CN113747779A - Transport system for moving substrates and functional apparatus comprising the same - Google Patents

Transport system for moving substrates and functional apparatus comprising the same Download PDF

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Publication number
CN113747779A
CN113747779A CN202110574055.3A CN202110574055A CN113747779A CN 113747779 A CN113747779 A CN 113747779A CN 202110574055 A CN202110574055 A CN 202110574055A CN 113747779 A CN113747779 A CN 113747779A
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CN
China
Prior art keywords
transport
substrate
clamping
stop
cheek
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Granted
Application number
CN202110574055.3A
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Chinese (zh)
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CN113747779B (en
Inventor
克里斯托夫·阿贝勒
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ASMPT GmbH and Co KG
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ASM Assembly Systems GmbH and Co KG
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Publication of CN113747779A publication Critical patent/CN113747779A/en
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Publication of CN113747779B publication Critical patent/CN113747779B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0076Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069Holders for printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention relates to a transport system for moving a substrate, wherein the transport system comprises: a) two conveying cheeks spaced apart from each other, wherein each of the two conveying cheeks has: i. a conveyor having a guide, wherein the guide includes a guide section, ii a stop spaced from the guide and having a stop section; b) a clamping device with at least one clamping part, wherein the clamping part is transferred from the free position to the clamping position, and the edge area of the upper side of the substrate is at least partially arranged on the stopping section of the stopper of the first conveying cheek and/or the second conveying cheek in the two conveying cheeks by means of the elasticity of the at least one clamping part so as to fix the substrate.

Description

Transport system for moving substrates and functional apparatus comprising the same
Technical Field
The present invention relates to a transport system for moving a substrate and a functional apparatus having the transport system.
Background
Printed circuit boards are basic electronic components that are flat as substrates for mounting electrical or electronic components, such as resistors, transistors, diodes, etc. In manufacturing systems for processing printed circuit boards, for example chemical or thermal treatment, printing, assembly, soldering, inspection, testing, etc., the printed circuit boards are moved between processing stations for processing by means of a transport system and are fixed into the processing stations as required. In many devices, for example assembly devices, screen printing devices for printed circuit boards or inspection devices for inspecting circuit boards, the fastening of circuit boards (for example printed circuit boards) is very important for carrying out corresponding tasks.
Generally, the printed circuit boards are transported in the assembly plant along a linear transport path between two transport cheeks of a transport system. In particular by means of a conveyor belt driven by suitable rollers or toothed belts. Furthermore, the printed circuit boards each have narrow side bars, i.e. edge regions of the printed circuit boards, which rest on the conveyor belt on the respective sides of the conveying cheeks of the conveying system. One transport cheek can be fixedly mounted to the machine frame, for example to the base carrier, while the other transport cheek can additionally be adjustably arranged transversely to the transport direction by means of a linear drive with linear guides, in order to be able to guide printed circuit boards of different widths. During assembly of the printed circuit board, the printed circuit board is fixed by a jig. In order to fix the printed circuit boards in the assembly region of the transport path, the printed circuit boards with the respectively vertically movable side sections are generally pressed against the respective stops of the transport cheeks.
Disadvantageously, the narrow side bars of the printed circuit board abutting against the respective side are only insufficiently fixed, since the sides are vertically movable. For example, the narrow side strips abutting against the respective side and/or the side may have uneven portions, such as bulges, so that during the assembly process the printed circuit board, in particular a heavy-duty printed circuit board, is insufficiently fixed, in particular only along the narrow side strips abutting against the respective side at several unknown locations. Furthermore, the side portions cannot exert a sufficiently large force for fixing. Thus, during assembly, printed circuit boards, especially heavy-duty printed circuit boards, may shift or slip due to the assembly and the assembly of electrical or electronic components to the printed circuit boards is not precise, especially in error.
Disclosure of Invention
It is an object of the present invention to at least partly overcome the above-mentioned disadvantages in a transport system. The object of the invention is in particular to fix substrates, preferably printed circuit boards, in particular heavy-duty printed circuit boards, particularly advantageously, or to be able to process, in particular assemble, substrates, preferably printed circuit boards, in particular heavy-duty printed circuit boards, particularly accurately.
The solution of the invention to achieve the object is a transport system with the features of claim 1 and a functional device with the features of claim 14. Further features and details of the invention are disclosed in the dependent claims, the description and the drawings. In the present invention, the features and details described in connection with the transport system according to the invention are of course also applicable in connection with the functional device according to the invention and vice versa, so that all references or can be made to each other in so far as the various aspects of the invention are disclosed.
According to a first aspect, the invention is directed to a transport system for moving substrates, in particular printed circuit boards, in a functional device, in particular a placement device, for processing the substrates, in particular the printed circuit boards, each having an upper side and a lower side opposite the upper side. The transport system comprises two transport cheeks spaced apart from each other for guiding the substrate, in particular the printed circuit board, between the two transport cheeks, wherein each of the two transport cheeks has a transport device with a guide element for guiding the substrate, in particular the printed circuit board, at least partially in a transport direction, wherein the guide element comprises a guide section for at least partially arranging an edge region of an underside of the substrate, in particular the printed circuit board. In addition, each of the two transport cheeks also has a stop which is arranged between the two transport cheeks, is spaced apart from the guide and has a stop section opposite the guide section of the guide. The transport system furthermore comprises a clamping device having at least one clamping element, wherein the at least one clamping element is designed to exert a spring force, and wherein, by the transfer of the clamping element from the free position into the clamping position, the substrate, in particular the upper edge region of the printed circuit board, is arranged at least partially by the spring force on a stop section of a stop of the first transport cheek and/or of the second transport cheek of the two transport cheeks in order to fix the substrate, in particular the printed circuit board.
Functional devices are in particular devices in which the substrate to be treated is at least temporarily fixed. The functional device is preferably a mounting device for mounting, for example, electrical or electronic components or parts to a substrate, in particular a printed circuit board. In addition, the functional device can also be a printing device, for example a screen printing device for printing substrates, and/or an inspection device for inspecting substrates or printed circuit boards and/or a soldering device for soldering (soldering), for example for soldering electrical components to printed circuit boards.
The substrate is in particular a plate-like body, preferably a printed circuit board. Printed circuit boards are in particular carriers for electrical and/or electronic components or assemblies. A printed circuit board may also be understood as a circuit card, circuit board or printed circuit. The processing of the substrate, preferably a printed circuit board, is in particular a chemical or thermal treatment, printing, assembly, soldering, inspection, testing and/or the like.
In the following, only one transport cheek will be discussed in part, wherein the contents apply logically to the first of the two transport cheeks and/or to the second of the two transport cheeks.
The transport cheeks may be of plate-like construction. The two spaced-apart transport cheeks are preferably arranged parallel or substantially parallel to one another. Furthermore, the distance between two transport cheeks spaced apart from one another is particularly adjustable. Thus, the transport system and the functional equipment can be used to move or process substrates of different widths. The transport cheeks may also have an outer side and an inner side facing away from the outer side. The inner side of the first transport cheek and the inner side of the second transport cheek are in particular opposite one another. The conveying means of the conveying cheeks are preferably arranged or configured inside the conveying cheeks. The guide and the stop in particular together form a gap in or on the transport cheek for guiding the substrate, wherein the gap preferably extends in the transport direction. The gap may be constituted by a recess in the transport cheeks. The recess may be a groove in the transfer cheek. Furthermore, the gap can be formed by a guide arranged inside the transport cheeks, for example a roller drive with a conveyor belt, and a projection formed inside the transport cheeks, in particular above the guide, such that the guide and the projection form the gap. In addition, the guide, in particular the guide section of the guide, and/or the stop, in particular the stop section of the stop, are preferably arranged in the upper region of the transport cheek, in particular in the upper third. In this way, at least one clamping element, for example a U-shaped clamping element, can be arranged particularly advantageously in the clamping position with the upper side of the substrate at least partially on the stop section of the stop of the transport cheek. The U-shaped clamp may press the upper side of the substrate against the stop by pressing the lower side of the substrate from below, i.e. from below the substrate.
The edge region of the underside of the substrate is arranged at least in part, in particular frictionally, on the guide section of the guide, wherein the frictional connection between the guide and the substrate is preferably achieved by the weight of the substrate. In addition, in particular only in the free position of the at least one clamping element, the edge region of the underside of the substrate can be arranged at least partially on the guide section of the guide. In other words, the underside of the substrate can be disengaged from the guide section of the guide when the clamp is transferred from the free position to the clamped position. At least one clamp can lift the substrate off the guide and press it against the stop. This makes the fixing of the substrate particularly easy. It is also conceivable that, in particular in the free position and the clamped position of the at least one clamping element, the edge region of the underside of the substrate is arranged at least partially on the guide section of the guide element. For this purpose, the guide and/or the stop can be moved perpendicular to the conveying direction, wherein the guide and the stop are preferably moved towards each other when the at least one gripper is transferred from the free position into the gripping position. In other words, both the substrate can be at least partially (pre-) fixed by the guides and the stops and the substrate can be (additionally) fixed by means of the spring force by at least one clamping member of the clamping device. In this way, the substrate can be held in a particularly defined and particularly powerful manner by the at least one holding element.
The guide section of the guide can be of a planar or substantially planar design, so that the substrate can be arranged particularly advantageously on the guide section. The stop section opposite the guide section is preferably also of flat or substantially flat design, so that the substrate can be arranged particularly advantageously on the stop section in the clamping position. In particular, the stop section and the guide section are parallel to each other.
An edge region of a substrate, in particular of a printed circuit board, is to be understood as a part of the substrate, in particular of the printed circuit board, in which, for example, electrical and/or electronic components are not arranged. The edge region of the substrate is in particular two opposite narrow outer edge strips of the substrate, which are guided in the transport system between guides and stops of the first transport cheek or of the second transport cheek. The region of the substrate, in particular of the printed circuit board, between two opposite side strips can be understood to be, for example, an electronics region of the substrate, in particular of the printed circuit board, in which electronics region electrical and/or electronic components and the like can be arranged on the upper side and/or the lower side of the substrate, in particular of the printed circuit board.
The free position of the at least one gripper is in particular a position of the at least one gripper in which the at least one gripper does not at least partially arrange or press the edge region of the upper side of the substrate against a stop section of a stop of the first transport cheek and/or the second transport cheek of the two transport cheeks. Preferably, the at least one clamping element does not touch the substrate in the free position, in particular does not touch the underside of the substrate. In other words, the part of the at least one clamping element which, in the clamping position of the at least one clamping element, touches the substrate, in particular the underside of the substrate (i.e. is in contact with the substrate), is spaced apart from the substrate in the free position. In this way, in the free position of the at least one gripper, the substrate can be arranged and guided at least partially on the guide section of the guide, in particular moved in the transport direction.
The clamping position of the at least one clamping element is in particular the position of the at least one clamping element at which the at least one clamping element at least partially arranges or presses the edge region of the upper side of the substrate against the stop section of the stop of the first transport cheek and/or the second transport cheek of the two transport cheeks. The edge region of the upper side of the substrate is arranged at least in sections, in particular in a frictional connection, on the stop section of the stop of the first and/or second transport cheek, wherein the frictional connection between the stop section and the upper side of the substrate is realized (mainly) by the spring force of the clamping element. Furthermore, the at least one clamping element can advantageously also have a plurality of clamping positions, wherein in particular the spring force exerted by the at least one clamping element depends on the clamping position. Thereby, the clamping member may exert a sufficiently large spring force, for example, depending on the weight of the substrate. Thus, a single transport system can be utilized to adequately hold and process substrates of different weights.
The clamping member is preferably made of spring steel. The spring force of the at least one gripper acts in particular on the underside of the substrate and preferably in the direction from the underside of the substrate to the upper side of the substrate, in particular from the guide section of the transport cheek to the stop section of the transport cheek. This makes it possible to fix the substrate with a particularly high spring force. Advantageously, the spring force of the at least one gripper acts on the underside of the substrate in the edge region of the substrate and preferably in the direction from the guide section of the transport cheek to the stop section of the transport cheek. Preferably, the spring force acts perpendicularly or substantially perpendicularly to the stop section. This makes it possible to fix the substrate to the stop segment with a particularly high spring force. While preventing the occurrence of a lever effect and preventing the substrate associated therewith from being bent or deformed. Furthermore, the at least one clamping element is preferably designed in the clamping position such that the at least one clamping element does not project into the electronics region of the substrate, in particular of the printed circuit board. This prevents damage to the substrate, in particular to the underside of the printed circuit board, and/or to electrical and/or electronic components arranged, for example, on the substrate, in particular on the underside of the printed circuit board.
With the transport system according to the invention, it is possible to fix substrates, in particular printed circuit boards, particularly advantageously for example printed circuit boards for processing, in particular assembling, electrical and/or electronic components. For this purpose, the substrate, in particular the printed circuit board, can be moved or transported in a processing region of the transport system, for example via a conveyor belt. The transport system may have two transport cheeks spaced apart from one another and a holding device at least in the treatment region. If the substrate, in particular the printed circuit board, is located in the processing region, the movement of the substrate, in particular the printed circuit board, in the transport direction can be stopped, i.e. the substrate, in particular the printed circuit board, is in the rest position. Subsequently, by transferring the gripper elements from the free position into the gripping position, the edge region of the upper side of the substrate, in particular the printed circuit board, can be arranged at least partially on the stop section of the stop of the first transport cheek and/or the second transport cheek of the two transport cheeks by means of the spring force of the at least one gripper element in order to fix the substrate, in particular the printed circuit board. The substrate, in particular a printed circuit board, can be particularly advantageously fixed by the spring force of the at least one clamping element. The force, in particular the spring force, with which the substrate, in particular the printed circuit board, is arranged on the stop element can be particularly high, whereby the static friction between the upper side of the substrate, in particular the printed circuit board, preferably the substrate or the printed circuit board, and the stop element, in particular the stop section of the stop element, is also particularly high. This prevents twisting and/or displacement of the substrate, in particular of the printed circuit board, between the transport cheeks. It is also possible to firmly fix a heavy-duty substrate, particularly a printed circuit board.
It may be advantageous if, in the transport system according to the invention, at least one gripper is at least partially elastically deformable, wherein the gripper is at least partially elastically deformed to fix the substrate by applying an elastic force by the gripper being transferred from the free position to the gripping position. The at least one partially elastically deformable holding element may in particular have at least one elastically deformable section. The elastically deformable section can, for example, have a spring and/or a bending region with a U-shaped clamp. The elastically deformable section may also be compressible and/or bendable, wherein the elastically deformable section compresses and/or bends in the clamping position. The elastically deformable section can compress and/or bend when the at least one at least partially elastically deformable clamping member is transferred from the free position to the clamped position, and thereby exert a spring force to secure the substrate. The at least one clamp may also have at least one force transfer section for transferring or transferring the spring force to the substrate. The elastically deformable section may further be arranged between at least two force transmission sections.
Advantageously, in the transport system according to the invention, the clamping device can have at least one clamping element and at least one second clamping element, wherein the upper-side edge region of the substrate is arranged at least partially on the stop section of the stop element of the first transport cheek for fixing the substrate by means of the spring force of the at least one first clamping element in the clamping position, and wherein the upper-side edge region of the substrate is arranged at least partially on the stop section of the stop element of the second transport cheek for fixing the substrate by means of the spring force of the at least one second clamping element in the clamping position. This makes it possible to fix the substrate particularly advantageously and to reduce the risk of twisting and/or displacement of the substrate. Here, the at least one clamping element can be understood as at least one first clamping element. Preferably, the at least one first gripper is arranged on the first transport cheek and the at least one second gripper is arranged on the second transport cheek, wherein in particular the at least one first gripper and the at least one second gripper exert an elastic force independently of each other for fixing the substrate.
Particularly advantageously, in the transport system according to the invention, the gripping device can have a lifting element which can be moved in the lifting direction between a zero position and at least one lifting position, wherein in at least one lifting position of the lifting element the at least one gripping element is transferred into the gripping position. The lifting direction is in particular the direction from the guide or guide section to the stop or stop section and is preferably perpendicular or substantially perpendicular to the conveying direction. In the zero position of the lifting element, the at least one clamping element is preferably in a free position. In addition, the lifting element is preferably arranged below the two transport cheeks, so that the at least one gripper can particularly easily press the upper side of the substrate against the stop element by pressing the lower side of the substrate from below (i.e. from below the substrate). The lifting element may further have a plate-like shape, and in particular the first transport cheek is perpendicular or substantially perpendicular to the movable plate-like lifting element and/or the second transport cheek is perpendicular or substantially perpendicular to the movable plate-like lifting element. Furthermore, the lifting member may have at least two lifting positions, at which the at least one gripper is respectively transferred to the gripping position to hold the substrate. In particular, the at least one clamping element can have mutually different spring forces in at least two lifting positions of the lifting element or in the respective clamping position. In this way both the light substrate and the heavy substrate can be advantageously fixed using at least one clamp. The lifting member may also have at least two lifting sections, wherein one of the two lifting sections transfers at least a first clamp to the clamping position and a second of the at least two lifting sections transfers at least a second clamp to the clamping position. This makes it possible to fix the substrate particularly advantageously.
According to a further preferred embodiment, in the transport system according to the invention, the at least one gripper can be arranged on the lift. Advantageously, the arrangement of the at least one clamping element on the lifting element, in particular on a movable plate-shaped lifting element, can be realized particularly easily. The at least one clamping element is arranged in particular stationary on the lifting element. For example, the at least one clamp can be arranged, preferably screwed, to a lift, in particular a movable plate-like lift, on the upper side of the underside facing the substrate. It is also conceivable that at least one clamping element is displaceably arranged on the lifting element. If the clamping device has at least one first clamping part and at least one second clamping part, the at least one first clamping part can be arranged in a stationary manner on the lifting element and the at least one second clamping part can be arranged displaceably on the lifting element, or vice versa. In this way, it is also ensured that substrates of different widths can be processed by the two transport cheeks being spaced apart from one another and the distance between them being adjustable in such a way that, in the clamping position, the upper edge region of the substrate is arranged at least partially by means of the spring force on the stop section of the stop of the first transport cheek and/or the second transport cheek of the two transport cheeks in order to fix the substrate.
It may be advantageous if, in the transport system according to the invention, at least one gripper is arranged, in particular at least partially, on a first transport cheek and/or a second transport cheek of the two transport cheeks. The at least one gripping member may be arranged at least on the inner side and/or on the outer side of the first transport cheek and/or of the second transport cheek. The at least one gripper is preferably arranged, for example screwed, onto the respective outer side of the first and/or second transport cheeks. Advantageously, the outer sides of the two transfer cheeks are particularly accessible. It is also conceivable that the at least one gripper is for example arranged, for example screwed, onto the respective inner side of the first and/or second transport cheek. The conveying system can thus be designed particularly compact. If the holding device has at least one first holding element and at least one second holding element, the at least one first holding element can be arranged on the first transport cheek, in particular on the inner side and/or on the outer side of the first transport cheek, and the at least one second holding element can be arranged on the second transport cheek, in particular on the inner side and/or on the outer side of the second transport cheek, or vice versa. In this way, by means of the two transport cheeks being spaced apart from one another and the distance between them being adjustable, it is also possible in a particularly simple manner to ensure that substrates of different widths can be processed in such a way that, in the clamping position, the upper edge region of the substrate is arranged at least partially by means of the spring force on the stop section of the stop of the first transport cheek and/or of the second transport cheek in the two transport cheeks in order to fix the substrate. Advantageously, the at least one gripper does not have to be arranged on the transport cheeks in a non-displaceable manner in order to exert a spring force for fixing at the edge regions thereof for substrates of different widths.
Advantageously, in the transport system according to the invention, the at least one gripper, in particular the at least first gripper and/or the at least second gripper, can be configured in the transport system such that the end of the at least one gripper, in particular the at least first gripper, facing the stop of the first transport cheek is, in the free position, below the guide section of the guide of the first transport cheek and/or such that the end of the at least one gripper, in particular the at least second gripper, facing the stop of the second transport cheek is, in the free position, below the guide section of the guide of the second transport cheek. Preferably, the end of the at least one (first) gripper facing the stop of the first transport cheek and/or the end of the at least one (second) gripper facing the stop of the second transport cheek do not touch the substrate in the free position of the at least one (first or second) gripper. This ensures that the substrate is not damaged when it is transported in the transport direction between the two transport cheeks. In particular, the end of the stop of the at least one (first or second) gripper facing the first transport cheek or the second transport cheek is substantially at the level of the guide section of the guide of the first transport cheek or the second transport cheek, without touching the substrate. The transfer of the at least one (first or second) clamping element from the free position into the clamping position can be carried out particularly quickly. The end of the at least one (first or second) clamping member is in particular a part or partial region of the at least one (first or second) clamping member which, in the clamping position of the at least one (first or second) clamping member, touches or contacts the substrate. For example, the end of at least one (first or second) clamp may be the end of a U-shaped clamp, wherein the end of the U-shaped clamp is pressed against the stop from below, i.e. from below the substrate.
Particularly advantageously, in the transport system according to the invention, the at least one gripper, in particular the at least first gripper and/or the at least second gripper, can be configured in the transport system such that the end of the at least one gripper, in particular the at least first gripper, facing the stop of the first transport cheek is at least in the gripping position substantially opposite the stop section of the stop of the first transport cheek and/or the end of the at least one gripper, in particular the at least second gripper, facing the stop of the second transport cheek is at least in the gripping position substantially opposite the stop section of the stop of the second transport cheek. In particular, the spring force of the at least one gripper, in particular of the at least one first gripper or second gripper, can act perpendicular or substantially perpendicular to the stop section of the first transport cheek and/or perpendicular or substantially perpendicular to the stop section of the second transport cheek. This makes it possible to fix the substrate to the stop segment with a particularly high spring force. Furthermore, it is possible to prevent the lever effect from occurring and to prevent the substrate, in particular the printed circuit board, associated therewith from bending or deforming. This enables a particularly precise processing of the fixed substrate, in particular the assembly of the fixed printed circuit board.
According to a further preferred embodiment, in the transport system according to the invention, at least one of the clamping elements can have a U-shaped configuration, wherein a first leg of the U-shaped clamping element is arranged on the outer side and/or on the inner side facing away from the outer side of one of the two transport cheeks and a second leg of the U-shaped clamping element is located below the substrate and between the two transport cheeks of the transport system. If the clamping device has at least one first clamping member and at least one second clamping member, the at least one first clamping member can be of a U-shaped configuration and/or the at least one second clamping member can be of a U-shaped configuration. In particular, the respective first legs of the U-shaped first and second gripping members may be arranged on the outer side and/or on the inner side facing away from the outer side of the first or second transport cheek and vice versa, and the respective second legs of the U-shaped first or second gripping members are located below the substrate and between the two transport cheeks of the transport system. Preferably, the second leg of the U-shaped clamp is movable in a direction from the guide section to the associated stop section. The second leg may be flexed to apply a spring force to secure the substrate when the second leg is moved. The U-shaped clamp may in particular be partially plate-like or substantially plate-like in configuration. For example, the U-shaped clamp may be made of spring steel plate.
It may be advantageous if, in the transport system according to the invention, the second leg of the U-shaped clamp has at least one bending region for at least partially elastically deforming at least the second leg of the clamp. The U-shaped clamp may in particular be configured with a bent edge in at least one bending region, at which the second leg bends when the clamp is transferred from the free position into the clamping position, in order to exert a spring force for fixing the substrate. When the clamp is returned from the clamping position to the free position, the U-shaped clamp, in particular the second leg, resumes its original shape.
Advantageously, in the transport system according to the invention, the U-shaped clamp may have a base for connecting the first and second legs, wherein the angle between the first leg and the base in the clamping position of the clamp is larger than the angle in the free position of the clamp. The first leg, the base and the second leg may each have a plate-like or substantially plate-like configuration, in particular the first leg and the second leg are substantially parallel to each other at least in the free position. Furthermore, in the free position of the clamping element, the angle between the first clamping leg and the base is preferably greater than 100 °, in particular greater than 100 ° and less than 120 °. In the clamping position of the clamping member, the angle between the first clamping leg and the base is preferably greater than/equal to 90 °, in particular greater than/equal to 90 ° and less than 110 °. The substrate can be particularly easily fixed by means of such a U-shaped clamp.
According to a further preferred embodiment, in the transport system according to the invention, the clamping device can have at least two clamping elements arranged one behind the other at least along one of the two transport cheeks, so that in the clamping position of the at least two clamping elements arranged one behind the other, the edge region of the upper side of the substrate is arranged at least partially along the stop section of the stop of the first transport cheek and/or of the second transport cheek. At least two clamping elements arranged one behind the other are arranged on the conveying system, in particular at a distance from one another in the conveying direction. Preferably, the clamping device has one of the at least two clamps arranged one after the other at the front end of the transport system or the substrate and the other of the at least two clamps at the rear end of the transport system or the substrate, which is opposite to the front end of the transport system or the substrate. This makes it particularly advantageous to secure the substrate to the front and rear ends, while minimizing the risk of substrate slippage and/or displacement. It is also conceivable for the clamping device to have several clamping elements arranged one behind the other at least along one of the two transport cheeks, so that in the clamping position of the several clamping elements arranged one behind the other, the edge region of the upper side of the substrate is arranged at least partially along the stop section of the stop of the first transport cheek and/or of the second transport cheek. The edge region of the upper side of the substrate can thereby be arranged at least partially along the stop section of the stop of the first and/or second transport cheek by means of the respective spring force of the plurality of clamping elements. By means of several grippers, irregularities such as bumps or depressions along the edge region of the substrate and/or irregularities of the stop section of the stop of the first and/or second transport cheeks can be taken into account. The printed circuit board may, for example, have recesses or weakenings in order to be able to divide the printed circuit board into individual printed circuit board sections in a simplified manner in one process step. Furthermore, the number of immobilization points, in particular the number of independent immobilization points, can advantageously be amplified. Thereby, it is possible to process the short substrates and the long substrates particularly advantageously by means of the same transport system. In addition, several clamps arranged one behind the other are in particular spaced apart from one another uniformly. Furthermore, the clamping device preferably has at least two (first) clamping elements arranged one behind the other along the first transport cheek, so that the upper edge region of the substrate is arranged at least partially along the stop section of the stop of the first transport cheek on the stop section, and/or preferably has at least two (second) clamping elements arranged one behind the other along the second transport cheek, so that the upper edge region of the substrate is arranged at least partially along the stop section of the stop of the second transport cheek on the stop section. This can be particularly advantageous for the fixing of the substrate.
It can be advantageous if, in the transport system according to the invention, at least two grippers arranged one behind the other overlap. At least two clamps arranged one behind the other may overlap at least in some areas, in particular at least at the respective ends of at least two clamps arranged one behind the other. The ends are in particular respective partial regions of at least two clamping elements arranged one behind the other, which partial regions touch or contact the substrate in the clamping position. For example, at least two clamps arranged one behind the other can each have a U-shaped configuration, wherein the second legs of the respective U-shaped clamps are also of trapezoidal configuration and the respective long bottom edges of the trapezoidal clamps overlap. This makes it possible to carry out the fixing of the substrate particularly advantageously.
According to a second aspect, the invention relates to a functional device, in particular a placement device, for processing a substrate, in particular a printed circuit board, wherein the functional device, in particular the placement device, comprises a functional head, in particular a placement head. In addition, the functional device, in particular the assembly device, comprises a transport system according to the invention.
The functional device according to the second aspect of the invention has the same advantages as already described for the transmission system according to the first aspect of the invention.
Drawings
Further developments of the invention are described with reference to the following description of the various embodiments of the invention which are schematically illustrated in the drawings. All the features and/or advantages derived from the claims, the description or the drawings, including structural details, spatial arrangements and method steps, are essential technical features of the invention, both individually and in various combinations. It is noted, therefore, that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the invention in any way.
Fig. 1 shows a front view of an embodiment of the transport system according to the invention with at least one gripper in a free position.
Fig. 2 shows a front view of the embodiment shown in fig. 1 with at least one clamp in a clamping position.
Fig. 3 shows a longitudinal section of an embodiment of the clamping device or at least one clamping piece in a free position FP.
Fig. 4 shows a longitudinal section of an embodiment of the clamping device or at least one clamping piece in a free position FP.
Fig. 5 shows a front view of an embodiment of the transport system according to the invention with at least one gripper in a free position.
Fig. 6 shows a front view of the embodiment of fig. 5 with at least one clamp in a clamping position.
Figure 7 shows a detailed top view of the overlapping clamps of figure 4.
Fig. 8 shows an embodiment of the functional device according to the invention.
Description of reference numerals:
1 substrate
3 underside of substrate
5 upper side of the substrate
7a, 7b substrate underside edge region
20a first conveying cheek
22a transport device
23a guide
24a guide segment
27a stop
28a stop section
20b second conveying cheek
22b conveying device
23b guide member
24b guide section
27b stop
28b stop section
40 clamping device
42. 42a, 42b clamp
Free position of FP clamp
Clamping position of KP clamping piece
43a, 43b ends of the clamps
45 lifting element
Zero position of NP lift
Lifting position of HP lifter
Lifting direction of HR lifting member
First clamping leg of S1U-shaped clamping piece
Second leg of S2U-shaped clamp
B U shaped clamp base
Angle alpha
BB1, BB2 bending region
100 transport system
200 function device
202 functional head
TR transfer direction.
Detailed Description
In the following figures, the same reference numerals are used for the same technical features of the different embodiments.
Fig. 1 and 2 show a front view of an embodiment of a transport system 100 according to the invention, respectively, the at least one gripper member 42a and the at least one second gripper member 42b of the gripper device 40 both being in the free position FP in fig. 1 and both being in the gripping position KP in fig. 2. Fig. 3 and 4 show a longitudinal section through an embodiment of the clamping device 40 or the clamping piece 42a in the free position FP, respectively. The at least one clamping element 42a is also understood here as the at least one first clamping element, and vice versa. The conveyor system 100 also has two conveyor cheeks 20a and 20b spaced from each other. Each of the two transport cheeks 20a and 20b has a transport device 22a or 22b with a guide 23a or 23b for at least partially guiding the substrate 1 in the transport direction TR, wherein the guide 23a or 23b comprises a guide section 24a or 24b for at least partially arranging an edge region 7a or 7b of the underside 3 of the substrate 1. Each of the two transport cheeks 20a and 20b also has a stop 27a or 27b, which is arranged between the two transport cheeks 20a and 20b, is spaced apart from the guide 23a or 23b and has a stop section 28a or 28b opposite the guide section 24a or 24b of the guide 23a or 23 b. The gripping device 40 also has, for example, a plate-like lifting member 45 which is movable in the lifting direction HR between a zero position NP and at least one lifting position HP. In the zero position NP of the lifting element 45, the at least one first clamping element 42a and the at least one second clamping element 42b are in a free position FP. As shown in fig. 2, by moving the lift 45 from the zero position NP to the lift position HP, the at least one first gripper 42a and the at least one second gripper 42b may be respectively shifted to the gripping positions KP. The lifting direction HR is the direction from the guide 23a or the guide section 24a to the stop 27a or the stop section 28a and is preferably perpendicular or substantially perpendicular to the conveying direction TR. In addition, the lifting element 45 is arranged below the two transport cheeks 20a, 20b, so that the at least one first and second clamping element 42a, 42b can particularly easily press the upper side 5 of the substrate 1 against the respective stop 27a or 27b, in particular against the respective stop section 28a or 28b, by pressing the lower side 3 of the substrate 1 from below (i.e. from below the substrate 1). In fig. 1 and 2, the at least one first clip 42a and the at least one second clip 42b are each, for example, of U-shaped configuration. The first leg S1 of the at least one first gripper 42a is arranged outside the first transport cheek 20a and the second leg S2 of the at least one first gripper 42a is located below the substrate 1 between the two transport cheeks 20a, 20b for fixing the edge region 7a of the upper side 5 of the substrate 1. Likewise, the first leg S1 of the at least one second gripper 42b is arranged outside the second transport cheek 20b, and the second leg S2 of the at least one second gripper 42b is located below the substrate 1 and between the two transport cheeks 20a, 20b for fixing the edge region 7b of the upper side 5 of the substrate 1. The corresponding base B connects the first leg S1 and the second leg S2 of the first clip 42a or the second clip 42B. The first leg S1, base B, and second leg S2 may each be of plate-like or substantially plate-like configuration and made of spring steel plate. In the free position FP of at least the first gripper 42a or the second gripper 42b, the extremity 43a of the second leg S2 of at least one first gripper 42a facing the stop 27a of the first transport cheek 20a and the extremity 43b of the second leg S2 of at least one second gripper 42b facing the stop 27b of the second transport cheek 20b do not touch the substrate 1. By moving the lifting member 45 in the lifting direction HR, the respective second leg S2 of the at least one first clamp 42a and the at least one second clamp 42B and the respective base B move in the direction of the respective stop 27a or 27B and the respective angle α between the first leg S1 and the base B decreases. By moving the respective second leg S2 in the direction of the respective stop 27a or 27b, the substrate 1 is also moved, in particular lifted, in the direction of the respective stop 27a or 27b until the upper side 5 of the substrate touches the respective stop section 28a or 28 b. If the lift 45 is now moved further in the lifting direction HR, the respective second legs S2 of the at least one first clip 42a and the at least one second clip 42b are at least partially elastically deformed, in particular bent in the bending regions BB1 or BB2, so that a spring force is exerted to fix the substrate 1. As can also be seen from fig. 2, the at least one first gripper 42a and the at least one second gripper 42b in the transport system 100 are configured such that the end 43a of the at least one first gripper 42a facing the stop 27a of the first transport cheek 20a is substantially opposite to the stop section 28a of the stop 27a of the first transport cheek 20a in the gripping position KP and such that the end 43b of the at least one second gripper 42b facing the stop 27b of the second transport cheek 20b is substantially opposite to the stop section 28b of the stop 27b of the second transport cheek 20b in the gripping position KP. This makes it possible to fix the substrate 1 to the respective stop section 28a or 28b with a particularly high spring force. Furthermore, the occurrence of the lever effect can be prevented, and the substrate 1 associated therewith can be prevented from being bent or deformed. At the end of the at least one clamp, in particular at the end 43a of the at least one first clamp 42a and at the end 43b of the at least one second clamp 42b, a protection can also be arranged for protecting the underside 3 of the substrate 1 from damage by the at least one clamp, in particular for protecting the underside 3 of the substrate 1 from damage by the clamps 42a and 42 b. The protective element may in particular be an edge protection element. The edge protector may be of U-shaped configuration. The protection is also in particular a rubber-like protection.
Fig. 3 shows a longitudinal section through the holding device 40, which holding device 40 has several holding parts 42a arranged one behind the other along the first transport cheek 20a, for arranging the edge region 7a of the upper side 5 of the substrate 1 at least partially along a stop section 28a of a stop 27a of the first transport cheek 20a at a holding position KP (not shown in the present figures; see fig. 2) of the several holding parts 42a arranged one behind the other on this stop section 28 a. Correspondingly, the gripping device 40 can also have several gripping elements 42b arranged one after the other along the second transport cheek 20 b. By means of the plurality of grippers 42a, it is possible to take into account irregularities (for example bumps) along the edge region 7a of the substrate 1 and/or irregularities of the stop section 28a of the stop 27a of the first transport cheek 20a for fixing. At the chucking position KP (not shown in the figure; see fig. 2), the plurality of chucking members 42a exert elastic forces independently of each other to hold the substrate 1. This advantageously allows the number of immobilization points, in particular the number of independent immobilization points, to be amplified. Fig. 3 also shows several clamping elements 42a arranged one behind the other, in particular at a uniform distance from one another. If the lifting element 45 is moved in the lifting direction HR, the respective second legs S2 of several grippers 42a arranged one after the other are at least partially elastically deformed, in particular bent in the bending region BB1, so that each of the several grippers 42a exerts an elastic force to hold the substrate 1. As can also be seen from fig. 3, horizontally extending curved edges are formed in the respective curved regions BB1 of several clamping elements 42 a. When the several clamping pieces 42a are transferred from the free position FP to the clamping position KP, the respective second leg S2 is bent at the bent edge (dash-dot line), in particular substantially at the bent edge, in order to exert a spring force.
Similar to fig. 3, fig. 4 shows a longitudinal section through the holding device 40, which holding device 40 has several holding parts 42a arranged one behind the other along the first transport cheek 20a, for arranging the edge region 7a of the upper side 5 of the substrate 1 at least partially along the stop section 28a of the stop 27a of the first transport cheek 20a at a holding position KP (not shown in the present figure; see fig. 2) of the several holding parts 42a arranged one behind the other. Correspondingly, the gripping device 40 can also have several gripping elements 42b arranged one after the other along the second transport cheek 20 b. In contrast to fig. 3, the gripping members 42a arranged one after the other along the first conveying cheeks 20a at least partially overlap. Fig. 7 shows a detailed top view of the respective ends 43a of several grippers 42a arranged one behind the other, which ends overlap at least partially in fig. 4. In particular, the gripping elements 42a arranged one after the other along the first conveying cheeks 20a overlap at least at the respective ends 43a of several gripping elements 42a arranged one after the other. The end 43a is here a respective partial region of several clamping elements 42a arranged one behind the other, which partial region touches or contacts the substrate 1 in the clamping position KP (not shown in the present figure). In fig. 4, for example, the respective second legs S2 of the U-shaped clamping elements 42a arranged one behind the other have a trapezoidal configuration, wherein the respective long base edges of the trapezoidal clamping elements 42a overlap. This prevents that, if the clamp 42a is not used to fix the substrate 1 because, for example, the substrate 1 to be processed is shorter than the clamp 40 or the entirety of several clamps 42a, the clamp 42a does not move to the clamp position KP along the front or rear edge of the substrate 1 when moving the clamp 42a from the free position FP. Damage to the front edge and/or the rear edge of the substrate 1 can thereby be prevented. The leading edge and the trailing edge are to be understood in particular as side edges of the substrate 1 extending from the first transport cheek 20a to the second transport cheek 20 b.
Fig. 5 and 6 show a front view of another embodiment of a transport system 100 according to the invention, respectively, with at least one gripper member 42a and at least one second gripper member 42b of the gripper 40 both in a free position FP in fig. 5 and in a gripping position KP in fig. 6. The at least one clamping element 42a is also understood here as the at least one first clamping element, and vice versa. In fig. 5 and 6, in contrast to fig. 1 and 2, at least one first clamping piece 42a and at least one second clamping piece 42b are each arranged on a lifting piece 45, and the at least one first clamping piece 42a and the at least one second clamping piece 42b are each, by way of example, of an L-shaped configuration. Here, the at least one first clip 42a and the at least one second clip 42b also have bending regions BB1 and BB2, respectively. Here, by moving the lifting member 45 in the lifting direction HR, the respective legs of the at least one first clamp 42a and the at least one second clamp 42b may be at least partially elastically deformed, in particular bent in the bending region BB1 or BB2, thereby exerting an elastic force to fix the substrate 1.
Fig. 8 shows an embodiment of a functional apparatus 200 for processing a substrate according to the invention, wherein the functional apparatus 200 comprises a transport system 100 according to the invention and a functional head 202.

Claims (14)

1. A transport system (100) for moving substrates (1) within a functional apparatus (200) for processing substrates (1), the substrates (1) each having an upper side (5) and a lower side (3) opposite to the upper side (5), wherein the transport system (100) comprises:
a) two transport cheeks (20a, 20b) spaced apart from each other for guiding the substrate (1) between the two transport cheeks (20a, 20b), wherein each of the two transport cheeks (20a, 20b) comprises:
i. a conveying device (22a, 22b) having a guide (23a, 23b) for at least partially guiding the substrate (1) in a conveying direction (TR), wherein the guide (23a, 23b) comprises a guide section (24a, 24b) for at least partially arranging an edge region (7a, 7b) of the underside (3) of the substrate (1),
a stop (27a, 27b) arranged between the two transport cheeks (20a, 20b), spaced from the guide (23a, 23b) and having a stop section (28a, 28b) opposite to the guide section (24a, 24b) of the guide (23a, 23 b);
b) a clamping device (40) having at least one clamping element (42), wherein the at least one clamping element (42) is designed to exert a spring force, and wherein, by means of a transfer of the clamping element (42) from a Free Position (FP) into a clamping position (KP), an edge region (7a, 7b) of the upper side (5) of the substrate (1) is arranged at least partially on a stop section (28a, 28b) of a stop (27a, 27b) of a first transport cheek (20a) and/or a second transport cheek (20b) of the two transport cheeks (20a, 20b) by means of the spring force in order to fix the substrate (1).
2. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
the at least one clamping element (42) is at least partially elastically deformable, wherein an elastic force is exerted by the clamping element (42) being transferred from the Free Position (FP) to the clamping position (KP), the clamping element (42) being at least partially elastically deformed to fix the substrate (1).
3. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
the clamping device (40) has at least one clamping part (42a) and at least one second clamping part (42b), wherein the edge region (7a) of the upper side (5) of the substrate (1) is arranged at least partially on the stop section (28a) of the stop (27a) of the first transport cheek (20a) by means of the spring force of the at least one clamping part (42a) in the clamping position (KP) in order to fix the substrate (1), and wherein the edge region (7b) of the upper side (5) of the substrate (1) is arranged at least partially on the stop section (28b) of the stop (27b) of the second transport cheek (20b) by means of the spring force of the at least one second clamping part (42b) in the clamping position (KP) in order to fix the substrate (1).
4. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
the clamping device (40) has a lifting element (45) which can be moved in a lifting direction (HR) between a zero position (NP) and at least one lifting position (HP), wherein, in the at least one lifting position (HP) of the lifting element (45), the at least one lifting element (45) transfers the clamping element (42) into the clamping position (KP).
5. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
the at least one gripper (42) is arranged on a first (20a) and/or a second (20b) of the two transport cheeks (20a, 20 b).
6. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
at least one gripper (42) in the transport system (100) is configured such that the end (43a) of the at least one gripper (1) facing the stop (27a) of the first transport cheek (20a) is located below the guide section (24a) of the guide (23a) of the first transport cheek (20a) in the Free Position (FP) and/or such that the end (43b) of the at least one gripper (42) facing the stop (27a) of the second transport cheek (20b) is located below the guide section (24b) of the guide (23b) of the second transport cheek (20b) in the Free Position (FP).
7. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
at least one gripper (42) in the conveying system (100) is configured such that an end (43a) of the at least one gripper (42) facing a stop (27a) of the first conveying cheek (20a) is substantially opposite a stop section (28a) of the stop (27a) of the first conveying cheek (20a) at least in the gripping position (KP) and/or such that an end (43b) of the at least one gripper (42) facing a stop (27b) of the second conveying cheek (20b) is substantially opposite a stop section (28b) of the stop (27b) of the second conveying cheek (20b) at least in the gripping position (KP).
8. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
the at least one gripper (42) is of U-shaped configuration, wherein a first clamping leg (S1) of the gripper (42) is arranged on the outer side and/or on the inner side facing away from the outer side of one of the two transport cheeks (20a, 20b), and a second clamping leg (S2) of the gripper (42) is located below the substrate (1) and between the two transport cheeks (20a, 20b) of the transport system (100).
9. The transfer system (100) of claim 8,
it is characterized in that the preparation method is characterized in that,
the second leg (S2) of the U-shaped clamp (42) has at least one bending region for at least partially elastically deforming at least the second leg (S2) of the clamp (42).
10. The delivery system (100) of claim 8 or 9,
it is characterized in that the preparation method is characterized in that,
the U-shaped clamp (42) has a base (B) for connecting the first leg (S1) and the second leg (S2), wherein an angle (a) between the first leg (S1) and the base (B) in a Free Position (FP) of the clamp (42) is greater than an angle (a) in a clamping position (KP) of the clamp (42).
11. The delivery system (100) of claim 4,
it is characterized in that the preparation method is characterized in that,
the at least one clamping element (42) is arranged on the lifting element (45).
12. The transfer system (100) of claim 1,
it is characterized in that the preparation method is characterized in that,
the clamping device (40) has at least two clamping elements (42a or 42b) arranged one behind the other at least along one of the two transport cheeks (20a or 20b) in order, in the clamping position (KP) of the at least two clamping elements (42a or 42b) arranged one behind the other, to arrange an edge region (7a or 7b) of the upper side (5) of the substrate at least partially along the stop section (28a or 28b) of the stop (27a or 27b) of the first and/or second transport cheek (20a or 20 b).
13. The delivery system (100) of claim 12,
it is characterized in that the preparation method is characterized in that,
at least two successively arranged clamping elements (42a or 42b) overlap.
14. Functional device (200) for processing a substrate (1), wherein the functional device (200) comprises a functional head (202),
it is characterized in that the preparation method is characterized in that,
the functional apparatus (200) comprises a transport system (100) constructed according to claim 1.
CN202110574055.3A 2020-05-27 2021-05-25 Transfer system for moving a substrate and functional apparatus comprising the same Active CN113747779B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020114215.3 2020-05-27
DE102020114215.3A DE102020114215B4 (en) 2020-05-27 2020-05-27 Transport system for moving a substrate and functional device with a transport system

Publications (2)

Publication Number Publication Date
CN113747779A true CN113747779A (en) 2021-12-03
CN113747779B CN113747779B (en) 2023-05-23

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1739327A (en) * 2002-11-13 2006-02-22 阿森姆布里昂股份有限公司 Component placement machine as well as a method for transporting printed circuit boards
JP2008066630A (en) * 2006-09-11 2008-03-21 Anritsu Corp Substrate transfer apparatus and printing solder inspection equipment provided with the same
JP2009099692A (en) * 2007-10-15 2009-05-07 Fuji Mach Mfg Co Ltd Substrate conveying conveyor
US20100061832A1 (en) * 2007-04-13 2010-03-11 Ekra Automatisierungssysteme Gmbh Asys Group Device and method for processing flat substrates such as for printing circuit boards or the like
CN201608987U (en) * 2010-03-26 2010-10-13 伟创力电子科技(上海)有限公司 Clamping support for printed circuit board assembly
CN102194728A (en) * 2010-02-18 2011-09-21 亚威科股份有限公司 Substrate transferring apparatus, substrate processing apparatus with it and substrate processing method using it
CN203086921U (en) * 2013-01-08 2013-07-24 刘有志 PCB (Printed Circuit Board) fixing mechanism applied to plugging machine
JP2015109363A (en) * 2013-12-05 2015-06-11 埼玉日本電気株式会社 Substrate transfer jig, transfer device and transfer method
CN107813276A (en) * 2017-11-17 2018-03-20 奥士康科技股份有限公司 A kind of circuit board rack
US20180347064A1 (en) * 2015-08-05 2018-12-06 Atotech Deutschland Gmbh Substrate holder reception apparatus
CN209447780U (en) * 2019-04-28 2019-09-27 中国建材国际工程集团有限公司 The various sizes of sample holder for being adaptable to substrate of plate-shaped substrate is used in semiconductor processes
CN210075739U (en) * 2019-01-23 2020-02-14 深圳市埃西尔电子有限公司 Small-size desk-top chip mounter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6035522A (en) 1996-03-13 2000-03-14 Motorola, Inc. Circuit board leveling apparatus
GB2457280B (en) 2008-02-08 2012-05-23 Dek Int Gmbh Workpiece transport system and method
JP5830644B2 (en) 2011-12-06 2015-12-09 パナソニックIpマネジメント株式会社 Underpinning pin arrangement determination device and underpinning pin arrangement determination method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1739327A (en) * 2002-11-13 2006-02-22 阿森姆布里昂股份有限公司 Component placement machine as well as a method for transporting printed circuit boards
JP2008066630A (en) * 2006-09-11 2008-03-21 Anritsu Corp Substrate transfer apparatus and printing solder inspection equipment provided with the same
US20100061832A1 (en) * 2007-04-13 2010-03-11 Ekra Automatisierungssysteme Gmbh Asys Group Device and method for processing flat substrates such as for printing circuit boards or the like
JP2009099692A (en) * 2007-10-15 2009-05-07 Fuji Mach Mfg Co Ltd Substrate conveying conveyor
CN102194728A (en) * 2010-02-18 2011-09-21 亚威科股份有限公司 Substrate transferring apparatus, substrate processing apparatus with it and substrate processing method using it
CN201608987U (en) * 2010-03-26 2010-10-13 伟创力电子科技(上海)有限公司 Clamping support for printed circuit board assembly
CN203086921U (en) * 2013-01-08 2013-07-24 刘有志 PCB (Printed Circuit Board) fixing mechanism applied to plugging machine
JP2015109363A (en) * 2013-12-05 2015-06-11 埼玉日本電気株式会社 Substrate transfer jig, transfer device and transfer method
US20180347064A1 (en) * 2015-08-05 2018-12-06 Atotech Deutschland Gmbh Substrate holder reception apparatus
CN107813276A (en) * 2017-11-17 2018-03-20 奥士康科技股份有限公司 A kind of circuit board rack
CN210075739U (en) * 2019-01-23 2020-02-14 深圳市埃西尔电子有限公司 Small-size desk-top chip mounter
CN209447780U (en) * 2019-04-28 2019-09-27 中国建材国际工程集团有限公司 The various sizes of sample holder for being adaptable to substrate of plate-shaped substrate is used in semiconductor processes

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