CN113809133B - Display panel and display device - Google Patents
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- CN113809133B CN113809133B CN202110960244.4A CN202110960244A CN113809133B CN 113809133 B CN113809133 B CN 113809133B CN 202110960244 A CN202110960244 A CN 202110960244A CN 113809133 B CN113809133 B CN 113809133B
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- 239000010410 layer Substances 0.000 claims description 382
- 230000004888 barrier function Effects 0.000 claims description 51
- 230000000903 blocking effect Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005538 encapsulation Methods 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 41
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 description 62
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 15
- 239000004020 conductor Substances 0.000 description 14
- 238000002955 isolation Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 239000011368 organic material Substances 0.000 description 9
- 238000000059 patterning Methods 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012466 permeate Substances 0.000 description 4
- -1 polyethylene naphthalate Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Abstract
The application discloses a display panel and a display device, which are provided with a display area and a non-display area surrounding the display area, wherein the non-display area comprises a step area and a circuit connection area arranged in the step area, and a shift register and a driver I C are also arranged in the non-display area, and the display device further comprises: the first wiring layer is arranged in the step area, a plurality of first wirings are arranged in the first wiring layer, and one end of each first wiring is connected with the driver I C; the second wiring layer is arranged in the step area, an insulating layer is arranged between the second wiring layer and the first wiring layer, a plurality of second wirings are arranged in the second wiring layer, and one end of each second wiring is connected with the first wiring through a via hole in the circuit connection area; the separation grooves are arranged in the non-display area and annularly distributed around the circuit connection area, and orthographic projection of the separation grooves in the non-display area surrounds or covers the circuit connection area. The display panel and the display device provided by the application can protect the circuit wiring in the via hole from being corroded by water vapor, and the service life of the display panel is prolonged.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the continuous development of display technologies, such as LCD (Liquid Crystal Display ) display, OLED (Organic Light-Emitting Diode) display, flexible display, etc., display panels are widely used in various industries. However, many technical problems in the display panel are not well solved, and in order to improve the production yield and display effect of the display panel, those skilled in the art need to continuously and deeply study, search for the reasons of the technical problems, and innovate a method for solving the problems.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, which can isolate water vapor at the periphery of a via hole in the display panel, protect a circuit wiring in the via hole from being corroded by the water vapor, reduce the risk of circuit failure caused by the corrosion of the circuit wiring by the water vapor, and prolong the service life of the display panel.
In a first aspect, an embodiment of the present application provides a display panel, including a display area and a non-display area surrounding the display area, where the non-display area includes a step area and a line connection area disposed in the step area, and a shift register and a driving IC are further disposed in the non-display area, where the display panel includes: the first wiring layer is arranged in the step area, a plurality of first wirings are arranged in the first wiring layer, and one end of each first wiring is connected with the driving IC; the second wiring layer is arranged in the step area, an insulating layer is arranged between the second wiring layer and the first wiring layer, a plurality of second wirings are arranged in the second wiring layer, one ends of the second wirings are connected with the first wirings through holes in the circuit connection area, the other ends of the second wirings are connected with the shift register, and the driving IC sequentially provides control signals for the shift register through the first wirings and the second wirings; the blocking grooves are arranged in the non-display area and annularly distributed around the circuit connection area, and orthographic projection of the blocking grooves in the non-display area surrounds or covers the circuit connection area; the organic functional film layer at least comprises a first part, the first part extends from the display area to the periphery of the barrier groove, the first part is arranged on one side of the second wiring layer, which is opposite to the first wiring layer, and the barrier groove is not provided with the organic functional film layer; the packaging layer is arranged on one side of the organic functional film layer, which is opposite to the second wiring layer.
In a second aspect, a display device provided in an embodiment of the present application includes a display panel according to the above embodiment.
According to the display panel and the display device provided by the embodiment of the application, the blocking groove surrounding the circuit connection area is arranged, and the organic functional film layer is not arranged in the blocking groove, so that the organic functional film layer arranged on the second wiring layer is blocked at the blocking groove, namely, the organic functional film layer around the circuit connection area is cut off through the blocking groove, so that the blocking groove cuts off the external water vapor from penetrating into the circuit connection area and the route around the through hole, and the water vapor is prevented from penetrating into the through hole through the organic functional film layer to corrode the circuit wiring in the through hole. Meanwhile, the packaging layer is arranged on one side of the organic functional film layer, which is opposite to the second wiring layer, so that the packaging layer is utilized to isolate water vapor secondarily, water vapor is further prevented from seeping into the organic functional film layer, and meanwhile, water vapor is prevented from seeping into the display area. According to the display panel and the display device provided by the embodiment of the application, the barrier groove and the packaging layer are used for double isolation of water vapor, so that the circuit wiring in the via hole is effectively protected from being corroded by the water vapor, the normal electric signal connection function of the via hole is ensured to be maintained, the risk of circuit failure caused by corrosion of the circuit wiring by the water vapor is reduced, and the service lives of the display panel and the display device are effectively prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a display panel in the prior art;
FIG. 2 is a schematic view of a partial structure of the stepped region of FIG. 1;
FIG. 3 is a schematic cross-sectional view of FIG. 2 taken along line A-A;
FIG. 4 is a schematic view of a partial enlarged structure of the region B in FIG. 3;
fig. 5 is a schematic view of a partial structure of a step area in a display panel according to an embodiment of the present application;
FIG. 6 is a schematic view of a cross-sectional structure of the film layer in the region C in FIG. 5;
FIG. 7 is a schematic view of a cross-sectional structure along D-D of FIG. 5;
fig. 8 is a schematic cross-sectional view of a display panel according to an embodiment of the application;
fig. 9 is a schematic view showing another partial structure of a step area in a display panel according to an embodiment of the present application;
FIG. 10 is a schematic view of the cross-sectional structure of FIG. 9 taken along E-E;
FIG. 11 is a schematic view of a partial enlarged structure of region F in FIG. 10;
fig. 12 is a schematic structural diagram of a display device according to an embodiment of the present application.
In the accompanying drawings: a display panel-100; display region-R1; a non-display region-R2; line connection area-1000; step area-2000; shift register-3000; a drive IC-4000; display device-5000; a first wiring layer-200; a first trace-210; a second wiring layer-300; a second trace-310; virtual line-320; a via-400; organic functional film layer-500; a first portion-510; a first planarization layer-511; a first pixel definition layer-512; a second portion-520; a second planarization layer-521; a second pixel definition layer-522; encapsulation layer-600; a first inorganic film layer-610; an organic protective layer-620; barrier groove-700; an insulating layer-800; an organic insulating layer-810; a first segment organic insulating layer-811; a second segment organic insulating layer-812; an inorganic insulating layer-820; a second inorganic film layer-900; a substrate-10; a TFT array layer-20; an active layer-21; a first interlayer insulating layer (22); a first conductor layer-23; a second interlayer insulating layer-24; a second conductor layer 25; a third interlayer insulating layer-26; a third conductor layer-27; a light emitting layer 30.
Detailed Description
Features and exemplary embodiments of various aspects of the application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order not to unnecessarily obscure the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The azimuth words appearing in the following description are all directions shown in the drawings, and do not limit the specific structures of the display panel and the display device of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.
Referring to fig. 1 to 4, in the step area 2000 in the display panel, there may be a circuit trace layer in which a circuit trace is formed through patterning, the circuit trace is generally used to transmit an electrical signal, the circuit trace existing in the step area 2000 includes a scan line lead, a timing control line and the like, for the OLED display panel, a light emitting control line lead, both ends of the above type of circuit trace are respectively connected to a driving IC4000 and a shift register 3000, the driving IC4000 transmits a control signal to the shift register 3000 through the circuit trace, and further provides a driving signal to each pixel area in the display panel through the shift register 3000.
Considering the bad condition that the circuit wiring can generate static electricity in the normal use process due to overlong length and overlarge resistance of the circuit wiring, and the condition that the circuit wiring is short-circuited due to excessive static electricity accumulated in the circuit wiring, the signal transmission function of the circuit wiring is damaged, and the normal display of the display panel is affected.
Based on the above, in the step area of the display panel, two or more circuit routing layers are provided, for example, two circuit routing layers are taken as an example, see fig. 1 to 4, the display panel has two circuit routing layers, including a first routing layer 200 and a second routing layer 300 both disposed in the step area 2000, an insulating layer 800 is disposed between the second routing layer 300 and the first routing layer 200, the first routing layer 200 has a plurality of first routing lines 210, one end of the first routing line 210 is connected with a driving IC4000, and the second routing layer 300 has a plurality of second routing lines 310. It should be understood that the first wiring layer 200 forms a plurality of first wirings 210 through patterning, and similarly, the second wiring layer 300 forms a plurality of second wirings 310 through patterning, the adjacent first wirings 210 and second wirings 310 are connected through the via 400, and the other end of the second wiring 310 is connected to the shift register 3000, so that the disadvantage that static electricity is easily generated and accumulated in a single circuit wiring with a longer length to affect the normal display of the display panel is eliminated. Meanwhile, the first and second routing layers 200 and 300 are provided with an insulating layer 800.
Before the display panel is put into the market, the reliability test is required, the display panel is exposed to natural or artificial manufacturing environment conditions for testing, such as the conditions of high temperature, low temperature, high temperature and high humidity, temperature change and the like of a climate environment are simulated through various environment test equipment, the conditions of the display panel in various use environments are accelerated to verify whether the display panel reaches the expected quality targets in research, development, design and manufacturing, and the whole display panel is evaluated to determine the reliability life of the display panel.
In the process of reliability test of the display panel, the research and development personnel find that the display effect or the display performance of part of the display panel is deteriorated after the reliability test, and even the bad condition that the display cannot be displayed occurs. After the developer scans and analyzes the cross section of the display panel with poor display effect through a FIB (focused ion beam) instrument, the developer finds that: corrosion occurs at the via 400 for connecting the first trace 210 and the second trace 310, resulting in failure of the connection circuit in the via 400, thereby affecting the display effect of the display panel.
By analyzing FIB (electronic image) of the cross section of the display panel, researchers find that the organic functional film 500 exists at the positions of the first trace layer 200, the second trace layer 300 and the corroded via 400 and at the periphery of the via 400, and because the organic functional film 500 is made of an organic material, the capability of the organic material to block water vapor is poor, when the display panel performs reliability experiments, water vapor in the environment easily enters from the side of the step area 2000 of the display panel, and because the organic functional film 500 exists in the step area 2000, the water vapor permeates into the organic functional film 500 from the side of the organic functional film 500 and diffuses to the positions of the first trace layer 200, the second trace layer 300 and the via 400 along the organic functional film 500. The water vapor permeates into the via 400 and then is adhered to the circuit trace in the via 400, and because the circuit trace is a metal trace, the circuit trace in the via 400 is oxidized and corroded by the water vapor after being adhered with the water vapor, and after the circuit trace in the via 400 is oxidized and corroded by the water vapor for a long time, the circuit trace in the via 400 is broken, so that the electric signal in the via 400 cannot be normally transmitted, and the display function and the service life of the display panel are seriously affected.
Based on the technical problems, the embodiment of the application provides a display panel and a display device, which can effectively protect circuit traces in vias from being corroded by water vapor, ensure that the vias maintain normal electric signal connection functions, reduce the risk of circuit failure caused by corrosion of the circuit traces by the water vapor, and effectively prolong the service lives of the display panel and the display device.
For a better understanding of the present application, a display panel and a display device according to embodiments of the present application are described in detail below with reference to fig. 5 to 12.
Referring to fig. 5 to 7, an embodiment of the present application provides a display panel, which has a display region R1 and a non-display region R2 surrounding the periphery of the display region R1, wherein the non-display region R2 includes a step region 2000 and a line connection region 1000 disposed in the step region 2000, a shift register 3000 and a driving IC4000 are further disposed in the non-display region R2, and the display panel 100 includes a first routing layer 200, a second routing layer 300, a barrier groove 700, an organic functional film layer 500 and an encapsulation layer 600.
The first wiring layer 200 is disposed in the step area 2000, and a plurality of first wirings 210 are disposed in the first wiring layer 200, and one end of the first wirings 210 is connected to the driving IC4000. The second wiring layer 300 is disposed in the step area 2000, an insulating layer 800 is disposed between the second wiring layer 300 and the first wiring layer 200, a plurality of second wirings 310 are disposed in the second wiring layer 300, one end of each second wiring 310 is connected to the first wiring 210 through the via 400 in the wiring connection area 1000, the other end of each second wiring 310 is connected to the shift register 3000, and the driver IC4000 sequentially provides control signals for the shift register 3000 through the first wiring 210 and the second wiring 310. The blocking grooves 700 are disposed in the non-display region R2 and annularly distributed around the circuit connection region 1000, and the front projection of the blocking grooves 700 in the non-display region R2 surrounds or covers the circuit connection region 1000. The organic functional film 500 at least includes a first portion 510, where the first portion 510 extends from the display region R1 to the periphery of the barrier groove 700, and it should be noted that, with the barrier groove 700 as a boundary, a sidewall of the barrier groove 700 near the line connection region 1000 is an inner periphery of the barrier groove 700, a sidewall of the barrier groove 700 away from the line connection region 1000 is an outer periphery of the barrier groove 700, and a recess region of the barrier groove 700 is between the inner periphery and the outer periphery of the barrier groove 700. The first portion 510 is disposed on a side of the second wiring layer 300 facing away from the first wiring layer 200, and the organic functional film 500 is not disposed in the isolation trench 700. The encapsulation layer 600 is disposed on a side of the organic functional film 500 facing away from the second wiring layer 300.
It should be noted that, the region where all the first wires 210 and all the second wires 310 are connected through the via 400 forms the circuit connection region 1000, and the via 400 is located in the circuit connection region 1000. In addition, the organic functional film layer 500 includes one or more of organic layers such as a planarization layer, a pixel definition layer, and an organic insulating layer.
According to the display panel provided by the embodiment of the application, the blocking groove 700 is arranged at the periphery of the circuit connecting area 1000, the blocking groove 700 surrounds the circuit connecting area 1000, and the organic functional film 500 is not arranged in the blocking groove 700, so that the organic functional film 500 arranged on the second wiring layer 300 is blocked at the blocking groove 700, namely, the blocking groove 700 cuts off the organic functional film 500 at the periphery of the circuit connecting area 1000, so that the blocking groove 700 cuts off the route of outside water vapor seeping into the circuit connecting area 1000 and the periphery of the via 400, and the water vapor is prevented from seeping into the via 400 through the organic functional film 500 to corrode the circuit wiring in the via 400. Meanwhile, the packaging layer 600 is arranged on one side of the organic functional film layer 500, which is opposite to the second wiring layer 300, so that the packaging layer 600 is utilized to secondarily isolate the water vapor, the water vapor is further prevented from seeping into the organic functional film layer 500, and meanwhile, the water vapor is prevented from seeping into the display area R1.
According to the display panel provided by the embodiment of the application, the barrier groove 700 and the packaging layer 600 are used for double isolation of water vapor, so that the circuit wiring in the via 400 is effectively protected from being corroded by the water vapor, the via 400 is ensured to maintain a normal electric signal connection function, the risk of circuit failure caused by corrosion of the circuit wiring by the water vapor is reduced, and the service lives of the display panel and the display device are effectively prolonged.
In some alternative embodiments, the barrier groove 700 is a rectangular groove, the concave side of the barrier groove 700 faces the back side of the display panel 100, i.e. the concave side of the barrier groove 700 faces the non-light emitting side of the display panel 100. The cross section of the barrier groove 700 may be a ring shape formed by a rectangular shape, a ring shape formed by an arc line, a ring shape formed by a wavy line, a rectangular shape, a circular shape, or an elliptical shape, and the shape of the barrier groove 700 is not limited in the present application. Of course, in other embodiments, the blocking groove 700 may be a polygonal groove, such as a pentagonal groove, a hexagonal groove, etc., and the shape of the blocking groove 700 only needs to meet the requirement that the orthographic projection of the blocking groove 700 in the non-display region R2 surrounds or covers the circuit connecting region 1000, so as to realize the function that the organic functional film 500 around the circuit connecting region 1000 is blocked by the blocking groove 700, so as to effectively block external moisture from entering the circuit connecting region 1000 through the side edge of the organic functional film 500. It should be understood that the circuit trace in the via 400 is the overlapping portion of the first trace 210 and the second trace 310, and the blocking groove 700 effectively prevents the circuit trace in the via 400 from being broken, so that the safety performance and the service life of the whole display panel are improved.
It should be appreciated that the barrier groove 700 may be a full groove, as shown in fig. 5 and 7, in this embodiment, the shape of the barrier groove 700 covers the wire connection region 1000 entirely in the front projection of the non-display region R2; the barrier groove 700 may also be an annular groove, as shown in fig. 9 and 10, in which embodiment the shape of the barrier groove 700 surrounds the wire connection region 1000 in the orthographic projection of the non-display region R2.
Referring to fig. 7, in some alternative embodiments, the first portion 510 includes a first flat layer 511 and a first pixel defining layer 512, each of the first flat layer 511 and the first pixel defining layer 512 extends to the periphery of the barrier groove 700 from the display region R1, the first flat layer 511 covers a side of the second routing layer 300 facing away from the first routing layer 200, the first pixel defining layer 512 covers a side of the first flat layer 511 facing away from the second routing layer 300, and the package layer 600 covers a side of the first pixel defining layer 512 facing away from the first flat layer 511.
Specifically, referring to fig. 8, in the display panel provided by the embodiment of the application, the display panel 100 further includes a substrate 10, an anode (not shown in the figure), a cathode (not shown in the figure), a light emitting layer 30, and a TFT array layer 20 disposed on the substrate 10, wherein the first flat layer 511 covers a side of the TFT array layer 20 facing away from the substrate 10, the anode array is disposed on a side of the first flat layer 511 facing away from the substrate 10, the first pixel defining layer 512 is disposed on a side of the anode facing away from the substrate 10, the first pixel defining layer 512 is formed with pixel opening regions in array distribution, the light emitting layer 30 is correspondingly disposed in the pixel opening regions, and the cathode is disposed on a side of the light emitting layer 30 facing away from the substrate 10.
It should be understood that, in the display panel provided in the embodiment of the present application, the structure of the entire display panel is formed by sequentially stacking the substrate 10, the TFT array layer 20, the first planarization layer 511, the first pixel definition layer 512, and the encapsulation layer 600. The substrate 10 and the TFT array layer 20 constitute an array substrate of a display panel.
Wherein the substrate 10 is used to support and protect a film layer thereon, the substrate 10 may be a rigid substrate, for example, the substrate 10 may be made of glass, and of course, the substrate 10 may also be a flexible substrate, for example, the substrate 10 may be made of a material including one or more combinations of polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and polymer resin of cellulose acetate propionate. Here, the material of the substrate 10 is not limited.
The TFT array layer 20 has a plurality of pixel driving circuits distributed in an array, the pixel driving circuits are used to drive the light emitting layer 30 to emit light or not, and the pixel driving circuits include thin film transistors. Referring further to fig. 8, exemplarily, the TFT array layer 20 includes an active layer 21, a first interlayer insulating layer 22, a first conductor layer 23, a second interlayer insulating layer 24, a second conductor layer 25, a third interlayer insulating layer 26, and a third conductor layer 27, which are stacked, and a first planarization layer 511 covers a side of the third conductor layer 27 facing away from the substrate 10, the active layer 21 is used to form an active region of each thin film transistor, the first conductive layer is used to form a gate electrode of each thin film transistor, the first conductor layer 23 and the second conductor layer 25 together form a storage capacitor of the array substrate, and the third conductor layer 27 is used to form a source electrode and a drain electrode of each thin film transistor.
In this embodiment, the first planarization layer 511 is used for planarizing the third conductive layer 27 at the uppermost layer of the TFT array layer 20, and the first pixel defining layer 512 covers the side of the first planarization layer 511 facing away from the substrate 10, the anode array is disposed on the first planarization layer 511, the first pixel defining layer 512 is formed with pixel opening areas distributed in an array, the light emitting layer 30 is correspondingly disposed in the pixel opening areas, and the cathode is disposed on the light emitting layer 30. It should be understood that the first planarization layer 511 and the first pixel defining layer 512 are both made of an organic material, for example, the first planarization layer 511 may be made of one or more combinations of polyimide, polyethylene terephthalate, polycarbonate, polyethylene, or polyacrylate, and herein, the materials of the first planarization layer 511 and the first pixel defining layer 512 are not limited.
In order to reduce the thickness of the entire display panel and simplify the process of the entire display panel, the first wiring layer 200 may be disposed on the same layer as one of the conductive film layers in the TFT array layer 20, for example, the first wiring layer 200 is disposed on the same layer as one of the active layer 21, the first conductive layer 23, the second conductive layer 25, and the third conductive layer 27; similarly, the second wiring layer 300 and the insulating layer 800 may be disposed on the same layer as one of the film layers in the TFT array layer 20, and only the different layers of the first wiring layer 200, the insulating layer 800 and the second wiring layer 300 need to be satisfied, so as to achieve the effects of reducing the thickness of the entire display panel and simplifying the process of the entire display panel.
Specifically, referring to fig. 7 and 8, in the present embodiment, the first routing layer 200 is disposed in the same layer as the first conductor layer 23, the second routing layer 300 is disposed in the same layer as the second conductor, and the insulating layer is disposed in the same layer as the second interlayer insulating layer 24, so as to achieve the effects of reducing the thickness of the entire display panel and simplifying the process of the entire display panel.
In addition, it should be understood that, before the display panel of the embodiment of the present application is completely fabricated and formed, the first planarization layer 511 and the first pixel definition layer 512 are both single-layer organic film layers, and the first planarization layer 511 and the first pixel definition layer 512 are both stacked and covered in the whole display panel area, that is, extend from the display area R1 to the non-display area R2. Therefore, when the isolation trench 700 is designed, the first flat layer 511 and the first pixel defining layer 512 covered on the circuit connection region 1000 can be removed by patterning etching, and the removed areas corresponding to the first flat layer 511 and the first pixel defining layer 512 form a recess recessed toward the non-light-emitting side of the display panel, which is the isolation trench 700, so that the first flat layer 511 and the first pixel defining layer 512 extend from the display region R1 only to the periphery of the isolation trench 700, and the corresponding first flat layer 511 and first pixel defining layer 512 do not exist at the periphery of the first routing layer 200, the second routing layer 300 and the via 400 in the circuit connection region 1000, so that the path of water vapor penetrating into the circuit connection region 1000 through the first flat layer 511 and the first pixel defining layer 512 is directly cut off, and the circuit routing in the via 400 is prevented from being corroded by water vapor.
In addition, it should be noted that, considering that the insulating layer 800 disposed between the second wiring layer 300 and the first wiring layer 200 is generally made of an organic material, in order to avoid that moisture permeates from the side surface of the insulating layer 800 and flows into the first wiring layer 200, the second wiring layer 300 and the via 400 to corrode the corresponding connection circuit, referring to fig. 7, in this embodiment, the insulating layer 800 is not disposed in the circuit connection region 1000, the insulating layer 800 is not disposed in the isolation groove 700, and the insulating layer 800 extends from the edge of the step region 1000 to the peripheral edge of the isolation groove 700 to terminate, thereby cutting off the path of moisture permeating into the first wiring layer 200, the second wiring layer 300 and the via 400 through the insulating layer 800, and further avoiding that the circuit trace of the via 400 is corroded by moisture. Similarly, before the display panel is completely formed, the insulating layer 800 may be understood as an integral organic film layer covering the step area 2000, and it is obvious that the insulating layer 800 covers the line connection area 1000 at this time, so that when the design of the isolation trench 700 is performed, the first planarization layer 511 and the first pixel definition layer 512 on the line connection area 1000 are removed by a patterning etching process, and at the same time, the corresponding insulating layer 800 is removed, so that the insulating layer 800 extends from the edge of the step area 1000 to the peripheral edge of the isolation trench 700, that is, the isolation trench 700 is terminated, so that the path of water vapor penetrating the line connection area 1000 through the insulating layer 800 is cut off, and the water vapor is further prevented from penetrating into the via 400 to corrode the circuit trace in the via 400.
Referring to fig. 9 to 11, in some alternative embodiments, the organic functional film layer 500 further includes a second portion 520 disposed on the same layer as the first portion 510, the second portion 520 is located in the wire connection region 1000, the second portion 520 is disposed on a side of the second routing layer 300 facing away from the first routing layer 200, and the second portion 520 is spaced from the first portion 510 by a barrier groove 700, and the encapsulation layer 600 is disposed on a side of the second portion 520 facing away from the second routing layer 300.
It should be understood that, since the step area 2000 and the line connection area 1000 are both located in the non-display area R2 of the display panel, when the display panel is a curved screen or a curled screen, the step area 2000 and the line connection area 1000 are both bent with a small amplitude. And the flexibility of the organic material is better, so that the organic material is not easy to deform during bending.
Therefore, in order to ensure the bending performance of the step area 2000 and the wire connection area 1000, the second portion 520 of the organic functional film 500 is disposed in the wire connection area 1000, and the first portion 510 and the second portion 520 of the organic functional film 500 are separated by the blocking groove 700, so that the external moisture is cut off, and the first portion 510 of the organic functional film 500 permeates into the wire connection area 1000 to corrode the circuit trace in the via 400, and the second portion 520 made of the organic material also enhances the bending performance of the wire connection area 1000, and the second portion 520 plays a role in reinforcing and protecting the circuit trace and the insulating layer 800 in the wire connection area 1000, so that the circuit trace in the wire connection area 1000 is prevented from breaking and losing efficacy due to excessive stress during bending.
It should be noted that, in this embodiment, before the display panel is completely manufactured and formed, the organic functional film 500 may be understood as an integral organic film, where the integral organic functional film 500 is covered in the whole display panel area, that is, the display area R1 extends to the non-display area R2 and covers the line connection area 1000, when the isolation groove 700 is provided, a part of the area of the organic functional film 500 may be removed along the ring by patterning, the removed part area forms an annular groove distributed along the line connection area 1000, the annular groove is the partition groove 700, and the front projection of the non-display area R2 is around the line connection area 1000, and the partition groove 700 formed by the removed part of the organic functional film 500 may separate the original integral organic functional film 500 into the first part 510 located at the periphery of the line connection area 1000 and the second part 520 located inside the line connection area 1000.
In some alternative embodiments, the second portion 520 includes a second planarization layer 521 and a second pixel defining layer 522, where an outer end of the second planarization layer 521 and an outer end of the second pixel defining layer 522 extend to an end of the barrier trench 700 near the wire connection region 1000, the second planarization layer 521 covers a side of the second trace layer 300 facing away from the first trace layer 200, the second pixel defining layer 522 covers a side of the second planarization layer 521 facing away from the second trace layer 300, and the encapsulation layer 600 covers a side of the second pixel defining layer 522 facing away from the second planarization layer 521.
It should be understood that in a specific embodiment, the first planar layer 511 and the second planar layer 521 are disposed in the same layer, that is, it should be understood that the barrier groove 700 separates the planar layer, which is originally a unitary layer, into the first planar layer 511 located at the periphery of the wire connection region 1000 and the second planar layer 521 located inside the wire connection region 1000; similarly, the first pixel defining layer 512 and the second pixel defining layer 522 are disposed in the same layer, and it can be understood that the barrier groove 700 separates the pixel defining layer, which is an integral layer, into the first pixel defining layer 512 located at the periphery of the line connection area 1000 and the second pixel defining layer 522 located inside the line connection area 1000, and the barrier groove 700 may be formed by using a patterning etching process.
It should be understood that, in this embodiment of the present portion, by setting the blocking groove 700 as an annular groove, it is ensured that the first routing layer 200, the second routing layer 300 and the circuit connection area 1000 located in the step area 2000 are covered by corresponding organic functional film layers, so that not only is the external moisture cut off from entering the path in the via hole 400 of the circuit connection area 1000, but also the protection effect on the circuit routing in the step area 2000 can be ensured, and the bending resistance performance of the circuit routing in the whole step area 2000 is improved.
In addition, it should be noted that, referring to fig. 10, in the present embodiment, the insulating layer 800 includes an organic insulating layer 810 and an inorganic insulating layer 820 that are stacked, the inorganic insulating layer 820 extends from the 2000 edge of the step area into the line connection area, the inorganic insulating layer 820 covers a side of the first routing layer 200 close to the second routing layer 300, the organic insulating layer 810 covers a side of the inorganic insulating layer 820 opposite to the first routing layer 200, that is, the organic insulating layer 810 and the inorganic insulating layer 820 that are stacked are both disposed between the first routing layer 200 and the second routing layer 300, which all play a role of isolating the first routing layer 200 and the second routing layer 300, so as to ensure normal light emission of the display panel 100, and meanwhile, the organic insulating layer 810 further enhances the bending resistance of the first routing layer 200 and the second routing layer 300. Whereas considering that the organic insulating layer 810 disposed between the second wiring layer 300 and the first wiring layer 200 is also made of an organic material, in order to avoid water vapor from penetrating from the side of the organic insulating layer 810 and thus flowing into the first wiring layer 200, the second wiring layer 300, and the via 400 to corrode the corresponding connection circuits, in this embodiment, the barrier trench 700 also partitions the organic insulating layer 810 into a first segment of organic insulating layer 811 and a second segment of organic insulating layer 812, the first segment of organic insulating layer 811 is terminated from the edge of the step region 1000 to the peripheral edge of the barrier trench 700, and the segment of organic insulating layer 810 is located at the periphery of the barrier trench 700; the second segment of the organic insulating layer 812 is located in the circuit connection region 1000, and the same is said to be true, namely, the isolation trench 700 is formed by patterning etching process to separate the organic insulating layer 810, which is an integral layer, into the first segment of the organic insulating layer 811 located at the periphery of the circuit connection region 1000 and the second segment of the organic insulating layer 812 located inside the circuit connection region 1000.
It is to be understood that, in this embodiment, by setting the blocking groove 700 as an annular groove, it is further ensured that the first routing layer 200, the second routing layer 300 and the circuit connection area 1000 in the step area 2000 all have corresponding flat layers, pixel definition layers, insulating layers and other organic film layers, so that the external moisture is effectively cut off from invading the path in the via 400 of the circuit connection area 1000, the physical performance of the corresponding organic film layers is utilized to the greatest extent, the protection effect on the circuit routing in the step area 2000 is further enhanced, and the bending resistance of the circuit routing in the whole step area 2000 is further improved.
Referring again to fig. 5 to 11, in some alternative embodiments, the encapsulation layer 600 includes at least a first inorganic film layer 610, and the first inorganic film layer 610 covers the display region R1 and covers at least the wire connection region 1000 and the barrier groove 700 on the non-display region R2.
It should be understood that the inorganic material has a high water vapor barrier capability, and in this embodiment, the material of the first inorganic film layer 610 may be alumina, silica, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide or zinc oxide, or other inorganic materials known to those skilled in the art, which is not limited in particular. By covering the first inorganic film layer 610 on the circuit connection region 1000 and the blocking groove 700, the ability of the first inorganic film layer 610 to block water vapor is fully utilized, and the water vapor is further cut off from entering the circuit connection region 1000 from the surface and the side surface of the circuit connection region 1000 to corrode the circuit trace in the via 400. Meanwhile, the first inorganic film layer 610 covering the barrier groove 700 and the circuit connection region 1000 further enhances the function of the barrier groove 700 for blocking water vapor, so that the first wiring layer 200 and the second wiring layer 300 in the circuit connection region 1000 region can be completely covered by the first inorganic film layer 610 to effectively block water vapor, and circuit wirings in the first wiring layer 200 and the second wiring layer 300 are prevented from being broken due to oxidation corrosion of water vapor.
In some alternative embodiments, the encapsulation layer 600 further includes an organic protection layer 620, where the organic protection layer 620 covers a portion of the first inorganic film layer 610, and a vertical projection of the organic protection layer 620 in the non-display region R2 does not overlap with a vertical projection of the barrier groove 700 in the non-display region R2.
It should be understood that the organic protective layer 620 is made of an organic material, and the arrangement of the organic protective layer 620 can improve the structural stability of the whole packaging layer 600, and since the vertical projection of the organic protective layer 620 in the non-display region R2 and the vertical projection of the barrier groove 700 in the non-display region R2 do not overlap, the edge of the barrier groove 700 extending from the display region R1 to the non-display region R2 of the organic protective layer 620 is terminated, so that the protective function of the organic protective layer 620 is ensured, and meanwhile, the barrier effect of the barrier groove 700 to water vapor is prevented from being affected by extending or covering the organic protective layer 620 in the barrier groove 700.
In some alternative embodiments, the second trace layer 300 further includes a plurality of dummy wires 320, where the dummy wires 320 are alternately arranged side by side with the second trace 310, and the dummy wires 320 do not extend to the wire connection region 1000. It should be understood that the second wires 310 of the second wire layer 300 are etched by a patterning process, so that in order to ensure the uniformity of the processes of the plurality of second wires 310, a plurality of dummy wires 320 are formed in the second wire layer 300 by the simultaneous process, and the dummy wires 320 and the second wires 310 are alternately arranged side by side, the arrangement of the dummy wires 320 ensures the uniformity and the accuracy of the processes of the plurality of second wires 310, so that the spacing and the position of the plurality of second wires 310 on the second wire layer 300 satisfy the requirement of the process accuracy.
In some alternative embodiments, the first trace layer 200 and the second trace layer 300 are both metal trace layers. In addition, in order to reduce the thickness of the display panel and simplify the process of the first and second routing layers 200 and 300, when the TFT array layer 20 on the array substrate is manufactured, the TFT array layer 20 has multiple metal conductor layers, so that the first and second routing layers 200 and 300 can be manufactured on the same layer while the metal conductor layers are manufactured, the process of the first and second routing layers 200 and 300 is simplified, and the forming period of the whole display panel is shortened.
In some alternative embodiments, the via 400 has a plurality, and the first trace 210 is connected to the second trace 310 through the via 400 in a one-to-one correspondence.
In some alternative embodiments, the second inorganic film 900 is disposed on the side of the first wiring layer 200 facing away from the second wiring layer 300, and the second inorganic film 900 may cover the side of the first wiring layer 200 facing away from the second wiring layer 300, where the second inorganic film 900 is also disposed to isolate moisture, and the simultaneous disposition of the package layer 600 and the second inorganic film 900 achieves a dual protection effect on the first wiring layer 200 and the second wiring layer 300.
As an alternative implementation manner, the embodiment of the application further provides a display device, which includes the display panel provided by each embodiment. The display device can be any product or component with display function such as a mobile phone, a tablet computer, a notebook computer, a digital photo frame, a navigator and the like, and can be integrated with photosensitive components such as a camera and the like. Referring to fig. 12, in the present embodiment, the display device 5000 is a smart phone. The display device provided by the embodiment of the application comprises the display panel in any embodiment, so that the display device has the advantages of difficult disconnection, high safety and the like.
While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (14)
1. A display panel characterized by having a display area and a non-display area surrounding the display area, wherein the non-display area includes a step area and a line connection area disposed in the step area, and a shift register and a driving IC are further disposed in the non-display area, the display panel comprising:
the first wiring layer is arranged in the step area, a plurality of first wirings are arranged in the first wiring layer, and one end of each first wiring is connected with the driving IC;
the second wiring layer is arranged in the step area, an insulating layer is arranged between the second wiring layer and the first wiring layer, a plurality of second wirings are arranged in the second wiring layer, one ends of the second wirings are connected with the first wirings through holes in the circuit connection area, the other ends of the second wirings are connected with the shift register, and the driving IC sequentially provides control signals for the shift register through the first wirings and the second wirings;
the blocking grooves are arranged in the non-display area and annularly distributed around the circuit connection area, and orthographic projection of the blocking grooves in the non-display area surrounds or covers the circuit connection area;
the organic functional film layer at least comprises a first part, the first part extends from the display area to the periphery of the barrier groove, the first part is arranged on one side of the second wiring layer, which is opposite to the first wiring layer, and the barrier groove is not provided with the organic functional film layer;
the packaging layer is arranged on one side of the organic functional film layer, which is away from the second wiring layer.
2. The display panel of claim 1, wherein the barrier groove is a rectangular recess with a concave side of the barrier groove facing a back side of the display panel.
3. The display panel of claim 1, wherein the first portion includes a first planarization layer and a first pixel definition layer, each of the first planarization layer and the first pixel definition layer extends to a periphery of the barrier groove, the first planarization layer covers a side of the second wiring layer facing away from the first wiring layer, the first pixel definition layer covers a side of the first planarization layer facing away from the second wiring layer, and the encapsulation layer covers a side of the first pixel definition layer facing away from the first planarization layer.
4. A display panel according to claim 3, further comprising a substrate, an anode, a cathode, a light emitting layer and a TFT array layer arranged on the substrate, wherein the first flat layer covers a side of the TFT array layer facing away from the substrate, the anode array is arranged on the first flat layer, the first pixel defining layer is formed with pixel areas distributed in an array, the light emitting layer is correspondingly arranged in the pixel areas, and the cathode is arranged on the light emitting layer.
5. The display panel according to claim 1, wherein the organic functional film layer further comprises a second portion disposed on the same layer as the first portion, the second portion is disposed in the wiring connection region, the second portion is disposed on a side of the second wiring layer facing away from the first wiring layer, the second portion is spaced from the first portion by the barrier groove, and the encapsulation layer is disposed on a side of the second portion facing away from the second wiring layer.
6. The display panel of claim 5, wherein the second portion includes a second flat layer and a second pixel defining layer, an outer end of the second flat layer and an outer end of the second pixel defining layer each extending onto an end of the barrier groove adjacent to the wire connection region.
7. The display panel according to claim 6, wherein the second planarization layer covers a side of the second wiring layer facing away from the first wiring layer, the second pixel defining layer covers a side of the second planarization layer facing away from the second wiring layer, and the encapsulation layer covers a side of the second pixel defining layer facing away from the second planarization layer.
8. The display panel of claim 1, wherein the encapsulation layer comprises at least a first inorganic film layer covering the display region and covering at least the wire connection region and the barrier groove on the non-display region.
9. The display panel of claim 8, wherein the encapsulation layer further comprises an organic protective layer overlying a portion of the first inorganic film layer, a perpendicular projection of the organic protective layer at the non-display region not overlapping a perpendicular projection of the barrier groove at the non-display region.
10. The display panel of claim 1, further comprising a plurality of dummy lines within the second trace layer, the dummy lines alternating side-by-side with the second trace, the dummy lines not extending to the wire connection region.
11. The display panel of claim 1, wherein the first trace layer and the second trace layer are both metal trace layers.
12. The display panel of claim 1, wherein the plurality of vias is provided, and the first trace is connected to the second trace in a one-to-one correspondence through the via.
13. The display panel according to claim 1, wherein a second inorganic film layer is disposed on a side of the first wiring layer facing away from the second wiring layer.
14. A display device comprising the display panel according to any one of claims 1 to 13.
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