CN113777536B - Testing jig, testing device and testing method for electrode patches - Google Patents
Testing jig, testing device and testing method for electrode patches Download PDFInfo
- Publication number
- CN113777536B CN113777536B CN202111328266.5A CN202111328266A CN113777536B CN 113777536 B CN113777536 B CN 113777536B CN 202111328266 A CN202111328266 A CN 202111328266A CN 113777536 B CN113777536 B CN 113777536B
- Authority
- CN
- China
- Prior art keywords
- electrode
- patch
- electrode patch
- interface
- test fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The embodiment of the application provides a test fixture, a test device and a test method for an electrode patch. This test fixture includes: the jig comprises a jig body, an element switching assembly, an electrode switching assembly and a grounding switching assembly, wherein the element switching assembly, the electrode switching assembly and the grounding switching assembly are respectively connected with the jig body; the element switching assembly is used for being electrically connected with the thermosensitive element of the electrode patch; the electrode switching assembly is used for being electrically connected with the electrode of the electrode patch; the grounding adapter component is used for grounding. The embodiment of the application realizes the amplification visualization of the ports of all lines in the electrode patch by designing the test fixture of the electrode patch, and realizes the simple operation of the electrical connection between the element tester and the electrode patch under the auxiliary action of the test fixture. Therefore, whether the welding between the thermosensitive element in the electrode patch and the circuit board is qualified or not and whether the thermosensitive element is insulated from the electrode of the electrode patch or not can be simply and accurately tested.
Description
Technical Field
The application relates to the technical field of testing, in particular to a testing jig, a testing device and a testing method for an electrode patch.
Background
Since 1980, electric fields have been commonly used in the biological and medical fields, including technical means of killing microorganisms, cell fusion, gene transformation, and tumor treatment. In 2004, scientific research shows that the proliferation process of tumor cells can be selectively inhibited under the action of alternating electric fields with low electric field intensity (1-2 volts per centimeter) and medium and low frequencies (100-300 kilohertz). With the gradual and intensive research on the action mechanism of the tumor treatment electric field by scientists, the tumor electric field treatment as a novel tumor treatment method has many potential advantages compared with the traditional operation and radiotherapy and chemotherapy.
The action mechanism of tumor electric field treatment is that the electric field is utilized to block the mitosis process of cells so that the pathological cells can not normally complete division and finally apoptosis is caused. The specific action means is that the electrode patch is pasted on a focus area, and a low-intensity and medium-frequency alternating current electric field is output to act on the focus area; finally, or in the early stage of mitosis of cancer cells, the microtubules consisting of polar molecules are polarized in a turning way by the action of the electric field force and move along the direction with stronger field intensity, so that the microtubules can not be gathered into spindle yarns, and the mitosis of the cancer cells is stopped; or at the end of mitosis, under the condition that the direction of the applied electric field force is parallel to the long axis of the dividing cell, the density of electric field force lines and cytoplasm at the narrow mitotic groove is highest, so that the cell membrane at the mitotic groove is broken, and the cancer cell can not divide two complete new cancer cells and finally die.
The electrode patch is used as an important device for tumor electric field treatment, and the structure of the electrode patch directly influences the performance of an electric field. The electrode patch of the prior art is usually configured to have a heat sensitive element for detecting the temperature of the electrode patch applied to the surface of the human body. If the position of the heat sensitive element on the electrode patch is shifted or is not firmly connected, the heat sensitive element cannot normally detect the temperature. However, no electrode patch testing device is available in the market at present for directly and conveniently detecting whether the thermosensitive element is welded to the circuit board or not or whether the thermosensitive element is insulated from the electrode or not.
Disclosure of Invention
The application provides a test fixture, a test device and a test method for an electrode patch aiming at the defects of the prior art, and aims to solve the technical problem that whether a thermosensitive element is welded with a flexible circuit board to be qualified or not or whether the thermosensitive element is insulated from an electrode or not in the prior art.
In a first aspect, an embodiment of the present application provides a test fixture for an electrode patch, including: the jig comprises a jig body, and an element switching assembly, an electrode switching assembly and a grounding switching assembly which are respectively connected with the jig body.
The element switching component is used for being electrically connected with the thermosensitive element of the electrode patch.
The electrode adapter assembly is used for being electrically connected with the electrodes of the electrode patch.
The grounding adapter component is used for grounding.
And under the condition of detecting the welding state of the thermosensitive element of the electrode patch and the circuit board, the element switching component and the grounding switching component are respectively and also used for being electrically connected with an element tester.
Under the condition of detecting the insulation state of the thermosensitive element of the electrode patch and the electrode, the element switching component and the electrode switching component are respectively used for being connected with an element tester.
Optionally, the element adapter assemblies correspond to the heat sensitive elements of at least some of the electrode patches one-to-one.
Optionally, each of the element transition assemblies comprises: the electrode patch comprises an element interface and an element pin which are electrically connected with each other, wherein the element interface is used for being electrically connected with an element tester, and the element pin is used for being electrically connected with a thermosensitive element of the electrode patch.
Optionally, the electrode adapter assembly comprises: the electrode interface is used for being electrically connected with an element tester, and the electrode pin is used for being electrically connected with an electrode of the electrode patch.
Optionally, the ground adapter assembly comprises: the device comprises a ground wire interface and a ground wire pin which are electrically connected with each other, wherein the ground wire interface is used for being electrically connected with the element tester, and the ground wire pin is used for being electrically connected with the ground wire.
Optionally, at least some of the component interfaces are located on the same side, adjacent sides, or opposite sides, respectively, of the fixture body.
Optionally, the electrode interface and at least part of the component interface are located on the same side of the jig body.
Optionally, the ground interface and at least some of the component interfaces are located on the same side of the fixture body.
Optionally, at least the element pin, the electrode pin and the ground pin are integrated to form a patch interface, and the patch interface is used for being electrically connected with an interface end of the electrode patch.
Optionally, the patch interface comprises: at least two different types of sub patch interfaces, at least part of which are used for being electrically connected with the interface ends of the different types of electrode patches in a one-to-one correspondence mode.
Optionally, at least some of the sub-patch interfaces are located on the same side, adjacent sides, or opposite sides of the fixture body, respectively.
In a second aspect, an embodiment of the present application provides a testing apparatus for an electrode patch, including: the electrode patch test jig according to the first aspect and the component tester are provided.
Under the condition that the first end of the element tester is connected with the grounding adapter assembly in the test fixture, the second end of the element tester is connected with the element adapter assembly in the test fixture. And under the condition that the second end of the element tester is connected with the electrode switching assembly in the test fixture, the first end of the element tester is connected with the element switching assembly in the test fixture.
In a third aspect, an embodiment of the present application provides a testing method for a testing apparatus based on the electrode patch provided in the second aspect, including:
a first measurement value between the element adapter assembly and the grounding adapter assembly in the test fixture is obtained.
And determining the welding state of the thermosensitive element in the electrode patch and the circuit board in the electrode patch according to the relation between the first measured value and the first reference threshold value.
Optionally, determining the welding state of the heat sensitive element in the electrode patch and the circuit board in the electrode patch according to the relationship between the first measurement value and the first reference threshold value, including:
and if the first measured value is not larger than the first reference threshold value, determining that the welding state of the thermosensitive element in the electrode patch and the circuit board in the electrode patch is effective.
And if the first measured value is larger than the first reference threshold value, determining that the welding state of the thermosensitive element in the electrode patch and the circuit board in the electrode patch is invalid.
In a fourth aspect, the present invention provides another testing method for a testing apparatus based on the electrode patch provided in the second aspect, including:
and acquiring a second measurement value between the element switching assembly and the electrode switching assembly in the test fixture.
And determining the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch according to the relation between the second measured value and the second reference threshold value.
Optionally, determining the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch according to a relationship between the second measurement value and a second reference threshold, including:
and if the second measured value is not larger than the second reference threshold value, determining that the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch is invalid.
And if the second measured value is larger than the second reference threshold value, determining that the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch is effective.
The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise:
the test fixture of electrode paster that provides in this application is provided with each switching subassembly, and the component switching subassembly among the test fixture corresponds with the thermal element in the electrode paster respectively and realizes the electricity to be connected, and the electrode switching subassembly corresponds with the electrode in the electrode paster respectively and realizes the electricity to be connected, and ground connection switching subassembly is used for ground connection. The ports of all lines in the electrode patch are enlarged and visualized, and the element tester is electrically connected with the electrode patch under the auxiliary action of the test fixture, so that the simple operation is realized. Therefore, under the condition that the test fixture is matched with the element tester to test the thermosensitive element of the electrode patch, the interface of each line in the electrode patch is clear, so that the problems that each line is mistakenly overlapped or the port is not clear due to confusion, the accurate test cannot be carried out and the like are solved, and the accuracy of an element test result is improved.
In addition, the electrode paster's that this application provided test fixture is provided with electrode switching subassembly and ground connection switching subassembly respectively except that the component switching subassembly, can weld qualified and whether heat-sensitive element and the circuit board among the electrode paster are insulated with the electrode of electrode paster carries out simple and easy accurate test to heat-sensitive element. Therefore, when the electrode patch acts on a human body, each thermosensitive element on the electrode patch is ensured to be in a normal working state, and the function of detecting the surface temperature of the human body is fully exerted in the process of acting on a focus area.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic cross-sectional view of a patch interface of a test fixture for electrode patches according to an embodiment of the present disclosure;
fig. 2 is a cross-sectional view of the patch interface of fig. 1 taken along direction a according to an embodiment of the present disclosure;
fig. 3 is a schematic perspective view of a test fixture for an electrode patch according to an embodiment of the present disclosure;
fig. 4 is a schematic perspective view of another testing fixture for electrode patches according to an embodiment of the present disclosure;
fig. 5 is a schematic perspective view of a testing fixture for an electrode patch according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of an electrode patch according to an embodiment of the present disclosure;
fig. 7 is a schematic flowchart of a testing method of an electrode patch according to an embodiment of the present disclosure;
fig. 8 is a schematic flow chart of another testing method for an electrode patch according to an embodiment of the present disclosure.
In the figure:
100-testing the fixture; 110-a jig body;
120-a component transfer assembly; 121-component interface; 122-component pins;
130-an electrode adapter assembly; 131-an electrode interface; 132-electrode pins;
140-a ground adapter assembly; 141-ground interface; 142-ground pin;
102-a patch interface; 1021-a first patch interface; 1022-a second patch interface;
200-electrode patch;
201-a thermosensitive element; 202-an electrode; 203-a circuit board;
204-electrode vias; 205-a transmission line; 206-interface end.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The inventor of the application researches and discovers that the tumor therapeutic apparatus based on the tumor electric field therapy technology acts on the human body mainly by means of at least two pairs of electrode patches, the electrode patches mainly comprise a medical adhesive tape, a circuit board and a circular electrode provided with a dielectric layer, wherein a pulse wire is arranged inside the circuit board, an electrode through hole is formed in the center of the circular electrode, and a thermosensitive element is arranged at the electrode through hole and used for detecting the temperature of the electrode patches acting on the surface of the human body.
The thermosensitive element is usually fixed on the circuit board in a welding mode, and if the thermosensitive element is not welded with the circuit board, the position of the thermosensitive element is deviated and even falls off, and the temperature cannot be detected normally. In addition, because the thermosensitive element is arranged at the through hole of the electrode, the thermosensitive element can be in contact with the electrode to be electrically connected with the electrode due to slight deviation, so that the voltage of the thermosensitive element is unstable, the thermosensitive element is easy to burn out, and the temperature cannot be normally detected.
However, in the conventional method of detecting a good product of an electrode patch, only whether voltage signal transmission of an electrode in the electrode patch is normal is tested, and there is no electrode patch testing apparatus capable of testing whether a thermosensitive element of the electrode patch is soldered to a circuit board satisfactorily and whether the thermosensitive element is insulated from the electrode.
The application provides a test fixture, a test device and a test method of an electrode patch, and aims to solve the technical problems in the prior art.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the present application provides a test fixture 100 for electrode patches, as shown in fig. 1, including: the fixture body 110, the component adapter assembly 120, the electrode adapter assembly 130 and the grounding adapter assembly 140 are respectively connected with the fixture body 110.
The element adapter assembly 120 is used for electrically connecting with the heat sensitive element 201 of the electrode patch.
The ground adapter 140 is used for grounding.
In the case of detecting the soldering state of the heat sensitive element 201 of the electrode patch and the circuit board 203, the element relay assembly 120 and the ground relay assembly 140 are also used for electrical connection with the element tester, respectively.
In the case of detecting the insulation state of the thermosensitive element 201 of the electrode patch and the electrode 202, the element relay assembly 120 and the electrode relay assembly 130 are also used for connection with an element tester, respectively.
The electrode patch testing jig 100 provided in the present embodiment is provided with an element adapter assembly 120, an electrode adapter assembly 130, and a grounding adapter assembly 140, which are electrically connected to the thermosensitive element 201, the electrode 202, and the ground of the electrode patch, respectively. The cooperation of the testing fixture 100 and the element tester can realize the detection of whether the soldering of the heat-sensitive element 201 and the circuit board 203 of the electrode patch is qualified and whether the heat-sensitive element 201 and the electrode 202 are insulated.
Alternatively, the jig body 110 in the present embodiment is rectangular, conical, or the like.
Optionally, the circuit board in this embodiment is a flexible circuit board, a rigid circuit board, or a combination of flexible and rigid circuit boards.
Alternatively, the thermosensitive element in the present embodiment is a thermistor, a bimetal, a semiconductor material, or the like.
Alternatively, the element tester in this embodiment may employ a resistance tester.
The inventor of the present application considers that different numbers of thermosensitive elements 201 are correspondingly disposed on different types of electrode patches, and the test fixture 100 for electrode patches provided in this embodiment needs to be matched and adapted to different types of electrode patches. Therefore, the present application provides one possible implementation manner for the electrode patch testing fixture 100 as follows:
the element switching components 120 correspond to the thermosensitive elements 201 of at least part of the electrode patches one by one.
In this embodiment, the element adapter assemblies 120 of the electrode patch testing fixture 100 are in a one-to-one correspondence relationship with at least some of the thermosensitive elements 201 of the electrode patches to be tested, each element adapter assembly 120 and each corresponding thermosensitive element 201 form a respective closed loop, and for electrode patches with different numbers of thermosensitive elements 201, the testing fixture 100 itself has high adaptability and inclusion, and can test electrodes 202 of different models.
In one example, as shown in fig. 1 and 6, the test fixture 100 of the electrode patch is provided with 9 element adapter assemblies 120 a-I, respectively, and the electrode patch is provided with 9 thermal elements 201 a-I, respectively. The element adapter assemblies a-I on the test fixture 100 are respectively corresponding to the thermal sensitive elements a-I on the electrode patches for performing element testing, and the element adapter assemblies 120 in the test fixture 100 are fully utilized.
In one example, the electrode patch testing jig 100 is provided with 9 element adapter assemblies 120, which are respectively a-I, and the electrode patch is provided with 6 thermal sensitive elements 201, which are respectively a-F, so that the element adapter assemblies a-F on the testing jig 100 respectively correspond to the thermal sensitive elements a-F on the electrode patch one-to-one for performing element testing, the remaining element adapter assemblies G-I on the testing jig 100 are not used, and the element adapter assemblies 120 in the testing jig 100 are partially used.
In one example, the test fixture 100 of the electrode patch is provided with 9 element switching assemblies 120, a-I respectively, and the electrode patch is provided with 12 thermal sensitive elements 201, a-l respectively, so that the element switching assemblies a-I on the test fixture 100 respectively correspond to the thermal sensitive elements a-I on the electrode patch one-to-one to perform element tests, and the remaining thermal sensitive elements j-l of the electrode patch cannot be tested, in which case, only the thermal sensitive elements 201 in the electrode patch are subjected to sampling tests, but not all tests.
The inventor of the present application considers that the element adapter assembly 120, the electrode adapter assembly 130 and the ground adapter assembly 140 respectively need a medium for electrically connecting the heat sensitive element 201, the electrode 202 and the ground in the electrode patch, so that the testing jig 100 and the element tester cooperatively test the welding state and the insulation state of the heat sensitive element 201. Therefore, the present application provides three possible implementation manners for the electrode patch testing fixture 100 as follows:
in a first embodiment, each of the component transition assemblies 120 includes: and the element interface 121 and the element pin 122 are electrically connected with each other, the element interface 121 is used for being electrically connected with an element tester, and the element pin 122 is used for being electrically connected with the thermosensitive element 201 of the electrode patch.
In a second embodiment, the electrode adapter assembly 130 includes: and the electrode interface 131 and the electrode pin 132 are electrically connected with each other, the electrode interface 131 is used for being electrically connected with the element tester, and the electrode pin 132 is used for being electrically connected with the electrode 202 of the electrode patch.
In a third embodiment, the ground transition assembly 140 includes: and a ground interface 141 and a ground pin 142 electrically connected to each other, wherein the ground interface 141 is used for electrically connecting with the component tester, and the ground pin 142 is used for electrically connecting with the ground.
It should be noted that the above three implementation manners of each switching component in the embodiments of the present application may be implemented in any combination according to specific objects and scenes, and are not limited to a single implementation manner.
In any of the three embodiments, each adapter module is composed of interfaces and pins electrically connected to each other, each interface constitutes a medium for electrically connecting the electrode patch test fixture 100 and the component tester, and each pin forms a medium for electrically connecting the electrode patch test fixture 100 and the electrode patch. The test fixture 100, the element tester and the electrode patches together form a completed closed loop to test the welding state and the insulation state of the thermosensitive element 201.
The inventor of the present application considers that, in general, the electrode patch has a plurality of heat sensitive elements 201 therein, and therefore, a plurality of element interfaces 121 are provided in the corresponding test fixture 100, and the positions where the element interfaces 121 can be provided are limited by the shape and size of the element interfaces 121 themselves relative to the fixture body 110. Therefore, the present application provides one possible implementation manner for the electrode patch testing fixture 100 as follows:
at least some of the component interfaces 121 are located on the same side, adjacent sides, or opposite sides of the fixture body 110, respectively.
In the present embodiment, the device interface 121 can be flexibly designed and arranged according to the specific size of the fixture body 110, thereby reducing the material and process costs.
In one example, the test fixture 100 is provided with 9 device interfaces 121, and the 9 device interfaces 121 are all disposed on the same side of the fixture body 110.
In one example, the testing fixture 100 is provided with 6 component interfaces 121, which are divided into 2 groups, each group has 3 component interfaces 121, and the component interfaces 121 are respectively disposed on two adjacent sides of the fixture body 110.
In one example, the testing fixture 100 is provided with 8 component interfaces 121, which are divided into 2 groups, each group has 4 component interfaces 121, and the component interfaces 121 are respectively disposed on two opposite sides of the fixture body 110.
The inventors of the present application considered that the electrode pad test fixture 100 needs to be more easily assembled during the testing process in cooperation with the component tester. Therefore, the present application provides one possible implementation manner for the electrode patch testing fixture 100 as follows:
the electrode interface 131 and at least a portion of the component interface 121 are located on the same side of the fixture body 110.
Optionally, the ground interface 141 and at least some of the component interfaces 121 are located on the same side of the fixture body 110.
In this embodiment, when testing the thermal element 201, the element interface 121, the electrode interface 131 and the ground line interface 141 are all used for being connected with an element tester, so that three interfaces or two of the three interfaces are all arranged on the same side of the test fixture 100, which is beneficial to rapidly and simply assembling a test device and testing the thermal element 201 of an electrode patch during testing, and improves the convenience of device testing.
In one example, when the test fixture 100 has 9 element interfaces 121, 1 electrode interface 131, and 1 ground interface 141, the arrangement includes the following 4 types:
first, as shown in fig. 3, the component interface 121, the electrode interface 131, and the ground interface 141 are disposed at the top end of the test fixture 100.
Secondly, the component interface 121 and the electrode interface 131 are both disposed at the top end of the test fixture 100, and the ground line interface 141 is disposed at the adjacent side of the top end of the test fixture 100.
Thirdly, the component interface 121 and the ground interface 141 are both disposed at the top end of the test fixture 100, and the electrode interface 131 is disposed at the adjacent side of the top end of the test fixture 100.
Fourth, as shown in fig. 4, the device interface 121 is disposed at the top end of the test fixture 100, and the electrode interface 131 and the ground interface 141 are disposed at the same side of the top end of the test fixture 100.
It should be noted that the positions of the three interfaces may be determined in a trade-off manner according to various influencing factors during the test process, and are not limited to be disposed on the same side. In this embodiment, the relative positions of the interfaces are not limited.
The inventor of the present application considers that each pin is used as a connection wire led out from the internal circuit of the test fixture 100 of the electrode patch to the peripheral circuit, and finally a completed interface is required to be formed to electrically connect with the external circuit. For this reason, as shown in fig. 2, the present application provides one possible implementation manner for the test fixture 100 of the electrode patch:
at least the element pin 122, the electrode pin 132 and the ground pin 142 are integrated to form a patch interface 102, and the patch interface 102 is used for electrically connecting with an interface end 206 of the electrode patch.
In the present embodiment, the patch interface 102 includes at least one of the element pin 122, the electrode pin 132 and the ground pin 142, and is used to be electrically connected to the interface end 206 of the electrode patch, so as to electrically connect the test fixture 100 of the electrode patch to the electrode patch.
The present application provides one possible implementation manner for the electrode patch testing fixture 100:
the patch interface 102 includes: at least two different types of sub-patch interfaces, at least some of which are adapted to be electrically connected in one-to-one correspondence with the interface ends 206 of the different types of electrode patches.
In this embodiment, the patch interface 102 of the test fixture 100 is divided into a first patch interface 1021 and a second patch interface 1022, where the first patch interface 1021 is used to be electrically connected with the interface end 206 of the first electrode patch, and the second patch interface 1022 is used to be electrically connected with the interface end 206 of the second electrode patch.
It should be noted that, since various types of electrode patches may exist in the market at present, the sub-patch interfaces are not limited to the first patch interface 1021 and the second patch interface 1022, and 3, 4, 5, … …, and n patch interfaces may be designed according to various types of electrode patches known in the market.
The inventor of the present application considers that the positions of the sub-patch interfaces in the test fixture 100 can also be designed according to the requirements of the manufacturing process or the test. Therefore, the present application provides one possible implementation manner for the electrode patch testing fixture 100 as follows:
at least some of the sub-patch interfaces are located on the same side, adjacent sides, or opposite sides of the fixture body 110, respectively.
In the embodiment, the sub-chip interface is disposed at a flexible position to adapt to the overall structure of the test fixture 100. Ultimately to facilitate electrical connection between the test fixture 100 and the electrode patches.
In one example, as shown in fig. 4, the test fixture 100 is provided with two patch interfaces 102, and the first patch interface 1021 and the second patch interface 1022 are located at two opposite sides of the fixture body 110.
In one example, as shown in fig. 5, the test fixture 100 is provided with two patch interfaces 102, and the first patch interface 1021 and the second patch interface 1022 are located on the same side of the fixture body 110.
In one example, the test fixture 100 is provided with 4 kinds of patch interfaces 102, the 4 kinds of patch interfaces 102 are divided into two groups, and the patch interfaces 102 of each group are respectively located at two adjacent sides of the fixture body 110.
It should be noted that the number of the patch interfaces 102 of the test fixture 100 can be set according to actual needs and specific situations, and is not limited to the listed situations in this embodiment.
Based on the same inventive concept, the embodiment of the present application provides a testing apparatus for an electrode patch, including but not limited to: the test fixture 100 for electrode patches and the component tester provided in the above embodiments are provided.
In the case that the first end of the component tester is connected to the ground adapter 140 in the test fixture 100, the second end of the component tester is connected to the component adapter 120 in the test fixture 100. In the case that the second end of the device tester is connected to the electrode adapter 130 of the test fixture 100, the first end of the device tester is connected to the device adapter 120 of the test fixture 100.
In the embodiment, when the first end of the component tester is connected to the grounding adapter 140 in the test fixture 100, the second end of the component tester is connected to the component adapter 120 in the test fixture 100, so as to test whether the thermal sensitive element 201 of the electrode patch is soldered to the circuit board 203. Under the condition that the second end of the component tester is connected with the electrode adapter assembly 130 in the test fixture 100, the first end of the component tester is connected with the component adapter assembly 120 in the test fixture 100, and is used for testing whether the thermosensitive element 201 of the electrode patch is insulated from the electrode 202.
Optionally, the component tester in the embodiment of the present application employs an multimeter. The negative terminal (black pen) of the multimeter is the first terminal in this embodiment and the positive terminal (red pen) is the second terminal in this embodiment.
Based on the same inventive concept, an embodiment of the present application provides a testing method of a testing apparatus for an electrode patch provided in the foregoing embodiment, and as shown in fig. 7, the testing method includes the following steps S101 to S102:
s101: a first measurement value between the component adapter 120 and the ground adapter 140 of the test fixture 100 is obtained.
Before step S101, the first end of the component tester can be connected to the ground adapter 140 of the test fixture 100 by the relevant tester, and after the second end of the component tester is connected to the component adapter 120 of the test fixture 100, the component tester and the test fixture 100 form a complete closed loop: the first end of the component tester-the ground adapter assembly 140-the ground-the thermal sensor 201-the component adapter assembly 120-the second end of the component tester.
In step S101, a first measurement value measured in real time between the component adapter 120 and the ground adapter 140 of the test fixture 100 may be obtained from the component tester by the host computer.
S102: and determining the welding state of the heat-sensitive element 201 in the electrode patch and the circuit board 203 in the electrode patch according to the relation between the first measured value and the first reference threshold value.
In step S102, the host computer compares the measured first measurement value with a first reference threshold value according to a relationship between the first measurement value and the first reference threshold value, which are set in advance, and determines the soldering state of the heat sensitive element 201 in the electrode patch and the circuit board 203 in the electrode patch.
Optionally, determining the welding state of the heat-sensitive element 201 in the electrode patch and the circuit board 203 in the electrode patch according to the relationship between the first measurement value and the first reference threshold value comprises:
if the first measurement value is not greater than the first reference threshold value, the welding state of the heat sensitive element 201 in the electrode patch and the circuit board 203 in the electrode patch is determined to be valid.
If the first measurement value is greater than the first reference threshold value, it is determined that the soldering state of the heat sensitive element 201 in the electrode patch and the circuit board 203 in the electrode patch is invalid.
In this embodiment, according to the standard and precision of the testing field, in combination with the testing method of the above embodiment, the host computer sets a first reference threshold of the thermal element 201 in advance in the system, after obtaining the testing result of the element tester, compares the first measurement value measured by the element tester with the first reference threshold, and if the first measurement value is not greater than the first reference threshold, determines that the electrical connection relationship between the thermal element 201 in the electrode patch and the flexible lead on the circuit board 203 in the electrode patch can be achieved, and the welding state of the two is valid. If the first measured value is larger than the first reference threshold value, it is determined that the thermal element 201 in the electrode patch is not electrically connected with the flexible lead on the circuit board 203 in the electrode patch, and the welding state of the two is invalid.
In one example, the thermistor 201 in the electrode patch is a thermistor of model NTCG163JX103DT1S, and the resistance value of the thermistor 201 in the electrode patch is 19K Ω at room temperature (15-25 ℃), at which the first reference threshold can be set to 20K Ω. If the first measurement value is 19.1K Ω, it can be concluded that the soldering state between the heat-sensitive element 201 in the electrode patch and the flexible wire on the circuit board 203 in the electrode patch is valid. If the first measurement is infinite, it can be concluded that the soldering state between the heat sensitive element 201 in the electrode patch and the flexible wire on the circuit board 203 in the electrode patch is invalid. It should be noted that different first reference thresholds may be set according to the room temperature corresponding to different seasons.
Based on the same inventive concept, an embodiment of the present application provides another testing method of a testing apparatus for an electrode patch provided based on the foregoing embodiment, as shown in fig. 8, the testing method includes the following steps S201 to S202:
s201: a second measurement between the device adapter 120 and the electrode adapter 130 of the test fixture 100 is obtained.
Before step S201, the second end of the device tester may be connected to the electrode adapter 130 of the test fixture 100 by the relevant tester, and after the first end of the device tester is connected to the device adapter 120 of the test fixture 100, the device tester and the test fixture 100 form a complete closed loop: the second end of the component tester-electrode adapter assembly 130-electrode 202-thermistor 201-component adapter assembly 120-the first end of the component tester.
In step S201, a second measurement value measured in real time between the component adapter 120 and the electrode adapter 130 of the test fixture 100 may be obtained from the component tester by the host computer.
S202: and determining the insulation state of the thermosensitive element 201 in the electrode patch and the electrode 202 in the electrode patch according to the relation between the second measured value and the second reference threshold value.
In step S202, the host computer compares the measured second measurement value with a second reference threshold value according to a relationship between the preset second measurement value and the second reference threshold value, and determines the insulation state between the thermosensitive element 201 in the electrode patch and the electrode 202 in the electrode patch.
Optionally, determining the insulation state of the thermosensitive element 201 in the electrode patch and the electrode 202 in the electrode patch according to the relationship between the second measurement value and the second reference threshold value, including:
if the second measurement value is not greater than the second reference threshold value, the insulation state of the heat sensitive element 201 in the electrode patch and the electrode 202 in the electrode patch is determined to be invalid.
If the second measurement value is greater than the second reference threshold value, the insulation state of the heat sensitive element 201 in the electrode patch and the electrode 202 in the electrode patch is determined to be valid.
In this embodiment, according to the method of the foregoing embodiment, similarly, the host computer sets a second reference threshold of the thermal element 201 in advance in the system, compares a second measurement value measured by the component tester with the second reference threshold after obtaining the test result of the component tester, and determines that the thermal element 201 in the electrode patch and the electrode 202 in the electrode patch are electrically connected and the insulation state therebetween is invalid if the second measurement value is not greater than the second reference threshold. If the second measurement value is greater than the second reference threshold value, it is determined that the thermosensitive element 201 in the electrode patch is not in contact with the electrode 202 in the electrode patch, and the insulating state between the two is valid.
It should be noted that, when the thermistor 201 is a thermistor, when the electrode 202 in the electrode patch is directly electrically connected to the electrode adapter assembly 130, the resistance of the electrode 202 is approximately equal to zero. I.e., the component tester measures a value close to the resistance value of the thermistor 201.
In one example, the thermistor 201 in the electrode patch is a thermistor of model NTCG163JX103DT1S, and the resistance value of the thermistor 201 in the electrode patch is 19K Ω at room temperature (15-25 ℃), at which a second reference threshold of 20K Ω can be set. If the second measurement value is 19.2K Ω, it can be inferred that the insulation state between the thermosensitive element 201 in the electrode patch and the electrode 202 in the electrode patch is invalid. If the second measurement value is infinite, it can be concluded that the insulation state between the heat sensitive element 201 in the electrode patch and the electrode 202 in the electrode patch is valid. It should be noted that different second reference thresholds may be set according to the room temperature corresponding to different seasons.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. the electrode patch testing jig 100 provided in the present embodiment is provided with an element adapter assembly 120, an electrode adapter assembly 130, and a grounding adapter assembly 140, which are electrically connected to the thermosensitive element 201, the electrode 202, and the ground of the electrode patch, respectively. The cooperation of the testing fixture 100 and the element tester can realize the detection of whether the soldering of the heat-sensitive element 201 and the circuit board 203 of the electrode patch is qualified and whether the heat-sensitive element 201 and the electrode 202 are insulated.
2. In this embodiment, the element adapter assemblies 120 of the electrode patch testing fixture 100 are in a one-to-one correspondence relationship with at least some of the thermosensitive elements 201 of the electrode patches to be tested, each element adapter assembly 120 and each corresponding thermosensitive element 201 form a respective closed loop, and for electrode patches with different numbers of thermosensitive elements 201, the testing fixture 100 itself has high adaptability and inclusion, and can test electrode patches of different models.
3. In this embodiment, each of the adapter assemblies is composed of various types of interfaces and pins electrically connected to each other, each of the interfaces constitutes a medium for electrically connecting the electrode patch test fixture 100 with the component tester, and each of the pins constitutes a medium for electrically connecting the electrode patch test fixture 100 with the electrode patch. The test fixture 100, the element tester and the electrode patches together form a completed closed loop to test the welding state and the insulation state of the thermosensitive element 201.
4. In the present embodiment, the device interface 121 can be flexibly designed and arranged according to the specific size of the fixture body 110, thereby reducing the material and process costs.
5. In this embodiment, when testing the thermal element 201, the element interface 121, the electrode interface 131 and the ground line interface 141 are all used for being connected with an element tester, so that three interfaces or two of the three interfaces are all arranged on the same side of the test fixture 100, which is beneficial to rapidly and simply assembling a test device and testing the thermal element 201 of an electrode patch during testing, and improves the convenience of device testing.
6. In the present embodiment, the patch interface 102 includes at least one of the element pin 122, the electrode pin 132 and the ground pin 142, and is used to be electrically connected to the interface end 206 of the electrode patch, so as to electrically connect the test fixture 100 of the electrode patch to the electrode patch.
7. In this embodiment, the patch interface 102 of the test fixture 100 is divided into a first patch interface 1021 and a second patch interface 1022, where the first patch interface 1021 is used to be electrically connected with the interface end 206 of the first electrode patch, and the second patch interface 1022 is used to be electrically connected with the interface end 206 of the second electrode patch.
8. In the embodiment, the sub-chip interface is disposed at a flexible position to adapt to the overall structure of the test fixture 100. Ultimately to facilitate electrical connection between the test fixture 100 and the electrode patches.
9. In this embodiment, according to the basic principle of the component tester, when the first end of the component tester is connected to the ground adapter 140 in the test fixture 100, the second end of the component tester is connected to the component adapter 120 in the test fixture 100, so as to test whether the thermal sensitive element 201 of the electrode patch is soldered to the circuit board 203. Under the condition that the second end of the component tester is connected with the electrode adapter assembly 130 in the test fixture 100, the first end of the component tester is connected with the component adapter assembly 120 in the test fixture 100, and is used for testing whether the thermosensitive element 201 of the electrode patch is insulated from the electrode 202.
10. In the present embodiment, a first reference threshold value of one thermistor 201 is set in accordance with the standard and accuracy of the test field in conjunction with the test method of the above-described embodiment. And comparing a first measurement value measured by the element tester with a first reference threshold, and if the first measurement value is not greater than the first reference threshold, deducing the relation of realizing the electrical connection between the thermosensitive element 201 in the electrode patch and the flexible lead on the circuit board 203 in the electrode patch, wherein the welding states of the thermosensitive element 201 and the flexible lead are effective. If the first measured value is greater than the first reference threshold value, it can be concluded that the electrical connection between the heat-sensitive element 201 in the electrode patch and the flexible lead on the circuit board 203 in the electrode patch is not achieved, and the soldering state of the two is invalid.
11. In the present embodiment, according to the method of the foregoing embodiment, similarly, a second reference threshold value of one thermosensitive element 201 is set. A second measurement value measured by the element tester is compared with a second reference threshold value, and if the second measurement value is not greater than the second reference threshold value, it is inferred that the contact between the heat sensitive element 201 in the electrode patch and the electrode 202 in the electrode patch has formed an electrical connection, and the insulation state between the two is invalid. If the second measurement value is greater than the second reference threshold value, it is inferred that there is no contact between the heat sensitive element 201 in the electrode patch and the electrode 202 in the electrode patch, and the insulation state between the two is effective.
Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (13)
1. The utility model provides a test fixture of electrode paster which characterized in that includes: the jig comprises a jig body, an element switching assembly, an electrode switching assembly and a grounding switching assembly, wherein the element switching assembly, the electrode switching assembly and the grounding switching assembly are respectively connected with the jig body;
the element switching assembly is used for being electrically connected with the thermosensitive element of the electrode patch;
the electrode switching assembly is used for being electrically connected with an electrode of the electrode patch;
the grounding adapter component is used for grounding;
under the condition of detecting the welding state of the thermosensitive element of the electrode patch and the circuit board, the element switching assembly and the grounding switching assembly are respectively and further used for being electrically connected with an element tester;
and under the condition of detecting the insulation state of the thermosensitive element and the electrode of the electrode patch, the element switching assembly and the electrode switching assembly are respectively connected with an element tester.
2. The test fixture of claim 1, wherein the element adapter assemblies correspond to the thermal sensitive elements of at least some of the electrode patches one-to-one.
3. The test fixture of claim 1 or 2, wherein each of the component adapter assemblies comprises: the electrode patch comprises an element interface and an element pin which are electrically connected with each other, wherein the element interface is used for being electrically connected with an element tester, and the element pin is used for being electrically connected with a thermosensitive element of the electrode patch;
the electrode adapter assembly includes: the electrode interface is used for being electrically connected with an element tester, and the electrode pin is used for being electrically connected with an electrode of the electrode patch;
the ground adapter assembly includes: the device comprises a ground wire interface and a ground wire pin which are electrically connected with each other, wherein the ground wire interface is used for being electrically connected with an element tester, and the ground wire pin is used for being electrically connected with a ground wire.
4. The test fixture of claim 3, wherein at least some of the component interfaces are located on the same side, adjacent sides, or opposite sides of the fixture body, respectively.
5. The test fixture of claim 4, wherein the electrode interface and at least a portion of the component interface are located on the same side of the fixture body;
and/or the ground wire interface and at least part of the component interface are positioned on the same side of the jig body.
6. The test fixture of claim 3, wherein at least the component pin, the electrode pin, and the ground pin are integrated to form a patch interface, and the patch interface is configured to be electrically connected to an interface end of the electrode patch.
7. The test fixture of claim 6, wherein the patch interface comprises: at least two sub patch interfaces of different types, at least part of which are used for being electrically connected with the interface ends of the electrode patches of different types in a one-to-one correspondence manner.
8. The test fixture of claim 7, wherein at least some of the sub-chip interfaces are located on the same side, adjacent sides, or opposite sides of the fixture body, respectively.
9. A test apparatus for an electrode patch, comprising a test jig for an electrode patch according to any one of claims 1 to 8 and an element tester;
under the condition that the first end of the element tester is connected with the grounding adapter assembly in the test fixture, the second end of the element tester is connected with the element adapter assembly in the test fixture; and under the condition that the second end of the element tester is connected with the electrode switching assembly in the test fixture, the first end of the element tester is connected with the element switching assembly in the test fixture.
10. A method for testing an electrode patch, which is based on the electrode patch testing device according to claim 9, the method comprising:
acquiring a first measurement value between an element switching assembly and a grounding switching assembly in a test fixture;
and determining the welding state of the thermosensitive element in the electrode patch and the circuit board in the electrode patch according to the relation between the first measurement value and the first reference threshold value.
11. The method of testing of claim 10, wherein determining the soldering status of the thermal element in the electrode patch to the circuit board in the electrode patch based on the relationship between the first measurement and the first reference threshold comprises:
if the first measured value is not larger than the first reference threshold value, determining that the welding state of the thermosensitive element in the electrode patch and the circuit board in the electrode patch is effective;
and if the first measured value is larger than the first reference threshold value, determining that the welding state of the thermosensitive element in the electrode patch and the circuit board in the electrode patch is invalid.
12. A method for testing an electrode patch, which is based on the electrode patch testing device according to claim 9, the method comprising:
acquiring a second measurement value between the element switching assembly and the electrode switching assembly in the test fixture;
and determining the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch according to the relation between the second measurement value and the second reference threshold value.
13. The method of claim 12, wherein determining the insulation state of the thermistor in the electrode patch from the electrode in the electrode patch based on the relationship between the second measurement value and the second reference threshold value comprises:
if the second measurement value is not greater than the second reference threshold value, determining that the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch is invalid;
and if the second measured value is larger than the second reference threshold value, determining that the insulation state of the thermosensitive element in the electrode patch and the electrode in the electrode patch is effective.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111328266.5A CN113777536B (en) | 2021-11-10 | 2021-11-10 | Testing jig, testing device and testing method for electrode patches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111328266.5A CN113777536B (en) | 2021-11-10 | 2021-11-10 | Testing jig, testing device and testing method for electrode patches |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113777536A CN113777536A (en) | 2021-12-10 |
| CN113777536B true CN113777536B (en) | 2022-01-21 |
Family
ID=78873773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111328266.5A Active CN113777536B (en) | 2021-11-10 | 2021-11-10 | Testing jig, testing device and testing method for electrode patches |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113777536B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115980490B (en) * | 2022-12-30 | 2024-04-19 | 江苏海莱新创医疗科技有限公司 | Quality detection system and method for electrode plate, adapter and electric field generator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006048625A1 (en) * | 2004-11-03 | 2006-05-11 | Liaisons Electroniques-Mecaniques Lem S.A. | Kelvin connector including temperature sensor |
| TW200820936A (en) * | 2006-11-09 | 2008-05-16 | Ind Tech Res Inst | A composite bio-sensing apparatus |
| CN104237300A (en) * | 2014-08-27 | 2014-12-24 | 北京时代民芯科技有限公司 | Fixture and method for testing steady state thermal resistance of glass sealed surface-mount diode |
| CN104302351A (en) * | 2011-11-25 | 2015-01-21 | 杨章民 | Object, method, and system for detecting heartbeat or whether or not electrodes are in proper contact |
| CN111090009A (en) * | 2020-01-08 | 2020-05-01 | 深圳市业展电子有限公司 | Adjustable test fixture and test method for chip resistor |
| CN111537777A (en) * | 2020-04-13 | 2020-08-14 | 深圳欣旺达智能科技有限公司 | Automatic testing method and device for thermistor failure current |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130015871A1 (en) * | 2011-07-11 | 2013-01-17 | Cascade Microtech, Inc. | Systems, devices, and methods for two-sided testing of electronic devices |
-
2021
- 2021-11-10 CN CN202111328266.5A patent/CN113777536B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006048625A1 (en) * | 2004-11-03 | 2006-05-11 | Liaisons Electroniques-Mecaniques Lem S.A. | Kelvin connector including temperature sensor |
| TW200820936A (en) * | 2006-11-09 | 2008-05-16 | Ind Tech Res Inst | A composite bio-sensing apparatus |
| CN104302351A (en) * | 2011-11-25 | 2015-01-21 | 杨章民 | Object, method, and system for detecting heartbeat or whether or not electrodes are in proper contact |
| CN104237300A (en) * | 2014-08-27 | 2014-12-24 | 北京时代民芯科技有限公司 | Fixture and method for testing steady state thermal resistance of glass sealed surface-mount diode |
| CN111090009A (en) * | 2020-01-08 | 2020-05-01 | 深圳市业展电子有限公司 | Adjustable test fixture and test method for chip resistor |
| CN111537777A (en) * | 2020-04-13 | 2020-08-14 | 深圳欣旺达智能科技有限公司 | Automatic testing method and device for thermistor failure current |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113777536A (en) | 2021-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4937915B2 (en) | Member for measuring battery voltage and temperature in a battery pack | |
| CN113777536B (en) | Testing jig, testing device and testing method for electrode patches | |
| JP2000241485A (en) | Electric resistance measuring device and its method for circuit board | |
| KR101471966B1 (en) | Jig for Measurement of Voltage in 3-Electrode System | |
| CN101692111A (en) | Device and method for testing resistivity of tin dioxide electrode | |
| KR102661280B1 (en) | impedance standard | |
| WO2023227058A1 (en) | Flexible characteristic test piece for partitions of fuel cell | |
| CN101294854B (en) | Chip type heater element | |
| JP4998004B2 (en) | Resistance measurement method | |
| TWI423500B (en) | Lithium ion cell assembly structure integrated by pcb circuits | |
| CN115980490A (en) | Electrode plate quality detection system and method, adapter and electric field generator | |
| CN210429811U (en) | Multi-core test circuit structure | |
| TWI684760B (en) | Method of using a measurement device to measure the concentration of an analyte of a sample in a reaction chamber of a test strip, and universal test strip | |
| CN116190723B (en) | Fuel cell current and voltage signal transmission method and device based on connector | |
| CN220064238U (en) | Multichannel calibration and line sequence detection device | |
| KR20040082934A (en) | Method and apparatus for fault tracing in electronic measurement and test arrangements for electrochemical elements | |
| CN212845513U (en) | Needle-shaped terminal half-bridge type power module and static test switching device thereof | |
| CN219915717U (en) | Battery seat testing device and electronic equipment testing system | |
| CN212301635U (en) | Static test switching device for needle-shaped terminal full-bridge type power module | |
| CN220473434U (en) | Film type biosensor and assembly thereof | |
| CN212031707U (en) | Ammeter clamping instrument | |
| CN216955836U (en) | Test equipment of bioelectrode with induction function | |
| CN220709316U (en) | Battery test board assembly and test system | |
| KR100313105B1 (en) | Method for measuring contact resistance between liquid crystal display panel and drive device thereof | |
| CN213061069U (en) | Multi-channel micro-current electroplating system suitable for bioelectrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |