CN113804332B - Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof - Google Patents
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Abstract
The application relates to a temperature sensing element array fault diagnosis method based on an ultrasonic imaging system and application thereof, wherein the scheme comprises the following steps: s100, acquiring a spatial position of each temperature sensing element, and performing spatial grouping on the temperature sensing elements according to the spatial position to form a plurality of groups of array elements and sequencing the plurality of groups of array elements, wherein each group of array elements comprises a serial number of the temperature sensing element; s200, performing self-reliability calculation and inter-reliability calculation among the array elements of each group according to the temperature data of each temperature sensing element; s300, forming an array reliability matrix according to the self reliability and inter-element reliability, wherein the array reliability matrix comprises the serial numbers of the temperature sensing elements and the group serial numbers of the elements where the temperature sensing elements are positioned; s400, obtaining a fault temperature sensing element according to the self-reliability and the inter-element reliability, and outputting the serial number and the group serial number of the temperature sensing element.
Description
Technical Field
The invention relates to the technical field of ultrasound, in particular to a temperature sensing element array fault diagnosis method based on an ultrasound imaging system and application thereof.
Background
The hemispherical ultrasonic imaging system is used as important equipment for detecting breast lesions, can perform tomographic scanning on the breast, forms accurate three-dimensional images, and improves judgment of doctors on the positions of the breast lesions.
CN109770944a applied before my department discloses a mammary gland detection device, in the practical use process, obtaining accurate sound velocity value in the imaging space is the key of the hemispherical ultrasonic imaging system, and the speed of ultrasonic wave propagation in water is strongly related to temperature, so detection of spatial position temperature of the hemispherical ultrasonic imaging system is an important factor affecting imaging quality. The hemispherical transducer array has integrated therein NTC temperature sensors, forming a hemispherical temperature sensor array comprising 128 NTC temperature sensors. When the temperature sensor array element in the array breaks down, if the temperature sensor array element is not positioned and replaced in time, the imaging quality of the system is affected. Therefore, it is important for imaging systems to detect the location of the failed array element quickly and accurately.
However, the prior art does not have the fault diagnosis means, and only manual investigation or direct replacement and maintenance can be performed, so that the maintenance cost is too high, and the maintenance period is long. Therefore, a temperature sensing element array fault diagnosis method based on an ultrasonic imaging system and application thereof, which can timely detect the position of a failure temperature sensor, is convenient to maintain and replace, ensures the normal operation of a temperature measuring system and provides accurate and effective temperature data for image reconstruction of the ultrasonic imaging system, are needed.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a temperature sensing element array fault diagnosis method based on an ultrasonic imaging system and application thereof.
In order to achieve the above object, the present invention adopts the following technical scheme: the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system comprises the following steps:
S100, acquiring a spatial position of each temperature sensing element, and performing spatial grouping on the temperature sensing elements according to the spatial position to form a plurality of groups of array elements and sequencing the plurality of groups of array elements, wherein each group of array elements comprises a serial number of the temperature sensing element;
s200, performing self-reliability calculation and inter-reliability calculation among the array elements of each group according to the temperature data of each temperature sensing element;
s300, forming an array reliability matrix according to the self reliability and inter-element reliability, wherein the array reliability matrix comprises the serial numbers of the temperature sensing elements and the group serial numbers of the elements where the temperature sensing elements are positioned;
S400, obtaining a fault temperature sensing element according to the self-reliability and the inter-element reliability, and outputting the serial number and the group serial number of the temperature sensing element.
Working principle and beneficial effect: 1. compared with the prior art, the application can find the array element group where the fault temperature sensing element is located through the inter-array element mutual credibility, and then quickly find the fault temperature sensing element from the array elements through the self-credibility, thereby quickly obtaining the serial number and the group serial number of the temperature sensing element without traversing all the temperature sensing elements, greatly reducing the investigation difficulty, obviously improving the investigation efficiency, being convenient for maintenance and replacement, ensuring the normal operation of a temperature measuring system and providing accurate and effective temperature data for the image reconstruction of an ultrasonic imaging system, wherein the temperature sensing element is a temperature sensor;
2. The application well utilizes the structural characteristics of the hemispherical ultrasonic imaging system and the distribution arrangement of the temperature sensing elements, does not need to change any structure of the hemispherical ultrasonic imaging system, has extremely low reconstruction cost, and is incomparable with the prior art.
In step S100, all the temperature sensing elements with the same height are used as a group of array elements, each group of array elements is ordered and calibrated from top to bottom or from bottom to top, one temperature sensing element in each group of array elements is respectively calibrated as a reference array element, and the reference array element is used as a starting point to perform position calibration on the rest temperature sensing elements in each group of array elements clockwise or counterclockwise to obtain the serial number of each temperature sensing element and the group serial number of the array element where the temperature sensing element is located. According to the scheme, all temperature sensing elements in the hemispherical ultrasonic imaging system can be rapidly numbered, grouping operation is performed, inquiry and positioning are facilitated, and each temperature sensing element has space coordinates.
Further, in step S200, the temperature data of each temperature sensing element for a set period of time is selected as a data source calculated from the reliability. By adopting the temperature data within a certain time period, the occurrence of abnormal data is reduced, the reliability of the temperature data is higher, and the interference factors are reduced.
Further, the temperature data of each temperature sensing element is subjected to average processing to obtain a temperature average value, the temperature sensing element with the temperature greater than the set temperature threshold value is selected as an abnormal value according to the temperature average value, the temperature sensing element with the temperature less than or equal to the set temperature threshold value is selected as a normal value, and the proportion of the normal value in each group of array elements to the total number of all the temperature sensing elements is used as the self-credibility of each temperature sensing element. According to the scheme, the obtained temperature data are more accurate, because the water temperatures at the same height in hemispheres of the hemispherical ultrasonic imaging system are basically consistent, the actual situation can be reflected after the water temperatures are averaged, the abnormal value can be found out rapidly in the step, even if some abnormal temperature sensing elements exist, the group of array elements can complete the temperature detection function and reflect more accurate data, so that the reliability of the temperature data of each group of array elements is evaluated through the self-reliability, if the self-reliability is lower than a certain value, the temperature data of the group of array elements are unreliable, further maintenance is needed to find out the abnormal value, and if the self-reliability is higher than the certain value, the temperature data of the group of array elements are reliable, the maintenance of the abnormal temperature sensing elements of the group is not needed, the maintenance period is greatly improved, and unnecessary investigation is reduced.
Further, the correlation coefficient between any two array elements in the same group of array elements is calculated based on the gray theory, and all the correlation coefficients are averaged to be used as the inter-element mutual credibility of each group of array elements. The correlation degree of the array elements can be judged according to the temperature change trend of each group of array elements, the temperature change trend of the same group of array elements is consistent through the temperature transfer characteristic, so that the correlation coefficient is calculated by utilizing the existing gray theory, the inter-array element correlation degree of each group of array elements, namely the correlation coefficient between two temperature sensing elements in each group of array elements, and the average value of all the correlation coefficients is used as the inter-array element correlation degree, and can also be called as the inter-array element correlation degree.
Further, in step S400, it is determined that the array elements with inter-element reliability smaller than the set threshold are low-association array elements, and an abnormal value is selected for traversing the low-association array elements, and a sequence number and a group sequence number of the abnormal value are output. In the step, the array elements with low association degree can be quickly found, then the abnormal values are directly selected from the array elements, and the sequence numbers and the group sequence numbers of the abnormal values are output.
Further, the number of the temperature sensing elements is 128, the temperature sensing elements are divided into 8 groups of array elements, the number of the temperature sensing elements in each group of array elements is increased from bottom to top in sequence, and the temperature sensing elements in each group of array elements are uniform in height. The scheme combines the actual use condition of the hemispherical ultrasonic imaging system, and has strong specificity.
The device for diagnosing the temperature sensing element array faults based on the ultrasonic imaging system comprises the ultrasonic imaging system and a control end in communication connection with the ultrasonic imaging system, wherein the control end is used for executing the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system. The device adopting the method has the same function as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low reconstruction cost.
An electronic device for temperature sensing element array fault diagnosis based on an ultrasonic imaging system comprises a processor and a memory; the processor is coupled to the memory for executing executable commands of the memory to cause the electronic device to perform the temperature sensing element array fault diagnosis method based on the ultrasound imaging system as described above. The electronic equipment adopting the method has the same function as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low reconstruction cost.
A computer program product for ultrasound imaging system based temperature sensing element array fault diagnosis, comprising a program or instructions which, when run on a computer, cause the computer to perform the ultrasound imaging system based temperature sensing element array fault diagnosis method as described above. The computer program product adopting the method has the same function as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low reconstruction cost.
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FIG. 1 is a basic flow chart of the method of the present invention;
FIG. 2 is a flow chart of one embodiment of the method of the present invention;
FIG. 3 is a specific flow chart of one embodiment of the method of the present invention;
Fig. 4 is a schematic diagram of an array element of the method of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the invention, fall within the scope of protection of the invention.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the invention.
Referring to fig. 1 and 2, the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system firstly utilizes the position distribution information of array elements to carry out space grouping processing on the array elements, then respectively constructs the reliability matrix of each array element group based on the self-reliability of single-channel temperature data and the inter-channel temperature data, and then gives the position prompt of the fault temperature sensor according to the fault comprehensive judgment rule of the whole array. The method fully utilizes the correlation of the space positions of the array elements, is quick and efficient in array grouping processing, can timely detect the position of the failure temperature sensor, is convenient to maintain and replace, ensures the normal operation of a temperature measuring system, and provides accurate and effective temperature data for image reconstruction of an ultrasonic imaging system.
Compared with other array fault judging methods, the method fully utilizes the space position information of the array elements, and the reliability analysis synthesizes the self-reliability and the cross-correlation degree of the temperature sensor elements, and has the advantages of small calculated amount and high accuracy.
Example 1
The following temperature sensing elements are the same as the temperature sensors.
As shown in fig. 3, the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system comprises the following steps:
S100, acquiring a spatial position of each temperature sensing element, and performing spatial grouping on the temperature sensing elements according to the spatial position to form a plurality of groups of array elements and sequencing the plurality of groups of array elements, wherein each group of array elements comprises a serial number of the temperature sensing element;
In step S100, all the temperature sensing elements with the same height are used as a group of array elements, each group of array elements is ordered and calibrated from top to bottom or from bottom to top, one of the temperature sensing elements in each group of array elements is respectively calibrated as a reference array element, and the reference array element is used as a starting point to perform position calibration on the rest of the temperature sensing elements in each group of array elements clockwise or counterclockwise to obtain the serial number of each temperature sensing element and the group serial number of the array element where the temperature sensing element is located. All temperature sensing elements in the hemispherical ultrasonic imaging system can be rapidly numbered and grouped, so that the query and the positioning are convenient, and each temperature sensing element has space coordinates.
Referring to fig. 4, the actual operation is to divide the temperature sensors at the same height into the same groups according to the spatial positions of the NTC temperature sensor array, so as to form a hemispherical array as in fig. 4, so that 128 temperature sensors in the hemispherical array are divided into 8 groups of array elements, the number of the temperature sensors in each group of array elements is M i, where 1.ltoreq.i.ltoreq.8 represents a group number, Σm i =128, but of course, one point in fig. 4 represents one array element, and there may be a plurality of temperature sensors in each array element.
S200, performing self-reliability calculation and inter-reliability calculation among the array elements of each group according to the temperature data of each temperature sensing element;
In the step, firstly, one temperature sensor in each group of array elements is selected as a reference array element, and the other temperature sensor array elements are subjected to position calibration in a clockwise direction to obtain position information S i,j of each array element, wherein i is more than or equal to 1 and less than or equal to 8, j is more than or equal to 1 and less than or equal to M i, i represents a group number, and j represents a number of the temperature sensor or a j number in an i-th group.
Temperature data acquired within 30 seconds of each temperature sensor is selected as a processing object. Acquiring temperature data T i (k) within 30 seconds of a single temperature sensor, wherein (i=1, 2,.; k=1, 2,..n.), there are a total of N temperature data, one of the temperature data is T i (k), where k represents time.
S210, carrying out average processing on the temperature data of each temperature sensing element to obtain a temperature average value, and selecting the temperature sensing element larger than a set temperature threshold value as an abnormal value, and selecting the temperature sensing element smaller than or equal to the set temperature threshold value as a normal value according to the temperature average value, wherein the proportion of the normal value in each group of array elements to the total number of all the temperature sensing elements is used as the self-credibility of each temperature sensing element. The obtained temperature data can be more accurate, because the water temperatures at the same height in hemispheres of the hemispherical ultrasonic imaging system are basically consistent, the actual situation can be reflected after the water temperatures are averaged, the abnormal value can be found out rapidly in the step, even if some abnormal temperature sensing elements exist, the group of array elements can complete the temperature detection function and reflect more accurate data, therefore, the reliability of the temperature data of each group of array elements is evaluated through the self-reliability, if the self-reliability is lower than a certain value, the temperature data of the group of array elements are unreliable, further maintenance is needed to find out the abnormal value, and if the self-reliability is higher than or equal to a certain value, the temperature data of the group of array elements are reliable, and the abnormal temperature sensing elements of the group are not needed to be maintained, so that the maintenance period is greatly improved, and unnecessary troubleshooting is reduced.
The actual operation of this step is to select a processing window length L (representing the number of points of temperature data of 5 seconds, since each temperature data is a point, the temperature data points of 5 seconds are connected together to form a window length L), calculate an average value epsilon ik of temperatures in the window by taking Ti (k) as the center, and calculate the number of points of less than the window length L at the boundary to be averaged by a total number of points in practice, and the obtained epsilon ik is as follows,
Where (i=1, 2,) M i; k=1, 2,..n.) there are a total of N temperature data, where one temperature data is T i (k) and k represents time.
After calculating the average value epsilon ik of the temperature in the window, the validity alpha i (k) of the temperature data is calculated as follows:
Wherein alpha i (k) represents the validity of the kth temperature data of the array element i, 1 represents the kth point temperature is valid, and 0 represents an abnormality.
S220, calculating association coefficients between any two array elements in the same group of array elements based on a gray theory, and taking all the association coefficients as inter-array element mutual credibility of each group of array elements. The gray similarity measurement can judge the association degree of the array elements according to the temperature change trend of each group of array elements, and the temperature change trend of the same group of array elements is consistent through the temperature transfer characteristic, so that the association coefficient is calculated by utilizing the existing gray theory, the inter-array element degree of each group of array elements, namely the association coefficient between two temperature sensing elements in each group of array elements, can be calculated rapidly, and the average value of all the association coefficients is used as the inter-array element degree of interaction, and can also be called the inter-association degree.
The actual operation formula of the step is as follows
Correlation coefficient
Wherein i, j represents the serial numbers of temperature sensors in the same group, T i(k)-Tj (k) represents the absolute value of the difference value of the sequences T i and T j at the kth point, ρ is a resolution coefficient, generally 0.5 is taken, j below min represents the serial numbers of other array elements in the same group as i, k below min represents the minimum value of the absolute value of the difference value of the temperature data in the ith and jth array elements. I.e. find the minimum k of the temperature data difference between the ith and jth groups, find the minimum k of the difference between the ith and jth+1th groups, find the minimum k of the difference between the ith and other groups, find the minimum k in the minimum k, and find the two-stage maximum k.
After this step, the average value of the correlation coefficient is defined as the degree of correlation between the array elements, that is, the degree of mutual trust between the array elements of each group of array elements,
Degree of mutual associationWherein N represents that a group of array elements has N temperature sensors, and i and j represent the serial numbers of the temperature sensors in the same group.
S300, forming an array reliability matrix according to the self reliability and inter-element reliability, wherein the array reliability matrix comprises the serial numbers of the temperature sensing elements and the group serial numbers of the elements where the temperature sensing elements are positioned;
In this step, the reliability matrix C ij of each group of array elements is constructed according to the self-reliability sequence and the correlation degree of the array elements,
At this time, the reliability matrix C is a two-dimensional matrix of 128×128, and C ij is an element in the ith row and jth column, that is, an element is data of any position in the matrix, where α i (k) represents validity of the kth temperature data of the element i, 1 represents validity of the kth temperature, and 0 represents abnormality. All points are added to represent the number of valid points, and a total of N points, if 80% of the points are valid, the data of the array element is proved to be valid.
Element C 11,C22,C33...C128128 on the diagonal of the reliability matrix C represents the self-reliability (i=j), i.e. β i, if C 11 represents the self-reliability of the first element, a 1 represents the feasibility and a 0 represents the failure. The other element (i is not equal to j, i.e. ζ ij), such as C 21 indicates the mutual confidence of the 2 nd element and the first element, 1 indicates confidence, and 0 indicates failure in both elements. If C 51＝0,C52 = 0, two consecutive ones are 0, then the 5 th element failure is indicated.
S400, obtaining a fault temperature sensing element according to the self-reliability and the inter-element reliability, and outputting the serial number and the group serial number of the temperature sensing element.
In step S400, it is determined that the array elements with inter-element reliability smaller than the set threshold are low-association array elements, and an abnormal value is selected for traversing the low-association array elements, and a sequence number and a group sequence number of the abnormal value are output. The array elements with low association degree can be found out quickly, then the abnormal value is selected from the array elements directly, the sequence number of the abnormal value and the group sequence number are output, because more or less abnormal values exist in each group of array elements, when the abnormal value is insufficient to influence the group of array elements, maintenance is not needed, namely, when the self-reliability is higher, when the association degree is lower or is 0, even if maintenance is not needed, the self-reliability in the array elements is also needed to be checked, the association degree is equivalent to the supplement of the self-reliability, and the self-reliability and the association degree are matched, so that the obstacle removing accuracy and the maintenance efficiency are greatly improved.
In this embodiment, in combination with the formula in S300, when the self-reliability of two adjacent serial numbers or the inter-reliability between the array elements is 0 in the reliability matrix C ij, the array element is determined to be an array element fault, the group serial number of the array element and the serial number of the temperature sensor in the corresponding array element are recorded, and then the position of the faulty array element or the temperature sensor is output. If a plurality of temperature sensors are contained in one array element, a group of annular array elements are formed by the plurality of array elements, the position of the fault array element is output at the moment, and if a single temperature sensor forms an annular array element, the group serial number and the serial number of the fault sensor are output at the moment. That is, in one embodiment, as shown in fig. 4, one point represents one array element, and a plurality of temperature sensors may be provided in each array element, and in another embodiment, one point represents one temperature sensor, and a plurality of temperature sensors form an array element in a ring shape, which may be applied to the method of the present application.
Example 2
The device for diagnosing the temperature sensing element array faults based on the ultrasonic imaging system comprises the ultrasonic imaging system and a control end which is in communication connection with the ultrasonic imaging system, wherein the control end is used for executing the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system. The device adopting the method has the same function as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low reconstruction cost.
Example 3
An electronic device for temperature sensing element array fault diagnosis based on an ultrasonic imaging system comprises a processor and a memory; the processor is coupled to the memory for executing executable commands of the memory to cause the electronic device to perform the temperature sensing element array fault diagnosis method based on the ultrasound imaging system as described above. The electronic equipment adopting the method has the same function as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low reconstruction cost.
Example 4
A computer program product for ultrasound imaging system based temperature sensing element array fault diagnosis, comprising a program or instructions which, when run on a computer, cause the computer to perform the ultrasound imaging system based temperature sensing element array fault diagnosis method as described above. The computer program product adopting the method has the same function as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low reconstruction cost.
The computer system of the server for implementing the method of the embodiment of the present invention includes a central processing unit CPU) that can perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM) or a program loaded from a storage section into a Random Access Memory (RAM). In the RAM, various programs and data required for the system operation are also stored. The CPU, ROM and RAM are connected to each other by a bus. An input/output (I/O) interface is also connected to the bus.
The following components are connected to the I/O interface: an input section including a keyboard, a mouse, etc.; an output section including a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), etc., and a speaker, etc.; a storage section including a hard disk or the like; and a communication section including a network interface card such as a LAN card, a modem, and the like. The communication section performs communication processing via a network such as the internet. The drives are also connected to the I/O interfaces as needed. Removable media such as magnetic disks, optical disks, magneto-optical disks, semiconductor memories, and the like are mounted on the drive as needed so that a computer program read therefrom is mounted into the storage section as needed.
In particular, according to embodiments of the present disclosure, the processes described above with reference to flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method shown in the flow chart. In such embodiments, the computer program may be downloaded and installed from a network via a communication portion, and/or installed from a removable medium. The above-described functions defined in the system of the present invention are performed when the computer program is executed by a Central Processing Unit (CPU).
The computer readable medium shown in the present invention may be a computer readable signal medium or a computer readable storage medium, or any combination of the two. The computer readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In the present invention, however, the computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, with the computer-readable program code embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. Each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The modules involved in the embodiments of the present invention may be implemented in software, or may be implemented in hardware, and the described modules may also be disposed in a processor.
As another aspect, the present invention also provides a computer-readable medium that may be contained in the apparatus described in the above embodiments; or may be present alone without being fitted into the device. The computer-readable medium carries one or more programs that, when executed by one of the devices, cause the device to perform the flow steps corresponding to the following method.
The invention is not described in detail in the prior art, and therefore, the invention is not described in detail.
It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.
Although such terms are used more herein, the use of other terms is not precluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.
The present application is not limited to the above-mentioned preferred embodiments, and any person who can obtain other various products under the teaching of the present application can make any changes in shape or structure, and all the technical solutions that are the same or similar to the present application fall within the scope of the present application.
Claims (6)
1. The temperature sensing element array fault diagnosis method based on the ultrasonic imaging system is characterized by comprising the following steps of:
S100, acquiring a spatial position of each temperature sensing element, and performing spatial grouping on the temperature sensing elements according to the spatial position to form a plurality of groups of array elements and sequencing the plurality of groups of array elements, wherein each group of array elements comprises a serial number of the temperature sensing element;
s200, performing self-reliability calculation and inter-reliability calculation among the array elements of each group according to the temperature data of each temperature sensing element;
the temperature data of each temperature sensing element in a set time period is selected as a data source for self-reliability calculation, the temperature data of each temperature sensing element is subjected to average processing to obtain a temperature average value, the temperature sensing element which is larger than a set temperature threshold value is selected as an abnormal value according to the temperature average value, the temperature sensing element which is smaller than or equal to the set temperature threshold value is selected as a normal value, and the proportion of the normal value in each group of array elements to the total number of all the temperature sensing elements is used as the self-reliability of each temperature sensing element; calculating association coefficients between any two array elements in the same group of array elements based on gray theory, and taking all the association coefficients as inter-array element mutual credibility of each group of array elements;
s300, forming an array reliability matrix according to the self reliability and inter-element reliability, wherein the array reliability matrix comprises the serial numbers of the temperature sensing elements and the group serial numbers of the elements where the temperature sensing elements are positioned;
S400, judging that the array elements with the inter-element reliability smaller than the set threshold value are low-association-degree array elements, traversing the low-association-degree array elements to select abnormal values, obtaining fault temperature sensing elements, and outputting sequence numbers and group sequence numbers of the abnormal values.
2. The method for diagnosing the faults of the temperature sensing element array based on the ultrasonic imaging system according to claim 1, wherein in the step S100, all the temperature sensing elements with the same height are used as a group of elements, each group of elements is ordered and calibrated from top to bottom or from bottom to top, one of the temperature sensing elements in each group of elements is respectively calibrated as a reference element, and the reference element is used as a starting point to perform position calibration on the rest of the temperature sensing elements in each group of elements clockwise or counterclockwise, so as to obtain the serial number of each temperature sensing element and the group serial number of the element in which the temperature sensing element is positioned.
3. The method for diagnosing a temperature sensing element array fault based on an ultrasonic imaging system according to claim 1, wherein the number of the temperature sensing elements is 128, the temperature sensing elements are divided into 8 groups of array elements, the number of the temperature sensing elements in each group of array elements is sequentially increased from bottom to top, and the temperature sensing elements in each group of array elements are uniform in height.
4. An apparatus for diagnosing a failure of a temperature sensing element array based on an ultrasonic imaging system, comprising an ultrasonic imaging system and a control terminal communicatively connected to the ultrasonic imaging system, wherein the control terminal is configured to perform the method for diagnosing a failure of a temperature sensing element array based on an ultrasonic imaging system according to any one of claims 1 to 3.
5. An electronic device for diagnosing faults of a temperature sensing element array based on an ultrasonic imaging system is characterized by comprising a processor and a memory; the processor is coupled to the memory for executing executable commands of the memory to cause the electronic device to perform the ultrasound imaging system-based temperature sensing element array fault diagnosis method of any one of claims 1-3.
6. A computer program product for ultrasound imaging system based temperature sensitive element array fault diagnosis, comprising a program or instructions which, when run on a computer, cause the computer to perform the ultrasound imaging system based temperature sensitive element array fault diagnosis method of any one of claims 1-3.
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