CN113804332A - Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof - Google Patents
Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof Download PDFInfo
- Publication number
- CN113804332A CN113804332A CN202111087230.2A CN202111087230A CN113804332A CN 113804332 A CN113804332 A CN 113804332A CN 202111087230 A CN202111087230 A CN 202111087230A CN 113804332 A CN113804332 A CN 113804332A
- Authority
- CN
- China
- Prior art keywords
- array
- temperature
- elements
- temperature sensing
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000003745 diagnosis Methods 0.000 title claims abstract description 15
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 238000004364 calculation method Methods 0.000 claims abstract description 10
- 238000012163 sequencing technique Methods 0.000 claims abstract description 4
- 230000002159 abnormal effect Effects 0.000 claims description 31
- 238000004590 computer program Methods 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 7
- 238000003491 array Methods 0.000 claims description 4
- 238000012285 ultrasound imaging Methods 0.000 claims 2
- 230000006870 function Effects 0.000 description 12
- 238000012423 maintenance Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000012935 Averaging Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000013024 troubleshooting Methods 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 210000000481 breast Anatomy 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003902 lesion Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/007—Testing
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/08—Detecting organic movements or changes, e.g. tumours, cysts, swellings
- A61B8/0825—Detecting organic movements or changes, e.g. tumours, cysts, swellings for diagnosis of the breast, e.g. mammography
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/58—Testing, adjusting or calibrating the diagnostic device
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Biomedical Technology (AREA)
- Medical Informatics (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Engineering & Computer Science (AREA)
- Biophysics (AREA)
- Heart & Thoracic Surgery (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention relates to a temperature sensing element array fault diagnosis method based on an ultrasonic imaging system and application thereof, wherein the scheme comprises the following steps: s100, acquiring the spatial position of each temperature sensing element, spatially grouping the temperature sensing elements according to the spatial position to form a plurality of groups of array elements, and sequencing the plurality of groups of array elements, wherein each group of array elements comprises the serial number of the temperature sensing element; s200, performing self-credibility calculation and mutual credibility calculation between array elements on each group of array elements according to the temperature data of each temperature sensing element; s300, forming an array credibility matrix according to the self credibility and the mutual credibility between the array elements, wherein the array credibility matrix comprises the serial number of the temperature sensing element and the group serial number of the array element where the temperature sensing element is located; s400, obtaining a fault temperature sensing element according to self-credibility and mutual credibility between array elements, and outputting the serial number and the group serial number of the temperature sensing element.
Description
Technical Field
The invention relates to the technical field of ultrasound, in particular to a temperature sensing element array fault diagnosis method based on an ultrasonic imaging system and application thereof.
Background
The hemispherical ultrasonic imaging system is used as important equipment for detecting the breast lesions, can perform tomography on the breast, forms an accurate three-dimensional image and improves the judgment of doctors on the breast lesion positions.
In the actual use process, the key of the hemispherical ultrasonic imaging system is to acquire an accurate sound velocity value in an imaging space, and the propagation speed of ultrasonic waves in water is strongly related to the temperature, so that the detection of the space position temperature of the hemispherical ultrasonic imaging system is an important factor influencing the imaging quality. NTC temperature sensors are integrated in the hemispherical transducer array to form a hemispherical temperature sensor array, and the array contains 128 NTC temperature sensors. When a temperature sensor array element in the array fails, if the temperature sensor array element is not timely positioned and replaced, the imaging quality of the system is affected. Therefore, it is important for the imaging system to detect the position of the faulty array element quickly and accurately.
However, the prior art does not have the fault diagnosis means, and only manual troubleshooting or direct replacement and maintenance are needed, so that the maintenance cost is too high, and the maintenance period is long. Therefore, a temperature sensing element array fault diagnosis method based on an ultrasonic imaging system and an application thereof are urgently needed, wherein the position of a failed temperature sensor can be timely detected, the maintenance and the replacement are convenient, the normal operation of a temperature measurement system is guaranteed, and accurate and effective temperature data are provided for the image reconstruction of the ultrasonic imaging system.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a temperature-sensitive element array fault diagnosis method based on an ultrasonic imaging system and application thereof.
In order to realize the purpose of the invention, the invention adopts the following technical scheme: the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system comprises the following steps:
s100, acquiring the spatial position of each temperature sensing element, spatially grouping the temperature sensing elements according to the spatial position to form a plurality of groups of array elements, and sequencing the plurality of groups of array elements, wherein each group of array elements comprises the serial number of the temperature sensing element;
s200, performing self-credibility calculation and mutual credibility calculation between array elements on each group of array elements according to the temperature data of each temperature sensing element;
s300, forming an array credibility matrix according to the self credibility and the mutual credibility between the array elements, wherein the array credibility matrix comprises the serial number of the temperature sensing element and the group serial number of the array element where the temperature sensing element is located;
s400, obtaining the fault temperature sensing element according to the self-credibility and the mutual credibility between the array elements, and outputting the serial number and the group serial number of the temperature sensing element.
The working principle and the beneficial effects are as follows: 1. compared with the prior art, the method can firstly find the array element group where the fault temperature sensing element is located through the mutual confidence between the array elements, and then quickly find the fault temperature sensing element from the array element group through the self-confidence, so that the serial number and the group serial number of the temperature sensing element can be quickly obtained, all the temperature sensing elements do not need to be traversed, the troubleshooting difficulty is greatly reduced, the troubleshooting efficiency is obviously improved, the maintenance and the replacement are convenient, the normal operation of a temperature measurement system is ensured, and accurate and effective temperature data are provided for the image reconstruction of an ultrasonic imaging system, wherein the temperature sensing element is a temperature sensor;
2. the application well utilizes the structural characteristics of the hemispherical ultrasonic imaging system and the distribution of the temperature sensing elements, does not need to change any structure of the hemispherical ultrasonic imaging system, has extremely low transformation cost, and is incomparable with the prior art.
Further, in step S100, all the temperature-sensing elements at the same height are used as a group of array elements, each group of array elements is ranked and calibrated from top to bottom or from bottom to top, one of the temperature-sensing elements in each group of array elements is respectively calibrated as a reference array element, and the position calibration is performed on the remaining temperature-sensing elements in each group of array elements clockwise or counterclockwise by using the reference array element as a starting point, so as to obtain the serial number of each temperature-sensing element and the group serial number of the array element where the temperature-sensing element is located. According to the scheme, all temperature-sensitive elements in the hemispherical ultrasonic imaging system can be numbered quickly and are subjected to grouping operation, so that the inquiry and the positioning are facilitated, and each temperature-sensitive element has a space coordinate.
Further, in step S200, the temperature data of the set time period of each temperature sensing element is selected as the data source from the reliability calculation. By adopting the temperature data in a certain time period, the occurrence of data abnormity is reduced, the reliability of the temperature data is higher, and interference factors are reduced.
Further, the temperature data of each temperature sensing element is averaged to obtain a temperature average value, the temperature sensing elements larger than a set temperature threshold value are selected as abnormal values according to the temperature average value, the temperature sensing elements smaller than or equal to the set temperature threshold value are selected as normal values, and the proportion of the normal values in each group of array elements to the total number of all the temperature sensing elements is used as the self-reliability of each temperature sensing element. According to the scheme, the obtained temperature data can be more accurate, the water temperature at the same height in the hemisphere of the hemispherical ultrasonic imaging system is basically consistent, the actual situation can be reflected after averaging, the abnormal value can be found out quickly in the step, even if some temperature sensing elements are abnormal, the temperature detection function can be completed by the array elements of the group, and the accurate data are reflected, so that the reliability of the temperature data of each group of array elements is evaluated through the reliability, if the reliability is lower than a certain value, the temperature data of the array elements of the group is not reliable, the abnormal value needs to be further overhauled and found out, if the reliability is larger than or equal to a certain value, the temperature data of the array elements of the group is reliable, the abnormal temperature sensing elements of the group do not need to be overhauled, the maintenance period is greatly prolonged, and unnecessary investigation is reduced.
Further, based on the grey theory, the correlation coefficient between any two array elements in the same group of array elements is calculated, and all the correlation coefficients are averaged to be used as the inter-array element mutual confidence of each group of array elements. The correlation degree of the array elements can be judged according to the temperature change trend of each group of array elements, the temperature data change trends of the array elements in the same group are relatively consistent through the transmission characteristic of the temperature, so that the correlation coefficient is calculated by utilizing the existing grey theory, the mutual confidence degree between the array elements of each group of array elements can be quickly calculated, namely the correlation coefficient between two temperature-sensitive elements in each group of array elements, and the average value of all the correlation coefficients is used as the mutual confidence degree between the array elements and can also be called the mutual correlation degree.
Further, in step S400, it is determined that the array elements with the mutual confidence between the array elements smaller than the set threshold are the array elements with low association, an abnormal value is selected for the array elements with low association, and the serial number and the group serial number of the abnormal value are output. The method comprises the steps of rapidly finding out the array elements with low association degree, then directly selecting abnormal values from the array elements, and outputting the serial numbers and the group serial numbers of the abnormal values, wherein the abnormal values exist in each group of array elements more or less, and when the number of the abnormal values is not enough to influence the group of array elements, the abnormal values do not need to be overhauled, namely, the self-reliability is high, so when the association degree is low or 0, the self-reliability in the array elements needs to be checked even if the self-reliability does not need to be overhauled, the abnormal values are found, the association degree is equivalent to the supplement of the self-reliability, the self-reliability is matched with the association degree, and the obstacle removing accuracy and the overhauling efficiency are greatly improved.
Furthermore, the number of the temperature sensing elements is 128, and the array elements are divided into 8 groups, the number of the temperature sensing elements of each group of array elements is increased from bottom to top in sequence, and the height of the temperature sensing elements in each group of array elements is consistent. The scheme is combined with the actual use condition of the hemispheroid ultrasonic imaging system, and the special purpose is strong.
The device for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system comprises the ultrasonic imaging system and a control end in communication connection with the ultrasonic imaging system, wherein the control end is used for executing the method for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system. The device adopting the method has the same functions as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low modification cost.
The electronic equipment for diagnosing the fault of the temperature sensing element array based on the ultrasonic imaging system comprises a processor and a memory; the processor is coupled with the memory and is used for executing the executable commands of the memory so as to enable the electronic equipment to execute the temperature-sensitive element array fault diagnosis method based on the ultrasonic imaging system. The electronic equipment adopting the method has the same functions as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low modification cost.
A computer program product for diagnosing faults of a temperature sensitive element array based on an ultrasonic imaging system, comprising a program or instructions which, when run on a computer, causes the computer to carry out the method for diagnosing faults of a temperature sensitive element array based on an ultrasonic imaging system as described above. The computer program product adopting the method has the same functions as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low modification cost.
Drawings
FIG. 1 is a basic flow diagram of the process of the present invention;
FIG. 2 is a flow chart of one embodiment of the method of the present invention;
FIG. 3 is a detailed flow chart of one embodiment of the method of the present invention;
FIG. 4 is a schematic diagram of an array element of the method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, the above terms should not be construed as limiting the present invention.
Referring to fig. 1 and 2, in the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system, spatial grouping processing is performed on array elements by using position distribution information of the array elements, then confidence matrixes of the array elements are respectively constructed based on self-confidence of single-channel temperature data and the correlation of temperature data among channels, and position prompt of a fault temperature sensor is given according to a fault comprehensive judgment rule of a full array. The method makes full use of the correlation of the spatial positions of the array elements, the array grouping processing is rapid and efficient, the positions of the failed temperature sensors can be detected in time, the maintenance and the replacement are convenient, the normal operation of a temperature measurement system is ensured, and accurate and effective temperature data are provided for the image reconstruction of an ultrasonic imaging system.
Compared with other array fault judgment methods, the method fully utilizes the spatial position information of the array elements, analyzes the self-credibility and the mutual correlation degree of the comprehensive temperature sensor array elements with credibility, and has the advantages of small calculated amount and high accuracy.
Example 1
The temperature sensing element is the same as the temperature sensor.
As shown in fig. 3, the method for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system comprises the following steps:
s100, acquiring the spatial position of each temperature sensing element, spatially grouping the temperature sensing elements according to the spatial position to form a plurality of groups of array elements, and sequencing the plurality of groups of array elements, wherein each group of array elements comprises the serial number of the temperature sensing element;
in step S100, all temperature-sensitive elements at the same height are used as a group of array elements, each group of array elements is ranked and calibrated from top to bottom or from bottom to top, one temperature-sensitive element in each group of array elements is respectively calibrated as a reference array element, and the position calibration is performed on the remaining temperature-sensitive elements in each group of array elements clockwise or counterclockwise by using the reference array element as a starting point, so as to obtain the serial number of each temperature-sensitive element and the group serial number of the array element where the temperature-sensitive element is located. All temperature sensing elements in the hemispherical ultrasonic imaging system can be numbered quickly and are subjected to grouping operation, so that the inquiry and the positioning are facilitated, and each temperature sensing element has a space coordinate.
Referring to fig. 4, in practice, the NTC temperature sensor arrays are grouped into the same group according to the spatial position of the NTC temperature sensor arrays to form the same hemispherical array as in fig. 4, such that the 128 temperature sensors in the hemispherical array are grouped into 8 groups, and the number of the temperature sensors in each group of the array elements is MiWherein i is more than or equal to 1 and less than or equal to 8 represents the group number, sigma Mi128, it is also possible that one dot in fig. 4 represents one array element, and there may be multiple temperature sensors in each array element.
S200, performing self-credibility calculation and mutual credibility calculation between array elements on each group of array elements according to the temperature data of each temperature sensing element;
in the step, firstly, one temperature sensor in each group of array elements is respectively selected as a reference array element, and the position calibration is carried out on other temperature sensor array elements according to the clockwise direction to obtain the position information S of each array elementi,jWherein i is more than or equal to 1 and less than or equal to 8, j is more than or equal to 1 and less than or equal to MiI denotes a group number, and j denotes a number of the temperature sensor or a j-th number in the i-th group.
The temperature data acquired within 30 seconds per temperature sensor is selected as the processing object. Acquiring temperature data T of a single temperature sensor within 30 secondsi(k) Wherein (i ═ 1, 2.., Mi(ii) a k 1, 2.., N), there are a total of N temperature data, one of which is Ti(k) And k represents time.
S210, averaging the temperature data of each temperature sensing element to obtain a temperature average value, selecting the temperature sensing elements larger than a set temperature threshold value as abnormal values according to the temperature average value, selecting the temperature sensing elements smaller than or equal to the set temperature threshold value as normal values, and taking the proportion of the normal values in each group of array elements to the total number of all the temperature sensing elements as the self-reliability of each temperature sensing element. The obtained temperature data can be more accurate, because the water temperatures at the same height in the hemisphere of the hemispherical ultrasonic imaging system are basically consistent, the actual situation can be reflected after averaging, abnormal values can be found out quickly in the step, even if some temperature sensing elements are abnormal, the array elements can complete the temperature detection function and reflect more accurate data, the reliability of the temperature data of each array element group is evaluated through the self-reliability, if the self-reliability is lower than a certain value, the temperature data of the array elements are not reliable, the abnormal values need to be found out through further overhauling, if the self-reliability is higher than a certain value, the temperature data of the array elements are reliable, the abnormal temperature sensing elements of the array elements do not need to be overhauled, the maintenance period is greatly prolonged, and unnecessary troubleshooting is reduced.
The actual operation of this step is to select a processing window length L (representing the number of temperature data points of 5 seconds, since each temperature data point is a point, the temperature data points of 5 seconds are connected together to form a window length L), and calculate the average value ε of the temperatures in the window by taking the half window length (0.5L) before and after the window length (Ti (k))ikThe number of points with insufficient window length L at the boundary is averaged by the total number of points to obtain epsilonikAs follows below, the following description will be given,
wherein (i ═ 1, 2.., Mi(ii) a k 1, 2.., N), there are a total of N temperature data, one of which is Ti(k) And k represents time.
Calculating the average temperature value epsilon in the windowikThen, the validity α of the temperature data is calculatedi(k) The following were used:
wherein alpha isi(k) The validity of the kth temperature data of the array element i is shown, 1 shows that the kth temperature is valid, and 0 shows that the temperature is abnormal.
And S220, calculating the correlation coefficient between any two array elements in the same group of array elements based on a grey theory, and averaging all the correlation coefficients to serve as the inter-array element mutual confidence of each group of array elements. The grey similarity measurement can judge the correlation degree of the array elements according to the temperature change trend of each group of array elements, and the temperature data change trends of the same group of array elements are relatively consistent through the transmission characteristic of the temperature, so that the correlation coefficient is calculated by utilizing the existing grey theory, the inter-array element mutual confidence degree of each group of array elements can be quickly calculated, namely the correlation coefficient between two temperature-sensitive elements in each group of array elements, and the average value of all the correlation coefficients is used as the inter-array element mutual confidence degree, namely the inter-array element mutual correlation degree.
The practical operation formula of the step is
Correlation coefficient
Wherein i, j represents the serial number of the temperature sensors in the same group, Ti(k)-Tj(k) Represents the sequence TiAnd TjAnd in the absolute value of the difference value of the kth point, rho is a resolution coefficient, generally 0.5 is taken, j below min represents the serial numbers of other array elements in the same group with i, k below min represents the minimum value of the absolute value of the difference value of the temperature data in the ith array element and the jth array element. The method comprises the steps of firstly finding the minimum value k of the temperature data difference value between the ith group and the jth group, then finding the minimum value of the difference value between the ith group and the jth +1 group, finding the minimum value of the difference value between the ith group and all other groups, and then finding the minimum value in the minimum values, namely two-stage minimum values, wherein max is the maximum value, and finding two-stage maximum values by the same principle.
After this step, defining the average value of the correlation coefficient as the correlation degree between the array elements, i.e. the mutual confidence degree between the array elements of each group of array elements,
degree of mutual association
Wherein N represents that a group of array elements has N temperature sensors, and i and j represent the serial numbers of the temperature sensors in the same group.
S300, forming an array credibility matrix according to the self credibility and the mutual credibility between the array elements, wherein the array credibility matrix comprises the serial number of the temperature sensing element and the group serial number of the array element where the temperature sensing element is located;
in the step, a credibility matrix C of each group of array elements is constructed according to the self-credibility sequence and the mutual correlation degree of the array elementsij，
The confidence matrix C is a two-dimensional matrix of 128 x 128, and CijIs the data in which the element in the ith row and the jth column, i.e. the element, is an arbitrary position in the matrix, where αi(k) The validity of the kth temperature data of the array element i is shown, 1 shows that the kth temperature is valid, and 0 shows that the temperature is abnormal. All points are added up to represent the number of effective points, N points are total, and if 80% of the points are effective, the data of the array element is proved to be effective.
Diagonal elements C of the confidence matrix C11,C22,C33...C128128Is represented by self-confidence (i ═ j), i.e. βiE.g. C11The self-credibility of the first array element is shown, 1 indicates feasibility, and 0 indicates failure. Elements in other positions (i not equal to j, i.e.. zeta.)ij) E.g. C21The mutual reliability of the 2 nd array element and the first array element is shown, 1 represents the reliability, and 0 represents the fault in the two array elements. If C is present51＝0,C52If the two continuous signals are 0, the 5 th array element is failed.
S400, obtaining the fault temperature sensing element according to the self-credibility and the mutual credibility between the array elements, and outputting the serial number and the group serial number of the temperature sensing element.
In step S400, the array elements with the mutual confidence between array elements smaller than the set threshold are determined as the array elements with low association, an abnormal value is selected for the array elements with low association, and the serial number and the group serial number of the abnormal value are output. The array elements with low relevance can be quickly found, then the abnormal values are directly selected from the array elements, the serial numbers and the group serial numbers of the abnormal values are output, because the abnormal values exist in each group of array elements more or less, when the number of the abnormal values is not enough to influence the group of array elements, the abnormal values do not need to be overhauled, namely, the self-credibility is high, when the relevance is low or 0, the self-credibility in the array elements needs to be checked even if the abnormal values do not need to be overhauled, the relevance is equivalent to the supplement of the self-credibility, the self-credibility is matched with the relevance, and the obstacle removing accuracy and the overhauling efficiency are greatly improved.
In this embodiment, in combination with the formula in S300, the confidence matrix CijWhen the self-credibility or the mutual credibility between two adjacent sequence numbers is 0, the array element is judged to be an array element fault, the group sequence number of the array element and the sequence number of the temperature sensor in the corresponding array element are recorded, and then the position of the faulty array element or the temperature sensor is output. If an array element contains a plurality of temperature sensors, a plurality of array elements form a group of annular array elements, the position of the fault array element is output at the moment, and if a single temperature sensor forms an annular array element, the group serial number and the serial number of the fault sensor are only output at the moment. That is, in one embodiment, as shown in fig. 4, a dot represents an array element, and there may be multiple temperature sensors in each array element, while in another embodiment, a dot represents a temperature sensor, and multiple temperature sensors form a ring to form an array element, whichever may be suitable for the method of the present application.
Example 2
The device for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system comprises the ultrasonic imaging system and a control end in communication connection with the ultrasonic imaging system, wherein the control end is used for executing the method for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system. The device adopting the method has the same functions as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low modification cost.
Example 3
The electronic equipment for diagnosing the fault of the temperature sensing element array based on the ultrasonic imaging system comprises a processor and a memory; the processor is coupled with the memory and is used for executing the executable commands of the memory so as to enable the electronic equipment to execute the temperature sensing element array fault diagnosis method based on the ultrasonic imaging system. The electronic equipment adopting the method has the same functions as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low modification cost.
Example 4
A computer program product for diagnosing faults of a temperature sensitive element array based on an ultrasonic imaging system comprises a program or instructions, which when run on a computer causes the computer to execute the method for diagnosing faults of a temperature sensitive element array based on an ultrasonic imaging system. The computer program product adopting the method has the same functions as the method, can be directly applied to the existing ultrasonic imaging system, and has extremely low modification cost.
The computer system of the server for implementing the method of the embodiment of the present invention includes a central processing unit CPU) that can perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM) or a program loaded from a storage section into a Random Access Memory (RAM). In the RAM, various programs and data necessary for system operation are also stored. The CPU, ROM, and RAM are connected to each other via a bus. An input/output (I/O) interface is also connected to the bus.
The following components are connected to the I/O interface: an input section including a keyboard, a mouse, and the like; an output section including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage section including a hard disk and the like; and a communication section including a network interface card such as a LAN card, a modem, or the like. The communication section performs communication processing via a network such as the internet. The drive is also connected to the I/O interface as needed. A removable medium such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive as necessary, so that a computer program read out therefrom is mounted into the storage section as necessary.
In particular, according to the embodiments of the present disclosure, the processes described above with reference to the flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method illustrated in the flow chart. In such an embodiment, the computer program may be downloaded and installed from a network via the communication section, and/or installed from a removable medium. The computer program performs the above-described functions defined in the system of the present invention when executed by a Central Processing Unit (CPU).
It should be noted that the computer readable medium shown in the present invention can be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present invention, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In the present invention, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. Each block of the block diagrams or flowchart illustrations, and combinations of blocks in the block diagrams or flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The modules described in the embodiments of the present invention may be implemented by software, or may be implemented by hardware, and the described modules may also be disposed in a processor.
As another aspect, the present invention also provides a computer-readable medium that may be contained in the apparatus described in the above embodiments; or may be separate and not incorporated into the device. The computer readable medium carries one or more programs which, when executed by a device, cause the device to perform the process steps corresponding to the following method.
The present invention is not described in detail in the prior art, and therefore, the present invention is not described in detail.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Although the terms are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
The present invention is not limited to the above-mentioned preferred embodiments, and any other products in various forms can be obtained by anyone in the light of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as those of the present application, fall within the protection scope of the present invention.
Claims (10)
1. The temperature sensing element array fault diagnosis method based on the ultrasonic imaging system is characterized by comprising the following steps of:
s100, acquiring the spatial position of each temperature sensing element, spatially grouping the temperature sensing elements according to the spatial position to form a plurality of groups of array elements, and sequencing the plurality of groups of array elements, wherein each group of array elements comprises the serial number of the temperature sensing element;
s200, performing self-credibility calculation and mutual credibility calculation between array elements on each group of array elements according to the temperature data of each temperature sensing element;
s300, forming an array credibility matrix according to the self credibility and the mutual credibility between the array elements, wherein the array credibility matrix comprises the serial number of the temperature sensing element and the group serial number of the array element where the temperature sensing element is located;
s400, obtaining the fault temperature sensing element according to the self-credibility and the mutual credibility between the array elements, and outputting the serial number and the group serial number of the temperature sensing element.
2. The method for diagnosing the failure of the array of temperature sensitive elements based on the ultrasonic imaging system according to claim 1, wherein in step S100, all temperature sensitive elements at the same height are used as a group of array elements, each group of array elements is ranked and calibrated from top to bottom or from bottom to top, one temperature sensitive element in each group of array elements is respectively calibrated as a reference array element, and the position calibration is performed on the remaining temperature sensitive elements in each group of array elements clockwise or counterclockwise by using the reference array element as a starting point, so as to obtain the serial number of each temperature sensitive element and the group serial number of the array element where the temperature sensitive element is located.
3. The method for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system as claimed in claim 1, wherein the temperature data of each temperature-sensitive element in the set time period is selected as the data source of the self-credibility calculation in the step S200.
4. The method for diagnosing the fault of the temperature sensing element array based on the ultrasonic imaging system as claimed in claim 3, wherein the temperature data of each temperature sensing element is averaged to obtain a temperature average value, the temperature sensing elements larger than a set temperature threshold are selected as abnormal values according to the temperature average value, the temperature sensing elements smaller than or equal to the set temperature threshold are selected as normal values, and the proportion of the normal values in each group of array elements to the total number of all the temperature sensing elements is used as the self-reliability of each temperature sensing element.
5. The method for diagnosing the array fault of the temperature sensing elements based on the ultrasonic imaging system as claimed in claim 4, wherein the correlation coefficient between any two array elements in the same group of array elements is calculated based on a gray theory, and the average of all the correlation coefficients is used as the inter-array element mutual confidence of each group of array elements.
6. The method for diagnosing the array fault of the temperature sensing element based on the ultrasonic imaging system as claimed in claim 5, wherein the array elements with the mutual confidence degree smaller than the set threshold among the array elements are determined as the array elements with the low association degree in the step S400, the abnormal values are selected for the array elements with the low association degree in a traversal manner, and the serial numbers and the group serial numbers of the abnormal values are output.
7. The method for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system according to claim 1, wherein the number of the temperature-sensitive elements is 128, the temperature-sensitive elements are divided into 8 groups of array elements, the number of the temperature-sensitive elements in each group of array elements is increased from bottom to top, and the height of the temperature-sensitive elements in each group of array elements is consistent.
8. The device for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system is characterized by comprising the ultrasonic imaging system and a control terminal which is in communication connection with the ultrasonic imaging system, wherein the control terminal is used for executing the method for diagnosing the fault of the temperature-sensitive element array based on the ultrasonic imaging system according to any one of claims 1 to 7.
9. The electronic equipment for diagnosing the fault of the temperature sensing element array based on the ultrasonic imaging system is characterized by comprising a processor and a memory; the processor is coupled with the memory and is used for executing the executable commands of the memory so as to enable the electronic equipment to execute the temperature-sensitive element array fault diagnosis method based on the ultrasonic imaging system according to any one of claims 1 to 7.
10. Computer program product for ultrasound imaging system based diagnosis of faults in arrays of temperature sensitive elements, comprising a program or instructions which, when run on a computer, causes the computer to carry out the method for ultrasound imaging system based diagnosis of faults in arrays of temperature sensitive elements according to any of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111087230.2A CN113804332B (en) | 2021-09-16 | 2021-09-16 | Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111087230.2A CN113804332B (en) | 2021-09-16 | 2021-09-16 | Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113804332A true CN113804332A (en) | 2021-12-17 |
| CN113804332B CN113804332B (en) | 2024-06-04 |
Family
ID=78941304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111087230.2A Active CN113804332B (en) | 2021-09-16 | 2021-09-16 | Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113804332B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115670504A (en) * | 2022-10-24 | 2023-02-03 | 浙江衡玖医疗器械有限责任公司 | Method for judging quality of original signal of three-dimensional ultrasonic tomography system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105372534A (en) * | 2015-12-04 | 2016-03-02 | 国网河南省电力公司电力科学研究院 | Multi-sensor multi-parameter information intelligent integration system |
| CN105515184A (en) * | 2015-12-04 | 2016-04-20 | 国网河南省电力公司电力科学研究院 | Wireless sensor network-based cooperative monitoring system of multi-sensor and multi-parameter distribution network |
| JP2017167599A (en) * | 2016-03-14 | 2017-09-21 | 日本電気株式会社 | Fault diagnosis apparatus, fault diagnosis system, fault diagnosis method, and program |
| CN108627720A (en) * | 2018-03-08 | 2018-10-09 | 国网四川省电力公司电力科学研究院 | A kind of power equipment state monitoring method based on bayesian algorithm |
| CN110477950A (en) * | 2019-08-29 | 2019-11-22 | 浙江衡玖医疗器械有限责任公司 | Ultrasonic imaging method and device |
| WO2021108954A1 (en) * | 2019-12-02 | 2021-06-10 | 北京微动数联科技有限公司 | Sensor array-based detection and control method and apparatus |
| CN112949472A (en) * | 2021-02-28 | 2021-06-11 | 杭州翔毅科技有限公司 | Cooperative sensing method based on multi-sensor information fusion |
-
2021
- 2021-09-16 CN CN202111087230.2A patent/CN113804332B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105372534A (en) * | 2015-12-04 | 2016-03-02 | 国网河南省电力公司电力科学研究院 | Multi-sensor multi-parameter information intelligent integration system |
| CN105515184A (en) * | 2015-12-04 | 2016-04-20 | 国网河南省电力公司电力科学研究院 | Wireless sensor network-based cooperative monitoring system of multi-sensor and multi-parameter distribution network |
| JP2017167599A (en) * | 2016-03-14 | 2017-09-21 | 日本電気株式会社 | Fault diagnosis apparatus, fault diagnosis system, fault diagnosis method, and program |
| CN108627720A (en) * | 2018-03-08 | 2018-10-09 | 国网四川省电力公司电力科学研究院 | A kind of power equipment state monitoring method based on bayesian algorithm |
| CN110477950A (en) * | 2019-08-29 | 2019-11-22 | 浙江衡玖医疗器械有限责任公司 | Ultrasonic imaging method and device |
| WO2021108954A1 (en) * | 2019-12-02 | 2021-06-10 | 北京微动数联科技有限公司 | Sensor array-based detection and control method and apparatus |
| CN112949472A (en) * | 2021-02-28 | 2021-06-11 | 杭州翔毅科技有限公司 | Cooperative sensing method based on multi-sensor information fusion |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115670504A (en) * | 2022-10-24 | 2023-02-03 | 浙江衡玖医疗器械有限责任公司 | Method for judging quality of original signal of three-dimensional ultrasonic tomography system |
| CN115670504B (en) * | 2022-10-24 | 2024-01-09 | 浙江衡玖医疗器械有限责任公司 | Method for judging quality of original signal of three-dimensional ultrasonic tomography system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113804332B (en) | 2024-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7183376B2 (en) | Computer-assisted detection using multiple images from different views of the region of interest to improve detection accuracy | |
| US20170124700A1 (en) | Method and system for measuring a volume from an ultrasound image | |
| KR101876338B1 (en) | Method and Apparatus for Predicting Liver Cirrhosis Using Neural Network | |
| JP2013542046A5 (en) | ||
| JP7237147B2 (en) | Biometric measurement and quality assessment | |
| US11763460B2 (en) | Image segmentation confidence determination | |
| CN111445546B (en) | Image reconstruction method, device, electronic equipment and storage medium | |
| US9498166B2 (en) | Method for displaying the temperature field of a biological subject | |
| US20140371591A1 (en) | Method for automatically detecting mid-sagittal plane by using ultrasound image and apparatus thereof | |
| CN111511288B (en) | Ultrasound lung assessment | |
| WO2012064986A2 (en) | System and method of ultrasound image processing | |
| KR20080035163A (en) | Ultrasound diagnostic apparatus and method for measuring size of target object | |
| CN111189545B (en) | High-precision wide-area intelligent infrared body temperature screening method and system | |
| CN103765159A (en) | Rapid dense point cloud imaging using probabilistic voxel maps | |
| CN105938513A (en) | Apparatus and method for providing reliability for computer aided diagnosis | |
| CN111811694A (en) | Temperature calibration method, device, equipment and storage medium | |
| US9339257B2 (en) | Measuring apparatus and method thereof | |
| CN113804332B (en) | Temperature sensing element array fault diagnosis method based on ultrasonic imaging system and application thereof | |
| CN114492629A (en) | Abnormality detection method, abnormality detection device, electronic apparatus, and storage medium | |
| CN110163907B (en) | Method and device for measuring thickness of transparent layer of fetal neck and storage medium | |
| CN113806934B (en) | Hemispherical temperature sensor prediction model construction method and device and electronic equipment | |
| CN114972530A (en) | Method, device and equipment for calibrating camera based on virtual scene and storage medium | |
| KR20230019645A (en) | Apparatus and method for predicting body temperature and method for training same | |
| CN117157015A (en) | Ultrasound imaging systems, methods, and non-transitory computer readable media | |
| US20240023939A1 (en) | Ultrasound diagnostic apparatus and method for operating same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |