CN113745275A - Display panel and tiled display - Google Patents
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- CN113745275A CN113745275A CN202011504933.6A CN202011504933A CN113745275A CN 113745275 A CN113745275 A CN 113745275A CN 202011504933 A CN202011504933 A CN 202011504933A CN 113745275 A CN113745275 A CN 113745275A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
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Abstract
The present disclosure provides a display panel and a tiled display. The display panel includes a substrate, a plurality of light emitting elements, a driving circuit, and an optical sensor. The substrate comprises a through hole, and the through hole comprises a hole. The plurality of light emitting elements are disposed on the substrate. The through-hole is located in a region between two of the plurality of light emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of light emitting elements. The optical sensor is disposed corresponding to the through hole and receives the sensing light through the hole. The width W of the hole conforms to the relation H ≦ W < D. H is the depth of the hole and D is the distance between the two light emitting elements.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a display panel and a tiled display.
Background
With the development of technology, electronic devices (e.g., display devices) are being developed to be more functional and thinner. There is a technology of externally connecting a camera lens to a display screen. However, there is still a need for optimizing the circuit configuration of the peripheral region of the panel and the use experience of the display device. In addition, in a large display device, it may be difficult for an externally connected camera lens to meet the use requirements. Therefore, there is room for improvement in the existing display device.
Disclosure of Invention
The present disclosure provides a display panel and a tiled display, which are helpful for overcoming at least one of the disadvantages of the external camera lens.
According to an embodiment of the present disclosure, a display panel includes a substrate, a plurality of light emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole including a hole. The plurality of light emitting elements are disposed on the substrate. The through-hole is located in a region between two of the plurality of light emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of light emitting elements. The optical sensor is disposed corresponding to the through hole and receives the sensing light through the hole. The width W of the hole conforms to the relation H ≦ W < D. H is the depth of the hole and D is the distance between the two light emitting elements.
According to an embodiment of the present disclosure, a tiled display includes at least one of the display panels described above.
In order to make the aforementioned and other features and advantages of the disclosure more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1 is a schematic partial cross-sectional view of a display panel according to some embodiments of the present disclosure;
FIGS. 2 through 5 are various enlarged partial views of region X of FIG. 1;
FIGS. 6-8 are various top schematic views of the display panel of FIG. 1;
FIG. 9 is a schematic diagram of a tiled display, according to some embodiments of the present disclosure;
FIG. 10 is a schematic view of another tiled display according to some embodiments of the present disclosure.
Detailed Description
The present disclosure may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings. It should be noted that in order to facilitate the understanding of the reader and the simplicity of the drawings, the various drawings in the present disclosure depict only a portion of an electronic device/display device and certain elements of the drawings are not necessarily drawn to scale. In addition, the number and size of the elements in the figures are merely illustrative and are not intended to limit the scope of the present disclosure. For example, the relative sizes, thicknesses, and locations of various layers, regions, or structures may be reduced or exaggerated for clarity.
Certain terms are used throughout the description and following claims to refer to particular elements. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that differ in function but not name. In the following description and claims, the terms "having" and "including" are used as open-ended terms, and thus should be interpreted to mean "including, but not limited to …".
Directional phrases used herein include, for example: "upper", "lower", "front", "rear", "left", "right", etc., refer only to the orientation of the figures. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers may be present (not directly). In contrast, when an element or layer is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present therebetween.
The terms "about," "equal," "identical," "substantially," or "approximately" as referred to herein generally represent a range of 10% of a given value or range, or 5%, 3%, 2%, 1%, or 0.5% of the given value or range. Further, the phrase "a given range is from a first value to a second value," and "a given range is within a range from a first value to a second value" means that the given range includes the first value, the second value, and other values therebetween.
In some embodiments of the present disclosure, terms such as "connected," "interconnected," and the like, with respect to bonding, connecting, and the like, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, unless otherwise specified, with respect to the structure between which they are disposed. The terms coupled and connected should also be construed to include both structures being movable or both structures being fixed. Furthermore, the terms "electrically connected" and "coupled" encompass any direct and indirect electrical connection.
In the following embodiments, the same or similar elements will be denoted by the same or similar reference numerals, and the detailed description thereof will be omitted. Furthermore, the features of the various embodiments may be combined in any suitable manner without departing from the spirit or conflict of the invention, and all such modifications and equivalents as may be within the spirit and scope of the disclosure are deemed to be within the ambit and scope of the disclosure. In addition, the terms "first", "second", and the like in the description and the claims are only used for naming different elements or distinguishing different embodiments or ranges, and are not used for limiting the upper limit or the lower limit of the number of elements, nor are they used for limiting the manufacturing order or the arrangement order of the elements.
The electronic device of the present disclosure may include, but is not limited to, a display device, an antenna device, a sensing device, a light-emitting device, or a splicing device. The electronic device may include a bendable or flexible electronic device. The electronic device may for example comprise a light emitting diode. The light emitting diode may include, for example, an Organic Light Emitting Diode (OLED), a submillimeter light emitting diode (mini LED), a micro light emitting diode (micro LED), or a quantum dot light emitting diode (quantum dot LED, which may include QLED, QDLED), a fluorescent (fluorescent), a phosphorescent (phosphor), or other suitable material, or a combination thereof, but is not limited thereto. The present disclosure will be described below with reference to a display device as an electronic device, but the present disclosure is not limited thereto.
The display device of the present disclosure may be a self-luminous display device, for example. The self-light emitting display device may include a light emitting diode, a light conversion layer or other suitable materials, or a combination thereof, but is not limited thereto. The light emitting diode may include, for example, an Organic Light Emitting Diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED), or a quantum dot light emitting diode (quantum dot LED, which may include a QLED or a QDLED), but is not limited thereto. The light conversion layer may include a wavelength conversion material and/or a light filtering material, and the light conversion layer may include, for example, fluorescence (phosphorescence), phosphorescence (phor), Quantum Dots (QD), other suitable materials, or combinations thereof, but is not limited thereto. The following description will be made with reference to the accompanying drawings for illustrating the display panel of the display device, and the present disclosure will be described with reference to a tiled display as a display device. However, the display device of the present disclosure may also be an unpatterned display.
Fig. 1 is a schematic partial cross-sectional view of a display panel according to some embodiments of the present disclosure. Fig. 2 to 5 are various enlarged partial views of the region X in fig. 1.
Referring to fig. 1 and 2, the display panel 100 may be a self-luminous display panel. The self-light emitting display panel may include a light emitting diode display panel, but is not limited thereto. The display panel 100 may be a display panel in which an image pickup device is embedded. For example, one or more image capture devices may be embedded in the display panel 100. According to different requirements, the display panel 100 may display the acquired image while acquiring the image of the photographic subject, but is not limited thereto.
In detail, the display panel 100 may include a substrate 110, a plurality of light emitting elements 120, a driving circuit 130, and an optical sensor 140. The substrate 110 may include a rigid substrate or a flexible substrate, and may also include a flexible film substrate, which is not limited in the disclosure. For example, the substrate 110 may include a printed circuit board, a plastic substrate, a glass substrate, or a composite substrate, such as: a composite board including Polyimide (PI) and a printed circuit board, a composite board including Polyimide and Polyethylene terephthalate (PET), and the like, but not limited thereto. The plurality of light emitting elements 120 may include Light Emitting Diodes (LEDs), which may include, for example, Organic Light Emitting Diodes (OLEDs), sub-millimeter light emitting diodes (mini LEDs), micro light emitting diodes (micro LEDs), or quantum dot light emitting diodes (quantum dot LEDs, which may include QLEDs, QDLEDs), fluorescent (fluorescent), phosphorescent (phosphor), or other suitable materials, or combinations thereof, but is not limited thereto. The driving circuit 130 may include one or more integrated circuits, but is not limited thereto. The optical sensor 140 may include a camera module or a fingerprint recognition module, and may also include an infrared camera, a thermal imager, or other image capture devices that provide a range finding, position sensing, or recognition function, but is not limited thereto. In some embodiments, the optical Sensor 140 may include a Charge-coupled Device (CCD) or a complementary metal oxide semiconductor Image Sensor (CIS), such as: a front-illuminated (FSI) CIS, a back-illuminated (BSI) CIS, etc., for receiving sensing light, but is not limited thereto.
The substrate 110 has a surface S1 and another surface S2 opposite to the surface S1. In addition, the substrate 110 may include a through hole T1. The through hole T1 penetrates through the surface S1 and the surface S2 of the substrate 110. In other words, the through hole T1 extends from the surface S1 to the surface S2.
The plurality of light emitting elements 120 are disposed on the substrate 110, and the plurality of light emitting elements 120 are disposed on the surface S1 of the substrate 110, for example. The through hole T1 is located, for example, in a region a between two light emitting elements (e.g., light emitting element 120a and light emitting element 120b) of the plurality of light emitting elements 120.
The driving circuit 130 is disposed on the substrate 110 and electrically connected to the plurality of light emitting elements 120. The driving circuit 130 can control the plurality of light emitting elements 120 to display an image frame. The driving circuit 130 may be disposed on the surface S1 of the substrate 110, or may be disposed on the surface S2 of the substrate 110 to reduce the effect on the visual effect, but the disclosure is not limited thereto. In some embodiments, the driving circuit 130 may be disposed on the surface S1 of the substrate 110.
The optical sensor 140 is disposed corresponding to the through hole T1 and receives sensing light through the through hole T1. As shown in fig. 1 and 2, the through hole T1 penetrates through a portion of the substrate 110 located in the area a, for example, and the optical sensor 140 is embedded in the through hole T1 of the substrate 110, for example, to acquire image data of the subject to be photographed by receiving the sensing light.
By disposing the optical sensor 140 in the display region of the display panel 100 (e.g., the region between the light emitting elements 120a and 120b), the technical problems of space waste caused by the external camera lens, appearance influence, or incapability of a user to directly view the screen and the image capturing device at the same time when using the image capturing device can be improved.
Referring to fig. 2, in the display panel 100, the through hole T1 may be a composite through hole, but not limited thereto. For example, the through hole T1 includes a portion T1b for disposing the optical sensor and a hole portion (hole T1a) for exposing the optical sensor 140, wherein the hole T1a is connected to the surface S1 of the substrate 110 and is located between the surface S1 and the portion T1b for disposing the optical sensor. The portion T1b where the optical sensor is disposed is connected to the surface S2 of the substrate 110 and located between the surface S2 and the hole T1 a. The optical sensor 140 may be disposed in the portion T1b where the optical sensor is disposed, and the hole T1a exposes the optical sensor 140, and the sensing light may be transmitted to the optical sensor 140 through the hole T1a, so that the optical sensor 140 acquires image data of the object to be photographed. In some embodiments, the portion T1b for disposing the optical sensor can be designed according to the size of the optical sensor 140 and can have a larger aperture than the hole T1a, but is not limited thereto.
In the embodiment of the present disclosure, based on the consideration of the image capturing effect, the width W of the hole T1a satisfies the following relation: h ≦ W < D. The width W of the hole T1a refers to, for example, the maximum width of the through hole T1 in a direction parallel to the substrate 110 on the surface (e.g., the surface S1) of the substrate 110 on which the plurality of light emitting elements 120 are disposed. In FIG. 2, the width W of the hole T1a is, for example, the maximum width of the surface S1 in a direction parallel to the substrate 110. H is the depth of the hole T1a, and is, for example, the distance from the surface of the substrate 110 on which the plurality of light emitting elements 120 are disposed (e.g., the surface S1) to the surface of the optical sensor 140 (e.g., the upper surface S3) in the direction perpendicular to the substrate 110. D is a distance between the light emitting elements 120a and 120b, for example, a minimum distance between the light emitting elements 120a and 120b in a direction parallel to the substrate 110.
In some embodiments of the present disclosure, the optical sensor 140 may be a camera module. For example, the optical sensor 140 may include a lens 1401 and a housing 1402 housing the lens 1401. In some embodiments, if the width B of the housing 1402 of the optical sensor 140 is greater than the distance D between the light emitting elements 120a and 120B, at least a portion of the housing 1402 can be embedded in the portion T1B of the substrate 110 where the optical sensor is disposed by the composite through hole T1 design. In this way, the optical sensor 140 can be fixed in the substrate 110 without increasing the distance D. In other embodiments, the optical sensor 140 may have other structural configurations, which are not limited by the present disclosure.
Referring to fig. 3, in the display panel 100A, the substrate 110 includes a through hole T2. The through hole T2 includes a portion T2b where the optical sensor is disposed and a hole portion T2a where the optical sensor 140 is exposed. The through hole T2 is a single through hole (single through hole), and the hole portion T2a and the portion T2b where the optical sensor is disposed in the through hole T2 have a single aperture. The width B' of a portion of the housing 1402 of the optical sensor 140 is smaller than the distance D between the light emitting elements 120a and 120B, and thus, the housing 1402 can be embedded in the through hole T2 of the substrate 110 through a single through hole design, but is not limited thereto. In fig. 3, the hole depth is such that the distance (H defined above) from the surface S1 to the upper surface S3 of the optical sensor 140 is, for example, 0.
Referring to fig. 4, in the display panel 100B, the substrate 110 includes a through hole T3. The through hole T3 includes a portion T3b where the optical sensor is disposed and a hole portion T3a where the optical sensor 140 is exposed. The through hole T3 is a single through hole, and the hole portion T3a and the portion T3b where the optical sensor is disposed in the through hole T3 have a single aperture. In some embodiments, the distance D 'between the light emitting elements 120a and 120B is larger (e.g., the display panel 100B has a larger pixel pitch or a lower resolution than the display panel 100), and the distance D' is larger than the width B of the housing 1402 of the optical sensor 140. Therefore, in the display panel 100B, the through hole T3 having a larger aperture may be disposed between the light emitting element 120a and the light emitting element 120B, and the optical sensor 140 may be disposed corresponding to the through hole T3 by disposing the housing 1402 in the through hole T3, but is not limited thereto. In fig. 4, the hole depth is such that the distance (H defined earlier) from the surface S1 to the upper surface S3 of the optical sensor 140 is, for example, 0.
Referring to FIG. 5, in the display panel 100C, the optical sensor 140 has a viewing angle θ, wherein the viewing angle θ falls to 180- [2 × tan [, for example-1(H/D)]Within a range of ± 10%. In other words, the distance H from the surface S1 to the upper surface S3 of the optical sensor 140 and the distance D between the light emitting elements 120a and 120b can be designed according to the light receiving capacity (viewing angle θ) of the optical sensor 140.
Fig. 6 to 8 are various top schematic views of the display panel in fig. 1. Referring to fig. 6, the display panel 100 may include a plurality of light emitting elements 120 disposed on the surface S1 of the substrate 110. The light emitting elements 120 may be arranged in an array in a direction parallel to the substrate 110 (e.g., the first direction D1 and the second direction D2). The second direction D2 intersects the first direction D1, and the second direction D2 may be, for example, perpendicular to the first direction D1, but is not limited thereto. The first direction D1 may be a horizontal direction facing a user of the display panel 100. The second direction D2 may be a vertical direction facing the user of the display panel 100.
As shown in fig. 6, in the display panel 100, the through hole T1 may be located at a region between two light emitting elements (e.g., the light emitting element 120a and the light emitting element 120b) of the plurality of light emitting elements 120. The light emitting elements 120a and 120b are adjacent light emitting elements 120 in the diagonal direction D3, for example. The diagonal direction D3 is a diagonal direction between the first direction D1 and the second direction D2. For example, the via T1 may be located in the area between four light emitting elements 120. Alternatively, the through hole T1 may be located in an area between six, eight, or more light emitting elements 120.
Referring to fig. 7, in the display panel 100D, the through hole T4 is located in a region between two light emitting elements (e.g., the light emitting element 120a and the light emitting element 120b) of the plurality of light emitting elements 120. The light emitting elements 120a and 120b are, for example, adjacent light emitting elements 120 in a horizontal direction (e.g., the first direction D1).
Referring to fig. 8, in the display panel 100E, the through hole T5 is located in a region between two light emitting elements (e.g., the light emitting element 120a and the light emitting element 120b) of the plurality of light emitting elements 120. The light emitting elements 120a and 120b are, for example, adjacent light emitting elements 120 in a vertical direction (e.g., the second direction D2).
FIG. 9 is a schematic diagram of a tiled display according to some embodiments of the present disclosure. Referring to fig. 9, the tiled display 10A can include a plurality of display panels DP. In some embodiments, some of the plurality of display panels DP in the tiled display 10A can have drive circuits electrically coupled to each other so that some of the plurality of display panels DP of the tiled display 10A can cooperatively display an overall or corresponding image picture.
As shown in fig. 9, the tiled display 10A can include at least two display panels 100 as described in fig. 1, 2, and 6. Through the optical sensor 140, the tiled display 10A can acquire image data of an object to be photographed. The tiled display 10A can also include the display panel 100A of fig. 3, the display panel 100B of fig. 4, the display panel 100C of fig. 5, the display panel 100D of fig. 7, the display panel 100E of fig. 8, or a combination thereof, which is not limited in this disclosure.
FIG. 10 is a schematic view of another tiled display according to some embodiments of the present disclosure. Referring to fig. 10, the tiled display 10B can have a ring shape and can include a plurality of display panels DP. The plurality of display panels DP may include one or more curved display panels, but is not limited thereto. Fig. 10 shows the tiled display 10B disposed inside the ring, but in other embodiments, the tiled display can be disposed outside the ring, or in other shapes, as the present disclosure is not limited in this respect. In some embodiments, some of the plurality of display panels DP in the tiled display 10B can have drive circuits electrically coupled to each other so that some of the plurality of display panels DP of the tiled display 10B can cooperatively display an overall or corresponding image picture.
As shown in fig. 10, the tiled display 10B can include at least one display panel 100 as described in fig. 1, 2, 6. Through the optical sensor 140, the tiled display 10B can acquire image data of the object O to be photographed. The tiled display 10B can also include the display panel 100A of fig. 3, the display panel 100B of fig. 4, the display panel 100C of fig. 7, the display panel 100D of fig. 8, or a combination thereof, which is not limited by the disclosure.
The tiled display 10B can include one optical sensor 140 and can also include multiple optical sensors 140. The tiled display 10B can include multiple display panels including the optical sensor 140 and can also include one display panel including multiple optical sensors 140. The plurality of optical sensors 140 may be respectively disposed on different display panels, or a plurality of optical sensors 140 may be disposed on one display panel. The tiled display 10B can also include a display panel without the optical sensor 140, which is not limited by the present disclosure. The plurality of optical sensors 140 may provide a plurality of photographing angles and a wider photographing range. For example, the optical sensors 140 of the tiled display 10B can acquire a three-dimensional image of the object O to be photographed, and can further combine the acquired three-dimensional image with the display screen of the tiled display 10B to present a real-time (real time) virtual reality (visual reality) image screen. In some embodiments, a tiled display including optical sensors can also integrate a billboard system with a monitoring system.
In summary, in the embodiments of the disclosure, the optical sensor is disposed in the display area (the area between the two light emitting elements) of the display panel or the tiled display, so as to improve the technical problems of space waste caused by the external camera lens, influence on the appearance, or incapability of allowing a user to directly view the screen and the image capturing device at the same time when using the image capturing device, and further help to optimize the circuit configuration or the use experience of the panel peripheral area.
The above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure.
Although the embodiments of the present disclosure and their advantages have been described above, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure, and the features of the various embodiments may be arbitrarily mixed and substituted with one another to form new embodiments. Moreover, the scope of the present disclosure is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather, the present disclosure will suggest themselves to those skilled in the art having the benefit of this disclosure, and is intended to cover such modifications as may incorporate those features or methods into the practice of the present disclosure, as well as the equivalents of such processes, machines, manufacture, composition of matter, means, methods and steps, or any materials, which perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein. Accordingly, the scope of the present disclosure includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim constitutes a separate embodiment, and the scope of the present disclosure also includes combinations of the respective claims and embodiments. The scope of the present disclosure is to be determined by the claims appended hereto.
Claims (10)
1. A display panel, comprising:
a substrate including a through hole, the through hole including a hole;
a plurality of light emitting elements disposed on the substrate, the through-hole being located in a region between two of the plurality of light emitting elements;
a driving circuit disposed on the substrate and electrically connected to the plurality of light emitting elements; and
an optical sensor disposed corresponding to the through hole and receiving sensing light through the hole;
wherein the width W of the hole conforms to the following relationship:
H≦W<D,
where H is the depth of the hole and D is the distance between the two light emitting elements.
2. The display panel according to claim 1, wherein the two light-emitting elements are adjacent light-emitting elements in a diagonal direction.
3. The display panel according to claim 1, wherein the two light-emitting elements are adjacent light-emitting elements in a horizontal direction.
4. The display panel according to claim 1, wherein the two light-emitting elements are adjacent light-emitting elements in a vertical direction.
5. The display panel of claim 1, wherein the optical sensor is a camera module.
6. A tiled display comprising at least two display panels according to claim 1.
7. The tiled display according to claim 6 wherein the two light emitting elements are diagonally adjacent light emitting elements.
8. The tiled display according to claim 6 wherein the two light emitting elements are adjacent light emitting elements in the horizontal direction.
9. A tiled display according to claim 6, wherein the two light emitting elements are adjacent light emitting elements in the vertical direction.
10. The tiled display according to claim 6, wherein the optical sensor is a camera module.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US17/308,041 US11501701B2 (en) | 2020-05-29 | 2021-05-04 | Display panel and spliced display |
US17/961,578 US11817049B2 (en) | 2020-05-29 | 2022-10-07 | Electronic device |
US18/481,250 US20240029645A1 (en) | 2020-05-29 | 2023-10-05 | Electronic device |
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