CN113775964A - Ultra-thin type modularization system based on LED lamps and lanterns circuit - Google Patents
Ultra-thin type modularization system based on LED lamps and lanterns circuit Download PDFInfo
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- CN113775964A CN113775964A CN202111062926.XA CN202111062926A CN113775964A CN 113775964 A CN113775964 A CN 113775964A CN 202111062926 A CN202111062926 A CN 202111062926A CN 113775964 A CN113775964 A CN 113775964A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
Abstract
The invention relates to an ultra-thin modular system based on an LED lamp circuit, which comprises an LED packaging module, a light source module and a light source module, wherein a plurality of LED lamps are arranged in the LED packaging module and are used as output light sources of the LED packaging module after being arranged in parallel; the LED packaging module is internally provided with a temperature sensing patch which is arranged on the light gathering cup and used for detecting the real-time temperature of the LED packaging module during working, and the heat dissipation module is connected with the control module and the LED packaging module and used for dissipating heat of the LED packaging module according to the instruction of the control module; and the control module is used for adjusting the quantity and the working time of the LED lamps connected in parallel according to the real-time heat distribution in the LED packaging module and the influence of the heat distribution in the LED packaging module by the heat dissipation module. The real-time temperature in the LED packaging module is detected and adjusted for many times according to actual conditions until the real-time temperature in the LED packaging module tends to be normal, so that the real-time temperature in the LED packaging module is maintained in a normal temperature range, and the service life is prolonged.
Description
Technical Field
The invention relates to the technical field of lamps, in particular to an ultra-thin modular system based on an LED lamp circuit.
Background
The lighting source is an electronic product which is very important in the historical development of human beings, since the first generation of incandescent lamps of the lighting source is published at the end of the 19 th century, the development of the lighting source goes through five generations of fluorescent lamps, high-intensity gas discharge lamps, semiconductor light-emitting diodes (LEDs) and Chip On Board (COB) packaging light sources, and the fourth generation and fifth generation lighting source technologies mainly based on the LEDs and the COB have already occupied very important positions in the fields of industrial production and daily life such as automobile lighting, indoor and outdoor lighting, medical application and living products and the like by virtue of the advantages of high luminous efficiency, long service life, power saving, energy saving, environmental protection and the like.
The LED light source is widely applied in the related fields of industrial production, living illumination and the like, the junction temperature is an important factor influencing the performance and the service life of the LED light source, and the normal operation of the LED light source cannot be effectively thermally managed. The temperature of the LED light source is not suitable to exceed 125 ℃.
But current maintenance lamp is because the condition that meets in the in-service use is different, and factors such as workman's ability of overhauing lead to the long increase of actual continuous use, and the heat is piled up unable diffusion and is caused the heat in the maintenance lamp too high, and then influences the life who overhauls the lamp.
Disclosure of Invention
Therefore, the invention provides an ultra-thin type modularized system based on an LED lamp circuit, which can solve the problem that the service life is shortened due to heat accumulation caused by overlong service life in the prior art.
In order to achieve the above object, the present invention provides an ultra-thin modular system based on LED lamp circuit, comprising:
the LED packaging module is internally provided with a plurality of LED lamps which are connected in parallel and then used as an output light source of the LED packaging module;
the LED packaging module is internally provided with a temperature sensing patch, the temperature sensing patch is arranged on the light-gathering cup and used for detecting the real-time temperature of the LED packaging module during working, and the light-gathering cup is used for gathering the light path of an output light source;
the driving device is movably connected with the light-gathering cup and is used for adjusting the angle of the light-gathering cup;
the timing device is connected with the control module and used for recording the working time of each LED lamp;
the heat dissipation module is connected with the control module and the LED packaging module and used for dissipating heat of the LED packaging module according to an instruction of the control module;
the control module is respectively connected with the temperature sensing patches and each LED lamp and is used for adjusting the number and the working time of the LED lamps connected in parallel according to the real-time heat distribution in the LED packaging module and the influence of the heat distribution in the LED packaging module by the heat dissipation module;
the method comprises the steps that in the working process of an LED packaging module, the real-time temperature Ti in the LED packaging module and the number of LED lamps which currently participate in working are obtained, the standard temperature T0 is arranged in a control module, when the real-time temperature Ti in the LED packaging module is larger than or equal to the standard temperature T0, the real-time temperature in the LED packaging module is over-high, the real-time temperature in the LED packaging module is obtained again after a first period S10 of a heat dissipation module is started with first power P10, and if the real-time temperature in the LED packaging module tends to be normal after the first period S10, the heat dissipation module is stopped;
if the real-time temperature Ti in the LED package module is still greater than or equal to the standard temperature T0 after the first time period S10 elapses, the first power P10 is increased or the first time period S10 is extended, the first time period S10 is operated with the increased power, the increased power is the second power, the second power P20 is k1 × P10, or the first power P10 is operated for the second time period S20, wherein the second time period S20 is k2 × the first time period S10 until the real-time temperature in the LED package module becomes normal, and both the first coefficient k1 and the second coefficient k2 are greater than 1.
Further, the influence of the heat dissipation module on the heat distribution in the LED packaging module includes:
the output light source is arranged at the bottom of the light gathering cup;
if the heat dissipation device with the first power is adopted to dissipate heat for the first time period, the first time period is set to be a plurality of driving nodes, and the driving device drives the light gathering cup to rotate at an angle on the driving nodes, so that the optical path length of the output light source in the light gathering cup is increased in the output process;
a first heat distribution curve and a second heat distribution curve are arranged in the control module, and the heat of the output light source in the first heat distribution curve is sequentially reduced along the transmission direction of the light path; the second heat distribution curve is uneven, and a positive peak value of the second heat distribution curve is determined;
if the heat distribution in the LED packaging module belongs to a first heat distribution curve, three driving nodes are selected to drive the rotation angle of the light-gathering cup;
and if the heat distribution in the LED packaging module belongs to a second heat distribution curve, selecting the position of the positive peak of the second heat distribution curve to carry out angle driving on the light-gathering cup.
Further, a standard temperature difference value delta T0 is also arranged in the control module, when the real-time temperature in the LED packaging module is too high, an actual difference value between the real-time temperature Ti in the LED packaging module and the standard temperature T0 is calculated, the actual difference value is compared with the standard temperature difference value delta T0, a comparison result is obtained, and the first coefficient k1 and the second coefficient k2 are adjusted according to the comparison result;
if the Ti-T0 is more than or equal to the delta T0, increasing a first coefficient k1 and a second coefficient k2 to increase the power and the heat dissipation time of the heat dissipation device;
if Ti-T0< Δ T0, the original values of the first coefficient k1 and the second coefficient k2 are used for adjustment.
Further, the increasing the first coefficient k1 and the second coefficient k2 includes:
the increased first coefficient k1 ═ 1+ (Ti-T0)/Δ T0) × k 1;
the increased second coefficient k2 ═ 1+ (Ti-T0)/Δ T0 × k 2.
Further, after the power and duration of the heat dissipation device are adjusted twice, and the real-time temperature in the LED package structure is still higher than the standard temperature T0, the number of LED lamps currently participating in operation needs to be adjusted to reduce the temperature of the output light source;
if the number of the LED lamps which currently participate in the work is 8, determining the difference value between the temperature after two times of adjustment and the standard temperature, wherein a first difference value, a second difference value and a third difference value are arranged in the control unit, and the first difference value is larger than the second difference value and larger than the third difference value;
if the difference value between the temperature after the two times of adjustment and the standard temperature belongs to a first difference value, reducing the number of the LED lamps which currently participate in the work by half;
if the difference value between the temperature after the two times of adjustment and the standard temperature belongs to a second difference value, reducing the number of the LED lamps which currently participate in the work by one fourth;
and if the difference value between the temperature after twice adjustment and the standard temperature belongs to a third difference value, reducing the number of the LED lamps which currently participate in the work by one eighth.
The LED packaging module is arranged on the side face of the shell, the auxiliary lamp is arranged at the top end of the shell, the shell is cylindrical, and the control module and the heat dissipation module are arranged in the shell;
the LED packaging module is provided with two, and the auxiliary lamp is provided with one.
Further, the output light source of the LED packaging module is 10W, and the auxiliary lamp is 3W;
the LED packaging lamp is characterized by further comprising a stepless dimming module, wherein the stepless dimming module is arranged in the shell and used for adjusting the output power of the LED packaging module and the auxiliary lamp, so that the LED packaging module serves as a main lamp and the auxiliary lamp are reasonably distributed in power.
Further, still include first switch and second switch, first switch and second switch all are connected with control module, first switch is used for controlling auxiliary lamp, the second switch is used for controlling the LED lamp in the LED encapsulation module, first switch and second switch can form multiple mode, and one of them mode is that auxiliary lamp is out of work, and only the LED lamp in the LED encapsulation module works, and another mode is that the lamp in two LED encapsulation modules all works, and two LED encapsulation modules can also merge into a power output.
Further, the LED packaging module comprises a power supply module which is used for electrically connecting the control module and the LED packaging module and supplying power to the LED packaging module and the control module so that the control module continuously works.
Further, still include the interface, the interface is the TYPEC interface for be connected with power module, be used for when power module electric quantity is not enough to charge.
Compared with the prior art, the invention has the advantages that the real-time temperature in the LED packaging module is detected and adjusted for many times according to the actual situation until the real-time temperature in the LED packaging module tends to be normal, so that the real-time temperature in the LED packaging module is maintained in a normal temperature range, the service life is prolonged, in the actual application process, if the temperature is overhigh, the heat dissipation device is started at the first power and the first time period, if the temperature still does not reach the normal temperature range after the adjustment of the first stage, the adjustment strategy needs to be corrected, and the heat dissipation device is adjusted again in the mode of correcting the time period and the power until the real-time temperature in the LED packaging module reaches the normal temperature range.
Particularly, through the condition of heat distribution in the LED packaging module, in the process of radiating heat of the heat radiating device, the driving device is adjusted to drive the rotation angle of the light-gathering cup, so that the heat radiating efficiency of the output light source in the light-gathering cup is higher, in the practical application process, the output light source is emitted from the bottom of the light-gathering cup, the light source is emitted along the extending direction of the light-gathering cup through the gathering action of the static light-gathering cup, and the light source is concentrated due to the gathering action and has high intensity; if under drive arrangement's drive effect, the light gathering cup is along the direction swing perpendicular rather than extending direction for the light source refracts many times on the inner wall of light gathering cup, makes the stroke of light source in the light gathering cup longer, makes the heat distribution dispersion of the energy of light source in the light gathering cup, is convenient for dispel the heat, improves the radiating efficiency.
Particularly, the amplitude of the adjustment of the first coefficient and the second coefficient is selected according to the magnitude relation between the actual difference value and the standard difference value between the real-time temperature and the standard temperature T0, so that if the temperature is too high, the power of the heat dissipation device is improved, the heat dissipation is accelerated, or the heat dissipation duration is increased, the heat in the LED packaging module is dissipated as soon as possible, the temperature in the LED packaging module is normal, and the service life is prolonged.
Particularly, on the basis of the first coefficient, the difference amplitude between the actual difference value and the standard difference value is used as the coefficient for adjusting the first coefficient and the second coefficient, so that the relationship between the actual difference value and the standard difference value can be accurately expressed by the increased first coefficient and the increased second coefficient, the adjustment of the first coefficient and the second coefficient is more accurate, the accurate control on the power and the working time of the heat dissipation device is greatly improved, and the service life is prolonged.
Especially, after the LED packaging structure is adjusted by adjusting the power and the heat dissipation time of the heat dissipation device, the temperature in the LED packaging structure still can not reach below the standard temperature, at the moment, the output light source is reduced by reducing the number of the LED lamps connected in parallel, so that the heat is reduced, the temperature in the LED packaging structure is reduced from the source, the service life is prolonged, the mode that 8 LED lamps are connected in parallel is adopted in the practical application process, the service time of the packaging module is greatly prolonged, in addition, after the number is reduced, the protection of the lamps which do not work is realized, and the service life of the packaging module is further prolonged.
Particularly, the auxiliary lamp and the shell are arranged, so that the auxiliary lamp and the LED packaging module are effectively protected, the control module and the heat dissipation module are arranged in the shell, the structure is compact, and the ultrathin modular system based on the LED lamp circuit provided by the embodiment of the invention is complete in function, simple in structure and easy to carry.
Especially, through stepless dimming module, realize to the LED encapsulation module as the main light with the power distribution of auxiliary lamp for power distribution output is more reasonable, and makes auxiliary lamp and LED encapsulation module's luminance accord with actual need, increase of service life improves the availability factor of light source.
Particularly, the LED packaging module and the auxiliary lamp are controlled by the first switch and the second switch through the arrangement of the first switch and the second switch, and then a proper working mode is selected according to actual needs, so that the ultrathin modular system based on the LED lamp circuit provided by the embodiment of the invention has richer working modes, meets the actual needs, enriches the use scenes and improves the service life.
Particularly, the power supply module is used for continuously supplying power, so that the reliability of the control module is improved, the LED packaging module realizes the selection of the working state of the LED lamp inside the LED packaging module under the control of the control module, and the service life of the LED packaging module is effectively prolonged.
Especially, through the interface that charges that the outside set up, realize the supply to the electric quantity in the power module, extension live time, and the TYPEC interface is current mainstream interface, and charging efficiency improves greatly in practical application.
Drawings
Fig. 1 is a schematic structural diagram of an ultra-thin modular system based on an LED lamp circuit according to an embodiment of the present invention.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described below with reference to examples; it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and do not limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1, an ultra-thin modular system based on an LED lamp circuit according to an embodiment of the present invention includes:
the LED packaging module 10 is internally provided with a plurality of LED lamps which are connected in parallel and then used as an output light source of the LED packaging module;
the LED packaging module is internally provided with a temperature sensing patch 11, the temperature sensing patch is arranged on a light-gathering cup 12 and used for detecting the real-time temperature of the LED packaging module during working, and the light-gathering cup is used for gathering the light path of an output light source;
the driving device 20 is movably connected with the light-gathering cup and used for adjusting the angle of the light-gathering cup;
the timing device 30 is connected with the control module and used for recording the working time of each LED lamp;
the heat dissipation module 40 is connected with the control module and the LED packaging module and used for dissipating heat of the LED packaging module according to instructions of the control module;
the control module 50 is respectively connected with the temperature sensing patches and each LED lamp and is used for adjusting the number and the working time of the LED lamps connected in parallel according to the real-time heat distribution in the LED packaging module and the influence of the heat dissipation module on the heat distribution in the LED packaging module;
the method comprises the steps that in the working process of an LED packaging module, the real-time temperature Ti in the LED packaging module and the number of LED lamps which currently participate in working are obtained, the standard temperature T0 is arranged in a control module, when the real-time temperature Ti in the LED packaging module is larger than or equal to the standard temperature T0, the real-time temperature in the LED packaging module is over-high, the real-time temperature in the LED packaging module is obtained again after a first period S10 of a heat dissipation module is started with first power P10, and if the real-time temperature in the LED packaging module tends to be normal after the first period S10, the heat dissipation module is stopped;
if the real-time temperature Ti in the LED package module is still greater than or equal to the standard temperature T0 after the first time period S10 elapses, the first power P10 is increased or the first time period S10 is extended, the first time period S10 is operated with the increased power, the increased power is the second power, the second power P20 is k1 × P10, or the first power P10 is operated for the second time period S20, wherein the second time period S20 is k2 × the first time period S10 until the real-time temperature in the LED package module becomes normal, and both the first coefficient k1 and the second coefficient k2 are greater than 1.
Specifically, in the embodiment of the invention, the real-time temperature in the LED package module is detected and adjusted for multiple times according to actual conditions until the real-time temperature in the LED package module tends to be normal, so that the real-time temperature in the LED package module is maintained within a normal temperature range, and the service life is prolonged.
Specifically, the influence of the heat dissipation module on the heat distribution in the LED package module includes:
the output light source is arranged at the bottom of the light gathering cup;
if the heat dissipation device with the first power is adopted to dissipate heat for the first time period, the first time period is set to be a plurality of driving nodes, and the driving device drives the light gathering cup to rotate at an angle on the driving nodes, so that the optical path length of the output light source in the light gathering cup is increased in the output process;
a first heat distribution curve and a second heat distribution curve are arranged in the control module, and the heat of the output light source in the first heat distribution curve is sequentially reduced along the transmission direction of the light path; the second heat distribution curve is uneven, and a positive peak value of the second heat distribution curve is determined;
if the heat distribution in the LED packaging module belongs to a first heat distribution curve, three driving nodes are selected to drive the rotation angle of the light-gathering cup;
and if the heat distribution in the LED packaging module belongs to a second heat distribution curve, selecting the position of the positive peak of the second heat distribution curve to carry out angle driving on the light-gathering cup.
Specifically, according to the embodiment of the invention, the driving device is adjusted to drive the rotation angle of the light-gathering cup in the process of radiating the heat radiating device through the condition of heat distribution in the LED packaging module, so that the heat radiating efficiency of the output light source in the light-gathering cup is higher, in the practical application process, the output light source is emitted from the bottom of the light-gathering cup, the light source is emitted along the extending direction of the light-gathering cup through the gathering action of the static light-gathering cup, and the light source is concentrated due to the gathering action and has high intensity; if under drive arrangement's drive effect, the light gathering cup is along the direction swing perpendicular rather than extending direction for the light source refracts many times on the inner wall of light gathering cup, makes the stroke of light source in the light gathering cup longer, makes the heat distribution dispersion of the energy of light source in the light gathering cup, is convenient for dispel the heat, improves the radiating efficiency.
Specifically, a standard temperature difference value Δ T0 is further set in the control module, when the real-time temperature in the LED package module is too high, an actual difference value between the real-time temperature Ti in the LED package module and the standard temperature T0 is calculated, the actual difference value is compared with the standard temperature difference value Δ T0 to obtain a comparison result, and the first coefficient k1 and the second coefficient k2 are adjusted according to the comparison result;
if the Ti-T0 is more than or equal to the delta T0, increasing a first coefficient k1 and a second coefficient k2 to increase the power and the heat dissipation time of the heat dissipation device;
if Ti-T0< Δ T0, the original values of the first coefficient k1 and the second coefficient k2 are used for adjustment.
Specifically, according to the embodiment of the invention, the amplitude of adjusting the first coefficient and the second coefficient is selected according to the magnitude relation between the actual difference value and the standard difference value between the real-time temperature and the standard temperature T0, so that if the temperature is too high, the power of the heat dissipation device is increased, the heat dissipation is accelerated, or the heat dissipation duration is increased, the heat in the LED packaging module is dissipated as soon as possible, the temperature in the LED packaging module is ensured to be normal, and the service life is prolonged.
Specifically, the increasing the first coefficient k1 and the second coefficient k2 includes:
the increased first coefficient k1 ═ 1+ (Ti-T0)/Δ T0) × k 1;
the increased second coefficient k2 ═ 1+ (Ti-T0)/Δ T0 × k 2.
Specifically, on the basis of the first coefficient, the difference between the actual difference and the standard difference is used as the coefficient for adjusting the first coefficient and the second coefficient, so that the relationship between the actual difference and the standard difference can be accurately expressed by the increased first coefficient and the increased second coefficient, the adjustment of the first coefficient and the second coefficient is more accurate, the accurate control of the power and the working time of the heat dissipation device is greatly improved, and the service life is prolonged.
Specifically, after the power and duration of the heat dissipation device are adjusted twice, and the real-time temperature in the LED package structure is still higher than the standard temperature T0, the number of LED lamps currently participating in operation needs to be adjusted to reduce the temperature of the output light source;
if the number of the LED lamps which currently participate in the work is 8, determining the difference value between the temperature after two times of adjustment and the standard temperature, wherein a first difference value, a second difference value and a third difference value are arranged in the control unit, and the first difference value is larger than the second difference value and larger than the third difference value;
if the difference value between the temperature after the two times of adjustment and the standard temperature belongs to a first difference value, reducing the number of the LED lamps which currently participate in the work by half;
if the difference value between the temperature after the two times of adjustment and the standard temperature belongs to a second difference value, reducing the number of the LED lamps which currently participate in the work by one fourth;
and if the difference value between the temperature after twice adjustment and the standard temperature belongs to a third difference value, reducing the number of the LED lamps which currently participate in the work by one eighth.
Specifically, after the power and the heat dissipation duration of the heat dissipation device are adjusted to adjust the LED packaging structure, the temperature in the LED packaging structure still cannot reach below the standard temperature, at the moment, the output light source is reduced by reducing the number of the LED lamps connected in parallel, so that the generated heat is reduced, the temperature in the LED packaging structure is reduced from the source, the service life is prolonged, the service life of the packaging module is greatly prolonged by adopting the mode that 8 LED lamps are connected in parallel in the actual application process, the protection of the lamps which do not work is realized after the number is reduced, and the service life of the packaging module is further prolonged.
Specifically, the LED packaging module is arranged on the side face of the shell, the auxiliary lamp is arranged at the top end of the shell, the shell is cylindrical, and the control module and the heat dissipation module are arranged in the shell;
the LED packaging module is provided with two, and the auxiliary lamp is provided with one.
Specifically, the auxiliary lamp and the shell are arranged, so that the auxiliary lamp and the LED packaging module are effectively protected, the control module and the heat dissipation module are arranged in the shell, the structure is compact, and the ultrathin modular system based on the LED lamp circuit is complete in function, simple in structure and easy to carry.
Specifically, the output light source of the LED packaging module is 10W, and the auxiliary lamp is 3W;
the LED packaging lamp is characterized by further comprising a stepless dimming module, wherein the stepless dimming module is arranged in the shell and used for adjusting the output power of the LED packaging module and the auxiliary lamp, so that the LED packaging module serves as a main lamp and the auxiliary lamp are reasonably distributed in power.
Specifically, the embodiment of the invention realizes power distribution of the LED packaging module as the main lamp and the auxiliary lamp through the stepless dimming module, so that the power distribution output is more reasonable, the brightness of the auxiliary lamp and the LED packaging module meets the actual requirement, the service life is prolonged, and the service efficiency of the light source is improved.
Particularly, still include first switch and second switch, first switch and second switch all are connected with control module, first switch is used for controlling auxiliary lamp, the second switch is used for controlling the LED lamp in the LED encapsulation module, first switch and second switch can form multiple mode, and one of them mode is out of work for auxiliary lamp, and only the LED lamp work in the LED encapsulation module, and another kind of mode is that the lamp in two LED encapsulation modules all works, and two LED encapsulation modules can also merge into a power output.
Specifically, the first switch and the second switch are arranged, the LED packaging module and the auxiliary lamp are controlled through the first switch and the second switch, and then a proper working mode is selected according to actual needs, so that the ultra-thin type modular system based on the LED lamp circuit provided by the embodiment of the invention has richer working modes, meets the actual needs, enriches the use scenes, and prolongs the service life.
In practical application, a switch can be arranged, the switch can be provided with a plurality of modes, if the switch is touched lightly, the merged head lamp is switched on/off, the head lamp is switched off and does not work, and if the switch is touched lightly, the main lamp is switched on and works, so that one side or two sides of the main lamp can be switched, and the single side of the main lamp can be merged. In the embodiment of the invention, the main lamp is an LED packaging module, and the auxiliary lamp is a head lamp.
Specifically, the LED packaging module comprises a power supply module which is used for electrically connecting the control module and the LED packaging module and supplying power to the LED packaging module and the control module so that the control module continuously works.
Specifically, the power module is used for continuously supplying power, so that the reliability of the control module is improved, the LED packaging module realizes the selection of the working state of the LED lamp therein under the control of the control module, and the service life of the LED packaging module is effectively prolonged.
Particularly, still include the interface, the interface is the TYPEC interface for be connected with power module, be used for when power module electric quantity is not enough to charge.
Specifically, the embodiment of the invention realizes the supply of electric quantity in the power module through the externally arranged charging interface, prolongs the service life, and greatly improves the charging efficiency in practical application because the TYPEC interface is the current mainstream interface.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention; various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An ultra-thin modular system based on an LED lamp circuit, comprising:
the LED packaging module is internally provided with a plurality of LED lamps which are connected in parallel and then used as an output light source of the LED packaging module;
the LED packaging module is internally provided with a temperature sensing patch, the temperature sensing patch is arranged on the light-gathering cup and used for detecting the real-time temperature of the LED packaging module during working, and the light-gathering cup is used for gathering the light path of an output light source;
the driving device is movably connected with the light-gathering cup and is used for adjusting the angle of the light-gathering cup;
the timing device is connected with the control module and used for recording the working time of each LED lamp;
the heat dissipation module is connected with the control module and the LED packaging module and used for dissipating heat of the LED packaging module according to an instruction of the control module;
the control module is respectively connected with the temperature sensing patches and each LED lamp and is used for adjusting the number and the working time of the LED lamps connected in parallel according to the real-time heat distribution in the LED packaging module and the influence of the heat distribution in the LED packaging module by the heat dissipation module;
the method comprises the steps that in the working process of an LED packaging module, the real-time temperature Ti in the LED packaging module and the number of LED lamps which currently participate in working are obtained, the standard temperature T0 is arranged in a control module, when the real-time temperature Ti in the LED packaging module is larger than or equal to the standard temperature T0, the real-time temperature in the LED packaging module is over-high, the real-time temperature in the LED packaging module is obtained again after a first period S10 of a heat dissipation module is started with first power P10, and if the real-time temperature in the LED packaging module tends to be normal after the first period S10, the heat dissipation module is stopped;
if the real-time temperature Ti in the LED package module is still greater than or equal to the standard temperature T0 after the first time period S10 elapses, the first power P10 is increased or the first time period S10 is extended, the first time period S10 is operated with the increased power, the increased power is the second power, the second power P20 is k1 × P10, or the first power P10 is operated for the second time period S20, wherein the second time period S20 is k2 × the first time period S10 until the real-time temperature in the LED package module becomes normal, and both the first coefficient k1 and the second coefficient k2 are greater than 1.
2. The ultra thin modular system based on LED lamp circuit of claim 1,
the influence of the heat dissipation module on the heat distribution in the LED packaging module comprises the following steps:
the output light source is arranged at the bottom of the light gathering cup;
if the heat dissipation device with the first power is adopted to dissipate heat for the first time period, the first time period is set to be a plurality of driving nodes, and the driving device drives the light gathering cup to rotate at an angle on the driving nodes, so that the optical path length of the output light source in the light gathering cup is increased in the output process;
a first heat distribution curve and a second heat distribution curve are arranged in the control module, and the heat of the output light source in the first heat distribution curve is sequentially reduced along the transmission direction of the light path; the second heat distribution curve is uneven, and a positive peak value of the second heat distribution curve is determined;
if the heat distribution in the LED packaging module belongs to a first heat distribution curve, three driving nodes are selected to drive the rotation angle of the light-gathering cup;
and if the heat distribution in the LED packaging module belongs to a second heat distribution curve, selecting the position of the positive peak of the second heat distribution curve to carry out angle driving on the light-gathering cup.
3. The ultra thin modular system based on LED lamp circuit of claim 2,
the control module is also internally provided with a standard temperature difference value delta T0, when the real-time temperature in the LED packaging module is too high, the actual difference value between the real-time temperature Ti in the LED packaging module and the standard temperature T0 is calculated, the actual difference value is compared with the standard temperature difference value delta T0 to obtain a comparison result, and the first coefficient k1 and the second coefficient k2 are adjusted according to the comparison result;
if the Ti-T0 is more than or equal to the delta T0, increasing a first coefficient k1 and a second coefficient k2 to increase the power and the heat dissipation time of the heat dissipation device;
if Ti-T0< Δ T0, the original values of the first coefficient k1 and the second coefficient k2 are used for adjustment.
4. The ultra thin modular system based on LED lamp circuit of claim 3,
the increasing the first coefficient k1 and the second coefficient k2 includes:
the increased first coefficient k1 ═ 1+ (Ti-T0)/Δ T0) × k 1;
the increased second coefficient k2 ═ 1+ (Ti-T0)/Δ T0 × k 2.
5. The ultra thin modular system based on LED lamp circuit of claim 4,
after the power and the duration of the heat dissipation device are adjusted twice, the real-time temperature in the LED package structure is still higher than the standard temperature T0, and the number of the LED lamps currently participating in the work needs to be adjusted to reduce the temperature of the output light source;
if the number of the LED lamps which currently participate in the work is 8, determining the difference value between the temperature after two times of adjustment and the standard temperature, wherein a first difference value, a second difference value and a third difference value are arranged in the control unit, and the first difference value is larger than the second difference value and larger than the third difference value;
if the difference value between the temperature after the two times of adjustment and the standard temperature belongs to a first difference value, reducing the number of the LED lamps which currently participate in the work by half;
if the difference value between the temperature after the two times of adjustment and the standard temperature belongs to a second difference value, reducing the number of the LED lamps which currently participate in the work by one fourth;
and if the difference value between the temperature after twice adjustment and the standard temperature belongs to a third difference value, reducing the number of the LED lamps which currently participate in the work by one eighth.
6. The ultra thin modular system based on LED lamp circuit of claim 5,
the LED packaging module is arranged on the side face of the shell, the auxiliary lamp is arranged at the top end of the shell, the shell is cylindrical, and the control module and the heat dissipation module are arranged in the shell;
the LED packaging module is provided with two, and the auxiliary lamp is provided with one.
7. The ultra thin modular system based on LED lamp circuit of claim 6,
the output light source of the LED packaging module is 10W, and the auxiliary lamp is 3W;
the LED packaging lamp is characterized by further comprising a stepless dimming module, wherein the stepless dimming module is arranged in the shell and used for adjusting the output power of the LED packaging module and the auxiliary lamp, so that the LED packaging module serves as a main lamp and the auxiliary lamp are reasonably distributed in power.
8. The ultra thin modular system based on LED lamp circuit of claim 7,
still include first switch and second switch, first switch and second switch all are connected with control module, first switch is used for controlling auxiliary lamp, the second switch is used for controlling the LED lamp in the LED encapsulation module, first switch and second switch can form multiple mode, and one of them mode is out of work for auxiliary lamp, and only the LED lamp work in the LED encapsulation module, and another one mode is the lamp in two LED encapsulation modules and all works, and two LED encapsulation modules can also merge into a power output.
9. The ultra-thin modular system based on LED lamp circuit of claim 8, further comprising a power module for electrically connecting the control module and the LED package module for powering the LED package module and the control module such that the control module operates continuously.
10. The ultra thin modular system based on LED lamp circuit of claim 9, further comprising an interface, which is a TYPEC interface, for connecting with a power module for charging when the power module is low on power.
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| TWM331083U (en) * | 2007-07-27 | 2008-04-21 | Ta Yih Ind Co Ltd | Heat dissipation device of LED automobile light |
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| US20100096993A1 (en) * | 2004-11-29 | 2010-04-22 | Ian Ashdown | Integrated Modular Lighting Unit |
| TWM331083U (en) * | 2007-07-27 | 2008-04-21 | Ta Yih Ind Co Ltd | Heat dissipation device of LED automobile light |
| CN103162197A (en) * | 2013-01-18 | 2013-06-19 | 浙江捷莱照明有限公司 | Light-emitting diode (LED) ceiling lamp |
| EP3354971A1 (en) * | 2017-01-31 | 2018-08-01 | Automotive Lighting Italia S.p.A. | Lighting device for vehicles provided with led lighting modules |
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