CN113763831A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN113763831A CN113763831A CN202111085764.1A CN202111085764A CN113763831A CN 113763831 A CN113763831 A CN 113763831A CN 202111085764 A CN202111085764 A CN 202111085764A CN 113763831 A CN113763831 A CN 113763831A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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Abstract
The invention relates to a display module, which comprises: a display panel including a display section, a binding section located on a backlight side of the display section, and a bending section connecting the display section and the binding section; the electronic device is arranged on one side of the binding part, which is back to the display part; the heat dissipation structure is arranged between the display part and the binding part; the heat dissipation structure itself has a lateral thermal conductivity greater than a longitudinal thermal conductivity. The heat dissipation structure is arranged between the display part and the binding part and used for dissipating heat of the display panel. At display module assembly during operation, the heat transfer that electron device produced to binding the portion, then transversely guides the heat to each position department of display part whole face through heat radiation structure, prevents that the direct vertical transmission of heat that electron device produced from to the display part, prevents that the display part from corresponding the local temperature of gathering of electron device. So, transmit to display part after transversely dispersing the heat through heat radiation structure, make the heat evenly transmit the diffusion on display part, improve optical material's in the display part life.
Description
Technical Field
The invention relates to the technical field of electronic display, in particular to a display module and a display device.
Background
Flat Display panels, such as Organic Light Emitting Diode (OLED) panels and Display panels using LED devices, have the advantages of high image quality, power saving, thin body, and wide application range, and thus are widely used in various consumer electronic products, such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, and become the mainstream of Display devices.
The display module generally includes a display panel and electronic components such as a driving chip (IC) electrically connected to an internal circuit of the display panel, and controls the operation of the display panel through the electronic components such as the driving chip (IC). After the display module assembly lights, the heat that some electronic components work and produce is great, for example the temperature of drive chip department is obviously higher than the temperature of the screen body, like this, in the use, the heat that the more electron device that generates heat produced can be at the position gathering that the screen body corresponds in the display module assembly, and the high temperature of the heat production of gathering can make the luminescent material life-span of the internal portion of screen reduce, can take place the phenomenon of burning even when serious.
Disclosure of Invention
Therefore, it is necessary to provide a display module and a display device for solving the problem that the service life of the luminescent material is affected by the heat accumulation in the local area of the conventional display module.
The utility model provides a display module assembly, display module assembly includes:
a display panel including a display section, a binding section located on a backlight side of the display section, and a bending section connecting the display section and the binding section;
an electronic device provided on a side of the binding portion facing away from the display portion;
a heat dissipation structure disposed between the display part and the binding part;
and the transverse thermal conductivity of the heat dissipation structure is larger than the longitudinal thermal conductivity.
Among the above-mentioned display module assembly, heat radiation structure locates the display part and binds between the portion for dispel the heat to display panel. And, the heat radiation structure's own transverse thermal conductivity is greater than the longitudinal thermal conductivity to more from the horizontal guide heat dissipation. At display module assembly during operation, the heat transfer that electron device produced to binding the portion, then transversely guides the heat to each position department of display part whole face through heat radiation structure, prevents that the direct vertical transmission of heat that electron device produced from to the display part, prevents that the display part from corresponding the local temperature of gathering of electron device. So, transmit to display part after transversely dispersing the heat through heat radiation structure, make the heat evenly transmit the diffusion on display part, improve optical material's in the display part life.
In one embodiment, the heat dissipation structure includes:
a heat transfer layer group bonded to a side of the binding portion facing the display portion; and
the heat output layer comprises a first sub output layer and a second sub output layer which are arranged at intervals, and the first sub output layer and the second sub output layer are both formed on the heat transmission layer group and are both connected with the display part;
wherein an orthographic projection of the electronic device toward the display portion is located between the first sub output layer and the second sub output layer.
In one embodiment, the heat transport layer group comprises:
a heat input layer coupled to a side of the binding portion facing the display portion; and
and the heat transmission layer is positioned between the heat input layer and the heat output layer and used for guiding the heat in the heat input layer to be transferred to the heat output layer.
In one embodiment, the transverse thermal conductivity of the heat output layer and the transverse thermal conductivity of the heat input layer are both greater than the transverse thermal conductivity of the heat transport layer, and the longitudinal thermal conductivity of the heat output layer and the longitudinal thermal conductivity of the heat input layer are both less than the longitudinal thermal conductivity of the heat transport layer.
In one embodiment, the second sub output layer is located entirely between the binding portion and the display portion, at least a portion of the first sub output layer extends beyond the binding portion in a direction parallel to the display portion, and the first sub output layer is closer to a central region of the display portion than the second sub output layer.
In one embodiment, the heat transport layer includes a first sub transport layer, the first sub transport layer is located between the heat input layer and the first sub output layer, and the first sub output layer is offset from the first sub transport layer in a direction away from the second sub output layer.
In one embodiment, the heat transport layer further includes a first conductive portion, the first sub transport layer is spaced apart from the heat input layer and the first sub output layer, and the first conductive portion is connected between the heat input layer and the first sub transport layer and between the first sub transport layer and the first sub output layer;
the transverse thermal conductivity of the heat input layer, the transverse thermal conductivity of the first sub-output layer and the transverse thermal conductivity of the first sub-transmission layer are all larger than the transverse thermal conductivity of the first transmission part, and the longitudinal thermal conductivity of the heat input layer, the longitudinal thermal conductivity of the first sub-output layer and the longitudinal thermal conductivity of the first sub-transmission layer are all smaller than the longitudinal thermal conductivity of the first transmission part.
In one embodiment, the heat transport layer further comprises a second conductive portion connected between the heat input layer and the second sub output layer;
the transverse thermal conductivity of the heat input layer and the transverse thermal conductivity of the second sub-output layer are both greater than the transverse thermal conductivity of the second conduction part, and the longitudinal thermal conductivity of the heat input layer and the longitudinal thermal conductivity of the second sub-output layer are both less than the longitudinal thermal conductivity of the second conduction part.
In one embodiment, the heat transfer layer includes a plurality of first sub-transfer layers spaced apart from each other;
in the direction that the binding part points to the display part, the plurality of first sub-transmission layers are sequentially arranged in a staggered mode along the direction of the path gradually far away from the second conduction part; the first conducting part is connected between every two adjacent first sub-transmission layers.
In one embodiment, the display part has a first area, and the spacing space between the first sub output layer and the second sub output layer coincides with the first area towards the display part orthographic projection area;
the heat dissipation structure further comprises a thermal insulation layer at least partially connected between the heat input layer and the first region.
In one embodiment, the heat insulation layer is connected between the heat input layer and the heat output layer, and the heat insulation layer wraps the side of the heat input layer facing the heat output layer, and the side of the heat transmission layer facing the heat input layer and the side of the heat output layer facing the heat input layer.
A display device comprises the display module.
Drawings
FIG. 1 is a schematic structural diagram of a display module according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a display module according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display module according to another embodiment of the invention.
100. A display module; 10. a display panel; 12. a display unit; 121. a first region; 13. a bending section; 14. a binding section; 30. an electronic device; 50. a heat dissipation structure; 51. a heat transport layer set; 52. a heat input layer; 53. a thermal insulation layer; 54. a heat transfer layer; 541. a first sub-transport layer; 543. a first conductive part; 545. a second conductive part; 56. a heat output layer; 561. a first sub output layer; 563. and a second sub-output layer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
As described in the background art, in the conventional display module, heat is easily collected inside the screen body during the operation process, and the luminescent material inside the screen body is easily damaged. The inventor researches and discovers that the root cause of the problem is that the heat dissipation layer in the traditional display module is mostly coated on the whole surface or attached to the whole surface, the transverse and longitudinal heat conduction speeds of all positions of the heat dissipation layer are the same, in practical application, heat cannot be transmitted transversely in time under the condition that the heat at local positions is too high, and the condition that the heat is accumulated in the screen body easily occurs.
In order to solve the above technical problems, an embodiment of the present invention provides a display module, which can uniformly diffuse heat in the display module, and prevent the heat from being accumulated at a position corresponding to a heat source, so that the position is overheated for a long time and the service life of a light emitting material is shortened.
Referring to fig. 1, the display module 100 includes a display panel 10, an electronic device 30, and a heat dissipation structure 50. The display panel 10 includes a display part 12, a binding part 14 located on a backlight side of the display part 12, and a bending part 13 connecting the display part 12 and the binding part 14. That is, the binding portion 14 is configured to be bent toward the backlight side of the display portion 12 such that the display portion 12 and the binding portion 14 are disposed opposite and spaced from each other, and the electronic device 30 is disposed on the side of the binding portion 14 facing away from the display portion 12. In the binding process, the electronic devices 30 are electrically connected to the surface of the binding portion 14 on the same side as the light emitting side of the display portion 12, and then the binding portion 14 is bent to the backlight side of the display portion 12, and at this time, the electronic devices 30 on the binding portion 14 are turned over to face away from the display portion 12, thereby realizing a "narrow bezel" of the display panel.
In some embodiments, the display panel 10 is a flexible display panel having a display portion 12 and a binding portion 14, the binding portion 14 is used for soldering the electronic device 30, the binding portion 14 is bent to a side away from a light emitting surface of the display portion 12, and the heat dissipation structure 50 is disposed between the binding portion 14 and the display portion 12 of the flexible display panel. In some other embodiments, the display module 100 further includes a flexible circuit board, the flexible circuit board is bonded to one side of the display panel 10, the electronic device 30 is disposed on the flexible circuit board, and then the flexible circuit board is bent to a side facing away from the light emitting side of the display panel 10, such that the display panel 10 is configured as the display portion 12, the flexible circuit board is configured as the bonding portion 14, and the heat dissipation structure 50 is disposed between the flexible circuit board and the display panel 10. All embodiments provided by the present invention may be applied to the display module 100 bound by the flexible circuit board, and may also be applied to the display module 100 bound by the flexible display panel itself, which is not limited herein.
The heat dissipation structure 50 is disposed between the display part 12 and the binding part 14, and is used for dissipating heat of the display panel 10. Also, the heat dissipation structure 50 itself has a lateral thermal conductivity greater than a longitudinal thermal conductivity to guide heat dissipation more from the lateral direction. When the display module 100 operates, heat generated by the electronic device 30 is transferred to the binding portion 14, and then the heat is transversely guided to each position of the whole surface of the display portion 12 through the heat dissipation structure 50, so that the heat generated by the electronic device 30 is prevented from being directly and longitudinally transferred to the display portion 12, and the local accumulated temperature of the display portion 12 corresponding to the electronic device 30 is prevented. Therefore, the heat is transversely dissipated and then transferred to the display part 12 through the heat dissipation structure 50, so that the heat is uniformly transferred and diffused on the display part 12, and the service life of the optical material in the display part 12 is prolonged.
It should be noted that, the electronic device 30 includes a driving chip, and the driving chip has a larger heat value when the display module 100 is turned on, and the heat generated by the driving chip can be laterally dissipated and guided by the heat dissipation structure 50, so as to prevent all the heat from being collected at the position of the display panel 10 corresponding to the driving chip, and improve the service life of the display module 100. Alternatively, the electronic device 30 includes a driving chip and other electronic components, so that the heat generated by more electronic components can be guided and diffused laterally outward by the heat dissipation structure 50.
The heat dissipation structure 50 includes a heat transport layer group 51 and a heat output layer 56, the heat transport layer group 51 is bonded to a side of the binding portion 14 facing the display portion 12, the heat output layer 56 is formed on the heat transport layer 54, that is, the heat transport layer group 51 and the heat output layer 56 are sequentially stacked on the binding portion 14, and the heat transport layer group 51 is provided between the binding portion 14 and the heat output layer 56 for guiding heat in the binding portion 14 to be transferred to the heat output layer 56.
The heat output layer 56 includes a first sub output layer 561 and a second sub output layer 563 that are disposed at an interval, and both the first sub output layer 561 and the second sub output layer 563 are formed on the heat transport layer 54 and are connected to the display portion 12; wherein the orthographic projection of the electronic device 30 towards the display portion 12 is located between the first sub output layer 561 and the second sub output layer 563. The heat output layer 56 is divided into a first sub output layer 561 and a second sub output layer 563, a gap is reserved between the first sub output layer 561 and the second sub output layer 563, the electronic device 30 corresponds to the gap, which is equivalent to the first sub output layer 561 and the second sub output layer 563 staggering the electronic device 30, heat generated during the operation of the electronic device 30 is transferred to the first sub output layer 561 and the second sub output layer 563 staggering the electronic device 30, the heat is prevented from being directly transferred to the area of the display part 12 facing the electronic device 30, the heat generated by the electronic device 30 is guided to the position of the display part 12 where the electronic device 30 staggers, the heat can be uniformly transferred and diffused on the display part 12, and the service life of the optical material in the display part 12 is further prolonged.
The heat transport layer group 51 includes a heat input layer 52 and a heat transport layer 54, the heat input layer 52 being bonded to a side of the binding portion 14 facing the display portion 12, the heat transport layer 54 being located between the heat input layer 52 and the heat output layer 56 for guiding heat in the heat input layer 52 to be transferred to the heat output layer 56. When the electronic device 30 disposed in the binding portion 14 operates, the heat generated by the operation of the electronic device 30 is collected in the binding portion 14, and then the heat of the binding portion 14 is collected in time through the heat input layer 52, and the heat is transferred to the heat output layer 56 through the heat transmission layer 54, so that the heat is effectively transferred to the heat output layer 56, and most of the heat in the binding portion 14 is transferred to the heat output layer 56 through the heat input layer 52, so as to transfer the heat to the region of the display portion 12 staggered from the electronic device 30, and prevent the heat in the binding portion 14 from being directly transferred to the region of the display portion 12 facing the electronic device 30. It should be noted that, in some embodiments, the heat transfer layer group 51 may also include only the heat transfer layer 54, and the heat transfer layer 54 is directly in contact with the binding portion 14 for heat conduction, which is not limited herein.
In some embodiments, a direction parallel to the display 12 is defined as a first direction, the binding portion 14 is directed toward the display 12, and a direction perpendicular to the display 12 is defined as a second direction. Generally, a first direction parallel to the display unit 12 is a horizontal direction, and a second direction in which the binding unit 14 is directed to the display unit 12 is a vertical direction. In the first direction, the thermal conductivity of the heat output layer 56 and the thermal conductivity of the heat input layer 52 are both greater than the thermal conductivity of the heat transport layer 54, i.e., the lateral thermal conductivity of the heat output layer 56 and the lateral thermal conductivity of the heat input layer 52 are both greater than the lateral thermal conductivity of the heat transport layer 54; in the second direction, the thermal conductivity of the heat output layer 56 and the thermal conductivity of the heat input layer 52 are both less than the thermal conductivity of the heat transport layer 54, i.e., the thermal conductivity in the longitudinal direction of the heat output layer 56 and the thermal conductivity in the longitudinal direction of the heat input layer 52 are both less than the thermal conductivity in the longitudinal direction of the heat transport layer 54. That is, both the heat input layer 52 and the heat output layer 56 are capable of conducting heat rapidly in the lateral direction, and the heat transfer layer 54 is capable of conducting heat rapidly in the longitudinal direction. The heat transferred to the binding portion 14 when the electronic device 30 operates can be gathered by the heat input layer 52 covering the binding portion 14 and transferred to the heat transfer layer 54 in the lateral direction, preventing the heat on the binding portion 14 from being directly transferred to the first region 121 in the longitudinal direction. Meanwhile, the heat transport layer 54 may continue to transfer heat to the heat output layer 56 in the longitudinal direction, and finally, the heat may be diffused in the heat output layer 56 in the transverse direction to various positions on the light emitting side of the display part 12, which may prevent the heat from being concentrated on the area of the display part 12 facing the display device 30.
Specifically, the heat output layer 56 and the heat input layer 52 are both made of graphite and have a thermal conductivity of 1600 w/m.k; the heat transfer layer 54 is made of copper and has a thermal conductivity of 400 w/m.k.
Referring to fig. 2 and 3, in other embodiments, considering that the binding portion 14 generally bends to correspond to the edge of the display portion 12, if the heat on the binding portion 14 is to be uniformly dispersed to each position of the display portion 12, more heat dissipation structures 50 need to be disposed toward the central region of the display portion 12, so as to increase the heat dissipation area of the central side of the display portion 12, and to make the heat more uniformly diffused from the light emitting side of the display portion 12. Particularly, for the large-sized display module 100, since the area of the display portion 12 itself is large and the space for disposing the heat dissipation structure 50 on the edge side is limited, more heat dissipation structures 50 need to be disposed on the center side of the display module 100 to uniformly dissipate heat.
Specifically, the second sub output layer 563 is completely located between the binding portion 14 and the display portion 12, the first sub output layer 561 at least partially extends to the outside of the binding portion 14 in a direction parallel to the display portion 12, and the first sub output layer 561 is closer to the central region of the display portion 12 than the second sub output layer 563, so that the first sub output layer 561 extends more toward the central region of the display portion 12 to guide heat as much as possible toward the central region of the display portion 12 through the first sub output layer 561, which can prevent heat from being greatly concentrated at the edge of the display portion 12, and can further uniformly diffuse the heat.
Alternatively, in a direction in which the second sub output layer 563 points to the first sub output layer 561 and is parallel to the display part 12, a size of an orthographic projection of the second sub output layer 563 on the display part 12 is smaller than a size of an orthographic projection of the first sub output layer 561 on the display part 12. In a direction in which the second sub-output layer 563 points to the first sub-output layer 561, for example, in a longitudinal extending direction of the mobile phone screen, the size of the second sub-output layer 563 is smaller, and the size of the first sub-output layer 561 is larger, so that the first sub-output layer 561 can guide heat to a central area of the display portion 12 as much as possible, thereby preventing heat from being concentrated on an edge of the display portion 12 in a large amount, and further uniformly diffusing the heat.
Further, the heat transport layer 54 includes a first sub transport layer 541, the first sub transport layer 541 is located on the heat input layer 52 and the first sub output layer 561, the first sub output layer 561 is disposed in a staggered manner relative to the first sub transport layer 541 in a direction away from the second sub output layer 563, that is, the first sub transport layer 541 and the first sub output layer 561 are gradually away from the second sub output layer 563 in a step shape, so that the first sub output layer 561 extends to a central area of the display portion 12, a transverse heat dissipation span of the heat dissipation structure 50 is larger, even when the heat dissipation structure is applied to a large-size display module 100, the first sub output layer 561 with a larger heat dissipation span can be disposed at a central side of the display module 100, so that the display module 100 can dissipate heat uniformly, and the heat dissipation structure 50 is suitable for the large-size display module 100.
The first sub-transmission layer 541, the heat input layer 52 and the first sub-output layer 561 are disposed at an interval, the heat transmission layer 54 further includes a first conduction portion 543, the first conduction portion 543 is connected between the heat input layer 52 and the first sub-transmission layer 541 and between the first sub-transmission layer 541 and the first sub-output layer 561, the first sub-transmission layer 541 and the heat input layer 52 are connected through the first conduction portion 543 in a heat conducting manner, and the first sub-transmission layer 541 and the first sub-output layer 561 are connected through another first conduction portion 543 in a heat conducting manner.
Specifically, a direction parallel to the display section 12 is defined as a first direction, a direction in which the binding section 14 is directed to the display section 12, and a direction perpendicular to the display section 12 is defined as a second direction. Generally, a first direction parallel to the display unit 12 is a horizontal direction, and a second direction in which the binding unit 14 is directed to the display unit 12 is a vertical direction. In the first direction, the thermal conductivity of the heat input layer 52, the thermal conductivity of the first sub transmission layer 541, and the thermal conductivity of the first sub output layer 561 are all greater than the thermal conductivity of the first conduction portion 543, that is, the lateral thermal conductivity of the heat input layer 52, the lateral thermal conductivity of the first sub transmission layer 541, and the lateral thermal conductivity of the first sub output layer 561 are all greater than the lateral thermal conductivity of the first conduction portion 543; in the second direction, the thermal conductivity of the heat input layer 52, the thermal conductivity of the first sub transmission layer 541, and the thermal conductivity of the first sub output layer 561 are all smaller than the thermal conductivity of the first conduction portion 543, that is, the longitudinal thermal conductivity of the heat input layer 52, the longitudinal thermal conductivity of the first sub transmission layer 541, and the longitudinal thermal conductivity of the first sub output layer 561 are all smaller than the longitudinal thermal conductivity of the first conduction portion 543.
That is, the heat input layer 52, the first sub-transmission layer 541, and the first sub-output layer 561 can rapidly conduct heat in the lateral direction, and the first conduction portion 543 can rapidly conduct heat in the vertical direction. The heat transferred to the bonding portion 14 during the operation of the electronic device 30 can be collected by the heat input layer 52 covering the bonding portion 14 and then transferred to a first conduction portion 543 in the transverse direction, so as to prevent the heat in the bonding portion 14 from being directly transferred to the first region 121 in the vertical direction. Meanwhile, the first conductive portion 543 can continuously transmit heat to the first sub-transmission layer 541 along the vertical direction, and then the heat in the first sub-transmission layer 541 is transmitted to the first sub-output layer 561 after being transmitted to another first conductive portion 543 laterally, and finally the heat is diffused to each position of the central side of the display portion 12 along the lateral direction in the first sub-output layer 561, so as to dissipate heat in a large area through the central side of the display module 100.
Optionally, as shown in fig. 2, a first conducting portion 543 is disposed between the first sub-transmitting layer 541 and the heat input layer 52, and another first conducting portion 543 is disposed between the first sub-transmitting layer 541 and the first sub-output layer 561, so as to achieve a heat conducting connection among the heat input layer 52, the first sub-transmitting layer 541, and the first sub-output layer 561. Still alternatively, as shown in fig. 3, a first conducting portion 543 is disposed between the first sub-transmitting layer 541 and the heat input layer 52, another first conducting portion 543 is disposed between the first sub-outputting layer 561 and the heat input layer 52, and the first conducting portion 543 is further abutted against the first sub-transmitting layer 541, so that the heat input layer 52, the first sub-transmitting layer 541 and the first sub-outputting layer 561 can be connected in a heat conducting manner.
Specifically, the heat input layer 52, the first sub-transmission layer 541 and the first sub-output layer 561 are made of graphite and have a thermal conductivity of 1600 w/m.k; the first conductive portion 543 is made of copper and has a thermal conductivity of 400 w/m.k.
Referring to fig. 2 and 3, the heat transport layer 54 includes a second conductive part 545, and the second sub output layer 563 includes a second sub output layer 563 and a second conductive part 545 connected to each other. In the limited space of the edge of the display module 100, a complex layer group is not required to be arranged, and the heat in the heat input layer 52 is conducted to the second sub output layer 563 through the second conduction portion 545 so as to uniformly diffuse the heat at the edge. In addition, the first sub-output layer 561 and the second sub-output layer 563 are respectively located at opposite sides of the first region 121, and radiate heat from both sides of the first region 121.
Specifically, a direction parallel to the display section 12 is defined as a first direction, a direction in which the binding section 14 is directed to the display section 12, and a direction perpendicular to the display section 12 is defined as a second direction. Generally, a first direction parallel to the display unit 12 is a horizontal direction, and a second direction in which the binding unit 14 is directed to the display unit 12 is a vertical direction. In the first direction, the thermal conductivity of the heat input layer 52 and the thermal conductivity of the second sub output layer 563 are both greater than the thermal conductivity of the second conductive portion 545, that is, the lateral thermal conductivity of the heat input layer 52 and the lateral thermal conductivity of the second sub output layer 563 are both greater than the lateral thermal conductivity of the second conductive portion 545; in the second direction, the thermal conductivity of the heat input layer 52 and the thermal conductivity of the second sub output layer 563 are both less than the thermal conductivity of the second conductive portion 545, that is, the longitudinal thermal conductivity of the heat input layer 52 and the longitudinal thermal conductivity of the second sub output layer 563 are both less than the longitudinal thermal conductivity of the second conductive portion 545.
That is, the heat input layer 52 and the second sub output layer 563 can rapidly conduct heat in the lateral direction, and the second conduction part 545 can rapidly conduct heat in the longitudinal direction. The heat transferred to the bonding portion 14 when the electronic device 30 operates can be gathered by the heat input layer 52 covering the bonding portion 14 and transferred to the second conduction portion 545 in the transverse direction, thereby preventing the heat on the bonding portion 14 from being directly transferred to the first region 121 in the longitudinal direction. Meanwhile, the second conduction part 545 can continuously transfer heat to the second sub output layer 563 in the longitudinal direction, and finally, the heat is diffused in the second sub output layer 563 to various positions on the edge side of the display part 12 in the transverse direction, so as to dissipate the heat through the edge side of the display module 100.
Optionally, the heat input layer 52 and the second sub output layer 563 are made of graphite and have a thermal conductivity of 1600 w/m.k; the second conduction part 545 is made of copper and has a thermal conductivity of 400 w/m.k.
In some embodiments, the heat transfer layer 54 includes a plurality of first sub-transfer layers 541 disposed to be spaced apart from each other. In a direction in which the binding portion 14 points to the display portion 12, that is, in a vertical direction in fig. 2 and 3, the plurality of first sub-transmission layers 541 are sequentially arranged in a staggered manner along a direction gradually departing from a path of the second transmission portion 545, which corresponds to a step shape in which the plurality of first sub-transmission layers 541 gradually depart from the second transmission portion 545, and a first transmission portion 543 is thermally connected between every two adjacent first sub-transmission layers 541, so that the plurality of first sub-output layers 561 are thermally connected to each other through the first transmission portion 543. By providing the plurality of first sub transfer layers 541 in this manner, the first sub output layer 561 can be extended to a position farther from the second sub output layer 563 on the center side of the display unit 12, and heat can be transferred and diffused more uniformly in the lateral direction.
In some embodiments, the display unit 12 has a first region 121, a space between the first sub output layer 561 and the second sub output layer 563, and an orthogonal projection region facing the display unit 12 coincides with the first region 121, that is, the first sub output layer 561 and the second sub output layer 563 are offset from a region of the electronic device 30, an orthogonal projection on the display unit 12 is the first region 121, and the first region 121 is a region of the display unit 12 corresponding to the electronic device 30. The heat dissipation structure 50 further includes a thermal insulation layer 53, wherein the thermal insulation layer 53 is at least partially connected between the heat input layer 52 and the first region 121, so that the thermal insulation layer 53 blocks heat in the heat input layer 52 from being transferred to the first region 121, and thus heat in the heat input layer 52 can be sufficiently transferred to the heat output layer 56 through the heat transmission layer 54, and the first region 121 is prevented from gathering excessive heat to damage the optical material.
Further, the thermal insulation layer 53 is connected between the heat input layer 52 and the heat output layer 56, and the thermal insulation layer 53 wraps the side of the heat input layer 52 facing the heat output layer 56, the heat transmission layer 54 and the side of the heat output layer 56 facing the heat input layer 52. Equivalently, the heat input layer 52 and the heat output layer 56 are not wrapped with the insulating layer 53 on their opposite sides to facilitate heat transfer in contact with the binding portion 14 and the display portion 12, respectively, while the other surfaces of the heat input layer 52 and the heat output layer 56 and the heat transfer layer 54 are all wrapped with the insulating layer 53.
Therefore, on one hand, the heat input layer 52, the heat transmission layer 54 and the heat output layer 56 are wrapped by the heat insulation layer 53 for heat conduction and isolation, so that the heat input layer 52 only guides heat to be transmitted between the binding portion 14 and the heat transmission layer 54, the heat transmission layer 54 only guides heat to be transmitted between the heat input layer 52 and the heat output layer 56, the heat output layer 56 only guides heat to be transmitted between the heat transmission layer 54 and the second area 123 of the display portion 12, the heat in the heat input layer 52, the heat transmission layer 54 and the heat output layer 56 is prevented from being transmitted to other places, an effective heat dissipation path is formed between the binding portion 14 and the display portion 12, the heat is guided to each position of the light emitting side of the display module 100, and uniform heat dissipation is achieved.
On the other hand, the heat input layer 52, the heat transmission layer 54 and the heat output layer 56 are connected into a whole by wrapping the heat insulation layer 53, so that the heat dissipation structure 50 is formed, the heat dissipation structure 50 can be pasted at different positions according to requirements, and the heat dissipation structure 50 can be conveniently assembled and used. Optionally, the insulating layer 53 is a glue layer having adhesive properties by which the heat input layer 52, the heat transfer layer 54, and the heat output layer 56 may be bonded. And the thermal conductivity coefficient of the adhesive layer is 0.2W/m.k, so that the adhesive layer has better heat insulation property.
In some embodiments, the area and thickness of each layer in the heat dissipation structure 50 can be adjusted according to actual conditions to achieve a better heat dissipation effect, and the thickness and area of the heat input layer 52, the heat transfer layer 54, and the heat output layer 56 in the heat dissipation structure 50 are not limited herein. For example, when the screen is large, the area of the heat output layer 56 may be increased to diffuse heat to various positions of the screen, so as to dissipate heat more uniformly and prevent heat from concentrating on a local area of the screen.
In an embodiment of the invention, a display device is further provided, which includes the display module 100. The touch display device can be any product or part with a touch display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a vehicle-mounted device, a wearable device or an internet of things device.
After the display module 100 is assembled in the display device, if the heat generated by other devices in the display device is large, for example, the processor (CPU) in the display device generates more heat, which also affects the service life of the position corresponding to the display panel 10 above the processor, the heat dissipation structure 50 provided by the present invention may also be disposed above the processor of the display device to disperse the heat generated by the processor, so as to uniformly dissipate the heat of the display device.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a display module assembly, its characterized in that, display module assembly includes:
a display panel including a display section, a binding section located on a backlight side of the display section, and a bending section connecting the display section and the binding section;
an electronic device provided on a side of the binding portion facing away from the display portion;
a heat dissipation structure disposed between the display part and the binding part;
and the transverse thermal conductivity of the heat dissipation structure is larger than the longitudinal thermal conductivity.
2. The display module assembly of claim 1, wherein the heat dissipation structure comprises:
a heat transfer layer group bonded to a side of the binding portion toward the display portion, including: a heat input layer coupled to a side of the binding portion facing the display portion; and a heat transport layer located between the heat input layer and the heat output layer; and
the heat output layer comprises a first sub output layer and a second sub output layer which are arranged at intervals, and the first sub output layer and the second sub output layer are both formed on the heat transmission layer group and are both connected with the display part;
wherein an orthographic projection of the electronic device toward the display portion is located between the first sub output layer and the second sub output layer.
3. The display module of claim 2, wherein the thermal conductivity of the heat output layer and the thermal conductivity of the heat input layer are both greater than the thermal conductivity of the heat transport layer, and the thermal conductivity of the heat output layer and the thermal conductivity of the heat input layer are both less than the thermal conductivity of the heat transport layer.
4. The display module of claim 2, wherein the second sub-output layer is located entirely between the binding portion and the display portion, at least a portion of the first sub-output layer extends beyond the binding portion in a direction parallel to the display portion, and the first sub-output layer is closer to a central region of the display portion than the second sub-output layer.
5. The display module according to claim 4, wherein the heat transport layer comprises a first sub transport layer, the first sub transport layer is disposed between the heat input layer and the first sub output layer, and the first sub output layer is disposed in a staggered manner with respect to the first sub transport layer in a direction away from the second sub output layer.
6. The display module according to claim 5, wherein the heat transport layer further comprises a first conductive portion, the first sub transport layer is spaced apart from the heat input layer and the first sub output layer, and the first conductive portion is connected between the heat input layer and the first sub transport layer and between the first sub transport layer and the first sub output layer;
the transverse thermal conductivity of the heat input layer, the transverse thermal conductivity of the first sub-output layer and the transverse thermal conductivity of the first sub-transmission layer are all larger than the transverse thermal conductivity of the first transmission part, and the longitudinal thermal conductivity of the heat input layer, the longitudinal thermal conductivity of the first sub-output layer and the longitudinal thermal conductivity of the first sub-transmission layer are all smaller than the longitudinal thermal conductivity of the first transmission part.
7. The display module of claim 5, wherein the heat transport layer further comprises a second conductive portion connected between the heat input layer and the second sub-output layer;
the transverse thermal conductivity of the heat input layer and the transverse thermal conductivity of the second sub-output layer are both greater than the transverse thermal conductivity of the second conduction part, and the longitudinal thermal conductivity of the heat input layer and the longitudinal thermal conductivity of the second sub-output layer are both less than the longitudinal thermal conductivity of the second conduction part.
8. The display module according to claim 7, wherein the heat transport layer comprises a plurality of first sub transport layers spaced apart from each other;
in the direction that the binding part points to the display part, the plurality of first sub-transmission layers are sequentially arranged in a staggered mode along the direction of the path gradually far away from the second conduction part; the first conducting part is connected between every two adjacent first sub-transmission layers.
9. The display module according to any one of claims 2-8, wherein the display portion has a first area, and the spacing space between the first sub-output layer and the second sub-output layer coincides with the first area in a forward projection area toward the display portion;
the heat dissipation structure further comprises a heat insulation layer at least partially connected between the heat input layer and the first region;
the heat insulation layer is connected between the heat input layer and the heat output layer, and the heat insulation layer wraps one side, facing the heat output layer, of the heat input layer, the heat transmission layer and one side, facing the heat input layer, of the heat output layer.
10. A display device, comprising the display module set of any one of claims 1-9.
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| CN113763831B (en) | 2023-06-20 |
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