CN113752465A - Injection molding method for center shaft of conductive slip ring - Google Patents
Injection molding method for center shaft of conductive slip ring Download PDFInfo
- Publication number
- CN113752465A CN113752465A CN202111097478.7A CN202111097478A CN113752465A CN 113752465 A CN113752465 A CN 113752465A CN 202111097478 A CN202111097478 A CN 202111097478A CN 113752465 A CN113752465 A CN 113752465A
- Authority
- CN
- China
- Prior art keywords
- ring
- injection molding
- copper
- spacer
- rings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/70—Wind energy
- Y02E10/72—Wind turbines with rotation axis in wind direction
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention provides an injection molding method of a center shaft of a conductive slip ring, which comprises the following steps: placing a copper ring: sequentially placing copper rings on a plurality of first copper ring installation positions on the lower die, wherein the copper rings are arranged at intervals; pre-installing a spacer ring: sequentially placing spacing rings on a plurality of first spacing ring installation positions on the lower die, wherein the spacing rings are arranged at intervals; injection molding: covering the upper die to the lower die, and injecting an injection molding material into an injection molding space formed by the spacer ring and the inner side of the copper ring; molding: after the injection molding material is solidified, taking out the molded product from an injection mold to complete the injection molding of the center shaft of the conductive slip ring; the invention ensures that the spacer ring can be molded at one time without damaging the copper ring and the lead when the spacer ring is thinner.
Description
Technical Field
The invention relates to the field of manufacturing of a center shaft of a conductive slip ring, in particular to an injection molding method of the center shaft of the conductive slip ring.
Background
Conductive slip rings are also known as conductive rings, slip rings, collector rings, and the like. It can be used in any electromechanical system that requires continuous rotation while transmitting power and signals from a fixed position to a rotating position. The slip ring can improve the system performance, simplify the system structure and avoid the sprain of the lead in the rotation process; the central shaft of the conductive slip ring is an important component of the conductive slip ring.
In the process of processing and manufacturing a center shaft of a conductive slip ring, a plurality of copper rings need to be installed on the periphery, and meanwhile, the plurality of copper rings need to be separated through a spacer ring.
Disclosure of Invention
The invention aims to provide an injection molding method for a center shaft of a conductive slip ring, which can ensure that the center shaft of the conductive slip ring can be molded at one step without damaging a copper ring and a lead when a spacer ring is thinner.
In order to solve the technical problem, the invention provides an injection molding method of a center shaft of a conductive slip ring, which comprises the following steps:
step 1) placing a copper ring: sequentially placing copper rings on a plurality of first copper ring installation positions on the lower die, wherein the copper rings are arranged at intervals;
step 2), pre-installing a spacer ring: sequentially placing spacing rings on a plurality of first spacing ring installation positions on the lower die, wherein the spacing rings are arranged at intervals;
step 3), injection molding: covering the upper die to the lower die, and injecting an injection molding material into an injection molding space formed by the spacer ring and the inner side of the copper ring;
step 4), forming: and after the injection molding material is solidified, taking out the molded product from the injection mold, and completing the injection molding of the center shaft of the conductive slip ring.
Further, in the step 3), after the injection molding material is injected into the injection molding space, the spacer ring arranged outside the injection molding space is partially melted under the influence of the high temperature of the injection molding material, and the melted portion of the spacer ring is filled in the gap between the spacer ring and the copper ring.
Further, in the step 2), the plurality of spacer rings and the plurality of copper rings are arranged in a staggered manner.
Furthermore, when the spacer rings and the copper rings are placed in a staggered mode, gaps exist between the spacer rings and the copper rings.
Furthermore, the spacer ring is made of an insulating material with a melting point lower than that of the injection molding material.
Furthermore, an injection molding channel is formed in one side of the first copper ring installation position on the outermost side of the lower die, the injection molding channel is communicated with the injection molding space, and injection molding materials flow into the injection molding space from the injection molding channel.
Furthermore, the second copper ring installation position and the second spacer ring installation position on the upper die are respectively identical in structure with the first copper ring installation position and the first spacer ring installation position on the lower die, so that when the upper die covers the lower die, the first copper ring installation position and the second copper ring installation position form a closed loop, and the first spacer ring installation position and the second spacer ring installation position form a closed loop.
Furthermore, the outer surfaces of the spacer ring and the copper ring are in a flat ring shape.
Further, the outer diameter of the spacer ring is larger than that of the copper ring.
Furthermore, a creepage distance is formed between two adjacent copper rings through the staggered spacer rings.
The invention has the following advantages:
1. when the spacer ring to be processed is thin, injection pressure does not need to be increased, the welding spot connection stability between the copper ring and the lead is ensured, and the creepage distance is ensured while the adjacent copper rings are effectively separated.
2. A gap is formed between the spacer ring and the copper ring when the spacer ring is placed in the die, so that the side edge of the copper ring is not scraped when the spacer ring is placed, and the integrity of the copper ring is ensured; after the injection molding material is added, the spacer ring is partially melted and a gap between the spacer ring and the copper ring is filled, so that the spacer ring and the copper ring are tightly attached after the conductive slip ring center shaft is molded.
3. The copper ring and the spacer ring only need to be formed at one time, and the machining efficiency of the center shaft of the conductive slip ring is improved.
Drawings
FIG. 1 is a schematic view of a lower die and a center shaft of a conductive slip ring according to the present invention.
Fig. 2 is a schematic structural diagram of a center shaft of the conductive slip ring of the present invention.
Fig. 3 is a schematic view of the structure of the lower mold in the present invention.
Fig. 4 is a schematic structural view of an upper mold in the present invention.
Fig. 5 is a diagram showing a state where the upper mold and the lower mold are clamped in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
As shown in fig. 1 to 5, the present invention provides an injection molding method for a center shaft of a conductive slip ring, comprising the following steps:
step 1) placing a copper ring: sequentially placing copper rings 3 on a plurality of first copper ring installation positions 2 on a lower die 1, wherein the copper rings 3 are arranged at intervals;
step 2), pre-installing a spacer ring: sequentially placing spacing rings 5 on a plurality of first spacing ring installation positions 4 on the lower die 1, wherein the spacing rings 5 are arranged at intervals;
step 3), injection molding: covering the upper die on the lower die 1, and injecting injection molding materials into an injection molding space formed by the spacer ring 5 and the inner side of the copper ring 3;
step 4), forming: and after the injection molding material 7 is solidified, taking out the molded product from the injection mold 1 to complete the injection molding of the center shaft of the conductive slip ring.
In this scheme, through the mode of pre-installation spacer ring, place injection mold in proper order with spacer ring and copper ring before injection molding, make in the process of moulding plastics to the spacer ring that the thickness is thinner, the material of moulding plastics only need with the spacer ring, the operation that injection molding can be accomplished to copper ring connection one-piece, the pressure of moulding plastics is improved when need not to adopt to mould plastics, extrude the material of moulding plastics to the mode that forms the spacer ring between two adjacent copper rings, and then avoided the too big condition that leads to the solder joint between copper ring and the wire drops of moulding plastics pressure, improve the connection stability between copper ring and the wire, guarantee the centraxonial processing effect of electrically conductive sliding ring, and because spacer ring and copper ring directly form integratively with the material of moulding plastics in the process of moulding plastics, make spacer ring and copper ring can one shot forming, the machining efficiency of electrically conductive sliding ring has been improved.
In one embodiment, before the copper rings are placed in the first copper ring mounting position, the copper rings are welded with the wires, then the copper rings welded with the wires are strung together one by one, the spacing rings penetrate through the plurality of copper rings at intervals, and then the copper rings and the spacing rings are placed in the lower die in a unified mode.
Preferably, in step 3), after the injection molding material is injected into the injection molding space, the spacer ring 5 disposed outside the injection molding space is partially melted under the influence of the high temperature of the injection molding material 7, and the melted portion of the spacer ring 5 is filled into the gap between the spacer ring 5 and the copper ring 3.
Specifically, because the clearance has when placing between spacer ring and the copper ring, in order to avoid appearing spacer ring and the unstable condition of copper ring connection after electrically conductive sliding ring axis moulds plastics, the spacer ring can receive the high temperature of the material of moulding plastics and appear partly melting at the in-process of moulding plastics, and the part that melts of spacer ring can flow and fill the clearance department between spacer ring and the copper ring for the spacer ring is at the in-process remolding of moulding plastics, and after the completion of moulding plastics, spacer ring and copper ring closely laminate, guarantee the stability of being connected of spacer ring and copper ring.
Preferably, in step 2), the plurality of spacer rings 5 and the plurality of copper rings 3 are arranged in a staggered manner.
Specifically, the spacer rings and the copper rings are arranged in a staggered mode, so that two adjacent copper rings cannot be in direct contact, and the short circuit caused by direct contact of the two copper rings is avoided.
Preferably, when the spacer rings 5 and the copper rings 3 are placed in a staggered manner, a gap exists between the spacer rings 5 and the copper rings 3.
Specifically, through the setting in clearance, when placing the spacer ring crisscross between the two adjacent copper rings, because there is the space between spacer ring and the copper ring for the spacer ring is put into more easily between the two adjacent copper rings, and then can not scrape the side of copper ring when making the spacer ring place, avoids the copper ring to receive the scraping and leads to the damaged condition, guarantees the integrality of copper ring.
Preferably, the spacer ring 5 is made of an insulating material with a melting point lower than that of the injection molding material 7.
Specifically, the melting point of the spacer ring material is lower than that of the injection molding material, so that the spacer ring can be melted through high temperature carried by the injection molding material during injection molding, and the gap between the spacer ring and the copper ring can be filled.
Preferably, an injection channel 6 is formed on one side of the first copper ring mounting position 2 on the outermost side of the lower die 1, wherein the injection channel 6 is communicated with the injection space, and the injection material 7 flows into the injection space from the injection channel 6.
Specifically, first copper ring installation position and first spacer ring installation position all are the sunken snap ring structure of semi-circle, and the sunken diameter in first spacer ring installation position is greater than the sunken diameter in first copper ring installation position, and the axis in the space of moulding plastics, the axis of first spacer ring installation position and the axis coincidence in first copper ring installation position, the passageway of moulding plastics links to each other with the one end in the space of moulding plastics to it runs through the other end that flows into to the space of moulding plastics to be the material of moulding plastics from the one end in the space of moulding plastics.
Preferably, the second copper ring installation position and the second spacer installation position on the upper die are respectively identical in structure with the first copper ring installation position 2 and the first spacer installation position 4 on the lower die 1, so that when the upper die covers the lower die, the first copper ring installation position and the second copper ring installation position form a closed loop, and the first spacer installation position and the second spacer installation position form a closed loop.
Specifically, a closed loop is formed by the copper ring installation position and the second copper ring installation position, the closed loop is formed by the first spacer ring installation position and the second spacer ring installation position, the spacer ring and the copper ring placed on the lower die are limited and fixed, and the stability of the spacer ring and the copper ring in the injection molding process is guaranteed.
Preferably, the outer surfaces of the spacer ring 5 and the copper ring 3 are flat and annular.
Preferably, the outer diameter of the spacer ring 5 is larger than that of the copper rings 3, and creepage intervals are formed between every two adjacent copper rings 3 through the spacer rings 5 which are arranged in a staggered mode.
Specifically, creepage distance means between two conductive parts that record along insulating surface, under the service condition of difference, because insulating material around the conductor is polarized, leads to insulating material to present the electrified district of electrified phenomenon, in this scheme, through the setting of spacer ring, guarantees to have creepage distance between two adjacent copper rings to in the axial actual course of working of conductive slip ring, can adjust the numerical value of creepage distance through the external diameter that changes the spacer ring.
The present invention is not limited to the above-mentioned preferred embodiments, and any other products in various forms can be obtained by anyone in the light of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as those of the present application, fall within the protection scope of the present invention.
Claims (10)
1. An injection molding method of a center shaft of a conductive slip ring is characterized by comprising the following steps:
step 1) placing a copper ring: sequentially placing copper rings (3) on a plurality of first copper ring installation positions (2) on a lower die (1), wherein the copper rings (3) are arranged at intervals;
step 2), pre-installing a spacer ring: spacer rings (5) are sequentially placed on a plurality of first spacer ring installation positions (4) on the lower die (1), and the plurality of spacer rings (5) are arranged at intervals;
step 3), injection molding: covering the upper die on the lower die (1), and injecting injection molding materials into an injection molding space formed by the spacer ring (5) and the inner side of the copper ring (3);
step 4), forming: and after the injection molding material (7) is solidified, taking out the molded product from the injection mold (1) to finish the injection molding of the center shaft of the conductive slip ring.
2. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: in the step 3), after the injection molding material is injected into the injection molding space, the spacer ring (5) arranged outside the injection molding space is partially melted under the influence of the high temperature of the injection molding material (7), and the melted part of the spacer ring (5) is filled into the gap between the spacer ring (5) and the copper ring (3).
3. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: in the step 2), the plurality of spacing rings (5) and the plurality of copper rings (3) are arranged in a staggered manner.
4. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 3, wherein: when the spacer rings (5) and the copper rings (3) are placed in a staggered mode, gaps exist between the spacer rings (5) and the copper rings (3).
5. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: the spacer ring (5) is made of an insulating material with a melting point lower than that of the injection molding material (7).
6. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: an injection molding channel (6) is formed in one side of the first copper ring mounting position (2) located on the outermost side of the lower die (1), wherein the injection molding channel (6) is communicated with an injection molding space, and injection molding materials (7) flow into the injection molding space from the injection molding channel (6).
7. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: the second copper ring mounting position and the second spacer ring mounting position on the upper die are respectively identical in structure with the first copper ring mounting position (2) and the first spacer ring mounting position (4) on the lower die (1), so that when the upper die covers the lower die, the first copper ring mounting position and the second copper ring mounting position form a closed loop, and the first spacer ring mounting position and the second spacer ring mounting position form a closed loop.
8. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: the outer surfaces of the spacing ring (5) and the copper ring (3) are in a flat ring shape.
9. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 1, wherein: the outer diameter of the spacer ring (5) is larger than that of the copper ring (3).
10. The injection molding method for the center shaft of the conductive slip ring as claimed in claim 3, wherein: creepage intervals are formed between two adjacent copper rings (3) through the staggered spacer rings (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111097478.7A CN113752465B (en) | 2021-09-18 | 2021-09-18 | Injection molding method for middle shaft of conductive slip ring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111097478.7A CN113752465B (en) | 2021-09-18 | 2021-09-18 | Injection molding method for middle shaft of conductive slip ring |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113752465A true CN113752465A (en) | 2021-12-07 |
CN113752465B CN113752465B (en) | 2023-05-09 |
Family
ID=78796397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111097478.7A Active CN113752465B (en) | 2021-09-18 | 2021-09-18 | Injection molding method for middle shaft of conductive slip ring |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113752465B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204076643U (en) * | 2014-08-20 | 2015-01-07 | 杭州全盛机电科技有限公司 | A kind of microspur type axis loopful road enters glue injection structure |
CN208157821U (en) * | 2018-04-13 | 2018-11-27 | 苏州恩必技精密电气有限公司 | A kind of the ultra-small volume electrical contact electric slip ring and injection mold of injection molding |
CN212676582U (en) * | 2020-09-04 | 2021-03-09 | 江西百宏光电科技有限公司 | Central stator of electric slip ring |
CN213321313U (en) * | 2020-09-04 | 2021-06-01 | 江西百宏光电科技有限公司 | Injection molding mold for center stator of electric slip ring |
CN214056214U (en) * | 2020-09-23 | 2021-08-27 | 浙江华愉科技有限公司 | Conductive slip ring injection mold and injection-molded conductive slip ring |
-
2021
- 2021-09-18 CN CN202111097478.7A patent/CN113752465B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204076643U (en) * | 2014-08-20 | 2015-01-07 | 杭州全盛机电科技有限公司 | A kind of microspur type axis loopful road enters glue injection structure |
CN208157821U (en) * | 2018-04-13 | 2018-11-27 | 苏州恩必技精密电气有限公司 | A kind of the ultra-small volume electrical contact electric slip ring and injection mold of injection molding |
CN212676582U (en) * | 2020-09-04 | 2021-03-09 | 江西百宏光电科技有限公司 | Central stator of electric slip ring |
CN213321313U (en) * | 2020-09-04 | 2021-06-01 | 江西百宏光电科技有限公司 | Injection molding mold for center stator of electric slip ring |
CN214056214U (en) * | 2020-09-23 | 2021-08-27 | 浙江华愉科技有限公司 | Conductive slip ring injection mold and injection-molded conductive slip ring |
Non-Patent Citations (1)
Title |
---|
王玲: "《外观构件设计及成型工艺》", 30 June 2017, 辽宁科学技术出版社 * |
Also Published As
Publication number | Publication date |
---|---|
CN113752465B (en) | 2023-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4641418A (en) | Molding process for semiconductor devices and lead frame structure therefor | |
US4556896A (en) | Lead frame structure | |
CN101093808A (en) | Resin molding semiconductor device, device and method for manufacturing resin molding semiconductor device | |
US20080230887A1 (en) | Semiconductor package and the method of making the same | |
CN101123195A (en) | Resin molding semiconductor device and its manufacturing device and method | |
US5424577A (en) | Lead frame for semiconductor device | |
US5453029A (en) | Contact support for a molded connector | |
KR101759049B1 (en) | Plastic injection overmoulded conductor path structure, and method for producing the plastic injection overmoulded conductor path structure | |
CN104227348A (en) | Method of producing suspended fuse type fuse | |
US6162381A (en) | Method for producing a molded unit with electrodes embedded therein | |
CN113752465A (en) | Injection molding method for center shaft of conductive slip ring | |
US9808973B2 (en) | Insert-moulded lead frame and method for the production thereof | |
US20070004092A1 (en) | Semiconductor device manufacturing method | |
US5563103A (en) | Method for manufacturing thermoplastic resin molded semiconductor | |
US3616529A (en) | Transducer and method of making same | |
CN210305092U (en) | Copper continuous extrusion device | |
US3132196A (en) | Method for molding an annular ring of insulating material to a flat metal strip | |
CN109904077B (en) | Packaging method of multi-pin semiconductor product | |
CN111916963A (en) | Commutator copper shell and commutator production method | |
KR100224649B1 (en) | Semiconductor molding die having radial runners | |
JPS6347270B2 (en) | ||
CN113752466A (en) | Injection molding process of center shaft of conductive slip ring | |
CN109904081B (en) | Packaging method of semiconductor product based on IDF lead frame | |
CN101303980B (en) | Surface adhesion type diode support and method for manufacturing the same | |
JPS6030144A (en) | Molding die for semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |