CN113805726A - Touch screen and manufacturing method thereof - Google Patents
Touch screen and manufacturing method thereof Download PDFInfo
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- CN113805726A CN113805726A CN202111020000.4A CN202111020000A CN113805726A CN 113805726 A CN113805726 A CN 113805726A CN 202111020000 A CN202111020000 A CN 202111020000A CN 113805726 A CN113805726 A CN 113805726A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a touch screen and a manufacturing method thereof, wherein the touch screen with a single-layer structure comprises a glass cover plate and an electrode array solidified on the binding surface of the glass cover plate through an adhesive layer, the electrode array comprises a conductive RX (receiver) line and a conductive TX (TX) line, and the projections of the RX line and the TX line in the vertical direction are in a net shape. The method for manufacturing the touch screen with the single-layer structure comprises the steps of cover plate surface treatment, manufacturing of an RX circuit die and a TX circuit die, transferring of the RX circuit structure, transferring of a conductive RX circuit, transferring of a TX circuit structure and transferring of a conductive TX circuit. The manufacturing method of the touch screen is simpler in processing technology and saves manufacturing cost.
Description
Technical Field
The invention relates to the technical field of touch screens, in particular to a touch screen and a manufacturing method thereof.
Background
The existing Touch screen adopts a GFF structure, and is a Touch screen (TP) with a five-layer structure formed by bonding a Glass cover plate (Glass) and two layers of soft material films (films) through two layers of Optical Cement (OCA), wherein a receiving signal layer (RX) and a transmitting signal layer (TX) of two layers of conducting circuits are respectively engraved on the two layers of soft material films (films) to respectively form an RX Film layer and a TX Film layer. As shown in fig. 1, the GFF five-layer structure is specifically divided into: the first layer is a Glass layer 91, the second layer is an OCA layer 92, the third layer is an RX Film layer 93, the fourth layer is an OCA layer 94, and the fifth layer is a TX Film layer 95, wherein the first layer and the third layer, and the third layer and the fifth layer are separated from each other and must be bonded together by optical glue of the second layer and the fourth layer. The RX Film layer and the TX Film layer are usually manufactured by using a Film material as a carrier, coating a UV glue on the Film carrier, and then respectively etching the RX line and the TX line into the UV glue to form an integral body with the Film. The existing five-layer GFF structural material has the disadvantages of more layers, more complex production process and higher manufacturing cost.
Disclosure of Invention
The invention provides a touch screen which only has a glass cover plate and a carrier, directly transfers a conductive RX circuit and a conductive TX circuit into an adhesive layer in a curing manner of the adhesive layer, and cures the adhesive layer and the glass cover plate into a single-layer structure.
The technical scheme includes that the touch screen with the following structure comprises a glass cover plate and an electrode array solidified on a binding surface of the glass cover plate through an adhesive layer, wherein the electrode array comprises a conductive RX line and a conductive TX line, and projections of the RX line and the TX line in the vertical direction are in a net shape and are not mutually conducted. Specifically, the glue film includes first glue film and second glue film, and the solidification of first glue film is on the binding face of glass apron, and the adversion has the RX circuit in the first glue film, and the solidification of second glue film is on first glue film and cover the RX circuit, and the adversion has the TX circuit in the second glue film. The first adhesive layer and the second adhesive layer are both UV adhesive layers. The effect of UV glue film lies in: providing structural support for RX line and TX line transfers; meanwhile, the RX circuit, the TX circuit and the glass cover plate form an integral single-layer structure through glue layer curing.
Compared with the prior art, the invention has the advantages that: the five-layer structure of the traditional touch screen is changed into a single-layer structure formed by only one cover plate and one carrier through the way of line transfer printing and glue layer curing, so that the product structure is greatly simplified, the material is saved, the product thickness is reduced, the product is attractive and has the advantage of being ultrathin.
Another technical problem to be solved by the present invention is to provide a method for manufacturing a touch panel with a single-layer structure, which includes the following steps:
s1, surface treatment of the glass cover plate: carrying out illumination treatment on the glass cover plate, and then coating a first adhesive layer on the binding surface of the glass cover plate;
s2, manufacturing an RX circuit die and a TX circuit die: respectively manufacturing an RX circuit mould and a TX circuit mould according to the designed RX circuit structure and TX circuit structure;
s3, transfer RX line structure: after the first adhesive layer is coated on the binding surface of the glass cover plate, gullies are pressed on the first adhesive layer through an RX circuit mould, namely, an RX circuit structure is transferred to the first adhesive layer; the first adhesive layer is cured through exposure of a UV machine, and forms an integral structure with the glass cover plate;
s4, transfer of conductive RX lines: after the RX circuit structure is transferred on the first adhesive layer, filling conductive paste in the gullies with the RX circuit structure, baking to solidify the conductive paste in the gullies, namely transferring the conductive RX circuit in the first adhesive layer;
s5, transfer TX line structure: after the conductive RX circuit is transferred on the glass cover plate, coating a second adhesive layer on the cured first adhesive layer, and enabling the second adhesive layer to cover the conductive RX circuit; after gluing, pressing gullies on the second adhesive layer through a TX circuit die, namely transferring a TX circuit structure onto the second adhesive layer; the second adhesive layer is cured through exposure of a UV machine and forms an integral structure with the first adhesive layer;
s6, transfer of conductive TX lines: after the TX circuit structure is transferred on the second adhesive layer, conductive paste is filled in the trenches having the TX circuit structure, and baking is performed to solidify the conductive paste in the trenches, so that the conductive TX circuit is transferred in the second adhesive layer.
In step S1, the step of irradiating the glass cover plate with light means: irradiating the surface of the glass cover plate by using ultraviolet light with the wave band of 150 nm-180 nm for 20 s;
in step S1, the step of coating the first adhesive layer on the glass cover bonding surface includes: and placing the glass cover plate subjected to illumination treatment on a jig, and coating a first layer of UV glue on the binding surface of the glass cover plate to ensure that the UV glue is coated in the binding surface of the glass cover plate, wherein the coating thickness is 6-20 microns.
In step S2, the step of manufacturing the RX circuit mold according to the designed RX circuit structure specifically includes the following steps:
a1, designing an RX (receiver/transmitter) line structure according to the number of line channels required by a product, and manufacturing a film with the RX line structure according to the designed RX line structure;
a2, coating a dry film on a smooth PET substrate, wherein no air bubbles exist after the dry film is coated with the film, and covering a film with an RX circuit structure on the dry film; placing the film and the dry film on an exposure machine, and vacuumizing to ensure that the distance between the film and the dry film approaches 0; carrying out exposure after vacuum absorption, wherein the exposure energy is 1000 mj-1500 mj;
a3, after exposure, developing by using a developing solution with the concentration of 0.7 +/-0.2 mol/L; after developing, etching by using an etching solution with the concentration of 6.5 +/-0.2 mol/L, and then washing and air-drying to manufacture an RX circuit die;
a4, exposing the manufactured RX circuit die in a UV machine, wherein the exposure energy is 3000 mj-5000 mj;
in step S2, the step of manufacturing the TX circuit mold according to the designed TX circuit structure specifically includes the following steps:
b1, designing a TX circuit structure according to the number of circuit channels of the product requirement, and manufacturing a film with the TX circuit structure according to the designed TX circuit structure;
b2, coating a dry film on the smooth PET substrate, wherein no air bubbles exist after the dry film is coated with the film, and covering the film with the TX circuit structure on the dry film; placing the film and the dry film on an exposure machine, and vacuumizing to ensure that the distance between the film and the dry film approaches 0; carrying out exposure after vacuum absorption, wherein the exposure energy is 1000 mj-1500 mj;
b3, after exposure is finished, developing by using a developing solution with the concentration of 0.7 +/-0.2 mol/L; after developing, etching by using etching solution with the concentration of 6.5 +/-0.2 mol/L, and then washing and air-drying to manufacture a TX circuit die;
b4, exposing the manufactured TX circuit mould in a UV machine, wherein the exposure energy is 3000 mj-5000 mj.
In step S3, after the first adhesive layer is coated on the glass cover bonding surface, a RX circuit mold is used to press gullies on the first adhesive layer, that is, the step of transferring the RX circuit structure to the first adhesive layer means: coating a first layer of UV glue on the joint surface of the glass cover plate, covering an RX circuit mould on the first layer of UV glue, rolling from one end of the glass cover plate to the other end in a roller jointing mode to enable the RX circuit mould to be completely contacted with the UV glue, pressing the RX circuit mould and the joint surface of the glass cover plate, and pressing gullies on the first layer of UV glue, wherein circuit structures of the RX circuit are transcribed in the gullies;
in step S3, the step of curing the first adhesive layer by UV exposure and forming an integral structure with the glass cover plate includes: after the RX circuit die is pressed with the binding surface of the glass cover plate, exposing by using a UV machine, wherein the exposure energy is 800 mj-2000 mj, curing the first layer of UV glue on the binding surface of the glass cover plate through exposure, and forming an integral structure with the glass cover plate; and after exposure, peeling the RX circuit mould from the first layer of UV adhesive curing structure, namely, the RX circuit mould is cured in the first layer of UV adhesive layer but is not conductive.
In step S4, after the RX line structures are transferred from the first adhesive layer, conductive paste is filled in the gaps with the RX line structures, and baking is performed to solidify the conductive paste in the gaps, that is, the conductive RX lines are transferred from the first adhesive layer: placing the glass cover plate with the RX circuit structure transferred on a printing machine, scraping a strip of conductive paste at one end of the glass cover plate from one end to the other end of the glass cover plate by a scraper of the printing machine, and filling the conductive paste into gullies with the RX circuit structure; after the conductive paste is filled, the glass cover plate is placed into an oven to be baked for 30-50 min at the baking temperature of 130-160 ℃, and the conductive paste is cured in a gully with an RX circuit structure through baking, namely, a conductive RX circuit is printed in the first layer of UV glue.
In step S5, after the conductive RX trace is transferred on the glass cover plate, coating a second adhesive layer on the cured first adhesive layer, and allowing the second adhesive layer to cover the conductive RX trace means: after the conductive RX circuit is transferred from the glass cover plate, the glass cover plate is placed on a jig, a second layer of UV glue is coated on the cured first layer of UV glue layer, and during gluing, the surface of the conductive RX circuit is ensured to be coated with the UV glue, and the thickness of the glue is 6-20 micrometers;
in step S5, after the glue is applied, a TX circuit mold is used to press ravines on the second adhesive layer, that is, the TX circuit structure is transferred to the second adhesive layer: coating a second layer of UV glue, covering a TX circuit mould on a second layer of UV glue surface, rolling from one end of the glass cover plate to the other end in a roller laminating mode to enable the TX circuit mould to be completely contacted with the UV glue, pressing the TX circuit mould and the second layer of UV glue, pressing a gully on the second layer of UV glue surface, and transferring and printing a circuit structure of the TX circuit in the gully;
in step S5, the step of curing the second adhesive layer by UV exposure and forming an integral structure with the first adhesive layer includes: the TX circuit die and the second layer of UV glue are pressed and then exposed by a UV machine, the exposure energy is 800 mj-2000 mj, the second layer of UV glue is cured on the first layer of UV glue through exposure, and an integral structure is formed by the second layer of UV glue and the cured first layer of UV glue; and stripping the TX circuit mould from the second layer of UV adhesive curing structure after exposure, namely curing the TX circuit structure in the second layer of UV adhesive layer, but not conducting electricity.
In step S6, after the TX trace structures are transferred from the second adhesive layer, conductive paste is filled in the gaps with the TX trace structures, and baking is performed to solidify the conductive paste in the gaps, that is, the conductive TX trace structures are transferred from the second adhesive layer: placing the glass cover plate with the TX circuit structure on a printing machine, scraping a strip of conductive paste at one end of the glass cover plate from one end to the other end of the glass cover plate by a scraper of the printing machine, and filling the conductive paste into a gully with the TX circuit structure; after the conductive paste is filled, the glass cover plate is placed into an oven to be baked for 30-50 min at the baking temperature of 130-160 ℃, and the conductive paste is cured in a gully with a TX circuit structure through baking, namely, a conductive TX circuit is printed in the second layer of UV glue.
Compared with the prior art, the invention has the advantages that: according to the invention, two layers of UV glue are sequentially cured on the cover plate, the conductive RX circuit and the conductive TX circuit are transferred in the UV glue curing structure, and the RX circuit, the conductive TX circuit and the glass cover plate form an integral single-layer structure through UV glue curing, so that the product structure is greatly simplified, the processing technology is simpler, and the manufacturing cost is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a GFF touch screen in the prior art.
Fig. 2 is a schematic structural diagram of a touch screen according to the present invention.
FIG. 3 is a schematic diagram of the structure of the RX circuit in the present invention
FIG. 4 is a schematic diagram of the TX circuitry of the present invention
As shown in the figure:
1. a cover plate; 21. an RX line; 22. the TX circuitry.
Detailed Description
The first embodiment is as follows:
as shown in fig. 2, fig. 3 and fig. 4, the touch screen of the present invention includes a glass cover plate 1 and an electrode array 2 cured on a bonding surface of the glass cover plate 1 by a glue layer, wherein the electrode array 2 includes a conductive RX line 21 and a conductive TX line 22, and projections of the RX line 21 and the TX line 22 in a vertical direction are in a mesh shape and are not electrically connected to each other. Specifically, the glue layer includes a first glue layer and a second glue layer, the first glue layer is solidified on the binding face of the glass cover plate 1, an RX circuit 21 is printed in the first glue layer, the second glue layer is solidified on the first glue layer and covers the RX circuit 21, and a TX circuit 22 is printed in the second glue layer. The first adhesive layer and the second adhesive layer are both UV adhesive layers. The effect of UV glue film lies in: providing structural support for RX line and TX line transfers; meanwhile, the RX circuit, the TX circuit and the glass cover plate form an integral single-layer structure through glue layer curing.
When the RX line and the TX line are designed, the RX line and the TX line can not be parallel and can only cross, if the RX line and the TX line are designed to be parallel, the signal quantity is low or interference occurs when a product touches, the problem of poor touch occurs, and in addition, the RX line 21 and the TX line 22 are not mutually conductive.
Compared with the prior art, the invention has the advantages that: the five-layer structure of the traditional touch screen is changed into a single-layer structure formed by only one cover plate and one carrier through the way of line transfer printing and glue layer curing, so that the product structure is greatly simplified, the material is saved, the product thickness is reduced, the product is attractive and has the advantage of being ultrathin.
Example two:
the embodiment is a method for manufacturing a touch screen in the first embodiment, and the method includes the following steps:
s1, surface treatment of the glass cover plate: carrying out illumination treatment on the glass cover plate 1, and then coating a first adhesive layer on the binding surface of the glass cover plate 1;
s2, manufacturing an RX circuit die and a TX circuit die: respectively manufacturing an RX circuit 21 mould and a TX circuit 22 mould according to the designed RX circuit 21 structure and the designed TX circuit 22 structure;
s3, transfer RX line structure: after a first adhesive layer is coated on the binding surface of the glass cover plate 1, pressing gullies on the first adhesive layer through an RX circuit 21 die, namely, transferring the structure of the RX circuit 21 to the first adhesive layer; the first adhesive layer is cured through exposure of a UV machine, and forms an integral structure with the glass cover plate 1;
s4, transfer of conductive RX lines: after the RX line 21 structure is transferred on the first adhesive layer, filling conductive paste in the trenches having the RX line 21 structure, baking to solidify the conductive paste in the trenches, i.e. transferring the conductive RX line 21 in the first adhesive layer;
s5, transfer TX line structure: after the conductive RX lines 21 are transferred on the glass cover plate 1, coating a second adhesive layer on the cured first adhesive layer, and allowing the second adhesive layer to cover the conductive RX lines 21; after the glue is coated, pressing gullies on the second glue layer through a TX circuit 22 die, namely, transferring the TX circuit 22 structure to the second glue layer; the second adhesive layer is cured through exposure of a UV machine and forms an integral structure with the first adhesive layer;
s6, transfer of conductive TX lines: after the TX circuit 22 structure is transferred on the second adhesive layer, the trenches having the TX circuit 22 structure are filled with conductive paste, and baking is performed to solidify the conductive paste in the trenches, so that the conductive TX circuit 22 is transferred in the second adhesive layer.
In step S1, the light irradiation treatment of the glass cover plate 1 is: irradiating the surface of the glass cover plate 1 by using ultraviolet light with the wave band of 150 nm-180 nm for 20 s; after the glass cover plate is subjected to illumination treatment, the surface adhesive force is increased, a substrate with good adhesive force is provided for subsequent circuit transfer printing, and the adhesive force can be monitored by a water drop angle tester and ranges from 10 degrees to 40 degrees;
in step S1, the step of coating the first adhesive layer on the bonding surface of the glass cover plate 1 includes: and (3) placing the glass cover plate 1 subjected to illumination treatment on a jig, and coating a first layer of UV glue on the joint surface of the glass cover plate 1 to ensure that the UV glue is coated in the joint surface of the glass cover plate 1, wherein the coating thickness is 6-20 microns.
In step S2, the step of manufacturing the RX circuit 21 mold according to the designed RX circuit 21 structure specifically includes the following steps:
a1, designing an RX circuit 21 structure according to the number of circuit channels required by a product, and manufacturing a film with the RX circuit 21 structure according to the designed RX circuit 21 structure;
a2, coating a dry film on a smooth PET substrate, wherein no air bubbles exist after the dry film is coated, and covering a film with an RX circuit 21 structure on the dry film; placing the film and the dry film on an exposure machine, and vacuumizing to ensure that the distance between the film and the dry film approaches 0; carrying out exposure after vacuum absorption, wherein the exposure energy is 1000 mj-1500 mj;
a3, after exposure, developing by using a developing solution with the concentration of 0.7 +/-0.2 mol/L; after development, etching is carried out by using etching solution with the concentration of 6.5 +/-0.2 mol/L, and then RX line 21 die is manufactured by washing and air drying;
a4, exposing the manufactured RX circuit 21 mould in a UV machine, wherein the exposure energy is 3000 mj-5000 mj; the secondary exposure is to strengthen the circuit structure of the mold.
In step S2, the step of manufacturing the TX circuit 22 mold according to the designed TX circuit 22 structure specifically includes the following steps:
b1, designing a TX circuit 22 structure according to the number of circuit channels of the product requirement, and manufacturing a film with the TX circuit 22 structure according to the designed TX circuit 22 structure;
b2, coating a dry film on the smooth PET substrate, wherein no air bubbles exist after the dry film is coated, and covering a film with the TX circuit 22 structure on the dry film; placing the film and the dry film on an exposure machine, and vacuumizing to ensure that the distance between the film and the dry film approaches 0; carrying out exposure after vacuum absorption, wherein the exposure energy is 1000 mj-1500 mj;
b3, after exposure is finished, developing by using a developing solution with the concentration of 0.7 +/-0.2 mol/L; after development, etching is carried out by using etching solution with the concentration of 6.5 +/-0.2 mol/L, and then a TX circuit 22 die is manufactured by washing and air drying;
b4, exposing the TX line 22 mold to UV light with exposure energy of 3000mj to 5000 mj. The secondary exposure is to strengthen the circuit structure of the mold.
In the circuit design, TX and RX circuits can not be parallel and can only be crossed, and if the RX circuit and the TX circuit are parallel, the signal quantity is low or interference occurs when a product touches, so that the problem of poor touch occurs;
the steps of making the film are as follows: uploading a designed circuit design drawing of the RX circuit 21 or the TX circuit 22, filling a structure, and inputting the filled drawing into a photoetching machine to manufacture a film;
in step S3, after the first adhesive layer is coated on the bonding surface of the glass cover 1, grooves are pressed out on the first adhesive layer by the RX circuit 21 mold, that is, the structure of the RX circuit 21 is transferred to the first adhesive layer, which means: after a first layer of UV glue is coated on the binding surface of the glass cover plate 1, covering an RX circuit 21 mold on the first layer of UV glue, rolling from one end of the glass cover plate 1 to the other end in a roller binding mode, enabling the RX circuit 21 mold to be completely contacted with the UV glue, pressing the RX circuit 21 mold on the binding surface of the glass cover plate 1, and pressing a gully on the first layer of UV glue, wherein a circuit structure of the RX circuit 21 is transcribed in the gully;
in step S3, the step of curing the first adhesive layer by UV exposure and forming an integral structure with the glass cover plate 1 includes: after the RX circuit 21 mould is pressed with the binding surface of the glass cover plate 1, exposing by using a UV machine, wherein the exposure energy is 800 mj-2000 mj, curing the first layer of UV glue on the binding surface of the glass cover plate 1 through exposure, and forming an integral structure with the glass cover plate 1; after exposure, the RX line 21 mold is peeled off from the first layer of UV glue cured structure, i.e. the RX line 21 structure is cured in the first layer of UV glue layer, but is not conductive.
In step S4, after the RX line 21 structure is transferred out of the first adhesive layer, conductive paste is filled in the gaps with the RX line 21 structure, and baking is performed to solidify the conductive paste in the gaps, that is, the conductive RX line 21 is transferred out of the first adhesive layer: placing the glass cover plate 1 with the RX circuit 21 structure transferred thereon on a printing machine, scraping a strip of conductive paste at one end of the glass cover plate 1 from one end to the other end of the glass cover plate 1 by a scraper of the printing machine, and filling the conductive paste into the gullies with the RX circuit 21 structure; after the conductive paste is filled, the glass cover plate 1 is placed into an oven to be baked for 30-50 min at 130-160 ℃, and the conductive paste is cured in a gully with an RX circuit 21 structure by baking, i.e. the conductive RX circuit 21 is printed in the first layer of UV glue.
In step S5, after the conductive RX trace 21 is transferred on the glass cover plate 1, coating a second adhesive layer on the cured first adhesive layer, and allowing the second adhesive layer to cover the conductive RX trace 21 means: after the conductive RX circuit 21 is transferred from the glass cover plate 1, the glass cover plate 1 is placed on a jig, a second layer of UV glue is coated on the cured first layer of UV glue layer, and when the glue is coated, the surface of the conductive RX circuit 21 is ensured to be coated with the UV glue, and the thickness of the coated glue is 6-20 microns;
in step S5, after the glue is applied, a TX circuit 22 mold is used to press ravines on the second adhesive layer, i.e. the structure of the TX circuit 22 is transferred to the second adhesive layer: coating a second layer of UV glue, covering a TX circuit 22 mold on a second layer of UV glue surface, rolling from one end of the glass cover plate 1 to the other end in a roller fitting mode, enabling the TX circuit 22 mold to be completely contacted with the UV glue, pressing the TX circuit 22 mold and the second layer of UV glue, pressing a gully on the second layer of UV glue surface, and transferring and printing a circuit structure of the TX circuit 22 in the gully;
in step S5, the step of curing the second adhesive layer by UV exposure and forming an integral structure with the first adhesive layer includes: the TX circuit 22 die and the second layer of UV glue are pressed and then exposed by a UV machine, the exposure energy is 800 mj-2000 mj, the second layer of UV glue is cured on the first layer of UV glue through exposure, and an integral structure is formed by the second layer of UV glue and the cured first layer of UV glue; after exposure, the TX circuitry 22 mold is peeled off from the second layer of UV glue cured structure, i.e. the TX circuitry 22 structure is cured in the second layer of UV glue layer, but is not conductive.
In step S6, after the TX line 22 structure is transferred on the second adhesive layer, the trenches having the TX line 22 structure are filled with the conductive paste, and the conductive paste is baked to be solidified in the trenches, that is, the conductive TX line 22 is transferred in the second adhesive layer: placing the glass cover plate 1 with the TX circuit 22 structure transferred thereon on a printing machine, scraping a strip of conductive paste at one end of the glass cover plate 1 from one end to the other end of the glass cover plate 1 by a scraper of the printing machine, and filling the conductive paste into the gullies with the TX circuit 22 structure; after the conductive paste is filled, the glass cover plate 1 is placed into an oven to be baked for 30-50 min at 130-160 ℃, and the conductive paste is cured in a gully with a TX circuit 22 structure by baking, i.e. the conductive TX circuit 22 is printed in the second layer of UV glue.
Compared with the prior art, the invention has the advantages that: according to the invention, two layers of UV glue are sequentially cured on the cover plate, the conductive RX circuit and the conductive TX circuit are transferred in the UV glue curing structure, and the RX circuit, the conductive TX circuit and the glass cover plate form an integral single-layer structure through UV glue curing, so that the product structure is greatly simplified, the processing technology is simpler, and the manufacturing cost is saved.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (10)
1. A touch screen is characterized in that: the novel glass cover plate comprises a glass cover plate (1) and an electrode array (2) solidified on the binding face of the glass cover plate (1) through a glue layer, wherein the electrode array (2) comprises a conductive RX line (21) and a conductive TX line (22), and projections of the RX line (21) and the TX line (22) in the vertical direction are meshed and are not conducted with each other.
2. The touch screen of claim 1, wherein: the glue film includes first glue film and second glue film, the solidification of first glue film is on the binding face of glass apron (1), and first glue film internal transfer have RX circuit (21), the solidification of second glue film is on first glue film and cover RX circuit (21), the internal transfer of second glue film has TX circuit (22).
3. The touch screen of claim 2, wherein: the first adhesive layer and the second adhesive layer are both UV adhesive layers.
4. A method for manufacturing a touch panel according to claim 3, comprising the steps of:
s1, surface treatment of the glass cover plate: carrying out illumination treatment on the glass cover plate (1), and then coating a first adhesive layer on the binding surface of the glass cover plate (1);
s2, manufacturing an RX circuit die and a TX circuit die: respectively manufacturing an RX circuit (21) mould and a TX circuit (22) mould according to the designed RX circuit (21) structure and the designed TX circuit (22) structure;
s3, transfer RX line structure: after a first adhesive layer is coated on the binding surface of the glass cover plate (1), gullies are pressed on the first adhesive layer through an RX circuit (21) die, namely the RX circuit (21) structure is transferred to the first adhesive layer; the first adhesive layer is cured through exposure of a UV machine, and forms an integral structure with the glass cover plate (1);
s4, transfer of conductive RX lines: after the structure of the RX circuit (21) is transferred on the first adhesive layer, filling conductive paste in the gullies with the structure of the RX circuit (21), baking to solidify the conductive paste in the gullies, namely, transferring the conductive RX circuit (21) in the first adhesive layer;
s5, transfer TX line structure: after the conductive RX circuit (21) is transferred on the glass cover plate (1), coating a second adhesive layer on the cured first adhesive layer, and enabling the second adhesive layer to cover the conductive RX circuit (21); after the glue is coated, pressing gullies on the second glue layer through a TX circuit (22) die, namely, transferring the TX circuit (22) structure to the second glue layer; the second adhesive layer is cured through exposure of a UV machine and forms an integral structure with the first adhesive layer;
s6, transfer of conductive TX lines: after the TX line (22) structure is transferred on the second adhesive layer, conductive paste is filled in the gaps having the TX line (22) structure, and baking is performed to solidify the conductive paste in the gaps, so that the conductive TX line (22) is transferred in the second adhesive layer.
5. The method for manufacturing a touch screen according to claim 4, wherein:
in step S1, the light irradiation treatment of the glass cover plate (1) means: irradiating the surface of the glass cover plate (1) by using ultraviolet light with the wave band of 150 nm-180 nm for 20 s;
in step S1, the step of coating the first adhesive layer on the bonding surface of the glass cover plate (1) includes: placing the glass cover plate (1) after illumination treatment on a jig, and coating a first layer of UV glue on the joint surface of the glass cover plate (1) to ensure that the UV glue is coated in the joint surface of the glass cover plate (1) and the glue coating thickness is 6-20 microns.
6. The method for manufacturing a touch screen according to claim 4, wherein:
in step S2, the step of manufacturing the RX line (21) mold according to the designed RX line (21) structure specifically includes the steps of:
a1, designing an RX line (21) structure according to the number of line channels required by a product, and manufacturing a film with the RX line (21) structure according to the designed RX line (21) structure;
a2, coating a dry film on a smooth PET substrate, wherein no air bubbles exist after the dry film is coated, and covering a film with an RX circuit (21) structure on the dry film; placing the film and the dry film on an exposure machine, and vacuumizing to ensure that the distance between the film and the dry film approaches 0; carrying out exposure after vacuum absorption, wherein the exposure energy is 1000 mj-1500 mj;
a3, after exposure, developing by using a developing solution with the concentration of 0.7 +/-0.2 mol/L; after development, etching is carried out by using etching solution with the concentration of 6.5 +/-0.2 mol/L, and then RX line (21) die is manufactured by washing and air drying;
a4, exposing the manufactured RX circuit (21) mould in a UV machine, wherein the exposure energy is 3000 mj-5000 mj;
in step S2, the step of manufacturing the TX line (22) mold according to the designed TX line (22) structure specifically includes the steps of:
b1, designing a TX circuit (22) structure according to the number of circuit channels required by a product, and manufacturing a film with the TX circuit (22) structure according to the designed TX circuit (22);
b2, coating a dry film on the smooth PET substrate, wherein no air bubbles exist after the dry film is coated, and covering a film with a TX circuit (22) structure on the dry film; placing the film and the dry film on an exposure machine, and vacuumizing to ensure that the distance between the film and the dry film approaches 0; carrying out exposure after vacuum absorption, wherein the exposure energy is 1000 mj-1500 mj;
b3, after exposure is finished, developing by using a developing solution with the concentration of 0.7 +/-0.2 mol/L; after development, etching is carried out by using etching solution with the concentration of 6.5 +/-0.2 mol/L, and then a TX circuit (22) die is manufactured through washing and air drying;
b4, exposing the manufactured TX circuit (22) mould in a UV machine, wherein the exposure energy is 3000 mj-5000 mj.
7. The method for manufacturing a touch screen according to claim 5, wherein:
in step S3, after the first adhesive layer is coated on the bonding surface of the glass cover (1), grooves are pressed out on the first adhesive layer by the RX circuit (21) mold, that is, the structure of the RX circuit (21) is transferred to the first adhesive layer: after a first layer of UV glue is coated on the binding surface of the glass cover plate (1), covering an RX circuit (21) mould on the first layer of UV glue, rolling from one end of the glass cover plate (1) to the other end in a roller binding mode, enabling the RX circuit (21) mould to be completely contacted with the UV glue, pressing the RX circuit (21) mould and the binding surface of the glass cover plate (1), and pressing out a gully on the first layer of UV glue, wherein a circuit structure of the RX circuit (21) is reprinted in the gully;
in step S3, the step of curing the first adhesive layer by UV exposure and forming an integral structure with the glass cover plate (1) includes: after the RX circuit (21) die is pressed on the binding surface of the glass cover plate (1), exposing by using a UV machine, wherein the exposure energy is 800 mj-2000 mj, curing the first layer of UV glue on the binding surface of the glass cover plate (1) through exposure, and forming an integral structure with the glass cover plate (1); and after exposure, the RX line (21) mould is stripped from the first layer of UV adhesive curing structure, namely the RX line (21) structure is cured in the first layer of UV adhesive layer and is not conductive.
8. The method for manufacturing a touch screen according to claim 7, wherein: in step S4, after the RX line (21) structure is transferred from the first adhesive layer, the conductive paste is filled in the gaps having the RX line (21) structure, and the conductive paste is baked to be solidified in the gaps, i.e. the transfer of the conductive RX line (21) in the first adhesive layer means: placing the glass cover plate (1) with the RX line (21) structure transferred on a printing machine, scraping a strip of conductive paste at one end of the glass cover plate (1) from one end to the other end of the glass cover plate (1) by a scraper of the printing machine, and filling the conductive paste into a gully with the RX line (21) structure; after the conductive paste is filled, the glass cover plate (1) is placed into an oven to be baked for 30-50 min at the baking temperature of 130-160 ℃, so that the conductive paste is cured in a gully with an RX circuit (21) structure through baking, and the conductive RX circuit (21) is printed in the first layer of UV glue.
9. The method of manufacturing a touch screen according to claim 8, wherein:
in step S5, after the conductive RX trace (21) is transferred on the glass cover plate (1), coating a second adhesive layer on the cured first adhesive layer, and allowing the second adhesive layer to cover the conductive RX trace (21) means: after the conductive RX circuit (21) is transferred from the glass cover plate (1), the glass cover plate (1) is placed on a jig, a second layer of UV glue is coated on the cured first layer of UV glue layer, and when the glue is coated, the surface of the conductive RX circuit (21) is ensured to be coated with the UV glue, and the thickness of the coated glue is 6-20 micrometers;
in step S5, after the glue is applied, a TX circuit (22) mold is used to press ravines on the second adhesive layer, i.e. the step of transferring the TX circuit (22) structure to the second adhesive layer means: coating a second layer of UV glue, covering a TX circuit (22) mould on a second layer of UV glue surface, rolling from one end of the glass cover plate (1) to the other end in a roller fitting mode, enabling the TX circuit (22) mould to be completely contacted with the UV glue, enabling the TX circuit (22) mould to be pressed with the second layer of UV glue, and pressing a gully on the second layer of UV glue surface, wherein a circuit structure of the TX circuit (22) is transferred and printed in the gully;
in step S5, the step of curing the second adhesive layer by UV exposure and forming an integral structure with the first adhesive layer includes: the TX circuit (22) mould and the second layer of UV glue are pressed and then exposed by a UV machine, the exposure energy is 800 mj-2000 mj, the second layer of UV glue is cured on the first layer of UV glue through exposure, and the second layer of UV glue and the cured first layer of UV glue form an integral structure; and stripping the TX circuit (22) mould from the second layer of UV adhesive curing structure after exposure, namely curing the TX circuit (22) structure in the second layer of UV adhesive layer, but not conducting electricity.
10. The method of manufacturing a touch screen according to claim 9, wherein: in step S6, after the TX line (22) structure is transferred from the second adhesive layer, the trenches having the TX line (22) structure are filled with the conductive paste, and the conductive paste is baked to be solidified in the trenches, that is, the transfer of the conductive TX line (22) in the second adhesive layer means: placing the glass cover plate (1) with the TX circuit (22) structure transferred on a printing machine, scraping a strip of conductive paste from one end to the other end of the glass cover plate (1) by a scraper of the printing machine, and filling the conductive paste into a gully with the TX circuit (22) structure; after the conductive paste is filled, the glass cover plate (1) is placed into an oven to be baked for 30-50 min at the baking temperature of 130-160 ℃, so that the conductive paste is cured in a gully with a TX circuit (22) structure through baking, and the conductive TX circuit (22) is printed in the second layer of UV glue.
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| CN202111020000.4A CN113805726A (en) | 2021-09-01 | 2021-09-01 | Touch screen and manufacturing method thereof |
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| JP2009080914A (en) * | 2007-09-27 | 2009-04-16 | Victor Co Of Japan Ltd | Method for manufacturing optical disk master plate, optical disk master plate, stamper, optical disk substrate, and optical disk |
| CN207408930U (en) * | 2017-12-01 | 2018-05-25 | 深圳市宇顺电子股份有限公司 | A kind of single-layer multi-point capacitive touch screen of metallic conduction ink printing circuit |
| CN110187802A (en) * | 2019-06-03 | 2019-08-30 | 江苏梨柳科技有限公司 | Capacitance touch screen and preparation method thereof |
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2021
- 2021-09-01 CN CN202111020000.4A patent/CN113805726A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009080914A (en) * | 2007-09-27 | 2009-04-16 | Victor Co Of Japan Ltd | Method for manufacturing optical disk master plate, optical disk master plate, stamper, optical disk substrate, and optical disk |
| CN207408930U (en) * | 2017-12-01 | 2018-05-25 | 深圳市宇顺电子股份有限公司 | A kind of single-layer multi-point capacitive touch screen of metallic conduction ink printing circuit |
| CN110187802A (en) * | 2019-06-03 | 2019-08-30 | 江苏梨柳科技有限公司 | Capacitance touch screen and preparation method thereof |
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