CN113755110B - UV anti-adhesive film and preparation method and application thereof - Google Patents
UV anti-adhesive film and preparation method and application thereof Download PDFInfo
- Publication number
- CN113755110B CN113755110B CN202111031934.8A CN202111031934A CN113755110B CN 113755110 B CN113755110 B CN 113755110B CN 202111031934 A CN202111031934 A CN 202111031934A CN 113755110 B CN113755110 B CN 113755110B
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive film
- adhesive
- parts
- film according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000181 anti-adherent effect Effects 0.000 title claims abstract description 140
- 239000002313 adhesive film Substances 0.000 title claims abstract description 105
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 113
- 239000000203 mixture Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000012790 adhesive layer Substances 0.000 claims abstract description 37
- 239000002216 antistatic agent Substances 0.000 claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 32
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 23
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 22
- 239000004814 polyurethane Substances 0.000 claims abstract description 20
- 229920002635 polyurethane Polymers 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 238000013329 compounding Methods 0.000 claims abstract description 9
- 239000003999 initiator Substances 0.000 claims abstract description 8
- 239000011247 coating layer Substances 0.000 claims abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 30
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 239000013638 trimer Substances 0.000 claims description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 10
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 4
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 4
- HNWNELAGDBSCDG-UHFFFAOYSA-O 2-hydroxyethyl-dimethyl-[3-(octadecanoylamino)propyl]azanium;nitrate Chemical compound [O-][N+]([O-])=O.CCCCCCCCCCCCCCCCCC(=O)NCCC[N+](C)(C)CCO HNWNELAGDBSCDG-UHFFFAOYSA-O 0.000 claims description 2
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- RYYWUUFWQRZTIU-UHFFFAOYSA-K thiophosphate Chemical compound [O-]P([O-])([O-])=S RYYWUUFWQRZTIU-UHFFFAOYSA-K 0.000 claims description 2
- AEXDMFVPDVVSQJ-UHFFFAOYSA-N trifluoro(trifluoromethylsulfonyl)methane Chemical group FC(F)(F)S(=O)(=O)C(F)(F)F AEXDMFVPDVVSQJ-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 10
- 239000002994 raw material Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000007689 inspection Methods 0.000 description 6
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- -1 2-hydroxy-methyl phenyl Chemical group 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YIEDHPBKGZGLIK-UHFFFAOYSA-L tetrakis(hydroxymethyl)phosphanium;sulfate Chemical compound [O-]S([O-])(=O)=O.OC[P+](CO)(CO)CO.OC[P+](CO)(CO)CO YIEDHPBKGZGLIK-UHFFFAOYSA-L 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- DQYBDCGIPTYXML-UHFFFAOYSA-N ethoxyethane;hydrate Chemical compound O.CCOCC DQYBDCGIPTYXML-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2327/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a UV anti-adhesive film, a preparation method and application thereof. The UV anti-adhesive film comprises a bottom coating layer, a substrate layer, an anti-adhesive layer and a release film layer which are sequentially overlapped; the anti-adhesive layer is made of a UV anti-adhesive composition; the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.9 to 2.8 parts of curing agent, 2 to 5 parts of antistatic agent and 0.9 to 2.5 parts of initiator. Firstly, coating waterborne polyurethane on one side of a substrate layer, and drying to obtain a prime coat and the substrate layer which are attached to each other; then coating the UV anti-adhesion composition on any side of the release film layer, and drying to obtain an anti-adhesion layer and the release film layer which are attached to each other; and finally, compounding the anti-adhesive layer at the side far away from the release film layer with the substrate layer at the side far away from the bottom coating layer, and curing to obtain the UV anti-adhesive film. The UV anti-adhesive film provided by the invention has lower haze, higher transparency and better antistatic property.
Description
Technical Field
The invention belongs to the technical field of mucosa reduction, and particularly relates to a UV (ultraviolet) anti-adhesive film and a preparation method and application thereof.
Background
The Micro LED display technology is a display technology in which self-luminous Micro LEDs are used as light-emitting pixel units, and the light-emitting pixel units are assembled on a driving panel to form a high-density LED array. Due to the characteristics of small size, high integration level, self-luminescence and the like of the micro LED chip, the micro LED chip has larger advantages in the aspects of brightness, resolution, contrast ratio, energy consumption, service life, response speed, thermal stability and the like compared with the LCD and the OLED in the aspect of display. In the production process of the LED chip, the LED chip is usually fixed by using a UV anti-adhesive film, so that the phenomenon that the LED chip moves in a cutting process and the production efficiency and the yield are affected is avoided. With the development of technology, the chips are subjected to AOI (automatic optical inspection) inspection after being cut. With the reduction of the size of the LED chip, if the haze of the UV anti-adhesive film is larger, the equipment identification is not facilitated; if the antistatic property of the UV anti-adhesive film is poor, the electric performance of the chip can be damaged, and the production efficiency and the yield are affected. Therefore, the performance of the UV anti-adhesive film has an important influence on the production of the LED chip.
CN111234719a discloses a UV-transmucosal film. The UV anti-sticking film comprises a substrate layer, a UV anti-sticking layer and a release layer which are sequentially arranged, and the substrate layer is a modified PET film; the UV anti-adhesive layer is made of a UV anti-adhesive composition, wherein the UV anti-adhesive composition comprises the following components in parts by weight: 50-60 parts of acrylic emulsion, 12-18 parts of photosensitive resin, 0.7-1 part of ethylenediamine, 0.5-2 parts of photoinitiator and 25-60 parts of solvent; the release layer is a PET release film. According to the technical scheme, the modified PET film is used as a base material, the special acrylic emulsion is used as a matrix substance of the UV adhesive composition, and the obtained UV adhesive-reducing film has excellent adhesive force, heat resistance and water resistance before UV irradiation, is easy to peel after UV irradiation, but has poor antistatic effect, and is not suitable for preparation of micro LED chips.
CN111057474a discloses an adhesive for UV-transmucosal reduction and UV-transmucosal reduction thereof. The adhesive is prepared from the following raw materials in parts by mass: 30-60 parts of acrylate resin, 8-12 parts of tackifying resin, 5-10 parts of polyfunctional monomer, 0.5-3 parts of antistatic agent, 2-3 parts of photoinitiator, 1.5-4 parts of curing agent and 25-50 parts of solvent; the antistatic agent is one or a combination of zinc oxide and tin oxide. The UV anti-adhesion film comprises an antistatic layer formed by a high-molecular conductive polymer, a polyester film layer, an antistatic adhesive layer formed by an adhesive and a release film layer which are sequentially arranged. The UV anti-adhesive film prepared by the technical scheme has good antistatic property, but an antistatic layer is required to be additionally arranged, so that the structure of the UV anti-adhesive film is complex, and the antistatic agent is difficult to uniformly disperse in the adhesive, so that the antistatic effect of the adhesive layer is poor.
CN108300336a discloses a UV-reducing composition, a UV-reducing film and a method for preparing the same. The UV viscosity reducing composition is mainly prepared from the following raw materials in percentage by weight: 20-50% of high-temperature-resistant acrylate pressure-sensitive adhesive resin, 1-30% of multifunctional oligomer and/or multifunctional monomer, 0.3-2% of cross-linking agent, 0.1-5% of antistatic agent, 0-2% of dispersing agent, 0.2-2% of leveling agent, 0.5-5% of photoinitiator and 25-60% of solvent; the antistatic agent comprises one or more of an organic antistatic agent, an inorganic filler type antistatic agent and a composite type antistatic agent, wherein the inorganic filler type antistatic agent comprises one or more of nano graphite powder, nano graphene, carbon nano tubes and nano silver wires. The anti-sticking film comprises a substrate layer, a UV anti-sticking layer and a release film layer, wherein the UV anti-sticking layer is coated on the substrate layer; the substrate layer comprises any one of an antistatic PET film, an antistatic PO film and an antistatic PVC film. In the technical proposal, the inorganic filler antistatic agent has poor dispersion effect in the UV anti-adhesion composition, which leads to poor antistatic effect of the UV anti-adhesion layer and is not suitable for the production and the use of LED chips, and if the PVC film is selected as the substrate layer, the PVC substrate is good for rolling due to a specific rolling process, the white film has higher haze, and the automatic inspection of the AOI is not good.
Therefore, how to prepare a UV anti-adhesive film with low haze, high transparency and good antistatic property, so that the UV anti-adhesive film is suitable for the production of micro LED chips and the automatic inspection of AOI has become a technical problem to be solved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a UV anti-adhesive film and a preparation method and application thereof. According to the invention, through the design of the UV anti-adhesive film structure and the raw material components of the anti-adhesive layer, the design of the bottom coating and the use of specific antistatic agents, the prepared UV anti-adhesive film has lower haze, higher transparency and better antistatic property.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a UV (ultraviolet) anti-adhesive film, which comprises a bottom coating layer, a substrate layer, an anti-adhesive layer and a release film layer which are sequentially overlapped;
the anti-adhesive layer is made of a UV anti-adhesive composition;
the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.9 to 2.8 parts of curing agent, 2 to 5 parts of antistatic agent and 0.9 to 2.5 parts of initiator;
the antistatic agent is selected from any one or a combination of at least two of stearamidopropyl dimethyl-beta-hydroxyethyl ammonium nitrate, 1-ethyl-3-methylimidazole bis (trifluoromethyl) sulfonyl imide salt, bis (trifluoromethyl) sulfonyl imide lithium or tetra (hydroxymethyl) phosphorus sulfate.
According to the invention, through the design of the UV anti-adhesive film structure and the design of the bottom coating, the prepared UV anti-adhesive film has lower haze and higher transparency, is suitable for preparing the UV anti-adhesive film in the micro LED chip, and is convenient for automatic inspection of AOI.
According to the invention, through designing the UV anti-adhesive composition, the specific antistatic agent is further used, the content of the antistatic agent is controlled within a specific range, and the prepared UV anti-adhesive film has good antistatic property and high transparency. If the content of the antistatic agent is too small, the antistatic property of the UV anti-adhesive film is poor; if the content of the antistatic agent is too much, the production cost is increased, precipitation of the antistatic agent is possibly caused, white fog appears after the UV irradiation of the UV anti-adhesive film, the transparency of the prepared UV anti-adhesive film is poor, automatic inspection of AOI is not facilitated, and the ultraviolet anti-adhesive film is not suitable for production and preparation of micro LED chips.
In the present invention, the curing agent may be 0.9 part, 1.2 parts, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, or the like by weight.
The antistatic agent may be 2 parts, 2.2 parts, 2.5 parts, 2.7 parts, 3 parts, 3.3 parts, 3.6 parts, 2.9 parts, 4.2 parts, 4.5 parts, 4.7 parts, 5 parts, etc.
The initiator may be 0.9 parts, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, etc.
The following is a preferred technical scheme of the present invention, but not a limitation of the technical scheme provided by the present invention, and the following preferred technical scheme can better achieve and achieve the objects and advantages of the present invention.
In a preferred embodiment of the present invention, the thickness of the undercoat layer is 1 to 4. Mu.m, for example, 1. Mu.m, 1.2. Mu.m, 1.5. Mu.m, 2. Mu.m, 2.3. Mu.m, 2.5. Mu.m, 2.7. Mu.m, 3. Mu.m, 3.2. Mu.m, 3.5. Mu.m, 3.7. Mu.m, 4. Mu.m, or the like.
According to the invention, the thickness of the bottom coating is controlled within a specific range, so that the prepared UV anti-adhesive film has lower haze and higher transparency, and the waste of raw materials is avoided. If the thickness of the bottom coating is too small, the prepared UV anti-adhesive film has higher haze and poorer transparency; if the thickness of the bottom coating is too large, the prepared UV anti-adhesive film has higher transparency and lower haze, but the raw materials are wasted, the production cost is increased, and the actual production of the UV anti-adhesive film is not facilitated.
Preferably, the primer layer is made of polyurethane.
The primer layer is prepared by applying aqueous polyurethane to the substrate layer, and the aqueous polyurethane may be diluted with a solvent for ease of application. The solvent for diluting the aqueous polyurethane in the present invention is not particularly limited, and exemplary solvents include, but are not limited to: any one or a combination of at least two of isopropanol, water or dipropylene glycol butyl ether.
Preferably, the weight average molecular weight of the aqueous polyurethane is 3 ten thousand to 5 ten thousand, for example, 3 ten thousand, 3.2 ten thousand, 3.4 ten thousand, 3.6 ten thousand, 3.8 ten thousand, 4 ten thousand, 4.2 ten thousand, 4.4 ten thousand, 4.6 ten thousand, 4.8 ten thousand or 5 ten thousand, etc.
Preferably, the aqueous polyurethane has a viscosity of < 100cps, for example, 20cps, 30cps, 40cps, 50cps, 60cps, 70cps, 80cps, 90cps, 95cps, or the like.
Preferably, the solid content of the aqueous polyurethane is 25% to 35%, for example, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34% or 35% or the like.
In a preferred embodiment of the present invention, the thickness of the base material layer is 50 to 100. Mu.m, for example, 50. Mu.m, 55. Mu.m, 60. Mu.m, 65. Mu.m, 70. Mu.m, 75. Mu.m, 80. Mu.m, 85. Mu.m, 90. Mu.m, 95. Mu.m, 100. Mu.m, or the like.
Preferably, the substrate layer is a PVC substrate layer.
The LED chip production can undergo the working procedures of cutting, film pouring, film expanding and the like, and PVC has good expansibility, so that the PVC substrate layer is selected to prepare the UV anti-adhesive film, the implementation of the film expanding working procedure in the Micro LED chip production is facilitated, the expansibility of other materials (such as PET) is poor, the prepared UV anti-adhesive film cannot realize the film expanding working procedure in the Micro LED chip production, and further the production and preparation of the Micro LED chip cannot be realized.
In the invention, the UV anti-adhesive film prepared by combining the design of the formula of the UV anti-adhesive resin and the selection of the type of the antistatic agent with the PVC base material has better antistatic property. The preparation process of the UV anti-adhesive film comprises the following steps: and compounding and curing the anti-adhesive layer and the substrate layer, wherein a plasticizer contained in the PVC base layer is separated out and enters the anti-adhesive layer in the compounding and curing process, and the plasticizer contacts with an antistatic agent in the anti-adhesive layer, so that the antistatic property of the finally prepared UV anti-adhesive film can be reduced. In the application, the influence of the plasticizer contained in the PVC base layer on the antistatic agent is avoided by selecting the specific antistatic agent, so that the prepared UV anti-adhesive film has better antistatic property.
As a preferable embodiment of the present invention, the thickness of the anti-adhesive layer is 5 to 60. Mu.m, for example, 5. Mu.m, 15. Mu.m, 20. Mu.m, 25. Mu.m, 30. Mu.m, 35. Mu.m, 40. Mu.m, 45. Mu.m, 50. Mu.m, 55. Mu.m, 60. Mu.m, etc.
The solid content of the acrylic resin is preferably 30% to 40%, and may be, for example, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39% or 40%.
Preferably, the viscosity of the acrylic resin is 500 to 1800cps, for example, 500cps, 600cps, 700cps, 800cps, 900cps, 1000cps, 1100cps, 1200cps, 1300cps, 1400cps, 1500cps, 1600cps, 1700cps, 1800cps, etc.
Preferably, the weight average molecular weight of the acrylic resin is 50 to 60 ten thousand, for example, 50 ten thousand, 51 ten thousand, 52 ten thousand, 53 ten thousand, 54 ten thousand, 55 ten thousand, 56 ten thousand, 57 ten thousand, 58 ten thousand, 59 ten thousand or 60 ten thousand, etc.
Preferably, the glass transition temperature of the acrylic resin is-40 to-30 ℃, and may be, for example, -40 ℃, -39 ℃, -38 ℃, -37 ℃, -36 ℃, -35 ℃, -34 ℃, -33 ℃, -32 ℃, -31 ℃ or-30 ℃, etc.
As a preferred embodiment of the present invention, the curing agent is selected from any one or a combination of at least two of triphenylmethane triisocyanate, hexamethylene diisocyanate trimer, toluene diisocyanate trimer, isophorone diisocyanate trimer, or tris (4-phenylisocyanate) thiophosphate;
preferably, the initiator is selected from any one or a combination of at least two of 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-methyl phenyl propane-1-ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, benzoin dimethyl ether, benzophenone, 2-isopropylthioxanthone or 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide.
As a preferred embodiment of the present invention, the UV-reducing adhesive composition further comprises a solvent.
Preferably, the solvent is selected from any one or a combination of at least two of ethyl acetate, toluene or methyl ethyl ketone.
Preferably, the UV-reducing adhesive composition is prepared by a method comprising the steps of:
and uniformly mixing acrylic resin, a curing agent, an antistatic agent, an initiator and an optional solvent to obtain the UV glue reducing composition.
Preferably, the UV-curable adhesive composition has a solids content of 20% to 25%, for example 20%, 21%, 22%, 23%, 24% or 25% or the like.
In a preferred embodiment of the present invention, the thickness of the release film layer is 12 to 75. Mu.m, for example, 12 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, or the like.
Preferably, the release film layer is a PET single-silicon release film layer.
Preferably, the release force of the PET single-silicon release film is 10-30 g/25mm, and can be 10g/25mm, 12g/25mm, 14g/25mm, 16g/25mm, 18g/25mm, 20g/25mm, 22g/25mm, 24g/25mm, 26g/25mm, 28g/25mm, 30g/25mm or the like.
In a second aspect, the present invention provides a method for preparing the UV anti-adhesive film according to the first aspect, the method comprising the steps of:
(1) Coating waterborne polyurethane on one side of a substrate layer, and drying to obtain a prime coat and the substrate layer which are attached to each other;
(2) Coating the UV anti-adhesion composition on any side of the release film layer, and drying to obtain an anti-adhesion layer and the release film layer which are attached to each other;
(3) And compounding the anti-adhesive layer at one side far away from the release film layer with the substrate layer at one side far away from the base coat layer, and curing to obtain the UV anti-adhesive film.
When the substrate layer is a PVC substrate layer, that is, the substrate layer is made of a PVC film, and the aqueous polyurethane is coated on one side of the PVC film where the matte is.
As a preferred embodiment of the present invention, the drying temperature in the step (1) is 50 to 80℃and may be, for example, 50℃52℃55℃57℃60℃63℃66℃68℃70℃72℃75℃78℃80 ℃.
Preferably, the drying time in the step (1) is 1 to 4min, for example, 1min, 1.5min, 2min, 2.5min, 3min, 3.5min or 4min, etc.
Preferably, the drying temperature in the step (2) is 60 to 100 ℃, and may be 60 ℃, 62 ℃, 66 ℃, 70 ℃, 72 ℃, 75 ℃, 78 ℃, 80 ℃, 83 ℃, 85 ℃, 88 ℃, 90 ℃, 94 ℃, 97 ℃, 100 ℃, or the like, for example.
Preferably, the drying time in the step (2) is 1 to 4min, for example, 1min, 1.5min, 2min, 2.5min, 3min, 3.5min or 4min, etc.
Preferably, the curing temperature in the step (3) is 40 to 60℃and may be, for example, 40℃42℃44℃46℃48℃50℃52℃54℃56℃58℃60 ℃.
Preferably, the curing time in the step (3) is 48-80 h, for example, 48h, 50h, 52h, 55h, 57h, 60h, 63h, 66h, 68h, 70h, 72h, 75h, 77h or 80h, etc.
In a third aspect, the present invention provides an application of the UV anti-adhesive film according to the first aspect in the preparation of Micro LED chips.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, through the design of the UV anti-adhesive film structure and the raw material components of the anti-adhesive layer, the design of the base coat and the use of specific antistatic agents are further adopted, the prepared UV anti-adhesive film has lower haze, higher transparency and better antistatic property, the initial viscosity is 494-624 g/25mm, the viscosity is 18-52 g/25mm after UV irradiation, the haze is 2.8-4%, the transparency is more than 90%, and the antistatic property is 10 < lambda > 9.3-10 < lambda > 10.8 omega, and the UV anti-adhesive film provided by the invention is suitable for the production and the preparation of micro LED chips.
Drawings
Fig. 1 is a schematic structural diagram of a UV anti-adhesive film according to an embodiment of the present invention;
wherein, the primer layer comprises a 1-base coat layer, a 2-substrate layer, a 3-anti-adhesive layer and a 4-release film layer.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
Some of the component sources in the following examples and comparative examples are as follows:
aqueous polyurethane: WF-77-289, style;
acrylic resin: n-9578, mitsubishi chemical Co., ltd;
single-wall carbon nanotubes: OCSIAl.
Example 1
The embodiment provides a UV anti-adhesive film and a preparation method thereof, wherein the structural schematic diagram of the UV anti-adhesive film is shown in fig. 1, and the UV anti-adhesive film comprises a bottom coating 1 with the thickness of 3 mu m, a PVC base material layer with the thickness of 80 mu m, an anti-adhesive layer 3 with the thickness of 40 mu m and a PET single-silicon release film layer with the thickness of 50 mu m which are sequentially overlapped.
The anti-adhesive layer 2 is made of a UV anti-adhesive composition;
the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 1.2 parts of toluene diisocyanate trimer, 3 parts of lithium bistrifluoromethane sulfonyl imide, 2.1 parts of 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide and 40 parts of solvent;
the solvent consists of ethyl acetate and toluene in a mass ratio of 7:3;
the preparation method of the UV glue reducing composition comprises the following steps:
uniformly mixing acrylic resin, toluene diisocyanate trimer, lithium bistrifluoromethane sulfonyl imide, 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide, ethyl acetate and toluene to obtain the UV viscose-reducing composition with the solid content of 25%.
The preparation method of the UV anti-adhesive film comprises the following steps:
(1) Uniformly mixing waterborne polyurethane (100 parts), isopropanol (88 parts) and water (38 parts), coating on the matte surface of a PVC film, and drying at 60 ℃ for 4min to obtain a PVC substrate layer with a bottom coating 1;
(2) Coating the UV adhesive reducing composition on any side of the PET single-silicon release film layer, and drying at 80 ℃ for 3min to obtain the PET single-silicon release film layer with the adhesive reducing layer 2;
(3) And compounding the anti-adhesive layer 2 on the side far away from the release film layer with the PVC substrate layer on the side far away from the bottom coating 1, and curing for 72 hours at 45 ℃ to obtain the UV anti-adhesive film.
Example 2
The embodiment provides a UV anti-adhesive film and a preparation method thereof, wherein the structural schematic diagram of the UV anti-adhesive film is shown in fig. 1, and the UV anti-adhesive film comprises a bottom coating 1 with the thickness of 1 mu m, a PVC base material layer with the thickness of 50 mu m, an anti-adhesive layer 3 with the thickness of 60 mu m and a PET single-silicon release film layer with the thickness of 12 mu m which are sequentially overlapped.
The anti-adhesive layer 2 is made of a UV anti-adhesive composition;
the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 2 parts of hexamethylene diisocyanate trimer, 3 parts of 1-ethyl-3-methylimidazole bis (trifluoromethyl) sulfonyl imide salt, 2.1 parts of 1-hydroxycyclohexyl phenyl ketone and 48 parts of solvent;
the solvent consists of ethyl acetate, toluene and methyl ethyl ketone in a mass ratio of 7:2:1;
the preparation method of the UV glue reducing composition comprises the following steps:
uniformly mixing acrylic resin, hexamethylene diisocyanate trimer, 1-ethyl-3-methylimidazole bis (trifluoromethyl) sulfonyl imide salt, 1-hydroxycyclohexyl phenyl ketone, ethyl acetate and toluene to obtain the UV viscose reducing composition with the solid content of 24%.
The preparation method of the UV anti-adhesive film comprises the following steps:
(1) Uniformly mixing waterborne polyurethane (100 parts), isopropanol (88 parts) and water (38 parts), coating on the matte surface of a PVC film, and drying at 50 ℃ for 4min to obtain a PVC substrate layer with a bottom coating 1;
(2) Coating the UV adhesive reducing composition on any side of the PET single-silicon release film layer, and drying at 60 ℃ for 4min to obtain the PET single-silicon release film layer with the adhesive reducing layer 2;
(3) And compounding the anti-adhesive layer 2 on the side far away from the release film layer with the PVC substrate layer on the side far away from the bottom coating 1, and curing for 80 hours at 40 ℃ to obtain the UV anti-adhesive film.
Example 3
The embodiment provides a UV anti-adhesive film and a preparation method thereof, wherein the structural schematic diagram of the UV anti-adhesive film is shown in fig. 1, and the UV anti-adhesive film comprises a bottom coating 1 with the thickness of 4 mu m, a PVC base material layer with the thickness of 100 mu m, an anti-adhesive layer 3 with the thickness of 40 mu m and a PET single-silicon release film layer with the thickness of 45 mu m which are sequentially overlapped.
The anti-adhesive layer 2 is made of a UV anti-adhesive composition;
the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.9 part of isophorone diisocyanate trimer, 5 parts of lithium bistrifluoromethylsulfonylimide, 0.9 part of benzophenone and 60 parts of solvent;
the solvent consists of ethyl acetate and toluene in a mass ratio of 7:3;
the preparation method of the UV glue reducing composition comprises the following steps:
uniformly mixing acrylic resin, isophorone diisocyanate trimer, lithium bistrifluoromethylsulfonylimide, benzophenone, ethyl acetate and toluene to obtain the UV (ultraviolet) viscose reducing composition with the solid content of 22%.
The preparation method of the UV anti-adhesive film comprises the following steps:
(1) Uniformly mixing waterborne polyurethane (100 parts), isopropanol (88 parts) and water (38 parts), coating on the matte surface of a PVC film, and drying at 80 ℃ for 1min to obtain a PVC substrate layer with a bottom coating 1;
(2) Coating the UV adhesive reducing composition on any side of the PET single-silicon release film layer, and drying at 100 ℃ for 1min to obtain the PET single-silicon release film layer with the adhesive reducing layer 2;
(3) And compounding the anti-adhesive layer 2 on the side far away from the release film layer with the PVC substrate layer on the side far away from the bottom coating 1, and curing for 48 hours at 60 to obtain the UV anti-adhesive film.
Example 4
The embodiment provides a UV anti-adhesive film and a preparation method thereof, wherein the structural schematic diagram of the UV anti-adhesive film is shown in fig. 1, and the UV anti-adhesive film comprises a bottom coating 1 with the thickness of 2 mu m, a PVC base material layer with the thickness of 50 mu m, an anti-adhesive layer 3 with the thickness of 5 mu m and a PET single-silicon release film layer with the thickness of 12 mu m which are sequentially overlapped.
The anti-adhesive layer 2 is made of a UV anti-adhesive composition;
the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 2.8 parts of hexamethylene diisocyanate trimer, 2 parts of tetrakis (hydroxymethyl) phosphonium sulfate, 2.5 parts of 2-isopropyl thioxanthone and 79 parts of solvent;
the solvent consists of ethyl acetate, toluene and methyl ethyl ketone in a mass ratio of 6:2:2;
the preparation method of the UV glue reducing composition comprises the following steps:
uniformly mixing acrylic resin, hexamethylene diisocyanate trimer, tetrakis (hydroxymethyl) phosphonium sulfate, 2-isopropyl thioxanthone, ethyl acetate and toluene to obtain the UV (ultraviolet) viscose-reducing composition with the solid content of 20%.
The preparation method of the UV anti-adhesive film comprises the following steps:
(1) Uniformly mixing waterborne polyurethane (100 parts), isopropanol (88 parts) and water (38 parts), coating on the matte surface of a PVC film, and drying at 70 ℃ for 3min to obtain a PVC substrate layer with a bottom coating 1;
(2) Coating the UV adhesive reducing composition on any side of the PET single-silicon release film layer, and drying at 90 ℃ for 2min to obtain the PET single-silicon release film layer with the adhesive reducing layer 2;
(3) And compounding the anti-adhesive layer 2 on the side far away from the release film layer with the PVC substrate layer on the side far away from the bottom coating 1, and curing for 72 hours at 45 ℃ to obtain the UV anti-adhesive film.
Example 5
This example provides a UV anti-adhesive film and a method for preparing the same, which are different from example 1 only in that the thickness of the primer layer 1 is 1 μm, and other conditions are the same as example 1.
Example 6
This example provides a UV anti-adhesive film and a method for preparing the same, which are different from example 1 only in that the thickness of the primer layer 1 is 4 μm, and other conditions are the same as example 1.
Example 7
This example provides a UV anti-adhesive film and a method for preparing the same, which are different from example 1 only in that the thickness of the primer layer 1 is 0.5 μm, and other conditions are the same as example 1.
Example 8
This example provides a UV anti-adhesive film and a method for preparing the same, which are different from example 1 only in that the thickness of the primer layer 1 is 6 μm, and other conditions are the same as example 1.
Example 9
This example provides a UV anti-adhesive film and a method for preparing the same, which are different from example 1 only in that the weight part of lithium bistrifluoromethane sulfonyl imide is 2 parts, and the other conditions are the same as example 1.
Example 10
This example provides a UV anti-adhesive film and a method for preparing the same, which are different from example 1 only in that the weight part of lithium bistrifluoromethane sulfonyl imide is 5 parts, and the other conditions are the same as example 1.
Comparative example 1
This comparative example provides a UV anti-adhesive film and a method for preparing the same, differing from example 1 only in that the weight part of lithium bistrifluoromethane sulfonyl imide is 1 part, and the other conditions are the same as example 1.
Comparative example 2
This comparative example provides a UV anti-adhesive film and a method for preparing the same, differing from example 1 only in that the lithium bistrifluoromethane sulfonyl imide is 7 parts by weight, and the other conditions are the same as example 1.
Comparative example 3
This comparative example provides a UV anti-adhesive film and a method for preparing the same, differing from example 1 only in that lithium bistrifluoromethane sulfonyl imide was replaced with carbon nanotubes, and the other conditions were the same as in example 1.
The performance of the UV anti-adhesive films provided in the above examples and comparative examples was tested as follows:
haze: JIS K7136-2000;
transparency: JIS K7136-2000;
antistatic properties: removing the release film layer of the UV anti-adhesive film provided in the above examples and comparative examples, contacting an impedance tester (model ST-4, SIMCO) with the anti-adhesive layer, and performing an antistatic test;
tack test: GB/T2792-1998.
The performance test results of the UV anti-adhesive films provided in the above examples and comparative examples are shown in table 1 below:
TABLE 1
As can be seen from the contents of Table 1, the UV anti-adhesive film prepared by designing the structure of the UV anti-adhesive film and the raw material components of the anti-adhesive layer and further by designing the base coat and using a specific antistatic agent has better viscosity, lower haze, higher transparency and better antistatic property, the initial viscosity is 494-624 g/25mm, the viscosity is 18-52 g/25mm after UV irradiation, the haze is 2.8-4%, the transparency is more than 90%, the antistatic property is 10-9.3-10-10.8 omega, and the UV anti-adhesive film provided by the invention is suitable for the production and the preparation of micro LED chips.
If the thickness of the primer layer is too small (example 7) as compared to example 1, the haze of the prepared UV anti-adhesive film is 11% larger; if the thickness of the primer layer is too large (example 8), the prepared UV anti-adhesive film has low haze and high transparency, but causes waste of raw materials, increases in production cost, and is unfavorable for actual production of the UV anti-adhesive film.
Compared with example 1, if the content of the antistatic agent in the anti-adhesive layer is too small (comparative example 1), the anti-static property of the prepared UV anti-adhesive film is poorer than 10≡11.5 Ω; if the content of the antistatic agent in the anti-adhesive layer is too much (comparative example 2), the antistatic agent is easy to precipitate, white fog remains after UV irradiation, the transparency is worse than 87.1%, and the anti-adhesive layer is not suitable for the production and the preparation of micro LED chips.
When other antistatic agents (comparative example 3) were used, the prepared UV anti-adhesive film had a haze of 12% and a transparency of 86.9% and an antistatic effect was poor, compared with example 1.
In conclusion, the UV anti-adhesive film prepared by the design of the base coat and the use of the specific antistatic agent has lower haze, higher transparency and better antistatic property, and is suitable for the production and preparation of micro LED chips.
The applicant states that the detailed process flow of the present invention is illustrated by the above examples, but the present invention is not limited to the above detailed process flow, i.e. it does not mean that the present invention must be implemented depending on the above detailed process flow. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.
Claims (25)
1. The UV anti-adhesive film for preparing the Micro LED chip is characterized by comprising a bottom coating layer, a substrate layer, an anti-adhesive layer and a release film layer which are sequentially overlapped;
the anti-adhesive layer is made of a UV anti-adhesive composition;
the UV glue reducing composition comprises the following components in parts by weight: 100 parts of acrylic resin, 0.9 to 2.8 parts of curing agent, 2 to 5 parts of antistatic agent and 0.9 to 2.5 parts of initiator;
the antistatic agent is selected from any one or a combination of at least two of stearamidopropyl dimethyl-beta-hydroxyethyl ammonium nitrate, 1-ethyl-3-methylimidazole bis (trifluoromethyl) sulfonyl imide salt, bis (trifluoromethyl) sulfonyl imide lithium or tetra (hydroxymethyl) phosphorus sulfate;
the thickness of the bottom coating is 1-4 mu m;
the primer layer is made of aqueous polyurethane;
the weight average molecular weight of the aqueous polyurethane is 3 ten thousand to 5 ten thousand;
the viscosity of the aqueous polyurethane is less than 100cps;
the solid content of the aqueous polyurethane is 25% -35%.
2. The UV anti-adhesive film according to claim 1, wherein the thickness of the substrate layer is 50 to 100 μm.
3. The UV curable adhesive film of claim 1, wherein the substrate layer is a PVC substrate layer.
4. The UV curable adhesive film according to claim 1, wherein the thickness of the curable adhesive layer is 5 to 60 μm.
5. The UV anti-adhesive film according to claim 1, wherein the solid content of the acrylic resin is 30% to 40%.
6. The UV anti-adhesive film according to claim 1, wherein the viscosity of the acrylic resin is 500 to 1800cps.
7. The UV anti-adhesive film according to claim 1, wherein the weight average molecular weight of the acrylic resin is 50 to 60 tens of thousands.
8. UV anti-adhesive film according to claim 1, characterized in that the glass transition temperature of the acrylic resin is-40 to-30 ℃.
9. The UV anti-adhesive film according to claim 1, wherein the curing agent is selected from any one or a combination of at least two of triphenylmethane triisocyanate, hexamethylene diisocyanate trimer, toluene diisocyanate trimer, isophorone diisocyanate trimer or tris (4-phenylisocyanate) thiophosphate.
10. The UV anti-adhesive film according to claim 1, wherein the initiator is selected from any one or a combination of at least two of 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-methylphenyl propane-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholino-1-propanone, benzoin dimethyl ether, benzophenone, 2-isopropylthioxanthone or 2,4,6- (trimethylbenzoyl) -diphenyl phosphine oxide.
11. The UV curable adhesive film of claim 1, wherein the UV curable adhesive composition further comprises a solvent.
12. The UV anti-adhesive film according to claim 11, wherein the solvent is selected from any one or a combination of at least two of ethyl acetate, toluene or methyl ethyl ketone.
13. The UV reducing adhesive film according to claim 1, wherein the UV reducing adhesive composition is prepared by a process comprising the steps of:
and uniformly mixing acrylic resin, a curing agent, an antistatic agent, an initiator and an optional solvent to obtain the UV glue reducing composition.
14. The UV reducing adhesive film according to claim 1, wherein the UV reducing adhesive composition has a solids content of 20% to 25%.
15. The UV curable adhesive film according to claim 1, wherein the release film layer has a thickness of 12 to 75 μm.
16. The UV curable adhesive film of claim 1, wherein the release film layer is a PET single silicon release film layer.
17. The UV curable adhesive film according to claim 16, wherein the release force of the PET single silicon release film is 10 to 30g/25mm.
18. A method of preparing a UV anti-adhesive film according to any one of claims 1 to 17, comprising the steps of:
(1) Coating the aqueous polyurethane composition on one side of a substrate layer, and drying to obtain a prime coat and the substrate layer which are attached to each other;
(2) Coating the UV anti-adhesion composition on any side of the release film layer, and drying to obtain an anti-adhesion layer and the release film layer which are attached to each other;
(3) And compounding the anti-adhesive layer at one side far away from the release film layer with the substrate layer at one side far away from the base coat layer, and curing to obtain the UV anti-adhesive film.
19. The method of claim 18, wherein the drying in step (1) is performed at a temperature of 50 to 80 ℃.
20. The method of claim 18, wherein the drying in step (1) is performed for a period of 1 to 4 minutes.
21. The method of claim 18, wherein the drying in step (2) is carried out at a temperature of 60 to 100 ℃.
22. The method of claim 18, wherein the drying in step (2) is performed for a period of 1 to 4 minutes.
23. The method according to claim 18, wherein the curing in step (3) is performed at a temperature of 40 to 60 ℃.
24. The method according to claim 18, wherein the curing time in the step (3) is 48 to 80 hours.
25. Use of the UV-anti-adhesive film according to any one of claims 1-17 for the preparation of Micro LED chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111031934.8A CN113755110B (en) | 2021-09-03 | 2021-09-03 | UV anti-adhesive film and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111031934.8A CN113755110B (en) | 2021-09-03 | 2021-09-03 | UV anti-adhesive film and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113755110A CN113755110A (en) | 2021-12-07 |
| CN113755110B true CN113755110B (en) | 2023-05-05 |
Family
ID=78792872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111031934.8A Active CN113755110B (en) | 2021-09-03 | 2021-09-03 | UV anti-adhesive film and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113755110B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114276755B (en) * | 2021-12-28 | 2023-10-27 | 苏州赛伍应用技术股份有限公司 | Adhesive tape and preparation method and application thereof |
| CN115197662B (en) * | 2022-06-22 | 2024-02-20 | 宁波惠之星新材料科技股份有限公司 | UV (ultraviolet) adhesive, UV adhesive film and preparation method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9780318B2 (en) * | 2015-12-15 | 2017-10-03 | 3M Innovative Properties Company | Protective display film |
| CN108659734A (en) * | 2018-03-30 | 2018-10-16 | 东莞市澳中电子材料有限公司 | A kind of cured high just viscous stripping tapes and preparation method thereof again of antistatic UV |
| CN113150709A (en) * | 2021-05-07 | 2021-07-23 | 东莞市亮雅塑料制品有限公司 | Acrylic acid thermal viscosity-reducing protective film and preparation method thereof |
-
2021
- 2021-09-03 CN CN202111031934.8A patent/CN113755110B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113755110A (en) | 2021-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113755110B (en) | UV anti-adhesive film and preparation method and application thereof | |
| CN106995665B (en) | Heat-resistant UV (ultraviolet) anti-adhesion film and preparation method thereof | |
| CN100562948C (en) | The unleaded silver paste composition that is used for the PDP addressing electrode | |
| CN104974594B (en) | The ink composite of a kind of water-soluble solvent, its application and printed circuit board (PCB) | |
| CN105778806A (en) | Heat-resistant UV visbreaking glue composition and UV visbreaking protective film | |
| CN103474126B (en) | Can the electrocondution slurry of UV surface cure and conductive film circuit production method thereof fast | |
| TWI744520B (en) | Inkjet resin composition and printed wiring board and method for preparing printed wiring board by using same | |
| TW201919864A (en) | Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures | |
| JP2016505086A (en) | Fluoropolymer fine particles | |
| CN102604455A (en) | Antistatic paint, antistatic thin film and preparation method of the antistatic thin film | |
| TW201112267A (en) | Thermosetting electrode paste composition for low temperature | |
| JP6018476B2 (en) | Thermosetting conductive paste | |
| CN115109294B (en) | Antistatic film and preparation method thereof | |
| KR20170101626A (en) | Composition for forming a barrier layer, and a barrier layer obtained therefrom | |
| CN106047207A (en) | Antistatic protective film and preparation method thereof | |
| KR20160032302A (en) | Flexible multilayer sheet for transparent electrode and manufacturing method thereof | |
| CN108699416A (en) | Adhesion agent composition and adhesive tape | |
| CN106084929A (en) | Protecting film compositions, protecting film and its preparation method | |
| CN102388421B (en) | Paste composition capable of being fired at low temperature for forming electrode or wiring | |
| CN102925066B (en) | Epoxy resin adhesive film and preparation method thereof | |
| KR20150136530A (en) | Thermoplastic resin film base for optical firing, conductive circuit board using same, and method for manufacturing said conductive circuit board | |
| KR102255284B1 (en) | Conductive ink composition for discharging electrostatic charges | |
| KR102258039B1 (en) | Conductive ink composition for discharging electrostatic charges | |
| CN111440466A (en) | UV special release coating for PET or BOPP film and preparation method thereof | |
| CN105602430B (en) | Pre- coating composition, UV cured articles and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |