b has better conductivity and flexibility. Since the material of the second sub-layer 210b includes aluminum, and the metal aluminum is easily etched, the metal protection part 220 covering the side of the second sub-layer 210b can provide better protection for the second sub-layer 210 b.

Optionally, the metal protection part 220 covers at least part of the top surface and the second sub-surface, and the metal protection part 220 extends to the top surface, which can reduce the manufacturing precision on one hand, and can ensure that the metal protection part 220 completely covers the second sub-surface on the other hand.

Optionally, the metal protection part 220 covers the second sub-surface and at least part of the first sub-surface, that is, the metal protection part 220 extends downward from the second sub-surface to the first sub-surface, which can reduce the manufacturing precision on one hand and ensure that the metal protection part 220 completely covers the second sub-surface on the other hand.

Optionally, the metal protection part 220 covers the second sub-surface, the first sub-surface and a part of the substrate surface. That is, the metal protection part 220 extends to the substrate surface, so as to ensure that the metal protection part 220 can completely cover the first sub-surface and the second sub-surface, and the metal protection part 220 can provide better protection for the signal line 210.

Referring to fig. 3, the metal protection portion 220 extends from the top surface to the surface of the substrate 100 through the second sub-surface and the first sub-surface, and the size of the metal protection portion 220 is large enough to enable the metal protection portion 220 to provide better protection for the signal line 210.

There are various ways of disposing the metal protecting part 220, and as shown in fig. 2 and 3, the display panel further includes: the insulating layer 300 is disposed on a side of the conductive layer 200 away from the substrate 100, and the insulating layer 300 is provided with a first opening 310, so that the signal line 210 and the metal protection portion 220 are exposed from the first opening 310; the first electrode layer 400 is located on a side of the insulating layer 300 away from the signal line 210.

Optionally, the display panel further includes: a pixel defining layer 500 disposed on a side of the first electrode layer 400 away from the insulating layer 300; the supporting pillars 600 are disposed on a side of the pixel defining layer 500 away from the first electrode layer 400. The material of the pixel defining layer 500 and the material of the support posts 600 include, for example, organic materials.

In some optional embodiments, in order to improve the connection stability between the sealant 710 on the package layer 700 and the substrate 100 and the structures on the substrate 100, the sealant 710 needs to be in direct contact with the wires. This results in that, when the insulating layer 300 is prepared, the insulating layer 300 is patterned to form the first opening 310, and the conductive line is exposed through the first opening 310.

Referring to fig. 3, fig. 3 is a partial cross-sectional view taken along line a-a of fig. 1 in accordance with another embodiment.

As shown in fig. 3, optionally, the signal line 210 includes, for example, a plurality of layers sequentially distributed in the thickness direction of the display panel, for example, the signal line 210 includes two titanium layers and an aluminum layer located between the two titanium layers.

With reference to fig. 3, the signal line 210 further includes a third sub-layer 210c, the third sub-layer 210c is located on a side of the second sub-layer 210b away from the first sub-layer 210a, the first sub-layer 210a and the third sub-layer 210c are both made of a metal titanium layer, the first side surface further includes a third sub-surface located on the third sub-layer 210c, and the metal protection portion 220 covers the third sub-surface 210 c. The metal protection part 220 extends from the top surface to the surface of the substrate 100 through the third sub-surface, the second sub-surface and the first sub-surface, so that the metal protection part 220 can provide better protection for the signal line 210.

Referring to FIG. 4, FIG. 4 is a partial cross-sectional view taken along line A-A of FIG. 1 in accordance with yet another embodiment.

As shown in fig. 4, the pixel defining layer 500 includes a pixel defining portion 510 and a pixel opening 520 in the display area AA, and the supporting pillar 600 is disposed on the pixel defining portion 510. Optionally, a light emitting unit is disposed in the pixel opening 520 to realize light emission of the display panel. Optionally, the first electrode layer 400 includes a plurality of first electrodes 410, each first electrode 410 is disposed corresponding to each pixel opening 520, and each first electrode 410 is used for driving the light emitting unit located in each pixel opening 520 to emit light. Optionally, a common electrode layer is further disposed on the sides of the pixel defining layer 500 and the supporting pillars 600 facing away from the first electrode layer 400, and the common electrode interacts with the first electrode 410 to drive the light emitting unit to emit light.

Alternatively, as shown in fig. 4, the substrate 100 includes a driving circuit including a thin film transistor T and a connection wire 240, and the thin film transistor T is connected to the first electrode 410 through the connection wire 240. The signal lines 210 and the connecting wires 240 may be formed of the same material in the same layer to simplify the manufacturing of the display panel.

As described above, in the case that the signal line 210 includes two titanium layers and an aluminum layer between the two titanium layers, that is, in the case that the signal line 210 includes the first sub-layer 210a, the second sub-layer 210b, and the third sub-layer 210c, the conductive line exposed by the first opening 310 is etched when the first electrode layer 400 is subsequently prepared and the first electrode layer 400 is patterned by using an etching process. The aluminum metal reacts with the etching solution to be etched, that is, the second sub-layer 210b reacts with the etching solution to be etched, so that a groove appears on the first side surface of the signal line 210. The organic materials used to prepare the pixel defining layer 500 and the support pillars 600 may fall into the grooves when the pixel defining layer 500 and the support pillars 600 are prepared in a subsequent process. When the frame sealing adhesive 710 is subsequently processed by a high temperature process, the signal line 210 closer to the frame sealing adhesive 710 is in a high temperature environment, and the organic material in the high temperature environment may cause bubbles to appear at the groove portion, which affects the packaging performance.

In the display panel that this application provided, the first side of at least part of signal line 210 is covered by metal protection portion 220, and metal protection portion 220 can play the guard action to the first side of signal line 210, avoids first side by the sculpture and form the recess, therefore can not make organic material remain in the recess, just can not form the bubble yet, can effectively improve encapsulation performance.

In some alternative embodiments, the metal guard 220 and the first electrode layer 400 are provided in the same layer of the same material. The metal guard 220 and the first electrode layer 400 may be prepared and molded in the same step. When the first electrode layer 400 is patterned, the metal protection part 220 is not etched because the metal protection part 220 needs to be formed. The metal protection part 220 formed on the one hand can provide protection to the side of the signal line 210, and on the other hand, the position is not etched to further ensure that no groove is formed.

The signal line 210 includes two first side surfaces opposite to each other in a width direction thereof, and the signal line 210 may be correspondingly provided with one metal protecting part 220 such that the metal protecting part 220 covers one of the side surfaces, thereby providing protection to one of the side surfaces and reducing the number of grooves formed.

In other alternative embodiments, two metal protection parts 220 are correspondingly disposed on the signal line 210, and each metal protection part 220 is used for covering at least part of each first side surface. The number of grooves formed on the signal line 210 can be further reduced. Optionally, the metal protection part 220 completely covers the side surface of the signal line 210, so that a groove can be avoided, and the sealing effect can be further improved.

In some alternative embodiments, the width dimension of the metal protection part in the width direction of the signal line is 6 μm to 8 μm, i.e., the dimension of the orthographic projection of the metal protection part 220 on the substrate is 6 μm to 8 μm. When the width of the metal protection part 220 is within the above range, it is possible to avoid that the width of the metal protection part 220 is too small to expose a part of the side surface, and the protection strength of the metal protection part 220 is insufficient; the metal protection part 220 can be prevented from being too large in size, so that the metal protection part 220 covers too much top surface, and the contact area between the frame sealing glue 710 and the top surface is reduced to influence the sealing effect.

Optionally, the size of the signal line 210 in the width direction is 200 μm to 300 μm. The width of the signal line 210 is large, so that the contact area between the signal line 210 and the frame sealing adhesive 710 can be increased, and the sealing effect can be improved.

The distance between two metal protection parts 220 corresponding to the same signal line 210 in the width direction is 195 μm to 295 μm, that is, the width dimension of the top surface not covered by the metal protection parts 220 is 195 μm to 295 μm, so that the contact area between the signal line 210 and the frame sealing adhesive 710 is large, and the sealing effect can be improved.

Optionally, the conductive layer 200 includes, for example, a three-layer structure stacked in sequence, and the conductive layer 200 includes, for example, two titanium layers and an aluminum layer located between the two titanium layers. When the first electrode layer 400 is prepared and the first electrode layer 400 is etched, the etching solution may react with the aluminum material in the aluminum layer, resulting in a groove on the side surface of the wire layer. In some optional embodiments, the titanium layer located above the aluminum layer in the conductive layer 200 may also cover the aluminum layer to isolate the reaction between the aluminum layer and the etching solution, so as to protect the aluminum layer. The titanium layer located above the aluminum layer may serve as a metal protector 220 to protect the signal line 210 formed by the aluminum layer and the titanium layer located on the side of the aluminum layer facing the substrate 100.

Referring to fig. 5, fig. 5 is a partial cross-sectional view taken along line a-a of fig. 1 in accordance with yet another embodiment.

As shown in fig. 5, in some alternative embodiments, the material of the metal protection part 220 is the same as the material of the first sub-layer 210 a. The material of the first sub-layer 210a and the metal protection part 220 includes titanium, and the material of the second sub-layer 210b includes aluminum. The titanium layer of the conductive layer 200 is used to protect the aluminum layer from being etched to generate a groove, so that the structure is simple and the thickness of the conductive layer 200 is not increased.

Metal guard 220 extends from one of the first side surfaces to the other first side surface and covers the top surface. Because the material of the metal protection part 220 includes titanium, the contact performance of the metal protection part 220 and the frame sealing adhesive 710 is better, and the metal protection part 220 extends from one first side surface to the other first side surface and covers the top surface, so that the contact area of the metal protection part 220 and the frame sealing adhesive 710 can be increased, and the sealing performance is improved.

Optionally, the metal protection part 220 covers at least a part of the surface of the substrate 100, so as to ensure that the metal protection part 220 can completely cover the side surface of the signal line 210, and improve the protection effect of the metal protection part 220.

Optionally, the metal protection portion 220 includes a bonding segment, the bonding segment is bonded to the substrate 100, and a dimension of the bonding segment in the width direction is 0.2 μm to 0.4 μm. When the size of the attaching section in the width direction is within the above range, the protective performance of the metal protective part 220 can be prevented from being affected by too short extension of the attaching section, and short-circuit connection between the attaching section and an adjacent metal wire due to too long extension of the attaching section can also be prevented.

Referring to fig. 6, fig. 6 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the second aspect of the present application.

As shown in fig. 6, an embodiment of the second aspect of the present application further provides a method for manufacturing a display panel, where the display panel may be the display panel provided in any of the embodiments of the first aspect. The preparation method of the display panel comprises the following steps:

step S01: a substrate 100 is prepared.

Step S02: a metal material layer is prepared on one side of the substrate 100, and the metal material layer is patterned to form the conductive layer 200.

As above, the conductive layer 200 includes the signal line 210 and the metal protection part 220, the signal line 210 has a top surface facing away from the substrate 100, a bottom surface facing the substrate 100, and side surfaces connecting the top surface and the bottom surface, the side surfaces include two first side surfaces disposed oppositely in a width direction of the signal line, and the metal protection part 220 covers at least a part of the first side surfaces.

Optionally, the signal line 210 and the metal protection part 220 are located in the encapsulation area FA.

As described above, the encapsulation layer 700 includes the sealant 710 located in the encapsulation area FA, and the orthographic projection of at least a portion of the signal lines 210 on the substrate 100 is located within the orthographic projection of the sealant 710 on the substrate 100.

In the display panel prepared by the embodiment of the application, the metal protection part 220 can provide protection for at least part of the side surface of the signal line 210, so that the side surface of the signal line 210 is not easy to be etched by a subsequent etching process to cause other impurity side residues, the yield of the signal line 210 can be improved, and the yield of the display panel is further improved.

Optionally, with continuing to refer to fig. 6, the method for manufacturing a display panel further includes: step S03: the encapsulation layer 700 is prepared at the side of the conductive layer 200 facing away from the substrate 100.

The setting manner of step S02 is various, please refer to fig. 7, and fig. 7 is a detailed flowchart of a step in a method for manufacturing a display panel according to an embodiment of the second aspect of the present application.

As shown in fig. 7, in some alternative embodiments, step S02 includes:

step S021: a first metal material layer is prepared on one side of the substrate 100, and is patterned to form the signal line 210.

Step S022: an insulating material layer is prepared on a side of the signal line 210 facing away from the substrate 100, and the insulating material layer is patterned to form an insulating layer 300, wherein the insulating layer 300 includes a first opening 310, and the signal line 210 is exposed from the first opening 310.

Step S023: a second metal material layer is prepared on the side of the insulating layer 300 away from the signal line 210, and the second metal material layer is patterned to form the metal protection portion 220 and the first electrodes 410 distributed in an array.

In these alternative embodiments, the metal protecting part 220 and the first electrode 410 are simultaneously formed in step S023, which can simplify the manufacturing method of the display panel. In addition, when the patterning process is performed on the first electrode layer 400, since the metal protection part 220 needs to be formed, the position of the metal protection part 220 is not etched. The metal protection part 220 formed on the one hand can provide protection to the side of the signal line 210, and on the other hand, the position is not etched to further ensure that no groove is formed.

Referring to fig. 8, fig. 8 is a schematic flowchart illustrating a step in a method for manufacturing a display panel according to another embodiment of the second aspect of the present application.

As shown in fig. 8, the signal line 210 may optionally include a first sub-layer 210a and a second sub-layer 210 b. In other alternative embodiments, step S02 includes:

step S021': a first sub-material layer and a second sub-material layer are sequentially coated on one side of the substrate 100.

The first sub-material layer comprises, for example, a metallic titanium layer and the second sub-material layer comprises, for example, a metallic aluminum layer.

Step S022': the first sub-material layer and the second sub-material layer are patterned to form a first sub-layer 210a and a second sub-layer 210 b.

Step S023': a third material layer is applied to the side of the second sub-layer 210b facing away from the substrate 100. The third material layer comprises, for example, a metallic titanium layer.

Step S024': the metal protection part 220 is formed by patterning the third material layer, which is the same as the first sub-material layer.

In these alternative embodiments, the original metal titanium layer is used as the metal protection portion 220, and a new film layer is not added while the metal protection portion 220 is added, so that the thickness of the display panel is not increased.

In step S022', the first sub-material layer and the second sub-material layer may be patterned by film formation, coating, exposure, development, and etching. The film formation is to form a film layer of the first sub-material layer and the second sub-material layer. "coating" is to coat a first photoresist layer over the first and second sub-material layers. The "exposure" is to perform laser processing on the first photoresist layer by using a mask plate, so that laser can remove part of the first photoresist layer. Developing forms the patterned first photoresist layer such that the first photoresist layer covers the first sub-material layer and the second sub-material layer that are not required to be etched away. The first sub-material layer 210a and the second sub-material layer 210b are formed by "etching", that is, etching the first sub-material layer and the second sub-material layer which are not covered by the first photoresist layer.

In step S024', the third material layer may also be patterned by film formation, coating, exposure, development, and etching. The film formation is to form a film layer of the third material layer. "coating" is to coat a second layer of photoresist over the third layer of material. The "exposure" is to perform laser processing on the photoresist layer by using a mask plate so that laser can remove part of the second photoresist layer. Development forms a patterned second photoresist layer such that the second photoresist layer covers the third material layer that does not need to be etched away. The metal protection part 220 is finally formed by "etching", that is, etching the third material layer which is not covered by the second photoresist layer.

In the above step S022 'and step S024', the same mask plate may be selected to process the first photoresist layer and the second photoresist layer, and the light energy for exposing the first photoresist layer is greater than the light energy for exposing the second photoresist layer. I.e., the third photoresist layer is weakly exposed, the size of the first photoresist layer etched in step S022 'is larger than the area of the second photoresist layer etched in step S024'. The area of the patterned second photoresist layer is larger than that of the patterned first photoresist layer, and when the first sub-material layer and the second sub-material layer, that is, the third material layer, are subsequently etched, the etched third material layer has a smaller size, and the remaining metal protection part 220 has a larger area, so that the metal protection part 220 can cover at least part of the side surface of the signal line 210.

In these optional embodiments, the same mask is used for exposing the first photoresist layer, so that one mask can be saved, the preparation of the display panel is simplified, and the preparation efficiency of the display panel is improved.

Taking the embodiment shown in fig. 3 as an example, referring to fig. 9 to 17, a method for manufacturing a display panel according to an embodiment of the second aspect of the present application is illustrated. The preparation method of the display panel comprises the following steps:

the method comprises the following steps: as shown in fig. 9, a first metallic material layer is formed on a substrate 100. The first metallic material layer includes, for example, a metallic titanium layer, a metallic aluminum layer, and a metallic titanium layer

Step two: as shown in fig. 10, the first metallic material layer is patterned to form the signal line 210 and the conductive line 230. The first metal material layer can be patterned by selecting the modes of film forming, coating, exposure, development and etching.

Step three: as shown in fig. 11, an insulating material layer is coated on the side of the signal lines 210 and the conductive lines 230 facing away from the substrate 100.

Step four: as shown in fig. 12, the insulating material layer is patterned to form an insulating layer 300, the insulating layer 300 includes a first opening 310, and the signal line 210 is exposed from the first opening 310.

Step five: as shown in fig. 13, a second metallic material layer is prepared on a side of the insulating layer 300 facing away from the substrate 100.

Step six: as shown in fig. 14, the second metal material layer is patterned to form a first electrode 410 and a metal guard 220. Optionally, the second metal material layer is patterned by selecting a film forming, coating, exposing, developing and etching manner.

Step seven: as shown in fig. 15, the pixel defining layer 500 and the supporting pillars 600 are prepared at a side of the first electrode 410 facing away from the substrate 100.

Step eight: as shown in fig. 16, a sealant 710 is disposed on the signal line 210

Step nine: as shown in fig. 17, a cover plate 720 is disposed on the sealant 710. Optionally, the frame sealing adhesive 710 and the cover plate 720 may be hermetically connected by laser sintering.

Taking the embodiment shown in fig. 5 as an example, referring to fig. 18 to fig. 26 together, a method for manufacturing a display panel according to another embodiment of the second aspect of the present application is illustrated. The preparation method of the display panel comprises the following steps:

the method comprises the following steps: as shown in fig. 18, a first sub-material layer and a second sub-material layer are sequentially coated on the substrate 100, the first sub-material layer includes, for example, a metal titanium layer, and the second sub-material layer includes, for example, a metal aluminum layer.

Step two: as shown in fig. 19, the first sub-material layer and the second sub-material layer are patterned to form the first sub-layer 210a and the second sub-layer 210 b.

Step three: as shown in fig. 20, a third material layer is applied on the side of the first and second sub-layers 210a and 210b facing away from the substrate 100. The material of the third material layer includes, for example, metallic titanium.

Step four: as shown in fig. 21, the conductive line 230, the signal line 210, and the metal guard 220 are formed by patterning the third material layer.

Step five: as shown in fig. 22, the insulating material layer is patterned to form an insulating layer 300, the insulating layer 300 includes a first opening 310, and the signal line 210 and the metal protection portion 220 are exposed through the first opening 310.

Step six: as shown in fig. 23, a second metallic material layer is prepared on a side of the insulating layer 300 facing away from the substrate 100. And the second metallic material layer is patterned to form the first electrode 410. Optionally, the second metal material layer is patterned by selecting a film forming, coating, exposing, developing and etching manner.

Step seven: as shown in fig. 24, the pixel defining layer 500 and the supporting pillars 600 are prepared at a side of the first electrode 410 facing away from the substrate 100.

Step eight: as shown in fig. 25, a frame sealing adhesive 710 is disposed on the metal protection portion 220

Step nine: as shown in fig. 26, a cover plate 720 is disposed on the sealant 710. Optionally, the frame sealing adhesive 710 and the cover plate 720 may be hermetically connected by laser sintering.

Embodiments of the present application further provide a display device, including the display panel according to any one of the embodiments of the first aspect. Since the display device of the embodiment of the present application includes the display panel, the display device of the embodiment of the present application has the beneficial effects of the display panel, and details are not repeated herein.

The display device in the embodiment of the present application includes, but is not limited to, a mobile phone, a Personal Digital Assistant (PDA), a tablet computer, an electronic book, a television, a door lock, a smart phone, a console, and other devices having a display function.

The present application may be embodied in other specific forms without departing from its spirit or essential characteristics. For example, the algorithms described in the specific embodiments may be modified without departing from the basic spirit of the application. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (10)

1. A display panel, comprising:

a substrate;

the conducting layer, set up in one side of base plate, the conducting layer includes signal line and metal protection part, the signal line has and deviates from the top surface of base plate, orientation the bottom surface of base plate and connection the top surface with the side of bottom surface, the side include signal line width direction is relative two first sides that set up, metal protection part covers at least part first side.

2. The display panel according to claim 1, wherein the display panel has a display region and a package region disposed on a peripheral side of the display region, the signal line and the metal protection portion are located in the package region, the display panel further comprises a package layer disposed on a side of the conductive layer away from the substrate, the package layer includes a sealant located in the package region, and an orthographic projection of the signal line on the substrate and an orthographic projection of the sealant on the substrate at least partially overlap.

3. The display panel according to claim 1, wherein the signal line comprises a first sub-layer and a second sub-layer located on a side of the first sub-layer facing away from the substrate, the first side surface comprises a first sub-surface located on the first sub-layer and a second sub-surface located on the second sub-layer, and the metal protection portion covers the second sub-surface;

preferably, the material of the second sublayer comprises aluminum;

preferably, the material of the first sub-layer comprises titanium;

preferably, the metal protection part covers at least part of the top surface and the second sub-surface;

preferably, the metal protection part covers the second sub-surface and at least part of the first sub-surface;

preferably, the metal protection part covers the second sub-surface, the first sub-surface and a part of the substrate surface.

4. The display panel according to claim 3, characterized in that the display panel further comprises:

the insulating layer is arranged on one side, away from the substrate, of the conducting layer, and is provided with a first opening, so that the signal line and the metal protection part are exposed out of the first opening;

the first electrode layer is positioned on one side of the insulating layer, which is far away from the signal wire, and the metal protection part and the first electrode layer are arranged on the same layer and are made of the same material;

preferably, the first electrode layer includes a plurality of first electrodes distributed in an array, and the first electrodes are used for driving the display panel to emit light;

preferably, the signal line includes a third sublayer located on a side of the second sublayer away from the first sublayer, the first sublayer and the third sublayer are both metal titanium layers, the first side face further includes a third sub-face located on the third sublayer, and the metal protection portion covers the third sub-face.

5. The display panel according to claim 3, wherein a material of the metal protective portion is the same as a material of the first sub-layer;

preferably, an orthogonal projection of the signal line on the substrate is located within an orthogonal projection of the metal protection part on the substrate;

preferably, the metal protection part extends from one of the first side faces to the other first side face and covers the top face;

preferably, the metal protection part covers at least part of the surface of the substrate;

preferably, the metal protection part comprises a bonding section, the bonding section is bonded with the substrate, and the size of the bonding section in the width direction is 0.2-0.4 μm.

6. The display panel according to claim 1, wherein two metal protection parts are correspondingly arranged on the signal line in the width direction of the signal line, and each metal protection part is used for covering at least part of each first side surface;

preferably, the size of the orthographic projection of the metal protection part on the substrate is 6-8 μm;

preferably, the signal line has a dimension in the width direction of 200 to 300 μm;

preferably, the pitch in the width direction of the two metal protection portions corresponding to the same signal line is 195 μm to 295 μm.

7. A method for manufacturing a display panel, the method comprising:

preparing a substrate;

preparing a metal material layer on one side of a substrate, patterning the metal material layer to form a conductive layer, wherein the conductive layer comprises a signal line and a metal protection part, the signal line is provided with a top surface deviating from the substrate, a bottom surface facing the substrate and side surfaces connected with the top surface and the bottom surface, the side surfaces comprise two first side surfaces which are oppositely arranged in the width direction of the signal line, and the metal protection part covers at least part of the first side surfaces.

8. The manufacturing method according to claim 7, wherein, in the step of preparing a metallic material layer on a substrate side, and patterning the metallic material layer to form the conductive layer:

preparing a first metal material layer on the substrate, and patterning the first metal material layer to form a signal line;

preparing an insulating material layer on one side of the signal line, which is far away from the substrate, and patterning the insulating material layer to form an insulating layer, wherein the insulating layer comprises a first opening, and the signal line is exposed from the first opening;

and preparing a second metal material layer on one side of the insulating layer, which is far away from the signal line, and carrying out patterning treatment on the second metal material layer to form the metal protection part and the first electrodes distributed in an array.

9. The manufacturing method according to claim 7, wherein the signal line includes a first sub-layer and a second sub-layer, a metal material layer is manufactured on a substrate side, and in the step of patterning the metal material layer to form the conductive layer:

coating a first sub-material layer and a second sub-material layer on one side of the substrate;

patterning the first sub-material layer and the second sub-material layer to form the first sub-layer and the second sub-layer;

coating a third material layer on a side of the second sub-layer facing away from the substrate;

and patterning the third material layer to form the metal protection part, wherein the material of the third material layer is the same as that of the first sub-material layer.

10. The production method according to claim 9,

in the step of patterning the first sub-material layer and the second sub-material layer to form the first sub-layer and the second sub-layer: coating a first photoresist layer on one side of the first sub-material layer and the second sub-material layer, which is far away from the substrate, and exposing, developing and etching to form a first sub-layer and a second sub-layer;

in the step of patterning the third material layer to form the metal protection portion: coating a second photoresist layer on one side of the third material layer, which is far away from the substrate, and exposing, developing and etching to form the metal protection part;

and exposing the first photoresist layer and the second photoresist layer by using the same mask plate, wherein the light energy for exposing the first photoresist layer is greater than the light energy for exposing the second photoresist layer.

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