CN113808976A - Automatic eutectic machine of semiconductor chip - Google Patents
Automatic eutectic machine of semiconductor chip Download PDFInfo
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- CN113808976A CN113808976A CN202111384525.6A CN202111384525A CN113808976A CN 113808976 A CN113808976 A CN 113808976A CN 202111384525 A CN202111384525 A CN 202111384525A CN 113808976 A CN113808976 A CN 113808976A
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- eutectic
- chip
- driving
- manual alignment
- suction nozzle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
The application provides an automatic eutectic machine of semiconductor chip, its characterized in that, including eutectic device, guiding device, transfer device and at least one manual aligning device, guiding device includes at least one bootstrap system, at least one bootstrap system and at least one manual aligning device sets up relatively, manual aligning device is used for placing the material, and is corresponding it is right under bootstrap system's the guide the material counterpoints, the transfer device be used for with material on the manual aligning device shifts to on the eutectic device. The application provides an automatic eutectic machine of semiconductor chip can shorten the adjustment cycle of eutectic machine when switching production different specification models product, simplifies the process, improves production efficiency.
Description
Technical Field
The application belongs to the technical field of eutectic, and in particular relates to an automatic eutectic machine for semiconductor chips.
Background
In semiconductor chip packaging, there is a Chip On Chip (COC) process. In the process, automatic eutectic is realized by a full-automatic eutectic machine in the prior art. However, the existing full-automatic eutectic machine adopts automatic identification and positioning when performing an alignment process, different algorithms need to be switched when products of different specifications and models are switched and produced, and the position of a chip placing table needs to be matched again, the process is very complex, so that the debugging period of the existing full-automatic eutectic machine is long when the products of different specifications and models are switched and produced, especially when small batches of samples are produced, the debugging time needs to occupy at least 30-80 minutes, the actual sample making time only occupies 10-20 minutes, a large amount of time is used for debugging, and after the original products are replaced, the full-automatic eutectic machine needs to be reset again, a large amount of time is occupied again, and the working efficiency is seriously affected.
Disclosure of Invention
Therefore, the technical problem to be solved by the application is to provide an automatic eutectic machine for semiconductor chips, which can shorten the adjustment period of the eutectic machine when products of different specifications and models are switched to be produced, simplify the process and improve the production efficiency.
In order to solve the above problem, the present application provides an automatic eutectic machine for semiconductor chips, including eutectic device, guiding device, transfer device and at least one manual alignment device, the guiding device includes at least one guiding system, at least one guiding system and at least one manual alignment device set up relatively, manual alignment device is used for placing the material to align under the corresponding guiding system's guide the material, the transfer device is used for transferring the material on the manual alignment device to on the eutectic device.
Optionally, the automatic eutectic machine for semiconductor chips comprises a first manual alignment device and a second manual alignment device, the guide device comprises a first guide system and a second guide system, the first manual alignment device is arranged opposite to the first guide system, the second manual alignment device is arranged opposite to the second guide system, the material comprises a chip and a substrate, the first manual alignment device is used for placing the chip and aligning the chip, and the second manual alignment device is used for placing the substrate and aligning the substrate.
Optionally, the first guidance system includes a chip alignment camera and a chip alignment auxiliary camera, the chip alignment camera is configured to obtain an image of the chip on the first manual alignment device from a first position, and the chip alignment auxiliary camera is configured to obtain an image of the chip on the first manual alignment device from a second position;
the second guiding system comprises a substrate alignment camera and a substrate alignment auxiliary camera, the substrate alignment camera is used for acquiring the image of the substrate on the second manual alignment device from a third position, and the substrate alignment auxiliary camera is used for acquiring the image of the substrate on the second manual alignment device from a fourth position.
Optionally, the guiding device further includes a eutectic guiding system, and the eutectic guiding system includes a eutectic alignment camera and an auxiliary eutectic alignment camera, the eutectic alignment camera is configured to acquire an image of the chip and/or the substrate on the eutectic device from a fifth position, and the auxiliary eutectic alignment camera is configured to acquire an image of the chip and/or the substrate on the eutectic device from a sixth position.
Optionally, the transfer device includes a driving part and a material taking part, the material taking part is used for obtaining the material, the material taking part is connected with the driving part, and the driving part is used for driving the material taking part to move between the manual alignment device and the eutectic device.
Optionally, the driving part includes a driving frame, a first driving part and a second driving part, the second driving part is disposed on the first driving part, the material taking part is disposed on the second driving part, the first driving part is movably disposed on the driving frame and used for driving the second driving part to move between the manual alignment device and the eutectic device, and the second driving part is used for driving the material taking part to move in a direction towards or away from the manual alignment device or the eutectic device.
Optionally, the material taking part comprises a suction nozzle, the second driving part comprises a connecting frame, the connecting frame is located at the action end of the second driving part, the suction nozzle is arranged on the connecting frame in a sliding mode, a pressure piece is arranged on the connecting frame, and the pressure piece is connected with the suction nozzle so as to enable the suction nozzle to face the manual alignment device, and the material moves to the position where the material is inconsistent and forms a buffer.
Optionally, the material taking part comprises a suction nozzle, the second driving part comprises a connecting frame, the connecting frame is located at the action end of the second driving part, the suction nozzle is arranged on the connecting frame in a sliding mode, a pressure part is arranged on the connecting frame and connected with the suction nozzle, the transfer device transfers the material to be eutectic to the eutectic device, and then the second driving part drives the suction nozzle to press the material, so that the pressure part presses the material.
Optionally, the pressure piece includes a connection unit and an elastic unit, the connection unit is connected with the suction nozzle, the elastic unit is respectively connected with the link and the connection unit, so as to apply an elastic force towards the material to the suction nozzle when the suction nozzle slides on the link along a direction away from the material.
Optionally, the connection unit is arranged on one side, away from the material, of the connection frame and can move along with the suction nozzle, a first connection piece is arranged on the connection unit, a second connection piece is arranged on the outer wall of the second connection piece, the elastic unit comprises a spring, one end of the spring is connected with the first connection piece, the other end of the spring is connected with the second connection piece, and the extending direction of the spring is the same as the extending direction of the suction nozzle.
Optionally, a guide is arranged on one side of the connecting frame, which is far away from the material, at least a part of the connecting unit is slidably arranged in the guide, and the guide direction of the guide is the same as the sliding direction of the suction nozzle on the second driving member.
Optionally, the transfer device includes two driving parts and two material taking parts, the driving parts and the material taking parts are arranged in a one-to-one correspondence manner, the automatic semiconductor chip eutectic machine includes two manual alignment devices, the material taking parts and the manual alignment devices are arranged in a one-to-one correspondence manner, and the driving parts are used for driving the corresponding material taking parts to move between the eutectic device and the corresponding manual alignment devices.
Advantageous effects
The automatic eutectic machine for the semiconductor chips, provided by the embodiment of the invention, can shorten the adjustment period of the eutectic machine when products with different specifications and models are switched and produced, simplify the process and improve the production efficiency, and particularly avoids the complex and time-consuming debugging work in the prior art when samples are produced in small batches, thereby greatly improving the production efficiency. Wherein, through setting up guiding device and at least one manual aligning device, can realize accurate counterpoint under guiding device's guide, guarantee product quality.
Drawings
Fig. 1 is a schematic perspective view of an automatic eutectic machine for semiconductor chips according to an embodiment of the present application;
fig. 2 is a schematic perspective view of a guiding device according to an embodiment of the present application;
fig. 3 is a schematic perspective view of a transfer device according to an embodiment of the present application;
FIG. 4 is a perspective view of a second driving member and a suction nozzle according to an embodiment of the present application;
FIG. 5 is a schematic perspective view of a nozzle according to an embodiment of the present application;
fig. 6 is a schematic perspective view of a manual alignment device according to an embodiment of the present application;
fig. 7 is a schematic perspective view of an eutectic device according to an embodiment of the present application;
fig. 8 is a schematic perspective view of a temperature control box according to an embodiment of the present application.
The reference numerals are represented as:
1. an eutectic device; 2. a guide device; 21. a chip alignment camera; 22. a chip alignment auxiliary camera; 23. a substrate alignment camera; 24. a substrate alignment auxiliary camera; 25. an eutectic alignment camera; 26. an eutectic alignment auxiliary camera; 3. a transfer device; 31. a first driving member; 32. a second driving member; 321. a connecting frame; 33. a suction nozzle; 34. a pressure member; 341. a connection unit; 342. an elastic unit; 35. a guide member; 36. a driving frame; 41. a first manual alignment device; 42. a second manual alignment device; 5. a temperature control box.
Detailed Description
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Referring to fig. 1 to 8 in combination, according to an embodiment of the present application, an automatic eutectic machine for semiconductor chips includes an eutectic device 1, a guiding device 2, a transferring device 3, and at least one manual alignment device, wherein the guiding device 2 includes at least one guiding system, the at least one guiding system is disposed opposite to the at least one manual alignment device, the manual alignment device is used for placing materials and aligning the materials under the guidance of the corresponding guiding system, and the transferring device 3 is used for transferring the materials on the manual alignment device to the eutectic device 1. Through setting up eutectic device 1, guiding device 2, transfer device 3 and at least one manual aligning device, can shorten the adjustment cycle of eutectic machine when switching production different specification models product, simplify the process, improve production efficiency, especially when to small batch production sample, avoided among the prior art complicated and time-consuming debugging work, very big improvement production efficiency. Wherein, through setting up guiding device 2 and at least one manual aligning device, can realize accurate counterpoint under guiding device 2's guide, guarantee product quality.
Furthermore, the guiding device 2 can be a CCD vision module assembly, and the CCD vision module is matched with a manual alignment device to carry out alignment calibration, so that the requirement on corresponding precision can be completely met. The debugging difficulty of the CCD visual module assembly is far smaller than that of a full-automatic eutectic machine in the prior art, the calibration and adjustment can be quickly completed according to products of different specifications and models, and a large amount of time is saved.
Furthermore, CCD vision module subassembly includes camera and display, and the display is used for showing the image of counterpointing marking and material, and the operating personnel of being convenient for carries out accurate manual counterpoint.
Furthermore, the automatic semiconductor chip eutectic machine further comprises a host, wherein a software program is stored in the host, the software program can manually set eutectic time, the eutectic time can be correspondingly set according to different models of products, and a good eutectic effect is guaranteed. The semiconductor chip automatic eutectic machine also comprises a software running display used for displaying the software running condition.
In this embodiment, transfer device 3 includes two drive divisions and two material portions of getting, and the drive division sets up with getting the material portion one-to-one, and automatic eutectic machine of semiconductor chip includes two manual aligning device, gets material portion and manual aligning device one-to-one setting, and the drive division is used for driving the material portion of getting that corresponds and removes between eutectic device 1 and the manual aligning device that corresponds. Because during the eutectic, need at least one base plate and at least one chip, through setting up two drive division and two material portions of getting, can remove chip and base plate respectively to eutectic device 1 on, through setting up two manual aligning device, can aim at chip and base plate simultaneously, save operating time, through production efficiency.
Furthermore, two drive parts can have the same structure, two material taking parts can have the same structure, and two manual aligning devices can also have the same structure, have improved spare part's commonality.
In this embodiment, the semiconductor chip automatic eutectic machine includes two manual alignment devices, one of which is a first manual alignment device 41, the other is a second manual alignment device 42, the guiding device 2 includes two guiding systems, one of which is a first guiding system, the other is a second guiding system, the first manual alignment device 41 is disposed opposite to the first guiding system, the second manual alignment device 42 is disposed opposite to the second guiding system, the material includes a chip and a substrate, the first manual alignment device 41 is used for placing the chip and aligning the chip, and the second manual alignment device 42 is used for placing the substrate and aligning the substrate. Through setting up first manual aligning device 41 and the manual aligning device 42 of second, can satisfy and counterpoint chip and base plate, also can realize counterpointing simultaneously of chip and base plate simultaneously, shortened operating time, improved production efficiency. The first manual alignment device 41 and the first guide system are arranged correspondingly, and the second manual alignment device 42 and the second guide system are arranged correspondingly, so that the chips and the substrates can be well aligned, and the product quality is guaranteed.
Further, the first manual alignment device 41 and the second manual alignment device 42 are both manual alignment stages.
Further, chip and base plate are placed on manual counterpoint platform when counterpointing, and manual counterpoint platform is provided with the handle, realizes that the mesa of manual counterpoint platform finely tunes in X and Y direction through the handle. The preset positions of the chip and the substrate are superposed with the marked lines, and then the chip and the substrate are driven to be aligned.
Furthermore, the base of the manual alignment device is made of SUS304 stainless steel, so that the manual alignment device is heavy in weight, cannot slide greatly during movement and calibration, and cannot shake after moving in place.
In another embodiment, the semiconductor chip automatic eutectic machine may include not only the first manual alignment device 41 and the second manual alignment device 42, but also a third manual alignment device. Also, the guide device 2 may include not only the first guide system and the second guide system but also a third guide system. The number of corresponding driving portions is also three. The manual alignment devices are arranged in one-to-one correspondence with the guide systems, so that each manual alignment device can be guided by the guide system when being aligned, and the product quality is guaranteed.
The first guiding system comprises a chip alignment camera 21 and a chip alignment auxiliary camera 22, the chip alignment camera 21 is used for acquiring an image of a chip on the first manual alignment device 41 from a first position, and the chip alignment auxiliary camera 22 is used for acquiring an image of the chip on the first manual alignment device 41 from a second position; the second guiding system comprises a substrate alignment camera 23 and a substrate alignment auxiliary camera 24, the substrate alignment camera 23 is used for acquiring the image of the substrate on the second manual alignment device 42 from the third position, and the substrate alignment auxiliary camera 24 is used for acquiring the image of the substrate on the second manual alignment device 42 from the fourth position. Through setting up chip counterpoint camera 21 and chip counterpoint auxiliary camera 22 and base plate counterpoint camera 23 and base plate counterpoint auxiliary camera 24, can further realize the alignment position fast when guaranteeing the accuracy of chip and base plate counterpoint, avoided duplicate debugging machine again. The arrangement of the chip alignment auxiliary camera 22 and the substrate alignment auxiliary camera 24 can facilitate the operation of the operator, and reduce the difficulty of the operation.
Further, in this embodiment, the chip alignment camera 21 shoots the chip on the first manual alignment device 41 from the first position, the chip alignment auxiliary camera 22 shoots the chip on the first manual alignment device 41 from the second position, and the shooting angles of the chip alignment camera 21 and the chip alignment auxiliary camera 22 are different, that is, the shooting angles are respectively two, so that the alignment accuracy is further improved. The first position is above the first manual alignment device 41, the second position is obliquely above the first manual alignment device 41, that is, the chip alignment camera 21 is located above the first manual alignment device 41, and the chip alignment camera 21 shoots downward. The chip alignment auxiliary camera 22 is located obliquely above the first manual alignment device 41, and the chip alignment auxiliary camera 22 photographs obliquely downward, and the position of the chip is viewed from the side, thereby improving the efficiency of manual alignment.
Further, in the present embodiment, the substrate alignment camera 23 photographs the substrate on the second manual alignment device 42 from the third position, the substrate alignment auxiliary camera 24 photographs the substrate on the second manual alignment device 42 from the fourth position, and the substrate alignment camera 23 and the substrate alignment auxiliary camera 24 have different photographing angles, that is, photograph from two angles, respectively, thereby further improving the alignment accuracy. The third position is above the second manual alignment device 42, the fourth position is obliquely above the second manual alignment device 42, that is, the substrate alignment camera 23 is located above the second manual alignment device 42, and the substrate alignment camera 23 takes an image downward. The substrate alignment auxiliary camera 24 is positioned obliquely above the second manual alignment device 42, and the substrate alignment auxiliary camera 24 takes an image obliquely downward, and the position of the substrate is viewed from the side, thereby improving the efficiency of manual alignment.
The guiding device 2 further comprises a eutectic guiding system, which comprises a eutectic alignment camera 25 and an auxiliary eutectic alignment camera 26, wherein the eutectic alignment camera 25 is used for acquiring the image of the chip and/or the substrate on the eutectic device 1 from the fifth position, and the auxiliary eutectic alignment camera 26 is used for acquiring the image of the chip and/or the substrate on the eutectic device 1 from the sixth position. Through setting up eutectic bootstrap system, accurate counterpoint when can further guaranteeing the eutectic.
Furthermore, a manual alignment table is arranged on the eutectic device 1, and the eutectic position is adjusted through the cooperation of the manual alignment table and the eutectic guide system, so that the position can be adjusted at any time according to the precision requirement.
Further, in this embodiment, the eutectic alignment camera 25 photographs the chip and the substrate on the eutectic device 1 from the fifth position, the eutectic alignment auxiliary camera 26 photographs the chip and the substrate on the eutectic device 1 from the sixth position, and the eutectic alignment camera 25 and the eutectic alignment auxiliary camera 26 have different photographing angles, that is, photograph from two angles, so as to further improve the alignment accuracy. The fifth position is above the eutectic device 1, and the sixth position is obliquely above the eutectic device 1, that is, the eutectic alignment camera 25 is located above the eutectic device 1, and the eutectic alignment camera 25 shoots downward. The eutectic alignment auxiliary camera 26 is located obliquely above the eutectic device 1, and the eutectic alignment auxiliary camera 26 takes an image obliquely downward, and the positions of the chip and the substrate are observed from the side, thereby improving the efficiency of manual alignment.
Further, the eutectic device 1 is heated by a thermocouple, and a temperature sensor is arranged on the eutectic device 1 to monitor temperature change.
Furthermore, a nitrogen gas inlet is arranged on the eutectic device 1 to form a nitrogen gas working environment, the nitrogen gas is blown up to cool, and a tin layer on the surface of the hot layer is oxidized when the eutectic device is placed for heating.
Furthermore, a vacuum suction hole is formed in the working surface of the eutectic device 1, and when the eutectic device works, the bottom surface of the substrate is sucked in a vacuum mode, so that the substrate and the chip are guaranteed to be immobile.
Further, the eutectic device 1 changes anchor clamps and can realize the semi-automatic paster operation of TO, avoids the complicated debugging work among the prior art, can realize the semi-automatic paster of TO and the semi-automatic eutectic fast switch of COC.
Further, eutectic device 1 is connected with temperature control box 5, is provided with temperature controller, shift knob and nitrogen gas flowmeter on the temperature control box 5. The temperature controller displays the temperature of the hot platform in real time, and the heating temperature of the hot platform can be manually adjusted. The flow rate of nitrogen can be manually adjusted according to the nitrogen flowmeter, and the flow rate of cooling nitrogen is controlled so as to control the temperature. The switch buttons comprise an emergency stop button, a power supply button and a stop button, and are convenient to control.
Further, guiding device 2 still includes the frame, and the frame setting is in eutectic device 1 and manual aligning device's top, and chip counterpoint camera 21, chip counterpoint auxiliary camera 22, base plate counterpoint camera 23, base plate counterpoint auxiliary camera 24, eutectic counterpoint camera 25 and eutectic counterpoint auxiliary camera 26 all connect in the frame. All be connected through the manual displacement platform of fine setting between each camera and the frame, can realize adjusting the focus, guarantee the quality of appearing, and then improve the accuracy that corresponds.
Furthermore, each camera is a CCD high-pixel camera, and a high-power telecentric lens is configured, so that imaging is clear. Meanwhile, the camera is also provided with a point light source and an annular light source to improve the image quality.
Further, the first manual alignment device 41, the eutectic device 1, and the second manual alignment device 42 are arranged in a straight line. The chip alignment camera 21, the eutectic alignment camera 25, and the substrate alignment camera 23 are arranged in a straight line. The chip auxiliary alignment cameras, the eutectic auxiliary alignment cameras and the substrate auxiliary alignment cameras are arranged in a straight line.
Transfer device 3 includes drive division and gets material portion, gets material portion and is used for acquireing the material, gets material portion and is connected with drive division, and drive division is used for driving and gets material portion and remove between manual aligning device and the eutectic device 1. Through setting up drive division and getting the material portion, can realize that automatic drive chip and basically remove between manual aligning device and eutectic device 1, get the stability of material and the accuracy of eutectic.
Further, chip and base plate setting are at manual aligning device's top, the drive division can follow vertical direction and drive the material portion of getting and move down, with chip and the base plate that acquires manual aligning device top, then drive the material portion of getting and rise to preset the height, it moves to eutectic device 1 directly over along the horizontal direction to drive the material portion of getting again, then move down along vertical direction again, place chip and base plate at eutectic device 1's top, the eutectic is accomplished the back, the drive division drives the material portion of getting and acquires the product after the eutectic is accomplished, place the product in the appointed area. Further, the eutectic finished product may be placed back on the second manual alignment device 42.
Further, the manual alignment device and the eutectic device 1 include a manual alignment device and the eutectic device 1 itself. Of course, the driving part can also drive the material taking part to other positions, but the driving part is irrelevant to the normally performed eutectic operation.
The driving part comprises a driving frame 36, a first driving part 31 and a second driving part 32, the second driving part 32 is arranged on the first driving part 31, the material taking part is arranged on the second driving part 32, the first driving part 31 is movably arranged on the driving frame 36 and used for driving the second driving part 32 to move between the manual alignment device and the eutectic device 1, and the second driving part 32 is used for driving the material taking part to move along the direction towards or away from the manual alignment device or the eutectic device 1. Through setting up the drive frame 36, provide the route for the removal of first driving piece 31, guarantee that first driving piece 31 can stably remove, guarantee first driving piece 31 and second driving piece 32, realized getting the removal of material portion at horizontal direction and vertical direction, and then drive chip, base plate and product and remove.
Further, in the present embodiment, the driving frame 36 is a horizontally disposed guide rail, and the direction in which the driving frame 36 is disposed is the same as the arrangement direction of the first manual alignment device 41, the eutectic device 1, and the second manual alignment device 42. For example, the first manual alignment device 41, the eutectic device 1, and the second manual alignment device 42 are arranged in a straight line in the left-right direction in this order, and the driving frame 36 is provided to extend in the left-right direction.
Further, the first driving member 31 is a mover high-precision linear motor, so that the position precision of the chip and the substrate is ensured, the precision of eutectic crystals is further ensured, and meanwhile, the first driving member 31 can be ensured to have higher moving speed.
Further, the second driving member 32 is fixedly connected to the first driving member 31 by a connecting member.
Further, the first driving member 31 and the material taking section are located on the side of the second driving member 32 close to the first manual alignment device 41, the eutectic device 1, and the second manual alignment device 42.
The material taking part comprises a suction nozzle 33, the second driving part 32 comprises a connecting frame 321, the connecting frame 321 is located at the action end of the second driving part 32, the suction nozzle 33 is arranged on the connecting frame 321 in a sliding mode, a pressure piece 34 is arranged on the connecting frame 321, and the pressure piece 34 is connected with the suction nozzle 33 so as to form buffering when the suction nozzle 33 moves towards the material on the manual alignment device to be abutted against the material. After the transferring device 3 transfers the material to be eutectic to the eutectic device 1, the second driving member 32 drives the suction nozzle 33 to press the material, so as to apply pressure to the material through the pressure member 34. By arranging the suction nozzle 33, the chips, the substrates and the products can be stably obtained, and the chips, the substrates and the products are not easily damaged. By providing the pressure member 34, it is possible to prevent the suction nozzle 33 from being damaged when it collides with the chip, the substrate, and the product. By arranging the pressure piece 34, downward pressure can be provided when the chip and the substrate are eutectic, and a good eutectic effect is ensured.
Further, the suction nozzle 33 is communicated with the vacuum air path, and the chip, the substrate and the product are obtained in a vacuum adsorption mode, so that the chip, the substrate and the product are further prevented from being damaged.
Further, by providing the connection frame 321, a firm mounting position is provided for the suction nozzle 33 and the pressure member 34, so that the suction nozzle 33 can slide stably.
Further, by arranging the pressure piece 34, when the suction nozzle 33 moves downwards to collide with the material to enable the suction nozzle 33 to slide upwards, a downward force is provided for the suction nozzle 33 to form a buffer, so that the suction nozzle 33 is prevented from directly and rigidly colliding with the chip, the substrate and the product, and meanwhile, the suction nozzle 33 can be prevented from sliding upwards all the time, and the chip, the substrate and the product cannot be obtained.
Further, by arranging the pressure piece 34, stable and appropriate downward pressure is applied to the chip during eutectic, and eutectic effect between the chip and the substrate is ensured.
Specifically, during eutectic crystallization, the chip is stacked above the substrate, and the suction nozzle 33 is pressed down by the pressure member 34, so that the suction nozzle 33 is pressed above the chip, and the chip and the substrate are pressed with proper pressure.
Further, the suction nozzle 33 can be a plurality of different types, for example, the diameters of the suction nozzles 33 of different types are different, and the suction nozzle 33 of the corresponding type can be selected according to the property and the size of the material.
Further, the second driving member 32 is a high-precision motor, and the suction nozzle 33 is driven by the high-precision motor to move accurately and stably in the vertical direction.
Further, a slide way is arranged on the connecting frame 321, and the suction nozzle 33 is slidably arranged in the slide way. The sliding limits the suction nozzle 33 and limits the suction nozzle 33 to slide only in the vertical direction.
The pressure member 34 includes a connection unit 341 and an elastic unit 342, the connection unit 341 is connected with the suction nozzle 33, and the elastic unit 342 is connected with the connection holder 321 and the connection unit 341, respectively, to apply an elastic force toward the material to the suction nozzle 33 when the suction nozzle 33 slides on the connection holder 321 in a direction away from the material. By providing the connection unit 341, it is ensured that the elastic unit 342 can accurately apply the elastic force to the suction nozzle 33.
Further, the connection unit 341 is fixedly connected to the outer wall of the suction nozzle 33, so that when the suction nozzle 33 slides upwards in the slide, the connection unit 341 can be driven to move upwards synchronously, and the elastic unit 342 is driven to stretch, so as to apply an elastic force downwards.
The connecting unit 341 is disposed on one side of the connecting frame 321 far away from the material and can move along with the suction nozzle 33, the connecting unit 341 is provided with a first connecting piece, the outer wall of the second driving piece 32 is provided with a second connecting piece, the elastic unit 342 comprises a spring, one end of the spring is connected with the first connecting piece, the other end of the spring is connected with the second connecting piece, and the extending direction of the spring is the same as the extending direction of the suction nozzle 33. By providing the first and second connecting members, a stable connecting position is provided for the elastic unit 342 unit. Through setting up the spring, can provide elastic force simultaneously, can select the spring of appropriate elastic coefficient according to the size of required downforce to provide suitable downforce when guaranteeing the eutectic. The extension direction of the spring is set to be the same as the extension of the suction nozzle 33, so that the elastic force of the spring is effectively applied to the suction nozzle 33, unnecessary loss is avoided, and abrasion can be avoided.
Further, the connection unit 341 is disposed on the top of the connection frame 321, and can move up and down along with the suction nozzle 33, and when the connection unit 341 moves to completely abut against the top of the connection frame 321, the connection unit 33 can be limited, so as to prevent the suction nozzle 33 from continuously sliding downwards.
Further, the suction nozzle 33 is disposed on a side of the connection frame 321 close to the operator for easy observation and operation. The elastic unit 342 is disposed on the left or right sidewall of the connecting frame 321 to avoid interference.
Furthermore, the first connecting piece and the second connecting piece are arranged on the same side edge of the mounting frame and are perpendicular to the side wall. Specifically, the first connecting piece and the second connecting piece are horizontally arranged.
Further, the suction nozzle 33 is vertically disposed, and the spring is also vertically disposed.
Further, the top of link 321 is provided with the spacing groove, and when linkage unit 341 completely contradicts at the top of link 321, linkage unit 341 is located the spacing inslot, and the spacing groove forms spacingly to linkage unit 341 on the horizontal direction, avoids when link 321 removes about, and linkage unit 341 deviates from the top outer wall of link 321.
The side of the connecting frame 321 away from the material is provided with a guide 35, at least a part of the connecting unit 341 is slidably arranged in the guide 35, and the guide direction of the guide 35 is the same as the sliding direction of the suction nozzle 33 on the second driving member 32. By providing the guide 35, a guiding function can be provided when the connection unit 341 moves up and down along with the suction nozzle 33, preventing the connection unit 341 from coming off.
Further, a guide groove is formed in the guide 35, and one end of the connection unit 341, which is far away from the suction nozzle 33, is slidably disposed in the guide groove, and the guide groove extends in a vertical direction to limit that one end of the connection unit 341, which is far away from the suction nozzle 33, can only slide in the vertical direction.
Further, one end of the connection unit 341 is fixedly connected to the suction nozzle 33, and the other end is limited in the guide groove, so that the guide 35 can only slide in the vertical direction.
In operation, the chip is manually placed on one slide, the substrate is manually placed on the other slide, the slide with the chip is manually placed on the first manual alignment device 41, and the slide with the substrate is manually placed on the second manual alignment device 42. Then, according to the monitoring and guiding of the first guiding system and the second guiding system, the chip and the substrate on the glass slide are placed to the position meeting the precision through the manual alignment device, then the working button is pressed down, the suction nozzle 33 starts to move the chip and the substrate to the eutectic platform, the eutectic is completed within the process time according to the set program steps, and after the eutectic is completed, the product is sucked by the suction nozzle 33 and placed back on the glass slide of the substrate, so that the operation is completed.
The automatic eutectic machine for the semiconductor chips, provided by the embodiment of the invention, can shorten the adjustment period of the eutectic machine when products with different specifications and models are switched and produced, simplify the process and improve the production efficiency, and particularly avoids the complex and time-consuming debugging work in the prior art when samples are produced in small batches, thereby greatly improving the production efficiency. Wherein, through setting up guiding device 2 and at least one manual aligning device, can realize accurate counterpoint under guiding device 2's guide, guarantee product quality.
It is readily understood by a person skilled in the art that the advantageous ways described above can be freely combined, superimposed without conflict.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed. The foregoing is only a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present application, and these modifications and variations should also be considered as the protection scope of the present application.
Claims (12)
1. The automatic eutectic machine for the semiconductor chips is characterized by comprising an eutectic device (1), a guide device (2), a transfer device (3) and at least one manual alignment device, wherein the guide device (2) comprises at least one guide system, the at least one guide system and the at least one manual alignment device are arranged oppositely, the manual alignment device is used for placing materials and aligning the materials under the guide of the corresponding guide system, and the transfer device (3) is used for transferring the materials on the manual alignment device to the eutectic device (1).
2. The automatic semiconductor chip eutectic machine according to claim 1, characterized in that the automatic semiconductor chip eutectic machine comprises a first manual alignment device (41) and a second manual alignment device (42), the guiding device (2) comprises a first guiding system and a second guiding system, the first manual alignment device (41) is disposed opposite to the first guiding system, the second manual alignment device (42) is disposed opposite to the second guiding system, the material comprises a chip and a substrate, the first manual alignment device (41) is used for placing the chip and aligning the chip, and the second manual alignment device (42) is used for placing the substrate and aligning the substrate.
3. The semiconductor chip automatic eutectic machine of claim 2, wherein said first guiding system comprises a chip alignment camera (21) and a chip alignment auxiliary camera (22), said chip alignment camera (21) is used for obtaining an image of said chip on said first manual alignment device (41) from a first position, said chip alignment auxiliary camera (22) is used for obtaining an image of said chip on said first manual alignment device (41) from a second position;
the second guiding system comprises a substrate alignment camera (23) and a substrate alignment auxiliary camera (24), the substrate alignment camera (23) is used for obtaining the image of the substrate on the second manual alignment device (42) from a third position, and the substrate alignment auxiliary camera (24) is used for obtaining the image of the substrate on the second manual alignment device (42) from a fourth position.
4. The semiconductor chip automatic eutectic machine of claim 3, characterized in that said guiding device (2) further comprises a eutectic guiding system comprising a eutectic alignment camera (25) and a eutectic alignment auxiliary camera (26), said eutectic alignment camera (25) being adapted to acquire images of said chip and/or said substrate on said eutectic device (1) from a fifth position, said eutectic alignment auxiliary camera (26) being adapted to acquire images of said chip and/or said substrate on said eutectic device (1) from a sixth position.
5. The automatic eutectic machine of semiconductor chip of claim 1, characterized in that said transfer device (3) comprises a driving part and a material taking part, said material taking part is used for taking said material, said material taking part is connected with said driving part, said driving part is used for driving said material taking part to move between said manual alignment device and said eutectic device (1).
6. The automatic eutectic machine of semiconductor chip of claim 5, characterized in that said driving part comprises a driving rack (36), a first driving member (31) and a second driving member (32), said second driving member (32) is disposed on said first driving member (31), said material taking part is disposed on said second driving member (32), said first driving member (31) is movably disposed on said driving rack (36) for driving said second driving member (32) to move between said manual alignment device and said eutectic device (1), said second driving member (32) is for driving said material taking part to move in a direction towards or away from said manual alignment device or said eutectic device (1).
7. The automatic eutectic machine of semiconductor chip of claim 6, characterized in that the material taking part comprises a suction nozzle (33), the second driving member (32) comprises a connecting frame (321), the connecting frame (321) is located at the action end of the second driving member (32), the suction nozzle (33) is slidably arranged on the connecting frame (321), a pressure member (34) is arranged on the connecting frame (321), and the pressure member (34) is connected with the suction nozzle (33) to form a buffer when the suction nozzle (33) moves to be against the material toward the material on the manual alignment device.
8. The automatic eutectic machine of semiconductor chip of claim 6, characterized in that the material taking part comprises a suction nozzle (33), the second driving member (32) comprises a connecting frame (321), the connecting frame (321) is located at the action end of the second driving member (32), the suction nozzle (33) is slidably arranged on the connecting frame (321), a pressure member (34) is arranged on the connecting frame (321), the pressure member (34) is connected with the suction nozzle (33), and after the transfer device (3) transfers the material to be eutectic to the eutectic device (1), the second driving member (32) drives the suction nozzle (33) to press on the material so as to press the material through the pressure member (34).
9. The semiconductor chip automatic eutectic machine of claim 7 or 8, characterized in that the pressure member (34) comprises a connection unit (341) and an elastic unit (342), the connection unit (341) is connected with the suction nozzle (33), and the elastic unit (342) is respectively connected with the connection rack (321) and the connection unit (341) to apply an elastic force toward the material to the suction nozzle (33) when the suction nozzle (33) slides on the connection rack (321) in a direction away from the material.
10. The semiconductor chip automatic eutectic machine of claim 9, wherein the connection unit (341) is disposed on a side of the connection rack (321) away from the material and is movable with the suction nozzle (33), a first connection member is disposed on the connection unit (341), a second connection member is disposed on an outer wall of the second driving member (32), the elastic unit (342) comprises a spring, one end of the spring is connected with the first connection member, the other end of the spring is connected with the second connection member, and an extending direction of the spring is the same as an extending direction of the suction nozzle (33).
11. The semiconductor chip auto-eutectic machine of claim 9, wherein a guide (35) is provided on a side of the connection rack (321) away from the material, at least a portion of the connection unit (341) is slidably disposed in the guide (35), and a guiding direction of the guide (35) is the same as a sliding direction of the suction nozzle (33) on the second driving member (32).
12. The automatic semiconductor chip eutectic machine of claim 5, wherein the transfer device (3) comprises two driving parts and two material taking parts, the driving parts and the material taking parts are arranged in a one-to-one correspondence manner, the automatic semiconductor chip eutectic machine comprises two manual alignment devices, the material taking parts and the manual alignment devices are arranged in a one-to-one correspondence manner, and the driving parts are used for driving the corresponding material taking parts to move between the eutectic device (1) and the corresponding manual alignment devices.
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| CN202111384525.6A CN113808976B (en) | 2021-11-22 | 2021-11-22 | Automatic eutectic machine of semiconductor chip |
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| CN113808976B (en) | 2022-03-01 |
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