CN113782696A - Packaging structure and method of OLED display panel - Google Patents
Packaging structure and method of OLED display panel Download PDFInfo
- Publication number
- CN113782696A CN113782696A CN202111186547.1A CN202111186547A CN113782696A CN 113782696 A CN113782696 A CN 113782696A CN 202111186547 A CN202111186547 A CN 202111186547A CN 113782696 A CN113782696 A CN 113782696A
- Authority
- CN
- China
- Prior art keywords
- laser
- tft substrate
- cover plate
- glass
- reflecting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses a packaging structure and a method of an OLED display panel, which comprises cover plate glass and a TFT substrate, wherein the left side of the end face of the TFT substrate is provided with an OLED device, the surface of the corresponding side of the OLED device is provided with a metal electrode, the surface of the metal electrode is adhered with a reflecting layer, a laser beam penetrates through the cover plate glass to be irradiated onto the reflecting layer of the TFT substrate, and the reflecting layer can reflect part of the laser beam onto the Frit and be absorbed by the Frit according to the reflection principle of light on a concave surface, so that the metal electrode on the TFT substrate is protected, laser head damage is avoided, through the design of the reflecting layer of the packaging area of the TFT substrate, the laser exceeding the Frit is reflected back to the Frit during laser welding packaging, the damage of the laser to the metal electrode is avoided, and redundant laser can be blocked during glass glue packaging, so that the laser can be totally irradiated onto the Frit, therefore, the metal electrode on the TFT substrate is protected, the utilization efficiency of laser can be improved, and the packaging effect is further ensured.
Description
Technical Field
The invention belongs to the technical field of display, particularly relates to an OLED display panel packaging structure, and further relates to an OLED display panel packaging method.
Background
Currently, the most common packaging method mainly adopts an Ultraviolet (UV) curing frame glue packaging mode. However, since the cover plate glass and the substrate are in plane connection, if the cover plate glass and the substrate are not flat or foreign matters exist between the cover plate glass and the substrate, the UV curing glue cannot be completely pressed and opened in the pressing process, so that the phenomenon of broken lines or bubbles occurs, and even if the UV curing glue which is completely pressed and opened is cured by ultraviolet light, the UV curing glue shrinks to form the phenomenon of broken lines, so that the organic materials in the OLED device bear the risk of being corroded by water and oxygen, the packaging reliability of the OLED device is reduced, the water and oxygen resistance of the OLED device is reduced, and the service life of the OLED device is shortened.
To this end, publication No. CN109065745A provides an encapsulation structure of an OLED device, comprising: the OLED device comprises a substrate on which an OLED device is formed and an encapsulation cover plate arranged on the substrate; the packaging cover plate is provided with a first groove and a second groove, the second groove surrounds the first groove, the OLED device is arranged in the first groove, and a viscous material is arranged in the second groove, so that the packaging cover plate and the substrate formed with the OLED device are bonded and fixed. The first groove and the second groove are formed in the packaging cover plate, and the adhesive material is arranged in the second groove, so that the purpose of improving the packaging reliability of the OLED device is achieved, the anti-water-oxygen capacity of the OLED device is improved, and the service life of the OLED device is prolonged.
For the packaging structure of the OLED device, although the first groove and the second groove are arranged on the packaging cover plate, the viscous material is arranged in the second groove, and the chamfer is arranged between the first groove and the second groove, the phenomenon of generating bubbles or broken lines during packaging is avoided, and the purpose of improving the packaging reliability of the OLED device is achieved, so that the anti-water-oxygen capacity of the OLED device is improved, the service life of the OLED device is prolonged, but the following obvious defects still exist in the using process: 1. in the manufacturing method of the OLED display panel in the prior art, in the glass cement packaging process, in order to ensure that the glass cement is completely cured, the irradiation diameter of the laser beam needs to be larger than the width of the glass cement, however, the laser beam wider than the glass cement can be irradiated onto the electrode of the OLED substrate through the packaging cover plate, which easily causes the electrode on the substrate to be burned out, and the OLED device is disabled.
2. Although the existing packaging technology avoids the situation, a photomask device is added in a machine table, after the processing of an alignment system, the light-tight area on the photomask blocks the redundant light of the laser beam, and only the laser is irradiated on the frit, so that the electrode on the OLED substrate is protected. However, this approach also has problems: firstly, a precise alignment system is required to support, the equipment is expensive, and alignment abnormity is easy to occur; secondly, the laser line blocked by the light-tight area of the light shield can be reflected to the laser head, so that the laser head is burnt and damaged.
Disclosure of Invention
The present invention is directed to an OLED display panel package structure and method, so as to solve the problems in the related art.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a OLED display panel's packaging structure, includes cover plate glass, TFT base plate, the terminal surface left side of TFT base plate is equipped with the OLED device, and the surface of the corresponding one side of OLED device is equipped with metal electrode, metal electrode's surface bonding has the reflection stratum, the bottom surface bonding of reflection stratum has the insulating layer, the surface of reflection stratum is equipped with Frit glass and glues, cover plate glass bonds and sets up the top surface that glues at Frit glass, cover plate glass's the corresponding upper end on surface right side is equipped with the laser head, it is equipped with the laser beam to form between laser head and the cover plate glass.
Preferably, the reflecting layer adopts circular arc concave surface structure in the position that corresponds the Frit glass and glues, the circular arc concave surface structure of reflecting layer adopts etching or D to print the preparation, guarantees that this structure can be reasonable carry out reasonable reflection to the laser beam and utilizes.
Preferably, the diameter of the laser beam is the diameter of the concave surface structure of the reflecting layer, so that the laser beam can be used for fully irradiating and curing the Frit glass cement, the laser beam is reasonably and effectively utilized, and the packaging and the bonding are facilitated.
Preferably, the packaging cover plate is adhered to the OLED substrate through Frit glass glue, so that the metal electrode has an effective packaging protection effect, and the OLED device can normally work without short circuit.
A packaging method of an OLED display panel specifically comprises the following steps:
s1, when the TFT substrate is manufactured, a reflection layer is additionally arranged in the packaging area, the reflection layer adopts an arc concave surface structure at the position corresponding to the Frit glass glue, and redundant laser transmitted to the TFT substrate is reflected back to the Frit glass glue by utilizing the reflection principle of light on the arc concave surface;
s2, etching or D printing technology is adopted to manufacture the reflecting layer through the arc concave surface structure of the reflecting layer, the reflecting layer is made of metal or nonmetal materials with high reflectivity, and meanwhile, in order to guarantee the packaging effect, the reflecting layer material is required to have the capability of blocking water and oxygen;
s3, further, if the reflective layer is made of conductive materials such as metals, in order to ensure that the OLED device does not short circuit when working normally, an insulating layer needs to be additionally arranged among the OLED device, the metal electrode and the reflective layer, and the insulating layer is made of inorganic or organic materials, so that the insulating property and the good water and oxygen blocking capability are required;
s4, after the TFT substrate is manufactured, the TFT substrate is subjected to an evaporation process to be packaged, a cover plate glass Frit adhesive is coated and baked and cured at high temperature, UV adhesive is coated on the periphery of the packaging cover plate coated with the glass adhesive in an N environment, the packaging cover plate and the TFT substrate are aligned and attached in the N environment, the UV adhesive is irradiated by UV light to be cured, and the coating and curing method of the UV adhesive is the same as that of the coating method and the curing method in the prior art;
s5, emitting laser beams by a laser head on one side of the cover plate glass of the OLED plywood to scan the Frit glass glue in an atmospheric environment, melting the Frit glass glue through the high temperature of the laser, and then cooling and curing the Frit glass glue to adhere the cover plate glass and the TFT substrate;
s6, according to the step 5, the diameter of the laser beam is within the width of the concave surface structure of the reflecting layer, in the welding process, the laser beam irradiates the Frit glass glue, because the diameter of the laser beam is wider than the Frit glass glue, redundant laser beams can penetrate through the cover plate glass to irradiate the reflecting layer on the TFT substrate, according to the reflection principle of light on the concave surface, the reflecting layer can reflect the laser beams to the Frit glass glue and be absorbed by the Frit glass glue, so that the electrodes on the TFT substrate are protected, meanwhile, the utilization efficiency of the laser is improved, and further the encapsulation of the OLED display panel is completed.
The invention provides an OLED display panel packaging structure and method, the reflecting layer of the invention adopts the arc concave surface structure design at the position corresponding to the Frit glass glue, can reflect the redundant laser transmitted to the TFT substrate back to the Frit glass glue by utilizing the reflection principle of the light on the arc concave surface, and the reflecting layer adopts the conductive materials such as metal and the like, thereby ensuring that the OLED device does not short circuit in normal operation;
the laser beam penetrates through the cover plate glass and is irradiated onto the reflecting layer of the TFT substrate, so that part of the laser beam can be reflected onto the glass cement and absorbed by the glass cement according to the reflection principle of light on the concave surface, the metal electrode on the TFT substrate is protected, the damage of the laser head cannot be caused, the utilization efficiency of the laser can be improved, the packaging effect is further ensured, meanwhile, through the design of the reflecting layer of the packaging area of the TFT substrate, the laser beam exceeding the Frit cement part is reflected back onto the Frit glass cement during laser welding packaging, the damage of the laser to the metal electrode is avoided, redundant laser can be blocked during glass cement packaging, and the laser is fully irradiated onto the glass cement, so that the metal electrode on the TFT substrate is protected, the damage of the laser head cannot be caused, the utilization efficiency of the laser can be improved, and the packaging effect is further ensured;
the invention can oxidize the active metal of the cathode of the OLED device by water oxygen in the air and can generate chemical reaction with organic materials, which can cause the loss of the OLED device, so that the OLED device is effectively packaged, the OLED device is fully isolated from the water oxygen, and the service life of the OLED device is further prolonged.
Drawings
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a front view of the package fabrication of the present invention.
In the figure: 1. cover plate glass; 2. a TFT substrate; 3. an OLED device; 4. frit glass cement; 5. a reflective layer; 6. a metal electrode; 7. an insulating layer; 8. a laser head; 9. a laser beam.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an OLED display panel packaging structure as shown in figures 1-3, which comprises a cover plate glass 1 and a TFT substrate 2, wherein the cover plate glass 1 and the TFT substrate 2 are adhered by Frit glass glue 4, the invasion effect of water and oxygen can be prevented, the packaging method is flexible and convenient, the qualified cover plate glass 1 is obtained by irradiating the surface position of the Frit glass glue 4, the sealing performance of the OLED device 3 packaging is further improved, the service life of the OLED device 3 is prolonged, the TFT substrate 2 is composed of a main area thin film transistor, a secondary area thin film transistor and a charge sharing thin film transistor, the voltage of a secondary area pixel electrode can be prevented from being influenced by a coupling signal, the display effects of two display areas in a split screen design are ensured to be the same, the display defect is avoided, the OLED device 3 is arranged on the left side of the end face of the TFT substrate 2, and the design of the OLED device in the OLED display panel is realized, the manufacturing deviation brought by the mask plate can be reduced, the alignment deviation between the substrate and the mask plate is reduced, the deviation caused by thermal deformation of the mask plate is reduced, the manufacturing precision is improved, the problems of scratching and the like of the mask plate caused by particles introduced by the mask plate can be reduced, the product yield is improved, and consumable materials are saved.
The surface of the corresponding side of the OLED device 3 is provided with a metal electrode 6, the metal electrode 6 refers to an electrode with electrode metal and metal ions in electrolyte reaching balance, a reflecting layer 5 is adhered to the surface of the metal electrode 6 and can reflect the generated laser beam 9, so that the metal electrode 6 is protected, the laser beam 9 can be reasonably utilized after being reflected, the reflecting layer 5 is made of a metal or non-metal material with high reflectivity, the situation that the laser beam 9 irradiates other components of the OLED display panel is avoided, meanwhile, the reflecting layer 5 can reasonably utilize and irradiate redundant laser beam 9 on the Frit glass to ensure the packaging quality of the OLED display panel, the reflecting layer 5 adopts an arc concave surface structure at the position corresponding to the Frit glass 4, and the arc concave surface structure of the reflecting layer 5 is manufactured by etching and 3D printing, the effect of reflecting the laser transmitted to the TFT substrate 2 can be obtained by using the principle of reflection of light on the concave surface of the circular arc back to the Frit glass 4.
The bottom surface bonding of reflection stratum 5 has insulating layer 7, adopt inorganic or organic class material through insulating layer 7, and insulating nature and the ability that has good separation water oxygen, the surface of reflection stratum 5 is equipped with Frit glass and glues 4, can protect the metal electrode on the TFT base plate 2, improve the utilization efficiency of laser simultaneously, the top surface that sets up at Frit glass gluing 4 is glued to 1 bonding of apron glass, the corresponding upper end on the surperficial right side of apron glass 1 is equipped with laser head 8, it is equipped with laser beam 9 to form between laser head 8 and the apron glass 1, the diameter of laser beam 9 is at the concave surface structure's of reflection stratum 5 diameter, can see through 5 surfaces of reflection stratum on the TFT base plate 2 of apron glass 1 with unnecessary laser beam 9, and then can not cause the laser head damage, simultaneously can also improve the utilization efficiency of laser, and then guarantee the encapsulation effect.
A packaging method of an OLED display panel specifically comprises the following steps:
s1, when the TFT substrate is manufactured, a layer of reflecting layer 5 is additionally arranged in the packaging area, the reflecting layer 5 adopts an arc concave surface structure at the position corresponding to the Frit glass glue 4, and redundant laser transmitted to the TFT substrate 2 is reflected to the Frit glass glue 4 by utilizing the reflection principle of light on the arc concave surface;
s2, the arc concave surface structure of the reflecting layer 5 is manufactured by etching and 3D printing technology, the reflecting layer 5 is made of metal or nonmetal materials with high reflectivity, and the reflecting layer material is required to have good water and oxygen blocking capability to ensure the packaging effect;
s3, if the reflective layer 5 is made of conductive materials such as metal, an insulating layer 7 needs to be additionally disposed between the OLED device 3, the metal electrode 6 and the reflective layer 5 to ensure that the OLED device 3 does not short-circuit during normal operation, and the insulating layer 7 is made of inorganic or organic materials, which requires insulation and has the ability of blocking water and oxygen;
s4, after the TFT substrate 2 is manufactured, the TFT substrate 2 is subjected to an evaporation process to be packaged, a cover plate glass Frit adhesive is coated and baked at high temperature for curing, UV adhesive is coated on the periphery of the packaging cover plate coated with the glass adhesive in an N2 environment, the packaging cover plate and the TFT substrate 2 are aligned and attached in an N2 environment, the UV adhesive is irradiated by the UV light to be cured, and the coating and curing method of the UV adhesive is the same as that of a coating method and a curing method in the prior art;
s5, emitting laser beams 9 to scan the Frit glass glue 4 by a laser head 8 on one side of the cover glass 1 of the OLED plywood in an atmospheric environment, melting the Frit glass glue 4 through the high temperature of the laser, and cooling and solidifying the Frit glass glue 4 so as to adhere the cover glass 1 and the TFT substrate 2;
s6, according to the diameter of the laser beam 9 in the width of the concave surface structure of the reflection layer 5 in the step 5, in the welding process, the laser beam 9 irradiates the Frit glass glue 4, because the diameter of the laser beam 9 is wider than the Frit glass glue 4, the redundant laser beam 9 can penetrate through the cover plate glass 1 to irradiate the reflection layer 5 on the TFT substrate 2, according to the reflection principle of light on the concave surface, the reflection layer 5 can reflect the laser beam 9 to the Frit glass glue 4 and be absorbed by the Frit glass glue 4, so that the electrode on the OLED substrate is protected, meanwhile, the utilization efficiency of the laser is improved, and the packaging of the OLED display panel is completed.
In summary, compared with the prior art, the invention adopts the arc concave surface structure design at the position corresponding to the Frit glass glue 4 through the reflective layer 5, can reflect the redundant laser transmitted to the TFT substrate 2 back to the Frit glass glue 4 by utilizing the reflection principle of the light on the arc concave surface, and the reflective layer 5 adopts the conductive materials such as metals, thereby ensuring that the OLED device 3 does not short circuit in normal operation, and simultaneously, through the insulating layer 7 additionally arranged between the metal electrode 6 and the reflective layer 5, and the insulating layer 7 adopts the inorganic or organic material design, the insulating property and the good capability of blocking water and oxygen can be realized, so that the damage of the packaging process to the product can be solved through improving the existing packaging structure, thereby prolonging the service life of the OLED display.
By means of the laser beam 9 penetrating through the cover glass 1 to the reflective layer 5 of the TFT substrate 2, the reflective layer 5 can reflect part of the laser beam 9 to the glass cement to be absorbed by the glass cement according to the reflection principle of light on the concave surface, thereby protecting the metal electrode 6 on the TFT substrate 2, not causing laser head damage, simultaneously improving the utilization efficiency of laser, further ensuring the packaging effect, and simultaneously reflecting the laser exceeding the FRIT adhesive part back to the Frit glass adhesive 4 during laser welding packaging through the design of the reflective layer 5 of the packaging area of the TFT substrate 2 to avoid the damage of the laser to the metal electrode 6, and can block redundant laser when the glass cement is packaged, so that the laser can be totally irradiated on the glass cement, therefore, the metal electrode 6 on the TFT substrate 2 is protected, the laser head 8 cannot be damaged, the utilization efficiency of laser can be improved, and the packaging effect is ensured.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (5)
1. The utility model provides a packaging structure of OLED display panel, includes cover plate glass (1), TFT base plate (2), its characterized in that: the terminal surface left side of TFT base plate (2) is equipped with OLED device (3), and the surface of the one side that corresponds of OLED device (3) is equipped with metal electrode (6), the surface bonding of metal electrode (6) has reflection stratum (5), the bottom surface bonding of reflection stratum (5) has insulating layer (7), the surface of reflection stratum (5) is equipped with Frit glass and glues (4), cover plate glass (1) bonding sets up the top surface that glues (4) at Frit glass, the correspondence upper end on the surface right side of cover plate glass (1) is equipped with laser head (8), it is equipped with laser beam (9) to form between laser head (8) and cover plate glass (1).
2. The encapsulating structure of the OLED display panel according to claim 1, wherein: the reflecting layer (5) adopts an arc concave surface structure at the position corresponding to the Frit glass glue (4), and the arc concave surface structure of the reflecting layer (5) is manufactured by etching or 3D printing.
3. The encapsulating structure of the OLED display panel according to claim 1, wherein: the diameter of the laser beam (9) is at the diameter of the concave structure of the reflective layer (5).
4. The encapsulating structure of the OLED display panel according to claim 1, wherein: the cover plate glass (1) is adhered to the TFT substrate (2) through Frit glass cement (4).
5. The method for encapsulating the OLED display panel of claim 1, wherein: the method specifically comprises the following steps:
s1, when the TFT substrate is manufactured, a reflection layer (5) is additionally arranged in the packaging area, the reflection layer (5) adopts an arc concave surface structure at the position corresponding to the Frit glass glue (4), and redundant laser transmitted to the TFT substrate (2) is reflected back to the Frit glass glue (4) by utilizing the reflection principle of light on the arc concave surface;
s2, the arc concave surface structure of the reflecting layer 5 is manufactured by etching or 3D printing technology, and the reflecting layer (5) is made of metal or nonmetal material with high reflectivity;
s3, the reflecting layer (5) is made of conductive materials such as metal, an insulating layer (7) is additionally arranged among the OLED device (3), the metal electrode (6) and the reflecting layer (5), and the insulating layer (7) is made of inorganic or organic materials;
s4, after the TFT substrate (2) is manufactured, the TFT substrate (2) is subjected to an evaporation process to be packaged, a cover plate glass Frit adhesive is coated and baked at a high temperature for curing, UV adhesive is coated on the periphery of the package cover plate coated with the glass adhesive in an N2 environment, the package cover plate and the TFT substrate (2) are aligned and attached in an N2 environment, and the UV adhesive is irradiated by the UV light to be cured;
s5, emitting a laser beam (9) to scan the Frit glass (4) by a laser head (8) on one side of the cover plate glass (1) of the OLED laminate, melting the Frit glass (4) through the high temperature of the laser, cooling and curing, and adhering the cover plate glass (1) and the TFT substrate (2);
s6, according to the step 5, the diameter of the laser beam (9) is within the width of the concave surface structure of the reflecting layer (5), in the welding process, the laser beam (9) irradiates the Frit glass (4), the diameter of the laser beam (9) is wider than that of the Frit glass (4), redundant laser beam (9) can penetrate through the cover plate glass (1) to be emitted to the reflecting layer (5) on the TFT substrate (2), according to the reflection principle of light on the concave surface, the reflecting layer (5) can reflect the laser beam (9) to the Frit glass (4) and be absorbed by the Frit glass (4), and then the packaging of the OLED display panel is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111186547.1A CN113782696A (en) | 2021-10-12 | 2021-10-12 | Packaging structure and method of OLED display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111186547.1A CN113782696A (en) | 2021-10-12 | 2021-10-12 | Packaging structure and method of OLED display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113782696A true CN113782696A (en) | 2021-12-10 |
Family
ID=78871015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111186547.1A Pending CN113782696A (en) | 2021-10-12 | 2021-10-12 | Packaging structure and method of OLED display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113782696A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114326177A (en) * | 2021-12-29 | 2022-04-12 | 江苏骏成电子科技股份有限公司 | Dam adhesive coating method of optical bonding technology |
-
2021
- 2021-10-12 CN CN202111186547.1A patent/CN113782696A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114326177A (en) * | 2021-12-29 | 2022-04-12 | 江苏骏成电子科技股份有限公司 | Dam adhesive coating method of optical bonding technology |
| CN114326177B (en) * | 2021-12-29 | 2023-12-12 | 江苏骏成电子科技股份有限公司 | Method for coating dam glue by optical bonding technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10971698B2 (en) | OLED display panel and manufacturing method for the same | |
| US7476138B2 (en) | Method of manufacturing organic EL displays incorporating adhesion escape grooves surrounding an adhesion region of each display | |
| US7560858B2 (en) | Sealing substrate and a pixel substrate of a display device joined by a metal joint solder | |
| EP1921651B1 (en) | Sealing device and method of manufacturing display device using the same | |
| US6798133B1 (en) | Glass cover and process for producing a glass cover | |
| TWI402948B (en) | Hermetically-sealed packages for electronic components having reduced unused areas | |
| CN109119449B (en) | Display panel and display device thereof | |
| US7477015B2 (en) | Sealing glass substrate for organic EL material and method of manufacturing organic EL display | |
| US20040069017A1 (en) | Encapsulation of a display element and method of forming the same | |
| US10613402B2 (en) | Display panel with array substrate having thickness varying in packaging area, method of manufacturing display panel and display device | |
| JP2007200845A (en) | Organic electroluminescent display | |
| JP2008123981A (en) | Organic electroluminescent display device, and its manufacturing method | |
| JP2009117181A (en) | Organic el display device, and manufacturing method thereof | |
| WO2019033538A1 (en) | Manufacturing method for oled display panel | |
| CN107833907B (en) | Flexible OLED display device and glue sealing method | |
| JP2012104397A (en) | Method for manufacturing electro-optical device and electro-optical device | |
| CN113782696A (en) | Packaging structure and method of OLED display panel | |
| CN112786742A (en) | Display panel and manufacturing method thereof | |
| CN216054782U (en) | Packaging structure of OLED display panel | |
| JP2011107432A (en) | Method of manufacturing electrooptical device | |
| KR100671645B1 (en) | Method of manufacturing organic light emitting display device | |
| JP2006165497A (en) | Glass cap bonding method and mask for curing encapsulant | |
| CN112768543A (en) | Double-glass photovoltaic module and welding method thereof | |
| US10340481B2 (en) | Manufacturing method of OLED display panel | |
| CN111864114A (en) | Display screen packaging structure and packaging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |