CN113752159B

CN113752159B - Polishing carrier capable of measuring thickness on line

Info

Publication number: CN113752159B
Application number: CN202110964212.1A
Authority: CN
Inventors: 朱亮; 沈文杰; 潘兴兴; 黄金涛; 谢龙辉; 郑猛; 陈莹
Original assignee: Jingsheng Electromechanical Japan Co ltd; Zhejiang Jingsheng Mechanical and Electrical Co Ltd
Current assignee: Jingsheng Electromechanical Japan Co ltd; Zhejiang Jingsheng Mechanical and Electrical Co Ltd
Priority date: 2021-08-21
Filing date: 2021-08-21
Publication date: 2022-11-15
Anticipated expiration: 2041-08-21
Also published as: CN113752159A

Abstract

The invention relates to the technical field of wafer processing, in particular to a polishing carrier capable of measuring thickness on line, which comprises: the carrier body is used for bearing the polishing sheet; a thickness measuring assembly, the thickness measuring assembly comprising: the detection channel is arranged in the carrier body and penetrates to one end, bonded with the polishing sheet, of the carrier body; the detector is fixedly connected to the carrier body and used for sending a detection signal to the polished section through the detection channel so as to detect the thickness of the polished section and output the thickness. The application has the following effects: the technical problem that the current polishing removal amount and polishing thickness of a system polishing piece cannot be fed back in real time in the prior art is solved; the technical effect of feeding back the thickness of the polished wafer in real time is achieved.

Description

Polishing carrier capable of measuring thickness on line

Technical Field

The invention relates to the technical field of wafer processing, in particular to a polishing carrier capable of measuring thickness on line.

Background

Polishing plays an important role in a semiconductor processing technology, and can realize the mirrorizing of a polishing piece and improve the flatness of the polishing piece; the damage to the surface of the polished wafer caused by the previous process step can be removed to a certain extent.

In the prior art, the pneumatic pressurized polishing carrier used by the polishing equipment only can provide functions of pressurizing and adsorbing a polished wafer, and cannot detect the actual polishing state of the polished wafer on line, namely cannot feed back the current polishing removal amount and the thickness of the polished wafer of the system in real time.

Therefore, the technical problems of the prior art are as follows: in the polishing process of the polishing piece, the polishing equipment cannot feed back the thickness of the polishing piece.

Disclosure of Invention

The invention provides a polishing carrier capable of measuring thickness on line, which solves the technical problem that the prior polishing removal amount and polishing thickness of a system polishing piece cannot be fed back in real time in the prior art; the technical effect of feeding back the thickness of the polished wafer in real time is achieved.

The invention provides a polishing carrier capable of measuring thickness on line, which adopts the following technical scheme:

an in-line thickness measurable polishing carrier comprising: the carrier body, the carrier body is used for bonding throwing the piece the carrier body includes: a first seat; the pressurizing assembly comprises an air bag which is fixedly arranged at one end of the first seat; the detection channel is arranged in the carrier body; and a thickness measuring assembly, the thickness measuring assembly comprising: the detector is fixedly connected to the carrier body, so that the detector can send a detection signal to the polished wafer through the detection channel to detect the thickness of the polished wafer and output the thickness.

Preferably, the detector includes: the light beam generator is arranged in the detection channel and used for emitting light beams to the polishing sheet; and the light beam receiver is arranged in the detection channel and is used for receiving and outputting the reflected light beam of the polishing piece.

Preferably, the detection channel is located on a rotational center of the carrier body.

Preferably, the pressurizing assembly further comprises: the first detection through hole is formed in the air bag, so that the detector can detect the thickness of the polished section through the first detection through hole, and the air bag is used for bonding the polished section; the pressurization cavity is arranged in the first seat and is in contact with the air bag, and the acting force of the air bag on the throwing sheet can be adjusted by adjusting the air pressure in the pressurization cavity.

Preferably, a flanging is arranged at the position of the first detection through hole of the air bag, and the flanging is attached to the inner wall of the detection channel.

Preferably, the pressurizing cavity is provided with a plurality of pressurizing cavities, the top of the first seat is provided with a plurality of joints, each joint is communicated with the corresponding pressurizing cavity downwards, and the joints are used for being connected with an external air source.

Preferably, the pressurizing cavities are uniformly distributed in the circumferential direction of the detection channel.

Preferably, still include the adsorption pad, the adsorption pad is used for bearing throwing the piece, the adsorption pad includes: the adsorption pad bottom is fixedly arranged at the bottom of the air bag, a second detection through hole is formed in the adsorption pad bottom, and the second detection through hole is positioned right below the first detection through hole, so that the detector can measure the thickness of the polished wafer through the first detection through hole and the second detection through hole; the adsorption backing ring is fixedly arranged on the adsorption backing bottom, so that a bearing cavity is formed inside the adsorption backing ring and is used for bearing the polishing piece.

Preferably, the polishing carrier further comprises: the second seat is connected with the first seat; an adjustment assembly, the adjustment assembly comprising: the adjusting sheet can deform, is fixedly connected to the second seat and is abutted against the first seat; the adjusting cavity is arranged in the second seat, the adjusting cavity is in contact with the adjusting sheet, and the acting force of the adjusting sheet on the first seat can be adjusted by adjusting the air pressure in the adjusting cavity.

Preferably, a retaining ring is fixedly arranged on the edge of the bottom of the first seat, and the air bag covers the retaining ring and the bottom of the first seat.

In summary, the present application includes at least one of the following beneficial technical effects:

1. according to the polishing device, the detection channel is formed in the carrier body, the thickness of the polishing piece can be monitored in real time through the detection channel by the detector and fed back, a signal is fed back when the polishing piece reaches the set thickness, the polishing piece is prevented from being over polished, and the signal is fed back when the thickness of the polishing piece does not reach the set thickness, so that the polishing piece can be continuously polished; the polishing efficiency and the polishing yield are greatly improved, and unnecessary polishing solution and polishing pad waste are saved; the technical problem that the current polishing removal amount and polishing thickness of a system polishing piece cannot be fed back in real time in the prior art is solved; the technical effect of feeding back the thickness of the polished wafer in real time is achieved.

2. Through improving the carrier body inside, set up the measuring channel in the carrier body inside to carry out the thickness measurement to the throwing piece through the measuring channel, reduce the change of burnishing device structure itself, and can not cause the influence in order to improve polishing efficiency and polishing yield to the polishing process.

3. The air bag is fixed at the bottom of the first seat, the polishing piece is fixed at the bottom of the air bag and is pressed on the polishing pad by the first seat and the air bag for polishing, the pressurizing cavity in direct contact with the air bag is arranged in the first seat, and the acting force of the air bag on the polishing piece is adjusted by adjusting the air pressure in the pressurizing cavity, so that the interaction between the polishing piece and the polishing pad is adjusted, the stress action on the polishing piece is favorably controlled, and the flatness of the polishing piece is improved. The simplified structure not only enables the polishing piece to be pressurized more stably, improves the polishing quality of the polishing piece, but also improves the assembling performance and the maintainability, and reduces the time loss outside the processing caused by maintenance and the like.

4. The second seat is additionally arranged on the basis of the first seat, in order to improve the polishing quality of the polishing piece, the acting force of the edge part of the polishing piece is independently controlled, the acting force of the deformable adjusting piece on the first seat is adjusted by adjusting the air pressure in the second seat, the acting force is transmitted to the edge of the polishing piece through the transmission of the first seat, the polishing quality of the edge part of the polishing piece is improved, and the problem that the edge is too thin or too thick is solved.

5. The aligning plate sets up on the adjustment sheet, aligning plate self is deformable and set up convex through-hole on the aligning plate, atmospheric pressure sees through circular-arc through-hole effect on the adjustment sheet, the adjustment sheet is used in first seat top downwards, circular-arc through-hole is seted up on the aligning plate, make the aligning plate have certain bradyseism and anti deformation effect, receive under the condition of deformation at the aligning plate, drag the control each other between the circular-arc through-hole, make the aligning plate form the trend change of recovering the original shape, produce vibrations during the polishing, can absorb certain vibrations through the aligning plate, improve the stability of whole effect, reduce vibrations and influence the polishing quality of throwing the piece.

6. The polishing pad is connected to the air bag through the adsorption pad, the polishing pad is adsorbed on the adsorption pad bottom through the tension action of water, the outer edge of the polishing pad is surrounded by the adsorption pad ring, when the polishing pad is polished, the adsorption pad ring and the polishing pad are attached to the polishing pad together for polishing, when the air pressure is adjusted in the adjusting cavity to adjust the action force of the edge of the polishing pad, the action force is prevented from directly acting on the edge of the polishing pad but acting on the adsorption pad ring due to the action of the adsorption pad ring, when the adsorption pad ring is attached to the polishing pad, the edge of the polishing pad is bound to the polishing pad, even if the action force is overlarge, the adsorption pad ring is supported between the air bag and the polishing pad, the distance between the polishing pad and the polishing pad is not too small, the phenomenon that the edge of the polishing pad is excessively polished due to overlarge action force is prevented, the protection on polishing is improved, and the polishing quality of the polishing pad is further improved.

Drawings

FIG. 1 is a schematic view of an on-line thickness measurable polishing carrier according to the present application;

FIG. 2 is an exploded view of a first carrier and a second carrier of the polishing carrier capable of on-line thickness measurement according to the present application;

FIG. 3 is an exploded view of an in-line thickness measurable polishing carrier conditioning assembly according to the present application;

FIG. 4 is an exploded view of the bladder and absorbent pad of an on-line thickness measurable polishing carrier according to the present application;

FIG. 5 is an exploded view of an in-line thickness measurable polishing carrier according to the present application;

FIG. 6 is a front cross-sectional view of an in-line thickness measurable polishing carrier according to the present application;

FIG. 7 is a first axial cross-sectional view of an in-line thickness measurable polishing carrier according to the present application;

FIG. 8 is an enlarged view of A in FIG. 6;

FIG. 9 is an enlarged view of B of FIG. 7;

FIG. 10 is a second axial cross-sectional view of an in-line thickness measurable polishing carrier according to the present application;

FIG. 11 is an enlarged view of C in FIG. 10;

FIG. 12 is an enlarged view of D in FIG. 10;

FIG. 13 is a schematic view of an adsorption pad of an on-line thickness-measurable polishing carrier according to the present application

Fig. 14 is a flow chart of the polishing thickness measurement of the polishing carrier capable of on-line thickness measurement according to the present application.

Description of the reference numerals: 10. polishing the sheet; 20. a pressurization cavity; 30. an adjustment chamber; 101. a second seat; 102. a limiting block; 103. a limiting seat; 104. a third seal ring; 106. a first seal ring; 201. a first seat; 202. an inner concave plate; 203. a retaining ring; 204. an air bag; 205. a second seal ring; 206. an adsorption pad; 206a, an adsorption pad bottom; 206b, an adsorption backing ring; 207. a detection seat; 208. a joint; 209. a detector; 210. briquetting; 211. a fourth seal ring; 212. a fifth seal ring; 213. a first retaining ring; 214. an aligning plate; 215. a gasket; 216. a regulating sheet; 217. a second fixing ring; 218. flanging; 219. and detecting the channel.

Detailed Description

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

The embodiment of the application provides a polishing carrier capable of measuring thickness on line, wherein a detection channel is arranged in a carrier body, and a detector can monitor the thickness of a polishing sheet in real time and feed back the thickness of the polishing sheet through the detection channel, so that the polishing efficiency and the polishing yield are greatly improved, and unnecessary polishing solution and polishing pad waste are saved; the technical problem that the current polishing removal amount and polishing thickness of a system polishing piece cannot be fed back in real time in the prior art is solved; the technical effect of feeding back the thickness of the polished wafer in real time is achieved.

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

A polishing carrier capable of measuring thickness on line comprises a carrier body, a detection channel and a thickness measuring component; the carrier body is used for bearing the polishing sheet and applying the polishing sheet on the polishing pad to realize polishing of the polishing sheet; the thickness measuring assembly is used for measuring the thickness of the polished wafer in real time and outputting the thickness; the detection channel is arranged in the carrier body and is used as a channel for detecting the polishing piece by the thickness measuring assembly.

As shown in fig. 1 to 3, the carrier body is used for carrying a polishing pad at the time of polishing, and the polishing carrier includes a second seat 101, a first seat 201, a pressurizing assembly, and a conditioning assembly.

The second seat 101 is located above the first seat 201 and is fixedly connected with the top of the first seat 201, a rotating shaft is arranged on the second seat 101, and the rotating shaft is driven by external rotation, so that the second seat 101 and the first seat 201 can rotate axially.

As shown in fig. 4, 5 and 7, the pressurizing assembly includes an air bag 204 and a pressurizing cavity 20, the air bag 204 is fixed at the bottom of the first seat 201, specifically, a retaining ring 203 is fixed on the edge of the bottom of the first seat 201 by screws, a second sealing ring 205 is arranged between the retaining ring 203 and the first seat 201, the air bag 204 is fixed on the retaining ring 203, so that the air bag 204 covers the retaining ring 203 and the whole bottom of the first seat 201, the air bag 204 can be fixed by gluing, the material of the air bag 204 can be, but not limited to, a deformable material such as natural rubber, and the air bag 204 is used for bonding the polishing sheet 10.

As shown in fig. 7, 8 and 10, the pressurizing chambers 20 are opened inside the first seat 201, the number of the pressurizing chambers 20 may be one or more, and when a plurality of pressurizing chambers 20 are provided, the pressurizing chambers 20 are respectively provided on both sides of the detecting passage 219 or are circumferentially distributed in an array inside the first seat 201 with the detecting passage 219 as a center; an inner concave plate 202 is arranged in the first seat 201, the concave direction of the inner concave plate 202 is upward, a pressurizing cavity 20 is formed between the inner concave plate 202 and the air bag 204, and the concave quantity of the inner concave plate 202 is consistent with the quantity of the pressurizing cavities 20. The pressurizing cavity 20 is directly contacted with the air bag 204, the air bag 204 expands outwards after air pressure is injected into the pressurizing cavity 20, acting force is applied to the adsorption pad bottom 206a, and the acting force of the air bag 204 on the projectile 10 can be adjusted by adjusting the size of the injected air pressure; the bladder 204 contracts to fit against the interior recessed panel 202 when a negative pressure is created by evacuating the pressurized cavity 20. In order to enable the detector 209 to detect the projectile 10 through the detection passage 219, a first detection through hole is formed in the airbag 204, and the first detection through hole is located right below the detection passage 219.

As shown in fig. 7 and 12, in order to improve the sealing of the pressurizing chamber 20, a cuff 218 facing the inside of the detection passage 219 is provided at the air bag 204 portion of the first detection through hole; specifically, the extending direction of the flange is upward, and the flange 218 is tightly attached to the inner wall of the detection channel, so as to ensure the air tightness in the pressurization cavity and ensure that the detector can detect the thickness of the polishing sheet through the air bag.

As shown in fig. 3 and 5, the adjusting assembly includes an adjusting sheet 216 and an adjusting cavity 30, the adjusting sheet 216 is made of a deformable material, the adjusting sheet 216 may be, but not limited to, a natural rubber, and the like, the adjusting sheet 216 is disposed at the bottom of the second seat 101, the adjusting sheet 216 is a complete sheet, so that the pressure regulating cavity 30 remains closed, and the adjusting sheet 216 abuts against the top of the first seat 201; the adjusting cavity 30 is arranged in the second seat 101, the adjusting cavity 30 is directly contacted with the adjusting sheet 216, the adjusting sheet 216 is deformed by injecting air pressure into the adjusting cavity 30, the adjusting sheet 216 acts on the top of the first seat 201, and acting force acts on the adsorption backing ring 206b through the retaining ring 203; an air passage is formed in the rotating shaft, and the air pressure in the adjusting cavity 30 is adjusted through the air passage. The retaining ring is fixed on the first seat through the screw, and the air bag needs to be replaced due to the limited service life of the air bag, and the retaining ring can be detached for replacement.

As shown in fig. 3 and 5, a centering plate 214 is further disposed on the adjusting sheet 216, and similarly, the centering plate 214 is deformable, the adjusting sheet 216 and the centering plate 214 are fixed between the second seat 101 and the first seat 201 through a fixing assembly, the fixing assembly includes a first fixing ring 213 and a second fixing ring 217, the first fixing ring 213 is fixed at the bottom edge of the second seat 101 through screws, a first sealing ring 106 is disposed between the first fixing ring 213 and the second seat 101, so as to ensure the air tightness of the pressure regulating cavity inside the second seat 101, the second fixing ring 217 is fixed under the first fixing ring 213 through screws, and the first fixing ring 213 is tightly connected with the second fixing ring 217 through threads or adhesion. The aligning plate 214 and the adjusting piece 216 are clamped between the first fixing ring 213 and the second fixing ring 217, and a ring of gasket 215 is also clamped between the aligning plate 214 and the first fixing ring 213; at least one through hole is formed in the adjustment plate 214, and in this embodiment, a plurality of arc-shaped through holes are formed in the adjustment plate 214, so that the pressure in the adjustment cavity 30 can act on the adjustment sheet 216 through the adjustment plate 214.

As shown in fig. 3 and 5, the through holes formed in the aligning plate 214 are circular arc-shaped, each circular arc is distributed with the aligning plate 214 as a center of circle, after air pressure is injected into the adjusting cavity 30 through the adjusting assembly, because the adjusting sheet 216 and the aligning plate 214 are both deformable, the air pressure acts on the adjusting sheet 216 through the circular arc-shaped through holes, the adjusting sheet 216 acts on the top of the first seat 201 downward, the circular arc-shaped through holes are formed in the aligning plate 214, so that the aligning plate 214 has certain cushioning and deformation resistant effects, under the condition that the aligning plate 214 is deformed, the circular arc-shaped through holes are mutually dragged and controlled, so that the aligning plate 214 forms a trend change of recovering the original shape, vibration is generated during polishing, certain vibration can be absorbed through the aligning plate 214, the stability of the overall effect is improved, and the polishing quality of the polishing sheet 10 is reduced due to the vibration.

As shown in fig. 6 and 7, a limiting component is arranged on the aligning plate 214, the limiting component comprises a limiting block 102 and a pressing block 210, the limiting block 102 is adjustably connected to the second seat 101, and is inconsistent with the aligning plate 214 through the adjusting cavity 30, concretely, the limiting seat 103 is arranged on the second seat 101, the upper part of the second seat 101 is communicated with the adjusting cavity 30 through the limiting seat 103, a third sealing ring 104 is arranged between the limiting seat 103 and the second seat 101 and between the limiting block 102, the limiting block 102 is in threaded connection with the limiting seat 103 to seal the adjusting cavity 30, and the acting force of the limiting block 102 on the aligning plate 214 is adjusted by rotating the limiting block 102. The bottom of the limiting block 102 is provided with a first step, the top edge of the pressing block 210 is provided with a second step, and the first step is matched with the second step, so that the limiting block 102 is pressed and limited by the pressing block 210.

As shown in fig. 8 and 9, the pressing block 210 is located inside the adjusting cavity 30 and fixed on the top of the first seat 201 through screws, and the self-aligning plate 214 and the adjusting sheet 216 are clamped between the pressing block 210 and the top of the first seat 201 together, so that the second seat 101 and the first seat 201 are fixedly connected. The limiting block 102 and the pressing block 210 are both acted on the aligning plate 214 and the adjusting sheet 216, specifically, the limiting block 102 is connected to the top of the second seat 101 through threads, the distance between the limiting block 102 and the top of the second seat 101 is adjustable by adjusting the height position of the limiting block 102, after the certain distance is adjusted, the aligning plate 214 and the adjusting sheet 216 are tightly pressed on the top of the second plate by the limiting block 102, namely, the aligning plate 214 and the adjusting sheet 216 are clamped by the tops of the limiting block 102 and the second seat 101. In addition, the pressing block 210 is fixed on the top of the first seat 201, and the aligning plate 214 and the adjusting sheet 216 are located between the pressing block 210 and the top of the first seat 201. Because the vibration generated in the polishing process causes the second seat 101 and the first seat 201 to form a certain distance of longitudinal relative movement, the unevenness and the vibration of the polishing pad generated in the polishing process are weakened through the arranged aligning plate 214, so that the polishing sheet 10 is better attached to the polishing pad, and the polishing quality is improved; however, when the aligning plate 214 is excessively deformed, plastic deformation is formed, the aligning plate 214 cannot restore itself, the aligning plate 214 loses the effect of absorbing vibration, the pressing block 210 and the limiting block 102 both have the effect of limiting the aligning plate 214, and under the abutting action of the pressing block 210 and the limiting block 102, the maximum deformation degree of the aligning plate 214 is limited, so that large deformation cannot be caused, and therefore it is ensured that the aligning plate 214 cannot be plastically deformed, and deformation protection of the aligning plate 214 is achieved.

A fourth sealing ring 211 is arranged between the pressing block 210 and the first seat 201. The pressing block 210 is specifically a pressing ring, one or more joints 208 are arranged on the pressing ring, each joint 208 corresponds to one pressurizing cavity 20, the joint 208 downwards passes through the pressing ring, the first seat 201 and the concave plate 202, the joint 208 is communicated with the pressurizing cavity 20, and the joint 208 is connected with an external air source so that air pressure can be injected into the pressurizing cavity 20.

As shown in fig. 8 and 9, the middle of the compression ring is hollow, a detection seat 207 is arranged in the compression ring, the detection seat 207 is embedded into the top of the first seat 201 downward and is fixedly connected with the first seat 201, a fifth sealing ring 212 is arranged between the detection seat 207 and the first seat 201, and the detection seat 207 is used for fixing a detector 209; an adsorption pad 206 is bonded on the air bag 204, the adsorption pad 206 is used for bearing the polishing sheet 10, the adsorption pad 206 comprises an adsorption pad bottom 206a and an adsorption pad ring 206b, the adsorption pad bottom 206a is fixed on the air bag 204 and can be fixed in an adhesive mode, the adsorption pad ring 206b is made of soft materials, the adsorption pad ring 206b is fixed on the adsorption pad bottom 206a, a bearing cavity is formed between the inside of the adsorption pad ring 206b and the adsorption pad bottom 206a, and the bearing cavity is used for bearing the polishing sheet.

As shown in fig. 10, 11 and 13, during polishing, the pressurizing chamber 20 is pressurized, the force of the air bag 204 on the adsorption pad 206 acts on the polishing sheet 10, and the polishing sheet 10 is in contact with the polishing pad; when the polishing piece is not polished, in order to improve the suction force of the polishing piece 10 absorbed on the adsorption pad 206, negative pressure is formed in the pressurizing cavity 20, so that the air bag 204 deforms and is attached to the inner concave surface of the inner concave plate 202, the adsorption pad bottom 206a bonded on the air bag 204 deforms due to the inner concave surface of the inner concave plate 202, and the polishing piece 10 cannot deform greatly due to the fact that the material is hard; this will make the original polished section 10 adsorbed on the adsorption pad 206a by water tension to form vacuum between the polished section 10 and the adsorption pad 206a, so that the polished section 10 is more firmly adsorbed.

The detection channel 219 is arranged on the rotation center line of the first seat 201, specifically, the detection channel 219 is arranged on the first seat 201, and the detection channel 219 penetrates from the top of the first seat 201 to the bottom of the first seat 201, so that the detection channel 219 is in contact with the polishing sheet 10; the detector 209 is fixedly connected to the detection seat 207, the upper port of the detection channel 219 is sealed after the detector 209 is installed on the detection seat 207 so as to ensure the air tightness of the adjusting cavity 30, and the detector 209 sends a detection signal to the polishing piece 10 through the detection channel 219 to detect the thickness of the polishing piece 10.

In order to enable the detector 209 to detect the thickness of the polishing piece 10, a first detection through hole is formed in the airbag 204, a second detection through hole is formed in the bottom of the adsorption pad 206, and the first detection through hole, the second detection through hole and the detection channel 219 are coaxial, so that a detection signal of the detector 209 is not blocked, and the detection signal can directly reach the polishing piece 10 from the detection channel 219.

Because the carrier body is a comparatively holistic mechanism, offer the integrality that measuring channel influences many parts on the carrier body, measuring channel need link up to the one end that first seat glues there is the wafer on, and measuring channel needs to contact with the wafer, must cause gasbag and pressurization chamber to be destroyed like this, the mode of admitting air in pressurization chamber causes the change, and gasbag and pressurization chamber are as the conduction spare of power, cause the dynamics to transmit inhomogeneous problem after being destroyed easily, make the wafer thickness deviation after the polishing great. Regarding the position of the detection channel, in the continuous research process of the applicant, the detection channel can be arranged below the polishing pad, and the thickness of the polishing sheet is measured in a mode from bottom to top.

As shown in fig. 7-9, in the present application, the detection channel is located at the rotation center of the carrier body, the pressurizing cavities are uniformly distributed in the circumferential direction of the detection channel, and the detection channel is located at the central axis of the air bag, that is, the pressurizing cavities are uniformly distributed on the circumferential surface of the air bag, so that the condition that the air bag conducts force unevenly is avoided, and the pressurizing force is applied through each independent pressurizing cavity corresponding to an independent joint, thereby reducing the influence on the overall function and effect of the carrier body.

As shown in fig. 7 and 10, the joint is fixed on the joint seat, the joint is provided with a plurality of joints, the number of the joints is consistent with that of the pressurizing cavities, each joint corresponds to each pressurizing cavity one by one, the joints are communicated with the corresponding pressurizing cavities through the joint seat, the pressing block and the first seat downwards, the joints are connected with an external air source, air pressure is injected into the joints through the external air source to control the air pressure in the pressurizing cavities, generally, the air pressure in the pressurizing cavities is not adjusted in real time, and after appropriate air pressure is injected before polishing, the first seat and the second seat rotate to polish the polishing piece, so that the joints can be further provided with electromagnetic valves for opening and closing the joints.

The thickness gauge assembly is used to monitor the thickness of the polishing pad 10 at various times during the polishing process and includes a detector 209.

The detector 209 can adopt a laser thickness measurement mode, the detector 209 comprises a light beam generator and a light beam receiver, specifically a laser transmitter and a receiver, the laser transmitter reaches the polishing piece 10 through the detection channel 219, the receiver receives reflected light through the reflection of the laser on the upper surface and the lower surface of the polishing piece 10, and outputs a time difference, external computing equipment calculates to obtain a thickness value, the thickness value is the central thickness of the polishing piece 10, the calculated central thickness value is compared with a target value of a system process, and if the actual calculated value reaches the target value, the polishing is finished; otherwise, polishing is continued until the calculated value reaches the target value. The light output by the detector needs to be perpendicular to the plane where the polished wafer is located, so that the incident light and the reflected light are collinear, the reflected light returns to the light beam receiver, and the thickness of the polished wafer is obtained through time difference calculation.

Optionally, the detector 209 may also adopt an ultrasonic thickness measurement method, and the detector 209 includes an ultrasonic probe, and transmits a pulse wave to the polished wafer 10 through the detection channel 219 and receives a reflected wave from the polished wafer 10, so as to detect and output the thickness of the polished wafer 10.

Working principle/steps:

the second seat 101 and the first seat 201 are rotated by providing rotation power and lifting up and down through the rotating shaft, and different pressures are generated on the polishing piece 10 and the adsorption backing ring 206b by respectively injecting air pressures with various pressures into the pressurizing cavity 20 of the polishing piece 10 and the pressurizing cavity 20 of the retaining ring 203, so that the polishing pressure is controlled, and the polishing piece 10 is polished. If the polishing pad is pressed against the polishing pad only by the action of the pressurizing chamber, and the stress is concentrated on the edge part of the polishing pad, over-polishing can occur. After the pressurization in the pressurization cavity 20, the acting force of the pressure in the pressurization cavity 20 to the air bag 204 is transmitted to the adsorption pad bottom 206a, and the adsorption pad 206 bearing the polishing sheet 10 is pressed on the polishing pad for polishing; after the pressure is applied to the adjusting cavity 30, the adjusting sheet 216 transmits force to the first seat 201 due to the deformation, the lower first seat 201 transmits the force to the retaining ring 203 and the air bag 204 fixed on the first seat 201, and finally transmits the force to the adsorption pad ring 206b fixed on the air bag 204, the adsorption pad ring 206b has certain deformation capability, the pressure is transmitted to the polishing pad by the adsorption pad ring 206b, the problem of edge over-polishing of the polishing sheet 10 is reduced or solved, and the polishing quality of the polishing sheet 10 is improved.

As shown in fig. 14, the light beam emitter reaches the polishing sheet through the detection channel, the receiver receives the reflected light by the reflection of the laser from the upper surface and the lower surface of the polishing sheet, and outputs a time difference, the external computing device calculates a thickness value, which is the central thickness of the polishing sheet, compares the calculated central thickness value with a target value of the system process, and if the actual calculated value reaches the target value, the polishing is finished; otherwise, the polishing is continued until the calculated value reaches the target value.

The technical effects are as follows:

1. according to the polishing device, the detection channel is formed in the carrier body, the thickness of the polishing piece can be monitored in real time through the detection channel by the detector and fed back, a signal is fed back when the polishing piece reaches the set thickness, the polishing piece is prevented from being over polished, and the signal is fed back when the thickness of the polishing piece does not reach the set thickness, so that the polishing piece can be continuously polished; the polishing efficiency and the polishing yield are greatly improved, and unnecessary polishing solution and polishing pad waste is saved; the technical problem that the current polishing removal amount and polishing thickness of a system polishing piece cannot be fed back in real time in the prior art is solved; the technical effect of feeding back the thickness of the polished wafer in real time is achieved.

2. Through improving carrier body inside, set up the sense passage in carrier body inside to carry out the thickness measurement to throwing the piece through the sense passage, reduce the change of burnishing device structure itself, and can not cause the influence in order to improve polishing efficiency and polishing yield to the polishing process.

3. The air bag is fixed at the bottom of the first seat, the polishing piece is fixed at the bottom of the air bag and is pressed on the polishing pad by the first seat and the air bag for polishing, the pressurizing cavity which is directly contacted with the air bag is arranged in the first seat, and the acting force of the air bag on the polishing piece is adjusted by adjusting the air pressure in the pressurizing cavity, so that the interaction between the polishing piece and the polishing pad is adjusted, the stress action on the polishing piece is favorably controlled, and the flatness of the polishing piece is improved. The simplified structure not only enables the polishing piece to be pressurized more stably, improves the polishing quality of the polishing piece, but also improves the assembly performance and the maintainability, and reduces the time loss outside the processing caused by maintenance and the like.

4. The second seat is additionally arranged on the basis of the first seat, in order to improve the polishing quality of the polished wafer, the acting force of the edge part of the polished wafer is independently controlled, the acting force of the deformable adjusting sheet on the first seat is adjusted by adjusting the air pressure in the second seat, and the acting force is transmitted to the edge of the polished wafer through the transmission of the first seat, so that the polishing quality of the edge part of the polished wafer is improved, and the problem that the edge is too thin or too thick is solved.

5. The aligning plate sets up on the adjustment sheet, aligning plate self is deformable and set up convex through-hole on the aligning plate, atmospheric pressure sees through circular-arc through-hole effect on the adjustment sheet, the adjustment sheet is used in first seat top downwards, circular-arc through-hole is seted up on the aligning plate, make the aligning plate have certain bradyseism and anti deformation effect, receive under the condition of deformation at the aligning plate, drag the control each other between the circular-arc through-hole, make the tendency change that the aligning plate formed the original shape of recovery, produce vibrations during the polishing, can absorb certain vibrations through the aligning plate, improve the stability of whole effect, reduce vibrations and influence the polishing quality of throwing the piece.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A polishing carrier capable of on-line thickness measurement, comprising:

the carrier body, the carrier body is used for connecting throwing the piece, the carrier body includes:

a first seat;

the pressurizing assembly comprises an air bag, the air bag is fixedly arranged at one end of the first seat, and a first detection through hole is formed in the air bag;

the detection channel is arranged in the carrier body, the detection channel is arranged on a rotation central line of the first seat, and the first detection through hole is positioned below the detection channel; and

a thickness measurement assembly, the thickness measurement assembly comprising:

the detector is fixedly connected to the carrier body, so that the detector can send a detection signal to the polished wafer through the detection channel to detect the thickness of the polished wafer and output the thickness of the polished wafer.

2. The carrier of claim 1, wherein the detector comprises:

the light beam generator is arranged in the detection channel and used for emitting light beams to the polishing sheet;

and the light beam receiver is arranged in the detection channel and is used for receiving and outputting the reflected light beam of the polishing piece.

3. An inline thickness measurable polishing carrier as set forth in claim 1 wherein said sensing channel is located at the center of rotation of said carrier body.

4. The on-line thickness-measurable polishing carrier according to claim 2, wherein the pressing assembly further comprises:

the first detection through hole is formed in the air bag, so that the detector can detect the thickness of the polished section through the first detection through hole, and the air bag is used for bonding the polished section;

the pressurization cavity is arranged in the first seat, air pressure in the pressurization cavity acts on the air bag, and the acting force of the air bag on the throwing piece can be adjusted by adjusting the air pressure in the pressurization cavity.

5. The polishing carrier capable of measuring thickness on line according to claim 4, wherein the air bag is provided with a flange at the position of the first detection through hole, and the flange is attached to the inner wall of the detection channel.

6. The carrier of claim 4, wherein the plurality of pressurized chambers are provided, the top of the first seat is provided with a plurality of connectors, each pressurized chamber corresponds to one of the connectors, each connector is communicated with the corresponding pressurized chamber downwards, and the connectors are used for being connected with an external air source.

7. The carrier of claim 6, wherein the pressurizing chambers are uniformly distributed on the circumferential surface of the air bag.

8. The carrier of claim 4, further comprising an adsorption pad for carrying a polishing pad, wherein the adsorption pad comprises:

the adsorption pad bottom is fixedly arranged at the bottom of the air bag, a second detection through hole is formed in the adsorption pad bottom, and the second detection through hole is positioned below the first detection through hole, so that the detector can measure the thickness of the polished wafer through the first detection through hole and the second detection through hole;

the adsorption backing ring is fixedly arranged on the adsorption backing bottom, so that a bearing cavity with a downward opening is formed inside the adsorption backing ring, and the bearing cavity is used for bearing the polishing piece.

9. The on-line thickness measurable polishing carrier as in claim 4 further comprising:

a second seat positioned above the first seat and connected to the first seat;

an adjustment assembly, the adjustment assembly comprising:

the adjusting sheet is deformable, is positioned between the first seat and the second seat and is abutted against the top of the first seat;

the adjusting cavity is arranged in the second seat, air pressure in the adjusting cavity acts on the adjusting sheet, and the acting force of the adjusting sheet on the first seat can be adjusted by adjusting the air pressure in the adjusting cavity.

10. A polishing carrier as recited in claim 4, wherein a retaining ring is secured to a bottom edge of the first seat, and the bladder covers the retaining ring and the bottom of the first seat.