CN113784534A - Open circuit repairing method and open circuit repairing device - Google Patents
Open circuit repairing method and open circuit repairing device Download PDFInfo
- Publication number
- CN113784534A CN113784534A CN202110932471.6A CN202110932471A CN113784534A CN 113784534 A CN113784534 A CN 113784534A CN 202110932471 A CN202110932471 A CN 202110932471A CN 113784534 A CN113784534 A CN 113784534A
- Authority
- CN
- China
- Prior art keywords
- open circuit
- substrate
- hole
- conductive paste
- jig plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
The invention discloses a method and a device for repairing an open circuit, and relates to the technical field of circuit board manufacturing. Which comprises the following steps: detecting the open circuit position of the substrate; placing a jig plate on a substrate, wherein the jig plate is provided with a through hole, and adjusting the relative position of the jig plate according to the open circuit position of the substrate so as to enable the through hole to be positioned above the open circuit position of the substrate; spraying conductive slurry to the through hole of the jig plate; and coating the conductive paste on the open circuit position of the substrate through the through hole so as to repair the defect at the open circuit position of the substrate. The novel open circuit repairing method and the open circuit repairing device provided by the invention can be used for repairing the circuit broken line position of the circuit board, reducing the rejection rate of the circuit board and improving the production efficiency.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a broken circuit repairing method and a broken circuit repairing device.
Background
A printed circuit board is a circuit substrate having printed wiring for mounting and connecting circuit components. In the manufacturing process of the printed circuit board, an etching process is needed, excessive etching of part of circuits of part of the PCB (printed circuit board) is difficult to avoid during etching, the circuits are disconnected, and in order to retrieve the part of the PCB and avoid waste, the disconnected parts of the PCB circuits need to be repaired.
At present, a common method for repairing a PCB in the market is to use a wire repairing machine to heat a gold wire/silver wire/copper wire to a semi-molten state, and then weld the gold wire/silver wire/copper wire at two ends of a broken circuit to achieve the purpose of connecting the two ends. By adopting the repairing method, obvious repairing traces exist at the repaired part, and the problems of insufficient adhesive force of lines on the base material, easy falling of welding points and the like exist.
Disclosure of Invention
In order to solve at least one problem mentioned in the background art, the invention provides a new open circuit repairing method and an open circuit repairing device, which are used for repairing a circuit broken line of a circuit board, reducing the rejection rate of the circuit board and improving the production efficiency.
The specific technical scheme provided by the invention is as follows:
an open circuit repair method comprising the steps of:
the open circuit position of the substrate is detected,
placing a jig plate on a substrate, wherein the jig plate is provided with a through hole, and adjusting the position of the jig plate according to the open circuit position of the substrate so that the through hole is positioned above the open circuit position of the substrate;
spraying conductive slurry to the through hole of the jig plate;
and coating the conductive paste on the open circuit position of the substrate through the through hole so as to repair the defect at the open circuit position of the substrate.
Optionally, identifying and detecting the open circuit position of the substrate by an image recognition device; the image recognition device comprises a CCD detection mechanism.
Optionally, the diameter of the through hole is larger than the line width of the open position of the substrate.
Optionally, conductive paste is sprayed to the through hole through a paste dropping device, wherein the conductive paste comprises carbon paste, metal paste and modified ceramic paste.
Optionally, the metal paste is a paste containing any one or more of gold powder, silver powder, copper powder, and silver-copper alloy.
Optionally, when the conductive paste is applied to the open circuit position of the substrate through the through hole, a press pin passes through the through hole and reciprocates to press the conductive paste at the through hole down to the open circuit position of the substrate.
Optionally, when the length of the open circuit of the substrate is greater than the diameter of the through hole, the substrate or the jig plate is controlled to move, so that the through hole relatively moves along the open circuit of the substrate.
Optionally, the method further comprises a curing process, wherein the curing process is as follows: after the conductive paste is coated on the open circuit position of the substrate through the through hole, the conductive paste coated on the open circuit position of the substrate is solidified; the curing process adopts heating curing or laser curing.
Optionally, before spraying the conductive paste to the through hole of the jig plate, calculating an open circuit area according to the length and width of the line at the open circuit position, and estimating the volume of the required conductive paste according to the size of the open circuit area.
Optionally, the substrate is a PCB.
The invention also provides a device for repairing broken circuit, which comprises
A controller for controlling the operation of the electronic device,
the mobile platform is used for bearing and moving the substrate to be repaired;
a position detecting device for detecting the open circuit position information of the substrate and transmitting the open circuit position information to the controller;
the slurry coating device comprises a jig plate, a press pin and a driving piece, wherein the jig plate is provided with a through hole, and the controller moves the position of the jig plate or the substrate according to the open circuit position information so that the through hole corresponds to the open circuit position of the substrate; the driving piece provides power to drive the pressing pin to pass through the through hole to do reciprocating motion;
and the curdling device is used for spraying conductive paste to the through hole of the jig plate.
Optionally, the moving platform is an XYZ three-coordinate moving platform.
Optionally, a curing device is arranged on the moving platform and used for curing the conductive paste coated on the substrate; the curing device is a heating device or a laser curing device.
Optionally, the paste applying device is provided with a needle-shaped spray head to spray the conductive paste at the through hole.
Optionally, the curdling device is a dispensing valve, a pipette, a syringe or a drainage needle.
Optionally, the diameter of the through hole is larger than the line width of the broken circuit of the substrate to be repaired; the diameter of the pressing pin is smaller than that of the through hole.
Optionally, the pressing pin has a diameter of 0.02-0.1 mm.
Optionally, the drive member is an electric motor.
Optionally, the driver is a voice coil motor.
The invention provides a method for repairing an open circuit, which is characterized in that a jig plate is placed above a substrate to be repaired, and then conductive slurry is coated on the open circuit position of the substrate through a through hole on the jig plate, so that the repair of the open circuit defect of a circuit of the substrate is realized. The method for repairing the broken circuit can repair the broken circuit of the circuit board, reduce the rejection rate of the circuit board and improve the production efficiency.
The invention provides a broken circuit repairing device which comprises a controller, a moving platform, a position detecting device, a slurry coating device and a slurry dispensing device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for repairing an open circuit according to the present invention;
FIG. 2 is a schematic flow chart of a method for repairing an open circuit according to the present invention;
FIG. 3 is a schematic structural diagram of an open circuit repair device according to the present invention;
FIG. 4 is a schematic view of a portion of a circuit interrupting and repairing apparatus according to the present invention;
fig. 5 is a schematic diagram illustrating a shutdown repair method according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, 2 and 5, the method for repairing an open circuit provided by the present invention generally may include the following steps:
the open position of the substrate 10 is detected,
placing a jig plate 31 on the substrate 10, wherein the jig plate 31 is provided with a through hole 34, and adjusting the relative position of the jig plate 31 and the substrate 10 according to the open circuit position of the substrate 10 so that the through hole 34 is positioned above the open circuit position of the substrate 10;
spraying the conductive paste 20 to the through holes 34 of the jig plate 31;
coating the conductive paste 20 on the open circuit position of the substrate 10 through the through hole to repair the defect at the open circuit position of the substrate 10;
when the conductive paste is applied to the open circuit position of the substrate 10 through the via hole 34 via the 20, the conductive paste passes through the via hole 34 via the presser pin 32. The pressing pins 32 reciprocate to press the conductive paste 20 at the through holes 34 down to the open position of the substrate 10.
Specifically, the substrate 10 may be a circuit board such as a PCB. The following description will be given by taking a PCB as an example, and the circuit breaking repair of other circuit boards is similar to the PCB.
When the disconnection position of the substrate 10 is detected, the disconnection position of the line of the substrate 10 can be detected by recognizing the disconnection position by an image recognition device, a machine vision system, a manual recognition, or the like. The detection means may be any means commonly used by those skilled in the art. Optionally, in a specific embodiment, the image recognition device includes a CCD detection mechanism, which photographs and compares the substrate 10 to be repaired by a CCD camera, so as to determine the open circuit position of the circuit of the substrate 10, and sends the open circuit position information to the controller.
A jig plate 31 is placed on the substrate 10 to be repaired. The jig plate 31 may be a plate-like structure of any shape, and is provided with a through hole 34. The through hole 34 is located above the open position by adjusting the position of the substrate 10 or the jig plate 31, or both. The distance between the substrate 10 and the jig plate 31 is adjusted as needed, and is not limited herein.
Then, the conductive paste 20 is sprayed to the through hole 34 of the jig plate 31 so that the conductive paste 20 surrounds the through hole 34. In this case, the conductive paste 20 is in a liquid (or fluid or paste) state. As shown in fig. 5, the conductive paste 20 forms a droplet shape above the through-hole 34 of the jig plate 31 due to the surface tension. Meanwhile, since the diameter of the through hole 34 is small, the conductive paste 20 temporarily remains on the jig plate 31 under the action of surface tension, and is difficult to drop by itself under the action of gravity.
The conductive paste 20 is applied to the open circuit position of the substrate 10 through the through hole 34 by a pressing pin 32 (or a drainage pin, a tamping rod, etc.). Preferably, the press pin 32 (or a tapping pin, ram, etc. mechanism) is reciprocated through the through hole 34 to increase the efficiency of tapping and pressing the conductive paste 20 down to the open circuit position of the substrate 10. Optionally, the end of the presser pin 32 is a flat surface. Each time the pressing pin 32 passes through the through hole 34, the end plane of the pressing pin 32 is adhered with a part of the conductive paste 20, and when the end of the pressing pin 32 approaches or contacts the open circuit position of the substrate 10, the part of the conductive paste 20 is adhered on the open circuit position of the substrate 10. The end plane of the pressing pin 32 is used for adhering and adhering the conductive paste 20, so that the coating precision (including the coating width and thickness) of the conductive paste 20 can be accurately controlled, the broken circuit repairing trace after curing is consistent with the circuit before repairing, and the repairing trace is weakened.
At this time, the conductive paste 20 is attached to the open circuit position of the substrate 10, and after the coating is finished, the conductive paste 20 connects both ends of the open circuit line of the substrate 10, and after the conductive paste 20 is cured, the defect repair of the open circuit position of the substrate 10 can be completed. The conductive paste 20 may be cured at room temperature, or may be cured at an accelerated rate by heating or other means.
In a preferred embodiment, the open circuit repair method includes a curing process, as shown in fig. 2. That is, after the conductive paste 20 is applied to the open position of the substrate 10, the conductive paste 20 is rapidly cured by heat curing, laser curing, or the like, thereby increasing the efficiency of repairing the open defect.
In the method for repairing a broken circuit provided by the present invention, the conductive paste 20 may be any one of carbon paste, metal paste, and modified ceramic paste. The metal slurry may be any one or more mixed slurry of gold powder, silver powder, copper powder and silver-copper alloy, or gold slurry, silver slurry, copper slurry and silver-copper alloy slurry in a molten state. The conductive paste 20 may be made of a material commonly used by those skilled in the art for repairing a circuit break.
In an alternative embodiment, the diameter of the through hole 34 is larger or slightly larger than the line width at the open circuit position of the substrate 10, so as to avoid the problem that the conductive paste 20 applied to the open circuit position of the substrate 10 is too wide or too narrow when the diameter of the through hole 34 is too large or too small. The diameter of the through hole 34 can be selected according to actual needs. By selecting the appropriate diameter of the through hole 34 and the diameter of the pressing pin 32, the width of the conductive paste 20 applied to the open circuit position of the substrate 10 can be made to be the same as or slightly larger than the line width of the substrate 10 before repair, so that the repair trace is weakened. According to the method for repairing the broken circuit, after the diameter of the through hole 34, the diameter of the press pin 32 and the conductive paste 20 are selected to be proper for repairing, the repairing trace is not obvious, and even the repairing trace cannot be observed by naked eyes.
In an alternative embodiment, when the length of the line break of the substrate 10 is large, the conductive paste 20 is coated only at one point, and the repair of the line break cannot be completed. At this time, the substrate 10 or the jig plate 31 needs to be moved slowly during the coating process, so that the conductive paste 20 is gradually coated along the line defect path at the open circuit of the substrate until the two ends of the line at the open circuit of the substrate 10 are connected, thereby completing the open circuit repair. The substrate 10 or the jig plate 31 may be moved by a controller, and the moving manner and the controlling manner may be well known to those skilled in the art.
Optionally, before spraying the conductive paste 20 to the through holes 34 of the jig plate 31, the method further includes calculating an open circuit area according to the length and width of the line at the open circuit, and calculating (or estimating) the volume of the conductive paste 20 according to the size of the open circuit area and the thickness of the line at the open circuit, so that the amount of the conductive paste 20 applied is just used for repairing the defect at the open circuit, the repairing trace is reduced, and the waste of the conductive paste 20 is avoided.
The principle of the open circuit repairing method provided by the invention is shown in figure 5; that is, through the through hole 34 on the jig plate 31, the needle-like object such as the pressing pin 32 is used for drainage, so that the conductive paste 20 is coated on the open circuit position of the substrate 10, the two ends of the circuit at the open circuit position of the substrate 10 are connected, and after the conductive paste 20 is cured, the open circuit repair can be completed. The conductive paste 20 is prepared according to actual needs, so that the cured conductive paste 20 has strong adhesive force with the substrate 10 and is not easy to fall off.
The method for repairing the broken circuit can repair the broken circuit of the circuit board, reduce the rejection rate of the circuit board and improve the production efficiency.
The present invention also provides a circuit interrupting repair device, as shown in fig. 3-5. Generally, the disconnection repairing apparatus includes a controller (not shown in the drawings), a moving platform 1, a position detecting device 2, a pasting device 3, and a pasting device 4. The moving platform 1 is used for carrying and moving a substrate 10 to be repaired. The position detection device 2 is configured to detect the breaking position information of the substrate 10 and transmit the breaking position information to the controller. The pasting device 3 includes a jig plate 31, a press pin 32, and a driving member 33. The jig plate 31 has a through hole 34. The controller moves the position of the jig plate 31 or the substrate 10 according to the open position information so that the through hole 34 corresponds to the open position of the substrate 10. The paste applying device 4 is used for spraying the conductive paste 20 to the through holes 34 of the jig plate 31. The driving member 33 provides power to drive the pressing pin 32 to pass through the through hole 34 to reciprocate, so that the conductive paste 20 at the through hole 34 is guided to the open circuit position of the substrate 10, and the open circuit repair can be realized after the conductive paste 20 is cured.
Specifically, the position detection device 2 may be an image recognition device, a machine vision system, a manual recognition, or the like. Which recognizes and detects the open position of the circuit of the substrate 10 by an image recognition device, a machine vision system, a manual recognition, or the like. The detection means may be any means commonly used by those skilled in the art. Optionally, in a specific embodiment, the image recognition device includes a CCD detection mechanism, which photographs and compares the substrate 10 to be repaired by a CCD camera, so as to determine the open circuit position of the circuit of the substrate 10, and sends the open circuit position information to the controller.
The moving platform 1 is an XYZ three-coordinate moving platform. An XYZ three-coordinate moving platform, also called a three-coordinate high-precision moving platform, is a platform for realizing precise movement in X, Y, Z three directions. The XYZ three-coordinate moving platform mainly comprises an X-axis moving part, a Y-axis moving part and a Z-axis moving part. The shaft couplings of the shafts can be used for being connected with servo motors to realize automatic adjustment, and can also be directly connected with a rotating disc to realize manual adjustment. In the present invention, the controller controls the XYZ stage to move according to the open position information provided by the position detection device 2, so as to adjust the position of the substrate 10 above the XYZ stage, and finally, the open position of the substrate 10 corresponds to the through hole 34 of the jig plate 31, so that the open position of the substrate 10 is located right below the through hole 34.
The paste applying device 4 is a device having a needle-shaped nozzle to apply the conductive paste 20 to the through hole 34 such that the conductive paste 20 surrounds the through hole 34. The curdling device 4 is one of a curdling valve, a pipette, a syringe or a drainage needle. Preferably a glue dispensing valve, which is common in industrial production in the field, and the amount of sprayed paste is relatively precise and easy to control. The number of the curdling devices 4 can be one or more, and is selected according to actual needs.
In one embodiment, the jig plate 31 may be a plate-shaped structure having any shape, and is provided with a through hole 34. The through hole 34 is located above the open position by adjusting the position of the substrate 10 or the jig plate 31, or both. The distance between the substrate 10 and the jig plate 31 is adjusted as needed, and is not limited herein. The diameter of the through hole 34 is larger or slightly larger than the line width of the broken circuit of the substrate 10 to be repaired, so as to avoid the problem that the conductive paste 20 coated on the broken circuit position of the substrate 10 is too wide when the diameter of the through hole 34 is too large.
The diameter of the press pins 32 is smaller than the diameter of the through holes 34 in order to better drain and press the conductive paste 20 down to the open circuit position of the lines of the substrate 10. The drive member 33 is a motor or other drive means. Alternatively, the presser pin 32 may have a diameter of 0.02-0.1mm and the drive member 33 may be a voice coil motor. The voice coil motor has the characteristics of simple structure, small volume, high speed, high acceleration response speed and the like, and is very suitable for driving and controlling the small-diameter pressing pin 32.
In one embodiment, a curing device (not shown) is disposed on the movable platform 1, and is used for rapidly curing the conductive paste 20 coated on the substrate 10. Optionally, the curing device is a heating device, a laser curing device or other devices capable of accelerating the curing speed of the conductive paste 20. The heating device heats the substrate 10 to raise the temperature of the conductive paste 20 coated on the open circuit position of the substrate 10, so that the rapid curing is realized, and the open circuit repairing efficiency is improved. The heating device can be selected from resistance heating, electric induction heating and the like, and the heating temperature and time are controlled by the controller. The laser curing apparatus heats the conductive paste 20 applied to the open circuit position of the substrate 10 by laser irradiation, or realizes rapid curing of the conductive paste 20 by means of photocuring (for example, a photosensitive liquid phase curing method) or the like, thereby improving the efficiency of open circuit repair.
The open circuit repairing device provided by the invention has the advantages of simple structure, convenience in repairing, strong adhesive force and unobvious repairing traces.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (15)
1. An open circuit repair method, comprising the steps of:
the open circuit position of the substrate is detected,
placing a jig plate on a substrate, wherein the jig plate is provided with a through hole, and adjusting the relative position of the jig plate according to the open circuit position of the substrate so as to enable the through hole to be positioned above the open circuit position of the substrate;
spraying conductive slurry to the through hole of the jig plate;
coating the conductive paste on the open circuit position of the substrate through the through hole so as to repair the defect at the open circuit position of the substrate;
the substrate is a PCB, when the conductive paste is coated on the open circuit position of the substrate through the through hole, the conductive paste passes through the through hole through a press pin, and the press pin reciprocates to press the conductive paste at the through hole down to the open circuit position of the substrate.
2. The open circuit repairing method according to claim 1, wherein the open circuit position of said substrate is recognized and detected by an image recognition device; the image recognition device comprises a CCD detection mechanism.
3. The open circuit repair method according to claim 1, wherein the diameter of the through hole is larger than a line width of the substrate at the open circuit position.
4. The open circuit repair method according to claim 1, wherein a conductive paste is sprayed to the through hole by a paste dropping device, and the conductive paste includes carbon paste, metal paste, and modified ceramic paste.
5. The open circuit repairing method according to claim 4, wherein said metal paste is a paste comprising any one or more of gold powder, silver powder, copper powder, and silver-copper alloy.
6. The open circuit repairing method according to claim 1, wherein when the length of the open circuit of the substrate is greater than the diameter of the through hole, the substrate or the jig plate is controlled to move so that the through hole moves relatively along the open circuit of the substrate.
7. The open circuit repair method of claim 1, further comprising a curing process, the curing process being: after the conductive paste is coated on the open circuit position of the substrate through the through hole, the conductive paste coated on the open circuit position of the substrate is solidified; the curing process adopts heating curing or laser curing.
8. The open circuit repairing method according to claim 1, further comprising calculating an open circuit area according to a length and a width of a line at the open circuit, and estimating a volume of the conductive paste required according to a size of the open circuit area, before spraying the conductive paste to the through hole of the jig plate.
9. An open circuit repair device is characterized by comprising
A controller for controlling the operation of the electronic device,
the mobile platform is used for bearing and moving the substrate to be repaired;
a position detecting device for detecting the open circuit position information of the substrate and transmitting the open circuit position information to the controller;
the slurry coating device comprises a jig plate, a press pin and a driving piece, wherein the jig plate is provided with a through hole, and the controller moves the position of the jig plate or the substrate according to the open circuit position information so that the through hole corresponds to the open circuit position of the substrate; the driving piece provides power to drive the pressing pin to pass through the through hole to do reciprocating motion;
and the curdling device is used for spraying conductive paste to the through hole of the jig plate.
10. The circuit interrupting repair device of claim 9 wherein the translation stage is an XYZ three coordinate translation stage.
11. The open circuit repair device according to claim 9 or 10, wherein a curing device is provided on the moving platform for curing the conductive paste applied on the substrate; the curing device is a heating device or a laser curing device.
12. The open circuit repair device according to claim 9, wherein the paste dispensing device has a needle-like spray head to spray the conductive paste at the through hole; the curdling device is a curdling valve, a pipette, an injector or a drainage needle.
13. The open circuit repair device of claim 9, wherein the through hole has a diameter larger than a line width at an open circuit of the substrate to be repaired; the diameter of the pressing pin is smaller than that of the through hole.
14. The open circuit repair device according to claim 13, wherein the press pin has a diameter of 0.02-0.1 mm.
15. The circuit interrupting repair device of claim 9 wherein said drive member is a motor and said drive member is a voice coil motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110932471.6A CN113784534A (en) | 2021-08-13 | 2021-08-13 | Open circuit repairing method and open circuit repairing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110932471.6A CN113784534A (en) | 2021-08-13 | 2021-08-13 | Open circuit repairing method and open circuit repairing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113784534A true CN113784534A (en) | 2021-12-10 |
Family
ID=78837935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110932471.6A Pending CN113784534A (en) | 2021-08-13 | 2021-08-13 | Open circuit repairing method and open circuit repairing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113784534A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116845170A (en) * | 2023-08-28 | 2023-10-03 | 芯体素(杭州)科技发展有限公司 | Bonding pad repairing method and repairing equipment based on glass substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008192901A (en) * | 2007-02-06 | 2008-08-21 | Ntn Corp | Pattern-modifying apparatus and coating unit used therefor |
| JP2013171985A (en) * | 2012-02-21 | 2013-09-02 | Auto Network Gijutsu Kenkyusho:Kk | Method of manufacturing circuit board used for circuit component, and circuit board |
| CN111405776A (en) * | 2020-02-25 | 2020-07-10 | 珠海杰赛科技有限公司 | Method for repairing solder mask of printed circuit board |
| CN111741608A (en) * | 2019-03-25 | 2020-10-02 | 深圳市百柔新材料技术有限公司 | Method for repairing conductive circuit |
| CN113038729A (en) * | 2019-12-09 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Method for repairing circuit of printed circuit board |
-
2021
- 2021-08-13 CN CN202110932471.6A patent/CN113784534A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008192901A (en) * | 2007-02-06 | 2008-08-21 | Ntn Corp | Pattern-modifying apparatus and coating unit used therefor |
| JP2013171985A (en) * | 2012-02-21 | 2013-09-02 | Auto Network Gijutsu Kenkyusho:Kk | Method of manufacturing circuit board used for circuit component, and circuit board |
| CN111741608A (en) * | 2019-03-25 | 2020-10-02 | 深圳市百柔新材料技术有限公司 | Method for repairing conductive circuit |
| CN113038729A (en) * | 2019-12-09 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Method for repairing circuit of printed circuit board |
| CN111405776A (en) * | 2020-02-25 | 2020-07-10 | 珠海杰赛科技有限公司 | Method for repairing solder mask of printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116845170A (en) * | 2023-08-28 | 2023-10-03 | 芯体素(杭州)科技发展有限公司 | Bonding pad repairing method and repairing equipment based on glass substrate |
| CN116845170B (en) * | 2023-08-28 | 2023-12-15 | 芯体素(杭州)科技发展有限公司 | Bonding pad repairing method and repairing equipment based on glass substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6230619B1 (en) | Printing method and printing apparatus | |
| US7513036B2 (en) | Method of controlling contact load in electronic component mounting apparatus | |
| KR100995983B1 (en) | Cross printing method and apparatus of circuit board | |
| US7726546B2 (en) | Bonding apparatus and bonding method | |
| CN202861569U (en) | Circuit board welding-based welding system | |
| CN109906127B (en) | Three-dimensional shaped object manufacturing device and three-dimensional shaped object manufacturing method | |
| JP3066383B1 (en) | Cream solder printing apparatus and printing method thereof | |
| CN113784534A (en) | Open circuit repairing method and open circuit repairing device | |
| EP1829639A1 (en) | Solder precoating method and work for electronic device | |
| US20050031776A1 (en) | Method and device for applying material to a workpiece | |
| KR20070032565A (en) | Apparatus for Melting and Adhering and Method for Melting and Adhering Solder Ball using it | |
| KR100269910B1 (en) | Method for adhering a member and apparatus for adhering a member | |
| CN102699463A (en) | Circuit-board welding based welding method and system | |
| CN211102022U (en) | Piezoelectric-driven automatic jet printing system | |
| JP2006344871A (en) | Method and apparatus of reflow soldering | |
| JP2510688B2 (en) | Excess solder removal equipment | |
| Shu et al. | Direct drop-on-demand printing of molten solder bumps on enig finishing at ambient conditions through starjet technology | |
| CN110202234A (en) | A kind of Piezoelectric Driving automatic spray printing system | |
| JP2005005460A (en) | Solder removing method, and method and device for repairing component | |
| CN114446838A (en) | Ball mounting method and device based on 3D printing process, electronic equipment and storage medium | |
| JP2006156443A (en) | Electronic component mounting method | |
| TW202218212A (en) | Chip repairing method capable of desoldering and removing a defective chip from a carrier and soldering and replacing with a good chip | |
| JPH05267838A (en) | Method and apparatus for supplying trace amount of solder | |
| JPH08307047A (en) | Solder precoated circuit board, method and apparatus for solder precoating | |
| CN112317908A (en) | Elastic PIN transfer printing type soldering flux coating method and process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |