CN113784530A - Circuit board processing method and system - Google Patents
Circuit board processing method and system Download PDFInfo
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- CN113784530A CN113784530A CN202111074393.7A CN202111074393A CN113784530A CN 113784530 A CN113784530 A CN 113784530A CN 202111074393 A CN202111074393 A CN 202111074393A CN 113784530 A CN113784530 A CN 113784530A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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Abstract
The invention provides a processing method and a system of a circuit board. The method comprises the following steps: acquiring an electronic diagram of a circuit board to be processed and acquiring information data of a photoetching position of the circuit board; classifying the lines to be processed according to the information data of the photoetching position of the circuit board; and respectively carrying out photoetching processing according to the lines with different widths. The system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring an electronic map of a circuit board to be processed and acquiring information data of a photoetching position of the circuit board; the classification module is used for classifying the lines to be processed according to the information data of the photoetching position of the circuit board; and the processing module is used for respectively carrying out photoetching processing according to the lines with different widths.
Description
Technical Field
The invention provides a method and a system for processing a circuit board, and belongs to the technical field of circuit board processing.
Background
With the continuous improvement of the performance requirement of the circuit board, the size of the integrated circuit is smaller and smaller, and the photoetching-etching process becomes the most core process in the manufacture of the circuit board, however, in the photoetching process of the circuit board circuit, the circuit board is often processed according to the line sequence of the circuit, the processing parameters need to be frequently changed and adjusted in the change process of the wide and narrow circuit, so that the load of a processing system is overlarge, the processing errors are easily generated by frequently changing and adjusting the circuit, and particularly, when the parameter adjustment and the change are delayed, the problem that the processing errors at the joint of the wide and narrow circuit are easily increased occurs.
Disclosure of Invention
The invention provides a processing method and a system of a circuit board, which are used for solving the problems that the processing is often carried out according to the line sequence of the circuit line in the photoetching processing process of the circuit board line, the processing system is overloaded due to the frequent replacement and adjustment of processing parameters in the process of changing a wide line and a narrow line, and the processing error is easily caused by the frequent replacement and adjustment of the line, and adopt the following technical scheme:
a method of processing a circuit board, the method comprising:
acquiring an electronic diagram of a circuit board to be processed and acquiring information data of a photoetching position of the circuit board;
classifying the lines to be processed according to the information data of the photoetching position of the circuit board;
and respectively carrying out photoetching processing according to the lines with different widths.
Further, classifying the lines to be processed according to the information data of the photoetching position of the circuit board, which comprises the following steps:
obtaining the width value of a line in a circuit to be processed of the circuit board according to the information data of the photoetching position of the circuit board;
classifying the circuit boards to be processed with the same width value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed;
coding the circuit board to be processed in the sequence of the width values from narrow to wide from first to last, and pairing the codes with the corresponding circuit board to be processed to obtain an electronic diagram of the circuit board to be processed with the number marks and information data of the photoetching processing position of the circuit board.
Further, the photolithography process is performed according to the lines of different width types, and includes:
determining the photoetching processing sequence of the circuit board circuit according to the electronic diagram of the circuit board to be processed with the serial number mark and the information data of the photoetching processing position of the circuit board;
and carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
Further, the determining the lithography processing order of the circuit board lines comprises:
sequentially extracting the lines to be processed of the circuit boards without width change connection according to the sequence from narrow to wide, extracting the positions and corresponding numbers of the lines to be processed of the circuit boards, and taking the lines to be processed of the circuit boards without width change connection as a first batch of lines to be processed of the circuit boards for photoetching;
sequentially extracting the lines to be processed of the circuit boards with the width change connection, and respectively setting line processing reserved sections on the lines to be processed of the circuit board on the wide side and the lines to be processed of the circuit board on the narrow side in the lines to be processed of the circuit boards with the width change connection; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing; the length of the line processing reserved section on the line to be processed of the circuit board on the wide side and the line to be processed of the circuit board on the narrow side is obtained through the following formula:
wherein L iszThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the narrow side is shown; l iskThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the wide side is represented; dzThe width value of a circuit to be processed of the circuit board on the narrow side is represented; dkAnd the width value of the circuit board to be processed on the wide side is shown.
Sequentially extracting the lines to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the narrow side of the two lines to be processed of the circuit boards with width change connection except the line processing reserved section as a second batch of the lines to be processed of the circuit boards with photoetching processing;
extracting the position and the corresponding serial number of a circuit board to-be-processed line corresponding to the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are connected with each other in width change in the circuit boards to-be-processed lines which are connected with each other in width change, and taking the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are connected with each other in width change except the line processing reserved section as a third batch of circuit board to-be-processed lines which are subjected to photoetching processing;
and taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching.
Further, the lithography processing of the circuit board lines is performed according to the lithography processing order of the circuit board lines, and comprises:
sequentially carrying out photoetching processing on the circuit boards to be processed according to the sequence of the first batch of circuit boards to be processed by photoetching, the second batch of circuit boards to be processed by photoetching and the third batch of circuit boards to be processed by photoetching;
after finishing the circuit to be processed of the first batch of circuit boards to be subjected to photoetching, the circuit to be processed of the second batch of circuit boards to be subjected to photoetching and the circuit to be processed of the third batch of circuit boards to be subjected to photoetching, the circuit to be processed of the fourth batch of circuit boards to be subjected to photoetching is subjected to photoetching, wherein the photoetching process of the circuit to be processed of the fourth batch of circuit boards to be subjected to photoetching comprises the following steps:
sequentially carrying out photoetching processing on the circuit board to be processed on the narrower side in each pair of width-to-width connected circuit processing reserved sections;
after the photoetching processing of all the lines to be processed of the circuit board on the narrower side in all the lines to be processed of the circuit board subjected to photoetching processing in the fourth batch is finished; and sequentially carrying out photoetching processing on the circuit board to be processed on the wider side in each pair of width-to-width connected circuit processing reserved sections until the circuit board to be processed corresponding to all the circuit processing reserved sections are subjected to photoetching processing.
A system for processing a circuit board, the system comprising:
the acquisition module is used for acquiring an electronic diagram of the circuit board to be processed and acquiring information data of a photoetching position of the circuit board;
the classification module is used for classifying the lines to be processed according to the information data of the photoetching position of the circuit board;
and the processing module is used for respectively carrying out photoetching processing according to the lines with different widths.
Further, the classification module includes:
the width acquisition module is used for acquiring the width numerical value of a line in the circuit to be processed of the circuit board according to the information data of the photoetching position of the circuit board;
the classification module is used for classifying the circuit boards to be processed with the same width numerical value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed;
and the coding module is used for respectively coding the circuit board to be processed according to the sequence of the width values from narrow to wide from first to last, pairing the codes with the corresponding circuit board to be processed and obtaining the electronic diagram of the circuit board to be processed with the number marks and the information data of the photoetching processing position of the circuit board.
Further, the processing module includes:
the determining module is used for determining the photoetching processing sequence of the circuit board circuit according to the electronic diagram of the circuit board to be processed with the serial number mark and the information data of the photoetching processing position of the circuit board;
and the photoetching processing module is used for carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
Further, the determining module includes:
the first batch of determining modules are used for sequentially extracting the circuit boards to be processed without width change connection according to the sequence from narrow to wide, extracting the positions and the corresponding numbers of the circuit boards to be processed, and taking the circuit boards to be processed without width change connection as the first batch of circuit boards to be processed for photoetching;
the reserved section determining module is used for sequentially extracting the circuit boards to be processed with the width change connection, and setting a line processing reserved section on the circuit board to be processed on the wide side and the circuit board to be processed on the narrow side in the circuit boards to be processed with the width change connection respectively; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing; the length of the line processing reserved section on the line to be processed of the circuit board on the wide side and the line to be processed of the circuit board on the narrow side is obtained through the following formula:
wherein L iszThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the narrow side is shown; l iskThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the wide side is represented; dzThe width value of a circuit to be processed of the circuit board on the narrow side is represented; dkAnd the width value of the circuit board to be processed on the wide side is shown.
The second batch of determining modules are used for sequentially extracting the lines to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the lines to be processed of the circuit boards with the narrow side except the line processing reserved section in the two lines to be processed of the circuit boards with width change connection as the second batch of lines to be processed of the circuit boards with photoetching processing;
the third batch of determining modules are used for extracting the positions and the corresponding serial numbers of the circuit board to-be-processed lines corresponding to the circuit board to-be-processed lines on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection, and taking the circuit board to-be-processed lines on the wide side except the line processing reserved section in the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection as a third batch of circuit board to-be-processed lines subjected to photoetching processing;
and the fourth batch of determination modules are used for taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching processing.
Further, the photolithography processing module includes:
the first processing module is used for sequentially carrying out photoetching processing on the circuit board to be processed according to the sequence of a first batch of circuit board to be processed circuits to be subjected to photoetching processing, a second batch of circuit board to be processed circuits to be subjected to photoetching processing and a third batch of circuit board to be processed circuits to be subjected to photoetching processing;
the second processing module is used for carrying out photoetching processing on the fourth batch of circuit boards to be processed, wherein the fourth batch of circuit boards to be processed comprises the following steps:
sequentially carrying out photoetching processing on the circuit board to be processed on the narrower side in each pair of width-to-width connected circuit processing reserved sections;
after the photoetching processing of all the lines to be processed of the circuit board on the narrower side in all the lines to be processed of the circuit board subjected to photoetching processing in the fourth batch is finished; and sequentially carrying out photoetching processing on the circuit board to be processed on the wider side in each pair of width-to-width connected circuit processing reserved sections until the circuit board to be processed corresponding to all the circuit processing reserved sections are subjected to photoetching processing.
The invention has the beneficial effects that:
according to the circuit board processing method and system provided by the invention, by means of carrying out photoetching processing on circuits with uniform width values in batches according to the wide and narrow circuits, the parameter adjusting times of a processing system in the circuit board processing process can be effectively reduced, errors caused by the increase of the system parameter adjusting times are effectively reduced, the accuracy and precision of circuit board processing are improved, the product precision and product quality can be greatly improved under the condition of high-precision circuit board processing, the defective rate is reduced, and the cost is effectively saved. Meanwhile, the circuit lines at the joint of the wide and narrow lines are subjected to targeted independent wide and narrow batch processing in a mode of setting a line processing reserved section, so that the processing error and roughness of the joint of the wide and narrow lines caused by time delay generated by system adjustment parameters at the joint of the wide and narrow lines can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced.
Drawings
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a system block diagram of the system of the present invention;
FIG. 3 is a schematic diagram of the position of the reserved section for line processing according to the present invention;
(1, a line processing reserved section; 2, a circuit board to-be-processed line).
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
The invention provides a processing method of a circuit board, as shown in fig. 1, the method comprises the following steps:
s1, acquiring an electronic diagram of the circuit board to be processed, and acquiring information data of the photoetching position of the circuit board;
s2, classifying the circuits to be processed according to the information data of the photoetching positions of the circuit board;
and S3, respectively carrying out photoetching processing according to the circuits with different widths.
The method for classifying the lines to be processed according to the information data of the photoetching position of the circuit board comprises the following steps:
s201, obtaining a width numerical value of a circuit in a circuit to be processed of the circuit board according to the information data of the photoetching position of the circuit board;
s202, classifying the circuit boards to be processed with the same width numerical value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed;
s203, coding the circuit board to be processed from first to last according to the sequence of the width values from narrow to wide, and pairing the codes with the corresponding circuit board to be processed to obtain the electronic diagram of the circuit board to be processed with the number marks and the information data of the photoetching processing position of the circuit board.
Wherein, according to the different width line of kind respectively carry out photoetching and processing, include:
s301, determining the photoetching processing sequence of the circuit board circuit according to the electronic diagram of the circuit board to be processed with the serial number mark and the information data of the photoetching processing position of the circuit board;
s302, carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
The working principle of the technical scheme is as follows: firstly, acquiring an electronic diagram of a circuit board to be processed, and acquiring information data of a photoetching position of the circuit board; then, classifying the lines to be processed according to the information data of the photoetching position of the circuit board; and finally, respectively carrying out photoetching processing according to the lines with different widths.
The method for classifying the lines to be processed according to the information data of the photoetching position of the circuit board comprises the following steps:
firstly, according to the information data of the photoetching position of the circuit board, obtaining the width value of a circuit in a circuit to be processed of the circuit board; then, classifying the circuit boards to be processed with the same width value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed; and finally, coding the circuit board to be processed from first to last according to the sequence of the width values from narrow to wide, and pairing the codes with the corresponding circuit board to be processed to obtain the electronic diagram of the circuit board to be processed with the number marks and the information data of the photoetching processing position of the circuit board.
Wherein, according to the different width line of kind respectively carry out photoetching and processing, include:
firstly, determining the photoetching processing sequence of circuit board lines according to an electronic diagram of a circuit board to be processed with a serial number mark and information data of a photoetching processing position of the circuit board; and then, carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
The effect of the above technical scheme is as follows: the method can effectively reduce the parameter adjusting times of a processing system in the circuit board processing process, effectively reduce errors caused by the increase of the parameter adjusting times of the system, improve the accuracy and precision of circuit board processing, greatly improve the precision and product quality of products under the condition of high-precision circuit board processing, reduce the defective percentage and effectively save the cost. Meanwhile, the circuit lines at the joint of the wide and narrow lines are subjected to targeted independent wide and narrow batch processing in a mode of setting a line processing reserved section, so that the processing error and roughness of the joint of the wide and narrow lines caused by time delay generated by system adjustment parameters at the joint of the wide and narrow lines can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced.
In one embodiment of the present invention, as shown in fig. 3, the determining the photolithography processing sequence of the circuit board lines includes:
s3011, sequentially extracting the circuit boards to be processed without width change connection according to the sequence from narrow to wide, extracting the positions and corresponding numbers of the circuit boards to be processed, and taking the circuit boards to be processed without width change connection as a first batch of circuit boards to be processed for photoetching;
s3012, sequentially extracting the circuit boards to be processed with the width change connection, and respectively setting a circuit processing reserved section on the circuit board to be processed on the wide side and the circuit board to be processed on the narrow side in the circuit boards to be processed with the width change connection; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing; the length of the line processing reserved section on the line to be processed of the circuit board on the wide side and the line to be processed of the circuit board on the narrow side is obtained through the following formula:
wherein L iszThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the narrow side is shown; l iskThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the wide side is represented; dzThe width value of a circuit to be processed of the circuit board on the narrow side is represented; dkAnd the width value of the circuit board to be processed on the wide side is shown.
S3013, sequentially extracting the circuits to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the circuits to be processed of the narrow circuit boards from two circuits to be processed of the circuit boards with width change connection from the circuits to be processed of the circuit boards with width change connection, and taking the circuits to be processed of the narrow circuit boards except the reserved circuit processing section from one narrow side of the two circuits to be processed of the two circuits to be processed of the circuit boards with width change connection as the circuits to be processed of the circuit boards to be processed of the second batch of photoetching processing;
s3014, extracting the position and the corresponding number of the circuit board to-be-processed line corresponding to the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection, and taking the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection except the line processing reserved section as a third batch of circuit board to-be-processed lines which are subjected to photoetching processing;
and S3015, taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth circuit board to-be-processed circuit for photoetching processing.
The working principle of the technical scheme is as follows: firstly, sequentially extracting the lines to be processed of the circuit boards without width change connection according to the sequence from narrow to wide, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards, and taking the lines to be processed of the circuit boards without width change connection as a first batch of lines to be processed of the circuit boards for photoetching; then, circuit boards to be processed with width change connection are sequentially extracted, and circuit processing reserved sections are respectively arranged on the circuit board to be processed on the wide side and the circuit board to be processed on the narrow side in the circuit boards to be processed with width change connection; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing; sequentially extracting the lines to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the narrow side of the two lines to be processed of the circuit boards with width change connection except the line processing reserved section as a second batch of lines to be processed of the circuit boards with photoetching processing; then, extracting the position and the corresponding number of the circuit board to-be-processed line corresponding to the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit board to-be-processed lines which are subjected to width change connection, and taking the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit board to-be-processed lines which are subjected to width change connection except the line processing reserved section as a third batch of circuit board to-be-processed lines which are subjected to photoetching processing; and finally, taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching.
The effect of the above technical scheme is as follows: the method can effectively reduce the parameter adjusting times of a processing system in the circuit board processing process, effectively reduce errors caused by the increase of the parameter adjusting times of the system, improve the accuracy and precision of circuit board processing, greatly improve the precision and product quality of products under the condition of high-precision circuit board processing, reduce the defective percentage and effectively save the cost. Meanwhile, the circuit lines at the joint of the wide and narrow lines are subjected to targeted independent wide and narrow batch processing in a mode of setting a line processing reserved section, so that the processing error and roughness of the joint of the wide and narrow lines caused by time delay generated by system adjustment parameters at the joint of the wide and narrow lines can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced.
Meanwhile, through the arrangement of the reserved section, reservation can be provided for processing at the wide-narrow connector for targeted processing, the number of times of system parameter change can be effectively reduced through single-side sequential processing of the wide and narrow sides in the reserved section, and the photoetching processing error at the wide-narrow connection connector can be effectively reduced from a narrow-to-wide processing mode. On the other hand, the reserved section obtained by the formula can ensure that sufficient allowance is reserved for processing the interface at the wide-narrow joint, simultaneously ensure the maximum processing degree of the circuit line at the non-joint interface to the maximum extent, and effectively improve the processing efficiency of the circuit board; the reserved section obtained by the formula can effectively balance the processing allowance of the targeted processing at the reserved joint and the fullness of the circuit lines at the non-joint positions in the first batch and the second batch, and the reasonability of the reserved section length setting for ensuring the processing efficiency and precision of the circuit board is effectively improved.
According to one embodiment of the invention, the photoetching of the circuit board lines is carried out according to the photoetching processing sequence of the circuit board lines, and the method comprises the following steps:
the method comprises the following steps of firstly, sequentially carrying out photoetching processing on the circuit board to be processed according to the sequence of a first batch of circuit board to be processed circuits to be subjected to photoetching processing, a second batch of circuit board to be processed circuits to be subjected to photoetching processing and a third batch of circuit board to be processed circuits to be subjected to photoetching processing;
the second step, after accomplishing the circuit that circuit board that the first batch carried out photoetching process waited to process the circuit, the circuit board that the second batch carried out photoetching process waited to process the circuit and the circuit board that the third batch carried out photoetching process waited to process the circuit, wait to process the circuit to carrying out photoetching process to the circuit board that carries out photoetching process of the fourth batch, wherein, the circuit board that carries out photoetching process waited to process the circuit at the fourth batch carries out photoetching process waits to process the circuit and carries out photoetching process and includes: sequentially carrying out photoetching processing on the circuit board to be processed on the narrower side in each pair of width-to-width connected circuit processing reserved sections; after the photoetching processing of all the lines to be processed of the circuit board on the narrower side in all the lines to be processed of the circuit board subjected to photoetching processing in the fourth batch is finished; and sequentially carrying out photoetching processing on the circuit board to be processed on the wider side in each pair of width-to-width connected circuit processing reserved sections until the circuit board to be processed corresponding to all the circuit processing reserved sections are subjected to photoetching processing.
The effect of the above technical scheme is as follows: the circuit line of wide and narrow line junction is subjected to targeted independent wide and narrow batch processing by setting the line processing reserved section, so that the processing error and roughness of the wide and narrow line junction caused by time delay generated by system adjusting parameters of the wide and narrow junction can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced. Meanwhile, through the arrangement of the reserved section, reservation can be provided for processing at the wide-narrow connector for targeted processing, the number of times of system parameter change can be effectively reduced through single-side sequential processing of the wide and narrow sides in the reserved section, and the photoetching processing error at the wide-narrow connection connector can be effectively reduced from a narrow-to-wide processing mode.
An embodiment of the present invention provides a processing system of a circuit board, as shown in fig. 2, the system includes:
the acquisition module is used for acquiring an electronic diagram of the circuit board to be processed and acquiring information data of a photoetching position of the circuit board;
the classification module is used for classifying the lines to be processed according to the information data of the photoetching position of the circuit board;
and the processing module is used for respectively carrying out photoetching processing according to the lines with different widths.
Wherein the classification module comprises:
the width acquisition module is used for acquiring the width numerical value of a line in the circuit to be processed of the circuit board according to the information data of the photoetching position of the circuit board;
the classification module is used for classifying the circuit boards to be processed with the same width numerical value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed;
and the coding module is used for respectively coding the circuit board to be processed according to the sequence of the width values from narrow to wide from first to last, pairing the codes with the corresponding circuit board to be processed and obtaining the electronic diagram of the circuit board to be processed with the number marks and the information data of the photoetching processing position of the circuit board.
Wherein, the processing module includes:
the determining module is used for determining the photoetching processing sequence of the circuit board circuit according to the electronic diagram of the circuit board to be processed with the serial number mark and the information data of the photoetching processing position of the circuit board;
and the photoetching processing module is used for carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
The working principle of the technical scheme is as follows: firstly, acquiring an electronic diagram of a circuit board to be processed through an acquisition module, and acquiring information data of a photoetching position of the circuit board; then, classifying the lines to be processed by utilizing a classification module according to the information data of the photoetching position of the circuit board; and finally, respectively carrying out photoetching processing according to the lines with different widths by adopting a processing module.
The operation process of the classification module comprises the following steps:
firstly, acquiring a width numerical value of a line in a circuit to be processed of the circuit board according to information data of a photoetching position of the circuit board by a width acquisition module; then, classifying the circuit boards to be processed with the same width numerical value into a class of circuit boards to be processed through a classification module, and obtaining a plurality of types of circuit boards to be processed; and then, coding the circuit board to be processed by a coding module from first to last according to the sequence of the width values from narrow to wide, and pairing the codes with the corresponding circuit board to be processed to obtain an electronic diagram of the circuit board to be processed with the number marks and information data of the photoetching processing position of the circuit board.
Wherein, the processing procedure of the processing module comprises:
firstly, determining the photoetching processing sequence of circuit board lines by a determining module according to an electronic diagram of a circuit board to be processed with a serial number mark and information data of a photoetching processing position of the circuit board;
and then, carrying out photoetching processing on the circuit board circuit by utilizing a photoetching processing module according to the photoetching processing sequence of the circuit board circuit.
The effect of the above technical scheme is as follows: the method can effectively reduce the parameter adjusting times of a processing system in the circuit board processing process, effectively reduce errors caused by the increase of the parameter adjusting times of the system, improve the accuracy and precision of circuit board processing, greatly improve the precision and product quality of products under the condition of high-precision circuit board processing, reduce the defective percentage and effectively save the cost. Meanwhile, the circuit lines at the joint of the wide and narrow lines are subjected to targeted independent wide and narrow batch processing in a mode of setting a line processing reserved section, so that the processing error and roughness of the joint of the wide and narrow lines caused by time delay generated by system adjustment parameters at the joint of the wide and narrow lines can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced.
In one embodiment of the present invention, the determining module includes:
the first batch of determining modules are used for sequentially extracting the circuit boards to be processed without width change connection according to the sequence from narrow to wide, extracting the positions and the corresponding numbers of the circuit boards to be processed, and taking the circuit boards to be processed without width change connection as the first batch of circuit boards to be processed for photoetching;
the reserved section determining module is used for sequentially extracting the circuit boards to be processed with the width change connection, and setting a line processing reserved section on the circuit board to be processed on the wide side and the circuit board to be processed on the narrow side in the circuit boards to be processed with the width change connection respectively; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing; the length of the line processing reserved section on the line to be processed of the circuit board on the wide side and the line to be processed of the circuit board on the narrow side is obtained through the following formula:
wherein L iszThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the narrow side is shown; l iskThe length corresponding to a line processing reserved section on a line to be processed of the circuit board on the wide side is represented; dzThe width value of a circuit to be processed of the circuit board on the narrow side is represented; dkAnd the width value of the circuit board to be processed on the wide side is shown.
The second batch of determining modules are used for sequentially extracting the lines to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the lines to be processed of the circuit boards with the narrow side except the line processing reserved section in the two lines to be processed of the circuit boards with width change connection as the second batch of lines to be processed of the circuit boards with photoetching processing;
the third batch of determining modules are used for extracting the positions and the corresponding serial numbers of the circuit board to-be-processed lines corresponding to the circuit board to-be-processed lines on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection, and taking the circuit board to-be-processed lines on the wide side except the line processing reserved section in the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection as a third batch of circuit board to-be-processed lines subjected to photoetching processing;
and the fourth batch of determination modules are used for taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching processing.
The working principle of the technical scheme is as follows: firstly, sequentially extracting the circuit boards to be processed without width change connection through a first batch of determining modules according to the sequence from narrow to wide, extracting the positions and corresponding numbers of the circuit boards to be processed, and taking the circuit boards to be processed without width change connection as a first batch of circuit boards to be processed for photoetching; then, sequentially extracting the circuit boards to be processed with the width change connection by using a reserved section determining module, and respectively setting a line processing reserved section on the circuit board to be processed on the wide side and the circuit board to be processed on the narrow side in the circuit boards to be processed with the width change connection; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing; then, sequentially extracting the lines to be processed of the circuit boards with width change connection by adopting a second batch of determining modules, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the lines to be processed of the circuit boards except the line processing reserved section from the narrow side of the two lines to be processed of the circuit boards with width change connection as a second batch of lines to be processed of the circuit boards with photoetching processing; then, the third batch of determining modules are used for extracting the positions and the corresponding numbers of the circuit board to-be-processed lines corresponding to the circuit board to-be-processed lines on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines with width change connection, and taking the circuit board to-be-processed lines on the wide side except the line processing reserved section in the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines with width change connection as a third batch of circuit board to-be-processed lines subjected to photoetching processing; and finally, using a fourth batch of determination modules to take the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching.
The effect of the above technical scheme is as follows: the method can effectively reduce the parameter adjusting times of a processing system in the circuit board processing process, effectively reduce errors caused by the increase of the parameter adjusting times of the system, improve the accuracy and precision of circuit board processing, greatly improve the precision and product quality of products under the condition of high-precision circuit board processing, reduce the defective percentage and effectively save the cost. Meanwhile, the circuit lines at the joint of the wide and narrow lines are subjected to targeted independent wide and narrow batch processing in a mode of setting a line processing reserved section, so that the processing error and roughness of the joint of the wide and narrow lines caused by time delay generated by system adjustment parameters at the joint of the wide and narrow lines can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced.
Meanwhile, through the arrangement of the reserved section, reservation can be provided for processing at the wide-narrow connector for targeted processing, the number of times of system parameter change can be effectively reduced through single-side sequential processing of the wide and narrow sides in the reserved section, and the photoetching processing error at the wide-narrow connection connector can be effectively reduced from a narrow-to-wide processing mode. On the other hand, the reserved section obtained by the formula can ensure that sufficient allowance is reserved for processing the interface at the wide-narrow joint, simultaneously ensure the maximum processing degree of the circuit line at the non-joint interface to the maximum extent, and effectively improve the processing efficiency of the circuit board; the reserved section obtained by the formula can effectively balance the processing allowance of the targeted processing at the reserved joint and the fullness of the circuit lines at the non-joint positions in the first batch and the second batch, and the reasonability of the reserved section length setting for ensuring the processing efficiency and precision of the circuit board is effectively improved.
In one embodiment of the invention, the lithographic processing module comprises:
the first processing module is used for sequentially carrying out photoetching processing on the circuit board to be processed according to the sequence of a first batch of circuit board to be processed circuits to be subjected to photoetching processing, a second batch of circuit board to be processed circuits to be subjected to photoetching processing and a third batch of circuit board to be processed circuits to be subjected to photoetching processing;
the second processing module is used for carrying out photoetching processing on the fourth batch of circuit boards to be processed, wherein the fourth batch of circuit boards to be processed comprises the following steps:
sequentially carrying out photoetching processing on the circuit board to be processed on the narrower side in each pair of width-to-width connected circuit processing reserved sections;
after the photoetching processing of all the lines to be processed of the circuit board on the narrower side in all the lines to be processed of the circuit board subjected to photoetching processing in the fourth batch is finished; and sequentially carrying out photoetching processing on the circuit board to be processed on the wider side in each pair of width-to-width connected circuit processing reserved sections until the circuit board to be processed corresponding to all the circuit processing reserved sections are subjected to photoetching processing.
The working principle of the technical scheme is as follows: firstly, sequentially carrying out photoetching processing on the circuit board to be processed according to the sequence of a first batch of circuit board to be processed circuits to be subjected to photoetching processing, a second batch of circuit board to be processed circuits to be subjected to photoetching processing and a third batch of circuit board to be processed circuits to be subjected to photoetching processing by a first processing module; and then, after finishing the processing of the first batch of circuits to be processed of the circuit boards to be subjected to photoetching, the second batch of circuits to be processed of the circuit boards to be subjected to photoetching and the third batch of circuits to be processed of the circuit boards to be subjected to photoetching by using the second processing module, carrying out photoetching processing on the fourth batch of circuits to be processed of the circuit boards to be subjected to photoetching.
The effect of the above technical scheme is as follows: the circuit line of wide and narrow line junction is subjected to targeted independent wide and narrow batch processing by setting the line processing reserved section, so that the processing error and roughness of the wide and narrow line junction caused by time delay generated by system adjusting parameters of the wide and narrow junction can be further reduced, the product precision and the product quality are further improved, and the defective rate is reduced. Meanwhile, through the arrangement of the reserved section, reservation can be provided for processing at the wide-narrow connector for targeted processing, the number of times of system parameter change can be effectively reduced through single-side sequential processing of the wide and narrow sides in the reserved section, and the photoetching processing error at the wide-narrow connection connector can be effectively reduced from a narrow-to-wide processing mode.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A method of processing a circuit board, the method comprising:
acquiring an electronic diagram of a circuit board to be processed and acquiring information data of a photoetching position of the circuit board;
classifying the lines to be processed according to the information data of the photoetching position of the circuit board;
and respectively carrying out photoetching processing according to the lines with different widths.
2. The processing method according to claim 1, wherein classifying the lines to be processed according to the information data of the lithography processing position of the circuit board comprises:
obtaining the width value of a line in a circuit to be processed of the circuit board according to the information data of the photoetching position of the circuit board;
classifying the circuit boards to be processed with the same width value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed;
coding the circuit board to be processed in the sequence of the width values from narrow to wide from first to last, and pairing the codes with the corresponding circuit board to be processed to obtain an electronic diagram of the circuit board to be processed with the number marks and information data of the photoetching processing position of the circuit board.
3. The processing method according to claim 1, wherein the photolithography processing is performed respectively for the lines of different width types, and comprises:
determining the photoetching processing sequence of the circuit board circuit according to the electronic diagram of the circuit board to be processed with the serial number mark and the information data of the photoetching processing position of the circuit board;
and carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
4. The process of claim 3 wherein said determining a photolithographic process sequence of circuit board traces comprises:
sequentially extracting the lines to be processed of the circuit boards without width change connection according to the sequence from narrow to wide, extracting the positions and corresponding numbers of the lines to be processed of the circuit boards, and taking the lines to be processed of the circuit boards without width change connection as a first batch of lines to be processed of the circuit boards for photoetching;
sequentially extracting the lines to be processed of the circuit boards with the width change connection, and respectively setting line processing reserved sections on the lines to be processed of the circuit board on the wide side and the lines to be processed of the circuit board on the narrow side in the lines to be processed of the circuit boards with the width change connection; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing;
sequentially extracting the lines to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the narrow side of the two lines to be processed of the circuit boards with width change connection except the line processing reserved section as a second batch of the lines to be processed of the circuit boards with photoetching processing;
extracting the position and the corresponding serial number of a circuit board to-be-processed line corresponding to the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are connected with each other in width change in the circuit boards to-be-processed lines which are connected with each other in width change, and taking the circuit board to-be-processed line on the wide side of the two circuit boards to-be-processed lines which are connected with each other in width change except the line processing reserved section as a third batch of circuit board to-be-processed lines which are subjected to photoetching processing;
and taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching.
5. The process of claim 4 wherein the photolithographic processing of circuit board traces is performed in the order of the photolithographic processing of the circuit board traces, comprising:
sequentially carrying out photoetching processing on the circuit boards to be processed according to the sequence of the first batch of circuit boards to be processed by photoetching, the second batch of circuit boards to be processed by photoetching and the third batch of circuit boards to be processed by photoetching;
after finishing the circuit to be processed of the first batch of circuit boards to be subjected to photoetching, the circuit to be processed of the second batch of circuit boards to be subjected to photoetching and the circuit to be processed of the third batch of circuit boards to be subjected to photoetching, the circuit to be processed of the fourth batch of circuit boards to be subjected to photoetching is subjected to photoetching, wherein the photoetching process of the circuit to be processed of the fourth batch of circuit boards to be subjected to photoetching comprises the following steps:
sequentially carrying out photoetching processing on the circuit board to be processed on the narrower side in each pair of width-to-width connected circuit processing reserved sections;
after the photoetching processing of all the lines to be processed of the circuit board on the narrower side in all the lines to be processed of the circuit board subjected to photoetching processing in the fourth batch is finished; and sequentially carrying out photoetching processing on the circuit board to be processed on the wider side in each pair of width-to-width connected circuit processing reserved sections until the circuit board to be processed corresponding to all the circuit processing reserved sections are subjected to photoetching processing.
6. A system for processing a circuit board, the system comprising:
the acquisition module is used for acquiring an electronic diagram of the circuit board to be processed and acquiring information data of a photoetching position of the circuit board;
the classification module is used for classifying the lines to be processed according to the information data of the photoetching position of the circuit board;
and the processing module is used for respectively carrying out photoetching processing according to the lines with different widths.
7. The processing system of claim 6, wherein the classification module comprises:
the width acquisition module is used for acquiring the width numerical value of a line in the circuit to be processed of the circuit board according to the information data of the photoetching position of the circuit board;
the classification module is used for classifying the circuit boards to be processed with the same width numerical value into a class of circuit boards to be processed to obtain a plurality of types of circuit boards to be processed;
and the coding module is used for respectively coding the circuit board to be processed according to the sequence of the width values from narrow to wide from first to last, pairing the codes with the corresponding circuit board to be processed and obtaining the electronic diagram of the circuit board to be processed with the number marks and the information data of the photoetching processing position of the circuit board.
8. The tooling system of claim 6, wherein the tooling module comprises:
the determining module is used for determining the photoetching processing sequence of the circuit board circuit according to the electronic diagram of the circuit board to be processed with the serial number mark and the information data of the photoetching processing position of the circuit board;
and the photoetching processing module is used for carrying out photoetching processing on the circuit board circuit according to the photoetching processing sequence of the circuit board circuit.
9. The machining system of claim 8, wherein the determining module comprises:
the first batch of determining modules are used for sequentially extracting the circuit boards to be processed without width change connection according to the sequence from narrow to wide, extracting the positions and the corresponding numbers of the circuit boards to be processed, and taking the circuit boards to be processed without width change connection as the first batch of circuit boards to be processed for photoetching;
the reserved section determining module is used for sequentially extracting the circuit boards to be processed with the width change connection, and setting a line processing reserved section on the circuit board to be processed on the wide side and the circuit board to be processed on the narrow side in the circuit boards to be processed with the width change connection respectively; the circuit processing reserved section on the circuit board to be processed on the wide side and the circuit processing reserved section on the circuit board to be processed on the narrow side are reserved circuits on the circuit board of the connection end with the line width changing;
the second batch of determining modules are used for sequentially extracting the lines to be processed of the circuit boards with width change connection, extracting the positions and the corresponding numbers of the lines to be processed of the circuit boards from the narrow side of the two lines to be processed of the circuit boards with width change connection in the lines to be processed of the circuit boards with width change connection, and taking the lines to be processed of the circuit boards with the narrow side except the line processing reserved section in the two lines to be processed of the circuit boards with width change connection as the second batch of lines to be processed of the circuit boards with photoetching processing;
the third batch of determining modules are used for extracting the positions and the corresponding serial numbers of the circuit board to-be-processed lines corresponding to the circuit board to-be-processed lines on the wide side of the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection, and taking the circuit board to-be-processed lines on the wide side except the line processing reserved section in the two circuit boards to-be-processed lines which are subjected to width change connection in the circuit boards to-be-processed lines which are subjected to width change connection as a third batch of circuit board to-be-processed lines subjected to photoetching processing;
and the fourth batch of determination modules are used for taking the circuit board to-be-processed circuit corresponding to the circuit processing reserved section as a fourth batch of circuit board to-be-processed circuit for photoetching processing.
10. The processing system of claim 9, wherein the photolithography processing module comprises:
the first processing module is used for sequentially carrying out photoetching processing on the circuit board to be processed according to the sequence of a first batch of circuit board to be processed circuits to be subjected to photoetching processing, a second batch of circuit board to be processed circuits to be subjected to photoetching processing and a third batch of circuit board to be processed circuits to be subjected to photoetching processing;
the second processing module is used for carrying out photoetching processing on the fourth batch of circuit boards to be processed, wherein the fourth batch of circuit boards to be processed comprises the following steps:
sequentially carrying out photoetching processing on the circuit board to be processed on the narrower side in each pair of width-to-width connected circuit processing reserved sections;
after the photoetching processing of all the lines to be processed of the circuit board on the narrower side in all the lines to be processed of the circuit board subjected to photoetching processing in the fourth batch is finished; and sequentially carrying out photoetching processing on the circuit board to be processed on the wider side in each pair of width-to-width connected circuit processing reserved sections until the circuit board to be processed corresponding to all the circuit processing reserved sections are subjected to photoetching processing.
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| JP2002064160A (en) * | 2000-08-21 | 2002-02-28 | Sumitomo Metal Electronics Devices Inc | Method of forming conductive pattern |
| US20200372365A1 (en) * | 2019-05-20 | 2020-11-26 | Synopsys, Inc. | Classification of patterns in an electronic circuit layout using machine learning based encoding |
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