CN113790721A - Planar micro inertial navigation system - Google Patents
Planar micro inertial navigation system Download PDFInfo
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- CN113790721A CN113790721A CN202110939914.4A CN202110939914A CN113790721A CN 113790721 A CN113790721 A CN 113790721A CN 202110939914 A CN202110939914 A CN 202110939914A CN 113790721 A CN113790721 A CN 113790721A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
- G01C21/166—Mechanical, construction or arrangement details of inertial navigation systems
Abstract
The invention provides a planarized micro inertial navigation system, comprising: the three-axis MEMS gyroscope and the three-axis MEMS accelerometer are arranged on the substrate in a planar mounting mode; the three-axis MEMS gyroscope comprises a first plane axis MEMS gyroscope, a second plane axis MEMS gyroscope and a Z axis MEMS gyroscope, wherein the first plane axis MEMS gyroscope, the second plane axis MEMS gyroscope and the Z axis MEMS gyroscope are orthogonally arranged in three axes; the three-axis MEMS accelerometer comprises a first plane axis MEMS accelerometer, a second plane axis MEMS accelerometer and a Z axis MEMS accelerometer, wherein the first plane axis MEMS accelerometer, the second plane axis MEMS accelerometer and the Z axis MEMS accelerometer are arranged in a three-axis orthogonal mode. By applying the technical scheme of the invention, the technical problem that the volume of the micro inertial navigation system is too large to realize the miniaturization and integration of the carrier in the prior art can be solved.
Description
Technical Field
The invention relates to the technical field of planar micro-inertial navigation systems, in particular to a planar micro-inertial navigation system.
Background
The micro-inertial navigation system measures the angular rate and the acceleration of a carrier through the MEMS gyroscope and the MEMS accelerometer, can be used for navigation positioning, stability control and the like of carriers such as small and medium-sized unmanned aerial vehicles, robots, vehicles and the like and various stable platforms, and particularly can provide autonomous and reliable linear motion, angular motion measurement information and navigation positioning information for the carriers and the stable platforms by using smaller volume and weight in various complex application environments. The micro inertial navigation system with autonomous navigation capability in the prior art usually adopts a hexahedral table body structure, and three-axis MEMS gyroscopes and three-axis MEMS accelerometers are respectively orthogonally arranged on a table top to realize the measurement of angular rate and acceleration of three-dimensional three-axis orthogonality so as to meet the requirements of inertial measurement and navigation calculation, so that the system is large in size and weight and not beneficial to the miniaturization integration of various carriers, meanwhile, the strict three-dimensional orthogonal constraint ensures that the system assembly and production seriously depend on manual operation, and the advantages of the current advanced automatic production technology are difficultly exerted to realize low-cost batch manufacturing.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art.
The invention provides a planarized micro inertial navigation system, comprising: the three-axis MEMS gyroscope and the three-axis MEMS accelerometer are arranged on the substrate in a planar mounting mode; the three-axis MEMS gyroscope comprises a first plane axis MEMS gyroscope, a second plane axis MEMS gyroscope and a Z axis MEMS gyroscope, wherein the first plane axis MEMS gyroscope, the second plane axis MEMS gyroscope and the Z axis MEMS gyroscope are orthogonally arranged in three axes; the three-axis MEMS accelerometer comprises a first plane axis MEMS accelerometer, a second plane axis MEMS accelerometer and a Z axis MEMS accelerometer, wherein the first plane axis MEMS accelerometer, the second plane axis MEMS accelerometer and the Z axis MEMS accelerometer are arranged in a three-axis orthogonal mode.
Furthermore, the first plane axis MEMS gyroscope and the second plane axis MEMS gyroscope both adopt an off-plane detection tuning fork type sensitive structure to realize plane axis angular motion measurement parallel to the gyroscope; the Z-axis MEMS gyroscope adopts a tuning fork type sensitive structure for detection in a horizontal plane so as to realize Z-axis angular motion measurement perpendicular to the gyroscope.
Furthermore, the first plane axis MEMS accelerometer and the second plane axis MEMS accelerometer both adopt a horizontal axis sensitive structure to realize plane axis acceleration measurement parallel to the accelerometers; the Z-axis MEMS accelerometer adopts a sensitive structure of a seesaw framework to realize Z-axis acceleration measurement perpendicular to the accelerometer.
Furthermore, the triaxial MEMS gyroscope is attached to a first plane of the substrate in a planar manner, and the triaxial MEMS accelerometer is attached to a second plane of the substrate, wherein the second plane is opposite to the first plane.
Further, the substrate is a PCB substrate.
Further, the planar micro inertial navigation system further comprises a microprocessor, wherein the microprocessor is arranged on the substrate and is respectively connected with the three-axis MEMS gyroscope and the three-axis MEMS accelerometer.
Further, the microprocessor respectively and synchronously acquires data of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer through the SPI interface.
Further, the planarized micro inertial navigation system further includes a connector disposed on the substrate, the connector being connected to the microprocessor.
Further, the connector is a micro-miniature board-to-board connector.
Further, the microprocessor is disposed on a first plane of the substrate, and the connector is disposed on a second plane of the substrate; alternatively, the microprocessor is disposed on the second plane of the substrate and the connector is disposed on the first plane of the substrate.
By applying the technical scheme of the invention, the planar micro-inertial navigation system is provided, the three-axis MEMS gyroscope and the three-axis MEMS accelerometer are arranged on the substrate in a planar mounting mode, the three-axis MEMS gyroscope comprises the first planar axis MEMS gyroscope, the second planar axis MEMS gyroscope and the Z-axis MEMS gyroscope, and the three-axis MEMS accelerometer comprises the first planar axis MEMS accelerometer, the second planar axis MEMS accelerometer and the Z-axis MEMS accelerometer, so that the three axial angular velocity information and the three axial acceleration information can be acquired, meanwhile, the size of the micro-inertial navigation system in the height direction is obviously reduced through a simple mounting mode, the micro-inertial navigation system has a planar characteristic, the size and the weight of the micro-inertial navigation system are further reduced, and the mounting and integration of a carrier are easier. Compared with the prior art, the technical scheme of the invention can solve the technical problem that the volume of the micro inertial navigation system is too large to realize the miniaturization and integration of the carrier in the prior art.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 illustrates a schematic component diagram of a planarized microinertia navigation system provided in accordance with an exemplary embodiment of the present invention;
FIG. 2 illustrates a schematic backside layout of a substrate of a planarized micro inertial navigation system provided in accordance with an exemplary embodiment of the present invention;
FIG. 3 illustrates a schematic layout of a front side of a substrate of a planarized micro inertial navigation system provided in accordance with an exemplary embodiment of the present invention;
FIG. 4 illustrates a bottom view of the internal structure of a planarized microinertia navigation system provided in accordance with a specific embodiment of the present invention;
FIG. 5 illustrates a top view of the internal structure of a planarized microinertia navigation system provided in accordance with a specific embodiment of the present invention;
FIG. 6 illustrates a top view of a planarized micro inertial navigation system outer structure provided in accordance with a specific embodiment of the present invention;
FIG. 7 illustrates a side view of an external structure of a planarized micro inertial navigation system provided in accordance with an exemplary embodiment of the present invention.
Wherein the figures include the following reference numerals:
10. a three-axis MEMS gyroscope; 11. a first planar axis MEMS gyroscope; 12. a second planar axis MEMS gyroscope; 13. a Z-axis MEMS gyroscope; 20. a three-axis MEMS accelerometer; 21. a first planar axis MEMS accelerometer; 22. a second planar axis MEMS accelerometer; 23. a Z-axis MEMS accelerometer; 30. a substrate; 40. a microprocessor; 50. a connector; 100a, mounting holes.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1, according to an embodiment of the present invention, there is provided a planarized micro inertial navigation system including a three-axis MEMS gyro, a three-axis MEMS accelerometer, and a substrate, both of the three-axis MEMS gyro and the three-axis MEMS accelerometer being arranged on the substrate in a planar manner; the three-axis MEMS gyroscope comprises a first plane axis MEMS gyroscope, a second plane axis MEMS gyroscope and a Z axis MEMS gyroscope, wherein the first plane axis MEMS gyroscope, the second plane axis MEMS gyroscope and the Z axis MEMS gyroscope are orthogonally arranged in three axes; the three-axis MEMS accelerometer comprises a first plane axis MEMS accelerometer, a second plane axis MEMS accelerometer and a Z axis MEMS accelerometer, wherein the first plane axis MEMS accelerometer, the second plane axis MEMS accelerometer and the Z axis MEMS accelerometer are arranged in a three-axis orthogonal mode.
By applying the configuration mode, the planar micro-inertial navigation system is provided, the three-axis MEMS gyroscope and the three-axis MEMS accelerometer are arranged on the substrate in a planar mounting mode, the three-axis MEMS gyroscope is arranged to comprise the first plane axis MEMS gyroscope, the second plane axis MEMS gyroscope and the Z axis MEMS gyroscope, and the three-axis MEMS accelerometer comprises the first plane axis MEMS accelerometer, the second plane axis MEMS accelerometer and the Z axis MEMS accelerometer, so that the three axial angular velocity information and the three axial acceleration information can be acquired, meanwhile, the size of the micro-inertial navigation system in the height direction is obviously reduced through a simple mounting mode, the micro-inertial navigation system has a planar characteristic, the size and the weight of the micro-inertial navigation system are further reduced, and the mounting and integration of a carrier are easier. Compared with the prior art, the technical scheme of the invention can solve the technical problem that the volume of the micro inertial navigation system is too large to realize the miniaturization and integration of the carrier in the prior art.
Further, in the invention, in order to realize the plane axis angular motion measurement under the plane installation condition, the first plane axis MEMS gyroscope and the second plane axis MEMS gyroscope both adopt tuning fork type sensitive structures for off-plane detection, and the plane axis angular motion measurement parallel to the gyroscope is realized through the coupling isolation and inhibition of out-of-plane vibration. The Z-axis MEMS gyroscope adopts a tuning fork type sensitive structure for detection in a horizontal plane, and the Z-axis angular motion measurement perpendicular to the gyroscope is realized under the condition of plane installation. In this embodiment, the first and second planar axis MEMS gyroscopes are arranged in a 90 orthogonal tiling on the substrate surface to enable X-axis and Y-axis angular motion measurements.
In addition, in the invention, in order to realize Z-axis acceleration measurement under the plane installation condition, the Z-axis MEMS accelerometer adopts a sensitive structure of a seesaw framework, and the Z-axis acceleration measurement vertical to the accelerometer is realized through out-of-plane differential detection. The first plane axis MEMS accelerometer and the second plane axis MEMS accelerometer both adopt horizontal axis sensitive structures, and plane axis acceleration measurement parallel to the accelerometers is realized under the condition of plane installation. In this embodiment, the first and second planar axis MEMS accelerometers are laid out at 90 ° orthogonal tiling on the substrate surface to enable X-axis and Y-axis acceleration measurements.
Further, in the invention, the arrangement sequence of the three-axis MEMS gyroscope and the three-axis MEMS accelerometer on the substrate can be adjusted on the basis of meeting the three-axis orthogonal measurement. In order to further reduce the volume of the micro inertial navigation system, the triaxial MEMS gyroscope plane is attached to a first plane of the substrate, and the triaxial MEMS accelerometer plane is attached to a second plane of the substrate, wherein the second plane is opposite to the first plane. The three-axis MEMS gyroscope and the three-axis MEMS accelerometer are respectively and planarly attached to two sides of the substrate, so that the size of the plane of the required substrate can be reduced, and the volume of the micro inertial navigation system is further reduced.
In addition, in the invention, in order to reduce the weight of the micro inertial navigation system, the substrate can be set to be a PCB substrate. By adopting the high-strength PCB substrate as the plane mounting platform of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer, the use of high-rigidity metal platforms such as aluminum alloy or magnesium-aluminum alloy as orthogonal mounting reference is avoided, the high-precision measurement requirement of the micro inertial navigation system can be met, and the weight of the micro inertial navigation system is reduced, so that the mounting and integration of the carrier are facilitated. In this embodiment, the high-strength PCB substrate may be fixed inside the micro inertial navigation system structure by screws, thereby significantly reducing the complexity of the internal structure of the system. The area of the PCB substrate can be determined according to the installation requirements of each component of the micro inertial navigation system, and in addition, the thickness, the length-width ratio, the installation hole positions of other components on the PCB substrate and the like of the PCB substrate can be determined through mechanical simulation such as vibration, impact and the like according to the mechanical environment condition of the micro inertial navigation system.
Further, in the present invention, in order to realize the precise fixed mounting of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer on the substrate, the triaxial MEMS gyroscope and the triaxial MEMS accelerometer may be mounted on the substrate by welding. In this embodiment, the three-axis MEMS gyroscope and the three-axis MEMS accelerometer are each configured in a three-axis quadrature to determine the solder-on direction. In order to ensure the orthogonal measurement precision of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer, the welding alignment of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer is ensured by aligning device coordinates, restraining pad size, improving substrate processing precision and the like, and the orthogonal measurement of X, Y and Z axial angular velocities and accelerations can be ensured by the simple production process under the condition of no support of a three-dimensional metal table body.
In addition, in the invention, in order to realize the acquisition of the inertial information and the inertial navigation solution of the micro inertial navigation system, the configurable planar micro inertial navigation system further comprises a microprocessor, wherein the microprocessor is arranged on the substrate and is respectively connected with the three-axis MEMS gyroscope and the three-axis MEMS accelerometer. The synchronous acquisition and inertial navigation resolving of the MEMS inertial information can be realized through the microprocessor so as to obtain the inertial navigation information such as position, speed, attitude and the like.
In one embodiment of the present invention, in order to reduce the power consumption of the micro inertial navigation system and improve the real-time performance, the microprocessor may be a low-power high-performance microprocessor. And synchronously acquiring data of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer by using a low-power-consumption high-performance microprocessor through an SPI (Serial Peripheral interface). In order to realize synchronous acquisition of three-axis angular velocity data, a three-axis MEMS gyroscope is synchronously triggered by a path of chip selection signals through a path of SPI interface, and three paths of angular velocity data are acquired in parallel; in order to realize synchronous acquisition of the three-axis acceleration data, the three-axis MEMS accelerometer is synchronously triggered by one path of chip selection signals through one path of SPI interface, and three paths of acceleration data are acquired in parallel. And performing inertial navigation calculation by using triaxial angular velocity information measured by the triaxial MEMS gyroscope and triaxial acceleration information measured by the triaxial MEMS accelerometer to obtain navigation information such as position, velocity and attitude. In this embodiment, the substrate acts as an electrical platform and the microprocessor may be disposed on the first or second plane of the substrate.
Further, in the present invention, in order to implement power supply and external data communication to the micro inertial navigation system, the configurable planarized micro inertial navigation system further includes a connector disposed on the substrate, the connector being connected to the microprocessor. As an embodiment of the present invention, in order to further reduce the volume of the micro inertial navigation system, the configurable connector employs a micro board-to-board connector. The micro template-to-board connector may be disposed on the first plane or the second plane of the substrate, and in order to further reduce the area of the substrate and further compress the volume of the micro inertial navigation system, the micro template-to-board connector and the microprocessor may be disposed opposite to each other on both sides of the substrate, for example, the micro template-to-board connector may be disposed on the first plane of the substrate and the microprocessor may be disposed on the second plane of the substrate. In this embodiment, for convenience of system installation and debugging, the plane of the substrate on which the micro board-to-board connector is located may be selected to be a front side arrangement, and the plane of the substrate on which the microprocessor is located may be a back side arrangement.
In addition, in the invention, in order to realize the power supply and external data communication of the micro board-to-board connector to the system, the configurable planarization micro inertial navigation system also comprises an external connector, and the micro board-to-board connector is connected with the external connector through a flexible board to receive external power supply and control instructions and simultaneously send navigation information to the outside.
As a specific embodiment of the invention, in order to ensure the reliable connection of the miniature plate-to-plate connector, a special boss is arranged at the corresponding position of the upper cover plate of the micro inertial navigation system structure, and the miniature plate-to-plate connector is compressed through the special boss so as to prevent the connector from loosening.
Further, in the present invention, as shown in fig. 6 and 7, in order to facilitate the fixed installation of the micro inertial navigation system inside the carrier, the configurable micro inertial navigation system external structure is provided with an installation hole 100 a. The micro-inertial navigation system can be stably installed inside the carrier through the corresponding installation hole, and displacement collision is avoided.
Compared with the prior art, the planar micro inertial navigation system has the following advantages:
(1) the invention realizes the three-dimensional three-axis orthogonal measurement of inertia information under the condition of plane installation; the existing micro inertial navigation system realizes orthogonal measurement through a hexahedron table body structure. Compared with the prior art, the planarization micro inertial navigation system has smaller volume and lighter weight, obviously reduces the size of the system in the height direction, has planarization characteristics and is easier for the installation and integration of a carrier;
(2) the invention adopts the high-strength PCB substrate as the interconnection platform of the triaxial MEMS gyroscope and the triaxial MEMS accelerometer; the existing micro-inertial navigation system realizes the three-dimensional interconnection of a triaxial MEMS gyroscope and a triaxial MEMS accelerometer through a rigid-flex board. Compared with the prior art, the planar micro inertial navigation system has the advantages of simple processing, high reliability, good environmental adaptability and the like;
(3) the planarization technical scheme provided by the invention enables the micro inertial navigation system to realize automatic batch production by utilizing a circuit electronic process; the three-dimensional assembly production of the existing micro inertial navigation system depends on manual operation. Compared with the prior art, the invention has the advantages of high automatic production level, low batch production cost and the like;
(4) the invention adopts a low-power-consumption high-performance microprocessor to realize the functions of data acquisition and navigation settlement, and adopts a miniature board-to-board connector as an electrical interface for system power supply and information input and output; the existing micro inertial navigation system adopts DSP/ARM + FPGA to realize information acquisition processing and communication functions, and adopts a conventional small connector as an electrical interface. Compared with the prior art, the invention has the advantages of low power consumption and microminiature.
For further understanding of the present invention, the planarized microinertia navigation system of the present invention will be described in detail with reference to fig. 1 to 7.
As shown in fig. 1 to 7, a planarized microinertia navigation system is provided according to an embodiment of the present invention, which includes a triaxial MEMS gyro 10, a triaxial MEMS accelerometer 20, a high strength PCB substrate 30, a low power consumption high performance microprocessor 40, a microminiature board-to-board connector 50, and an external-to-external connector.
The three-axis MEMS gyroscope 10 and the three-axis MEMS accelerometer 20 are arranged on the PCB substrate 30 in a planar mounting mode, the three-axis MEMS gyroscope 10 comprises a first plane axis MEMS gyroscope 11, a second plane axis MEMS gyroscope 12 and a Z axis MEMS gyroscope 13, and the first plane axis MEMS gyroscope 11, the second plane axis MEMS gyroscope 12 and the Z axis MEMS gyroscope 13 are orthogonally arranged in three axes. The first plane axis MEMS gyroscope 11 and the second plane axis MEMS gyroscope 12 both adopt tuning fork type sensitive structures for off-plane detection, and plane axis angular motion measurement parallel to the gyroscopes is realized through coupling isolation and inhibition of out-of-plane vibration. The Z-axis MEMS gyroscope 13 adopts a tuning fork type sensitive structure for detection in a horizontal plane, and realizes Z-axis angular motion measurement perpendicular to the gyroscope under the condition of plane installation.
The three-axis MEMS accelerometer 20 includes a first planar axis MEMS accelerometer 21, a second planar axis MEMS accelerometer 22, and a Z-axis MEMS accelerometer 23, wherein the first planar axis MEMS accelerometer 21, the second planar axis MEMS accelerometer 22, and the Z-axis MEMS accelerometer 23 are orthogonally arranged on three axes. The Z-axis MEMS accelerometer 23 employs a sensitive structure of a seesaw structure, and realizes Z-axis acceleration measurement perpendicular to the accelerometer itself by out-of-plane differential detection. The first plane axis MEMS accelerometer 21 and the second plane axis MEMS accelerometer 22 both adopt horizontal axis sensitive structures, and realize plane axis acceleration measurement parallel to the accelerometers under the condition of plane installation.
As shown in fig. 2 to 5, the three-axis MEMS gyro 10 and the low power consumption high performance microprocessor 40 are disposed on the rear surface of the PCB substrate 30, and the three-axis MEMS accelerometer 20 and the micro board-to-board connector 50 are disposed on the front surface of the PCB substrate 30. The low-power-consumption high-performance microprocessor 40 is respectively connected with the triaxial MEMS gyroscope 10, the triaxial MEMS accelerometer 20 and the miniature board-to-board connector 50, and the miniature board-to-board connector 50 is connected with an external connector through a flexible board.
Through the planarization design, the height of the micro inertial navigation system in the embodiment is not more than 12mm, and is far less than the average height of the micro inertial navigation system in the prior art, so that the installation and the application of the carrier where the micro inertial navigation system is located are more convenient.
In summary, the invention provides a planar micro inertial navigation system, wherein a three-axis MEMS gyroscope and a three-axis MEMS accelerometer are arranged on a substrate in a planar mounting manner, and the three-axis MEMS gyroscope includes a first planar-axis MEMS gyroscope, a second planar-axis MEMS gyroscope and a Z-axis MEMS gyroscope, and the three-axis MEMS accelerometer includes a first planar-axis MEMS accelerometer, a second planar-axis MEMS accelerometer and a Z-axis MEMS accelerometer, so that it is possible to significantly reduce the size of the micro inertial navigation system in the height direction by a simple mounting manner while acquiring three pieces of axial angular velocity information and three pieces of axial acceleration information, so that the micro inertial navigation system has a planar feature, thereby reducing the volume and weight of the micro inertial navigation system, and facilitating the mounting and integration of carriers. Compared with the prior art, the technical scheme of the invention can solve the technical problem that the volume of the micro inertial navigation system is too large to realize the miniaturization and integration of the carrier in the prior art.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A planarized micro inertial navigation system, comprising: the MEMS gyroscope comprises a triaxial MEMS gyroscope, a triaxial MEMS accelerometer and a substrate, wherein the triaxial MEMS gyroscope and the triaxial MEMS accelerometer are arranged on the substrate in a planar mounting mode; the three-axis MEMS gyroscope comprises a first plane axis MEMS gyroscope, a second plane axis MEMS gyroscope and a Z axis MEMS gyroscope, wherein the first plane axis MEMS gyroscope, the second plane axis MEMS gyroscope and the Z axis MEMS gyroscope are orthogonally arranged in three axes; the triaxial MEMS accelerometer comprises a first plane axis MEMS accelerometer, a second plane axis MEMS accelerometer and a Z axis MEMS accelerometer, wherein the first plane axis MEMS accelerometer, the second plane axis MEMS accelerometer and the Z axis MEMS accelerometer are arranged in a triaxial orthogonal mode.
2. The planarized microinertia navigation system of claim 1 wherein said first and second planar axis MEMS gyroscopes each employ an off-plane sensing tuning fork sensitive structure to enable planar axis angular motion measurements parallel to the gyroscope itself; the Z-axis MEMS gyroscope adopts a tuning fork type sensitive structure for detection in a horizontal plane so as to realize Z-axis angular motion measurement perpendicular to the gyroscope.
3. The planarized microinertia navigation system of claim 1, wherein said first and second planar axis MEMS accelerometers each employ a horizontal axis sensitive structure to enable planar axis acceleration measurements parallel to the accelerometer itself; the Z-axis MEMS accelerometer adopts a sensitive structure of a seesaw framework to realize Z-axis acceleration measurement vertical to the accelerometer.
4. The planarized microinertia navigation system of claim 1 wherein said triaxial MEMS gyroscope plane is attached to a first plane of said substrate and said triaxial MEMS accelerometer plane is attached to a second plane of said substrate opposite said first plane.
5. The planarized microinertia navigation system of claim 1, wherein said substrate is a PCB substrate.
6. The planarized micro inertial navigation system of claim 1, further comprising a microprocessor disposed on said substrate, said microprocessor connected to said three axis MEMS gyroscope and said three axis MEMS accelerometer, respectively.
7. The planarized microinertia navigation system of claim 6, wherein said microprocessor synchronously collects data from said triaxial MEMS gyroscope and said triaxial MEMS accelerometer, respectively, via SPI interfaces.
8. The planarized micro inertial navigation system of claim 1, further comprising a connector disposed on said substrate, said connector connected to said microprocessor.
9. The planarized microinertia navigation system of claim 8, wherein said connector is a micro board-to-board connector.
10. The planarized microinertia navigation system of claim 8, wherein said microprocessor is disposed on a first plane of said substrate and said connector is disposed on a second plane of said substrate; or, the microprocessor is disposed on a second plane of the substrate and the connector is disposed on a first plane of the substrate.
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| CN115824199A (en) * | 2022-11-07 | 2023-03-21 | 北京自动化控制设备研究所 | Microminiature multi-information fusion autonomous navigation system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020008661A1 (en) * | 2000-07-20 | 2002-01-24 | Mccall Hiram | Micro integrated global positioning system/inertial measurement unit system |
| CN1912545A (en) * | 2006-08-25 | 2007-02-14 | 北京航空航天大学 | Low cost, small volum plate micro-inertial measuring system based on MEMS |
| US20130317741A1 (en) * | 2012-05-23 | 2013-11-28 | Vectornav Technologies, Llc | System on a chip inertial navigation system |
| CN204115740U (en) * | 2014-10-13 | 2015-01-21 | 苏州文智芯微系统技术有限公司 | A kind of new micro Inertial Measurement Unit combination |
| CN104296746A (en) * | 2014-10-13 | 2015-01-21 | 苏州文智芯微系统技术有限公司 | Novel minitype inertial measurement unit assembly |
| CN108286967A (en) * | 2017-12-29 | 2018-07-17 | 中国电子科技集团公司信息科学研究院 | Multiple Source Sensor High Density Integration device and method |
| CN110966999A (en) * | 2019-12-13 | 2020-04-07 | 中北大学 | Monolithic integration triaxial gyro based on tunnel magnetic resistance detection |
| CN112344929A (en) * | 2020-11-27 | 2021-02-09 | 中电科技集团重庆声光电有限公司 | Multilayer bare chip stacking 3D heterogeneous integrated navigation micro system |
-
2021
- 2021-08-17 CN CN202110939914.4A patent/CN113790721A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020008661A1 (en) * | 2000-07-20 | 2002-01-24 | Mccall Hiram | Micro integrated global positioning system/inertial measurement unit system |
| CN1912545A (en) * | 2006-08-25 | 2007-02-14 | 北京航空航天大学 | Low cost, small volum plate micro-inertial measuring system based on MEMS |
| US20130317741A1 (en) * | 2012-05-23 | 2013-11-28 | Vectornav Technologies, Llc | System on a chip inertial navigation system |
| CN204115740U (en) * | 2014-10-13 | 2015-01-21 | 苏州文智芯微系统技术有限公司 | A kind of new micro Inertial Measurement Unit combination |
| CN104296746A (en) * | 2014-10-13 | 2015-01-21 | 苏州文智芯微系统技术有限公司 | Novel minitype inertial measurement unit assembly |
| CN108286967A (en) * | 2017-12-29 | 2018-07-17 | 中国电子科技集团公司信息科学研究院 | Multiple Source Sensor High Density Integration device and method |
| CN110966999A (en) * | 2019-12-13 | 2020-04-07 | 中北大学 | Monolithic integration triaxial gyro based on tunnel magnetic resistance detection |
| CN112344929A (en) * | 2020-11-27 | 2021-02-09 | 中电科技集团重庆声光电有限公司 | Multilayer bare chip stacking 3D heterogeneous integrated navigation micro system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115824199A (en) * | 2022-11-07 | 2023-03-21 | 北京自动化控制设备研究所 | Microminiature multi-information fusion autonomous navigation system |
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