CN113783044A - ARM CPU calculation module connection structure - Google Patents

Abstract

The invention discloses an ARM CPU calculation module connecting structure which comprises a first ultrathin sinking plate, a second ultrathin sinking plate, a first calculation module and a second grounding wire, wherein a first connector is installed at one end of the first ultrathin sinking plate in a positioning mode, a first connecting terminal is arranged on the outer side of the first connector, a second connector is connected at one end of the second ultrathin sinking plate in a positioning mode, a second connecting terminal is arranged on the outer side of the second connector, a first positioning mounting hole is formed in two corners of one side of the first ultrathin sinking plate, and a second positioning mounting hole is formed in two corners of one side of the second ultrathin sinking plate. The ARM CPU computing module connecting structure provided by the invention utilizes the connection mode of two ultrathin sinking plate interfaces, is simpler and quicker in connection, is convenient for the computing module to carry out connection operation more quickly, improves the working efficiency, is internally provided with a microchip module, has the calculation power of 0.8Tops, and can support one-key conversion of a model.

Description

ARM CPU calculation module connection structure

Technical Field

The invention relates to the field of computing modules, in particular to an ARM CPU computing module connecting structure.

Background

The computing module connecting structure is a supporting structure for connecting the computing module electric appliance, when a computer is used, the application of an internal computing module is indispensable, the computing module comprises an ARM CPU computing module, the computing module can quickly respond and process computer data, and along with the continuous development of science and technology, the manufacturing process requirements of people on the computing module connecting structure are higher and higher.

The existing connection structure of the computing module has certain disadvantages when in use, firstly, when in use, the internal structure of the computing module is complex, the connection cannot be convenient, the use of people is not facilitated, in addition, the thickness is thick when in connection, the packaging is not convenient, certain adverse effect is brought to the use process of people, and for this reason, the connection structure of the ARM CPU computing module is provided.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides the ARM CPU computing module connecting structure, which adopts the connecting mode of two ultrathin sinking plate interfaces, is simpler and quicker to connect, is convenient for the computing module to carry out connection operation more quickly, improves the working efficiency, is internally provided with a microchip, has the computing power of 0.8Tops, can support one-key conversion of a model, and can effectively solve the problems in the background technology.

(II) technical scheme

In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a ARM CPU calculation module connection structure, includes that an ultra-thin heavy board, No. two ultra-thin heavy boards, a calculation module and No. two earth connections, a connector is installed to the one end location of an ultra-thin heavy board, the outside of a connector is provided with a connecting terminal, the one end location of No. two ultra-thin heavy boards is connected with No. two connectors, the outside of No. two connectors is provided with No. two connecting terminals, a location mounting hole has been seted up at two angles in one side of an ultra-thin heavy board, No. two location mounting holes have been seted up at two angles in one side of No. two ultra-thin heavy boards, No. two connecting terminals and a connecting terminal inboard have all seted up the inserting groove.

As an optimal technical scheme of this application, the inside of a calculation module is provided with a module chip, a earth connection, a power module, a data processing module, a signal transmission module, a connection module connects the position of a signal transmission module, a signal transmission module connects the position of a data processing module and a module chip, a data processing module connects a module chip, a module chip connects an earth connection and a power module.

As an optimal technical scheme, No. two connection modules, No. two data processing modules, No. two signal transmission modules, No. two power modules, No. two module chips and No. two grounding wires are arranged inside No. two grounding wires, No. two connection modules connect the position of No. two signal transmission modules, No. two signal transmission modules connect the position of No. two data processing modules and No. two module chips, No. two data processing modules connect No. two module chips, No. two module chips connect the position of No. two grounding wires and No. two power modules.

As an optimal technical scheme of this application, the one end of a number of ultra-thin heavy boards is connected with the one end electrical apparatus of a number of ultra-thin heavy boards through a connector, a connecting terminal No. two, a connector No. two, a connecting terminal No. two.

As an optimal technical scheme, a welding hole position is arranged between the first computing module and the first module chip, the middle of the first computing module is fixedly connected with the lower end of the first module chip through the welding hole position, and the first module chip is electrically connected with the first grounding wire, the first power supply module, the first data processing module and the first signal transmission module.

As an optimal technical scheme of this application, be provided with the welding position between No. two earth connections and No. two module chips, the lower extreme welded connection of welding position and No. two module chips is passed through to the surface of No. two earth connections, No. two module chips and No. two data processing module, No. two signal transmission module, No. two earth connections, No. two electrical apparatus connection between the power module.

As an optimal technical scheme of this application, be provided with the wire between a linking module and No. two linking modules, be connected through wire electrical apparatus between a linking module and No. two linking modules, the one end of a calculation module is connected with the one end electrical apparatus of No. two earth connections through No. two linking modules, a linking module.

(III) advantageous effects

Compared with the prior art, the invention provides an ARM CPU computing module connecting structure, which has the following beneficial effects: the ARM CPU computing module connecting structure utilizes a connecting mode of two ultrathin sinking plate interfaces, the connection is simpler and quicker, the computing module can be conveniently and quickly connected for operation, the working efficiency is improved, a microchip is arranged in the ARM CPU computing module connecting structure, the computing power reaches 0.8Tops and can support model one-key conversion, one end of a first ultrathin sinking plate is electrically connected with one end of a second ultrathin sinking plate through a first connector, a second connecting terminal, a second connector and a second connecting terminal, the microchip is arranged in the ARM CPU computing module connecting structure, the computing power reaches 0.8Tops, a RK3568 structure can support model one-key conversion, a first module chip, a first grounding wire, a first power supply module, a first data processing module, a first signal transmission module and a first connecting module are arranged in the ARM CPU computing module, the first connecting module is connected with the first signal transmission module, the first signal transmission module is connected with the first data processing module and the first chip, the first data processing module is connected with the first module chip, the first module chip is connected with the first grounding wire and the first power supply module to facilitate the operation of the first computing module on data signals, the second grounding wire is internally provided with a second connecting module, a second data processing module, a second signal transmission module, a second power supply module, a second module chip and a second grounding wire, the second connecting module is connected with the position of the second signal transmission module, the second signal transmission module is connected with the position of the second data processing module and the position of the second module chip, the second data processing module is connected with the second module chip, the second module chip is connected with the position of the second grounding wire and the position of the second power supply module to facilitate the operation of the second grounding wire on data signals, a lead is arranged between the first connecting module and the second connecting module, and the first connecting module and the second connecting module are connected through a lead electrical appliance, the one end of a calculation module is connected with the one end electrical apparatus of No. two earth connections through No. two connection module, a connection module, and convenient more quick is connected between two modules, improves operation speed, and whole calculation module connection structure simple structure, convenient operation, the effect of use is better for traditional mode.

Drawings

Fig. 1 is a schematic structural diagram of an entire connection structure of an ARM CPU computing module according to the present invention.

FIG. 2 is a schematic structural diagram of a second embodiment of the ARM CPU computing module connection structure according to the present invention.

FIG. 3 is a schematic diagram of a side view of an ARM CPU computing module connection structure according to the present invention.

Fig. 4 is a schematic structural diagram of a second ultrathin sinking plate in the connection structure of the ARM CPU computing module of the present invention.

Fig. 5 is a schematic structural diagram of a first ultrathin sinking plate in the connection structure of the ARM CPU computing module of the present invention.

Fig. 6 is a schematic structural diagram of a connection module block diagram in the connection structure of the ARM CPU computing module according to the present invention.

In the figure: 1. a first ultrathin sinking plate; 2. a first connector; 3. a first positioning mounting hole; 4. a second ultrathin sinking plate; 5. a second connector; 6. a second connecting terminal; 7. a second positioning mounting hole; 8. a first connecting terminal; 9. inserting grooves; 10. a first calculation module; 11. a module chip number one; 12. a first ground line; 13. a first power supply module; 14. a first data processing module; 15. a first signal transmission module; 16. a first connection module; 17. a second connection module; 18. a second data processing module; 19. a second signal transmission module; 20. a second power supply module; 21. module chip No. two; 22. a second ground wire; 23. and a second calculation module.

Detailed Description

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings and the detailed description, but those skilled in the art will understand that the following described embodiments are some, not all, of the embodiments of the present invention, and are only used for illustrating the present invention, and should not be construed as limiting the scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

as shown in fig. 1-6, an ARM CPU computing module connection structure, including an ultra-thin heavy board 1, No. two ultra-thin heavy boards 4, a computing module 10 and No. two earth connections 23, a connector 2 is installed in the one end location of an ultra-thin heavy board 1, the outside of a connector 2 is provided with a connecting terminal 8, the one end location of No. two ultra-thin heavy boards 4 is connected with No. two connectors 5, the outside of No. two connectors 5 is provided with No. two connecting terminals 6, a location mounting hole 3 has been seted up at two corners of one side of an ultra-thin heavy board 1, No. two location mounting holes 7 have been seted up at two corners of one side of No. two ultra-thin heavy boards 4, No. two connecting terminals 6 and No. 8 inboard inserting grooves 9 have all been seted up.

Furthermore, one end of the first ultrathin sinking plate 1 is electrically connected with one end of the second ultrathin sinking plate 4 through the first connector 2, the first connecting terminal 8, the second connector 5 and the second connecting terminal 6.

Example two:

on the basis of the first embodiment, as shown in fig. 1-6, an ARM CPU computing module connection structure includes a first ultrathin sinking plate 1, a second ultrathin sinking plate 4, a first computing module 10 and a second grounding wire 23, a first connector 2 is installed at one end of the first ultrathin sinking plate 1 in a positioning manner, a first connecting terminal 8 is arranged at the outer side of the first connector 2, a second connector 5 is connected at one end of the second ultrathin sinking plate 4 in a positioning manner, a second connecting terminal 6 is arranged at the outer side of the second connector 5, a first positioning mounting hole 3 is arranged at two corners of one side of the first ultrathin sinking plate 1, a second positioning mounting hole 7 is arranged at two corners of one side of the second ultrathin sinking plate 4, and inserting grooves 9 are respectively arranged at the inner sides of the second connecting terminal 6 and the first connecting terminal 8.

Furthermore, a module chip 11, a ground wire 12, a power module 13, a data processing module 14, a signal transmission module 15, and a connection module 16 are arranged inside the first calculation module 10, the first connection module 16 is connected to the position of the first signal transmission module 15, the first signal transmission module 15 is connected to the positions of the first data processing module 14 and the first module chip 11, the first data processing module 14 is connected to the first module chip 11, and the first module chip 11 is connected to the first ground wire 12 and the first power module 13.

Furthermore, a welding hole position is arranged between the first computing module 10 and the first module chip 11, the middle part of the first computing module 10 is fixedly connected with the lower end of the first module chip 11 through the welding hole position, and the first module chip 11 is electrically connected with the first grounding wire 12, the first power supply module 13, the first data processing module 14 and the first signal transmission module 15.

Example three:

on the basis of the second embodiment, as shown in fig. 1-6, an ARM CPU computing module connection structure includes a first ultrathin sinking plate 1, a second ultrathin sinking plate 4, a first computing module 10 and a second grounding wire 23, a first connector 2 is installed at one end of the first ultrathin sinking plate 1 in a positioning manner, a first connecting terminal 8 is arranged at the outer side of the first connector 2, a second connector 5 is connected at one end of the second ultrathin sinking plate 4 in a positioning manner, a second connecting terminal 6 is arranged at the outer side of the second connector 5, a first positioning mounting hole 3 is arranged at two corners of one side of the first ultrathin sinking plate 1, a second positioning mounting hole 7 is arranged at two corners of one side of the second ultrathin sinking plate 4, and inserting grooves 9 are respectively arranged at the inner sides of the second connecting terminal 6 and the first connecting terminal 8.

Furthermore, a second connection module 17, a second data processing module 18, a second signal transmission module 19, a second power supply module 20, a second module chip 21 and a second ground wire 22 are arranged inside the second ground wire 23, the second connection module 17 is connected with the position of the second signal transmission module 19, the second signal transmission module 19 is connected with the positions of the second data processing module 18 and the second module chip 21, the second data processing module 18 is connected with the second module chip 21, and the second module chip 21 is connected with the positions of the second ground wire 22 and the second power supply module 20.

Furthermore, a welding position is arranged between the second ground wire 23 and the second module chip 21, the outer surface of the second ground wire 23 is connected with the lower end of the second module chip 21 in a welding mode through the welding position, and the second module chip 21 is electrically connected with the second data processing module 18, the second signal transmission module 19, the second ground wire 22 and the second power supply module 20.

Furthermore, a wire is arranged between the first connecting module 16 and the second connecting module 17, the first connecting module 16 is electrically connected with the second connecting module 17 through the wire, and one end of the first calculating module 10 is electrically connected with one end of the second grounding wire 23 through the second connecting module 17 and the first connecting module 16.

The working principle is as follows: the invention comprises a first ultrathin sinking plate 1, a first connector 2, a first positioning mounting hole 3, a second ultrathin sinking plate 4, a second connector 5, a second connecting terminal 6, a second positioning mounting hole 7, a first connecting terminal 8, a splicing groove 9, a first calculating module 10, a first module chip 11, a first grounding wire 12, a first power module 13, a first data processing module 14, a first signal transmission module 15, a first connecting module 16, a second connecting module 17, a second data processing module 18, a second signal transmission module 19, a second power module 20, a second module chip 21, a second grounding wire 22 and a second grounding wire 23, wherein when in use, one end of the first ultrathin sinking plate 1 is connected with one end of the second ultrathin sinking plate 4 through the first connector 2, the first connecting terminal 8, the second connector 5 and the second connecting terminal 6, a microchip is arranged in the first calculation module 10, the calculation power reaches 0.8Tops and can support model one-key conversion, a first module chip 11, a first grounding wire 12, a first power module 13, a first data processing module 14, a first signal transmission module 15 and a first connection module 16 are arranged in the first calculation module 10, the first connection module 16 is connected with the position of the first signal transmission module 15, the first signal transmission module 15 is connected with the positions of the first data processing module 14 and the first module chip 11, the first data processing module 14 is connected with the first module chip 11, the first module chip 11 is connected with the first grounding wire 12 and the first power module 13, the calculation of the first calculation module 10 on data signals is facilitated, a second connection module 17, a second data processing module 18, a second signal transmission module 19, a second power module 20, a second module chip 21 and a second grounding wire 22 are arranged in the second grounding wire 23, no. two connection module 17 connects the position of No. two signal transmission module 19, No. two signal transmission module 19 connects the position of No. two data processing module 18 and No. two module chips 21, No. two data processing module 18 connects No. two module chips 21, No. two module chips 21 connect the position of No. two earth connection 22 and No. two power module 20, make things convenient for No. two earth connection 23 to data signal's operation, be provided with the wire between No. one connection module 16 and No. two connection module 17, be connected through wire electrical apparatus between one connection module 16 and No. two connection module 17, No. two connection module 17 are passed through to the one end of a calculation module 10, No. one connection module 16 is connected with the one end electrical apparatus of No. two earth connection module 23, convenient more quick connect between two modules, improve the rate of operation.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.

Claims (7)

1. The utility model provides a ARM CPU calculates module connection structure, includes ultra-thin heavy board (1), No. two ultra-thin heavy boards (4), a calculation module (10) and No. two earth connection (23), its characterized in that: connector (2) are installed to the one end location of an ultra-thin heavy board (1), the outside of connector (2) is provided with connecting terminal (8) No. one, the one end location of No. two ultra-thin heavy boards (4) is connected with connector (5) No. two, the outside of No. two connector (5) is provided with connecting terminal (6) No. two, location mounting hole (3) have been seted up at one side two angles of an ultra-thin heavy board (1), No. two location mounting hole (7) have been seted up at one side two angles of No. two ultra-thin heavy boards (4), inserting groove (9) have all been seted up with connecting terminal (8) inboard No. two connecting terminal (6).

2. The connection structure of an ARM CPU computing module as claimed in claim 1, wherein: a module chip (11), a ground wire (12), a power module (13), a data processing module (14), a signal transmission module (15), a connection module (16) are arranged inside the calculation module (10), the connection module (16) is connected with the position of the signal transmission module (15), the signal transmission module (15) is connected with the position of the data processing module (14) and the module chip (11), the data processing module (14) is connected with the module chip (11), and the module chip (11) is connected with the ground wire (12) and the power module (13).

3. The connection structure of an ARM CPU computing module as claimed in claim 1, wherein: no. two inside of earth connection (23) is provided with No. two connection module (17), No. two data processing module (18), No. two signal transmission module (19), No. two power module (20), No. two module chip (21) and No. two earth connection (22), No. two connection module (17) are connected the position of No. two signal transmission module (19), No. two signal transmission module (19) are connected the position of No. two data processing module (18) and No. two module chip (21), No. two data processing module (18) are connected No. two module chip (21), No. two module chip (21) are connected the position of No. two earth connection (22) and No. two power module (20).

4. The connection structure of an ARM CPU computing module as claimed in claim 1, wherein: one end of the first ultrathin sinking plate (1) is electrically connected with one end of the second ultrathin sinking plate (4) through the first connector (2), the first connecting terminal (8), the second connector (5) and the second connecting terminal (6).

5. The connection structure of an ARM CPU computing module as claimed in claim 2, wherein: a welding hole position is arranged between the first computing module (10) and the first module chip (11), the middle of the first computing module (10) is fixedly connected with the lower end of the first module chip (11) through the welding hole position, and the first module chip (11) is electrically connected with the first grounding wire (12), the first power supply module (13), the first data processing module (14) and the first signal transmission module (15).

6. The ARM CPU computing module connection structure of claim 3, wherein: a welding position is arranged between the second grounding wire (23) and the second module chip (21), the outer surface of the second grounding wire (23) is connected with the lower end of the second module chip (21) in a welding mode through the welding position, and the second module chip (21) is electrically connected with the second data processing module (18), the second signal transmission module (19), the second grounding wire (22) and the second power supply module (20).

7. The connection structure of an ARM CPU computing module as claimed in claim 2, wherein: a wire is arranged between the first connecting module (16) and the second connecting module (17), the first connecting module (16) is electrically connected with the second connecting module (17) through a wire, and one end of the first calculating module (10) is electrically connected with one end of the second grounding wire (23) through the second connecting module (17) and the first connecting module (16).

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