CN113759796B - Intelligent gateway for collecting and controlling industrial MCU - Google Patents
Intelligent gateway for collecting and controlling industrial MCU Download PDFInfo
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- CN113759796B CN113759796B CN202111108571.3A CN202111108571A CN113759796B CN 113759796 B CN113759796 B CN 113759796B CN 202111108571 A CN202111108571 A CN 202111108571A CN 113759796 B CN113759796 B CN 113759796B
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- 238000012544 monitoring process Methods 0.000 claims abstract description 44
- 238000002955 isolation Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000005057 refrigeration Methods 0.000 claims description 18
- 238000001914 filtration Methods 0.000 claims description 16
- 238000013500 data storage Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 3
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0428—Safety, monitoring
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/24—Pc safety
- G05B2219/24024—Safety, surveillance
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- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an intelligent gateway for collecting and controlling an industrial MCU, which belongs to the technical field of gateways, and adopts a mode that a feedback module is connected with a switching power supply module and a central control MCU, so that the function of detecting and feeding back the voltage transmitted to the central control MCU is realized, the intelligent gateway is matched with the switching power supply module to adaptively adjust and increase a voltage isolation module to avoid the interference problem, and a camera monitoring and a temperature and humidity monitoring are increased when industrial equipment is monitored, so that the problem of external damage of the industrial equipment and a proper operating environment are avoided, and data of the intelligent gateway is transmitted through a wireless module and can be monitored by opening a mobile terminal.
Description
Technical Field
The invention relates to a gateway, in particular to an intelligent gateway for collecting and controlling an industrial MCU, and belongs to the technical field of gateways.
Background
The gateway is also called gateway connector and protocol converter.
The gateway is the most complex network interconnection device on the transport layer to implement network interconnection, and is only used for network interconnection with two higher-layer protocols different.
The gateway may be used for both wide area network and local area network interconnections.
A gateway is a computer system or device that acts as a translation rendition.
The gateway is a translator between two systems using different communication protocols, data formats or languages, and even architectures that are quite different.
Rather than simply conveying the information, the gateway repacks the received information to accommodate the needs of the destination system.
At the same time, the gateway may also provide filtering and security functions.
Most gateways operate at the top-application layer of the OSI7 layer protocol.
The industrial gateway in the prior art has the advantages that the shell structure of the industrial gateway is simply placed when being fixed, is not stable enough, is not improved in the process of cooling and in the process of conducting induction distribution and arrangement, leads to messy wiring, is not well in induction arrangement, and is not detected in the environment around the industrial gateway for detecting the industrial equipment and in the temperature and humidity in the prior art, so that the service life of the industrial equipment and the problem of external damage cannot be treated, a power supply module cannot provide a relatively stable power supply, the industrial gateway is easily affected by information transmission, and an intelligent gateway for collecting and controlling an industrial MCU is designed to optimize the problem.
Disclosure of Invention
The invention mainly aims to provide an intelligent gateway for collecting and controlling an industrial MCU, the bottom and the top of the intelligent gateway adopt a semiconductor refrigeration component to enable the semiconductor refrigeration component to absorb heat rapidly and conduct heat away, an efficient cooling function is achieved, meanwhile, the bottom heat-absorbing board and the ground are kept at a certain distance by adopting a fixed frame component to facilitate heat dissipation, the circuit board is fixed by adopting a buffer cylinder supporting piece when the circuit board is fixed, the buffer cylinder supporting piece can play a certain buffering function on the circuit board when the mobile gateway is carried out, the problem that welding spots on the circuit board fall off is avoided, the problem that a cover body and a bottom bin are convenient to detach and clamp in a mode of adopting an adjusting clamping piece to be matched with a clamping groove component is solved, compared with the prior art, the intelligent gateway is convenient to mount by adopting a beam tube to centralize lines and go away from side beam line ports, the functions of arranging and sorting external wiring are achieved, the circuit board is detected by adopting a feedback module to connect a switch power module and a central control mode, the problem that voltage transmitted to the central control circuit board is prevented from being damaged by adopting a feedback module to a feedback module and the power supply module when the MCU is matched with a temperature and humidity monitoring module is carried out, the wireless monitoring device is prevented from being damaged by the wireless monitoring and the wireless monitoring equipment is increased, and the problem that the temperature and humidity can be prevented from being damaged by the wireless monitoring equipment is prevented from being carried out when the monitoring and the monitoring equipment is increased.
The aim of the invention can be achieved by adopting the following technical scheme:
the intelligent gateway for collecting and controlling the industrial MCU comprises a bottom bin, wherein a semiconductor refrigeration component is arranged in the bottom bin, the top of the semiconductor refrigeration component penetrates through the top of the bottom bin, and the bottom of the semiconductor refrigeration component penetrates through the bottom of the bottom bin;
the four corners of the top of the bottom bin are provided with buffer tube supporting pieces, the top of each buffer tube supporting piece is fixed with a circuit board through a screw, one side bottom of the bottom bin is integrally provided with an L-shaped side frame, the middle part of the inner side bottom of the L-shaped side frame is provided with a side wire binding opening, the inner side of the side wire binding opening is paved with a wire breaking preventing side rubber layer, the two sides of the inner side of the L-shaped side frame, which are close to the side wire binding opening, are provided with side buffer tube assemblies, and the end parts of the side buffer tube assemblies are fixed with wire binding tubes;
the outer side of the bottom bin is sleeved with a cover body, a plurality of groups of adjusting clamping pieces are arranged on two sides of the cover body, clamping groove components matched with the adjusting clamping pieces are arranged on two sides of the bottom bin, and fixing frame components are arranged at two corners of the bottom of the L-shaped side frame and two corners of the bottom bin;
the top of the circuit board is provided with a power supply module, a central control MCU module, a data storage module, a wireless module, a feedback module and a universal interface;
the central control MCU module is electrically connected with the power supply module, the data storage module, the wireless module and the feedback module, and the feedback module is electrically connected with the power supply module, and is electrically connected with the industrial equipment monitoring module through the universal interface;
the central control MCU module is used for acquiring data and processing and analyzing the data;
the power supply module is used for supplying power to the central control MCU module;
the data storage module is used for storing data;
the wireless module is used for wirelessly transmitting information and receiving information, and is connected with a 5G network through the wireless module, and the 5G network is connected with the mobile terminal;
and the feedback module is used for acquiring the voltage information output by the power supply module and feeding back the voltage information to the power supply module.
Preferably, the semiconductor refrigeration assembly comprises a semiconductor radiator, a top heat absorbing plate and a bottom heat radiating plate, the top of the bottom bin is provided with the top heat absorbing plate at equal intervals, the bottom of the bottom bin is provided with the bottom heat radiating plate at equal intervals, the semiconductor radiator is placed in the bottom bin, the refrigeration end of the semiconductor radiator penetrates through the bottom bin to be in contact with the top heat absorbing plate, and the heat radiation end of the semiconductor radiator penetrates through the bottom bin to be in contact with the bottom heat radiating plate.
Preferably, the buffer tube support piece comprises an outer fixed tube, a third buffer spring, a top buffer rod and internal threads, wherein the outer fixed tube is arranged at four corners of the top of the bottom bin, the third buffer spring is arranged at the inner bottom of the outer fixed tube, the top buffer rod is arranged at the top of the third buffer spring, the internal threads are arranged at the top of the top buffer rod, and the screw penetrates through four corners of the top of the circuit board to be meshed with the internal threads so as to fix the circuit board at the top of the top buffer rod.
Preferably, the adjusting clamping piece comprises a U-shaped clamping piece, a side penetrating square hole, a side placing groove, a horizontal elastic adjusting component and a vertical elastic adjusting component, wherein the side penetrating square hole is formed in two sides of the cover body and is close to the edge, the side placing groove is formed in the bottom and the inner top of the side penetrating square hole, the horizontal elastic adjusting component is mounted on the inner side of the side placing groove, the vertical elastic adjusting component is mounted at the end of the horizontal elastic adjusting component, and the U-shaped clamping piece is mounted at the bottom of the vertical elastic adjusting component.
Preferably, the card slot assembly comprises a slot and side slots, the slot is arranged at the edge parts of the two sides of the bottom bin, the side slots are arranged at the inner top of the slot and the inner bottom of the slot, and the end parts of the U-shaped card piece are mutually matched with the side slots.
Preferably, the horizontal elastic adjusting component comprises a second buffer spring, a first outer sliding cylinder and a first side fixing rod, the first side fixing rod is arranged on the inner side wall of the side placing groove, the first outer sliding cylinder is sleeved on the outer side of the first side fixing rod, the second buffer spring is arranged between the inner end part of the first outer sliding cylinder and the end part of the first side fixing rod, and the vertical elastic adjusting component is arranged at the end part of the first outer sliding cylinder;
the vertical elastic adjusting assembly comprises a fourth buffer spring, a second outer fixed cylinder and a second side fixed rod, the second side fixed rod is installed at the end part of the first outer sliding cylinder, the second outer fixed cylinder is sleeved outside the second side fixed rod, the fourth buffer spring is installed between the inner top of the second outer fixed cylinder and the top of the second side fixed rod, and a U-shaped clamping piece is installed at the top of the fourth buffer spring.
Preferably, the fixing frame assembly comprises a bottom supporting rod and a sucker, the bottom side end part of the L-shaped side frame and the bottom side end part of the bottom bin are both provided with the bottom supporting rod, and the sucker is arranged at the bottom of the bottom supporting rod;
the side type buffer tube assembly comprises a side hollow tube, a first buffer spring and an inner Fang Chagan, wherein the side hollow tube is arranged on the inner wall of the L-shaped side frame close to the two sides of the side wire harness opening, the first buffer springs are arranged at the inner end part of the side hollow tube at equal intervals, the inner Fang Chagan is sleeved on the inner side of the first buffer spring, the first buffer springs are fixed on the end part of the inner Fang Chagan and the inner end part of the side hollow tube, and the wire harness tube is arranged on the end part of the inner Fang Chagan.
Preferably, the power module comprises a rectifying and filtering input module, a switching power module, a voltage isolation module and a rectifying and filtering output module, wherein the output end of the rectifying and filtering input module is electrically connected with the switching power module, the output end of the switching power module is electrically connected with the voltage isolation module, the output end of the voltage isolation module is electrically connected with the rectifying and filtering output module, the rectifying and filtering output module is electrically connected with the central control MCU, and the feedback module is electrically connected with the switching power module.
Preferably, the wireless module comprises a UART interface circuit and a 5G module, the central control MCU is electrically connected with the UART interface circuit, the UART interface circuit is electrically connected with the 5G module, and the 5G module is connected with the 5G network;
the universal interface comprises an RS485 interface, a PLC module and a CAN module, wherein the central control MCU is electrically connected with the RS485 interface, the PLC module and the CAN module, and the RS485 interface, the PLC module and the CAN module are electrically connected with the industrial equipment monitoring module.
Preferably, the industrial equipment monitoring module comprises intelligent industrial equipment, a video monitoring module and a temperature and humidity monitoring module, the intelligent industrial equipment, the video monitoring module and the temperature and humidity monitoring module are electrically connected through a universal interface, and the acquired information of the intelligent industrial equipment, the video monitoring module and the temperature and humidity monitoring module is sent to the central control MCU.
The beneficial technical effects of the invention are as follows:
according to the intelligent gateway for collecting and controlling the industrial MCU, the bottom and the top of the semiconductor refrigeration component are respectively provided with the top heat absorbing plate and the bottom heat dissipating plate, so that the semiconductor refrigeration component can absorb heat rapidly and conduct heat away, the efficient cooling function is achieved, meanwhile, the bottom heat dissipating plate is matched with the fixed frame component to keep a certain distance from the ground for facilitating heat dissipation, the circuit board is fixed by the buffer cylinder supporting piece when the circuit board is fixed, the buffer cylinder supporting piece can play a certain role in buffering the circuit board when the mobile gateway is carried out, the problem that welding spots on the circuit board fall off is avoided, the cover body and the bottom bin are matched with the clamping groove component in a mode of adopting the adjusting clamping piece, the screw rod is convenient to detach and install in a fixed mode, the interfaces are arranged on two sides of the cover body, the line is bound in a concentrated mode and the line is discharged from the side beam line port, the finishing and sorting function of an external wiring is achieved, the voltage detection and feedback function for the circuit board is achieved by the aid of the buffer cylinder supporting piece when the circuit board is fixed, the buffer cylinder supporting piece can be used for detecting and feeding back the voltage transmitted to the circuit board, the problem that the temperature and humidity are prevented from being damaged by the wireless monitoring device is solved when the wireless monitoring equipment is connected through the wireless monitoring equipment, and the wireless monitoring equipment is prevented from being damaged by the wireless monitoring equipment.
Drawings
FIG. 1 is an exploded view of the overall architecture of a device of a preferred embodiment of an intelligent gateway for collecting and controlling industrial MCUs according to the present invention;
FIG. 2 is a schematic diagram of the overall architecture of a device according to a preferred embodiment of an intelligent gateway for collecting and controlling industrial MCUs according to the present invention;
FIG. 3 is an enlarged view of the structure at a of a preferred embodiment of an intelligent gateway for collecting and controlling industrial MCU according to the present invention;
FIG. 4 is an enlarged view of the structure at b of a preferred embodiment of an intelligent gateway for collecting and controlling industrial MCU according to the present invention;
FIG. 5 is a schematic diagram of a cover perspective of a preferred embodiment of an intelligent gateway for collecting and controlling industrial MCU according to the present invention;
FIG. 6 is a side cross-sectional view of a cover of a preferred embodiment of an intelligent gateway for collecting and controlling an industrial MCU according to the present invention;
FIG. 7 is an enlarged view of the structure at c of a preferred embodiment of an intelligent gateway for collecting and controlling industrial MCU according to the present invention;
fig. 8 is a system diagram of a preferred embodiment of an intelligent gateway for collecting and controlling an industrial MCU according to the present invention.
In the figure: the device comprises a 1-cover body, a 2-circuit board, a 3-L-shaped side frame, a 5-side through square hole, a 6-bottom bin, a 7-bottom supporting rod, an 8-sucker, a 9-side hollow pipe, a 10-inner Fang Chagan, an 11-wire harness pipe, a 12-bottom radiating plate, a 13-U-shaped clamping piece, a 14-slot, a 15-side wire harness opening, a 16-wire breakage preventing side rubber layer, a 17-first buffer spring, a 18-second buffer spring, a 19-top heat absorbing plate, a 20-top buffer rod, a 21-third buffer spring, a 22-outer fixed cylinder, a 23-semiconductor radiator, a 24-first side fixed rod, a 25-side slot, a 26-side placing groove, a 27-first outer sliding cylinder, a 28-second side fixed rod, a 29-second outer fixed cylinder and a 30-fourth buffer spring.
Detailed Description
In order to make the technical solution of the present invention more clear and obvious to those skilled in the art, the present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-8, the intelligent gateway for collecting and controlling an industrial MCU provided in this embodiment includes a bottom bin 6, a semiconductor refrigeration component is disposed in the bottom bin 6, the top of the semiconductor refrigeration component penetrates through the top of the bottom bin 6, and the bottom of the semiconductor refrigeration component penetrates through the bottom of the bottom bin 6;
the four corners of the top of the bottom bin 6 are provided with buffer tube supporting pieces, the top of each buffer tube supporting piece is fixed with a circuit board 2 through a screw, one side bottom of the bottom bin 6 is integrally formed with an L-shaped side frame 3, the middle part of the inner side bottom of the L-shaped side frame 3 is provided with a side wire binding opening 15, the inner side of the side wire binding opening 15 is paved with a wire breaking preventing side rubber layer 16, two sides of the inner side of the L-shaped side frame 3, which are close to the side wire binding opening 15, are provided with side buffer tube assemblies, and the end parts of the side buffer tube assemblies are fixed with wire binding tubes 11;
the cover body 1 is sleeved outside the bottom bin 6, a plurality of groups of adjusting clamping pieces are arranged on two sides of the cover body 1, clamping groove components matched with the adjusting clamping pieces are arranged on two sides of the bottom bin 6, and a placing fixing frame component is arranged at two corners of the bottom of the L-shaped side frame 3 and two corners of the bottom bin 6;
the top of the circuit board 2 is provided with a power supply module, a central control MCU module, a data storage module, a wireless module, a feedback module and a universal interface;
the central control MCU module is electrically connected with the power supply module, the data storage module, the wireless module and the feedback module, and the feedback module is electrically connected with the power supply module, and is electrically connected with the industrial equipment monitoring module through the universal interface;
the central control MCU module is used for acquiring data and processing and analyzing the data;
the power supply module is used for supplying power to the central control MCU module;
the data storage module is used for storing data;
the wireless module is used for wirelessly transmitting information and receiving information, and is connected with a 5G network through the wireless module, and the 5G network is connected with the mobile terminal;
and the feedback module is used for acquiring the voltage information output by the power supply module and feeding back the voltage information to the power supply module.
General principle of operation: the invention adopts the semiconductor refrigeration assembly, the bottom and the top of which adopt the top heat absorbing plate 19 and the bottom heat radiating plate 12 to enable the semiconductor refrigeration assembly to absorb heat rapidly and conduct heat away, thereby realizing the efficient cooling function, and simultaneously, the bottom heat radiating plate 12 and the placing ground are kept at a certain distance to facilitate heat dissipation by adopting the placing fixing frame assembly, the circuit board 2 is fixed by adopting the buffer cylinder supporting piece when the circuit board 2 is fixed, the buffer cylinder supporting piece can play a certain buffering function on the circuit board 2 when the mobile gateway is carried out in the mode, the problem that welding spots on the circuit board 2 fall off is avoided, the cover body 1 and the bottom bin 6 are conveniently detached and clamped by adopting the mode of matching the adjusting clamping piece with the clamping groove assembly, compared with the prior art, the screw fixing is more convenient and more detached and installed by adopting the line tube 11 at two sides of the cover body 1, the line centralizing and going away from the side line port 15, the finishing and sorting function of external wiring are realized, the mode of connecting the switch power module and the central control MCU by adopting the feedback module, the function of detecting and feeding back the voltage to the MCU is realized, the problem that the voltage transmitted to the central control MCU is matched with the switch and the switch is matched with the voltage and the MCU is prevented from being damaged when the wireless monitoring equipment is opened, and the wireless monitoring equipment is prevented from being damaged by the wireless monitoring equipment.
In this embodiment, the semiconductor refrigeration assembly includes a semiconductor radiator 23, a top heat absorbing plate 19 and a bottom heat dissipating plate 12, the top of the bottom bin 6 is provided with the top heat absorbing plate 19 at equal intervals, the bottom of the bottom bin 6 is provided with the bottom heat dissipating plate 12 at equal intervals, the semiconductor radiator 23 is placed in the bottom bin 6, and the refrigeration end of the semiconductor radiator 23 penetrates through the bottom bin 6 to contact with the top heat absorbing plate 19, and the heat release end of the semiconductor radiator 23 penetrates through the bottom bin 6 to contact with the bottom heat dissipating plate 12.
In this embodiment, the buffer tube support includes an outer fixing tube 22, a third buffer spring 21, a top buffer rod 20 and internal threads, the outer fixing tube 22 is installed at four corners of the top of the bottom bin 6, the third buffer spring 21 is installed at the inner bottom of the outer fixing tube 22, the top buffer rod 20 is installed at the top of the third buffer spring 21, the top of the top buffer rod 20 is provided with the internal threads, and the circuit board 2 is fixed at the top of the top buffer rod 20 by engaging the internal threads with the four corners of the top of the circuit board 2 through the screw rod.
In this embodiment, the adjusting clamp includes U type fastener 13, side run through square hole 5, side standing groove 26, horizontal elasticity adjusting part and perpendicular elasticity adjusting part, side run through square hole 5 and offer in lid 1 both sides and be close to limit portion department, side standing groove 26 has all been offered to side bottom and interior top in the side run through square hole 5, horizontal elasticity adjusting part is installed to the inboard of side standing groove 26, perpendicular elasticity adjusting part is installed to the tip of horizontal elasticity adjusting part, U type fastener 13 is installed to the bottom of perpendicular elasticity adjusting part.
In this embodiment, the card slot assembly includes a slot 14 and a side slot 25, the slot 14 is formed at the side portions of two sides of the bottom bin 6, the side slot 25 is formed at the inner top of the slot 14 and the inner bottom of the slot 14, and the end portion of the u-shaped card 13 is matched with the side slot 25.
In this embodiment, the horizontal elastic adjustment assembly includes a second buffer spring 18, a first outer sliding cylinder 27 and a first side fixing rod 24, the first side fixing rod 24 is installed on the inner side wall of the side placing groove 26, the first outer sliding cylinder 27 is sleeved on the outer side of the first side fixing rod 24, the second buffer spring 18 is installed between the inner end of the first outer sliding cylinder 27 and the end of the first side fixing rod 24, and the vertical elastic adjustment assembly is installed on the end of the first outer sliding cylinder 27;
the vertical elastic adjusting component comprises a fourth buffer spring 30, a second outer fixed cylinder 29 and a second side fixed rod 28, the second side fixed rod 28 is installed at the end part of the first outer sliding cylinder 27, the second outer fixed cylinder 29 is sleeved outside the second side fixed rod 28, the fourth buffer spring 30 is installed between the inner top part of the second outer fixed cylinder 29 and the top part of the second side fixed rod 28, and the U-shaped clamping piece 13 is installed at the top part of the fourth buffer spring 30.
In the embodiment, the placing fixing frame component comprises a bottom supporting rod 7 and a sucker 8, wherein the bottom supporting rod 7 is arranged at the bottom end part of the L-shaped side frame 3 and the bottom end part of the bottom bin 6, and the sucker 8 is arranged at the bottom of the bottom supporting rod 7;
the side type buffer tube assembly comprises a side hollow tube 9, a first buffer spring 17 and an inner inserting rod 10, wherein the side hollow tube 9 is installed on two sides, close to a wire bundling opening 15, of the inner wall of the L-shaped side frame 3, the first buffer springs 17 are installed at equal intervals on the inner end part of the side hollow tube 9, an inner Fang Chagan is sleeved on the inner side of the first buffer spring 17, the first buffer spring 17 is fixed on the end part of the inner inserting rod 10 and the inner end part of the side hollow tube 9, and the wire bundling tube 11 is installed on the end part of the inner inserting rod 10.
In this embodiment, the power module includes a rectifying and filtering input module, a switching power module, a voltage isolation module and a rectifying and filtering output module, where the output end of the rectifying and filtering input module is electrically connected to the switching power module, the output end of the switching power module is electrically connected to the voltage isolation module, the output end of the voltage isolation module is electrically connected to the rectifying and filtering output module, the rectifying and filtering output module is electrically connected to a central control MCU, the feedback module is electrically connected to the switching power module, the wireless module includes a UART interface circuit and a 5G module, the central control MCU is electrically connected to the UART interface circuit, the UART interface circuit is electrically connected to the 5G module, and the 5G module is connected to a 5G network;
the universal interface comprises an RS485 interface, a PLC module and a CAN module, wherein the central control MCU is electrically connected with the RS485 interface, the PLC module and the CAN module, and the RS485 interface, the PLC module and the CAN module are electrically connected with the industrial equipment monitoring module.
The industrial equipment monitoring module comprises intelligent industrial equipment, a video monitoring module and a temperature and humidity monitoring module, is electrically connected with the intelligent industrial equipment, the video monitoring module and the temperature and humidity monitoring module through a universal interface, and transmits the acquired information of the intelligent industrial equipment, the video monitoring module and the temperature and humidity monitoring module to the central control MCU.
The mode that the feedback module is connected with the switching power supply module and the central control MCU is adopted, the function of detecting and feeding back the voltage transmitted to the central control MCU is achieved, the voltage isolation module is adaptively adjusted and added in cooperation with the switching power supply module to avoid interference, the camera monitoring and the temperature and humidity monitoring are added when industrial equipment is monitored, the problem of external damage of the industrial equipment and a proper running environment are avoided, and data of the industrial equipment are transmitted through the wireless module and can be monitored by opening the mobile terminal.
The above description is merely a further embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art will be able to apply equivalents and modifications according to the technical solution and the concept of the present invention within the scope of the present invention disclosed in the present invention.
Claims (10)
1. An intelligent gateway for collecting and controlling industrial MCU, which is characterized in that: the semiconductor refrigerating assembly is arranged in the bottom bin (6), the top of the semiconductor refrigerating assembly penetrates through the top of the bottom bin (6), and the bottom of the semiconductor refrigerating assembly penetrates through the bottom of the bottom bin (6);
the four corners of the top of the bottom bin (6) are provided with buffer tube supporting pieces, the top of each buffer tube supporting piece is fixedly provided with a circuit board (2) through a screw rod, one side bottom of the bottom bin (6) is integrally provided with an L-shaped side frame (3), the middle part of the inner side of the L-shaped side frame (3) is provided with a side wire harness port (15), the inner side of the side wire harness port (15) is paved with a wire breakage preventing side rubber layer (16), the two sides of the inner side of the L-shaped side frame (3) close to the side wire harness port (15) are provided with side type buffer tube components, and the end part of each side type buffer tube component is fixedly provided with a wire harness tube (11);
the cover body (1) is sleeved outside the bottom bin (6), a plurality of groups of adjusting clamping pieces are arranged on two sides of the cover body (1), clamping groove components matched with the adjusting clamping pieces are arranged on two sides of the bottom bin (6), and a holding fixing frame component is arranged at two corners of the bottom of the L-shaped side frame (3) and two corners of the bottom bin (6);
the top of the circuit board (2) is provided with a power supply module, a central control MCU module, a data storage module, a wireless module, a feedback module and a universal interface;
the central control MCU module is electrically connected with the power supply module, the data storage module, the wireless module and the feedback module, and the feedback module is electrically connected with the power supply module, and is electrically connected with the industrial equipment monitoring module through the universal interface;
the central control MCU module is used for acquiring data and processing and analyzing the data;
the power supply module is used for supplying power to the central control MCU module;
the data storage module is used for storing data;
the wireless module is used for wirelessly transmitting information and receiving information, and is connected with a 5G network through the wireless module, and the 5G network is connected with the mobile terminal;
and the feedback module is used for acquiring the voltage information output by the power supply module and feeding back the voltage information to the power supply module.
2. The intelligent gateway for collecting and controlling an industrial MCU of claim 1, wherein: the semiconductor refrigeration assembly comprises a semiconductor radiator (23), a top heat absorption plate (19) and a bottom heat dissipation plate (12), wherein the top of a bottom bin (6) is provided with the top heat absorption plate (19) at equal intervals, the bottom of the bottom bin (6) is provided with the bottom heat dissipation plate (12) at equal intervals, the semiconductor radiator (23) is placed in the bottom bin (6), the refrigeration end of the semiconductor radiator (23) penetrates through the bottom bin (6) to be in contact with the top heat absorption plate (19), and the heat dissipation end of the semiconductor radiator (23) penetrates through the bottom bin (6) to be in contact with the bottom heat dissipation plate (12).
3. An intelligent gateway for collecting and controlling an industrial MCU according to claim 2, wherein: the buffer tube support piece comprises an outer fixed tube (22), a third buffer spring (21), a top buffer rod (20) and internal threads, wherein the outer fixed tube (22) is installed at four corners of the top of the bottom bin (6), the third buffer spring (21) is installed at the inner bottom of the outer fixed tube (22), the top buffer rod (20) is installed at the top of the third buffer spring (21), the internal threads are arranged at the top of the top buffer rod (20), and the circuit board (2) is fixed at the top of the top buffer rod (20) through engagement of the screw rod with the internal threads at four corners of the top of the circuit board (2).
4. An intelligent gateway for collecting and controlling an industrial MCU according to claim 3, wherein: the adjusting clamping piece comprises a U-shaped clamping piece (13), a side penetrating square hole (5), a side placing groove (26), a horizontal elastic adjusting component and a vertical elastic adjusting component, wherein the side penetrating square hole (5) is formed in two sides of the cover body (1) and is close to the edge, the side placing groove (26) is formed in the inner bottom and the inner top of the side penetrating square hole (5), the horizontal elastic adjusting component is arranged on the inner side of the side placing groove (26), the vertical elastic adjusting component is arranged at the end of the horizontal elastic adjusting component, and the U-shaped clamping piece (13) is arranged at the bottom of the vertical elastic adjusting component.
5. The intelligent gateway for collecting and controlling an industrial MCU of claim 4, wherein: the clamping groove assembly comprises a slot (14) and side slots (25), the slot (14) is arranged at the edge parts of the two sides of the bottom bin (6), the side slots (25) are arranged at the inner top of the slot (14) and the inner bottom of the slot (14), and the end parts of the U-shaped clamping pieces (13) are matched with the side slots (25).
6. The intelligent gateway for collecting and controlling an industrial MCU of claim 5, wherein: the horizontal elastic adjusting assembly comprises a second buffer spring (18), a first outer sliding cylinder (27) and a first side fixing rod (24), the first side fixing rod (24) is arranged on the inner side wall of the side placing groove (26), the first outer sliding cylinder (27) is sleeved on the outer side of the first side fixing rod (24), the second buffer spring (18) is arranged between the inner end part of the first outer sliding cylinder (27) and the end part of the first side fixing rod (24), and the vertical elastic adjusting assembly is arranged at the end part of the first outer sliding cylinder (27);
the vertical elastic adjusting assembly comprises a fourth buffer spring (30), a second outer fixed cylinder (29) and a second side fixed rod (28), the second side fixed rod (28) is installed at the end part of the first outer sliding cylinder (27), the second outer fixed cylinder (29) is sleeved outside the second side fixed rod (28), the fourth buffer spring (30) is installed between the inner top part of the second outer fixed cylinder (29) and the top part of the second side fixed rod (28), and the U-shaped clamping piece (13) is installed at the top part of the fourth buffer spring (30).
7. The intelligent gateway for collecting and controlling an industrial MCU of claim 6, wherein: the fixing frame assembly comprises a bottom supporting rod (7) and a sucker (8), the bottom side end part of the L-shaped side frame (3) and the bottom side end part of the bottom bin (6) are both provided with the bottom supporting rod (7), and the sucker (8) is arranged at the bottom of the bottom supporting rod (7);
the side type buffer tube assembly comprises a side hollow tube (9), a first buffer spring (17) and an inner side Fang Chagan (10), wherein the side hollow tube (9) is arranged on two sides, close to a wire harness opening (15), of the inner wall of the L-shaped side frame (3), the first buffer spring (17) is arranged at the inner end part of the side hollow tube (9) at equal intervals, the inner side of the first buffer spring (17) is sleeved with the inner side Fang Chagan (10), the first buffer spring (17) is fixed to the end part of the inner Fang Chagan (10) and the inner end part of the side hollow tube (9), and the wire harness tube (11) is arranged at the end part of the inner Fang Chagan (10).
8. The intelligent gateway for collecting and controlling an industrial MCU of claim 1, wherein: the power module comprises a rectifying and filtering input module, a switching power module, a voltage isolation module and a rectifying and filtering output module, wherein the output end of the rectifying and filtering input module is electrically connected with the switching power module, the output end of the switching power module is electrically connected with the voltage isolation module, the output end of the voltage isolation module is electrically connected with the rectifying and filtering output module, the rectifying and filtering output module is electrically connected with the central control MCU, and the feedback module is electrically connected with the switching power module.
9. The intelligent gateway for collecting and controlling an industrial MCU of claim 8, wherein: the wireless module comprises a UART interface circuit and a 5G module, the central control MCU is electrically connected with the UART interface circuit, the UART interface circuit is electrically connected with the 5G module, and the 5G module is connected with a 5G network;
the universal interface comprises an RS485 interface, a PLC module and a CAN module, wherein the central control MCU is electrically connected with the RS485 interface, the PLC module and the CAN module, and the RS485 interface, the PLC module and the CAN module are electrically connected with the industrial equipment monitoring module.
10. The intelligent gateway for collecting and controlling an industrial MCU of claim 9, wherein: the industrial equipment monitoring module comprises intelligent industrial equipment, a video monitoring module and a temperature and humidity monitoring module, is electrically connected with the intelligent industrial equipment, the video monitoring module and the temperature and humidity monitoring module through a universal interface, and transmits the acquired information of the intelligent industrial equipment, the video monitoring module and the temperature and humidity monitoring module to the central control MCU.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111108571.3A CN113759796B (en) | 2021-09-22 | 2021-09-22 | Intelligent gateway for collecting and controlling industrial MCU |
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| CN202111108571.3A CN113759796B (en) | 2021-09-22 | 2021-09-22 | Intelligent gateway for collecting and controlling industrial MCU |
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| CN113759796B true CN113759796B (en) | 2024-04-09 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018039958A1 (en) * | 2016-08-31 | 2018-03-08 | 刘哲 | Smart safety system for operation of elevator on basis of internet of things |
| CN209299288U (en) * | 2018-11-30 | 2019-08-23 | 辉统信息科技(常州)有限公司 | Industry internet intelligent gateway device |
| CN212258990U (en) * | 2020-06-17 | 2020-12-29 | 贵州泰永长征技术股份有限公司 | Intelligent gateway circuit for intelligent terminal power distribution system |
-
2021
- 2021-09-22 CN CN202111108571.3A patent/CN113759796B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018039958A1 (en) * | 2016-08-31 | 2018-03-08 | 刘哲 | Smart safety system for operation of elevator on basis of internet of things |
| CN209299288U (en) * | 2018-11-30 | 2019-08-23 | 辉统信息科技(常州)有限公司 | Industry internet intelligent gateway device |
| CN212258990U (en) * | 2020-06-17 | 2020-12-29 | 贵州泰永长征技术股份有限公司 | Intelligent gateway circuit for intelligent terminal power distribution system |
Non-Patent Citations (1)
| Title |
|---|
| 工业无线测控网络智能节点;程健;朱健;徐亭;;计算机系统应用;20131215(12);全文 * |
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