CN113801491B - Wide wood-plastic base material plate and production method thereof - Google Patents
Wide wood-plastic base material plate and production method thereof Download PDFInfo
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- CN113801491B CN113801491B CN202110976858.1A CN202110976858A CN113801491B CN 113801491 B CN113801491 B CN 113801491B CN 202110976858 A CN202110976858 A CN 202110976858A CN 113801491 B CN113801491 B CN 113801491B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L97/00—Compositions of lignin-containing materials
- C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
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Abstract
The invention provides a wide wood-plastic base material plate, which adopts a mode of adding high heat conduction material to enhance the integral heat conduction performance of the base material plate, so that the heat conduction coefficient of the wood-plastic material added with a large amount of low heat conduction plant fiber powder returns to a value close to that of polyolefin, thereby avoiding the phenomena of large internal stress of the plate, uneven surface of the plate and the like during the production of the wide plate, and improving the quality and yield of the wide wood-plastic plate. Specifically, the wide wood-plastic base material plate comprises the following components: 20-30 parts of polyolefin resin, 30-50 parts of plant fiber powder, 20-30 parts of high-thermal-conductivity filler and a plurality of processing aids; the heat conductivity coefficient of the high heat conduction filler is not lower than 15W/(m & ltK >); the processing aid comprises one or more of a coupling agent, a lubricant and an antioxidant.
Description
The invention provides a wide wood-plastic base material plate and a production method thereof, relating to the technical field of building plates.
Background
In the field of architectural decoration, a large number of panels are often used, such as floor panels, wall panels and the like, and the panels produced according to actual requirements often have different specifications, for example, the panels used as the floor panels are mostly relatively slender strips, and the wall panels are mostly of a panel structure with small length, small width and large area.
In recent years, with the development of wood-plastic industry, wood-plastic boards have the advantages of light weight, environmental protection, strong weather resistance and the like compared with traditional metal boards, wood-made boards and the like, and people increasingly adopt wood-plastic materials to prepare boards. A broad-width wood-plastic foamed PVC plate composition disclosed in patent document CN201410257510.7, which adopts PVC resin and wood powder as main substrates, and prepares a broad-width foamed plate by adding various additives such as a foaming agent; patent document No. cn201510959665.X discloses a PE wood plastic flooring, which uses PE resin and wood flour as main substrates for the production manufacture of flooring. However, when producing a board with a small length, a small width and a large area, i.e. a wide board, the wood-plastic material as a raw material for production may encounter some special problems. The problem that the surface of the board is uneven is always encountered in the production process, and the phenomenon is particularly obvious when the wood-plastic material is used for manufacturing a wide board.
Disclosure of Invention
In order to solve the problems, the invention provides the broad-width wood-plastic base material plate, the overall heat conduction performance of the base material plate is enhanced by adding the high heat conduction material, so that the heat conduction coefficient of the wood-plastic material added with a large amount of low heat conduction plant fiber powder returns to a value close to that of polyolefin, the phenomena of large internal stress of the board, uneven surface of the board and the like during production of the broad-width board are avoided, and the quality and the yield of the broad-width wood-plastic board are improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
the wide wood-plastic base material plate comprises the following components in parts by mass: 20 to 30 parts of polyolefin resin, 30 to 50 parts of plant fiber powder, 20 to 30 parts of high-thermal-conductivity filler and a plurality of processing aids; the heat conductivity coefficient of the high heat conduction filler is not lower than 15W/(m & ltK >); the processing aid comprises one or more of a coupling agent, a lubricant and an antioxidant.
The wide plate generally refers to a plate with a plate width of more than 0.5m, and the span between two side edges of the wide plate is large, for example, the thermal conductivity of the plate material is poor, and a relatively significant accumulation-type cooling rate difference occurs between the central portion and the side edge portion of the wide plate. The side portions are more easily cooled and the central portion is cooled more slowly, resulting in greater thermal stress within the sheet during the forming process. Eventually making the surface of the board uneven or even warped.
In the field of wood-plastic floors, the thermal conductivity coefficient of the common wood powder is only 0.14 to 0.17W/(mK), and the thermal conductivity coefficient is greatly different from that of polyolefin resin which is commonly used in the field of wood-plastic floors, and the thermal conductivity coefficient is 0.42W/(mK) taking polyethylene as an example. Since most of wood-plastic products contain more than 40% of wood flour component and the mixing uniformity of wood flour and polyolefin resin is not good enough, from a microscopic view, wood flour forms a large amount of small particles basically formed by wood flour in resin and is in dispersed distribution. Therefore, when a large amount of wood powder is added into polyolefin, the heat conductivity coefficient of the polyolefin is greatly reduced, and the heat conductivity coefficients of different parts of the wood-plastic plate are greatly different, so that the heat dissipation of the wood-plastic plate is greatly problematic and non-uniform; and the side parts are easy to cool, while the central part is slower to cool, which causes the uneven surface of the plate during molding. And wide panels are particularly evident.
According to the technical scheme, the heat conducting agent is added into the plate, and the amount and the use method of the heat conducting agent are controlled, so that a heat conducting network is formed, the heat conducting and radiating capacity of the plate is obviously improved, and the problems are solved.
In the above technical solution of the present invention, the polyolefin resin refers to a polymer material obtained by polymerizing olefin and its derivatives as monomers, the monomers of the polyolefin resin may be selected from olefin compounds such as ethylene, propylene, and vinyl chloride, and may also be copolymerized with a plurality of monomers to obtain a polymer material, for example, ethylene propylene rubber obtained by copolymerizing ethylene and propylene. Because the polyethylene has low cost and simple production process, the invention preferably adopts the high-density polyethylene as the raw material for preparing the wide-width plate. Preferably, the present invention can use the polyethylene reclaimed material as a raw material for preparing the wide-width board. The recycled polyethylene material may be used as a plastic component of the wood-plastic substrate plate, or may be used as a plastic component of the wood-plastic substrate plate by mixing the recycled polyethylene material with a new polyethylene material or other polyolefin resins.
The plant fiber powder is fine particles obtained by grinding a plant (usually, xylem of a plant), and is called plant fiber powder since most of the xylem of a plant is cellulose. The plant fiber powder can be obtained by various methods, including but not limited to, logs, bamboos, straws, and the like.
The high thermal conductivity filler refers to powder with a thermal conductivity coefficient not lower than 15W/(m × K), inorganic powder such as calcium carbonate and wollastonite can be added to improve the physical properties of the polyolefin wood plastic during the processing of the general polyolefin wood plastic, and the high thermal conductivity filler is adopted to replace the inorganic powder. Through adding high heat conduction filler, can compensate polyolefin resin because the interpolation of wood flour and the inhomogeneous of heat conductivility that loses to make broad width wood mould board surface in the cooling process keep level, reduce the production of internal stress. The term "broad width" as used herein generally means a width of the sheet material of 0.5m or more. Different from the common strip-shaped plate, the wide-width plate has two heat dissipation types, one is to transfer heat to the upper plane and the lower plane of the plate, and the other is to transfer heat to the side edge area of the plate, obviously, the material at the edge part of the wide-width plate is more fully contacted with air or other cooling media, the cooling rate is faster, the material at the middle part of the wide-width plate has a much slower heat transfer rate to the edge part of the wide-width plate, and in addition, taking air cooling as an example, the material at the middle part can further reduce the efficiency of transferring heat to the upper plane and the lower plane of the plate due to hot air flow generated by heat dissipation of peripheral materials, so that an obvious temperature difference is formed between the middle part and the side edge of the wide-width plate. Through having added high heat conduction filler, can realize the heat exchange more fast between the different regions on the broad width board to reduce the difference in temperature between the different regions, realize the effect that reduces the internal stress. In the prior art, some heat conductive rubbers prepared by adding high heat conductive substances into rubber exist, but such products are generally used in the fields of packaging of electronic components and the like, and because the operation of the electronic components generates a large amount of heat, high heat conductive materials must be adopted, and because of the application fields, these heat conductive rubbers are generally used for preparing miniaturized devices, and large objects such as broad boards are rarely used. From another point of view, in order to prevent the uneven surface of the wide-width board caused by uneven cooling, a more efficient and uniform cooling method is generally considered to be adopted instead of the heat conductivity of the wide-width board, which relates to the problem of equipment upgrading and increases the cost to a certain extent, and the invention can obtain the high-quality wide-width board by adopting the traditional cooling method without improving the equipment.
When the high-thermal-conductivity filler is filled into the composite material, the increase of the thermal conductivity coefficient of the composite material is not in a linear relation with the high-thermal-conductivity filler. The heat conduction principle of the high-heat-conduction filler is as follows: the two adjacent high heat conduction particles form direct contact to transfer heat mutually, when a large number of high heat conduction particles are connected to form a heat conduction network channel, the heat can be quickly transferred in the heat conduction network channel, and once the network channel is blocked, the heat transfer efficiency is greatly reduced. When the addition amount of the high thermal conductive filler is too small, a thermal conductive network passage is difficult to form, so that when the addition amount is low, the obvious improvement of the thermal conductivity coefficient is not usually generated, and as the proportion of the high thermal conductive filler is increased, the thermal conductive network passage is gradually established, the network density is increased, and the thermal conductivity coefficient is also gradually increased. In the invention, on one hand, the wide board contains enough high-heat-conductivity particles, and on the other hand, the influence of the high-heat-conductivity filler on the physical strength of the wide board is considered, so that the optimal addition amount is 20 to 35 parts by mass, and the heat conductivity coefficient of the high-heat-conductivity filler is above 15W/(m K) in order to ensure the heat conductivity effect.
It should be noted that the term "substrate board" refers to a wide-width wood-plastic board produced by the present invention, which can be used as a substrate to be combined with other materials to form a product with other functional characteristics, for example, a composite board used as wall decoration is obtained by combining the substrate board with decorative stickers, and a novel multi-layer reinforced floor is obtained by laminating a balance layer, a printing layer and a wear-resistant layer on the substrate board.
Preferably, the wide wood-plastic base material plate further comprises a compatilizer with the components of 5-15 parts by mass.
Further, the compatibilizer is selected from unsaturated carboxylic acid-modified polyolefin resins.
Further, the compatilizer is selected from maleic anhydride grafted polyethylene graft modified polyethylene.
Preferably, the high thermal conductive filler is one or more selected from magnesium oxide, aluminum oxide, zinc oxide, boron nitride, silicon carbide and aluminum nitride. The above materials are common heat-conducting fillers with heat conductivity coefficient above 15W/(m × K).
Preferably, the particle size of the plant fiber powder is 140 to 200 meshes; the particle size of the high-thermal-conductivity filler is 20 to 40um.
Judging according to the composition of the wide wood-plastic plate, the plant fiber powder has the highest component and the lowest heat conductivity coefficient. Therefore, the establishment of the heat conduction network channel is substantially to coat the periphery of the plant fiber powder through the high heat conduction particles, so that a similar cage-like structure is formed, the plant fiber powder is coated in the cage-like structure, and the skeleton part of the cage-like structure is the heat conduction network channel, so that certain optimization needs to be carried out on the selection of the particle size of the plant fiber powder and the particle size of the high heat conduction filler. When the particle size of the high-thermal-conductivity filler is too small, a microstructure in which high-thermal-conductivity particles are in direct contact with each other is difficult to form, so that the heat conductivity coefficient is not favorably improved, and when the particle size of the high-thermal-conductivity filler is too large, the number of the high-thermal-conductivity particles is too small under the condition of the same addition amount, the high-thermal-conductivity particles are not favorably uniformly dispersed, and a high-thermal-conductivity network channel is not favorably formed, so that the high-thermal-conductivity filler with the particle size within the range of 20 to 40um is better selected.
Preferably, the wide wood-plastic base material plate further comprises a fiber reinforced material.
Preferably, the fiber reinforcement material is one or more selected from glass fiber, carbon fiber, boron fiber, aramid fiber, alumina fiber, and silicon carbide fiber.
Because the strength of the wood-plastic board is much lower than that of a metal board, particularly when the wide board is used as a ground supporting board, the load-bearing capacity of the wood-plastic board is very limited, and the situations of collapse, bending, cracking and the like are easy to occur when the middle part is stressed greatly, and the fiber reinforced material can greatly improve the compression resistance and bending resistance of the wood-plastic board and widen the application field of the wood-plastic wide board. When the fiber reinforced material is compounded with thermosetting resin, glass fiber reinforced plastic can be prepared, the strength of the glass fiber reinforced plastic is comparable to that of metal in some aspects, and the fiber reinforced material can improve the physical properties of the wood plastic product in various aspects after being added into the wood plastic product.
Preferably, in the technical scheme, the thermal conductivity of the wide wood-plastic base material plate is not lower than 0.35W/(m × K).
The invention also provides a production mode of the product, which comprises the following steps:
(1) Taking 35 to 50 parts by weight of plant fiber powder, 20 to 30 parts by weight of polyolefin resin, 20 to 35 parts by weight of high-thermal-conductivity filler, 8 to 15 parts by weight of fiber reinforcing material and 8 to 12 parts by weight of processing aid as raw materials;
(2) Mixing and stirring polyolefin resin, plant fiber powder, a fiber reinforcing material, a processing aid and a high-heat-conductivity filler by a high-speed stirrer to obtain a first mixture;
(3) Putting the first mixture into an internal mixer for kneading to obtain a second mixture; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the length, width, diameter and thickness of not less than 0.5m and 6-12mm;
(5) And cooling and shaping the blank plate, and cutting to obtain a finished product of the wide wood-plastic base material plate.
Preferably, the processing aid comprises 0.4 to 1.8 parts of silane coupling agent, 2 to 4 parts of compatilizer, 3 to 6 parts of lubricant and 0.3 to 0.6 part of antioxidant.
Preferably, in the step (2), the high thermal conductive filler and the silane coupling agent are added into a high-speed stirrer to be stirred and mixed to obtain the surface-activated high thermal conductive filler, and then other raw material components are added into the high thermal conductive filler.
As mentioned above, the establishment of the heat conducting network path is substantially to wrap the high heat conducting particles around the plant fiber powder to form a cage-like structure, and the plant fiber powder is wrapped in the high heat conducting particles, which are usually metal compound powder and have no good compatibility with wood plastic, so the formation of the cage-like structure is hindered to some extent when the high heat conducting particles are directly added, and after the high heat conducting filler is treated, groups having affinity with the plant fiber powder are added on the activated surface, so that the wrapping effect is easier to form.
In summary, the following beneficial effects can be obtained by applying the invention:
1. according to the invention, the high-thermal-conductivity filler with the thermal conductivity coefficient of more than 15W/(m & ltK & gt) is added into the raw materials, so that the overall thermal conductivity efficiency of the wide wood-plastic base material plate is improved to be more than 0.35W/(m & ltK & gt), the temperature difference between the central part and the edge part of the wide wood-plastic base material plate in the processing and forming process is reduced, the internal stress generated due to the fact that the cold zone rate of the central part is inconsistent with that of the edge part is reduced, and the phenomenon that the plate plane is uneven is avoided; further, the high thermal conductive material is subjected to surface activation by using a coupling agent before being mixed with other raw material components, so that the thermal conductive effect is further enhanced.
2. The invention also adds fiber reinforced material in the raw material, and utilizes the fiber reinforced material to improve the physical property of the wide board, so that the wide board can be used as load-bearing objects such as floors and the like.
3. The wide wood-plastic base material plate produced by the invention can be used for being jointed or pressed with other materials to produce composite plates with different functional characteristics.
Detailed Description
The technical solution of the present invention is further described below by means of specific embodiments.
Example 1
The wide-width wood-plastic base material plate is produced in the following mode:
(1) By weight, 40 parts of wood fiber powder, 10 parts of maleic anhydride grafted polyethylene, 20 parts of high-density polyethylene resin, 10 parts of glass fiber, 22 parts of aluminum oxide, 4.6 parts of lubricant, 0.2 part of antioxidant 1010, 168.2 parts of antioxidant and 0.8 part of silane coupling agent;
(2) Firstly putting alumina and a silane coupling agent into a high-speed stirrer, stirring for 10min at 110 ℃, then putting high-density polyethylene resin, glass fiber, maleic anhydride grafted polyethylene, a lubricant, antioxidant 1010 and antioxidant 168 into the high-speed stirrer, and continuously mixing and stirring for 15min to obtain a first mixture;
(3) Putting the first mixture into an internal mixer for kneading at about 130 ℃ to obtain a second mixture; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the width of 1m and the thickness of 6 mm;
(5) And cooling and shaping the rudiment board, and cutting to obtain a finished product of the wood-plastic base material board with the length and the width of 1 m.
Example 2
(1) By weight, 35 parts of wood fiber powder, 10 parts of maleic anhydride grafted polyethylene, 25 parts of high-density polyethylene resin, 8 parts of glass fiber, 25 parts of aluminum oxide, 4 parts of lubricant, 0.2 part of antioxidant 1010, 0.2 part of antioxidant 168, and 1 part of silane coupling agent;
(2) Firstly putting alumina and a silane coupling agent into a high-speed stirrer, stirring for 10min at 110 ℃, then putting high-density polyethylene resin, glass fiber, maleic anhydride grafted polyethylene, a lubricant, antioxidant 1010 and antioxidant 168 into the high-speed stirrer, and continuously mixing and stirring for 15min to obtain a first mixture;
(3) Putting the first mixture into an internal mixer for kneading at about 130 ℃ to obtain a second mixture; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the width of 1m and the thickness of 6 mm;
(5) And cooling and shaping the blank plate, and cutting to obtain a finished product of the wide wood-plastic base material plate with the length and the width of 1 m.
Example 3
(1) By weight, 45 parts of wood fiber powder, 10 parts of maleic anhydride grafted polyethylene, 20 parts of high-density polyethylene resin, 12 parts of glass fiber, 20 parts of aluminum oxide, 5 parts of lubricant, 0.2 part of antioxidant 1010.2 parts, 168.2 parts of antioxidant and 0.8 part of silane coupling agent;
(2) Firstly putting alumina and a silane coupling agent into a high-speed stirrer, stirring for 10min at 110 ℃, then putting high-density polyethylene resin, glass fiber, maleic anhydride grafted polyethylene, a lubricant, antioxidant 1010 and antioxidant 168 into the high-speed stirrer, and continuously mixing and stirring for 15min to obtain a first mixture;
(3) Putting the first mixed material into an internal mixer for kneading at about 130 ℃ to obtain a second mixed material; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the width of 1m and the thickness of 8 mm;
(5) And cooling and shaping the blank plate, and cutting to obtain a finished product of the wide wood-plastic base material plate with the length and the width of 1 m.
Example 4
(1) By weight, 30 parts of wood fiber powder, 10 parts of maleic anhydride grafted polyethylene, 20 parts of high-density polyethylene resin, 12 parts of glass fiber, 30 parts of aluminum oxide, 4.6 parts of lubricant, 0.2 part of antioxidant 1010, 168.2 parts of antioxidant and 1.5 parts of silane coupling agent;
(2) Firstly putting alumina and a silane coupling agent into a high-speed stirrer, stirring for 10min at 110 ℃, then putting high-density polyethylene resin, glass fiber, maleic anhydride grafted polyethylene, a lubricant, antioxidant 1010 and antioxidant 168 into the high-speed stirrer, and continuously mixing and stirring for 15min to obtain a first mixture;
(3) Putting the first mixed material into an internal mixer for kneading at about 130 ℃ to obtain a second mixed material; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the width of 1m and the thickness of 8 mm;
(5) And cooling and shaping the blank plate, and cutting to obtain a finished product of the wide wood-plastic base material plate with the length and the width of 1 m.
Comparative example 1
(1) 40 parts of wood fiber powder, 10 parts of maleic anhydride grafted polyethylene, 20 parts of high-density polyethylene resin, 10 parts of glass fiber, 22 parts of calcium carbonate, 4.6 parts of lubricant, 1010.2 parts of antioxidant, 168.2 parts of antioxidant and 0.8 part of silane coupling agent;
(2) Firstly, putting calcium carbonate and a silane coupling agent into a high-speed stirrer, stirring for 10min at 110 ℃, then putting high-density polyethylene resin, glass fiber, maleic anhydride grafted polyethylene, a lubricant, antioxidant 1010 and antioxidant 168 into the high-speed stirrer, and continuously mixing and stirring for 15min to obtain a first mixture;
(3) Putting the first mixture into an internal mixer for kneading at about 130 ℃ to obtain a second mixture; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the width of 1m and the thickness of 6 mm;
(5) And cooling and shaping the blank plate, and cutting to obtain a finished product of the wide wood-plastic base material plate with the length and the width of 1 m.
The following is a performance analysis of examples and comparative examples, and the results are shown in Table 1.
Surface flatness analysis: the method comprises the steps of lighting a fluorescent lamp by adopting a visual observation method, aligning a plate to the fluorescent lamp at a certain angle, observing the plate in an oblique direction by using eye sight, enabling the fluorescent lamp to form a linear bright shadow on the surface of the plate, enabling the bright shadow to wander at different parts of the plate by changing the observation angle or changing the angle of the plate, observing whether the bright shadow obviously distorts and deforms in the wandering process, and if so, enabling the surface of the plate to be uneven.
Warping degree analysis: and directly measuring by using a warping degree laser measuring instrument.
And (3) measuring the heat conductivity coefficient: the test was carried out using ASTM D-5470-01 standard method.
TABLE 1
As can be seen from table 1, the surface flatness of the broad wood-plastic base material plate is related to the heat conductivity coefficient thereof, and when the heat conductivity coefficient is low, the surface thereof is uneven, and the warping degree is high.
The bending failure load, the bending strength and the bending elastic modulus of the products of examples 1 to 4 and the product of comparative example 1 were tested twice according to the relevant contents of GB/T24598-2009 and GB/T24137-209, and the results are shown in Table 2.
TABLE 2
The described embodiments of the present invention are only preferred embodiments of the present invention, and not all embodiments of the present invention are described. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention. The experimental methods in the examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
Claims (9)
1. The utility model provides a base material board is moulded to broad width wood which characterized in that: the wide wood-plastic base material plate comprises the following components in parts by mass: 20 to 30 parts of polyolefin resin, 30 to 50 parts of plant fiber powder, 20 to 30 parts of high-thermal-conductivity filler and a plurality of processing aids; the heat conductivity coefficient of the high heat conduction filler is not lower than 15W/(m & ltK >); the processing aid comprises one or more of a coupling agent, a lubricant and an antioxidant; the length, the width and the length of the wide wood-plastic base material plate are not less than 0.5m, and the thickness is 6 to 12mm.
2. The broad width wood-plastic substrate board of claim 1, wherein: the wide-width wood-plastic base material plate also comprises a compatilizer with the components of 5-15 parts by mass.
3. The wide wood-plastic base material plate as claimed in claim 1, wherein: the high heat conduction filler is selected from one or more of magnesium oxide, aluminum oxide, zinc oxide, boron nitride, silicon carbide and aluminum nitride.
4. The broad width wood-plastic substrate board of claim 3, wherein: the particle size of the plant fiber powder is 140 to 200 meshes; the particle size of the high-thermal-conductivity filler is 20 to 40um.
5. The broad width wood-plastic substrate board of claim 1, wherein: the wide wood-plastic base material plate also comprises a fiber reinforced material.
6. The wide wood-plastic base material plate as claimed in claim 5, wherein: the fiber reinforced material is selected from one or more of glass fiber, carbon fiber, boron fiber, aramid fiber, alumina fiber and silicon carbide fiber.
7. The wide wood-plastic base material plate as claimed in claim 1, wherein: the thermal conductivity coefficient of the wide wood-plastic base material plate is not lower than 0.35W/(m & K).
8. The production method of the wide wood-plastic base material plate is characterized by comprising the following steps:
(1) Taking 35 to 50 parts by weight of plant fiber powder, 20 to 30 parts by weight of polyolefin resin, 20 to 35 parts by weight of high-thermal-conductivity filler, 8 to 15 parts by weight of fiber reinforcing material and 8 to 12 parts by weight of processing aid as raw materials; the processing aid comprises 0.4 to 1.8 parts of silane coupling agent, 3 to 6 parts of lubricant and 0.3 to 0.6 part of antioxidant;
(2) Mixing and stirring polyolefin resin, plant fiber powder, a fiber reinforcing material, a processing aid and a high-heat-conductivity filler by a high-speed stirrer to obtain a first mixture;
(3) Putting the first mixture into an internal mixer for kneading to obtain a second mixture; extruding the second mixture through a granulator to obtain material particles;
(4) Extruding the material particles in a molten state through an extruder, and calendering the material particles through a compression roller to form a prototype plate with the length, width, diameter and thickness of not less than 0.8m and 6-12mm;
(5) And cooling and shaping the rudiment plate, and performing cutting treatment to obtain a finished product of the wide wood-plastic base material plate.
9. The method for producing a broad wood-plastic substrate board according to claim 8, wherein: in the step (2), the high-thermal-conductivity filler and the silane coupling agent are added into a high-speed stirrer to be stirred and mixed to obtain the high-thermal-conductivity filler with the activated surface, and then other raw material components are added into the high-thermal-conductivity filler.
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