CN113764315A - Bonding tool and bonding method - Google Patents
Bonding tool and bonding method Download PDFInfo
- Publication number
- CN113764315A CN113764315A CN202111138053.6A CN202111138053A CN113764315A CN 113764315 A CN113764315 A CN 113764315A CN 202111138053 A CN202111138053 A CN 202111138053A CN 113764315 A CN113764315 A CN 113764315A
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- Prior art keywords
- cover plate
- chip bar
- moving frame
- frame
- bonding tool
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 47
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 23
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application discloses a bonding tool, which comprises a base, wherein the base comprises a substrate and moving frame supporting columns, the moving frame supporting columns are positioned on the upper surface of the substrate and are oppositely arranged, and an area between the moving frame supporting columns is a placing area of a chip BAR strip and a cover plate; the moving frame is provided with a plurality of first through holes which are uniformly distributed, and the moving frame is connected with the base through the moving frame support; the first graduated knob is arranged in the first through hole and used for measuring the thicknesses of the chip BAR, the adhesive layer and the cover plate and applying pressure to the cover plate, and the distance between the upper surface of the cover plate and the lower surface of the movable frame is larger than a preset threshold value; and a fixing part for fixing the chip BAR and the cover plate so that the chip BAR and the cover plate are parallel to the moving frame. The bonding frock of this application can guarantee that the glue film thickness between chip BAR strip and the apron is even unanimous, and can regulate and control the thickness of glue film. The application also provides a bonding method.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a bonding tool and a bonding method.
Background
In the process of processing a wafer to form a chip, a core layer and a cladding layer need to be prepared respectively, and a glass cover plate needs to be added for bonding for protection because the core layer is fragile. At present, when a glass cover plate is bonded, UV glue is firstly dispensed on a chip BAR, then the glass cover plate is covered on the chip BAR, a pressing block is placed on the glass cover plate, and the thickness of the glue layer is reduced under the action of the pressing block. The placing time and the placing position of the pressing block have important influence on the adhesive layer, the adhesive layer is very easy to have the uneven phenomenon that one side of the adhesive layer is thick and the other side of the adhesive layer is thin, so that the performance of a semiconductor device made of a chip is influenced, in addition, when the adhesive layer is pre-cured, because UV light cannot penetrate through the pressing block, the pressing block needs to be taken down from the glass cover plate and then is subjected to UV pre-curing, and the glass cover plate is also easy to move along with the taking-away of the pressing block in the process, so that the adhesive sheet is staggered; meanwhile, as the pressing block is taken away, the pressure of the glass cover plate is reduced, the glue layer rebounds, and the thickness of the glue layer is uneven or different from the expected thickness.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims at providing a bonding tool and a bonding method so as to form a glue layer with uniform thickness and accurate thickness between a chip BAR and a cover plate.
In order to solve the technical problem, the application provides a bonding frock, includes:
the base comprises a base and moving frame pillars which are positioned on the upper surface of the base and are oppositely arranged, and the area between the moving frame pillars is a placing area of a chip BAR and a cover plate;
the moving frame is provided with a plurality of first through holes which are uniformly distributed, and the moving frame is connected with the base through the moving frame support;
the first graduated knob is arranged in the first through hole and used for measuring the thicknesses of the chip BAR, the adhesive layer and the cover plate and applying pressure to the cover plate, and the distance between the upper surface of the cover plate and the lower surface of the movable frame is larger than a preset threshold value;
and a fixing part for fixing the chip BAR and the cover plate so that the chip BAR and the cover plate are parallel to the moving frame.
Optionally, the fixing part is arranged on the upper surface of the base and located on two sides of the movable support column respectively, and the fixing part comprises a side fixing frame provided with a second through hole, a second rotary knob with scales arranged in the second through hole, and a sliding block connected with the second rotary knob with scales.
Optionally, a channel is formed in the upper surface of the base, and a protrusion matched with the channel is formed in the sliding block, so that the sliding block can slide in the channel.
Optionally, one side of the sliding block, which is far away from the second knob with the scale, is in a step shape.
Optionally, the slider is made of stainless steel, and the movable frame and the base are made of stainless steel.
Optionally, one the removal frame pillar is cylindric pillar, the removal frame be equipped with cylindric pillar assorted third through-hole, the rotatable cover of removal frame is established on the cylindric pillar.
Optionally, the top of the moving frame pillar opposite to the cylindrical pillar is stepped, and an adsorbing member is disposed at the top of the stepped shape and used for adsorbing and fixing the moving frame.
Optionally, the method further includes:
the thread buckle is used for fixing the movable frame;
correspondingly, the outer surface of the cylindrical support higher than the movable frame is a threaded surface.
Optionally, the method further includes:
and the height adjusting frame is connected with the fixing part and comprises an adjusting support and a third knob with scales.
The present application also provides a bonding method, comprising:
placing a chip BAR in a placing area of a base in any one of the bonding tools;
placing a movable frame on a movable frame support, and adjusting the position of the chip BAR so as to enable the chip BAR to be positioned right below the movable frame;
removing the moving frame;
dispensing glue on the upper surface of the chip BAR, and covering a cover plate on the upper surface of the chip BAR;
fixing the chip BAR and the cover plate with a fixing member,
placing the moving frame on the moving frame support again, wherein the chip BAR and the cover plate are parallel to the moving frame;
downwards rotating a first knob with scales until the thicknesses of the chip BAR, the glue layer and the cover plate reach a preset thickness, and the distance between the upper surface of the cover plate and the lower surface of the movable frame is larger than a preset threshold value;
placing the bonding tool with the chip BAR strip, the adhesive layer and the cover plate in a curing box, and irradiating the curing light rays to the adhesive layer through the space for precuring;
taking out the bonding tool with the bonded chip BAR strip and the bonded cover plate, detaching the bonded chip BAR strip and the bonded cover plate from the bonding tool, and wiping off redundant glue around the cover plate and the BAR strip;
and placing the bonded chip BAR and the cover plate in the curing box again for curing, and finishing bonding of the chip BAR and the cover plate.
The bonding tool comprises a base, wherein the base comprises a substrate and moving frame supporting columns which are positioned on the upper surface of the substrate and are arranged oppositely, and an area between the moving frame supporting columns is a placing area of a chip BAR strip and a cover plate; the moving frame is provided with a plurality of first through holes which are uniformly distributed, and the moving frame is connected with the base through the moving frame support; the first graduated knob is arranged in the first through hole and used for measuring the thicknesses of the chip BAR, the adhesive layer and the cover plate and applying pressure to the cover plate, and the distance between the upper surface of the cover plate and the lower surface of the movable frame is larger than a preset threshold value; and a fixing part for fixing the chip BAR and the cover plate so that the chip BAR and the cover plate are parallel to the moving frame.
It can be seen that the bonding tool in the application comprises a base, a movable frame with a plurality of first through holes, a first scale knob and a fixed part, wherein a chip BAR is arranged between the pillars of the movable frame of the base, after the chip BAR is glued and placed on a cover plate, the fixed part fixes the chip BAR and the cover plate to avoid movement and dislocation, the first scale knob rotates downwards through the first through holes on the movable frame to apply pressure to the cover plate, the first through holes are uniformly distributed on the movable frame, namely the first scale knobs uniformly apply pressure to the cover plate, and simultaneously, the fixed part enables the chip BAR and the cover plate to be parallel to the movable frame, so that the pressure applied to a glue layer between the chip BAR and the cover plate is uniform, the thickness of the glue layer is uniform, and the thicknesses of the chip BAR, the glue layer and the cover plate can be known through the first scale knob, subtract chip BAR strip and apron thickness again and can learn the thickness of glue film, in addition, because the interval of the upper surface of apron and the lower surface of removal frame is greater than preset threshold value, UV light can shine through this clearance, accomplishes the precuring, need not to remove the pressure of applying on the apron, avoids glue film thickness to appear the bounce-back to guarantee that the thickness of glue film is fixed invariable, realize the thickness of accurate control glue film.
In addition, the application also provides a bonding method.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a bonding tool provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a mobile rack according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a first dial knob according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural view of a side fixing frame according to an embodiment of the present disclosure;
FIG. 5 is a top view of a base according to an embodiment of the present disclosure;
FIG. 6 is a schematic structural diagram of a slider according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a base according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a mobile rack according to an embodiment of the present disclosure;
fig. 9 is a schematic structural view of a threaded fastener according to an embodiment of the present disclosure;
FIG. 10 is a schematic structural diagram of a height adjustment bracket according to an embodiment of the present disclosure;
fig. 11 is a side view of a height adjustment bracket according to an embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, in the prior art, when a glass cover plate is bonded, UV glue is applied to a chip BAR, then the glass cover plate is covered on the chip BAR, a pressing block is placed on the glass cover plate, and the thickness of the glue layer is reduced under the action of the pressing block. The placing time and the placing position of the pressing block have important influence on the adhesive layer, the adhesive layer is very easy to have the uneven phenomenon that one side of the adhesive layer is thick and the other side of the adhesive layer is thin, in addition, when the adhesive layer is pre-cured, because UV light cannot penetrate through the pressing block, the pressing block needs to be taken down from the glass cover plate and then is subjected to UV pre-curing, and the glass cover plate is also easy to move along with the taking-away of the pressing block in the process, so that the sticking sheet is staggered; meanwhile, as the pressing block is taken away, the pressure of the glass cover plate is reduced, the glue layer rebounds, and the thickness of the glue layer is uneven or different from the expected thickness.
In view of this, the present application provides a bonding tool, please refer to fig. 1, where fig. 1 is a schematic structural diagram of a bonding tool provided in an embodiment of the present application, and the bonding tool includes:
the chip packaging structure comprises a base 1, wherein the base 1 comprises a substrate 11 and moving frame supports 12 which are positioned on the upper surface of the substrate 11 and are oppositely arranged, and the area between the moving frame supports 12 is a placing area of a chip BAR strip 7 and a cover plate 8;
the moving frame 2 is provided with a plurality of first through holes which are uniformly distributed, and the moving frame 2 is connected with the base 1 through the moving frame support 12;
the first graduated knob 3 is arranged in the first through hole and used for measuring the thicknesses of the chip BAR 7, the adhesive layer and the cover plate 8 and applying pressure to the cover plate 8, and the distance between the upper surface of the cover plate 8 and the lower surface of the movable frame 2 is larger than a preset threshold value;
a fixing part 4 for fixing the chip BAR 7 and the cover plate 8 so that the chip BAR 7 and the cover plate 8 are parallel to the moving frame 2.
Remove frame 2 and first take scale knob 3's schematic structure respectively as shown in fig. 2, fig. 3, the quantity of first taking scale knob 3 equals with first through-hole 21's quantity, the quantity of first through-hole 21 is a plurality of, and evenly distributed is the purpose on removing frame 2, first taking scale knob 3 screws up downwards through first through-hole 21 gradually, to apron 8 applys pressure, a plurality of evenly distributed's first through-hole 21 can be so that the pressure that receives everywhere on the apron 8 is balanced, and then guarantee the homogeneity of the thickness of glue film.
The material of the moving frame 2 and the base 1 includes, but is not limited to, 304 stainless steel, iron, and copper, and preferably, in order to enhance the rigidity of the base 1 and the moving frame 2, make it not easy to deform, and have corrosion resistance, the material of the moving frame 2 and the base 1 is stainless steel. The width of the movable frame 2 is generally narrow, and is only about 5 mm.
In the present application, the number of the first through holes 21 is not limited, and may be set by itself. For example, the number of the first through holes 21 may be three, four, five, and so on.
The numerical value of the first scale knob 3 is the sum of the thicknesses of the chip BAR 7, the glue layer and the cover plate 8, and the thicknesses of the chip BAR 7 and the cover plate 8 are known, so that the thickness of the glue layer can be calculated.
Preferably, first area scale knob 3 is the high accuracy knob of precision 0.05um, the accurate control glue film thickness of being convenient for.
The distance between the upper surface of the cover plate 8 and the lower surface of the movable frame 2 means that when the first graduated knob 3 is unscrewed and the thickness of the glue layer reaches the set thickness, the distance between the upper surface of the cover plate 8 and the lower surface of the movable frame 2. The distance between the upper surface of the cover plate 8 and the lower surface of the movable frame 2 needs to enable UV light rays to irradiate the chip BAR strip 7 through the distance, the first knob 3 with the scales does not need to be screwed on and the movable frame 2 does not need to be removed, and the pre-curing of the UV light rays on the glue layer is realized under the condition that pressure is applied to the cover plate 8.
The preset threshold is not limited in the present application, as the case may be. For example, the preset threshold may be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, and so on.
The fixing part 4 is arranged on the upper surface of the base 1 and is respectively positioned on two sides of the movable support column, and the fixing part 4 comprises a side fixing frame 42 provided with a second through hole 41, a second knob 43 with scales arranged in the second through hole 41, and a sliding block 44 connected with the second knob with scales.
The number of the fixing parts 4 is two, the structural schematic diagram of the side fixing frame is shown in fig. 4, the second knob 43 with scales passes through the second through hole 41, the second knob 43 with scales drives the slide block 44 to displace by screwing in and out, and then the chip BAR 7 and the cover plate 8 are fixed and are parallel to the moving frame 2. The second dial knob 43 is provided with a dial for the purpose of making the operator aware of the moving distance of the chip BAR 7 and the cover plate 8 on both sides of the moving pillar and the moving distance of the chip BAR 7 and the cover plate 8 at different positions on the same side, thereby making the chip BAR 7 and the cover plate 8 parallel to the moving frame 2.
Preferably, the second knob 43 with scale is a high precision knob with precision of 0.05um, which facilitates precise adjustment of the displacement of the chip BAR 7 and the cover plate 8.
The number of the second through holes 41 is not limited in this application, and may be set by itself, such as one, two, three, four, etc., and the number of the second through holes 41 is preferably a plurality so as to quickly and accurately adjust the chip BAR 7 and the cover plate 8 to be parallel to the moving frame 2.
Optionally, the upper surface of the base 1 is provided with a channel 13, the slider 44 is provided with a protrusion matching with the channel 13, so that the slider 44 can slide in the channel 13, and a top view of the base 1 is shown in fig. 5. However, the present application is not limited to this, and as another embodiment, the upper surface of the base 1 may be a flat surface, that is, the channel 13 is not provided, and the lower surface of the slider 44 is in flat contact with the upper surface of the base 1 and moves.
The side of the slider 44 away from the second knob 43 with scale is stepped, referring to fig. 6, the surface of the slider 44 connected to the second knob 43 with scale is a plane, and at this time, the slider 44 can be in contact with the chip BAR 7 and the cover plate 8 with different BAR widths in a matching manner, so as to fix the chip BAR 7 and the cover plate 8 well. In addition, the side of the sliding block 44 far away from the second knob 43 with the scale and the surface connected with the second knob 43 with the scale are both flat surfaces, and at this time, the sliding block 44 is in matched contact with the chip BAR 7 and the cover plate 8 with the same BAR width, so that a good fixing effect on the chip BAR 7 and the cover plate 8 is achieved.
Since the slider 44 needs to contact the chip BAR 7 and the cover plate 8, in order to avoid the slider 44 from causing additional damage to the chip BAR 7 and the cover plate 8, the material of the slider 44 is stainless steel, which is a tough and elastic material, although other materials such as polydimethylsiloxane may be selected.
The bonding tool in the application comprises a base 1, a moving frame 2 with a plurality of first through holes 21, a first scale-provided knob 3 and a fixed part 4, a chip BAR strip 7 is arranged between moving frame pillars 12 of the base 1, when glue is dispensed on the chip BAR strip 7 and a cover plate 8 is placed, the chip BAR strip 7 and the cover plate 8 are fixed by the fixed part 4 to avoid moving and dislocation, the first scale-provided knob 3 rotates downwards through the first through holes 21 on the moving frame 2 to apply pressure to the cover plate 8, the first through holes 21 are uniformly distributed on the moving frame 2, namely the first scale-provided knobs 3 uniformly apply pressure to the cover plate 8, meanwhile, the fixed part 4 enables the chip BAR strip 7 and the cover plate 8 to be parallel to the moving frame 2, so that the pressure applied to a glue layer between the chip BAR strip 7 and the cover plate 8 is uniform, the thickness of the glue layer is uniform, and the first scale-provided knob can know that the chip BAR strip 7, the cover plate 8 and the cover plate 8 are parallel, Glue film and 8 three's of apron thickness, subtract the thickness of chip BAR strip 7 and apron 8 again and can learn the thickness of glue film, in addition, because the interval of the upper surface of apron 8 and the lower surface of removal frame 2 is greater than the predetermined threshold value, UV light can shine through this clearance, accomplish the precuring, need not to remove the pressure of applying on the apron 8, avoid glue film thickness rebound to appear, thereby guarantee that the thickness of glue film is fixed unchangeably, realize the thickness of accurate control glue film.
On the basis of the above embodiments, in an embodiment of the present application, please refer to fig. 7 for a structural schematic diagram of the base 1, please refer to fig. 8 for a structural schematic diagram of the moving frame 2, one of the moving frame pillars 12 is a cylindrical pillar, the moving frame 2 is provided with a third through hole 22 matched with the cylindrical pillar, and the moving frame 2 is rotatably sleeved on the cylindrical pillar.
The top of the moving frame support 12 opposite to the cylindrical support is stepped, and an adsorption member is arranged at the top of the stepped shape and used for adsorbing and fixing the moving frame 2. Wherein, the adsorption piece can be a magnet.
The top of the mobile frame strut 12 that sets up relatively with cylindric pillar sets up to the echelonment purpose, be located between two mobile frame struts 12 when mobile frame 2, and first take scale knob 3 when exerting pressure to apron 8 through the first through-hole 21 on the mobile frame 2, make the better fixing of mobile frame 2 between two mobile frame struts 12, avoid taking place to remove twisting the in-process of taking scale knob 3, the influence is to the homogeneity that the pressure was exerted to apron 8, and then the homogeneity of influence glue film thickness. When the moving frame 2 needs to be moved between the two moving frame supports 12 or needs to be disposed between the two moving frames 2, the moving frame 2 can be rotated with the cylindrical support as an axis, which is very convenient.
For further promote the stability that removes frame 2 and cylindric pillar connection, the bonding frock still includes:
a thread buckle 5 for fixing the movable frame 2;
correspondingly, the outer surface of the cylindrical support column higher than the movable frame 2 is a threaded surface.
The structure of the threaded fastener 5 is schematically shown in fig. 9, and the movable frame 2 is rotatably sleeved on the cylindrical support and then fastened by the threaded fastener 5.
It should be noted that, the two movable frame supports 12 on the base 1 may also be two supports with the same shape, the shape includes but is not limited to a cylinder and a cuboid, the top of the two movable frame supports 12 is provided with a threaded hole, when the movable frame 2 needs to be arranged on the two movable frame supports 12, the movable frame 2 is fixed on the movable frame supports 12 by bolts, when the movable frame 2 needs to be removed, the bolts are removed, and the movable frame 2 is removed.
On the basis of any one of the above embodiments, in an embodiment of the present application, the bonding tool further includes:
a height adjustment bracket 6 connected to the fixed part 4, the height adjustment bracket 6 shown comprising an adjustment abutment 61 and a third graduated knob 62.
The structural schematic diagram of the height adjusting frame 6 is shown in fig. 10, the side view is shown in fig. 11, the height of the adjusting support 61 is adjusted through the third knob 62 with scales, and then the heights of the side fixing frame 42, the second knob 43 with scales and the sliding block are adjusted, so that the cover plate 8 with different thicknesses of the adhesive joints and the requirements of windowing is realized.
The application further provides a bonding method for bonding a cover plate by using the bonding tool in any one of the embodiments, and the method comprises the following steps:
step S101: and placing the chip BAR in a placing area of the base in the bonding tool in any embodiment.
The chip BAR strip is a clean chip BAR strip.
Step S102: and placing a movable frame on a movable frame support, and adjusting the position of the chip BAR so as to enable the chip BAR to be positioned under the movable frame.
Step S103: and removing the moving frame.
Step S104: and dispensing glue on the upper surface of the chip BAR, and covering the cover plate on the upper surface of the chip BAR.
The UV glue is uniformly dispensed on the chip BAR strip through an automatic glue dispenser, and the cover plate is a clean cover plate.
It should be noted that after the cover plate is placed, if bubbles are observed in the glue layer, the cover plate is lightly pressed to extrude the bubbles.
Step S105: and fixing the chip BAR and the cover plate by using a fixing component.
Step S106: and placing the movable frame on the movable frame support again, wherein the chip BAR and the cover plate are parallel to the movable frame.
Step S107: and downwards rotating the first knob with the scales until the thicknesses of the chip BAR, the glue layer and the cover plate reach the preset thickness, and enabling the distance between the upper surface of the cover plate and the lower surface of the movable frame to be larger than the preset threshold value.
Step S108: and placing the bonding tool with the chip BAR strip, the glue layer and the cover plate in a curing box, wherein curing light rays irradiate the glue layer through the space to be pre-cured.
In order to improve the efficiency, a plurality of bonding tools can be put into a curing box together for pre-curing.
Step S109: taking out the bonding tool with the bonded chip BAR strip and the bonded cover plate, detaching the bonded chip BAR strip and the bonded cover plate from the bonding tool, and wiping off redundant glue around the bonded cover plate and the BAR strip.
Step S110: and placing the bonded chip BAR and the cover plate in the curing box again for curing, and finishing bonding of the chip BAR and the cover plate.
In order to improve the efficiency, a plurality of bonded chip BAR and cover plate can be put into a curing box together for curing.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The bonding tool and the bonding method provided by the application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. The utility model provides a bonding frock which characterized in that includes:
the base comprises a base and moving frame pillars which are positioned on the upper surface of the base and are oppositely arranged, and the area between the moving frame pillars is a placing area of a chip BAR and a cover plate;
the moving frame is provided with a plurality of first through holes which are uniformly distributed, and the moving frame is connected with the base through the moving frame support;
the first graduated knob is arranged in the first through hole and used for measuring the thicknesses of the chip BAR, the adhesive layer and the cover plate and applying pressure to the cover plate, and the distance between the upper surface of the cover plate and the lower surface of the movable frame is larger than a preset threshold value;
and a fixing part for fixing the chip BAR and the cover plate so that the chip BAR and the cover plate are parallel to the moving frame.
2. The bonding tool according to claim 1, wherein the fixing member is disposed on the upper surface of the base and located on two sides of the movable support, and the fixing member comprises a side fixing frame having a second through hole, a second knob with scale disposed in the second through hole, and a slider connected to the second knob with scale.
3. The bonding tool according to claim 2, wherein a channel is formed in the upper surface of the base, and the slider is provided with a protrusion matched with the channel so that the slider can slide in the channel.
4. The bonding tool of claim 3, wherein a side of the slider away from the second graduated knob is stepped.
5. The bonding tool of claim 4, wherein the slider is made of stainless steel, and the movable frame and the base are made of stainless steel.
6. The bonding tool according to claim 5, wherein one of the moving frame supports is a cylindrical support, the moving frame is provided with a third through hole matched with the cylindrical support, and the moving frame is rotatably sleeved on the cylindrical support.
7. The bonding tool according to claim 6, wherein the top of the moving frame support column opposite to the cylindrical support column is stepped, and an adsorption member is disposed at the top of the stepped portion and used for adsorbing and fixing the moving frame.
8. The bonding tool of claim 7, further comprising:
the thread buckle is used for fixing the movable frame;
correspondingly, the outer surface of the cylindrical support higher than the movable frame is a threaded surface.
9. The bonding tool of any one of claims 1 to 8, further comprising:
and the height adjusting frame is connected with the fixing part and comprises an adjusting support and a third knob with scales.
10. A method of bonding, comprising:
placing a chip BAR in a placement area of a base in the bonding tool according to any one of claims 1 to 9;
placing a movable frame on a movable frame support, and adjusting the position of the chip BAR so as to enable the chip BAR to be positioned right below the movable frame;
removing the moving frame;
dispensing glue on the upper surface of the chip BAR, and covering a cover plate on the upper surface of the chip BAR;
fixing the chip BAR and the cover plate with a fixing member,
placing the moving frame on the moving frame support again, wherein the chip BAR and the cover plate are parallel to the moving frame;
downwards rotating a first knob with scales until the thicknesses of the chip BAR, the glue layer and the cover plate reach a preset thickness, and the distance between the upper surface of the cover plate and the lower surface of the movable frame is larger than a preset threshold value;
placing the bonding tool with the chip BAR strip, the adhesive layer and the cover plate in a curing box, and irradiating the curing light rays to the adhesive layer through the space for precuring;
taking out the bonding tool with the bonded chip BAR strip and the bonded cover plate, detaching the bonded chip BAR strip and the bonded cover plate from the bonding tool, and wiping off redundant glue around the cover plate and the BAR strip;
and placing the bonded chip BAR and the cover plate in the curing box again for curing, and finishing bonding of the chip BAR and the cover plate.
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113764315B (en) | 2024-06-11 |
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