CN113745300B - Organic light-emitting display panel and preparation method thereof - Google Patents
Organic light-emitting display panel and preparation method thereof Download PDFInfo
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- CN113745300B CN113745300B CN202111027950.XA CN202111027950A CN113745300B CN 113745300 B CN113745300 B CN 113745300B CN 202111027950 A CN202111027950 A CN 202111027950A CN 113745300 B CN113745300 B CN 113745300B
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 230000004888 barrier function Effects 0.000 claims abstract description 137
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 238000007789 sealing Methods 0.000 claims abstract description 82
- 239000003292 glue Substances 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims description 52
- 229920002120 photoresistant polymer Polymers 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 9
- 229910004205 SiNX Inorganic materials 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 10
- 239000001301 oxygen Substances 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 15
- 238000005538 encapsulation Methods 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the application discloses an organic light-emitting display panel and a preparation method thereof, wherein the organic light-emitting display panel comprises an array substrate, a barrier layer, an organic light-emitting device, a cover plate and annular sealing glue; the barrier layer is arranged on the array substrate; an organic light emitting device disposed on the barrier layer; the cover plate is arranged opposite to the barrier layer and is positioned at one side of the barrier layer away from the array substrate; and the annular sealing glue is connected between the cover plate and the array substrate and is arranged around the periphery of the organic light-emitting device, so that the projection of the annular sealing glue on the array substrate is overlapped with the peripheral edge part of the barrier layer, and therefore, cracks generated in the barrier layer can be avoided when the cover plate and the array substrate are pressed together, and water molecules and oxygen molecules are blocked from penetrating into the OLED display screen.
Description
Technical Field
The application relates to the field of display, in particular to an organic light-emitting display panel and a preparation method thereof.
Background
AMOLED (active matrix organic light emitting diode) displays typically employ LTPS (low temperature polysilicon) or metal oxide transistor technology routes. A layer of SiNx or SiOx is generally formed on the first layer of the array substrate by vapor deposition to serve as a PV barrier layer, so as to prevent the electrical properties of the transistor from being affected by the elements on the array substrate. While the OLED display is packaged, the cover plate and the array substrate are sometimes glued by UV glue. In the research and practice process of the prior art, the inventor of the application finds that in the bonding process, the PV barrier layer is easy to generate cracks due to stress generated by lamination, so that water molecules enter the inside of the OLED display screen through the cracks, and the encapsulation is invalid.
Disclosure of Invention
The embodiment of the application provides an organic light-emitting display panel and a preparation method thereof, which can prevent a barrier layer from generating cracks when a cover plate and an array substrate are pressed together, and prevent water molecules and oxygen molecules from penetrating into an OLED display screen.
In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:
in one aspect, an organic light emitting display panel is provided, including an array substrate, a barrier layer, an organic light emitting device, a cover plate, and an annular seal; the barrier layer is arranged on the array substrate; an organic light emitting device disposed on the barrier layer; the cover plate is arranged opposite to the barrier layer and is positioned at one side of the barrier layer away from the array substrate; and the annular sealing glue is connected between the cover plate and the array substrate and is arranged around the periphery of the organic light-emitting device, so that the projection of the annular sealing glue on the array substrate is overlapped with the peripheral edge part of the barrier layer.
Alternatively, define: the distance between the edge of the barrier layer and the edge of the array substrate is a; the distance between the periphery of the annular sealing glue and the edge of the array substrate is b; the distance between the inner periphery of the annular sealing glue and the edge of the array substrate is c; then there are: b < a < c.
Optionally, the organic light emitting display panel includes a display area and a non-display area, and the non-display area includes a binding area; the organic light-emitting display panel further comprises a chip, and the chip is arranged at the part of the array substrate, which is positioned in the binding area.
Optionally, the material of the barrier layer is at least one of SiNx or SiOx
Optionally, the thickness of the barrier layer ranges from 500 to 3000 angstroms.
Correspondingly, the embodiment of the application also provides a preparation method of the organic light-emitting display panel, which comprises the following steps:
providing an array substrate, and depositing a barrier layer on the array substrate;
patterning the barrier layer, and defining an annular area adjacent to the peripheral edge of the barrier layer on the array substrate as a blank area;
preparing an organic light emitting device on the barrier layer after patterning;
and providing a cover plate, and arranging an annular sealing glue between the array substrate and the cover plate, wherein the annular sealing glue is arranged around the periphery of the organic light-emitting device, so that the projection of the annular sealing glue on the blank area is overlapped with the peripheral edge part of the barrier layer.
Optionally, the step of disposing an annular seal between the array substrate and the cover plate includes:
the annular sealing glue is arranged on one side of the array substrate, which faces the cover plate; and the annular sealing glue is coated on the blank area around the edge of the barrier layer.
Alternatively, define:
the distance between the edge of the barrier layer and the edge of the array substrate is a;
the distance between the periphery of the annular sealing glue and the edge of the array substrate is b;
the distance between the inner periphery of the annular sealing glue and the edge of the array substrate is c; then there are:
b<a<c。
optionally, the step of depositing a barrier layer on the array substrate includes:
and depositing at least one of SiNx or SiOx on the array substrate by using a vapor deposition method to form the barrier layer, wherein the thickness of the barrier layer ranges from 500 to 3000 angstroms.
Optionally, the step of patterning the barrier layer includes:
coating photoresist on the surface of the barrier layer, and curing;
covering a photoetching mask plate on the barrier layer coated with the photoresist, and selectively exposing the photoresist under an ultraviolet lamp;
cleaning the photoresist of the exposed part by using a developer, and performing curing treatment;
dry etching is carried out on the photoresist;
and stripping the excess photoresist by using a stripping solution.
One of the above technical solutions has the following advantages or beneficial effects:
in this embodiment, when the cover plate and the array substrate are connected by using the annular sealing glue, the orthographic projection of the annular sealing glue on the array substrate is partially overlapped with the peripheral edge of the barrier layer, and when the organic light-emitting display panel is packaged by using the annular sealing glue, the sealing is realized by pressing the annular sealing glue between the cover plate and the array substrate by external force, and the barrier layer, especially the peripheral edge of the barrier layer, only bears a small part of pressure or does not bear the pressure, so that the barrier layer is not easy to crack due to the pressure, and therefore, external water molecules and oxygen molecules can be blocked from penetrating into the organic light-emitting display panel, damage to the organic light-emitting device is avoided, and the packaging effect is ensured.
The other technical scheme has the following advantages or beneficial effects: because the peripheral edge of the barrier layer is overlapped with the orthographic projection part of the annular sealing glue on the array substrate, when the pressure applied to the annular sealing glue is dispersed at the outer edge of the barrier layer to cause cracks, the outer edge of the barrier layer is connected with the annular sealing glue, and the whole barrier layer is packaged in the organic light-emitting display panel, even if the barrier layer generates cracks, external water molecules and oxygen molecules cannot invade the organic light-emitting display panel, so that the packaging effect of the organic light-emitting display panel is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an organic light emitting display panel according to a first embodiment;
FIG. 2 is an enlarged schematic view of a portion A of FIG. 1;
fig. 3 is a flowchart of a method for manufacturing an organic light emitting display panel according to the second embodiment.
Reference numerals illustrate:
100. an array substrate; 200. a barrier layer; 300. an organic light emitting device; 400. a cover plate; 500. annular sealing glue; 600. and a chip.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides an organic light-emitting display panel and a preparation method thereof. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
Example 1
A first embodiment of the present application provides an organic light emitting display panel, in particular, prepared by LTPS (low temperature polysilicon) or metal oxide transistor technology routes. The above-described organic light emitting display panel may be used for at least one of a smart phone, a tablet computer, a desktop/laptop computer, a workstation, a server, a mobile phone, a video phone, an electronic book reader, a car navigator, an electronic billboard, a wearable device, or the like, for example.
As shown in fig. 1 and 2, the organic light emitting display panel specifically includes an array substrate 100, a barrier layer 200, an organic light emitting device 300, and a cover plate 400, wherein the barrier layer 200 is disposed above the array substrate 100, and the organic light emitting device 300 is disposed above the barrier layer 200. The barrier layer 200 covered on the array substrate 100 in this embodiment can prevent the elements on the array substrate 100 from affecting the electrical performance of the transistor, so as to ensure the stability of the working performance of the organic light emitting display panel.
In addition, the organic light emitting device 300 in the present embodiment is an OLED display, in which the organic light emitting device 300 includes a cathode, an anode, and an organic light emitting layer disposed between the cathode and the anode, and the organic light emitting device 300 may further include a hole injection layer, a hole transport layer, an electron injection layer, and the like. Since the structure of the organic light emitting device 300 is a related art, a detailed description thereof will be omitted herein.
The cover plate 400 is disposed opposite to the barrier layer 200 while the cover plate 400 is located at a side of the barrier layer 200 away from the array substrate 100, i.e., the cover plate 400 is disposed at a position above the organic light emitting device 300. The cover plate 400 in this embodiment may be transparent glass or plastic, wherein the cover plate 400 is mainly used for protecting the organic light emitting display panel. In addition, the organic light-emitting display panel can realize color display in a manner of independently emitting red, green and blue pixels; the organic light emitting device 300 may be used to emit white light, and the color filter may be disposed on the cover plate 400 in the second light emitting mode. Alternatively, the organic light emitting display panel may also employ the organic light emitting device 300 of blue light, and then use the blue light to excite a color conversion material, such as phosphor or quantum dot material, to obtain red light and green light, so as to realize color display of the organic display panel, and specific light emitting modes include, but are not limited to, the above-listed modes.
The organic light emitting display panel further includes an annular sealing compound 500, the annular sealing compound 500 being connected between the cap plate 400 and the array substrate 100, and the annular sealing compound 500 being disposed around the outer circumference of the organic light emitting device 300 such that the orthographic projection of the annular sealing compound 500 on the array substrate 100 coincides with the outer circumferential edge portion of the barrier layer 200 to encapsulate the organic light emitting display panel with the annular sealing compound 500. The annular sealing compound 500 in the embodiment can realize the bonding effect under the pressure effect, so as to realize the encapsulation of the organic light-emitting display panel; on the other hand, the annular molding compound 500 has a function of supporting the cover plate 400.
In this embodiment, when the cover plate 400 and the array substrate 100 are connected by using the annular sealing compound 500, the orthographic projection of the annular sealing compound 500 on the array substrate 100 is partially overlapped with the edge of the outer periphery of the barrier layer 200, so that when the organic light emitting display panel is packaged by using the annular sealing compound 500, the annular sealing compound 500 can realize synchronous connection of the cover plate 400, the array substrate 100 and the barrier layer 200, and the outer periphery of the packaged barrier layer 200 is located at the position of attaching the inner periphery of the annular sealing compound 500. Therefore, when the encapsulation is performed by pressing the annular sealing compound 500 between the cover plate 400 and the array substrate 100 by an external force, the barrier layer 200, especially, the peripheral edge thereof is only subjected to a small part of pressure or not subjected to the pressure, so that the barrier layer 200 is not easy to crack due to the pressure, and thus, external water molecules and oxygen molecules can be blocked from penetrating into the organic light emitting display panel, and damage to the organic light emitting device 300 is avoided, so as to ensure the encapsulation effect.
In addition, when the cover plate 400 and the array substrate 100 are connected by using the annular sealing compound 500, the orthographic projection on the array substrate 100 of the annular sealing compound 500 is overlapped with the peripheral edge of the barrier layer 200, so that the synchronous sealing of the cover plate 400, the array substrate 100 and the barrier layer 200 at the connection position is realized, the stability of the sealing position of the cover plate 400, the array substrate 100 and the barrier layer 200 is ensured when the organic light-emitting display panel is packaged, and the sealing effect of the connection position is further improved.
In a further improved scheme, a distance between the edge of the barrier layer 200 and the edge of the array substrate 100 is predefined as a, a distance between the outer periphery of the annular seal 500 and the edge of the array substrate 100 is defined as b, and a distance between the inner periphery of the annular seal 500 and the edge of the array substrate 100 is defined as c; then there are: b < a < c.
In this embodiment, the orthographic projection of the outer edge of the barrier layer 200 on the array substrate 100 is located between the outer periphery and the inner periphery of the annular seal 500, so that when the annular seal 500 is used to seal the organic light emitting display panel, the annular seal 500 connects the cover plate 400 and the array substrate 100, and also bonds the outer edge of the barrier layer 200. Since the annular sealing compound 500 is only connected to the outer edge of the barrier layer 200, when pressure is applied to the annular sealing compound 500 to force the annular sealing compound to adhere the cover plate 400, the array substrate 100 and the barrier layer 200, only a part of the acting force is dispersed on the outer edge of the barrier layer 200 or does not act on the outer edge of the barrier layer 200, so that the outer edge of the barrier layer 200 is prevented from being subjected to more pressure to generate cracks. Therefore, the sealing effect can be ensured by reasonably arranging the outer edge of the barrier layer 200, and external water molecules and oxygen molecules can be prevented from invading the inside of the organic light-emitting display panel, so that the packaging effect of the organic light-emitting display panel is ensured.
In addition, since the outer edge of the barrier layer 200 is located between the outer circumference and the inner circumference of the annular sealing compound 500, when the pressure applied to the annular sealing compound 500 is dispersed at the outer edge of the barrier layer 200 to cause the crack thereof, since the outer edge thereof is connected with the annular sealing compound 500 and the entire barrier layer 200 is encapsulated inside the organic light emitting display panel, even if the barrier layer 200 generates the crack, external water molecules and oxygen molecules do not invade inside the organic light emitting display panel, thereby securing the encapsulation effect of the organic light emitting display panel.
In a further improved scheme, the material of the barrier layer 200 is at least one of SiNx or SiOx, so that the barrier layer 200 is used to block the direct contact between the array substrate 100 and the organic light emitting device 300, so as to prevent the element on the array substrate 100 from affecting the electrical properties of the transistor in the organic light emitting display device.
In a further improved scheme, the thickness of the barrier layer 200 is 500-3000 a/m, and by reasonably designing the thickness of the barrier layer 200, the element on the array substrate 100 can be prevented from affecting the electrical property of the transistor in the organic light emitting display device, and the light and thin design of the organic light emitting display panel can be realized.
In a further improved scheme, the organic light emitting display panel includes a display area L1 and a non-display area including a binding area L2. The organic light emitting display panel further includes a chip 600, and the chip 600 is disposed at a portion of the array substrate 100 located in the bonding area L2. In this embodiment, the area of the organic light emitting display panel corresponding to the organic light emitting device 300 is a display area L1, the outer area of the organic light emitting display panel surrounding the organic light emitting device 300 is a non-display area, and the outer area of the organic light emitting display panel located at the periphery of the annular sealing compound 500 is a binding area L2. The chip 600 for controlling the organic light emitting display panel in this embodiment is disposed in the binding region L2, so that the control of the organic light emitting device 300 can be achieved, and the functions of the display region are not affected. In addition, the chip 600 is disposed at the bonding region L2 outside the annular molding compound 500, which can facilitate the mounting of the chip 600.
Example two
As shown in fig. 3, the preparation method of the organic light-emitting display panel specifically includes the following steps:
s1, providing an array substrate 100, and depositing a barrier layer 200 on the upper surface of the array substrate 100;
the specific steps in this embodiment include: at least one of SiNx or SiOx is deposited on the array substrate 100 by vapor deposition to form the barrier layer 200, and the thickness of the barrier layer 200 is 500-3000A. Thereby blocking direct contact of the array substrate 100 and the organic light emitting device 300 by the barrier layer 200 to prevent elements on the array substrate 100 from affecting the electrical properties of transistors in the organic light emitting display device. In addition, the thickness of the barrier layer 200 is designed reasonably, so that the elements on the array substrate 100 can be prevented from affecting the electrical properties of the transistors in the organic light emitting device 300, and the light and thin design of the organic light emitting display panel can be realized.
S2, patterning the barrier layer 200, and defining an annular area adjacent to the peripheral edge of the barrier layer 200 on the upper surface of the array substrate 100 as a blank area;
by setting the annular region adjacent to the array substrate 100 at the peripheral edge of the barrier layer 200 as a blank region, the region coated with the annular sealing compound 500 can be reserved in the blank region, and the position of the peripheral edge of the barrier layer 200 can be limited by limiting the patterning region of the barrier layer 200, so that all parts of the barrier layer 200 can be limited in the annular sealing compound 500, and the packaging effect of the organic light emitting display panel can be ensured.
S3, preparing an organic light-emitting device 300 on the barrier layer 200 after patterning;
the organic light emitting device 300 in this embodiment is an OLED display, in which the organic light emitting device 300 includes a cathode, an anode, and an organic light emitting layer disposed between the cathode and the anode, and the organic light emitting device 300 may further include a hole injection layer, a hole transport layer, an electron injection layer, and the like.
S4, providing a cover plate 400, disposing an annular sealing compound 500 between the array substrate 100 and the cover plate 400, wherein the annular sealing compound 500 is disposed around the periphery of the organic light emitting device 300, so that the projection of the annular sealing compound 500 on the plane of the blank area coincides with the peripheral edge portion of the barrier layer 200.
In this embodiment, when the cover plate 400 and the array substrate 100 are connected by using the annular sealing compound 500, the orthographic projection of the annular sealing compound 500 on the array substrate 100 is partially overlapped with the edge of the outer periphery of the barrier layer 200, so that when the organic light emitting display panel is packaged by using the annular sealing compound 500, the annular packaging can realize synchronous connection of the cover plate 400, the array substrate 100 and the barrier layer 200, and the outer periphery of the packaged barrier layer 200 is located at the position of the inner periphery of the bonded annular sealing compound 500, so as to ensure the stability of the sealing positions of the cover plate 400, the array substrate 100 and the barrier layer 200 when the organic light emitting display panel is packaged, and further improve the sealing effect of the connecting positions.
When the encapsulation is realized by pressing the annular sealing compound 500 between the cover plate 400 and the array substrate 100 by external force, the barrier layer 200, especially the peripheral edge thereof, is only subjected to a small part of pressure or not subjected to the pressure, so that the barrier layer 200 is not easy to crack due to the pressure, and therefore, external water molecules and oxygen molecules can be blocked from penetrating into the organic light emitting display panel, and damage to the organic light emitting device 300 is avoided, so that the encapsulation effect is ensured.
In a further improved scheme, the steps specifically further comprise:
definition: the distance between the edge of the barrier layer 200 and the edge of the array substrate 100 is a, the distance between the outer circumference of the annular seal 500 and the edge of the array substrate 100 is b, and the distance between the inner circumference of the annular seal 500 and the edge of the array substrate 100 is c; then there are: b < a < c.
In this embodiment, the orthographic projection of the outer edge of the barrier layer 200 on the plane of the array substrate 100 is located between the outer periphery and the inner periphery of the annular seal 500, so that when the annular seal 500 is used to seal the organic light emitting display panel, the annular seal 500 connects the cover plate 400 and the array substrate 100 and also bonds the outer edge of the barrier layer 200. Since the annular sealing compound 500 is only connected with the outer edge of the barrier layer 200, when pressure is applied to the annular sealing compound 500 to drive the annular sealing compound 500 to adhere the cover plate 400, the array substrate 100 and the barrier layer 200, the pressure is only partially dispersed at the outer edge of the barrier layer 200 or does not act on the outer edge of the barrier layer 200, so that the outer edge of the barrier layer 200 can be prevented from bearing more pressure to generate cracks; therefore, the sealing effect can be ensured by reasonably arranging the outer edge of the barrier layer 200, and external water molecules and oxygen molecules can be prevented from invading the inside of the organic light-emitting display panel, so that the packaging effect of the organic light-emitting display panel is ensured.
In addition, since the outer edge of the barrier layer 200 is located between the outer circumference and the inner circumference of the annular sealing compound 500, when the pressure applied to the annular sealing compound 500 is dispersed at the outer edge of the barrier layer 200 to cause the crack thereof, since the outer edge thereof is connected with the annular sealing compound 500 and the entire barrier layer 200 is encapsulated inside the organic light emitting display panel, even if the barrier layer 200 generates the crack, external water molecules and oxygen molecules do not invade inside the organic light emitting display panel, thereby securing the encapsulation effect of the organic light emitting display panel.
In a further improved scheme, the patterning on the barrier layer 200 in step S2 specifically includes the following steps:
photoresist is coated on the surface of the barrier layer 200 to form a uniform photoresist layer, and curing treatment is performed.
A photoresist mask is coated over the photoresist-coated barrier layer 200 and the photoresist is selectively exposed to light under an ultraviolet lamp. And irradiating the surface of the photoresist through a prefabricated photoetching mask plate by utilizing an ultraviolet lamp, so that the irradiated photoresist layer reacts. A photoresist mask is coated over the photoresist-coated barrier layer 200 and the photoresist is selectively exposed to light under an ultraviolet lamp.
The photoresist of the exposed portion is cleaned with a developer and subjected to a curing process. The photoresist in the exposed portions is rinsed off using a developer, leaving only the unexposed portions of the photoresist, and then the dissolved photoresist is rinsed off with deionized water. After the development process, a curing process is required, which in this embodiment may be a heat bake, so that the unexposed photoresist may be firmly attached to the barrier layer 200.
A dry etching process is performed using a process gas to etch the photoresist overlying the barrier layer 200.
Excess photoresist on the barrier layer 200 is stripped using a stripping solution.
In the embodiment shown in fig. 3, the technical features of the method for manufacturing an organic light emitting display panel provided in this embodiment correspond to those of the first embodiment, so the technical features of this embodiment may be referred to the content of the first embodiment, and will not be described again.
The above description has been made in detail on an organic light emitting display panel and a method for manufacturing the same provided in the embodiments of the present application, and specific examples are applied herein to illustrate the principles and embodiments of the present application, and the above description of the embodiments is only for helping to understand the method and core ideas of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (7)
1. An organic light emitting display panel, comprising:
an array substrate (100);
the barrier layer (200) is arranged on the array substrate (100), the material of the barrier layer (200) is SiNx, and the barrier layer (200) is used for preventing elements on the array substrate (100) from influencing the electrical performance of the transistor;
an organic light emitting device (300) disposed on the barrier layer (200);
a cover plate (400) which is arranged opposite to the barrier layer (200) and is positioned at one side of the barrier layer (200) away from the array substrate (100); and
an annular sealing compound (500) connected between the cover plate (400) and the array substrate (100), the annular sealing compound bonding the cover plate (400) and the array substrate (100) under pressure, the annular sealing compound (500) being arranged around the periphery of the organic light emitting device (300) so that the projection of the annular sealing compound (500) on the array substrate coincides with the peripheral edge part of the barrier layer (200), and a containing cavity containing gas is formed by surrounding the annular sealing compound (500), the array substrate (100) and the cover plate (400);
the distance between the edge of the barrier layer (200) and the edge of the array substrate (100) is a, the distance between the outer periphery of the annular sealing compound (500) and the edge of the array substrate (100) is b, and the distance between the inner periphery of the annular sealing compound (500) and the edge of the array substrate (100) is c, then: b < a < c.
2. The organic light emitting display panel of claim 1, wherein the organic light emitting display panel comprises a display region and a non-display region, the non-display region comprising a binding region;
the organic light emitting display panel further comprises a chip (600), and the chip (600) is arranged at the part of the array substrate (100) located in the binding area.
3. The organic light emitting display panel according to claim 1, wherein the thickness of the barrier layer (200) ranges from 500 to 3000 a.
4. A method for manufacturing an organic light emitting display panel, comprising the steps of:
providing an array substrate (100), and depositing a barrier layer (200) on the array substrate (100), wherein the barrier layer (200) is made of SiNx;
patterning the barrier layer (200) and defining an annular region adjacent to the peripheral edge of the barrier layer (200) on the array substrate (100) as a blank region, wherein the barrier layer (200) is used for preventing elements on the array substrate (100) from influencing the electrical performance of the transistor;
preparing an organic light emitting device (300) on the patterned barrier layer (200);
providing a cover plate (400), arranging an annular sealing compound (500) between the array substrate (100) and the cover plate (400), wherein the annular sealing compound (500) is arranged around the periphery of the organic light-emitting device (300) so that the projection of the annular sealing compound (500) on the plane of the blank area is overlapped with the peripheral edge part of the barrier layer (200), the annular sealing compound (500), the array substrate (100) and the cover plate (400) are encircled to form a containing cavity containing gas, the distance between the edge of the barrier layer (200) and the edge of the array substrate (100) is a, the distance between the periphery of the annular sealing compound (500) and the edge of the array substrate (100) is b, and the distance between the inner periphery of the annular sealing compound (500) and the edge of the array substrate (100) is c, then: b < a < c.
5. The method of manufacturing an organic light emitting display panel according to claim 4, wherein the step of disposing an annular sealing compound (500) between the array substrate (100) and the cover plate (400) comprises:
the annular sealing glue (500) is arranged on one side of the array substrate (100) facing the cover plate (400); and the annular seal (500) is applied to the blank area around the edge of the barrier layer (200).
6. The method of manufacturing an organic light emitting display panel according to any one of claims 4 to 5, wherein the step of depositing a barrier layer (200) on the array substrate (100) comprises:
and depositing the SiNx on the array substrate (100) by using a vapor deposition method to form the barrier layer (200), wherein the thickness of the barrier layer (200) ranges from 500 to 3000 Emi.
7. The method of manufacturing an organic light emitting display panel according to any one of claims 4 to 5, wherein the patterning of the barrier layer (200) comprises:
coating photoresist on the surface of the barrier layer (200) and curing;
covering a photoetching mask plate on the barrier layer (200) coated with the photoresist, and selectively exposing the photoresist under an ultraviolet lamp;
cleaning the photoresist of the exposed part by using a developer, and performing curing treatment;
dry etching is carried out on the photoresist;
and stripping the excess photoresist by using a stripping solution.
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