CN113778259B - Touch structure, manufacturing method, display panel and display device - Google Patents
Touch structure, manufacturing method, display panel and display device Download PDFInfo
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- CN113778259B CN113778259B CN202110982276.4A CN202110982276A CN113778259B CN 113778259 B CN113778259 B CN 113778259B CN 202110982276 A CN202110982276 A CN 202110982276A CN 113778259 B CN113778259 B CN 113778259B
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Abstract
The application discloses touch structure and preparation method, display panel and display device, touch structure includes: a substrate; a first conductive pattern disposed on the substrate; an organic layer covering the first conductive pattern, which is advantageous to increase flexibility, and which can protect the first conductive pattern; the second conductive pattern is arranged on the organic layer, the second conductive pattern comprises at least one hollow structure, a first protective layer is arranged on the organic layer in a region corresponding to the hollow region of the second conductive pattern, the first protective layer covers the region corresponding to the hollow region of the second conductive pattern, the organic layer can be prevented from being damaged by a solvent for stripping the photoresist pattern in the stripping process, the flatness of the organic layer is ensured, and the reliability of touch control is ensured while the flexibility is improved.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a touch structure, a manufacturing method, a display panel and a display device.
Background
In recent years, OLED screens have received attention for their light weight, excellent display effect, high contrast, wide color gamut, and flexibility. With the rising of AMOLED mobile phones, the position of a flexible OLED display screen is increasingly highlighted, with the gradual maturation of on-cell technology, the FMLOC technology is gradually applied to new products, in order to meet the flexibility requirement, the FMLOC film layer needs to be thinned or an insulating layer needs to be replaced, the flexibility is increased, and the insulating layer is easily damaged by a subsequent etching process.
Disclosure of Invention
The embodiment of the application aims to provide a touch structure, a preparation method, a display panel and a display device, which are used for solving the problem that a subsequent etching process is easy to damage an insulating layer.
In a first aspect, an embodiment of the present application provides a touch structure, including:
a substrate;
a first conductive pattern disposed on the substrate;
an organic layer covering the first conductive pattern;
the organic layer is provided with a second conductive pattern, the second conductive pattern comprises at least one hollow structure, and a first protection layer is arranged on the organic layer in a region corresponding to the hollow region of the second conductive pattern.
The first conductive patterns comprise bridge electrodes, the second conductive patterns comprise a plurality of first touch electrodes and a plurality of second touch electrodes, two adjacent first touch electrodes are directly connected, and two adjacent second touch electrodes are connected with the bridge electrodes through holes in the organic layer.
Wherein the first protective layer comprises a polymer layer having fluorine-containing groups.
Wherein the first protection layer is arranged between the second conductive pattern and the organic layer; or alternatively
The first protection layer is positioned on the surface of the organic layer and inside the hollow structure.
Wherein, still include:
and a second protective layer covering the second conductive pattern.
In a second aspect, an embodiment of the present application provides a method for manufacturing a touch structure, including:
forming a first conductive pattern on a substrate;
forming an organic layer covering the first conductive pattern;
forming a second conductive pattern and a first protective layer, wherein the first protective layer covers an area corresponding to a hollowed-out area of the second conductive pattern on the organic layer, and the second conductive pattern comprises at least one hollowed-out structure;
wherein the first protective layer is formed before the photoresist pattern is stripped using the photoresist pattern as a mask in forming the second conductive pattern.
The first conductive patterns comprise bridge electrodes, the second conductive patterns comprise a plurality of first touch electrodes and a plurality of second touch electrodes, two adjacent first touch electrodes are directly connected, and two adjacent second touch electrodes are connected with the bridge electrodes through holes in the organic layer.
Wherein the step of forming the second conductive pattern and the first protective layer includes:
forming a first protective layer on the organic layer;
forming a conductive layer on the first protective layer;
forming a second conductive pattern using the photoresist pattern as a mask;
removing the photoresist pattern on the second conductive pattern;
alternatively, the step of forming the second conductive pattern and the first protective layer includes:
forming a conductive layer on the organic layer;
forming a second conductive pattern using the photoresist pattern as a mask;
forming a first protection layer on the organic layer in a region corresponding to the hollowed-out region of the second conductive pattern;
and removing the photoresist pattern on the second conductive pattern.
Wherein after removing the photoresist pattern on the second conductive pattern, further comprising:
forming a second protective layer covering the second conductive pattern; and/or
The first protective layer includes a polymer layer having a fluorine-containing group, and the step of removing the photoresist pattern on the second conductive pattern includes:
and removing the photoresist pattern on the second conductive pattern by a non-fluorine solvent.
In a third aspect, an embodiment of the present application provides a display panel, including the touch structure described in the foregoing embodiment.
In a fourth aspect, embodiments of the present application provide a display device including the display panel described in the above embodiments.
The touch structure of the embodiment of the application comprises: a substrate; a first conductive pattern disposed on the substrate; an organic layer covering the first conductive pattern, which is advantageous to increase flexibility, and which can protect the first conductive pattern; the organic layer is provided with the second conductive pattern, the second conductive pattern comprises at least one hollow structure, the area corresponding to the hollow area of the second conductive pattern on the organic layer is provided with the first protective layer, the first protective layer covers the area corresponding to the hollow area of the second conductive pattern on the organic layer, the organic layer can be prevented from being damaged by a solvent for stripping the photoresist pattern in the stripping process, the flatness of the organic layer is ensured, and the reliability of touch control is ensured while the flexibility is improved.
Drawings
FIG. 1 is a schematic illustration of forming a photoresist on a first metal layer;
fig. 2 is a schematic view of forming an organic layer on the first conductive pattern;
FIG. 3 is a schematic illustration of forming a first protective layer over an organic layer;
FIG. 4 is a schematic illustration of etching an organic layer and a first protective layer;
FIG. 5 is a schematic illustration of forming a conductive layer on the first protective layer;
FIG. 6 is a schematic illustration of forming a photoresist on a conductive layer;
FIG. 7 is a schematic diagram of forming a second conductive pattern;
FIG. 8 is a schematic diagram of the removal of photoresist on the second conductive pattern;
fig. 9 is a schematic view of forming a second protective layer on the second conductive pattern;
FIG. 10 is a schematic view of forming a first protective layer on an organic layer after forming a second conductive pattern;
fig. 11 is a simplified schematic diagram of an FMLOC structure.
Reference numerals
A first conductive pattern 10; a first metal layer 11; a photoresist 12; a mask plate 13;
an organic layer 20;
a second conductive pattern 30; a conductive layer 31; a photoresist 32; a mask plate 33;
a first touch electrode 34; a second touch electrode 35;
a first protective layer 40;
a photoresist pattern 50;
a second protective layer 60;
a substrate 70.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The touch structure provided in the embodiments of the present application is described in detail below with reference to fig. 1 to 11 by way of specific embodiments and application scenarios thereof.
As shown in fig. 9 and 10, an embodiment of the present application provides a touch structure, including:
the substrate 70, the substrate 70 may be a flexible material layer, and the substrate 70 may be a touch buffer layer;
a first conductive pattern 10 disposed on the substrate 70;
an organic layer 20 covering the first conductive pattern 10;
the second conductive pattern 30 is arranged on the organic layer 20, the second conductive pattern 30 comprises at least one hollow structure, the second conductive pattern 30 and the first conductive pattern 10 can be electrically connected through the through hole, a first protection layer 40 can be arranged on the organic layer 20 in a region corresponding to the hollow region of the second conductive pattern 30, the region corresponding to the hollow region of the second conductive pattern 30 on the organic layer 20 is covered by the first protection layer 40, the organic layer 20 is protected by the first protection layer 40, the organic layer 20 is prevented from being damaged by a solvent for stripping photoresist patterns in the stripping process, the flatness of the organic layer is ensured, and the touch reliability is ensured while the flexibility is improved.
In some embodiments, the first conductive pattern 10 may include a bridge electrode, the second conductive pattern 30 may include a plurality of first touch electrodes 34 and a plurality of second touch electrodes 35, two adjacent first touch electrodes 34 are directly connected, two adjacent second touch electrodes 35 may be connected with the bridge electrode through a via hole on the organic layer 20, and the solvent for stripping the photoresist pattern may not damage the organic layer 20 and the first conductive pattern 10 during stripping, so that the reliability of connection between the electrodes may be ensured, and further the reliability of touch control may be ensured. The first touch electrode 34 and the second touch electrode 35 may include a plurality of hollow structures, and each hollow structure may correspond to at least one sub-pixel light emitting area, so as to facilitate displaying.
In some embodiments, the first protective layer 40 may include a polymer layer having a fluorine-containing group, and the first protective layer 40 may be a polymer layer having a fluorine-containing group, since the polymer layer having a fluorine-containing group is poorly soluble in a non-fluorine solvent, the non-fluorine solvent may not damage the first protective layer 40 during removal of the photoresist pattern 50 on the second conductive pattern 30 by the non-fluorine solvent, thereby protecting the organic layer 20 by the first protective layer 40 from damaging the organic layer 20 during stripping of the photoresist pattern 50.
In other embodiments, as shown in fig. 9, a first protective layer 40 may be disposed between the second conductive pattern 30 and the organic layer 20, that is, the first protective layer 40 is disposed on the entire surface of the organic layer 20, and the second conductive pattern 30 is disposed on the first protective layer 40, so that damage to the organic layer 20 during stripping of the photoresist pattern 50 may be effectively avoided.
Alternatively, as shown in fig. 10, the first protection layer 40 may be located on the surface of the organic layer 20 and inside the hollow structure, and only the first protection layer 40 is required to be disposed on the surface of the organic layer 20 in the area of the hollow structure, so that the first protection layer 40 is not required to be disposed on the whole surface of the organic layer 20, and the organic layer 20 is protected by the first protection layer 40, so that the organic layer 20 is prevented from being damaged in the process of stripping the photoresist pattern 50.
In some embodiments, as shown in fig. 9 and 10, the touch structure may further include:
a second protective layer 60 covering the second conductive pattern 30. The second conductive pattern 30 is covered with a second protective layer 60, and the second conductive pattern 30 can be protected by the second protective layer 60.
In the application process, a touch structure is designed by an FMLOC (flexible multi-layer structure) process, which is to manufacture a metal grid electrode layer on a package substrate of a display panel so as to perform touch control. As shown in fig. 11, the first touch electrode 34 may be connected to Tx, which may be a transmitting electrode of a signal of the touch device, and the second touch electrode 35 may be connected to Rx, which may be a signal sensing electrode of the touch device. The Tx electrode and the Rx electrode are arranged on the same layer, the Tx electrode and the Rx electrode can be connected through connecting metal wires on the same layer, and the Rx electrode can be connected through a contact bridge mode. The stacked structure of the Rx contact bridge design (TFE encapsulation layer under FMLOC, OLED (organic light emitting diode) light emitting layer, TFT (thin film transistor) layer, substrate, etc. may use conventional design, which will not be described here any more) may be as shown in fig. 9. The substrate 70 may be a touch buffer layer, the first conductive pattern 10 may be a metal layer, which may be used as a bridge connection trace, and the second conductive pattern 30 may be a metal layer, which may be used as a sensing electrode block.
As shown in fig. 1 to 10, the method for manufacturing a touch structure according to an embodiment of the present application includes:
forming a first conductive pattern 10 on a substrate 70, wherein the substrate 70 may be a flexible material layer, and the substrate 70 may be a touch buffer layer;
forming an organic layer 20 covering the first conductive pattern 10, the first conductive pattern 10 may be protected by the organic layer 20, the organic layer 20 may be a flexible layer, and the organic layer 20 may be an insulating layer;
forming a second conductive pattern 30 and a first protective layer 40, wherein the first protective layer 40 covers an area of the organic layer 20 corresponding to the hollowed-out area of the second conductive pattern 30, and the second conductive pattern 30 comprises at least one hollowed-out structure; wherein the photoresist pattern 50 may be used as a mask in the process of forming the second conductive pattern 30, and the first protective layer 40 is formed before the photoresist pattern 50 is stripped to prevent the solvent for stripping the photoresist pattern from damaging the organic layer 20 during the stripping process.
In the preparation process, the organic layer 20 covering the first conductive pattern 10 is formed, the organic layer 20 may be an insulating layer, the flexibility is increased by the organic layer 20, the first conductive pattern 10 may be protected, the photoresist pattern 50 is used as a mask in the process of forming the second conductive pattern 30, the first protective layer 40 is formed before the photoresist pattern 50 is stripped, the organic layer 20 is prevented from being damaged in the process of stripping the photoresist pattern 50, for example, by arranging the first protective layer 40, the first protective layer 40 covers the area of the organic layer 20 corresponding to the hollowed-out area of the second conductive pattern 30, the organic layer 20 is prevented from being damaged by a solvent for stripping the photoresist pattern in the stripping process, the flatness of the organic layer is ensured, and the reliability of touch control is ensured while the flexibility is improved.
In some embodiments, the first conductive pattern 10 may include a bridge electrode, the second conductive pattern 30 may include a plurality of first touch electrodes 34 and a plurality of second touch electrodes 35, two adjacent first touch electrodes 34 are directly connected, two adjacent second touch electrodes 35 may be connected with the bridge electrode through a via hole on the organic layer 20, and the solvent for stripping the photoresist pattern may not damage the organic layer 20 and the first conductive pattern 10 during stripping, so that the reliability of connection between the electrodes may be ensured, and further the reliability of touch control may be ensured.
In some embodiments, as shown in fig. 1 to 8, the step of forming the second conductive pattern 30 and the first protective layer may include:
forming the first protective layer 40 on the organic layer 20, the first protective layer 40 may be formed on the entire surface of the organic layer 20, or the first protective layer 40 may be formed on a predetermined region on the organic layer 20 such that the first protective layer 40 covers a region of the organic layer 20 corresponding to the hollowed-out region of the second conductive pattern 30;
forming a conductive layer on the first protective layer 40, the first protective layer 40 may be formed on the entire surface of the organic layer 20, and a conductive layer, such as a metal layer, may be formed on the entire surface of the first protective layer 40;
forming a second conductive pattern 30 using the photoresist pattern 50 as a mask, and etching the conductive layer through the photoresist pattern 50 as a mask so that the conductive layer may form the second conductive pattern 30;
removing the photoresist pattern 50 on the second conductive pattern 30, since the first protective layer 40 is formed on the organic layer 20, the first protective layer 40 is formed before the photoresist pattern 50 is stripped, and damage to the organic layer 20 during stripping of the photoresist pattern 50 can be prevented.
In other embodiments, as shown in fig. 10, the step of forming the second conductive pattern 30 and the first protective layer may include:
forming a conductive layer on the organic layer 20;
forming a second conductive pattern 30 using the photoresist pattern 50 as a mask;
forming the first protective layer 40 on the organic layer 20 in a region corresponding to the hollowed-out region of the second conductive pattern 30, it may not be necessary to form the first protective layer 40 on the entire surface of the organic layer 20;
the photoresist pattern 50 on the second conductive pattern 30 is removed. By the first protective layer 40 of the hollowed-out region of the second conductive pattern 30, damage to the organic layer 20 during stripping of the photoresist pattern 50 can be avoided.
In an embodiment of the present application, as shown in fig. 9, after removing the photoresist pattern 50 on the second conductive pattern 30, it may further include:
the second protective layer 60 is formed to cover the second conductive pattern 30, that is, the second protective layer 60 is formed to cover the second conductive pattern 30, and the second conductive pattern 30 can be protected by the second protective layer 60.
In some embodiments, the first protective layer 40 may include a polymer layer having fluorine-containing groups, and the removing of the photoresist pattern 50 on the second conductive pattern 30 may include:
the photoresist pattern 50 on the second conductive pattern 30 is removed by a non-fluorine solvent. The first protective layer 40 may be a polymer layer having a fluorine-containing group, and since the polymer layer having a fluorine-containing group is poorly soluble in a non-fluorine solvent, the non-fluorine solvent does not damage the first protective layer 40 during the removal of the photoresist pattern 50 on the second conductive pattern 30 by the non-fluorine solvent, and thus the organic layer 20 is protected by the first protective layer 40, thereby avoiding damage to the organic layer 20 during the stripping of the photoresist pattern 50. The fluorine-containing organic layer needs a fluorine-containing solvent to be stripped and does not react with the stripping liquid of the photoresist, so that the stripping liquid is a fluorine-free solvent in the photoresist stripping process after etching, the first protective layer 40 is not damaged, and the flatness of the first protective layer 40 is ensured.
In some manufacturing processes of the touch structure, as shown in fig. 1 to 8, first, a substrate 70 (such as a touch buffer layer) may be deposited on the TFE (Thin Film Encapsulation) packaging layer, where the material of the substrate 70 may be an inorganic or organic material; the first metal layer 11 is deposited on the substrate 70 by PECVD (plasma enhanced chemical vapor deposition) and the material may be various transparent conductive layers such as ITO (indium tin oxide) -Ag-ITO, ti-AL-Ti, nano-silver, etc.; a layer of photoresist 12 is coated on the first metal layer 11, the photoresist 12 may be a positive photoresist, and the explicit photoresist is patterned by using a photo mask 13 to expose the area of the photoresist 12 to be removed. The positive photosensitive adhesive can be PMMA (polymethyl methacrylate), PMGI (polydimethyl glutarimide), phenolic resin and the like, can be washed by a solvent after illumination, and can use a non-fluorinated organic solvent as a main component;
as shown in fig. 2, after developing the photoresist, a positive trapezoid structure is formed, the first metal layer 11 is exposed, and the first metal layer 11 is etched and patterned, wherein the etching method may be dry etching, and then the remaining photoresist 12 is removed, and the solvent may be a normal solvent, and contains no fluorine, so as to form the first conductive pattern 10;
as shown in fig. 2, an organic layer 20 is deposited on the first conductive pattern 10, and a material of the organic layer 20 may be polyimide, PR (photoresist), photo-acrylate, etc., and the organic layer 20 may be formed by coating;
as shown in fig. 3, a thin first protection layer 40 is deposited on the organic layer 20, where the first protection layer 40 may be a fluorine-based photopolymer, and may be dissolved in a highly fluorinated solvent, such as HFE (hydrofluoroether), so as to avoid damage to the organic layer 20, and avoid defects of FMLOC routing or display non-uniformity;
the first protective layer 40 can be selectively removed by using a perfluorinated solvent after illumination for patterning to expose the positions of the contact holes, and meanwhile, the organic layer 20 can also be used as a mask plate for performing a punching process (can be removed by using a non-fluorinated solvent for wet etching) by using the patterned first protective layer 40, so that the patterned organic layer 20 is formed;
the fluorine content in the fluorine-based photosensitive polymer can be 15% -45%, the fluorine-containing group and the functional group (the solubility-changing reactive group can be insoluble and the full auxiliary solvent after the UV illumination reaction) can be selected from random copolymer of resorcinol, perfluorooctyl methacrylate and 2-nitrobenzyl methacrylate (FOMA-NBMA), FOMA-TBMA (perfluorooctyl methacrylate-tert-butyl methacrylate), FDMA-NBMA (perfluorodecyl methacrylate-2-nitrobenzyl methacrylate) and the like, the fluorine-containing group and the functional group can be dissolved in a perfluorinated solvent, the perfluorinated solvent is a green solvent, and the solvent of the conventional photoresist is orthogonal, namely, the two solvents only dissolve corresponding materials and do not react with other materials, namely, the perfluorinated solvent does not react with the conventional photoresist.
As shown in fig. 4 and 5, a conductive layer 31 is formed on the patterned first protective layer 40, the conductive layer 31 may be a metal layer, and the conductive layer 31 may be electrically connected to the first conductive pattern 10 through a via hole;
as shown in fig. 6, a photoresist 32 is formed on the conductive layer 31; etching the photoresist 32 through the mask plate 33 to form a photoresist pattern 50;
as shown in fig. 7, the second conductive pattern 30 is formed using the photoresist pattern 50 as a mask, and the conductive layer 31 is etched through the photoresist pattern 50 as a mask so that the conductive layer 31 may form the second conductive pattern 30;
as shown in fig. 8, the photoresist pattern 50 on the second conductive pattern 30 is removed, the stripping solvent of the photoresist pattern 50 is a non-fluorine solvent and does not react with the fluorine-based photosensitive material, the stripping solvent cannot damage the underlying first protective layer 40, damage to the organic layer 20 is avoided, flexibility is provided for the screen, performance of the polymer is not affected, and reliability of the product is improved;
then, as shown in fig. 9, a second protective layer 60 is coated on the second conductive pattern 30, where the second protective layer 60 may be OC (Over Coat) adhesive, and the OC adhesive may be a transparent resin material, and provides a certain flexibility while protecting metal.
In another manufacturing process, after the first conductive pattern 10 is formed, the organic layer 20 may be formed, and the conductive layer 31 may be formed on the organic layer 20;
forming a photoresist 32 on the conductive layer 31; etching the photoresist 32 through the mask plate 33 to form a photoresist pattern 50;
as shown in fig. 10, the second conductive pattern 30 is formed using the photoresist pattern 50 as a mask;
forming a first protective layer 40 on the organic layer 20 in a region corresponding to the hollowed-out region of the second conductive pattern 30;
the photoresist pattern 50 on the second conductive pattern 30 is removed, and damage to the organic layer 20 during stripping of the photoresist pattern 50 can be prevented by the first protective layer 40 of the hollowed-out region of the second conductive pattern 30.
Then, a second protective layer 60 is coated on the second conductive pattern 30 to protect the metal and provide a certain flexibility;
after the second conductive pattern 30 is formed, a fluorine-based polymer is deposited on the organic layer 20 in a region corresponding to the hollowed-out region of the second conductive pattern 30 as the first protective layer 40, and a fluorine-based polymer material (which may be non-photosensitive) is deposited at the hollowed-out region by patterning of photoresist, so that the organic layer 20 between metals is not damaged when the photoresist pattern 50 is stripped, and meanwhile, the fluorine-based polymer on the photoresist pattern 50 is removed, and the content of the fluorine-based polymer left in the structure is reduced.
An embodiment of the present application provides a display panel, including the touch structure described in the above embodiment. The display panel having the touch structure described in the above embodiments, the first protective layer 40 may protect the organic layer 20, ensure the flatness of the organic layer, and ensure the reliability of touch while improving flexibility. The first touch electrode 34 and the second touch electrode 35 respectively include a plurality of hollow structures, and each hollow structure corresponds to at least one sub-pixel light emitting area, so as to facilitate display.
An embodiment of the present application provides a display device including the display panel described in the above embodiment. In the display device with the display panel described in the above embodiment, the first protective layer in the display panel can protect the organic layer, ensure the flatness of the organic layer, and ensure the reliability of touch control while improving flexibility.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.
Claims (9)
1. A touch structure, comprising:
a substrate;
a first conductive pattern disposed on the substrate;
an organic layer covering the first conductive pattern;
a second conductive pattern is arranged on the organic layer, the second conductive pattern comprises at least one hollow structure, and a first protective layer is arranged on the organic layer in a region corresponding to the hollow region of the second conductive pattern;
the first conductive patterns comprise bridge electrodes, the second conductive patterns comprise a plurality of first touch electrodes and a plurality of second touch electrodes, two adjacent first touch electrodes are directly connected, and two adjacent second touch electrodes are connected with the bridge electrodes through holes in the organic layer;
the first protective layer includes a polymer layer having fluorine-containing groups.
2. The touch structure according to claim 1, wherein the first protective layer is disposed between the second conductive pattern and the organic layer; or alternatively
The first protection layer is positioned on the surface of the organic layer and inside the hollow structure.
3. The touch structure of claim 1, further comprising:
and a second protective layer covering the second conductive pattern.
4. A method for manufacturing a touch structure according to any one of claims 1 to 3, comprising:
forming a first conductive pattern on a substrate;
forming an organic layer covering the first conductive pattern;
forming a second conductive pattern and a first protective layer, wherein the first protective layer covers an area corresponding to a hollowed-out area of the second conductive pattern on the organic layer, and the second conductive pattern comprises at least one hollowed-out structure;
wherein the first protective layer is formed before the photoresist pattern is stripped using the photoresist pattern as a mask in forming the second conductive pattern.
5. The method according to claim 4, wherein the first conductive pattern includes a bridge electrode, the second conductive pattern includes a plurality of first touch electrodes and a plurality of second touch electrodes, two adjacent first touch electrodes are directly connected, and two adjacent second touch electrodes are connected to the bridge electrode through a via hole on the organic layer.
6. The method of manufacturing according to claim 4, wherein the step of forming the second conductive pattern and the first protective layer includes:
forming a first protective layer on the organic layer;
forming a conductive layer on the first protective layer;
forming a second conductive pattern using the photoresist pattern as a mask;
removing the photoresist pattern on the second conductive pattern; or alternatively
The step of forming the second conductive pattern and the first protective layer includes:
forming a conductive layer on the organic layer;
forming a second conductive pattern using the photoresist pattern as a mask;
forming a first protection layer on the organic layer in a region corresponding to the hollowed-out region of the second conductive pattern;
and removing the photoresist pattern on the second conductive pattern.
7. The method of manufacturing according to claim 6, further comprising, after removing the photoresist pattern on the second conductive pattern:
forming a second protective layer covering the second conductive pattern; and/or
The first protective layer includes a polymer layer having a fluorine-containing group, and the step of removing the photoresist pattern on the second conductive pattern includes:
and removing the photoresist pattern on the second conductive pattern by a non-fluorine solvent.
8. A display panel comprising a touch structure as claimed in any one of claims 1-3.
9. A display device comprising the display panel of claim 8.
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| CN202110982276.4A CN113778259B (en) | 2021-08-25 | Touch structure, manufacturing method, display panel and display device |
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| CN202110982276.4A CN113778259B (en) | 2021-08-25 | Touch structure, manufacturing method, display panel and display device |
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